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1 [email protected] EUV mask inspection: a bright idea? EUV mask inspection: a bright idea? Kenneth A. Goldberg, Ph.D. Lawrence Berkeley National Laboratory Wailea, Maui, Hawaii, June 12, 2008 http://Goldberg.LBL.gov Kenneth A. Goldberg, Ph.D. Lawrence Berkeley National Laboratory Wailea, Maui, Hawaii, June 12, 2008 http://Goldberg.LBL.gov

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EUV mask inspection:a bright idea?EUV mask inspection:a bright idea?

Kenneth A. Goldberg, Ph.D.Lawrence Berkeley National Laboratory

Wailea, Maui, Hawaii, June 12, 2008

http://Goldberg.LBL.gov

Kenneth A. Goldberg, Ph.D.Lawrence Berkeley National Laboratory

Wailea, Maui, Hawaii, June 12, 2008

http://Goldberg.LBL.gov

[email protected]

Kenneth A. Goldberg, Ph.D.Lawrence Berkeley National Laboratory

Wailea, Maui, Hawaii, June 12, 2008

Kenneth A. Goldberg, Ph.D.Lawrence Berkeley National Laboratory

Wailea, Maui, Hawaii, June 12, 2008

EUV mask inspection:a bright idea?EUV mask inspection:a bright idea?

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Different wavelengths see the same ML structure differently

λ“1%” depth

bi- layers

13.4 nm 215 nm 31488 nm 53.6 nm 8266 nm 20.6 nm 3

EUV light penetrates deeply into the resonant ML structure.488-nm and 266-nm light barely reaches below the surface.EUV light penetrates deeply into the resonant ML structure.488-nm and 266-nm light barely reaches below the surface.

Field Penetration for three λs

0.01

1.00

depth [nm]

Field intensity vs. depth

At-wavelength testing probes the actual multilayer response.

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• colorblind inspection: more than skin deep• modeling: size does matter• Lasertec M7360: detectability• actinic imaging: seeing is believing• EUV brightfield defect detection: Yes, we can

Outline

d=“SEVd” =Spherical EquivalentVolume diameter

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Critical EUV Phase defects < 50 nm SEVd

Eric Gullikson,SPIE 5734

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M7360-detectable defects > 29 nm SEVd

K J I H G F E D C B A

0.9 2.4 height

39.1 48.8 FWHML

Wonil Cho, SPIE 6730

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buried substrate defect

1 µm

1 µm

1 µm

0.8-µm focus steps (50-nm wafer equivalent)

large absorber defect

Column K (2.4 x 48.8 nm)Buried defects with < 20 nm SEVd are seen at EUV

W. Cho, SPIE 6730

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buried substrate defect

1 µm

1 µm

1 µm

0.8-µm focus steps (50-nm wafer equivalent)

large absorber defect

Column L (0.9 x 38.1 nm)Buried defects with < 15 nm SEVd are seen at EUV

W. Cho, SPIE 6730

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Printability vs. Detectability Summaryhe

ight

(nm

)

Good News!Actinic imaging:Small defects are Less Printable than predicted

Bad NewsM7360 did not detect

critical defects for 40 nm HP

W. Cho, SPIE 6730

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How long would it take to scan an EUV mask with EUV light?

Consider an EUV mask-blank inspection tool

Defect Size Source PowerStatistics

Result

Beam Size

Remember:• In Brightfield you look for tiny changes in R.• In Darkfield you search for scattering, BUT

you can miss large dark defects completely!

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Total mask area, MNumber of patches = M/A

MA

NA > 4MARD2

Total Number of photons

Total Energy

E > 4MA

RD2 100 eV( )1.6x10−17J /eV( )

E > 4MA

RD2 1.6x10−15J( )

To detect the change we need

N > 2A

D⎛

⎝ ⎜

⎠ ⎟ 2

Reflectivity is R.Assume Q.E. = 100%

1N

< D2A

or

NA > 1

R2AD

⎝ ⎜

⎠ ⎟ 2

in each patch A

Brightfield detection requirements

A D

Reflected Intensity relative change DA

Measure N photons,relative uncertainty

NN

= 1N

N

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Total mask area, MNumber of patches = M/A

MA

NA > 4MARD2

Total Number of photons

Total Energy

E > 4MA

RD2 100 eV( )1.6x10−17J /eV( )

E > 4MA

RD2 1.6x10−15J( )

Brightfield detection requirements

To detect the change we need

N > 2A

D⎛

⎝ ⎜

⎠ ⎟ 2

Reflectivity is R.Assume Q.E. = 100%

1N

< D2A

or

NA > 1

R2AD

⎝ ⎜

⎠ ⎟ 2illuminating

each patch, A

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Brightfield detection requirements

Total mask area, MNumber of patches = M/A

MA

NA > 4MARD2

Total Number of photons

Total Energy

E > 4MA

RD2 100 eV( )1.6x10−19J /eV( )

E > 4MA

RD2 1.6x10−17J( )Note: This slide has been corrected.The original slide, had an errorin the exponent here.

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Brightfield detection requirements

Total mask area, MNumber of patches = M/A

MA

NA > 4MARD2

Total Number of photons

Total Energy

E > 4MA

RD2 100 eV( )1.6x10−17J /eV( )

E > 4MA

RD2 1.6x10−15J( )

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R = 60%, M = (100 mm)2

D =A [µm] 40 nm 30 nm 20 nm 10 nm

10 42 132 667 106675 10 33 167 2667 Einc [J]1 0.4 1 6.7 107

0.5 0.1 0.3 1.7 27

incident EUV energy

Each case is < 1h with a 10W (IF) sourceand a 30% efficient illuminator.

E > 4MA

RD2 1.6x10−15J( )

EUV mask-blank scanning: It can be done

3h @ 1W

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Will lowly defects stop EUVL?

defectdefect defectdefectdefect defect

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EUVL?EUVL?

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Will lowly defects stop EUVL?

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defectdefect defectdefectdefect defect

MaskInspection!

MaskInspection!EUVL?EUVL?

Not if it’sour move!