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EV Group Product Range
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Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice.
All trademarks, logos, website addresses or equipment names that contain the letters or words “EVG” or “EV Group” or any combination thereof, as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond®, CoverSpin™, EZB®,EZ Bond®, EZD®, EZ Debond®, EZR®, EZ Release®, GEMINI®, HERCULES®, HyperIntegration®, IQ Aligner®, LowTemp™, NanoAlign®, NanoFill™, NanoSpray™, NIL-COM®, NILPhotonics®, OmniSpray®, SmartEdge®, SmartNIL®, SmartView®, The Triple “i” Company Invent-Innovate-Implement®, Triple i®. Other product and company names may be registered trademarks of their respective owners.
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HeadquartersWorldwide Sales and Customer SupportEV Group Europe & Asia/Pacific GmbHDI Erich Thallner Strasse 14782 St.Florian am InnAustriaPhone: +43 7712 5311 0Fax: +43 7712 5311 4600E-Mail: [email protected]
GermanyEV GroupE. Thallner GmbHHartham 1394152 Neuhaus GermanyPhone: +49 8503 923 852Fax: +49 8503 923 852E-Mail: [email protected]
Europe Tech SupportPhone: +43 7712 5311 3000E-Mail: [email protected]
JapanEV Group Japan KKYokohama Business Park East Tower 1F134, Godo-cho, Hodogaya-ku,Yokohama-shi, Kanagawa, 240-0005Phone: +81 45 348 0665Fax: +81 45 348 0666E-Mail: [email protected]
Japan Tech SupportPhone: +81 45 348 1237 (Yokohama)Phone: +81 92 292 2100 (Fukuoka)E-Mail: [email protected]
KoreaEV Group Korea Ltd.Room 503, Seokun Tower, 178, Pangyoyeok-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, 463-400, South KoreaPhone: +82 2 3218 4400Fax: +82 2 3218 4401E-Mail: [email protected]
North AmericaEV Group Inc.7700 South River ParkwayTempe, AZ 85284Phone: +1 480 305 2400Fax: +1 480 305 2401E-Mail: [email protected]
EV Group Inc.100 Great Oaks Blvd; Suite #119Albany, NY 12203E-Mail: [email protected]
North America Tech SupportPhone: +1 800 384 8794E-Mail: [email protected]
Taiwan SalesEVG-JOINTECH CORP.No. 400, Hwang-Pei RoadChung-Li City, 32070Phone: +886 3 280 5680Fax: +886 3 280 5689E-Mail: [email protected]
Taiwan Customer SupportEV Group Taiwan Ltd.North Office:No. 400, Hwang-Pei RoadChung-Li City, 32070South Office:Rm203, NO.12, Nanke 2nd RD, Xinshi Dist., Tainan City, 74147Phone: +886 3 426 7900Fax: +886 3 426 7920 (North Office)Fax: +886 3 426 7917 (South Office)E-Mail: [email protected]
ChinaEV Group China Ltd.Room 3312 - 3316, Building No. 3, No. 498 Guo Shou Jing Road, ZhangjiangHigh-Tech Park, Pudong New Area, Shanghai, PR China, Shanghai 201203Phone: +86 21 3899 4800Fax: +86 21 3899 4801E-Mail: [email protected] E-Mail: [email protected]
Global Locations
Our highly qualified employees are part of a worldwide network.
Commitment Without Borders
EVG Subsidiaries
EVG Japan EVG TaiwanEVG North AmericaEVG Korea
Corporate Headquarters
EVG China
We act globally. Our lithography, bonding and imprint equipment is designed for reliability, productivity and quality, without any limits. Our highly qualified employees are part of a worldwide network and react quickly and flexibly to customer requests and inquiries.
We are always prepared for new challenges.
Customer Support
EVG Applications Lab Quality Assurance Process Monitoring on anEVG®850 DB System
Process Developmentand Services
EVG Process Expertise
EVG Processes
With state-of-the-art application labs based at its headquarters in Austria, as well as in the U.S. and Japan, EV Group (EVG) is focused on delivering superior process expertise to its growing global customer base - from the initialdevelopment until the final integration at the customer’s site.Featuring state-of-the-art cleanroomsand a highly experienced staff of process and application engineers, the company's process development business unit works hand in hand with customers on a number of areas.
The company's application labs provide demonstrations of its various products for potential customers looking to leverage EV Group's extensive line up of advanced wafer processing solutions for semiconductor, MEMS and nanotechnology markets. Furthermore, our labs provide process development support for custom applications to address customer´s unique and challenging requirements - at any stage of the development process.
These advanced process development and application labs are designed to accommodate independent research work to explore and develop baseline processes that will open up new market opportunities. This includes working with key partners, like material suppliers, to develop and optimize new processes and capabilities. Case in point, EV Group's ongoing relationship with Brewer Science, who by working closely together, have demonstrated temporary wafer bonding capabilities for a wide range of backside processes.
EV Group's process development team works with customers needing "demonstrator" parts for their respective customer-specific requirements. As a result, EV Group's multiple application labs are equipped to conduct small-volume pilot line runs to simulate an actual production line process, when necessary. This is very advantageous, especially for those customers with extremely complex demands - ensuring seamless process capability that suits
all parties ahead of time and ultimately puts EV Group's customers a step ahead of the competition.
In all, these advanced labs provide customized tooling capabilities - enabling EV Group's customers to effectively compete in today's ever-changing,fast-paced environment by enabling ashorter time to market, easing integrationheadaches and eliminating the risk to schedule across multiple industries and applications.
This is the passion and commitment that makes EV Group a value-added partner and why companies demanding nothing less than the best continue to turn to EV Group for its unparalleled world-class process and technology expertise.
Since introducing the industry's first backside-alignment microscope on a proximity mask alignment system more than two decades ago, EV Group has been committed to pioneering advances in lithography for semiconductor and MEMS manufacturing.
The company's key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask alignment systems (EVG600, EVG6000 and IQ series) and in its highly integrated coating platform (EVG100 series). All of EV Group's lithography equipment platforms are 300 mm ready, can be fully integrated into its HERCULES lithography track systems, and are complemented by its metrology tools for top-to-bottom side alignment verification.
Other important advancements by EV Group in the lithography space include the company's special resist coating technologies - OmniSpray and the revolutionary NanoSpray. Not only do these unique technologies allow for extremely conformal coatings over high-topography structures - for example, through-silicon-via (TSV) structures with an aspect ratio of 1:5 (W:H) - but, ultimately, they enable customers to realize significantly reduced fabrication costs.
Through its commitment to continued innovation and customer collaboration, EV Group has consistently raised the bar for cost-effective, nanometer-scale lithography processing. This future-focused approach enabled the accelerated introduction of its UV-nanoimprint lithography (UV-NIL) and hot-embossing systems.
Today, the company holds the dominant market share in these promising technologies.
Solutions forLITHOGRAPHY
• Top and bottom side mask alignment both near-ultraviolet (NUV) or deep-ultraviolet (DUV) in proximity and contact exposure mode• Spin coating and resist development
• Dry-film resist lamination• OmniSpray and NanoSpray coating• Top-to-bottom side alignment inspection • UV-NIL, hot embossing and Micro Contact Printing (µ-CP)• Metrology tasks like CD, Box-in-Box or Overlay measurement
SUPPORTED LITHOGRAPHY PROCESS STEPS
IQ Aligner® NT Automated Mask Alignment System up to 300 mmEVG®150 Automated Resist Processing System up to 300 mm
The introduction of EV Group's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market.
Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EV Group holding the dominant market share for both semi- and automated wafer bonding systems and a growing ins-tall base of more than 1100 bond chambers. Regarding systems applying low-contact forces under room temperature at utmost clean conditions, EV Group is also leading the market.
EV Group's wafer bonding systems offer manufacturers numerous benefits, including optimal total cost of ownership (TCO), as well as a real wafer-wedge compensation unit to maximize the bonding yield. Their bond alignment systems can be integrated into a GEMINI Automated Production Bonding System. These systems, such as the patented (U.S. Pat.: 6,214,692 B1) SmartView face-to-face Bond Aligner, can support sub-micron alignment accuracies even with non-infrared (IR) transparent wafers.
As it did with MEMS manufacturing, the company is now leveraging its technology strengths to accelerate the success of 3D wafer stacking. For this the GEMINI FB Automated Production Fusion Bonding System has been developed. In further support of this technology transfer, EV Group developed chip-to-wafer bonding tools for high-yield heterogeneous 3D integration schemes and was the first to market with 300 mm wafer bonding systems.
Addressing new market challenges in “beyond CMOS” applications, power devices, silicon photonics and high-vacuum MEMS packaging, EVG has introduced the automated high-vacuum wafer bonding system EVG ComBond. The ComBond technology enables covalent and conductive wafer bonding processes at room temperature or low temperatures. This process facilitates the direct integration of heterogeneous materials, including III-V compound semiconductor materials like gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP) on silicon substrates, GaAs on germanium (Ge), crystalline silicon carbide (cSiC) on SiC or on silicon, and lithium tantalate (LiTaO3) on silicon. Key markets and applications include engineered substrates, high efficiency solar cells and MEMS devices.
• Permanent wafer bonding and chip-to-wafer bonding• Thermal and UV cured bonding interfaces• Anodic, glass-frit, metal-diffusion, eutectic, silicon-direct, polymer bonding, and LowTemp™ plasma activated bonding • Face-to-face SmartView®, backside, IR and transparent bond alignment
• Temporary bonding to carrier substrates with spin-on polymers or dry-film laminates• Debonding of thin wafers from carrier substrates• Void and alignment inspection • ComBond® technology: room temperature bonding, oxide-free conductive interface• High vacuum encapsulation
Solutions forPERMANENT WAFER BONDING
Building on its success in permanent wafer bonding, EV Group introduced automated temporary bonding and debonding technology to address compound semiconductor and 3D IC manufacturers' immediate need for high-yield processing of ultra-thin and fragile wafers.
The EV Group technology temporarily mounts a wafer onto a carrier by applying thermal or UV-release intermediates (e.g., spin-on polymers, waxes, resists and dry-film laminates), providing manufacturers with several key benefits. These include optimal design-process flexibility, high yield (via the rigid carrier support), ease of integration into an existing fabrication infrastructure, and a highly reliable debonding step following complete front and backside processing.
Solutions forTEMPORARY WAFER BONDING
SUPPORTED WAFER BONDING STEPS
EVG®560 Automated Wafer Bonding System up to 300 mmEVG®500 Bond series chamber
EVG Services
Field Service On-Site Visits • Preventive maintenance and repair carried out in accordance with EV Group's high-quality standards• Immediate assistance by factory trained, certified field service engineers• On call support • Equipment relocation• Worldwide service through our subsidiaries and partners
Technical Support • Remote diagnostics and trouble shooting via secure internet line, phone and e-mail • Assistance with spare part number research
Spare Parts • Recommended spare parts packages • Guaranteed lead times • Regional spare part stocks • Parts repair and refurbishment servces • Consignment stock options
Product Training • Worldwide distributed training locations• Standardized modules for operation, maintenance & process training from novice to expert level available on-site and at EV Group training centers.
Extended Equipment Warranty • Includes spare parts and labor
Upgrades
Key Benefits
• Certified engineers are taking care of all equipment related issues• Engineers' long-term experience and technology expertise• ISO certification ensures consistent high quality
• Access to Best Known Methods (BKM's) and trouble shooting advise• Expert help from experienced Senior Engineers• Guaranteed fast response time
• Cost optimization through parts repair, refurbishment or new parts replacement • Customized spare part packages • Short lead times due to customized spare part stocking options
• Optimum uptime and tool performance through EV Group certified operators and maintenance personnel
• Set costs with priority support
• Performance enhancement based on your actual production needs • Customized solutions for new challenges
• Off the shelf upgrades for additional features and performance enhancement • Tailored soft- and hardware upgrades based on your requirements Wafer &
TemplateFabrication
SubstrateBondingfor SOI
AlignmentVerification
Resist Coating
Spin/Spray
Nano-imprint
Lithography
Thinning,CMP
Electro-plating
RIE,DRIE
WaferDicing
...etc.
BondAlignment
ResistDeveloping
TemporaryBonding/Debonding
CVD,LPCVD,PVD,...
WetEtching
StressRelief
Etching
WaferBonding
Metallization
ResistLift-Off
Oxidation
Chip-to-Wafer
Bonding
WaferBumping &Redistri-bution
Substrate Cleaning
PlasmaActivation
ProximityLithography
Metrology
EVG Customer SupportEVG Applications Lab
We act globally. Our lithography, bonding and imprint equipment is designed for reliability, productivity and quality, without any limits. Our highly qualified employees are part of a worldwide network and react quickly and flexibly to customer requests and inquiries.
We are always prepared for new challenges.
Customer Support
EVG Applications Lab Quality Assurance Process Monitoring on anEVG®850 DB System
Process Developmentand Services
EVG Process Expertise
EVG Processes
With state-of-the-art application labs based at its headquarters in Austria, as well as in the U.S. and Japan, EV Group (EVG) is focused on delivering superior process expertise to its growing global customer base - from the initialdevelopment until the final integration at the customer’s site.Featuring state-of-the-art cleanroomsand a highly experienced staff of process and application engineers, the company's process development business unit works hand in hand with customers on a number of areas.
The company's application labs provide demonstrations of its various products for potential customers looking to leverage EV Group's extensive line up of advanced wafer processing solutions for semiconductor, MEMS and nanotechnology markets. Furthermore, our labs provide process development support for custom applications to address customer´s unique and challenging requirements - at any stage of the development process.
These advanced process development and application labs are designed to accommodate independent research work to explore and develop baseline processes that will open up new market opportunities. This includes working with key partners, like material suppliers, to develop and optimize new processes and capabilities. Case in point, EV Group's ongoing relationship with Brewer Science, who by working closely together, have demonstrated temporary wafer bonding capabilities for a wide range of backside processes.
EV Group's process development team works with customers needing "demonstrator" parts for their respective customer-specific requirements. As a result, EV Group's multiple application labs are equipped to conduct small-volume pilot line runs to simulate an actual production line process, when necessary. This is very advantageous, especially for those customers with extremely complex demands - ensuring seamless process capability that suits
all parties ahead of time and ultimately puts EV Group's customers a step ahead of the competition.
In all, these advanced labs provide customized tooling capabilities - enabling EV Group's customers to effectively compete in today's ever-changing,fast-paced environment by enabling ashorter time to market, easing integrationheadaches and eliminating the risk to schedule across multiple industries and applications.
This is the passion and commitment that makes EV Group a value-added partner and why companies demanding nothing less than the best continue to turn to EV Group for its unparalleled world-class process and technology expertise.
Since introducing the industry's first backside-alignment microscope on a proximity mask alignment system more than two decades ago, EV Group has been committed to pioneering advances in lithography for semiconductor and MEMS manufacturing.
The company's key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask alignment systems (EVG600, EVG6000 and IQ series) and in its highly integrated coating platform (EVG100 series). All of EV Group's lithography equipment platforms are 300 mm ready, can be fully integrated into its HERCULES lithography track systems, and are complemented by its metrology tools for top-to-bottom side alignment verification.
Other important advancements by EV Group in the lithography space include the company's special resist coating technologies - OmniSpray and the revolutionary NanoSpray. Not only do these unique technologies allow for extremely conformal coatings over high-topography structures - for example, through-silicon-via (TSV) structures with an aspect ratio of 1:5 (W:H) - but, ultimately, they enable customers to realize significantly reduced fabrication costs.
Through its commitment to continued innovation and customer collaboration, EV Group has consistently raised the bar for cost-effective, nanometer-scale lithography processing. This future-focused approach enabled the accelerated introduction of its UV-nanoimprint lithography (UV-NIL) and hot-embossing systems.
Today, the company holds the dominant market share in these promising technologies.
Solutions forLITHOGRAPHY
• Top and bottom side mask alignment both near-ultraviolet (NUV) or deep-ultraviolet (DUV) in proximity and contact exposure mode• Spin coating and resist development
• Dry-film resist lamination• OmniSpray and NanoSpray coating• Top-to-bottom side alignment inspection • UV-NIL, hot embossing and Micro Contact Printing (µ-CP)• Metrology tasks like CD, Box-in-Box or Overlay measurement
SUPPORTED LITHOGRAPHY PROCESS STEPS
IQ Aligner® NT Automated Mask Alignment System up to 300 mmEVG®150 Automated Resist Processing System up to 300 mm
The introduction of EV Group's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market.
Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EV Group holding the dominant market share for both semi- and automated wafer bonding systems and a growing ins-tall base of more than 1100 bond chambers. Regarding systems applying low-contact forces under room temperature at utmost clean conditions, EV Group is also leading the market.
EV Group's wafer bonding systems offer manufacturers numerous benefits, including optimal total cost of ownership (TCO), as well as a real wafer-wedge compensation unit to maximize the bonding yield. Their bond alignment systems can be integrated into a GEMINI Automated Production Bonding System. These systems, such as the patented (U.S. Pat.: 6,214,692 B1) SmartView face-to-face Bond Aligner, can support sub-micron alignment accuracies even with non-infrared (IR) transparent wafers.
As it did with MEMS manufacturing, the company is now leveraging its technology strengths to accelerate the success of 3D wafer stacking. For this the GEMINI FB Automated Production Fusion Bonding System has been developed. In further support of this technology transfer, EV Group developed chip-to-wafer bonding tools for high-yield heterogeneous 3D integration schemes and was the first to market with 300 mm wafer bonding systems.
Addressing new market challenges in “beyond CMOS” applications, power devices, silicon photonics and high-vacuum MEMS packaging, EVG has introduced the automated high-vacuum wafer bonding system EVG ComBond. The ComBond technology enables covalent and conductive wafer bonding processes at room temperature or low temperatures. This process facilitates the direct integration of heterogeneous materials, including III-V compound semiconductor materials like gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP) on silicon substrates, GaAs on germanium (Ge), crystalline silicon carbide (cSiC) on SiC or on silicon, and lithium tantalate (LiTaO3) on silicon. Key markets and applications include engineered substrates, high efficiency solar cells and MEMS devices.
• Permanent wafer bonding and chip-to-wafer bonding• Thermal and UV cured bonding interfaces• Anodic, glass-frit, metal-diffusion, eutectic, silicon-direct, polymer bonding, and LowTemp™ plasma activated bonding • Face-to-face SmartView®, backside, IR and transparent bond alignment
• Temporary bonding to carrier substrates with spin-on polymers or dry-film laminates• Debonding of thin wafers from carrier substrates• Void and alignment inspection • ComBond® technology: room temperature bonding, oxide-free conductive interface• High vacuum encapsulation
Solutions forPERMANENT WAFER BONDING
Building on its success in permanent wafer bonding, EV Group introduced automated temporary bonding and debonding technology to address compound semiconductor and 3D IC manufacturers' immediate need for high-yield processing of ultra-thin and fragile wafers.
The EV Group technology temporarily mounts a wafer onto a carrier by applying thermal or UV-release intermediates (e.g., spin-on polymers, waxes, resists and dry-film laminates), providing manufacturers with several key benefits. These include optimal design-process flexibility, high yield (via the rigid carrier support), ease of integration into an existing fabrication infrastructure, and a highly reliable debonding step following complete front and backside processing.
Solutions forTEMPORARY WAFER BONDING
SUPPORTED WAFER BONDING STEPS
EVG®560 Automated Wafer Bonding System up to 300 mmEVG®500 Bond series chamber
EVG Services
Field Service On-Site Visits • Preventive maintenance and repair carried out in accordance with EV Group's high-quality standards• Immediate assistance by factory trained, certified field service engineers• On call support • Equipment relocation• Worldwide service through our subsidiaries and partners
Technical Support • Remote diagnostics and trouble shooting via secure internet line, phone and e-mail • Assistance with spare part number research
Spare Parts • Recommended spare parts packages • Guaranteed lead times • Regional spare part stocks • Parts repair and refurbishment servces • Consignment stock options
Product Training • Worldwide distributed training locations• Standardized modules for operation, maintenance & process training from novice to expert level available on-site and at EV Group training centers.
Extended Equipment Warranty • Includes spare parts and labor
Upgrades
Key Benefits
• Certified engineers are taking care of all equipment related issues• Engineers' long-term experience and technology expertise• ISO certification ensures consistent high quality
• Access to Best Known Methods (BKM's) and trouble shooting advise• Expert help from experienced Senior Engineers• Guaranteed fast response time
• Cost optimization through parts repair, refurbishment or new parts replacement • Customized spare part packages • Short lead times due to customized spare part stocking options
• Optimum uptime and tool performance through EV Group certified operators and maintenance personnel
• Set costs with priority support
• Performance enhancement based on your actual production needs • Customized solutions for new challenges
• Off the shelf upgrades for additional features and performance enhancement • Tailored soft- and hardware upgrades based on your requirements Wafer &
TemplateFabrication
SubstrateBondingfor SOI
AlignmentVerification
Resist Coating
Spin/Spray
Nano-imprint
Lithography
Thinning,CMP
Electro-plating
RIE,DRIE
WaferDicing
...etc.
BondAlignment
ResistDeveloping
TemporaryBonding/Debonding
CVD,LPCVD,PVD,...
WetEtching
StressRelief
Etching
WaferBonding
Metallization
ResistLift-Off
Oxidation
Chip-to-Wafer
Bonding
WaferBumping &Redistri-bution
Substrate Cleaning
PlasmaActivation
ProximityLithography
Metrology
EVG Customer SupportEVG Applications Lab
Application ExamplesThe different drivers for employing wafer bonding, as well as the applications served by EV Group bonding technology, are as diversified as the markets from which these applications originate.
200 mm chip-to-wafer bondCourtesy of Datacon
Sub 0.5 µm aligned, bonded color filter Courtesy of MicroEmissive Displays (MED)
Ziptronix direct bond InterconnectCourtesy of Ziptronix
Metal/Adhesive via first 3D bonding Interface Courtesy of RPI
8-layer direct bond cross-sectionCourtesy of MIT
SOI wafers produced utilizingSmartCut® technologyCourtesy of Soitec
Glass-frit bond interfaceCourtesy of ST Microelectronics
Cross-section of temporary bond utilizing Brewer Science®'s HT series adhesive Source: EVG
Product Wafer
Carrier Wafer
Adhesive
Scanning Acoustic Microscope (SAM) image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding processSource: EVG
Cross-section SEM image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process Source: EVG
Bond Interface
Markets
MEMS
Advanced Packaging & 3D Interconnect
SOI & Engineered Substrates
Compound Semiconductor
The key below denotes each systems' market applicability.
Advanced LithographyEV Group's solutions enable a broad range of applications that are key in the manufacture of today's leading edge electronics products.
Nanoimprint Lithography (NIL)Nanoimprint lithography is a cost efficient manufacturing technique for sub-100 nm features and complex 3D structures. It enables the fabrication of new, demanding applications requiring single step or step&repeat processes.
Sub-µm high-aspect ratio structures created with DUV-Lithography Courtesy of CEETAM
Through-silicon-via (TSV) structure conformally coated utilizing NanoSpray Technology Source: EVG
Patterned, spray coated resist layer in anisotropically etched cavityCourtesy of TU-Delft DIMES
80 µm SU-8 resist features with sidewall angles approaching 90°Courtesy of DALSA Corporation
High-Q-3D solenoid inductors for RF ICs Courtesy of SIMIT
Wafer-level micro-lens arrays created utilizing UV-NIL Source: EVG
50 nm resolution pattern utilizing UV-NILCourtesy of Quantiscript Inc.
Biological sample interacting with directly imprinted functional array Courtesy of FH Wels
20 nm wide 3D structure produced utilizing Soft UV-NIL Courtesy of AMO
Nanotechnology
Application Examples
INSPECTION SYSTEMS
INTEGRATED BONDING SYSTEMS
TEMPORARY BONDING and DEBONDING SYSTEMS
SOI & ENGINEERED SUBSTRATES BONDING SYSTEMS
BOND ALIGNMENT SYSTEMS
EVG®20 IR Inspection Stationup to 200 mm
EVG®510 Semi-automatedWafer Bonding Systemup to 200 mm
EVG®620 Semi-automated Bond Alignment Systemup to 150 mm
EVG®6200∞ Semi-automated Bond Alignment Systemup to 200 mm
SmartView® NT Automated Bond Alignment System for Universal Alignment up to 300 mm
EVG®520 IS Semi-automated Wafer Bonding Systemup to 200 mm
EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System up to 300 mm
EVG®540 AutomatedWafer Bonding Systemup to 300 mm
WAFER BONDING SYSTEMS
EVG®501 Wafer Bonding Systemup to 200 mm
EVG®610 Semi-automated Bond Alignment Systemup to 200 mm
GEMINI® FB Automated Production Fusion Bonding Systemup to 200 mm
GEMINI® Automated Production Wafer Bonding Systemup to 300 mm
GEMINI® Automated Production Wafer Bonding Systemup to 200 mm
EVG®850 LT Automated Production Bonding System for SOI and Direct Wafer Bondingup to 200 mm
EVG®850 Automated Production Bonding System for SOI and Direct Wafer Bondingup to 300 mm
EVG®810 LT LowTemp™
Plasma Activation Systemup to 300 mm
EVG®301 Semi-automated Single Wafer Cleaning Systemup to 300 mm
EVG®320 Automated Single Wafer Cleaning Systemup to 300 mm
3-D honeycomb anti-reflective layer imprinted using SmartNIL®
Courtesy of FHG ISE
20 µm Topas hot embossed micro fluidic structures utilizing soft working stamp polymersSource: EVG
100 nm resolution lines replicated using SmartNIL® Source: EVG
EVG®850 TBL Automated Temporary Bonding System with integrated Lamination Systemup to 300 mm
EVG®805 Semiautomated Debonding System up to 300 mm
EVG®820 Lamination System up to 300 mm
EVG®850 DB AutomatedDebonding Systemup to 300 mm
EVG®850 TB XT Frame Automated Bonding SystemEVG®850 DB XT Frame Automated Debonding Systemup to 300 mm
EVG®560 Automated Wafer Bonding Systemup to 300 mm
3 µm thick resist with 0.5 µm line/space exposed using DUV setup Source: EVG
SU-8 structures 470 µm high, developed in PGMEA with megasonic-enhanced developmentSource: EVG
Fully populated 6” Si substrate imprinted on EVG®720 Source: EVG
ComBond® Automated High-Vacuum Wafer Bonding System up to 200 mm
Amorphouslayer
Si
Si
EVG® ComBond®: Particle- and void-free bondSource: EVG
EVG® ComBond®: Oxide-free, conductive interface silicon/silicon Source: EVG
EVG®560 Automated Wafer Bonding Systemup to 200 mm
EVG®50 Automated Metrology Systemup to 300 mm
2 µm20 µm1 mm
200 µm 10 µm
100 µm 10 µm
2 µm 500 µm
LITHOGRAPHY TRACK SYSTEMS
INSPECTION SYSTEMS
NANOIMPRINT LITHOGRAPHY SYSTEMS (UV-NIL / SmartNIL®, µ-CP, HE)
MASK ALIGNMENT SYSTEMS
EVG®620 Semi-automated Mask Alignment System up to 150 mm
HERCULES® Lithography Track System coat, UV-exposure and develop modules up to 300 mm
EVG®770 AutomatedNIL Stepperup to 300 mm
IQ Aligner® AutomatedUV-NIL, µ-CP Systemup to 300 mm
EVG®520 HE Semi-automatedHot Embossing System up to 200 mm
EVG®510 HE Semi-automatedHot Embossing System up to 200 mm
EVG®750 AutomatedHot Embossing Systemup to 200 mm
EVG®150 N Automated NanoSpray Coating Systemup to 300 mm
EVG®40 NT Automated Measurement Systemup to 200 mm
HERCULES® L Lithography Track System resist processing & expose configuration up to 300 mm
EVG®6200∞ Semi-automatedUV-NIL, µ-CP System up to 200 mm
EVG®620(0) NT Semi-automated UV-NIL, µ-CP Systemup to 150/200 mm
EVG® 40NT Automated Measurement Systemup to 300 mm
EVG®40 NT Semi-automated Measurement Systemup to 300 mm
EVG®101 AdvancedResist Processing System up to 300 mm
EVG®101 LA Large Area Coating Systemfor > 300 mm
EVG®150 Automated Resist Processing Systemup to 200 mm
EVG®105 BakeModule up to 300 mm
EVG®120 Automated ResistProcessing System up to 200 mm
EVG®150 LA Large Area Resist Processing System> 300 mm
EVG®620 NT Automated Mask Alignment System up to 150 mm
EVG®6200∞ Automated Mask Alignment Systemup to 200 mm
IQ Aligner® NT Automated Mask Alignment System up to 300 mm
EVG® 6200NT Semi-automated Mask Alignment Systemup to 200 mm
EVG®620 Semi-automated UV-NIL, µ-CP Systemup to 150 mm
EVG®610 Semi-automated Mask Alignment System up to 200 mm
EVG®620HBL Automated Mask Alignment System up to 150 mm
EVG®610 Semi-automated UV-NIL, µ-CP System up to 150 mm
EVG®150 Automated Resist Processing Systemup to 300 mm
EVG®750 R2R AutomatedRoll-to-Roll Hot Embossing System
EVG®720(0) Automated UV-NIL Systemup to 150/200 mm
EVG®150 XT Automated Resist Processing Systemup to 300 mm
RESIST PROCESSING SYSTEMS
HERCULES® NIL Integrated UV-NIL Track Systemup to 200 mm
EVG®7200 LA Semi-automated Large-Area SmartNIL® Systemup to 370 x 470 mm (Gen 2)
GEMINI® FB Automated Production Fusion Bonding Systemup to 300 mm
EVG®850 TB Automated Temporary Bonding Systemup to 300 mm
Application ExamplesThe different drivers for employing wafer bonding, as well as the applications served by EV Group bonding technology, are as diversified as the markets from which these applications originate.
200 mm chip-to-wafer bondCourtesy of Datacon
Sub 0.5 µm aligned, bonded color filter Courtesy of MicroEmissive Displays (MED)
Ziptronix direct bond InterconnectCourtesy of Ziptronix
Metal/Adhesive via first 3D bonding Interface Courtesy of RPI
8-layer direct bond cross-sectionCourtesy of MIT
SOI wafers produced utilizingSmartCut® technologyCourtesy of Soitec
Glass-frit bond interfaceCourtesy of ST Microelectronics
Cross-section of temporary bond utilizing Brewer Science®'s HT series adhesive Source: EVG
Product Wafer
Carrier Wafer
Adhesive
Scanning Acoustic Microscope (SAM) image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding processSource: EVG
Cross-section SEM image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process Source: EVG
Bond Interface
Markets
MEMS
Advanced Packaging & 3D Interconnect
SOI & Engineered Substrates
Compound Semiconductor
The key below denotes each systems' market applicability.
Advanced LithographyEV Group's solutions enable a broad range of applications that are key in the manufacture of today's leading edge electronics products.
Nanoimprint Lithography (NIL)Nanoimprint lithography is a cost efficient manufacturing technique for sub-100 nm features and complex 3D structures. It enables the fabrication of new, demanding applications requiring single step or step&repeat processes.
Sub-µm high-aspect ratio structures created with DUV-Lithography Courtesy of CEETAM
Through-silicon-via (TSV) structure conformally coated utilizing NanoSpray Technology Source: EVG
Patterned, spray coated resist layer in anisotropically etched cavityCourtesy of TU-Delft DIMES
80 µm SU-8 resist features with sidewall angles approaching 90°Courtesy of DALSA Corporation
High-Q-3D solenoid inductors for RF ICs Courtesy of SIMIT
Wafer-level micro-lens arrays created utilizing UV-NIL Source: EVG
50 nm resolution pattern utilizing UV-NILCourtesy of Quantiscript Inc.
Biological sample interacting with directly imprinted functional array Courtesy of FH Wels
20 nm wide 3D structure produced utilizing Soft UV-NIL Courtesy of AMO
Nanotechnology
Application Examples
INSPECTION SYSTEMS
INTEGRATED BONDING SYSTEMS
TEMPORARY BONDING and DEBONDING SYSTEMS
SOI & ENGINEERED SUBSTRATES BONDING SYSTEMS
BOND ALIGNMENT SYSTEMS
EVG®20 IR Inspection Stationup to 200 mm
EVG®510 Semi-automatedWafer Bonding Systemup to 200 mm
EVG®620 Semi-automated Bond Alignment Systemup to 150 mm
EVG®6200∞ Semi-automated Bond Alignment Systemup to 200 mm
SmartView® NT Automated Bond Alignment System for Universal Alignment up to 300 mm
EVG®520 IS Semi-automated Wafer Bonding Systemup to 200 mm
EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System up to 300 mm
EVG®540 AutomatedWafer Bonding Systemup to 300 mm
WAFER BONDING SYSTEMS
EVG®501 Wafer Bonding Systemup to 200 mm
EVG®610 Semi-automated Bond Alignment Systemup to 200 mm
GEMINI® FB Automated Production Fusion Bonding Systemup to 200 mm
GEMINI® Automated Production Wafer Bonding Systemup to 300 mm
GEMINI® Automated Production Wafer Bonding Systemup to 200 mm
EVG®850 LT Automated Production Bonding System for SOI and Direct Wafer Bondingup to 200 mm
EVG®850 Automated Production Bonding System for SOI and Direct Wafer Bondingup to 300 mm
EVG®810 LT LowTemp™
Plasma Activation Systemup to 300 mm
EVG®301 Semi-automated Single Wafer Cleaning Systemup to 300 mm
EVG®320 Automated Single Wafer Cleaning Systemup to 300 mm
3-D honeycomb anti-reflective layer imprinted using SmartNIL®
Courtesy of FHG ISE
20 µm Topas hot embossed micro fluidic structures utilizing soft working stamp polymersSource: EVG
100 nm resolution lines replicated using SmartNIL® Source: EVG
EVG®850 TBL Automated Temporary Bonding System with integrated Lamination Systemup to 300 mm
EVG®805 Semiautomated Debonding System up to 300 mm
EVG®820 Lamination System up to 300 mm
EVG®850 DB AutomatedDebonding Systemup to 300 mm
EVG®850 TB XT Frame Automated Bonding SystemEVG®850 DB XT Frame Automated Debonding Systemup to 300 mm
EVG®560 Automated Wafer Bonding Systemup to 300 mm
3 µm thick resist with 0.5 µm line/space exposed using DUV setup Source: EVG
SU-8 structures 470 µm high, developed in PGMEA with megasonic-enhanced developmentSource: EVG
Fully populated 6” Si substrate imprinted on EVG®720 Source: EVG
ComBond® Automated High-Vacuum Wafer Bonding System up to 200 mm
Amorphouslayer
Si
Si
EVG® ComBond®: Particle- and void-free bondSource: EVG
EVG® ComBond®: Oxide-free, conductive interface silicon/silicon Source: EVG
EVG®560 Automated Wafer Bonding Systemup to 200 mm
EVG®50 Automated Metrology Systemup to 300 mm
2 µm20 µm1 mm
200 µm 10 µm
100 µm 10 µm
2 µm 500 µm
LITHOGRAPHY TRACK SYSTEMS
INSPECTION SYSTEMS
NANOIMPRINT LITHOGRAPHY SYSTEMS (UV-NIL / SmartNIL®, µ-CP, HE)
MASK ALIGNMENT SYSTEMS
EVG®620 Semi-automated Mask Alignment System up to 150 mm
HERCULES® Lithography Track System coat, UV-exposure and develop modules up to 300 mm
EVG®770 AutomatedNIL Stepperup to 300 mm
IQ Aligner® AutomatedUV-NIL, µ-CP Systemup to 300 mm
EVG®520 HE Semi-automatedHot Embossing System up to 200 mm
EVG®510 HE Semi-automatedHot Embossing System up to 200 mm
EVG®750 AutomatedHot Embossing Systemup to 200 mm
EVG®150 N Automated NanoSpray Coating Systemup to 300 mm
EVG®40 NT Automated Measurement Systemup to 200 mm
HERCULES® L Lithography Track System resist processing & expose configuration up to 300 mm
EVG®6200∞ Semi-automatedUV-NIL, µ-CP System up to 200 mm
EVG®620(0) NT Semi-automated UV-NIL, µ-CP Systemup to 150/200 mm
EVG® 40NT Automated Measurement Systemup to 300 mm
EVG®40 NT Semi-automated Measurement Systemup to 300 mm
EVG®101 AdvancedResist Processing System up to 300 mm
EVG®101 LA Large Area Coating Systemfor > 300 mm
EVG®150 Automated Resist Processing Systemup to 200 mm
EVG®105 BakeModule up to 300 mm
EVG®120 Automated ResistProcessing System up to 200 mm
EVG®150 LA Large Area Resist Processing System> 300 mm
EVG®620 NT Automated Mask Alignment System up to 150 mm
EVG®6200∞ Automated Mask Alignment Systemup to 200 mm
IQ Aligner® NT Automated Mask Alignment System up to 300 mm
EVG® 6200NT Semi-automated Mask Alignment Systemup to 200 mm
EVG®620 Semi-automated UV-NIL, µ-CP Systemup to 150 mm
EVG®610 Semi-automated Mask Alignment System up to 200 mm
EVG®620HBL Automated Mask Alignment System up to 150 mm
EVG®610 Semi-automated UV-NIL, µ-CP System up to 150 mm
EVG®150 Automated Resist Processing Systemup to 300 mm
EVG®750 R2R AutomatedRoll-to-Roll Hot Embossing System
EVG®720(0) Automated UV-NIL Systemup to 150/200 mm
EVG®150 XT Automated Resist Processing Systemup to 300 mm
RESIST PROCESSING SYSTEMS
HERCULES® NIL Integrated UV-NIL Track Systemup to 200 mm
EVG®7200 LA Semi-automated Large-Area SmartNIL® Systemup to 370 x 470 mm (Gen 2)
GEMINI® FB Automated Production Fusion Bonding Systemup to 300 mm
EVG®850 TB Automated Temporary Bonding Systemup to 300 mm
We act globally. Our lithography, bonding and imprint equipment is designed for reliability, productivity and quality, without any limits. Our highly qualified employees are part of a worldwide network and react quickly and flexibly to customer requests and inquiries.
We are always prepared for new challenges.
Customer Support
EVG Applications Lab Quality Assurance Process Monitoring on anEVG®850 DB System
Process Developmentand Services
EVG Process Expertise
EVG Processes
With state-of-the-art application labs based at its headquarters in Austria, as well as in the U.S. and Japan, EV Group (EVG) is focused on delivering superior process expertise to its growing global customer base - from the initialdevelopment until the final integration at the customer’s site.Featuring state-of-the-art cleanroomsand a highly experienced staff of process and application engineers, the company's process development business unit works hand in hand with customers on a number of areas.
The company's application labs provide demonstrations of its various products for potential customers looking to leverage EV Group's extensive line up of advanced wafer processing solutions for semiconductor, MEMS and nanotechnology markets. Furthermore, our labs provide process development support for custom applications to address customer´s unique and challenging requirements - at any stage of the development process.
These advanced process development and application labs are designed to accommodate independent research work to explore and develop baseline processes that will open up new market opportunities. This includes working with key partners, like material suppliers, to develop and optimize new processes and capabilities. Case in point, EV Group's ongoing relationship with Brewer Science, who by working closely together, have demonstrated temporary wafer bonding capabilities for a wide range of backside processes.
EV Group's process development team works with customers needing "demonstrator" parts for their respective customer-specific requirements. As a result, EV Group's multiple application labs are equipped to conduct small-volume pilot line runs to simulate an actual production line process, when necessary. This is very advantageous, especially for those customers with extremely complex demands - ensuring seamless process capability that suits
all parties ahead of time and ultimately puts EV Group's customers a step ahead of the competition.
In all, these advanced labs provide customized tooling capabilities - enabling EV Group's customers to effectively compete in today's ever-changing,fast-paced environment by enabling ashorter time to market, easing integrationheadaches and eliminating the risk to schedule across multiple industries and applications.
This is the passion and commitment that makes EV Group a value-added partner and why companies demanding nothing less than the best continue to turn to EV Group for its unparalleled world-class process and technology expertise.
Since introducing the industry's first backside-alignment microscope on a proximity mask alignment system more than two decades ago, EV Group has been committed to pioneering advances in lithography for semiconductor and MEMS manufacturing.
The company's key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask alignment systems (EVG600, EVG6000 and IQ series) and in its highly integrated coating platform (EVG100 series). All of EV Group's lithography equipment platforms are 300 mm ready, can be fully integrated into its HERCULES lithography track systems, and are complemented by its metrology tools for top-to-bottom side alignment verification.
Other important advancements by EV Group in the lithography space include the company's special resist coating technologies - OmniSpray and the revolutionary NanoSpray. Not only do these unique technologies allow for extremely conformal coatings over high-topography structures - for example, through-silicon-via (TSV) structures with an aspect ratio of 1:5 (W:H) - but, ultimately, they enable customers to realize significantly reduced fabrication costs.
Through its commitment to continued innovation and customer collaboration, EV Group has consistently raised the bar for cost-effective, nanometer-scale lithography processing. This future-focused approach enabled the accelerated introduction of its UV-nanoimprint lithography (UV-NIL) and hot-embossing systems.
Today, the company holds the dominant market share in these promising technologies.
Solutions forLITHOGRAPHY
• Top and bottom side mask alignment both near-ultraviolet (NUV) or deep-ultraviolet (DUV) in proximity and contact exposure mode• Spin coating and resist development
• Dry-film resist lamination• OmniSpray and NanoSpray coating• Top-to-bottom side alignment inspection • UV-NIL, hot embossing and Micro Contact Printing (µ-CP)• Metrology tasks like CD, Box-in-Box or Overlay measurement
SUPPORTED LITHOGRAPHY PROCESS STEPS
IQ Aligner® NT Automated Mask Alignment System up to 300 mmEVG®150 Automated Resist Processing System up to 300 mm
The introduction of EV Group's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market.
Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EV Group holding the dominant market share for both semi- and automated wafer bonding systems and a growing ins-tall base of more than 1100 bond chambers. Regarding systems applying low-contact forces under room temperature at utmost clean conditions, EV Group is also leading the market.
EV Group's wafer bonding systems offer manufacturers numerous benefits, including optimal total cost of ownership (TCO), as well as a real wafer-wedge compensation unit to maximize the bonding yield. Their bond alignment systems can be integrated into a GEMINI Automated Production Bonding System. These systems, such as the patented (U.S. Pat.: 6,214,692 B1) SmartView face-to-face Bond Aligner, can support sub-micron alignment accuracies even with non-infrared (IR) transparent wafers.
As it did with MEMS manufacturing, the company is now leveraging its technology strengths to accelerate the success of 3D wafer stacking. For this the GEMINI FB Automated Production Fusion Bonding System has been developed. In further support of this technology transfer, EV Group developed chip-to-wafer bonding tools for high-yield heterogeneous 3D integration schemes and was the first to market with 300 mm wafer bonding systems.
Addressing new market challenges in “beyond CMOS” applications, power devices, silicon photonics and high-vacuum MEMS packaging, EVG has introduced the automated high-vacuum wafer bonding system EVG ComBond. The ComBond technology enables covalent and conductive wafer bonding processes at room temperature or low temperatures. This process facilitates the direct integration of heterogeneous materials, including III-V compound semiconductor materials like gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP) on silicon substrates, GaAs on germanium (Ge), crystalline silicon carbide (cSiC) on SiC or on silicon, and lithium tantalate (LiTaO3) on silicon. Key markets and applications include engineered substrates, high efficiency solar cells and MEMS devices.
• Permanent wafer bonding and chip-to-wafer bonding• Thermal and UV cured bonding interfaces• Anodic, glass-frit, metal-diffusion, eutectic, silicon-direct, polymer bonding, and LowTemp™ plasma activated bonding • Face-to-face SmartView®, backside, IR and transparent bond alignment
• Temporary bonding to carrier substrates with spin-on polymers or dry-film laminates• Debonding of thin wafers from carrier substrates• Void and alignment inspection • ComBond® technology: room temperature bonding, oxide-free conductive interface• High vacuum encapsulation
Solutions forPERMANENT WAFER BONDING
Building on its success in permanent wafer bonding, EV Group introduced automated temporary bonding and debonding technology to address compound semiconductor and 3D IC manufacturers' immediate need for high-yield processing of ultra-thin and fragile wafers.
The EV Group technology temporarily mounts a wafer onto a carrier by applying thermal or UV-release intermediates (e.g., spin-on polymers, waxes, resists and dry-film laminates), providing manufacturers with several key benefits. These include optimal design-process flexibility, high yield (via the rigid carrier support), ease of integration into an existing fabrication infrastructure, and a highly reliable debonding step following complete front and backside processing.
Solutions forTEMPORARY WAFER BONDING
SUPPORTED WAFER BONDING STEPS
EVG®560 Automated Wafer Bonding System up to 300 mmEVG®500 Bond series chamber
EVG Services
Field Service On-Site Visits • Preventive maintenance and repair carried out in accordance with EV Group's high-quality standards• Immediate assistance by factory trained, certified field service engineers• On call support • Equipment relocation• Worldwide service through our subsidiaries and partners
Technical Support • Remote diagnostics and trouble shooting via secure internet line, phone and e-mail • Assistance with spare part number research
Spare Parts • Recommended spare parts packages • Guaranteed lead times • Regional spare part stocks • Parts repair and refurbishment servces • Consignment stock options
Product Training • Worldwide distributed training locations• Standardized modules for operation, maintenance & process training from novice to expert level available on-site and at EV Group training centers.
Extended Equipment Warranty • Includes spare parts and labor
Upgrades
Key Benefits
• Certified engineers are taking care of all equipment related issues• Engineers' long-term experience and technology expertise• ISO certification ensures consistent high quality
• Access to Best Known Methods (BKM's) and trouble shooting advise• Expert help from experienced Senior Engineers• Guaranteed fast response time
• Cost optimization through parts repair, refurbishment or new parts replacement • Customized spare part packages • Short lead times due to customized spare part stocking options
• Optimum uptime and tool performance through EV Group certified operators and maintenance personnel
• Set costs with priority support
• Performance enhancement based on your actual production needs • Customized solutions for new challenges
• Off the shelf upgrades for additional features and performance enhancement • Tailored soft- and hardware upgrades based on your requirements Wafer &
TemplateFabrication
SubstrateBondingfor SOI
AlignmentVerification
Resist Coating
Spin/Spray
Nano-imprint
Lithography
Thinning,CMP
Electro-plating
RIE,DRIE
WaferDicing
...etc.
BondAlignment
ResistDeveloping
TemporaryBonding/Debonding
CVD,LPCVD,PVD,...
WetEtching
StressRelief
Etching
WaferBonding
Metallization
ResistLift-Off
Oxidation
Chip-to-Wafer
Bonding
WaferBumping &Redistri-bution
Substrate Cleaning
PlasmaActivation
ProximityLithography
Metrology
EVG Customer SupportEVG Applications Lab
Application ExamplesThe different drivers for employing wafer bonding, as well as the applications served by EV Group bonding technology, are as diversified as the markets from which these applications originate.
200 mm chip-to-wafer bondCourtesy of Datacon
Sub 0.5 µm aligned, bonded color filter Courtesy of MicroEmissive Displays (MED)
Ziptronix direct bond InterconnectCourtesy of Ziptronix
Metal/Adhesive via first 3D bonding Interface Courtesy of RPI
8-layer direct bond cross-sectionCourtesy of MIT
SOI wafers produced utilizingSmartCut® technologyCourtesy of Soitec
Glass-frit bond interfaceCourtesy of ST Microelectronics
Cross-section of temporary bond utilizing Brewer Science®'s HT series adhesive Source: EVG
Product Wafer
Carrier Wafer
Adhesive
Scanning Acoustic Microscope (SAM) image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding processSource: EVG
Cross-section SEM image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process Source: EVG
Bond Interface
Markets
MEMS
Advanced Packaging & 3D Interconnect
SOI & Engineered Substrates
Compound Semiconductor
The key below denotes each systems' market applicability.
Advanced LithographyEV Group's solutions enable a broad range of applications that are key in the manufacture of today's leading edge electronics products.
Nanoimprint Lithography (NIL)Nanoimprint lithography is a cost efficient manufacturing technique for sub-100 nm features and complex 3D structures. It enables the fabrication of new, demanding applications requiring single step or step&repeat processes.
Sub-µm high-aspect ratio structures created with DUV-Lithography Courtesy of CEETAM
Through-silicon-via (TSV) structure conformally coated utilizing NanoSpray Technology Source: EVG
Patterned, spray coated resist layer in anisotropically etched cavityCourtesy of TU-Delft DIMES
80 µm SU-8 resist features with sidewall angles approaching 90°Courtesy of DALSA Corporation
High-Q-3D solenoid inductors for RF ICs Courtesy of SIMIT
Wafer-level micro-lens arrays created utilizing UV-NIL Source: EVG
50 nm resolution pattern utilizing UV-NILCourtesy of Quantiscript Inc.
Biological sample interacting with directly imprinted functional array Courtesy of FH Wels
20 nm wide 3D structure produced utilizing Soft UV-NIL Courtesy of AMO
Nanotechnology
Application Examples
INSPECTION SYSTEMS
INTEGRATED BONDING SYSTEMS
TEMPORARY BONDING and DEBONDING SYSTEMS
SOI & ENGINEERED SUBSTRATES BONDING SYSTEMS
BOND ALIGNMENT SYSTEMS
EVG®20 IR Inspection Stationup to 200 mm
EVG®510 Semi-automatedWafer Bonding Systemup to 200 mm
EVG®620 Semi-automated Bond Alignment Systemup to 150 mm
EVG®6200∞ Semi-automated Bond Alignment Systemup to 200 mm
SmartView® NT Automated Bond Alignment System for Universal Alignment up to 300 mm
EVG®520 IS Semi-automated Wafer Bonding Systemup to 200 mm
EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System up to 300 mm
EVG®540 AutomatedWafer Bonding Systemup to 300 mm
WAFER BONDING SYSTEMS
EVG®501 Wafer Bonding Systemup to 200 mm
EVG®610 Semi-automated Bond Alignment Systemup to 200 mm
GEMINI® FB Automated Production Fusion Bonding Systemup to 200 mm
GEMINI® Automated Production Wafer Bonding Systemup to 300 mm
GEMINI® Automated Production Wafer Bonding Systemup to 200 mm
EVG®850 LT Automated Production Bonding System for SOI and Direct Wafer Bondingup to 200 mm
EVG®850 Automated Production Bonding System for SOI and Direct Wafer Bondingup to 300 mm
EVG®810 LT LowTemp™
Plasma Activation Systemup to 300 mm
EVG®301 Semi-automated Single Wafer Cleaning Systemup to 300 mm
EVG®320 Automated Single Wafer Cleaning Systemup to 300 mm
3-D honeycomb anti-reflective layer imprinted using SmartNIL®
Courtesy of FHG ISE
20 µm Topas hot embossed micro fluidic structures utilizing soft working stamp polymersSource: EVG
100 nm resolution lines replicated using SmartNIL® Source: EVG
EVG®850 TBL Automated Temporary Bonding System with integrated Lamination Systemup to 300 mm
EVG®805 Semiautomated Debonding System up to 300 mm
EVG®820 Lamination System up to 300 mm
EVG®850 DB AutomatedDebonding Systemup to 300 mm
EVG®850 TB XT Frame Automated Bonding SystemEVG®850 DB XT Frame Automated Debonding Systemup to 300 mm
EVG®560 Automated Wafer Bonding Systemup to 300 mm
3 µm thick resist with 0.5 µm line/space exposed using DUV setup Source: EVG
SU-8 structures 470 µm high, developed in PGMEA with megasonic-enhanced developmentSource: EVG
Fully populated 6” Si substrate imprinted on EVG®720 Source: EVG
ComBond® Automated High-Vacuum Wafer Bonding System up to 200 mm
Amorphouslayer
Si
Si
EVG® ComBond®: Particle- and void-free bondSource: EVG
EVG® ComBond®: Oxide-free, conductive interface silicon/silicon Source: EVG
EVG®560 Automated Wafer Bonding Systemup to 200 mm
EVG®50 Automated Metrology Systemup to 300 mm
2 µm20 µm1 mm
200 µm 10 µm
100 µm 10 µm
2 µm 500 µm
LITHOGRAPHY TRACK SYSTEMS
INSPECTION SYSTEMS
NANOIMPRINT LITHOGRAPHY SYSTEMS (UV-NIL / SmartNIL®, µ-CP, HE)
MASK ALIGNMENT SYSTEMS
EVG®620 Semi-automated Mask Alignment System up to 150 mm
HERCULES® Lithography Track System coat, UV-exposure and develop modules up to 300 mm
EVG®770 AutomatedNIL Stepperup to 300 mm
IQ Aligner® AutomatedUV-NIL, µ-CP Systemup to 300 mm
EVG®520 HE Semi-automatedHot Embossing System up to 200 mm
EVG®510 HE Semi-automatedHot Embossing System up to 200 mm
EVG®750 AutomatedHot Embossing Systemup to 200 mm
EVG®150 N Automated NanoSpray Coating Systemup to 300 mm
EVG®40 NT Automated Measurement Systemup to 200 mm
HERCULES® L Lithography Track System resist processing & expose configuration up to 300 mm
EVG®6200∞ Semi-automatedUV-NIL, µ-CP System up to 200 mm
EVG®620(0) NT Semi-automated UV-NIL, µ-CP Systemup to 150/200 mm
EVG® 40NT Automated Measurement Systemup to 300 mm
EVG®40 NT Semi-automated Measurement Systemup to 300 mm
EVG®101 AdvancedResist Processing System up to 300 mm
EVG®101 LA Large Area Coating Systemfor > 300 mm
EVG®150 Automated Resist Processing Systemup to 200 mm
EVG®105 BakeModule up to 300 mm
EVG®120 Automated ResistProcessing System up to 200 mm
EVG®150 LA Large Area Resist Processing System> 300 mm
EVG®620 NT Automated Mask Alignment System up to 150 mm
EVG®6200∞ Automated Mask Alignment Systemup to 200 mm
IQ Aligner® NT Automated Mask Alignment System up to 300 mm
EVG® 6200NT Semi-automated Mask Alignment Systemup to 200 mm
EVG®620 Semi-automated UV-NIL, µ-CP Systemup to 150 mm
EVG®610 Semi-automated Mask Alignment System up to 200 mm
EVG®620HBL Automated Mask Alignment System up to 150 mm
EVG®610 Semi-automated UV-NIL, µ-CP System up to 150 mm
EVG®150 Automated Resist Processing Systemup to 300 mm
EVG®750 R2R AutomatedRoll-to-Roll Hot Embossing System
EVG®720(0) Automated UV-NIL Systemup to 150/200 mm
EVG®150 XT Automated Resist Processing Systemup to 300 mm
RESIST PROCESSING SYSTEMS
HERCULES® NIL Integrated UV-NIL Track Systemup to 200 mm
EVG®7200 LA Semi-automated Large-Area SmartNIL® Systemup to 370 x 470 mm (Gen 2)
GEMINI® FB Automated Production Fusion Bonding Systemup to 300 mm
EVG®850 TB Automated Temporary Bonding Systemup to 300 mm
Application ExamplesThe different drivers for employing wafer bonding, as well as the applications served by EV Group bonding technology, are as diversified as the markets from which these applications originate.
200 mm chip-to-wafer bondCourtesy of Datacon
Sub 0.5 µm aligned, bonded color filter Courtesy of MicroEmissive Displays (MED)
Ziptronix direct bond InterconnectCourtesy of Ziptronix
Metal/Adhesive via first 3D bonding Interface Courtesy of RPI
8-layer direct bond cross-sectionCourtesy of MIT
SOI wafers produced utilizingSmartCut® technologyCourtesy of Soitec
Glass-frit bond interfaceCourtesy of ST Microelectronics
Cross-section of temporary bond utilizing Brewer Science®'s HT series adhesive Source: EVG
Product Wafer
Carrier Wafer
Adhesive
Scanning Acoustic Microscope (SAM) image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding processSource: EVG
Cross-section SEM image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process Source: EVG
Bond Interface
Markets
MEMS
Advanced Packaging & 3D Interconnect
SOI & Engineered Substrates
Compound Semiconductor
The key below denotes each systems' market applicability.
Advanced LithographyEV Group's solutions enable a broad range of applications that are key in the manufacture of today's leading edge electronics products.
Nanoimprint Lithography (NIL)Nanoimprint lithography is a cost efficient manufacturing technique for sub-100 nm features and complex 3D structures. It enables the fabrication of new, demanding applications requiring single step or step&repeat processes.
Sub-µm high-aspect ratio structures created with DUV-Lithography Courtesy of CEETAM
Through-silicon-via (TSV) structure conformally coated utilizing NanoSpray Technology Source: EVG
Patterned, spray coated resist layer in anisotropically etched cavityCourtesy of TU-Delft DIMES
80 µm SU-8 resist features with sidewall angles approaching 90°Courtesy of DALSA Corporation
High-Q-3D solenoid inductors for RF ICs Courtesy of SIMIT
Wafer-level micro-lens arrays created utilizing UV-NIL Source: EVG
50 nm resolution pattern utilizing UV-NILCourtesy of Quantiscript Inc.
Biological sample interacting with directly imprinted functional array Courtesy of FH Wels
20 nm wide 3D structure produced utilizing Soft UV-NIL Courtesy of AMO
Nanotechnology
Application Examples
INSPECTION SYSTEMS
INTEGRATED BONDING SYSTEMS
TEMPORARY BONDING and DEBONDING SYSTEMS
SOI & ENGINEERED SUBSTRATES BONDING SYSTEMS
BOND ALIGNMENT SYSTEMS
EVG®20 IR Inspection Stationup to 200 mm
EVG®510 Semi-automatedWafer Bonding Systemup to 200 mm
EVG®620 Semi-automated Bond Alignment Systemup to 150 mm
EVG®6200∞ Semi-automated Bond Alignment Systemup to 200 mm
SmartView® NT Automated Bond Alignment System for Universal Alignment up to 300 mm
EVG®520 IS Semi-automated Wafer Bonding Systemup to 200 mm
EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System up to 300 mm
EVG®540 AutomatedWafer Bonding Systemup to 300 mm
WAFER BONDING SYSTEMS
EVG®501 Wafer Bonding Systemup to 200 mm
EVG®610 Semi-automated Bond Alignment Systemup to 200 mm
GEMINI® FB Automated Production Fusion Bonding Systemup to 200 mm
GEMINI® Automated Production Wafer Bonding Systemup to 300 mm
GEMINI® Automated Production Wafer Bonding Systemup to 200 mm
EVG®850 LT Automated Production Bonding System for SOI and Direct Wafer Bondingup to 200 mm
EVG®850 Automated Production Bonding System for SOI and Direct Wafer Bondingup to 300 mm
EVG®810 LT LowTemp™
Plasma Activation Systemup to 300 mm
EVG®301 Semi-automated Single Wafer Cleaning Systemup to 300 mm
EVG®320 Automated Single Wafer Cleaning Systemup to 300 mm
3-D honeycomb anti-reflective layer imprinted using SmartNIL®
Courtesy of FHG ISE
20 µm Topas hot embossed micro fluidic structures utilizing soft working stamp polymersSource: EVG
100 nm resolution lines replicated using SmartNIL® Source: EVG
EVG®850 TBL Automated Temporary Bonding System with integrated Lamination Systemup to 300 mm
EVG®805 Semiautomated Debonding System up to 300 mm
EVG®820 Lamination System up to 300 mm
EVG®850 DB AutomatedDebonding Systemup to 300 mm
EVG®850 TB XT Frame Automated Bonding SystemEVG®850 DB XT Frame Automated Debonding Systemup to 300 mm
EVG®560 Automated Wafer Bonding Systemup to 300 mm
3 µm thick resist with 0.5 µm line/space exposed using DUV setup Source: EVG
SU-8 structures 470 µm high, developed in PGMEA with megasonic-enhanced developmentSource: EVG
Fully populated 6” Si substrate imprinted on EVG®720 Source: EVG
ComBond® Automated High-Vacuum Wafer Bonding System up to 200 mm
Amorphouslayer
Si
Si
EVG® ComBond®: Particle- and void-free bondSource: EVG
EVG® ComBond®: Oxide-free, conductive interface silicon/silicon Source: EVG
EVG®560 Automated Wafer Bonding Systemup to 200 mm
EVG®50 Automated Metrology Systemup to 300 mm
2 µm20 µm1 mm
200 µm 10 µm
100 µm 10 µm
2 µm 500 µm
LITHOGRAPHY TRACK SYSTEMS
INSPECTION SYSTEMS
NANOIMPRINT LITHOGRAPHY SYSTEMS (UV-NIL / SmartNIL®, µ-CP, HE)
MASK ALIGNMENT SYSTEMS
EVG®620 Semi-automated Mask Alignment System up to 150 mm
HERCULES® Lithography Track System coat, UV-exposure and develop modules up to 300 mm
EVG®770 AutomatedNIL Stepperup to 300 mm
IQ Aligner® AutomatedUV-NIL, µ-CP Systemup to 300 mm
EVG®520 HE Semi-automatedHot Embossing System up to 200 mm
EVG®510 HE Semi-automatedHot Embossing System up to 200 mm
EVG®750 AutomatedHot Embossing Systemup to 200 mm
EVG®150 N Automated NanoSpray Coating Systemup to 300 mm
EVG®40 NT Automated Measurement Systemup to 200 mm
HERCULES® L Lithography Track System resist processing & expose configuration up to 300 mm
EVG®6200∞ Semi-automatedUV-NIL, µ-CP System up to 200 mm
EVG®620(0) NT Semi-automated UV-NIL, µ-CP Systemup to 150/200 mm
EVG® 40NT Automated Measurement Systemup to 300 mm
EVG®40 NT Semi-automated Measurement Systemup to 300 mm
EVG®101 AdvancedResist Processing System up to 300 mm
EVG®101 LA Large Area Coating Systemfor > 300 mm
EVG®150 Automated Resist Processing Systemup to 200 mm
EVG®105 BakeModule up to 300 mm
EVG®120 Automated ResistProcessing System up to 200 mm
EVG®150 LA Large Area Resist Processing System> 300 mm
EVG®620 NT Automated Mask Alignment System up to 150 mm
EVG®6200∞ Automated Mask Alignment Systemup to 200 mm
IQ Aligner® NT Automated Mask Alignment System up to 300 mm
EVG® 6200NT Semi-automated Mask Alignment Systemup to 200 mm
EVG®620 Semi-automated UV-NIL, µ-CP Systemup to 150 mm
EVG®610 Semi-automated Mask Alignment System up to 200 mm
EVG®620HBL Automated Mask Alignment System up to 150 mm
EVG®610 Semi-automated UV-NIL, µ-CP System up to 150 mm
EVG®150 Automated Resist Processing Systemup to 300 mm
EVG®750 R2R AutomatedRoll-to-Roll Hot Embossing System
EVG®720(0) Automated UV-NIL Systemup to 150/200 mm
EVG®150 XT Automated Resist Processing Systemup to 300 mm
RESIST PROCESSING SYSTEMS
HERCULES® NIL Integrated UV-NIL Track Systemup to 200 mm
EVG®7200 LA Semi-automated Large-Area SmartNIL® Systemup to 370 x 470 mm (Gen 2)
GEMINI® FB Automated Production Fusion Bonding Systemup to 300 mm
EVG®850 TB Automated Temporary Bonding Systemup to 300 mm
Application ExamplesThe different drivers for employing wafer bonding, as well as the applications served by EV Group bonding technology, are as diversified as the markets from which these applications originate.
200 mm chip-to-wafer bondCourtesy of Datacon
Sub 0.5 µm aligned, bonded color filter Courtesy of MicroEmissive Displays (MED)
Ziptronix direct bond InterconnectCourtesy of Ziptronix
Metal/Adhesive via first 3D bonding Interface Courtesy of RPI
8-layer direct bond cross-sectionCourtesy of MIT
SOI wafers produced utilizingSmartCut® technologyCourtesy of Soitec
Glass-frit bond interfaceCourtesy of ST Microelectronics
Cross-section of temporary bond utilizing Brewer Science®'s HT series adhesive Source: EVG
Product Wafer
Carrier Wafer
Adhesive
Scanning Acoustic Microscope (SAM) image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding processSource: EVG
Cross-section SEM image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process Source: EVG
Bond Interface
Markets
MEMS
Advanced Packaging & 3D Interconnect
SOI & Engineered Substrates
Compound Semiconductor
The key below denotes each systems' market applicability.
Advanced LithographyEV Group's solutions enable a broad range of applications that are key in the manufacture of today's leading edge electronics products.
Nanoimprint Lithography (NIL)Nanoimprint lithography is a cost efficient manufacturing technique for sub-100 nm features and complex 3D structures. It enables the fabrication of new, demanding applications requiring single step or step&repeat processes.
Sub-µm high-aspect ratio structures created with DUV-Lithography Courtesy of CEETAM
Through-silicon-via (TSV) structure conformally coated utilizing NanoSpray Technology Source: EVG
Patterned, spray coated resist layer in anisotropically etched cavityCourtesy of TU-Delft DIMES
80 µm SU-8 resist features with sidewall angles approaching 90°Courtesy of DALSA Corporation
High-Q-3D solenoid inductors for RF ICs Courtesy of SIMIT
Wafer-level micro-lens arrays created utilizing UV-NIL Source: EVG
50 nm resolution pattern utilizing UV-NILCourtesy of Quantiscript Inc.
Biological sample interacting with directly imprinted functional array Courtesy of FH Wels
20 nm wide 3D structure produced utilizing Soft UV-NIL Courtesy of AMO
Nanotechnology
Application Examples
INSPECTION SYSTEMS
INTEGRATED BONDING SYSTEMS
TEMPORARY BONDING and DEBONDING SYSTEMS
SOI & ENGINEERED SUBSTRATES BONDING SYSTEMS
BOND ALIGNMENT SYSTEMS
EVG®20 IR Inspection Stationup to 200 mm
EVG®510 Semi-automatedWafer Bonding Systemup to 200 mm
EVG®620 Semi-automated Bond Alignment Systemup to 150 mm
EVG®6200∞ Semi-automated Bond Alignment Systemup to 200 mm
SmartView® NT Automated Bond Alignment System for Universal Alignment up to 300 mm
EVG®520 IS Semi-automated Wafer Bonding Systemup to 200 mm
EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System up to 300 mm
EVG®540 AutomatedWafer Bonding Systemup to 300 mm
WAFER BONDING SYSTEMS
EVG®501 Wafer Bonding Systemup to 200 mm
EVG®610 Semi-automated Bond Alignment Systemup to 200 mm
GEMINI® FB Automated Production Fusion Bonding Systemup to 200 mm
GEMINI® Automated Production Wafer Bonding Systemup to 300 mm
GEMINI® Automated Production Wafer Bonding Systemup to 200 mm
EVG®850 LT Automated Production Bonding System for SOI and Direct Wafer Bondingup to 200 mm
EVG®850 Automated Production Bonding System for SOI and Direct Wafer Bondingup to 300 mm
EVG®810 LT LowTemp™
Plasma Activation Systemup to 300 mm
EVG®301 Semi-automated Single Wafer Cleaning Systemup to 300 mm
EVG®320 Automated Single Wafer Cleaning Systemup to 300 mm
3-D honeycomb anti-reflective layer imprinted using SmartNIL®
Courtesy of FHG ISE
20 µm Topas hot embossed micro fluidic structures utilizing soft working stamp polymersSource: EVG
100 nm resolution lines replicated using SmartNIL® Source: EVG
EVG®850 TBL Automated Temporary Bonding System with integrated Lamination Systemup to 300 mm
EVG®805 Semiautomated Debonding System up to 300 mm
EVG®820 Lamination System up to 300 mm
EVG®850 DB AutomatedDebonding Systemup to 300 mm
EVG®850 TB XT Frame Automated Bonding SystemEVG®850 DB XT Frame Automated Debonding Systemup to 300 mm
EVG®560 Automated Wafer Bonding Systemup to 300 mm
3 µm thick resist with 0.5 µm line/space exposed using DUV setup Source: EVG
SU-8 structures 470 µm high, developed in PGMEA with megasonic-enhanced developmentSource: EVG
Fully populated 6” Si substrate imprinted on EVG®720 Source: EVG
ComBond® Automated High-Vacuum Wafer Bonding System up to 200 mm
Amorphouslayer
Si
Si
EVG® ComBond®: Particle- and void-free bondSource: EVG
EVG® ComBond®: Oxide-free, conductive interface silicon/silicon Source: EVG
EVG®560 Automated Wafer Bonding Systemup to 200 mm
EVG®50 Automated Metrology Systemup to 300 mm
2 µm20 µm1 mm
200 µm 10 µm
100 µm 10 µm
2 µm 500 µm
LITHOGRAPHY TRACK SYSTEMS
INSPECTION SYSTEMS
NANOIMPRINT LITHOGRAPHY SYSTEMS (UV-NIL / SmartNIL®, µ-CP, HE)
MASK ALIGNMENT SYSTEMS
EVG®620 Semi-automated Mask Alignment System up to 150 mm
HERCULES® Lithography Track System coat, UV-exposure and develop modules up to 300 mm
EVG®770 AutomatedNIL Stepperup to 300 mm
IQ Aligner® AutomatedUV-NIL, µ-CP Systemup to 300 mm
EVG®520 HE Semi-automatedHot Embossing System up to 200 mm
EVG®510 HE Semi-automatedHot Embossing System up to 200 mm
EVG®750 AutomatedHot Embossing Systemup to 200 mm
EVG®150 N Automated NanoSpray Coating Systemup to 300 mm
EVG®40 NT Automated Measurement Systemup to 200 mm
HERCULES® L Lithography Track System resist processing & expose configuration up to 300 mm
EVG®6200∞ Semi-automatedUV-NIL, µ-CP System up to 200 mm
EVG®620(0) NT Semi-automated UV-NIL, µ-CP Systemup to 150/200 mm
EVG® 40NT Automated Measurement Systemup to 300 mm
EVG®40 NT Semi-automated Measurement Systemup to 300 mm
EVG®101 AdvancedResist Processing System up to 300 mm
EVG®101 LA Large Area Coating Systemfor > 300 mm
EVG®150 Automated Resist Processing Systemup to 200 mm
EVG®105 BakeModule up to 300 mm
EVG®120 Automated ResistProcessing System up to 200 mm
EVG®150 LA Large Area Resist Processing System> 300 mm
EVG®620 NT Automated Mask Alignment System up to 150 mm
EVG®6200∞ Automated Mask Alignment Systemup to 200 mm
IQ Aligner® NT Automated Mask Alignment System up to 300 mm
EVG® 6200NT Semi-automated Mask Alignment Systemup to 200 mm
EVG®620 Semi-automated UV-NIL, µ-CP Systemup to 150 mm
EVG®610 Semi-automated Mask Alignment System up to 200 mm
EVG®620HBL Automated Mask Alignment System up to 150 mm
EVG®610 Semi-automated UV-NIL, µ-CP System up to 150 mm
EVG®150 Automated Resist Processing Systemup to 300 mm
EVG®750 R2R AutomatedRoll-to-Roll Hot Embossing System
EVG®720(0) Automated UV-NIL Systemup to 150/200 mm
EVG®150 XT Automated Resist Processing Systemup to 300 mm
RESIST PROCESSING SYSTEMS
HERCULES® NIL Integrated UV-NIL Track Systemup to 200 mm
EVG®7200 LA Semi-automated Large-Area SmartNIL® Systemup to 370 x 470 mm (Gen 2)
GEMINI® FB Automated Production Fusion Bonding Systemup to 300 mm
EVG®850 TB Automated Temporary Bonding Systemup to 300 mm
We act globally. Our lithography, bonding and imprint equipment is designed for reliability, productivity and quality, without any limits. Our highly qualified employees are part of a worldwide network and react quickly and flexibly to customer requests and inquiries.
We are always prepared for new challenges.
Customer Support
EVG Applications Lab Quality Assurance Process Monitoring on anEVG®850 DB System
Process Developmentand Services
EVG Process Expertise
EVG Processes
With state-of-the-art application labs based at its headquarters in Austria, as well as in the U.S. and Japan, EV Group (EVG) is focused on delivering superior process expertise to its growing global customer base - from the initialdevelopment until the final integration at the customer’s site.Featuring state-of-the-art cleanroomsand a highly experienced staff of process and application engineers, the company's process development business unit works hand in hand with customers on a number of areas.
The company's application labs provide demonstrations of its various products for potential customers looking to leverage EV Group's extensive line up of advanced wafer processing solutions for semiconductor, MEMS and nanotechnology markets. Furthermore, our labs provide process development support for custom applications to address customer´s unique and challenging requirements - at any stage of the development process.
These advanced process development and application labs are designed to accommodate independent research work to explore and develop baseline processes that will open up new market opportunities. This includes working with key partners, like material suppliers, to develop and optimize new processes and capabilities. Case in point, EV Group's ongoing relationship with Brewer Science, who by working closely together, have demonstrated temporary wafer bonding capabilities for a wide range of backside processes.
EV Group's process development team works with customers needing "demonstrator" parts for their respective customer-specific requirements. As a result, EV Group's multiple application labs are equipped to conduct small-volume pilot line runs to simulate an actual production line process, when necessary. This is very advantageous, especially for those customers with extremely complex demands - ensuring seamless process capability that suits
all parties ahead of time and ultimately puts EV Group's customers a step ahead of the competition.
In all, these advanced labs provide customized tooling capabilities - enabling EV Group's customers to effectively compete in today's ever-changing,fast-paced environment by enabling ashorter time to market, easing integrationheadaches and eliminating the risk to schedule across multiple industries and applications.
This is the passion and commitment that makes EV Group a value-added partner and why companies demanding nothing less than the best continue to turn to EV Group for its unparalleled world-class process and technology expertise.
Since introducing the industry's first backside-alignment microscope on a proximity mask alignment system more than two decades ago, EV Group has been committed to pioneering advances in lithography for semiconductor and MEMS manufacturing.
The company's key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask alignment systems (EVG600, EVG6000 and IQ series) and in its highly integrated coating platform (EVG100 series). All of EV Group's lithography equipment platforms are 300 mm ready, can be fully integrated into its HERCULES lithography track systems, and are complemented by its metrology tools for top-to-bottom side alignment verification.
Other important advancements by EV Group in the lithography space include the company's special resist coating technologies - OmniSpray and the revolutionary NanoSpray. Not only do these unique technologies allow for extremely conformal coatings over high-topography structures - for example, through-silicon-via (TSV) structures with an aspect ratio of 1:5 (W:H) - but, ultimately, they enable customers to realize significantly reduced fabrication costs.
Through its commitment to continued innovation and customer collaboration, EV Group has consistently raised the bar for cost-effective, nanometer-scale lithography processing. This future-focused approach enabled the accelerated introduction of its UV-nanoimprint lithography (UV-NIL) and hot-embossing systems.
Today, the company holds the dominant market share in these promising technologies.
Solutions forLITHOGRAPHY
• Top and bottom side mask alignment both near-ultraviolet (NUV) or deep-ultraviolet (DUV) in proximity and contact exposure mode• Spin coating and resist development
• Dry-film resist lamination• OmniSpray and NanoSpray coating• Top-to-bottom side alignment inspection • UV-NIL, hot embossing and Micro Contact Printing (µ-CP)• Metrology tasks like CD, Box-in-Box or Overlay measurement
SUPPORTED LITHOGRAPHY PROCESS STEPS
IQ Aligner® NT Automated Mask Alignment System up to 300 mmEVG®150 Automated Resist Processing System up to 300 mm
The introduction of EV Group's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market.
Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EV Group holding the dominant market share for both semi- and automated wafer bonding systems and a growing ins-tall base of more than 1100 bond chambers. Regarding systems applying low-contact forces under room temperature at utmost clean conditions, EV Group is also leading the market.
EV Group's wafer bonding systems offer manufacturers numerous benefits, including optimal total cost of ownership (TCO), as well as a real wafer-wedge compensation unit to maximize the bonding yield. Their bond alignment systems can be integrated into a GEMINI Automated Production Bonding System. These systems, such as the patented (U.S. Pat.: 6,214,692 B1) SmartView face-to-face Bond Aligner, can support sub-micron alignment accuracies even with non-infrared (IR) transparent wafers.
As it did with MEMS manufacturing, the company is now leveraging its technology strengths to accelerate the success of 3D wafer stacking. For this the GEMINI FB Automated Production Fusion Bonding System has been developed. In further support of this technology transfer, EV Group developed chip-to-wafer bonding tools for high-yield heterogeneous 3D integration schemes and was the first to market with 300 mm wafer bonding systems.
Addressing new market challenges in “beyond CMOS” applications, power devices, silicon photonics and high-vacuum MEMS packaging, EVG has introduced the automated high-vacuum wafer bonding system EVG ComBond. The ComBond technology enables covalent and conductive wafer bonding processes at room temperature or low temperatures. This process facilitates the direct integration of heterogeneous materials, including III-V compound semiconductor materials like gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP) on silicon substrates, GaAs on germanium (Ge), crystalline silicon carbide (cSiC) on SiC or on silicon, and lithium tantalate (LiTaO3) on silicon. Key markets and applications include engineered substrates, high efficiency solar cells and MEMS devices.
• Permanent wafer bonding and chip-to-wafer bonding• Thermal and UV cured bonding interfaces• Anodic, glass-frit, metal-diffusion, eutectic, silicon-direct, polymer bonding, and LowTemp™ plasma activated bonding • Face-to-face SmartView®, backside, IR and transparent bond alignment
• Temporary bonding to carrier substrates with spin-on polymers or dry-film laminates• Debonding of thin wafers from carrier substrates• Void and alignment inspection • ComBond® technology: room temperature bonding, oxide-free conductive interface• High vacuum encapsulation
Solutions forPERMANENT WAFER BONDING
Building on its success in permanent wafer bonding, EV Group introduced automated temporary bonding and debonding technology to address compound semiconductor and 3D IC manufacturers' immediate need for high-yield processing of ultra-thin and fragile wafers.
The EV Group technology temporarily mounts a wafer onto a carrier by applying thermal or UV-release intermediates (e.g., spin-on polymers, waxes, resists and dry-film laminates), providing manufacturers with several key benefits. These include optimal design-process flexibility, high yield (via the rigid carrier support), ease of integration into an existing fabrication infrastructure, and a highly reliable debonding step following complete front and backside processing.
Solutions forTEMPORARY WAFER BONDING
SUPPORTED WAFER BONDING STEPS
EVG®560 Automated Wafer Bonding System up to 300 mmEVG®500 Bond series chamber
EVG Services
Field Service On-Site Visits • Preventive maintenance and repair carried out in accordance with EV Group's high-quality standards• Immediate assistance by factory trained, certified field service engineers• On call support • Equipment relocation• Worldwide service through our subsidiaries and partners
Technical Support • Remote diagnostics and trouble shooting via secure internet line, phone and e-mail • Assistance with spare part number research
Spare Parts • Recommended spare parts packages • Guaranteed lead times • Regional spare part stocks • Parts repair and refurbishment servces • Consignment stock options
Product Training • Worldwide distributed training locations• Standardized modules for operation, maintenance & process training from novice to expert level available on-site and at EV Group training centers.
Extended Equipment Warranty • Includes spare parts and labor
Upgrades
Key Benefits
• Certified engineers are taking care of all equipment related issues• Engineers' long-term experience and technology expertise• ISO certification ensures consistent high quality
• Access to Best Known Methods (BKM's) and trouble shooting advise• Expert help from experienced Senior Engineers• Guaranteed fast response time
• Cost optimization through parts repair, refurbishment or new parts replacement • Customized spare part packages • Short lead times due to customized spare part stocking options
• Optimum uptime and tool performance through EV Group certified operators and maintenance personnel
• Set costs with priority support
• Performance enhancement based on your actual production needs • Customized solutions for new challenges
• Off the shelf upgrades for additional features and performance enhancement • Tailored soft- and hardware upgrades based on your requirements Wafer &
TemplateFabrication
SubstrateBondingfor SOI
AlignmentVerification
Resist Coating
Spin/Spray
Nano-imprint
Lithography
Thinning,CMP
Electro-plating
RIE,DRIE
WaferDicing
...etc.
BondAlignment
ResistDeveloping
TemporaryBonding/Debonding
CVD,LPCVD,PVD,...
WetEtching
StressRelief
Etching
WaferBonding
Metallization
ResistLift-Off
Oxidation
Chip-to-Wafer
Bonding
WaferBumping &Redistri-bution
Substrate Cleaning
PlasmaActivation
ProximityLithography
Metrology
EVG Customer SupportEVG Applications Lab
Our highly qualified employees are part of a worldwide network.
Commitment Without Borders
EVG Subsidiaries
EVG Japan EVG TaiwanEVG North AmericaEVG Korea
Corporate Headquarters
EVG China
EV Group Product Range
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Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice.
All trademarks, logos, website addresses or equipment names that contain the letters or words “EVG” or “EV Group” or any combination thereof, as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond®, CoverSpin™, EZB®,EZ Bond®, EZD®, EZ Debond®, EZR®, EZ Release®, GEMINI®, HERCULES®, HyperIntegration®, IQ Aligner®, LowTemp™, NanoAlign®, NanoFill™, NanoSpray™, NIL-COM®, NILPhotonics®, OmniSpray®, SmartEdge®, SmartNIL®, SmartView®, The Triple “i” Company Invent-Innovate-Implement®, Triple i®. Other product and company names may be registered trademarks of their respective owners.
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North America Tech SupportPhone: +1 800 384 8794E-Mail: [email protected]
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