Progress in 3D Printed Multi-functionality Eric MacDonald, PhD PE

Friedman Chair for Manufacturing, Youngstown State University Associate Director, W. M. Keck Center for 3D Innovation, UTEP

Outline

London Museum of Science and Manchester Museum of Industry in exhibit 3D Printed Gun from University of Texas Law Student (confiscated) 3D Printed Satellite from UTEP / UNM COSMIAC

Intro: 3D Printing in International Spot Light

Intro: ASTM F42 Categories

■  Vat Photopolymerization

■  Material Extrusion

■  Powder Bed Fusion

■  Material Jetting

■  Binder Jetting

■  Sheet Lamination

■  Directed Energy Deposition

AM Technologies Available within the UTEP Keck Center

Major Research in Multifunctional 3D Processes and Applications Major research in Arcam EBM Investing in Lasers – SLM, Aconity Recent investment in Binder jetting ExOne – ceramics, metals, RF

Intro: ASTM F42 Categories

■  Vat Photopolymerization

■  Material Extrusion

■  Powder Bed Fusion

■  Material Jetting

■  Binder Jetting

■  Sheet Lamination

■  Directed Energy Deposition

AM at YSU and the America Makes Innovation Factory Youngstown, OH

Research focus on smart tooling, sand casting, computer vision for closed loop control, metal repair,. Starting 3D printed electronics.

Intro: Vat Photopolymerization

■  AM process with a vat of photocurable polymer cured selectively by laser or projector.

■  Benefits •  Surface finish •  Resolution (75 microns) •  uSL (5 microns) •  Ambient processing

■  Issues •  Materials limitations •  Post cleaning

Intro: Materials Extrusion

■  AM process that selectively extrudes a thermoplasitc ■  Based on Stratasys FDM patents (expired patent –> proliferation)

•  Most popular

■  Benefits •  Office friendly •  DIY community •  Large volume

■  Issues •  Resolution •  Surface finish •  Z axis anisotropy

Intro: Powder Bed Fusion

■  AM process where thermal energy selectively melts/sinters the top surface of a powder bed.

■  SLS, SLM, DMLS, EBM

•  Polymers, metals & ceramics

■  Benefits •  Multiple materials (metals, nylon) •  Strength •  Fully dense

■  Issues •  Wasted powder •  Powders processing

Intro: Materials Jetting

■  AM process in which photocurable material is inkjetting and immediately cured with a UV lamp

•  Wax or Photopolymers •  Multiple nozzles •  Single nozzles

■  Benefits •  Multiple colored materials •  Ink jet resolution

■  Issues •  Materials limitations

Intro: Binder Jetting

■  AM process depositing binder with inkjetting onto a powder bed and thermally cured – often infiltrated for full density.

■  Zcorp (Dead) •  ExOne •  Voxeljet •  HP Fusionjet ?

■  Benefits •  Multiple colors per layer •  Wide range of materials

■  Issues •  Post furnace cycle •  Strength (Z Corp)

Intro: Sheet Lamination

■  AM process in which laminate material is bonded and selectively removed

•  Paper – glue •  Plastic – glue / heat •  Metal – UC welding

■  Benefits •  Materials choices

–  Aluminum (UC)

•  Strength (UC)

■  Issues •  Waste •  Additional steps

Intro: Directed Energy Deposition

■  AM process in which material and energy are applied coincidently to the layer.

■  Benefits •  Feature addition and repair •  Wire & Powder Materials •  Lasers & Electron Beams

■  Optomec LENS – –  Good resolution but slower

■  Sciaky –  Large build (19’x4’x4’) –  Fast (20 Lbs / hour) –  Lower resolution\

■  Ambit

UTEP closer to San Diego than Houston YSU < six hours from NYC, Chicago, Pitt, Cleveland, DC, Philly

Intro: Where are El Paso and Youngstown?

•  Founded in 2000 – 13,000 sq. ft. facility with over 50 3D printers •  R&D projects with over 100 industrial clients and ten federal agencies •  More than 50 student researchers and seven full-time staff •  Broad and expanding patent portfolio •  Everything we do uses 3D printing technologies

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Intro: UTEP’s Keck Center

•  Founded in 2000 – 13,000 sq. ft. facility with over 50 3D printers •  R&D projects with over 100 industrial clients and ten federal agencies •  More than 50 student researchers and seven full-time staff •  Broad and expanding patent portfolio •  Everything we do uses 3D printing technologies

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Intro: YSU’s CIAM Center

Intro: 3D Printing in International Spot Light

http://www.journals.elsevier.com/additive-manufacturing/

■  Ryan Wicker Editor in Chief ■  Eric MacDonald, Deputy Editor

■  Mireya Perez, Managing Editor

■  Introducing fast-publication, science-based, peer-reviewed journal for academia / industry

■  Inaugural issue in Summer 2014

■  Topics:

•  Design and Modeling

•  AM processes and process enhancement

•  Multiple and novel materials

•  Special applications with multi-functionality

Materials: Twin Screw Extruder Matrix

Material

Additives

Extruder Unit

Extruded Composites

3D Printed Structures

3D Printer

Extrude thermoplastic feedstock (3D printer specialty ink): •  Increase Material Strength, Hardness, Flexibility, Stretchability •  Optimize Permittivity / Permeability •  Increase Thermal Conductivity •  Improve Radiation Shielding

•  Tungsten impregnation •  High Density Polyethylene (HDPE)

Materials: Heavy Metal Composites

•  Tungsten powder in Polycarbonate –  Trade-off between:

•  Weight •  Strength •  Thermal / electrical conductivity •  Radiation attenuation

–  3D printed geometries for shielding –  Optimize unused volume for protection

Radiation shielding

Additives Permittivity Extruded CaTiO3 165 Yes

SrTiO3 233 Yes

TiO2, anatase 48 Yes

TiO2, rutile 114 Yes

NaCl 5.9 Yes

Fe3O4 Permeability Yes

Tungsten Rad. Shield Yes

Zeonex Low Loss Yes

Extrusion of E&M Polycarbonate

Goals: Radiation Shielding Low Loss Antennas Electrically Large Antennas Electromechanical Devices

Materials: RF and Magnetic Materials

Materials: Flexibility / Stretchability

•  UTEP Proprietary Polymer Blend –  ABS/SEBS Blend –  Tunable strain – Wires embed structurally

ABS Grade MG94 blended with Kraton SEBS-g-MA. Tunable strain from 3.32 ± 0.7 % to 1506.57 ± 90.1%

Complementary Manufacturing

3D Printing for Dielectric Structures

Enhanced thermoplastics

Technology: 3D Printed Electronics

In low Earth Orbit

Ceramics

Photo- polymers

wires dispensing

machining

lasers

motors

conformal

3d sensors

3d sensors

Satellites

Technology: Ultra sonic / thermal embedding

copper wire

3D printed thermoplastic substrate

Laser Micro-Welding

Technology: Replacing Conductive Inks

Replace inks with bulk copper: -  High conductivity -  Good density (80 micron wires) -  Low cost relative to silver inks -  Laser welding for connections

100 microns

anvil double-sided tape ABS substrate metal mesh polyimide film

vertically oscillating

horn

scanning direction

0 5

10 15 20 25 30 35 40 45

Aver

age

Yiel

d St

reng

th (M

Pa)

Theoretical

Actual

Technology: Serendipitous enhancements

Mechanical reinforcement: -  Essentially a composite -  Structurally integrated wires -  Improving anisotropy

Technology: Milled Foils for Intricate Patterns

0.075”

0.080”

0.020” 0.125” 35 micron thick copper foil is

equivalent to PCB plating. Smooth surface is well-suited for RF apps at high frequency.

Technology: Original Multi3D Manufacturing

Technology: Independent Wire Embedding

•  Lockheed Martin / Wolf Robotics Factory of the Future •  Point wise Composition Control

•  “Borrowing” UTEP Wire Embedding •  Displayed at Defense Manufacturing Conference Exhibition

600 micron diameter copper wire

Technology: Next Gen Multi3D

Foil  applica)on  will  milling  

•  Consolidated  single  gantry  fabrica)on  system.  •  Tool  exchanger    •  Five  degrees  of  freedom  •  200  °C  Build  Chamber  •  Full  opera)on  on  schedule  for  Oct  16  

Pellet  fed  extrusion  /  tool    exchange  

Wire  embedding  

Technology: Big Area AM (BAAM) with Multi3D

Grant  for  Integra)ng  hybrid  wire  embedding  into  Oak  Ridge  technology  

Base  fabrica)on  born  from  Oak  Ridge  and  LMC.  

Commercialized  by  Cincinna),  Inc  and  car  design  and  fabrica)on  by  Local  Motors,  Inc    

Demonstrations: Conformal Electronics

Demonstrations: Satellite Electronics

To avoid this wiring clutter…

Wiring bus in structure

Bus connector

Solar panels in walls

Demonstrations: 3D Printed Propulsion

•  Busek Pulsed Plasma Thrusters •  requiring high voltage (1-10kV) •  non-toxic Teflon propellant

•  Dielectric strength and leakage testing •  Propulsion (micro-newton) testing at

Glenn NASA.

Propulsion Test Plate

Demonstrations: 3D Printed Thermal Mgmt

Textured Radiator intended for space applications

3D Printed Graphite

34

1 2 3 4 5 6 7 8 9 1030−

20−

10−

0

Attached BalunMesh BalunEmbedded Balun

Spiral Iteration 2 Return Loss

Frequency [GHz]

S11

[dB

]

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90-18

-16

-14

-12

-10

-8

-6

-4

-2

0

Azimuth (degrees)

Norm

aliz

ed M

agni

tude

(dB)

Radiation PatternArchimedian Spiral - Embedded Balun (f = 2.3 GHz)

LHCPRHCP

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90-22

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

Azimuth (degrees)

Norm

aliz

ed M

agni

tude

(dB)

Radiation PatternArchimedian Spiral - Attached Balun (f = 2.3 GHz)

LHCPRHCP

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

-14

-12

-10

-8

-6

-4

-2

0

Azimuth (degrees)

Norm

aliz

ed M

agni

tude

(dB)

Radiation PatternArchimedian Spiral - Mesh Balun (f = 2.3 GHz)

LHCPRHCP

Demonstrations: Archimedes Antenna Results

Demonstrations: Conformal Patch Antennas

Again,  Patch  A  was  designed  for  5.85  GHz,  and  Patch  B  for  5.65  GHz  with  no  fringing  factor.    Measurement   showed   the   actual   resonances   to   occur   at   6.27  GHz  and  6.18  GHz  although  the  S11  curve  was  much  higher  as  compared  to  the  foil  patches.  

A

B

5 5.2 5.4 5.6 5.8 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 8.2 8.4 8.6 8.8 930−

20−

10−

0

Mesh Patch AMesh Patch B

Conformal Mesh Patch Antennas

Frequency [GHz]

S11

[dB

]

Demonstrations: 3D Printed UAVs

Demonstrations: 3D Printed Motor

Computer Vision: Defects Easily Identified

Precise geometric data is captured from image for comparison against GCODE and CAD.

Computer Vision: Fourier Analysis

Frequency content describes roughness of surfaces or uniformity of powder.

Smooth Surfaces

Rough Surfaces

2D Freq Spectrum

Computer Vision: Video Feature Tracking

Tracking of heads, tips, salient process features.

Computer Vision: Electron Beam Tracking

Geographical data collected from real time in IR video of electron beam melting of one layer of a cylinder in an evacuated build chamber. Detecting difference from frame to frame. Fumes causing false detections but easily filtered.

Identical video with persistent dots. 4X speed.

Computer Vision: Thermographic Evaluation

Open Source computer vision, one image per layer.

Standard camera and $200 FLIR Lepton camera.

Tool path modified to hide “hot” extruder after each layer.

2D side profiling with high resolution geometry verification.

Computer Vision: Geometric Verification

Computer Vision: Debris Detection

Precise pixel-level measurement of existing layers during print. Virtual and dynamic calipers.

Three layers are monitored for width changes during subsequent layers

Computer Vision: Layer Width Measurement

Conclusion: Campus Architecture

Inspired by a 1916 National Geographic photo essay of the Kingdom of Bhutan Buddhist Himalayan Architecture

When YSU president Jim Tressel speaks, I instinctively want to deliver a open field tackle. GO PENGUINS!

UTEP

YSU