faculty list and research interests - hong kong … devices,circuits and systems,microelectronics,...

The program has been included inthe list of reimbursable courses for CEF purposes

This brochure describes the HKUST MSc(ICDE) program as intended at the time of printing. The program description in this brochure may be changed from time to time. In the event of inconsistency or where an interpretation of the brochure is required, the decision of the University Authority shall be final.

Program ObjectivesMicroelectronics, or Integrated Circuit (IC) Technology, has been the principal driver of the electronics industry in the past decades. The continuing advancement of electronics from the microscale to the nanoscale will be critical to the advancement of information technology in the decades to come.

Today, most of the ICs used in China are impor ted. The State Council Document Number 18 issued in 2000 clearly demonstrated China's resolution to develop a strong integrated circuit industry. The percentage of ICs that are designed and manufactured in China will increase exponentially due to the new national policy. To fuel the growing IC industr y, it is estimated that between 100,000 to 300,000 engineers will be needed in China by 2010. The current education system cannot even educate 10% of the manpower needed. The Master of Science in IC Design Engineering is a graduate degree program offered to address this educational need. This program is designed for students with a Bachelor degree in engineering or science who are interested to acquire in-depth as well as broad-based knowledge in integrated circuit design. The curriculum meets the HKUST requirements for granting the Master of Science degree.

Program Commencement and ScheduleSeptember every year.

Approximately 1 year for full-time and 2 years for part-time study.

All postgraduate courses are scheduled on weekday evenings and Saturday afternoons.

Target StudentsThe MSc(ICDE) program is designed for students and professionals who wish to upgrade their knowledge in the subjects of integrated circuit design.

Admission RequirementApplicants must hold a Bachelor degree in EE, engineering or physical sciences, or an equivalent qualification from a recognized university or tertiary institution.

All classes will be conducted in English. Applicants from universities where English is not the major medium of instruction will be considered on a case-by-case basis. In general, English proof such as Test of English as a Fore ign Language (TOEFL) , Internat iona l Eng l i sh Language Testing System (IELTS), or National English Exam (CET) is required.

Medium of InstructionAll in-class lectures and materials are in English.

Course Assessment and Graduation RequirementsRegular attendance of courses is expected. Students are required to take 21 credits from the course list and 3 credits of EESM 698 to complete the MSc program. Courses are assessed according to the grading scheme used for postgraduate courses. Students in the program must complete the program with a graduation grade average (GGA) of B or above as required for all postgraduate students at HKUST. If a student fails to meet the graduation grade average requirement, the student is required to repeat or substitute the course(s) at a per credit fee.

Lecture VenueClasses will be held in HKUST campus at Clear Water Bay, Kowloon. Students may apply for free parking at HKUST. Students may also take minivan or KMB from the closest Hang Hau MTR station or another closed by Choi Hung MTR station. The traveling time is around 10 minutes.

Program Fee and Financial AssistanceThe program fee is HK$84,000 (subject to University’s final approval). Students admitted with credit transfer are also required to pay the full program fee. Students who fail a course and need to repeat it will have to pay additional tuition fee at per credit rate.

Successful applicants may apply for Government’s N o n - m e a n s Te s t e d L o a n S c h e m e ( N L S ) a n d Continuing Education Fund (CEF) for reimbursement up to a maximum of HK$10,000.

Credit TransferCredi t t r ans fer may be gr anted to s tudents in r e co gn i t i o n o f s t ud i e s comp l e t ed e l s ewhe r e . Application must be made to the program office within the first semester after admission. All credit transfer must be approved by the Program Director and are subject to the normal university, school, and program requirement on credit transfer.

Faculty List and Research Interests

International leading experts from the Department of Electronic and Computer Engineering will teach all the courses in English.

Philip Ching-Ho CHAN

Chair Professor and Dean, School of EngineeringBS Univ of California, Davis; MS, PhD Univ of Illinois,Urbana-Champaign

VLSI devices, circuits and systems, microelectronics, electronic packaging, integrated sensors.

Howard Cam LUONG

ProfessorBS, MS, PhD Univ of California, Berkeley

Low-power, low-voltage, high-speed analog and RF integrated circuits and systems for wireless communications.

Amine BERMAK

Associate ProfessorBEng Polytech Inst Alg; MSc, PhD Paul Sabatier University, Toulouse.

VLSI circuits and systems, packaging technologies, CMOS image sensors, smart vision systems, VLSI implementation of artificial neural networks.

Mansun CHAN

Associate ProfessorBS Univ of California, San Diego; MS, PhD Univ of California, Berkeley

Nano-electronics devices, high speed circuits, compact device modeling, automated device characterization systems, biosensors, multimedia applications.

Kevin J. CHEN

Associate ProfessorBS Beijing Univ; PhD Maryland

RF/microwave devices and circuits: design, fabrication and characterization, GaN-based microwave power transistors, RF/microwave power amplifiers, RF micro-electromechanical systems (MEMS).

Wing-Hung KI

Associate ProfessorBS Univ of California, San Diego; MS California Inst of Tech;PhD Univ of California, Los Angeles

Low voltage power management systems, switch-mode power converters, high efficiency charge pumps, low dropout regulators, bandgap references, and analog integrated circuit design methodology.

Philip K. T. MOK

Associate ProfessorBASc, MASc, PhD Univ of Toronto

Analog integrated circuits for telecommunications and power electronics applications, power management integrated circuits and systems.

Bertram SHI

Associate ProfessorBS, MS Stanford; PhD Univ of California, Berkeley

Analog VLSI neural networks, cellular neural networks, neuromorphic and biologically inspired engineering, computer vision, image, speech and signal processing, non-linear dynamics, nonlinear circuit theory.

Chi-Ying TSUI

Associate ProfessorBS Univ of Hong Kong; MS, PhD Univ of Southern California

VLSI design and CAD algorithms for energy efficient high-performance microprocessors, low-power embedded systems, low-energy wireless multimedia systems, power management system for low energy applications.

Albert Kai-Sun WONG

Visiting Associate ProfessorBS, MS, PhD Massachusetts Inst of Tech

Data and optical networking, telecommunications, performance analysis.

Application Details

Application deadline and details, please refer to the program web page.

For inquiry, please contact:

http://www.seng.ust.hk/msc/icdeTel : (852) 2358 6959 / 2358 6966Fax : (852) 2719 3027Email : [email protected]

MSc(ICDE) Program Office (Room 2577, 2/F, Lift 29-30)School of EngineeringThe Hong Kong University of Science and TechnologyClear Water Bay, Kowloon, Hong Kong

CurriculumStudents are required to take 21 credits of course work and complete 3 credits of project wor k with a graduation grade average (GGA) of B or above for the award of an MSc degree in IC Design Engineering. Subject to the prior approval of the Program Director, students may tailor their program to their specific interest with a maximum of 6 credits of courses offered by the MSc progr am in E lec t ron ic Eng ineer ing (http://www.seng.ust.hk/msc/eleg) or the MSc program in Telecommunications (http://www.seng.ust.hk/msc/telc). The avai labi l ity of cour ses offered by other MSc programs may be subject to quota limitations.

List of Courses

EESM 501 CMOS VLSI Design 3 credits

EESM 503 Analog IC Analysis and Design 3 credits

EESM 504 Advanced Analog IC Analysis and Design 3 credits

EESM 506 Semiconductor Devices for Integrated Circuit Designs 3 credits

EESM 516 Digital VLSI System Design and Design Automation 3 credits

EESM 518 VLSI Signal Processing Architecture 3 credits

EESM 600 Special Topics 3 credits

EESM 692 Topics in Analog IC Systems and Design 3 credits

EESM 698 MSc Project 3 credits

Course Description

EESM 501 CMOS VLSI DesignCMOS proces s and des i gn r u l e s ; MOS dev i ce e l e c t r o n i c s ; C M O S c i r c u i t a n d l o g i c c i r c u i t character ization and performance estimation; VLSI design and verification tools. Project work will be centered on industry standard tools.

EESM 503 Analog IC Analysis and DesignCurrent Sources, output stages, operational amplifiers, frequency response, feedback analysis, stability and compensation, slew rate, advanced integrated-circuit design techniques, analog VLSI building blocks.

EESM 504 Advanced Analog IC Analysis and Design Noise analysis, advanced op-amp design techniques, analog VLSI building blocks, multipliers, oscillators, mixers, phase-locked loops, A/D and D/A conver ters, passive filter design, frequency scaling, active filter design.

EESM 506 Semiconductor Devices for Integrated Circuit Designs

Review of MOSFET characteristics, device modeling for circuit simulation (SPICE models), the BSIM MOSFET models, other semiconductor models, circuit model parameter character ization, design guard-band and statistical modeling.

EESM 516 Digital VLSI System Design and Design AutomationStructured design styles, specification, synthesis and simulation using hardware descriptive language (HDL), structural chip design and system design, circuit design of system building blocks: arithmetic unit, memory systems, clocking and performance issues in system design, design-automation tools and their applications, introduction to testing.

EESM 518 VLSI Signal Processing ArchitectureVLSI architecture design for digital signal processing applications such as multimedia and communication systems will be covered; general techniques such as pipelining, retiming, folding and unfolding, and systolic array design will be discussed; algorithmic/architectural tradeoff in power and performance will be studied; example applications in video processing and wireless communication architectures will be provided.

EESM 600 Special TopicsSelected topics of current interest. May be repeated for credit if different topics are covered.

EESM 692 Topics in Analog IC Systems and DesignSelected topics in analog and mixed-signal IC design drawn from disciplines such as RF/microwave IC design, integrated power electronics, imager design, micro-sensor design and micro-display design. Two to three selected topics will be discussed in depth that put emphasis on system level considerations as well as functional blocks design.

EESM 698 MSc ProjectIndependent project carried out under the supervision of a faculty member.

Courses are offered subject to availability