epd assignment

8/6/2019 EPD Assignment

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Submitted by,

Robin Thomas(s7 A)[33]Pranoy T. Jose(s7 A)[29]

Rejo George Varghese(S7 A)[30]

Nithin Alex John(S7 A)[26]


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IC PACKAGING

o Semiconductor industry manufactures large variety of Integrated

circuits with different packaging requirements.

o Package attributes taken into consideration when choosing a package

type for a particular semiconductor device include:

size,

lead count,

power dissipation,

field operating conditions &

cost.


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ROLES OF IC PACKAGING

o Two Primary and Fundamental functions :

1) the IC package protects the die from physical damage

2) redistributes the I/O to a more manageable pitch in assembly

o Number of potential secondary roles :

1) providing a structure more amenable to standardization

2) providing a thermal path away from the die

3) providing protection from the potential of soft errors due to alpha

particles

4)providing a structure more easily disposed to electrical test and

burn-in

o The IC package has several roles to play as keeper of the chip


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o package can also serve to interconnect multiple IC :

1)directly to each other using standard interconnectiontechnologies, such as wire bonding

2) indirectly using interconnection pathways provided on the

package, such as those used in hybrid packages and MCMs


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CLASSIFICATION

o broadly separated and defined by their basic construction :

1) lead frame-type packages

2) substrate-type packages

a) organic-laminate

b) ceramic-base materials

o There is now package product family concerned with the assembly of ICs

on the wafer called wafer-level packaging (WLP

) -packaging elements

typically are constructed on the face of the wafer, resulting in a true chip-

size package.


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o depending on next level of interconnection :

1) lead frame and the dual in-line package (DIP), are designed for

either pin-in-hole solder assembly

2) pin-grid array (PGA), are designed for socketing

3) compliant-lead-type lead frame packages are designed for surface

mounting

Eg: quad flat pack (QFP),

the leadless-type lead frame package,

quad flat no-lead (QFN) package

o QFP and QFN are representatives of peripherally leaded packages


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Area Array Packages

o ADV : handle high I/O without sacrificing performance & natural area

conservancy

E.g.: Ball grid array

(BGA)

made using organic

laminate substrates


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TYPES OF IC PACKAGING

1) Ceramic Ball Grid Array :square-shaped or rectangular ceramicpackage that uses solder balls for external electrical connection

instead of leads. These solder balls are arranged in a grid or array at

the bottom of the ceramic package body, hence the name 'ceramic

ball grid array

2) Ceramic Column Grid Array :CCGA, is a square-shaped orrectangular ceramic package that uses solder columns for external

electrical connection instead of leads or solder balls. These solder

columns are arranged in a grid or array at the bottom of the ceramic

package body, hence the name 'ceramic column grid array' .

3) Ceramic Dual-in-Line Package :It is a rectangular ceramicpackage that has leads extending from both of its longer sides, thus

forming two sets of in-line pins.

4) Ceramic Package : is a hermetically sealed rectangular ceramicpackage that has leads extending from both of its longer sides, thus

forming two sets of in-line pins


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5) Ceramic Leadless Chip Carrier :is a square or rectangular

surface-mount ceramic package that has no leads

6) Ceramic Pin Grid Array :CPGA, is a square or rectangularthrough-hole ceramic package whose pins or leads are

arranged in a square array at the bottom of the package body.

7) Ceramic Quad Flat Pack :CQFP, is a ceramic IC package

with leads extending from all four sides of the package body.

8) Dual Flat No Leads Package: a very small square-shaped or

rectangular surface-mount plastic package with no leads. Metal

pads or lands along two sides of the bottom of the DFN

package serve as electrical connection points to the outside

world . The DFN is similar to the QFN, except that the latter

has lands all around the periphery of the package instead of

just two sides like the DFN.

9)Decawatt Package :C package developed by Motorola to

encase discrete high-power devices. The DPAK is also known

as the 'TO-252'


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10) Power Quad Flat No Leads Package :PQFN, is a small square-shaped orrectangular surface-mount plastic package with no leads that is capable of high

power dissipation. Instead of leads, it uses metal pads around the periphery of

the bottom of the package body for electrical connection to the outside world. It

is basically a 'high-power' version of the quad flat no leads (QFN) package.

11) Plastic Pin Grid Array :PPGA, is a square-shaped plastic package whose

pins or leads are arranged in a square array at the bottom of the package body.

12) Plastic Leaded Chip Carrier : PLCC is a four-sided plastic package that

has "J" leads around its periphery. These "J" leads occupy less board space thanthe gull-wing leads that other packages have.

13) Plastic Dual-in-Line Package : it is rectangular in shape and has leadsextending from both sides along its length, thus forming two sets of in-line pins.


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14) Plastic Quad Flat Pack :is an IC package with leads extending

from all four sides of the package body. PQFP's are predominantly

square in shape, although rectangular variants do exist.

15) Power Small Outline Package : is a rectangular small outline

IC package developed by Amkor that integrates a copper heat slug in

its plastic body. The die is attached to this heat slug, increasing the

chip's ability to dissipate heat and thus handle more power.

16) Quad Flat No Leads Package :QFN, is a very small square-

shaped or rectangular surface-mount plastic package with no leads. It

is basically a quad flat package, except for the absence of leads

protruding from its sides. Metal pads or lands around the periphery of

the bottom of the QFN package serve as electrical connection points

to the outside world. Because the QFN has no leads and has shorter

bond wire lengths, it exhibits less inductance than leaded packages

and therefore provides a higher electrical performance.


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PCB DESIGN


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Printed Circuit Boards are primarily an insulating

material used as base, into which conductive

strips are printed

The base material is generally fiberglass, and theconductive connections are generally copper and

are made through an etching process

The main PCB board is called the motherboard,

the smaller attachment PCB boards are called

daughter boards or daughter cards

PCB BOARD


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PCB BOARD DESIGN

PCB board design defines the electrical pathways

between components

It is derived from a schematic representation ofthe circuit

When it is derived, or imported from a schematic

design, it translates the schematic symbols and

libraries into physical components and

connections


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MANUFACTURING PROCESS

Step 1: Film Generation

The film is generated from

the design files (gerber files)which are sent to the

manufacturing house.

Step 2: Raw Material

Industry standard 0.059thick, copper clad panel

is generated per layer


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S

tep 3: Drill HolesUsing NC machines and

carbide drills to drill holes

according to the drill specifications

sent to the manufacturing house

Step 4: Electroless

Copper

Apply thin copper deposit in

hole barrels


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Step 5: Apply Image

Apply photosensitive dry film

to panel and use a light

source and the film to

expose the panel

Step 6: Pattern Plate

Electrochemical process tobuild copper in the holes and

on the trace areas. Apply tin to

surface


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Step 7: Strip and EtchRemove the dryfilm, and then

etch the exposed copper.

The tin protects the copper

circuitry from being etched away

Step 8: Solder Mask

Apply a solder mask area to the

entire board with the

exception of solder pads


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Step 9: Solder Coat

Apply solder to pads by

immersing into tank of

solder. Hot air knives level

the solder when removed from thetank

Step 10: Nomenclature

Apply white letter markingsusing screen printing

process


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PCB DESIGN LAYERS

A PCB design package allows the

designer to

define and design on multiple layersMany of these are physical layers

such as:

Signal Layer

Power plane Layer Mechanical Layer

And some are special layers such as:

Solder & Paste Mask Layers

Silkscreen or Top Overlay Layers

Drill guides Keep-out Layer

And some CAD specific display-

only layers:

Ratsnest layer

DRC Errors


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GROUNDING AND BYPASSING

Providing good grounding is critical to the functionalityof a PCB board

On a multi layer board, one of the layers should be dedicated

ground and all ground signals should have ways into this

ground plane.

Avoid chaining grounds in order to prevent ground loops

from occurring

Use bypass capacitors to smooth out power spikes by

components that suddenly draw significant current

Bypass caps should be placed as close to thecomponents power pins as possible


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MANUFACTURING DETAILS

Internal layers should be designed at least 15away from the edge of the PCB board.

This is to ensure that the manufacturer of the

board does not cut into the copper or short the

planes.You can employ the keepout layer for this

purpose.

Each manufacturing house has their own

manufacturing guidelines for minimum space

width, copper-to-edge distance, via and hole sizes,annular ring, etc.

Many assembly houses require that you provide

your PCB boards in a panelized format.


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COMPONENT PLACEMENT

Component placement is an extremely importantfunction of the designer

Components should be placed according to their

connections to other components, thermal

considerations, mechanical requirements, as well as

signal integrity and routability

Components which have connections to each

other should be placed in the same vicinity

Components should also be placed on a grid,

usually a 100 mil grid, in order to provide for asymmetric flow of routing where tracks and

components are lined up


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CABLES

AND CONNECTORS


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They are the link between the device and the

power that makes the mechanism run . Most

transmit signals between electrical

equipments. The type of signals transmitted

is based on what type of cable is being used. Different types of cables are:

Twisted wire cables

Coaxial cables

Optical fibre

CABLES


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Twisted pair cable

STP - Twisted pair copper, protected from external

electromagnetic interference by a metal sheath

UTP - Twisted pair copper with no shield

Available in two varieties of wire:

StrandedSolid


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Coaxial cable

High-capacity used for video and communication

networks

Provides higher bandwidth than twisted pair cable

Contains a single wire at the center, (stranded or

solid) surrounded by a metallic shield that servesas a ground

Thin and thick coaxial cables use baseband

transmission.

Thin coaxial cable has a maximum segmentlength of

185 meters

Thick coaxial cable has a maximum segment

length of 500

meters.


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Commonly used as the backbone media when

implementing a large LAN

Can accommodate data transmissions much faster

than coaxial or twisted pair cable Transmission rates in the Gigabits-per-second

range

Laser transmitters send the modulated light pulses

and optical receivers receive them

Two types of optic fibre cables are single :Single mode-intercity telephone trunks and video

applications.

Multimode-uses a large no: of modes

used in LANs and WANs

Fibre optic cable


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Cable connectors are audio and visual

connectors used to carry audio and/or video

signals. These signals are either digital or

analog. Cables and connectors are necessaryto unite outputs and inputs, and the quality

of the signal varies with each connector.

CONNECTORS


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BNC connector

British Naval Connector (or

Bayonet Neil-Concelman)

Commonly used to connect

coaxial cable to NICs, hubs andother network devices

Connector is crimped on the

cable using a bayonet mount


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Designed to replace serial and

parallel ports

Allows up to 127 devices to be

daisy-chained using one USB port

Offers a bandwidth of

1.5MB/sec

Devices are hot swappable

Uses a type A socket (4-pins)

Network adapters using USBconnections are becoming

common

Universal serial bus(USB)


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Two types of connectors:DB-9 (9-pin) - Usually COM1

DB-25 (25-pin) - Usually COM2

Usually two serial ports are found on PCs:

one DB-9 and one DB-25 (some only have2 DB-9)

Traditionally based on Recommended

Standard-232 (RS-232)

Standard cable limit is 50 feet

SERIAL PORTS


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PS/2 connectors

A computer mini-socket and plug

used to connect a keyboard and a

mouse to a computer

Consists of a 6-pin circular

connector


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Computer sockets that connect printers or any

other parallel device, such as removable disks

and tapes backup devices, to a computers

Built into the computer motherboard

Some manufacturers sell network adapters that

can be connected to a parallel port Now enhanced using IEEE 1284 standard,

providing bi-directional transfers and increased

speeds, and it defines a cable type that allows

data transfers up to 32 feet on a parallel cable

Uses a DB-25 connector on the computer end,and a Centronics 36-pin connector at the

printer

PARALLEL PORTS


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SMALL COMPUTER SYSTEM INTERFACE

Allows up to 15 devices to be daisy-

chained using one SCSI controller

The last device in a SCSI daisy-chain

must have aS

CS

I terminator Three types of external SCSI connectors:

25-pin (SCSI-1) 4 Mbps, DB-25 (8-bit

bus)

50-pin (SCSI-2) 4 Mbps, supports

multiple chained devices, Centronics 50(8-bit bus)

68-pin (SCSI-3) 40 Mbps, Ultra Wide

SCSI, Centronics 68 (16-bit bus)


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THANK YOU

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