epon and epi-rez epoxy resins - momentive · pdf file2 at a glance epon™ – liquid...

Product Selector

We are the Epoxy Business of Momentive, one of the world’s leading suppliers of epoxy resins, curing agents, modifiers and epoxy systems. We offer a diverse line of epoxy resins that vary in chemical structure, molecular weight, viscosity and functionality—providing the formulator with a multitude of options. What’s more, our products have over sixty years of innovation and success in a wide variety of markets and end-use applications.

At our world-class technology centers in the U.S., Europe and Asia Pacific we pursue advanced processing technologies while creating new resin products and systems with broad performance ranges. We bring you processing advantages such as easy workability at room temperature with variable cure rates, and help you create products with special characteristics such as flexibility, good chemical and water resistance, and superior performance in elevated temperature service. By continually tackling technical challenges in our application laboratories, we are able to translate real world requirements into high quality, production-oriented materials.

The EPON™ and EPI-REZ™ families of resins were developed to provide superior overall performance in a variety of end-use applications. These products enable manufacturers to achieve nearly any desired performance level, while

optimizing processability and strength retention at elevated temperatures.

Key Benefits

EPON resins, in thermoset systems with our curing agents and modifiers, offer advantages such as: ■■ Low room temperature viscosity ■■ Long working life ■■ Low moisture absorption ■■ Superior epoxy performance ■■ Flexibility ■■ Reactivity ■■ High elongation ■■ Adjustable cure times ■■ Good chemical and corrosion resistance

■■ Heat resistance ■■ Fire retardance

EPON™ and EPI-REZ™ Epoxy Resins

Qualifying a resin system that

offers the best balance of

performance and processability

can be a significant challenge. You

not only need quality products

from a reliable supplier, you need

a company that is willing to share

its technical expertise and that will

provide services to help satisfy your

unique requirements. That’s where

Momentive Specialty Chemicals

Inc. (Momentive) comes in.

Our Products for America (North and South)

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At A Glance EPON™ – Liquid Epoxy Resins and Blends This segment of our product line represents the most widely used products in a number of industries. The most commonly used EPON Resin/V. C. HELOxy™ Modifier blends are available in several types and viscosity grades.

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EPON – Epoxy Resin Solutions These products are higher molecular weight standard or modified epoxies which are dissolved in solvent to allow easier handling and formulation because of lower viscosity.

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EPON – Solid and Powder Grade Resins These epoxy resins are in the molecular weight range most suitable for use in epoxy solutions, powder coating, composite and electronic applications. These products have a good balance of properties, including appropriate epoxy functionality for proper curing, good physical stability (sintering resistance), and good melt flow (low melt viscosity).

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EPON – Epoxy Novolac Resins These products are specifically designed to provide increased levels of thermal stability and chemical resistance, and are used in composites, structural adhesives, electronics / electrical and coating applications.

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EPON – Epoxy Polyacrylates These are very low viscosity resins possessing excellent wetting characteristics and rapid reaction rates with amine curatives over a broad temperature range.

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EPON – Elastomer Modified Epoxy Resins These products offer improved adhesive properties, thermal shock resistance and toughness, with good fatigue resistant properties.

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EPONEX™ – Cycloaliphatic Resin This segment offers a low viscosity liquid epoxy based on hydrogenated Bisphenol A for applications requiring UV resistance.

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EPON and EPONOL™ – Electrical Laminating Resins These products can be used to obtain fire retardance in a base epoxy resin formulation. The ultra-high molecular weight resin can be used to improve flexibility and modify the flow properties of the system.

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EPON and EPIKOTE™ – Epoxy Resins for Composites Epoxy resins that provide the property retention, toughness and corrosion protection required in composite applications.

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■ EPI-REZ™ – Epoxy Waterborne Resins These non-ionic aqueous dispersions of our epoxy resins provide benefits such as lower VOC, extended pot life, high crosslink density, high temperature performance, very good chemical resistance, B-stage capability, low color, and complete water-reducibility. Many of the Momentive EPIKURE™ Curing Agents can be used with these epoxy dispersions. In addition, since dicyandiamide is water soluble, it may be used to provide extended pot life formulations.

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The Formulator’s Choice All of our products are manufactured to high standards of quality and have very specific property ranges. To help you assess the many production and performance advantages of Momentive’s complete line of resins, we’ve summarized typical properties and resin characteristics in this product bulletin. The data in this bulletin is intended to give only basic product information for quick reference—individual product technical data sheets with additional information are available for most of the products listed in the following pages. For additional information about these products, or to contact us, visit the Epoxy, Curing Agents and Modifiers section of the Momentive website at www.momentive.com/epoxy

Resin Solution Coding System Epoxy resins employ a simple three-part coding system for designating the composition of resin solutions. The coding system consists of a number indicating the epoxy resin used in the particular solution, followed by one or more letters that describe the solvent or combination of solvents used to make up the solution. The last two numbers indicate the percent solids (by weight) of the composition. For example:

EPON™ Resin 1001-H-75

In this example, the base resin used to make this solution is the EPON Resin 1001F type. The solvent used is Propylene Glycol Monomethyl Ether (PM), as shown in the next table, and the solids content is 75 percent by weight.

The coding system that is used to designate the solvents in resin solutions is shown on the next table (pg 5):

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Solvent Coding System

Letter Code

Solvent Name Abbr Non HAPS 1 VOC Exempt 2

A Acetone Yes Yes

B Methyl Ethyl Ketone MEK Yes

C Methyl Isobutyl Ketone MIBK

D Diacetone Alcohol DAA Yes

E Isopropyl Alcohol IPA Yes

F n-Butyl Alcohol (Converting to Code "N") NBA Yes

G n-Butyl Acetate NBAC Yes

H Propylene Glycol Monomethyl Ether PGMME / PM Yes

I iso-Butyl Alcohol Yes

J Ethyl 3-Ethoxy Propionate EEP

K t-Butyl Acetate TBAC Yes Yes

L Propylene Glycol Mono n-Butyl Ether PGMnBE / PnB Yes

M Ethylene Glycol Monobutyl Ether EGMBE / EB Yes

N n-Butyl Alcohol NBA Yes

O Methyl n-Amyl Ketone MNAK Yes

P n-Propyl Alcohol NPA Yes

Q Propylene Glycol Monomethyl Ether Acetate PGMMEA / PMA Yes

R Dimethyl Formamide DMF

S Cyclohexanone Yes

T Toluene

U Aromatic 100 A 100 < 5% HAPS

V Dipropylene Glycol Monomethyl Ether DPGME Yes

W Water Yes Yes

X Xylene

Y Ethylene Glycol Monopropyl Ether EGMPE / EP

1 HAP is the acronym for hazardous air pollutant as defined by the U.S. Clean Air Act Amendments of 1990.

2 VOC is the acronym for Volatile Organic Compound as defined by the U.S. 40 CFRS1.100 (s). VOC exempt solvents are classified as such by the U.S. EPA, local state and regional air quality districts.

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Table 1: Typical Properties of EPON™ Unmodified Liquid Epoxy Resins

Product Chemical Type Viscosity at 25 °C (P)

Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPON 825 DGEBPA 50 – 65 175 –180 250 9.7 Ultra high purity, low viscosity liquid epoxy used for high solids coatings and specialty composites.

EPON 826 DGEBPA 65 – 95 178 –186 250 9.7 Low viscosity liquid epoxy used in coatings and composite applications.

EPON 827 DGEBPA 80 –100 179 –184 100 9.7 Medium viscosity liquid epoxy resin that falls between EPON 826 and EPON 828. It is used mainly in composite applications.

EPON 828 DGEBPA 110 –150 185 –192 250 9.7 Predominant liquid epoxy product, widely used in multiple applications.

EPON 830 DGEBPA 170 – 225 190 –198 250 9.7 Higher molecular weight liquid epoxy.

EPON 834 DGEBPA 3.5 – 9 2 230 – 280 200 9.7 Highest molecular weight liquid epoxy used in adhesives and as a modifier of liquid epoxy systems.

EPON 862 DGEBPF 25 – 45 165 –173 200 9.8 Low viscosity Bisphenol F liquid epoxy used alone or in blends with other resins. Allows high solids formulations with good chemical resistance. A high performance alternative to diluted EPON 828 resins.

EPON 863 DGEBPF 25 – 45 165 –174 200 9.9 Comparable performance to EPON 862 with improved crystallization resistance.

1 Platinum-Cobalt Color Scale

2 70% by weight solution in Diethylene Glycol Monobutyl Ether

Table 2: Typical Properties of EPON Modified Liquid Epoxy Resins


Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPON 824 Modified DGEBPA

40 – 70 192 – 204 250 9.6 Liquid epoxy modified for low viscosity and may be used as an alternative to diluted EPON 828 resins. Offers improved crystal resistance.


30 – 70 193 – 203 250 9.6 Liquid epoxy resin pre-catalyzed for subsequent up-staging with BPA.


110 –150 185 –195 250 9.7 Anti-foaming and anti-settling modified liquid epoxy resin for systems with fillers and pigments.


110 –140 182 –195 250 9.7 Anti-foaming and anti-settling modified liquid epoxy resin for silica filled systems.


15 – 382 625 – 725 10 3 9.0 Liquid epoxy modified for flexibility and toughness. Used in applications where thermal shock or impact resistance is important.


2 75% by weight solution in Xylene

3 Gardner Color Scale

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Table 3: Typical Properties of EPON™ Epoxy Resin Blends

Product Chemical Type

Viscosity at 25 °C (P)

Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPON 235 DGEBPA/ DGEBPF

60 – 80 177–182 200 9.8 Blend of BPA and BPF liquid epoxy resins. It provides lower viscosity than standard LER as well as improved crystallization resistance.


5 – 7 180 –195 75 9.5 Liquid epoxy with HELOXY 62 – Cresyl Glycidyl Ether, for good chemical and crystallization resistance.

EPON 815C Modified DGEBPA

5 – 7 180 –195 250 9.4 Liquid epoxy with HELOXY 61 – Butyl Glycidyl Ether, providing superior wetting characteristics.

EPIKOTE™ 816 Modified DGEBPA

1.5 – 2.1 189 – 200 200 9.4 Liquid epoxy with CARDURA E10P - glycidyl ester of neodecanoic acid, for good pigment wetting and resistance to filler settling. Offers good resistance to crystallization.


7–10 182 –190 250 9.4 Similar to EPON 815C with slightly higher viscosity.


11 –16 245 – 275 500 9.2 Liquid epoxy with HELOXY 505 – Castor Oil Glycidyl Ether, for flexibility in flooring and adhesive applications.


5 – 7 195 – 215 250 9.2 Liquid epoxy with HELOXY 8 – Alkyl Glycidyl Ether, utilized in a broad range of applications.

EPON CS 241 Modified DGEBPA

22.5 – 27.5 190 – 200 250 9.6 Liquid epoxy with HELOXY 8 – Alkyl Glycidyl Ether. A higher viscosity version of EPON 8132.


13.5 –18.5 195 – 205 50 9.4 Liquid epoxy modified with HELOXY 8 – Alkyl Glycidyl Ether. A medium viscosity version of EPON 8132 most often used in flooring systems.


52 – 58 187–195 50 9.6 Liquid epoxy with HELOXY 8 – Alkyl Glycidyl Ether that provides easier handling with good overall performance.


75 – 95 182 –196 200 9.6 Resin solution, 96% solids with HELOXY 65 – p-tert-Butyl Phenyl Glycidyl Ether.


50 – 65 180 –195 250 9.7 Liquid epoxy with HELOXY 62 – Cresyl Glycidyl Ether and modified for anti-settling and anti-foaming, primarily used in highly filled systems.


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Table 4: Typical Properties of EPON™ Liquid Epoxy Solutions



Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPON 828-X-95 DGEBPA Solution

15 – 45 193 – 204 2 9.5 Resin solution, 95% solids in Xylene.

EPON 834-F-90 DGEBPA Solution

46 –148 225 – 265 3 9.3 Resin solution, 90% solids in n-Butanol.


4.5 –18 230 – 280 3 9.2 Resin solution, 80% solids in Xylene.



EPON 836-C-75 DGEBPA Solution

3 – 6.5 280 – 335 3 8.9 Resin solution, 75% solids in MIBK.

EPON 8521-MX-60 Modified DGEBPA Solution

17.5 – 36 750 – 850 3 8.8 Modified resin solution, 60% solids in Ethylene Glycol Monobutyl Ether/Xylene, for improved surface tension characteristics.

EPON 872-X-75 Modified DGEBPA Solution

20 – 28 625 – 700 6 8.4 Modified resin solution, 75% solids in Xylene, for applications needing flexibility and toughness.

EPON 873-CX-80 Modified DGEBPA Solution

4.5 – 23 380 – 420 5 8.6 Modified resin solution, 80% solids in MIBK/Xylene, for applications needing flexibility, toughness and reduced VOC levels.

EPON 874-B-90 Modified DGEBPA Solution

515 –1213 245 – 275 6 9.1 Modified resin solution, 80% solids in MEK, for applications needing flexibility, toughness and reduced VOC levels.

EPON 874-CX-90 Modified DGEBPA Solution

13 – 27 245 – 275 6 9.1 Modified resin solution, 90% solids in MIBK/Xylene, for applications needing flexibility, toughness and reduced VOC levels.

EPIKOTE™ 874L-X-90 Modified DGEBPA Solution

21 – 23 230 – 270 3 9.2 Modified resin solution, 90% solids in MIBK/Xylene, for applications needing higher flexibiity, toughness, and lower VOC levels


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Table 5: Typical Properties of EPON™ Solid Epoxy Solutions



Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPON 1001-A-80 DGEBPA Solution

45 – 70 450 – 550 3 9.2 Resin solution, 80% solids in Acetone (VOC Exempt).

EPON 1001-B-80 DGEBPA Solution

27–148 450 – 550 3 9.1 Resin solution, 80% solids in MEK.

EPON 1001-CX-75 DGEBPA Solution

27–148 450 – 550 3 9.0 Resin solution, 75% solids in MIBK/Xylene.

EPON 1001-DNT-75 DGEBPA Solution

15 – 40 500 – 575 2 9.2 Resin solution, 75% solids in Diacetone Alcohol/ n-Butanol/Toluene

EPON 1001-FT-75 DGEBPA Solution

27–148 450 – 600 3 9.1 Resin solution, 75% solids in n-Butanol/Toluene.

EPON 1001-G-70 DGEBPA Solution

15 – 64 450 – 500 2 9.2 Resin solution, 75% solids in n-Butyl Acetate.

EPON 1001-H-75 DGEBPA Solution

36 – 388 450 – 600 3 9.2 Resin solution, 75% solids in Propylene Glycol Monomethyl Ether.

EPON 1001-K-65 DGEBPA Solution

15 – 45 450 – 550 3 8.8 Resin solution, 65% solids in t-Butyl Acetate (VOC-exempt).

EPON 1001-O-75 DGEBPA Solution

27–148 450 – 550 3 9.0 Resin solution, 75% solids in MNAK.

EPON 1001-T-75 DGEBPA Solution

36 – 388 450 – 550 3 9.1 Resin solution, 75% solids in Toluene.

EPON 1001-UY-70 DGEBPA Solution

36 – 64 450 – 500 3 9.0 Resin solution, 70% solids in Aromatic 100/Ethylene Glycol Monopropyl Ether.



EPON 1004-O-65 DGEBPA Solution

27 – 99 880 – 985 3 8.7 Resin solution, 65% solids in MNAK.

EPON 1007-CT-55 DGEBPA Solution

23 – 64 1,600 – 2,300 3 8.4 Resin solution, 55% solids in MIBK/Toluene.

EPON 1007-FMU-50 DGEBPA Solution

27 – 64 1,600 – 2,300 3 8.3 Resin solution, 50% solids in n-Butanol/Ethylene Glycol Monobutyl Ether/Aromatic 100.

EPON 1007-HT-55 DGEBPA Solution

27 – 64 1,600 –1,900 2 9.0 Resin solution, 55% solids in Propylene Glycol Monomethyl Ether/Toluene.

EPON 1009-DU-40 DGEBPA Solution

11 – 27 2,300 – 3,500 1 8.3 Resin solution, 40% solids in Diacetone Alcohol/ Aromatic 100.

EPON 1009-MX-40 DGEBPA Solution

6 – 23 2,300 – 3,000 1 8.3 Resin solution, 40% solids in Ethylene Glycol Monobutyl Ether/Xylene.


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Table 6: Typical Properties of EPON™ Solid Epoxy Custom Solutions



Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPON CS 258 DGEBPA Solution

40 – 65 2,250 – 2,455 1 8.9 Resin solution, 50% solids in Propylene Glycol Monomethyl Ether Acetate.

EPON CS 267 Modified DGEBPA Solution

13 – 36 2,700 – 3,300 3 8.8 High molecular weight resin modified for high toughness, 65% solids in Propylene Glycol Monomethyl Ether Acetate/Toluene.


Table 7: Typical Properties of EPON Solid Epoxy Resins – Fusion Grades


Solution Viscosity 1 at 25 °C (cP)

Weight per Epoxide

Color2 (max)

Softening Point °C

Melt Viscosity at 150 °C (P)

Comments

EPON 1001F DGEBPA 7.0 – 9.6 525 – 550 200 79 4 – 5 Lowest molecular weight solid epoxy used to provide improved toughness, flexibility, flow control and tack. Standard resin for coatings and pre-preg. Susceptible to sintering. Density 1.20 g/ml.

EPON 1002F DGEBPA 9.2 –13.6 600 – 700 200 85 12 – 25 Slightly higher molecular weight than EPON 1001F. Better sintering resistance. Density 1.20 g/ml.

EPON 1004F DGEBPA 15 – 25 800 – 950 200 96 16 – 20 Medium molecular weight solid epoxy resin containing hydroxyl groups. Often reacted with vegetable oil acids to produce epoxy ester resins. Can also add toughness, flexibility and rheology control. Density 1.20 g/ml.

EPON 1007F DGEBPA 50 –100 1,700 – 2,200 200 125 ≈ 500 Moderately high molecular weight solid epoxy resin used for industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins. Density 1.19 g/ml.

EPON 1009F DGEBPA 100 – 250 2,300 – 3,800 200 135 > 500 High molecular weight solid epoxy resin for baked industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins. Density 1.19 g/ml.

1 40% by weight solution in MEK


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Table 8: Typical Properties of EPON™ Solid Epoxy Resins – Powder Coating and Molding Grades


Solution Viscosity 1 at 25 °C (cP)

Weight per Epoxide

Color2 (max)

Softening Point °C


Comments

EPON 2002 DGEBPA 10 –17 675 – 760 100 80 – 90 20 – 40 Medium low molecular weight solid epoxy resin used primarily for thin film epoxy powder coating applications. Density 1.19 g/ml.

EPON 2003 DGEBPA 14 –18 725 – 825 100 90 – 95 30 – 50 Medium molecular weight solid epoxy resin used primarily for thin or thick epoxy powder coating applications. Density 1.19 g/ml.

EPON 2004 DGEBPA 18 – 27 875 – 975 100 95 –105 70 –120 Medium molecular weight solid epoxy resin used primarily for thin or thick film epoxy powder coating applications. Density 1.19 g/ml.

EPON 2005 DGEBPA 25 – 55 1,200 –1,400 100 110 –120 > 300 Moderately high molecular weight solid epoxy resin used primarily for intermediate and thick film epoxy powder coating applications. Density 1.19 g/ml.


35 – 75 750 – 850 100 100 –120 200 – 600 Moderately high molecular weight solid epoxy resin modified with epoxy phenol novolac used primarily in high performance powder coating applications to provide superior chemical and corrosion resistance. Density 1.19 g/ml.


17 – 26 850 – 950 100 95 –105 60 –120 Medium molecular weight solid epoxy resin modified with a flow control agent. Density 1.2 g/ml.


8 –12 625 – 675 100 — — Medium low molecular weight solid epoxy resin modified for improved flow.



Table 9: Typical Properties of EPON Solid Epoxy Resins – Electrical Grade


Solution Viscosity 1

cP at 25 °C

Weight per Epoxide

Color2 (max)

Softening Point °C


Comments


7.4 – 9.5 520 – 590 500 75 – 80 6 – 8 Solid epoxy resin flake, modified for low melt viscosity and high reactivity. Primarily used for electrical encapsulation.



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Table 10: Typical Properties of EPON™ and EPIKOTE™ Epoxy Novolac Resins



Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPON 1031 TGETPE Flake

39 2 195 – 230 18 10.4 Tetraglycidyl Ether of Tetraphenol Ethane with a functionality of 3.5. Used in applications requiring high temperatures and chemical resistance.

EPON 1031-A-70 TGETPE Solution

0.5 – 2.2 195 – 230 18 9.1 EPON 1031 solution, 70 % solids in Acetone.

EPON HPT 154-A-85 Epoxy Phenolic Novolac Solution

5 –12 176 –181 2 9.0 EPON 154 solution, 85% solids in Acetone.

EPON 154 Epoxy Phenolic Novolac

310 – 400 3 176 –181 2 10.3 Epoxy phenolic novolac resin with a functionality of 3.6, providing high chemical and temperature resistance, and dimensional stability.

EPON SU-2.5 Epoxy BPA Novolac

20 – 60 3 180 – 200 6 9.8 Epoxy Bisphenol A novolac with a functionality of 2.5, providing good thermal stability and chemical resistance. Used in electrical, adhesive and composite applications.

EPON SU-8 Epoxy BPA Novolac Flake

10 – 60 4 195 – 230 6 10.0 Epoxy Bisphenol A novolac with a functionality of 8, providing rapid development of green strength, with good high temperature performance. Used in electrical, adhesive and composite applications.

EPON 160 Epoxy BPF Novolac

345 – 485 168 –178 3 9.9 BPF epoxy novolac with a functionality of 2.6 – a low viscosity version of EPON 154. High functionality with easy processing, good thermal stability and chemical resistance.


180 – 280 169 –178 3 9.9 BPF epoxy novolac with a functionality of 2.5 – a lower viscosity version of EPON 160. High functionality with easy processing, good thermal stability and chemical resistance.


60 – 78 166 –178 3 9.9 BPF epoxy novolac with a functionality of 2.2 – the lowest viscosity version of EPON 160. Adequate functionality with easiest processing, yet with good thermal stability and chemical resistance.

EPON 164 Epoxy Cresol Novolac Flake

35 – 50 5 200 – 240 6 10.0 Solid epoxy cresol novolac resin with a functionality of 4.1 and is used in high performance laminates, molding compounds, aerospace composites, special adhesives and tooling systems.

EPON 165 Epoxy Cresol Novolac Flake

100 – 200 4 200 – 230 6 10.0 Solid epoxy cresol novolac resin with a functionality of 5.5 and is used in very high performance laminates, molding compounds, special adhesives, aerospace composites and tooling systems.


2 at 120 °C

3 at 52 °C

4 at 130 °C


6 at 50 °C

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Table 11: Typical Properties of EPON™ Epoxy Polyacrylates

Product Chemical Type Viscosity at 25 °C (cP)

Equivalent Weight

Color1 (max)

Density (lb/gal)

Comments

EPON 8021 Epoxy Polyacrylate

85 –115 300 – 320 1 9.2 Very low viscosity epoxy diacrylate resin that imparts high reactivity and superior wetting characteristics. 13 minute gel time with TETA.


800 –1,100 300 – 320 1 9.5 Low viscosity epoxy triacrylate resin that provides rapid reaction rates. Uses include high-build sealers, wear-resistant surfacing and low temperature cure applications. 2.5 minute gel time with TETA.


1,800 – 2,400 205 – 214 1 9.6 Moderate viscosity epoxy diacrylate resin with performance similar to EPON 828. Applications include flooring, grouts, adhesives, casting and encapsulation systems. 27 minute gel time with TETA.


Table 12: Typical Properties of EPON Elastomer Modified Epoxy Resins


Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPON 58005 CTBN Modified DGEBPA

3,000 – 8,000 325 – 375 11 9.0 CTBN modified BPA epoxy resin with an elastomer content of 40%. Utilized in high performance adhesives for peel strength, thermal shock resistance, toughness and fatigue resistance.


1,500 – 3,000 330 – 360 11 8.9 CTBN modified BPA epoxy resin with an elastomer content of 40%, but a slightly lower acrylonitrile level than EPON 58005. For flexibility and fatigue resistance in adhesives and composites.

EPON 58034 CTBN Modified DGENPG

40 – 80 275 – 305 10 8.4 CTBN modified HELOXY 68 with an elastomer content of 50%. Used as a low viscosity and high toughness modifier for adhesives and sealants.


50 – 200 2 850 –1,050 3 — CTBN modified solid epoxy resin with an elastomer content of 20%. Used for adhesion, thermal shock, fatigue and impact resistance in functional pipe and thick film powder coatings as well as for electrical powders.


1,000 – 5,000 195 – 210 5 9.6 CTBN modified BPA epoxy resin with an elastomer content of 5%. Provides flexibility and tack for early green strength, and also provides flow control for adhesives, prepregs and sealants.


2 at 150 °C

Table 13: Typical Properties of EPONEX™ Cycloaliphatic Resin

Product Chemical Type Viscosity at 25 °C (cP)

Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPONEX 1510 Hydrogenated DGEBPA

1,800 – 2,500 210 – 220 80 9.1 Low viscosity Cycloaliphatic Glycidyl Ether. Used to obtain epoxy performance in coatings, electronics and specialty composites where improved UV resistance is a requirement.


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Table 14: Typical Properties of EPON™ Electrical Laminating Resins


Viscosity at 25 °C (cP)

Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPON 1124-A-80 DGETBBPA 1,200 – 2,000 425 – 445 2 10.2 Acetone solution of brominated resin for flame retardant electrical laminates. Bromine content – 19.5% by weight.

EPON 1163 DGETBBPA 100 –1,200 2 380 – 410 200 3 15.4 Low melting solid epoxy with 48% by weight bromine. Softening point at 64 °C. Imparts fire retardancy in laminating, casting and molding applications.

EPON CS 373 Modified Brominated Epoxy

100 – 600 350 – 400 3 10.0 One-pack, DICY-free, brominated epoxy resin and curing agent solution supplied as 70% by weight solids in a blend of Methyl Ethyl Ketone (MEK) and Propylene Glycol Monomethyl Ether (PGME). Used for high Tg applications at 180 °C. Bromine content – 13.5 % by weight.


2 at 120 °C


Table 15: Typical Properties of EPONOL™ Ultra High Molecular Weight Resin



Viscosity at 25 °C (Gardner)

Color1 (max)

Density (lb/gal)

Comments

EPONOL 53-BH-35 DGEBPA 600 – 3,600 U - Z2 6 7.8 Ultra high molecular weight epoxy resin used for adhesives and prepreg laminates to impart flexibility and to modify flow properties of the system.


Table 16: Typical Properties of EPON and EPIKOTE™ Epoxy Resins for Composites



Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPON 9215 DGEBPA 3,000 – 5,000 187 – 207 1 9.6 For CIPP (Cured In Place Pipe) applications where long term physical integrity, durability and resistance to chemical attack is needed. Typically used with EPIKURE 9270.


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Table 17: Typical Properties of EPI-REZ™ Waterborne Epoxy Resin Dispersions



Weight per Epoxide

pH Density (lb/gal)

Comments

EPI-REZ 3510-W-60 DGEBPA Dispersion

500 – 5,000 185 – 215 2 – 5 9.0 Waterborne dispersion of a low molecular weight liquid Bisphenol A epoxy resin (EPON Resin 828 type).


4,000 –15,000 225 – 275 3 – 6 9.2 Waterborne dispersion of a semi-solid Bisphenol A epoxy resin.

EPI-REZ 3520-WY-55 DGEBPA Dispersion

7,000 –17,000 485 – 555 7 – 9 9.1 Waterborne dispersion of a semi-solid Bisphenol A epoxy resin (EPON 1001 type) with an organic co-solvent. Primarily used in coatings systems


8,000 –18,000 615 – 715 7 – 9 9.2 Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1002 type). Typically used in film and fiber adhesives and finishes, FRP, and electrical dip coatings.


7,000 –17,000 1,600 – 2,000 7–10 9.0 Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1007 type) with an organic co-solvent. Generally used in baked industrial finishes, fiber finishes/binders, and as a modifier for ambient cure systems.

EPI-REZ 3546-WH-53 DGEBPA Dispersion

1,000 –15,000 1,900 – 2,200 7–10 9.0 Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1007 type) similar to EPI-REZ 3540-WY-55 with a non HAPS co-solvent.

EPI-REZ 5003-W-55 BPA Novolac Dispersion

2,000 –15,000 195 – 215 3 – 5 9.2 Waterborne dispersion of an epoxidized Bisphenol A novolac modified epoxy resin with an average functionality of 3 (EPON SU-3 type). Promotes wetting and adhesion to a variety of fibers and enhances chemical resistance in coatings.


2,000 –15,000 480 – 560 3 – 5 9.2 Waterborne dispersion of a urethane-modified Bisphenol A epoxy resin. Provides improved chemical resistance and thermal performance for fiber finishes and industrial textile applications.


8,000 –19,000 550 – 700 7 – 9 9.0 Waterborne dispersion of a novolac modified Bisphenol A epoxy resin (EPON 1002 type) with an organic co-solvent. Used for high performance coatings where higher chemical resistance and corrosion protection are required.

EPI-REZ 6006-W-68 OCN Novolac Dispersion

500 – 2,000 230 – 270 8.5 – 9.5 9.0 Waterborne dispersion of an epoxidized o-cresylic novolac resin with an average functionality of 6. Provides high temperature stability, abrasion and chemical resistance in coatings, composites, adhesive and electronic applications.

EPI-REZ 6520-WH-53 DGEBPA Dispersion

1,000 – 6,000 500 – 600 7 – 9 8.9 New Gen™ Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1001 type) with a non HAPS co-solvent. Provides exceptional corrosion protection for metal substrates as primers, DTM and topcoats.

Table 18: Typical Properties of EPI-REZ Water Reducible Epoxy Resins



Weight per Epoxide

Color1 (max)

Density (lb/gal)

Comments

EPI-REZ WD-510 Water Red. DGEBPA

80 –120 190 – 205 2 9.6 Water dispersible Bisphenol A epoxy resin.

EPI-REZ WD-512 Water Red. DGEBPA

150 – 600 195 – 210 2 9.7 Water dispersible Bisphenol A epoxy resin.


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15

Safety, Storage and Handling

Please refer to the Material Safety Data Sheet (MSDS) for the most current Safety and Handling information. Please refer to the Momentive website for shelf life and recommended storage information.

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored or transported until the handling precautions and recommendations as stated in the MSDS for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Momentive products should be directed to your Momentive sales representative, or the nearest Momentive sales office. Information and MSDSs about non-Momentive products should be obtained from the respective manufacturer.

Packaging

Available in bulk and drum quantities.

Contact Information

For product prices, availability or order placement, call our toll-free customer service number at +1 866 443 9466.

For literature and technical assistance, visit our website at www.momentive.com/epoxy

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Momentive: The Science Behind What Lies Ahead

At Momentive, our global team is focused on delivering value by helping our customers make their products and processes better. We do this by bringing our deep technical expertise, market experience and technology portfolio to bear on their specific challenges. We are the science behind thousands of innovations that enhance both our customers’ business results…and everyday life.

Reach our Global Customer Service network at:

U.S. and Canada +1 888 443 9466 E-mail: [email protected]

Europe +800 836 43581 E-mail: [email protected]

All Others +86 21 3860 4638

Please refer to the literature code MSC-152 when contacting us.

Momentive Specialty Chemicals Inc.

World Headquarters180 East Broad Street Columbus, OH 43215-3799

© 2013 Momentive Specialty Chemicals Inc. All rights reserved. ® and ™ denote trademarks owned by or licensed to Momentive Specialty Chemicals Inc. MSC-152 8/13 Printed in U.S.A.

The information provided herein was believed by Momentive Specialty Chemicals (“Momentive”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Momentive are subject to Momentive’s terms and conditions of sale. MOMENTIVE MAKES NO WARRANTy, ExPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITy OR FITNESS THEREOF FOR ANy PURPOSE OR CONCERNING THE ACCURACy OF ANy INFORMATION PROVIDED By MOMENTIVE, except that the product shall conform to Momentive’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

MSC_152 22.08.13 17:55

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