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    Thermal conductivityFrom Wikipedia, the free encyclopedia

    In physics, thermal conductivity, (or denoted ), is the property of a material's ability to conductheat. It appears primarily in Fourier's Law for heat conduction.

    Heat transfer across materials of high thermal conductivity occurs at a higher rate than across materialsof low thermal conductivity. Correspondingly materials of high thermal conductivity are widely used in

    heat sink applications and materials of low thermal conductivity are used as thermal insulation. Thermalconductivity of materials is temperature dependent. The reciprocal of thermal conductivity is thermalresistivity.

    Contents

    1 Units of thermal conductivity

    2 Measurement 3 Experimental values 4 Definitions

    4.1 Conductance 4.2 Resistance

    4.3 Transmittance 5 Influencing factors

    5.1 Temperature

    5.2 Material phase 5.3 Material structure 5.4 Electrical conductivity

    5.5 Convection 6 Physical origins

    6.1 Lattice waves 6.2 Electronic thermal conductivity

    7 Equations

    8 See also 9 References

    10 Further reading

    Units of thermal conductivityIn the International System of Units (SI), thermal conductivity is measured in watts per meter kelvin (W/

    (mK)) or Wm1

    K1

    .

    In the imperial system of measurement thermal conductivity is measured in Btu/(hrftF) where 1 Btu/

    (hrftF) = 1.730735 W/(mK).[1]

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    Experimental values of thermal conductivity.

    ther units which are closely related to the thermal conductivity are in common use in the construction

    and textile industries. The construction industry makes use of units such as the R- alue (resistancevalue) and the U- alue (thermal transmittance). lthough related to the thermal conductivity of aproduct R and U-values are dependent on the thickness of a product.

    Likewise the textile industry has several units including the Tog and the Clo which express thermalresistance of a material in a way analogous to the R-values used in the construction industry.

    ote: R- alues and U- alues quoted in the US (based on the imperial units of measurement) do notcorrespond with and are not compatible with those used in Europe (based on the SI units ofmeasurement).

    Measurement

    Main article: Thermal conductivity measurement

    There are a number of ways to measure thermal conductivity. Each of these is suitable for a limitedrange of materials, depending on the thermal properties and the medium temperature. There is adistinction between steady-state and transient techniques.

    In general, steady-state techniques are useful when the temperature of the material does not change withtime. This makes the signal analysis straightforward (steady state implies constant signals). The

    disadvantage is that a well-engineered experimental setup is usually needed. The Divided Bar (varioustypes) is the most common device used for consolidated rock samples.

    The transient techniques perform a measurement during the process of heating up. Their advantage is

    quicker measurements. Transient methods are usually carried out by needle probes. method describedby ngstrom involves rapidly cycling the temperature from hot to cold and back and measuring the

    temperature change as the heat propagates along a thin strip of material in a vacuum.

    erimental values

    Main

    article:List of

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    thermal conductivities

    Thermal conductivity is important in material science, research, electronics, building insulation andrelated fields, especially where high operating temperatures are achieved. However, materials used insuch trades are rarely sub ected to chemical purity standards. Several materials are shown in the list of

    thermal conductivities. These should be considered approximate due to the uncertainties related tomaterial definitions.

    n the one hand solutions for computer cooling or turbine blades usually use high thermal conductivematerials such as silver, copper and aluminium, to cool down specific components. n the other hand inconstruction or furnaces low thermal conductive materials such as polystyrene and alumina are used to

    separate warm / hot parts from cold ones.

    efinitions

    The reciprocal of thermal conductivity is thermal resistivity, usually measured in kelvin-meters per watt

    (KmW1). When dealing with a known amount of material, its thermal conductance and the reciprocal

    property, thermal resistance, can be described. Unfortunately, there are differing definitions for theseterms.

    Conductance

    For general scientific use, thermal conductance is the quantity of heat that passes in unit time through aplate ofparticular area and thickness when its opposite faces differ in temperature by one kelvin. For a

    plate of thermal conductivity k, areaA and thicknessL this is kA/L, measured in WK1 (equivalent to:

    W/ C). Thermal conductivity and conductance are analogous to electrical conductivity ( m1

    1

    ) and

    electrical conductance ( 1).

    There is also a measure known as heat transfer coefficient: the quantity of heat that passes in unit timethrough unit area of a plate of particular thickness when its opposite faces differ in temperature by one

    kelvin. The reciprocal is thermal insulance. In summary:

    thermal conductance = kA/L, measured in WK1

    thermal resistance =L /(kA), measured in KW1 (equivalent to: C/W)

    heat transfer coefficient= k/L, measured in WK1m2

    thermal insulance =L /k, measured in Km W1.

    The heat transfer coefficient is also known as thermal admittance

    esistance

    Main article: Thermal resistance

    It is a thermal-property of a material to resist the flow of heat.

    It is a resistance offered by a material (a metal in general and a heat sink material in particular) to theconduction or flow of heat through it.

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    Thermal resistance is the reciprocal of thermal conductance, i.e., lowering its value will raise the heat

    conduction and vice versa.

    When thermal resistances occur in series, they are additive. So when heat flows through twocomponents each with a resistance of 1 C/W, the total resistance is 2 C/W.

    common engineering design problem involves the selection of an appropriate si ed heat sink for a

    given heat source. Working in units of thermal resistance greatly simplifies the design calculation. Thefollowing formula can be used to estimate the performance:

    where:

    Rhs is the maximum thermal resistance of the heat sink to ambient, in C/W (equivalent to K/W)

    is the temperature difference (temperature drop), in C Pth is the thermal power (heat flow), in watts

    Rs is the thermal resistance of the heat source, in C/W

    For example, if a component produces 100 W of heat, and has a thermal resistance of 0.5 C/W, what is

    the maximum thermal resistance of the heat sink Suppose the maximum temperature is 125 C, and theambient temperature is 25 C then the is 100 C. The heat sink's thermal resistance to ambient

    must then be 0.5 C/W or less.

    Transmittance

    third term, thermal transmittance, incorporates the thermal conductance of a structure along with heattransfer due to convection and radiation. It is measured in the same units as thermal conductance and is

    sometimes known as the composite thermal conductance. The term U-value is another synonym.

    nfluencin factors

    Tem erature

    The effect of temperature on thermal conductivity is different for metals and nonmetals. In metalsconductivity is primarily due to free electrons. Following Wiedemann Fran law thermal conductivity

    of metals is approximately proportional to the absolute temperature (in Kelvin) times electricalconductivity. In pure metals the electrical resistivity often increases proportional to temperature and thus

    thermal conductivity stays approximately constant. In alloys the change in electrical conductivity isusually smaller and thus thermal conductivity increases with temperature, often proportional totemperature.

    n the other hand conductivity in nonmetals is mainly due to lattice vibrations (phonons). Except forhigh quality crystals at low temperatures, the phonon mean free path of phonons is not reducedsignificantly at higher temperatures. Thus the thermal conductivity of nonmetals is approximately

    constant at not too low temperatures. t low temperatures well below Debye-temperature thermalconductivity decreases ust like the heat capacity does.

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    Ceramic coatings with low thermal

    conductivities are used on exhaust

    systems to prevent heat from reaching

    sensitive components

    Material hase

    When a material undergoes a phase change from solid to liquid or from liquid to gas the thermal

    conductivity may change. n example of this would be the change in thermal conductivity that occurswhen ice (thermal conductivity of 2.18 W/(mK) at 0 C) melts into liquid water (thermal conductivityof 0.58 W/(mK) at 0 C).

    Material structure

    Pure crystalline substances can exhibit different thermal conductivities along different crystal axes, dueto differences in phonon coupling along a given crystal axis. Sapphire is a notable example of variable

    thermal conductivity based on orientation and temperature, with 35 W/(mK) along the c-axis and 32 W/

    (mK) along the a-axis.[2]

    lectrical conductivity

    In metals, thermal conductivity approximately tracks electrical conductivity according to theWiedemann-Fran law, as freely moving valence electrons transfer not only electric current but also heatenergy. However, the general correlation between electrical and thermal conductance does not hold forother materials, due to the increased importance of phonon carriers for heat in non-metals. s shown in

    the table below, highly electrically conductive silver is less thermally conductive than diamond, which isan electrical insulator.

    Convection

    ir and other gases are generally good insulators, in the absence of convection. Therefore, many

    insulating materials function simply by having a large number of gas-filled pockets which prevent large-

    scale convection. Examples of these include expanded and extruded polystyrene (popularly referred toas "styrofoam") and silica aerogel. atural, biological insulators such as fur and feathers achieve similareffects by dramatically inhibiting convection of air or water near an animal's skin.

    Light gases, such as hydrogen and helium typically have high

    thermal conductivity. Dense gases such as xenon anddichlorodifluoromethane have low thermal conductivity. n

    exception, sulfur hexafluoride, a dense gas, has a relatively highthermal conductivity due to its high heat capacity. rgon, a gasdenser than air, is often used in insulated gla ing (double paned

    windows) to improve their insulation characteristics.

    hysical ori ins

    Heat flux is exceedingly difficult to control and isolate in alaboratory setting. Thus at the atomic level, there are no simple,correct expressions for thermal conductivity. tomically, the

    thermal conductivity of a system is determined by how atomscomposing the system interact. There are two different approaches for calculating the thermal

    conductivity of a system.

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