February © 2015

From Technologies to Market

Emerging Non-Volatile Memory

(NVM) 2018

SAMPLE

From Technologiesto Market

Cover source: Getty Images

© 2018

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Biography & contact

ABOUT THE AUTHORS

Simone Bertolazzi, Ph.D.

Simone is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division.He is member of the Yole’s memory team and he contributes on a day-to-day basis to the analysis of nonvolatile memorytechnologies, their related materials and fabrication processes.

Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developednovel flash memory device based on heterostructures of 2D materials and high-κ dielectrics.

Contact: bertolazzi@yole.fr

Yann de Charentenay

Yann de Charentenay works as a Technology & Market Senior Analyst for Yole Développement (Yole). As part of theSemiconductor division, Yann is strongly involved in the technology & market analysis of the applications of disruptivetechnologies and components: memory, MEMS and sensors... Yann is daily contributing to the development of Yole’s activitieswith a dedicated collection of market & technology reports as well as custom consulting projects.

Prior his mission at Yole, Yann was engaged as a marketing engineer at the Commissariat à l’Energie Atomique (CEA, France)as well as a consultant at Algoe (France). He has spoken in numerous international conferences and has authored or co-authored numerous press articles.

Yann graduated from the University of Compiegne (France) with a master degree in innovation management. He is alsograduated from INP Phelma (Grenoble, France) with a master degree in materials science.

Contact: decharentenay@yole.fr

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4DS, A*STAR, Adesto, Aeroflex, Apple, Atmel, Avalanche, Buffalo, Canon, CEA Leti, Cisco, CNE, Crocus, Crossbar, Cypress, Dell,

EBay, EMC, Evaderis, Everspin, Facebook, Ferroelectric Memory Company, Freescale, Fujitsu, Fusion IO, Fujian Jinhua Integrated

Circuit Co., Ltd, Gemalto, Giesecke & Devrient, GigaDevice, GlobalFoundries, Google, Hefei Chang Xin, H-Grace, Hikstor, HLMC,

Honeywell, HP, Huawei, IBM, Imec, Infineon, Intermolecular, Innovative Silicon, Intel, ITRI, Lenovo, Macronix, Materion, Maxim,

Mediatek, Microchip, Micron-Elpida, Morpho, Mythic, Nantero, Nanya, National Tsing Hua University, NEC, NetApp, Nike, Nokia,

Numonyx, NXP, Oberthur, Panasonic, Qualcomm, Quantum, Rambus - Unity, Reliance, Renesas, Samsung, Sandisk, Seagate, SGI,

Sino King Technology, SK Hynix, Smart Modular Technologies, SMIC, Sony, Spansion, Spin Memory, Spreadtrum, STMicroelectronics,

Stanford University, STEC, Sun, Syntiant, TDK, Tezzaron, TMS, Tohoku University, TEL, TEL Magnetic Solutions, Teledyne e2v, Toshiba,

Towerjazz, TPSCO, Tsinghua Unigroup , TSMC, UMC, Violin Memory, Weebit, Western Digital, Winbond, XFab, XMC, Yangtze River

Storage Technologies, new Chinese emerging NVM players and more.

COMPANIES CITED IN THIS REPORT

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TABLE OF CONTENTS

Executive summary

Standard memory market introduction

Market and technology overview

• NAND

• DRAM

• NVDIMM

• Niche stand-alone memory

• Embedded MCU/SoC memory

Memory market players overview

China memory landscape

Emerging NVM overview

Emerging NVM applications

Market segments

• Industrial, Transportation & Consumer Electronics

Applications

• Enterprise Storage SCM Applications

• Client SCM Applications

• Mass Storage NAND Applications

• Embedded NVM in Microcontrollers (MCUs)

• Embedded Cache Memory in Mobile Devices

• Embedded Cache Memory in High-End Processors

• Embedded NVM for Artificial Intelligence

13

44

54

86

95

100

127

138

MRAM/STT-MRAM technology, forecast, and players

• Technology description, roadmap, time to market/application,

forecast by application, key players, key products, main trends

RRAM technology, forecast, and players

• Technology description, roadmap, time to market/application,

forecast by application, key players, key products, main trends

PCM technology, forecast, and players

• Technology description, roadmap, time to market/application,

forecast by application, key players, key products, main trends

Other emerging NVM

General conclusions

Noteworthy news 2017-2018

Yole Développement’s presentation

190

215

242

263

270

280

286

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MARKET RESEARCH – SCOPE AND METHODOLOGY

Market research scope:

o This report surveys emerging non-volatile memory technologies, their applications and markets.

o An introduction to standard memory, flash NAND, DRAM, NVDIMMs is given in order to provide an overall analysis ofmemory technology & market trends

o The market study focuses on the following emerging non-volatile technologies: (STT-)MRAM, RRAM and PCM.

o We have not included memory types that are in early research phase, i.e. zero capacitor (ZRAM), quantum dot RAM andpolymer printed memory, as we believe these are unlikely to be widely commercialized before 2023.

o We did not include FRAM in our market study. Although conventional FRAM has currently a larger market (~$240M in2017) compared to other emerging memories, it will remain a static niche market (CAGR2017-2023≈3.7%).

o New memories could emerge in the next 5 years, such as HfO2-based FeFET and NRAM. Although promising, thesememories are still at the early stages and there is lack of certainty about their future adoption in commercial products. Dueto lack of detailed information, we could not include these technologies in our market projection study.

o Market estimates pertain to the 2017 – 2023 time period and are given in USD (with $1.1 = 1€)

Methodology:

o Our research is derived from:

• Primary information sources: direct interviews with companies across the value chain (memory manufacturers, IP companies, equipment and materials suppliers, etc.)

• Secondary information sources: conferences, web sites, newsletters, etc.

o All data, graphs, tables, and calculations in this report are part of Yole Développement’s investigation.

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2017 REPORT UPDATES

New content compared to the 2016 version

Redefinition of embedded market segments, highlighting newly emerging AI applications as well as eDRAM/SRAM

replacement in mobile AP and high-end processors

Updated market forecast for phase-change memory (PCM), (STT-)MRAM, and RRAM

Updated analysis of technical trends for PCM, (STT-)MRAM, and RRAM

Updated analysis of the stand-alone and embedded memory markets

Updated analysis of China’s memory market, and a detailed list of emerging Chinese NVM players

In-depth analysis of NVDIMM technology and its market

Analysis of PCM’s development history, including the latest news on Micron and Intel’s 3D XPoint activities

Review of materials suppliers and equipment players

Analysis of 3D XPoint products, and comparison with Samsung’s Z-NAND

Examination of newly emerging technologies, including FeFET and NRAM

Updated analysis of new entrants and startup funding

Analysis of memory technologies for artificial intelligence (AI) applications

©2018 | www.yole.fr | Emerging Non-Volatile Memory - Sample

© 2018

Standard Memory Market Introduction

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SOLID-STATE STAND-ALONE MEMORY – MARKET STATUS

Stand-alone memory market revenue evolution:

• $XXB in 2015: CAGR ~ +X%

• CAGRDRAM ~ -XX%

• CAGRNAND ~ +XX%

• $XXB in 2016: CAGR ~ -X%

• CAGRDRAM ~ -XX%

• CAGRNAND ~ +XX%

• $XXB in 2017: CAGR ~ +XX%

• CAGRDRAM ~ +XX%

• CAGRNAND ~ +XX%

NAND and DRAM dominate the stand-alone memory market

achieving together more than XX% of sales.

Record DRAM sales were recorded in 2017 (~$XXB) due to high

demand from mobile products and servers which has driven tight supply and

upward price pressure on DRAM chips.

DRAM sales keep growing in 2018: expected CAGRDRAM ~ +XX%

Semiconductor Memory Market 2017

©2018 | www.yole.fr | Emerging Non-Volatile Memory - Sample

© 2018

NVDIMM Market and Technology Overview

Source: SNIA 2018

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NVDIMM –TECHNOLOGY AND MARKET

Key NVDIMM players

Expected increasing adoption of NVDIMM-N in servers

NVDIMM-N market

in 2017 ~$XX

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© 2018

Embedded MCU/SoCMemory Overview

Source: STMicroelectronics

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EMBEDDED MEMORY – MARKET SIZE

• Embedded memory is a submarket of the MCU/SoC

markets. It is generally not estimated because it is not a

stand-alone market.

o MCU memory business:

o NVM: $XXB, equal to XX% of MCU cost

o SRAM: $XXB, equal to XX% of MCU cost

o Mobile AP memory business:

o SRAM ~ $XXB, equal to XX% of AP cost

o High-performance processor memory business

o SRAM ~ $XXB, equal to XX% of CPU cost

• Total 2017 embedded memory ~ $XXB. This

represents 19% of the stand-alone memory business. In

the long-term, emerging NVM could also replace SRAM in

processor business.Yole Développement © October 2018

~ $23.7B

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© 2018

Memory Market Players Overview

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STAND-ALONE MEMORY - SUPPLY CHAIN

Key market players

Market concentration has increased over the last few years: 5 players owns XX% of the business

NAND DRAM NOR / 3D XPoint

Alliance:

Toshiba Sandisk/WD

Acquired Inotera memory from Nanya in Dec. 2016

• Samsung, Micron, SK Hynix,Toshiba and Sandisk/WD are dominating the stand-alone memory business.

• In June 2018, Toshiba completes $18B sale of its memory business to an investment group led by Bain Capital (US).

The consortium includes Apple, SK Hynix, Dell, and Seagate Technology.

3DJV IM Flash Technologies

(NAND collaboration

ending soon after 3rd generation

3D NAND development)

WD acquired Sandisk

in 2016

JV IM Flash Technologies

(3D XPoint collaboration

ending soon after 2nd generation

XPoint development)

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NAND MEMORY – MAIN MARKET PLAYERS

• A highly-concentrated market dominated by Samsung (~XX%) followed by the Japanese-US alliance of Toshiba and Sandisk (the latter

was acquired by Western Digital in 2016) with a market share of ~XX%. SK Hynix is the next in the line together with Micron.

2017 NAND memory players market share by revenue

Total NAND market

in 2017 ~$XXB

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DRAM MEMORY – MAIN MARKET PLAYERS

2017 DRAM memory players market share by revenue

• A highly-concentrated market (3 main players) dominated by Korean (Samsung and SK Hynix) and US (Micron) players.

• Taiwanese players (Nanya,Winbond, Powerchip) achieve an overall market share of ~XX%.

Total DRAM market

in 2017 ~$XXB

©2018 | www.yole.fr | Emerging Non-Volatile Memory - Sample

© 2018

China Memory Landscape

Source: STMicroelectronicsSource: DOIT Media Group

China’s fabs entering in production in 2019 (orange)

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CHINA MEMORY EXPANSION & EMERGING NVM PLAYERS

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© 2018

Emerging NVM Overview

Image credit: Dreamstime

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OVERVIEW OF EMERGING NVM TECHNOLOGY

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EMERGING NVM MARKET – FORECAST BY TECHNOLOGY (2017-2023)

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EMERGING NVM MARKET – FORECAST BY TECHNOLOGY (2017-2023)

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© 2018

Emerging Non-Volatile Memory Applications

Memristor for

cybersecurity

Image credit: Brian Long

University of California, Santa Barbara

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EMERGING NVM –APPLICATIONS

Emerging NVM Applications

Industry & Transportation &

consumer electronics

Enterprise Storage

Client SCMMass Storage

MemoryNVM in

MicrocontrollersCache in Mobile

DevicesCache in High-End processors

NVM for Artificial Intelligence

Industrial Automation

Journal Memory

Automotive

SCM

NAND

Memory

Smartphones

& Tablets

NVDIMM-NGeneral Purpose

Automotive

Work Station

Notebook

Smart card

Stand alone Embedded

Increasing density Increasing density

IoT

AI at the edge

Smart Meters

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EMERGING NVM –APPLICATIONS

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EMERGING NVM MARKET – FORECAST BY TECHNOLOGY (2017-2023)

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(STT-)MRAM –TECHNOLOGY AND MARKET TRENDS

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RRAM –TECHNOLOGY AND MARKET TRENDS

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PCM –TECHNOLOGY AND MARKET TRENDS

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OTHER EMERGING NVM TECHNOLOGIES

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RELATED REPORT

©2018 | www.yole.fr | Emerging Non-Volatile Memory - Sample

Ever-growing data generation driven by mobile devices, the cloud, the internet of things (IoT), and big data, as well as novel AI applications, requires continuous advancements in memory technologies. Flash NAND (non-volatile) and Dynamic Random Access Memory (DRAM - volatile) are the stand-alone workhorse options, and will maintain their leading position for another several years thanks to new technical solutions that enable further scalability. However, there exists a large speed-capacity gap between NAND and DRAM, one which must be reduced to improve overall performance of computing systems. Storage-class memory (SCM) serves precisely this purpose and has long been awaited.

Hitherto, emerging non-volatile memories (NVMs) – e.g. phase-change memory (PCM), magnetoresistive random access memory (MRAM), spin transfer torque MRAM (STT-MRAM) and resistive RAM (RRAM) – have been restricted to niche applications because of poor scalability, high cost, and a lack of support from major memory makers. In 2015, Micron and Intel presented a new SCM technology, 3D XPoint, which uses phase-change memory (PCM) materials that the companies researched for more than 15 years. The first 3D XPoint products

– OptaneTM Solid State Drives (SSDs) and storage accelerators – were introduced by Intel in 2017, and persistent-memory modules (OptaneTM Dual Inline Memory Modules (DIMMs)) are expected in 2019. Despite the coming end of the Intel-Micron joint venture (IMFT), Micron has confirmed its continuing strategic involvement with 3D XPoint by announcing its acquisition of Intel’s stake in IMFT, along with plans to introduce its own 3D XPoint products (QuantXTM) in 2019.

Over the next three years, 3D XPoint sales will grow by more than one order of magnitude thanks to Intel’s dominant position in the enterprise processor business. Optane DIMMs will be sold in combination with the latest generation of Intel’s Xeon server processors (i.e. Cascade Lake). Moreover, Intel’s new brand strategy for client systems that includes Optane caching pre-installed (Intel Core i+), will support sales growth.

Due to the rise of 3D XPoint sales, SCM is expected to be the dominant application for emerging NVMs in the coming years, reaching more than 90% of the emerging NVM market by 2019.

EMERGING NON-VOLATILE MEMORY 2018Market & Technology report - November 2018

EMERGING NVM SALES WILL GROW BY MORE THAN ONE ORDER OF MAGNITUDE IN THE NEXT THREE YEARS, THANKS TO SCM APPLICATIONS

After more than 15 years in development, PCM has finally taken off in stand-alone applications. STT-MRAM will lead the embedded memory race.

KEY FEATURES• 2017 - 2023 market forecast in units,

Gbit, $US, and number of wafers• Competitive landscape and market

dynamics• Emerging non-volatile memory

(NVM) - potential applications and market drivers

• Technology roadmap, with time-to-market

• Price evolution, by application and technology

• Technology description and main technical trends by technology, along with overview of main players, and roadmap

WHAT’S NEW•Redefinitionofembeddedmarket

segments, highlighting newly emergingartificialintelligence(AI)applications as well as eDynamic RandomAccessMemory(eDRAM)/StaticRandomAccessMemory(SRAM)replacementinmobileAPandhigh-endprocessors

• Updated market forecast for phase-change memory (PCM), spintransfertorqueMRAM(STT-MRAM)andresistiveRAM(RRAM)

• Updated analysis of technical trends forPCM,(STT-)MRAM,andRRAM

• Updated analysis of the stand-alone and embedded memory markets

• Updated analysis of China’s memory market, and a detailed list of emerging Chinese NVM players

•In-depthanalysisofNon-VolatileDualInlineMemoryModules(NVDIMM)technologyanditsmarket

•AnalysisofPCM’sdevelopmenthistory, including the latest news onMicronandIntel’s3DXPointactivities

• Review of materials suppliers and equipment players

•Analysisof3DXPointproducts,and comparison with Samsung’s Z-NAND

• Examination of newly emerging technologies, including Ferroelectric Field-Effect Transistor (FeFET) and NanotubeRAM(NRAM)

• Updated analysis of new entrants and startup funding

•Analysisofmemorytechnologiesforartificialintelligence(AI)applications

(Yole Développement, November 2018)

2017~$99M

2018~$280M

2019~$1.08B

CAGR2017-2019~230%

Embedded Non Volatile Memory - Microcontrollers (MCU)

Industrial and transportation and consumer electronics

Entreprise storage-class memory (SCM)

Client storage-class memory

Emerging non-volatile memory market – breakdown by application

In the stand-alone business, emerging NVMs will not replace DRAM and NAND but will be used in combination with them inside memory modules, e.g. SSDs, DIMMs, and NVDIMMs. In 2023, PCM

will maintain its lead in the stand-alone memory market thanks to the increasing adoption of 3D XPoint as an enterprise and client SCM. It is worth noting that Samsung and Toshiba took a different

IN THE NEXT FIVE YEARS, PCM-BASED 3D XPOINT WILL DRIVE THE STAND-ALONE EMERGING NVM MARKET, WHEREAS STT-MRAM WILL LEAD EMBEDDED TECHNOLOGY

EMERGING NON-VOLATILE MEMORY 2018

EMERGING NVM PLAYERS WILL USE “TROJAN HORSE” STRATEGIES TO INTRODUCE THEIR TECHNOLOGIES TO THE MEMORY MARKET

In the stand-alone business, emerging NVM brings new features and functionalities, but at a higher price. Thus, new solutions must be found for triggering this NVM’s market penetration. Among big IDMs, Intel has a unique position: it is both a stand-alone memory supplier and a Central Processing Unit (CPU) leader.

Intel can combine its 3D XPoint products with its new generation of Xeon processors, which will act as the aforementioned Trojan horse for introducing 3D XPoint into the data-center technology market.

STT-MRAM developers are rather small companies (e.g. Everspin, Avalanche, Spin Memory) that view memory module suppliers (Smart Modular, for example) as the ideal partner for entering the enterprise storage market. These module suppliers are midsized companies inclined to develop niche applications in the early stages.

In the embedded business, the top foundries are the key decision makers: they can promote the adoption of new embedded NVM in applications such as MCUs or cache memory. Therefore, it is critical for IP memory companies to convince foundries to develop edge-node (28/22nm) technology platforms for emerging NVM, a goal that has already been achieved by STT-MRAM players. In fact, RRAM has been adopted at 22nm by TSMC, but other foundries are hesitating to scale down to 28/22nm.

Yole Développement invites you to read our comprehensive analysis on the ecosystem and market landscape, highlighting the challenges and opportunities towards large adoption of emerging NVM.

strategic path by developing 3D NAND-based SCM solutions such as Z-NAND (Samsung) and XL-Flash (Toshiba, showcased in August 2018). However, these technologies will be used in enterprise SSDs and will not compete with DDR4-compatible Optane DIMMs, which we expect will represent more than 50% of overall 3D XPoint sales.

Resistive RAM (RRAM) was expected to be the first stand-alone technology to compete with 3D XPoint, but it has suffered repeated delays due to technical challenges. We presume that RRAM could return in the race for SCM after 2020, and possibly start competing with NAND for mass storage applications.

Spin transfer torque MRAM (STT-MRAM), thanks to its high speed and high endurance, is promising for enterprise storage SCM. However, its success will be much lower compared to stand-alone PCM due to higher costs, greater fabrication complexity, and challenging scalability.

Compared to stand alone, the embedded emerging NVM market is relatively small, representing ~3% of the emerging NVM market in 2017. The market is dominated today by RRAM, since only a few RRAM-based microcontrollers (MCUs) are available on the market. However, all top foundries are now getting ready with 28/22nm technology processes for STT-MRAM whereas RRAM adoption has been delayed by approximately two years by SMIC and UMC. Therefore, we expect that STT-MRAM will be the first to take-off in the coming years and will lead the embedded emerging NVM market, especially MCUs, which represent the most important embedded segment.

Emerging memory will first replace eFlash, which is facing major scaling challenges due to rising fabrication complexity/costs for technology nodes ≤ 28nm. The adoption of STT-MRAM as an embedded cache memory (SRAM or eDRAM) in high-end processors and mobile AP will occur later due to more strict scalability requirements (≤ 14nm).

AI on the edge is the most innovative application for embedded emerging NVM. Crossbar recently demonstrated various AI applications, i.e. face recognition, through the use of RRAM chips. We expect that such RRAM-based AI devices will enter the market after 2021.

Examples of market entry strategies for stand-aloneand embedded emerging non-volatile memory*

(Yole Développement, November 2018)

Evolution of the emerging non-volatile memory market – breakdownby technology for stand-alone and embedded memories

(Yole Développement, November 2018)

~$6.4M ~$1.1B

~$273M ~$6.1B

2018 2023

Resistive random accessmemory (RRAM)

(Spin transfer torque)magnetoresistive randomaccess memory ((STT)MRAM)

Phase-change memory (PCM)

Stand-alone

Embedded

Source: Everspin

Source: STMicroelectronics

Stand-alone chip provider Modules Systems

FlashCoreTM Module

OptaneTM DIMM

XeonTM Processor

Embedded NVM IP** provider

STT-MRAM

Enterprise-StoragePlayers

3D XPoint

IoT, general purposeand automotive MCUs***

integrators

Foundries

Bundle

* Non exhaustive list of companies **Non Volatile Memory Intellectual Property***Microcontrollers

MARKET & TECHNOLOGY REPORT

COMPANIES CITED IN THE REPORT (non exhaustive list)4DS, A*STAR, Adesto, Aeroflex, Apple, Atmel, Avalanche, Buffalo, Canon, CEA Leti, Cisco, CNE, Crocus, Crossbar, Cypress, Dell, EBay, EMC, Evaderis, Everspin, Facebook, Ferroelectric Memory Company, Freescale, Fujitsu, Fusion IO, Fujian Jinhua Integrated Circuit Co., Ltd, Gemalto, Giesecke & Devrient, GigaDevice, GlobalFoundries, Google, Hefei Chang Xin, H-Grace, Hikstor, HLMC, Honeywell, HP, Huawei, IBM, Imec, Infineon, Intermolecular, Innovative Silicon, Intel, ITRI, Lenovo, Materion, Macronix, Maxim, Mediatek, Microchip, Micron-Elpida, Morpho, Mythic, Nantero, Nanya, National Tsing Hua University, NEC, NetApp, Nike, Nokia, Numonyx, NXP, Oberthur, Panasonic, Qualcomm, Quantum, Rambus - Unity, Reliance, Renesas, Samsung, Sandisk, Seagate, SGI, Sino King Technology, SK Hynix, Smart Modular Technologies, SMIC, Sony, Spansion, Spin Memory, Spreadtrum, STMicroelectronics, Stanford University, STEC, Sun, Syntiant, TDK, Tezzaron, TMS, Tohoku University, TEL, TEL Magnetic Solutions, Teledyne e2v, Toshiba, Towerjazz, TPSCO, Tsinghua Unigroup , TSMC, UMC, Violin Memory, Weebit, Western Digital, Winbond, XFab, XMC, Yangtze River Storage Technologies, new Chinese emerging NVM players and more…

Find more details about

this report here:

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Technology Report 2017Find all our reports on www.i-micronews.com

Simone Bertolazzi, PhD is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of the Yole’s memory team and he contributes on a day-to-day basis to the analysis of nonvolatile memory technologies, their related materials and fabrication processes. He (co-) authored more than tenpapersinhigh-impactscientificjournals.Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerldand), where he investigatednovelflashmemorycellsbasedon heterostructures of 2D materials and high-k dielectrics.

AUTHORS

Executive summary 13

Standard memory market introduction 44

Market and technology overview 54> NAND > DRAM > NVDIMM> Niche stand-alone memory> Embedded MCU/SoC memory

Memory market players overview 86

China memory landscape 95

Emerging NVM overview 100

Emerging NVM applications 127

Market segments 138> Industrial, transportation & consumer> Electronics applications> Enterprise storage SCM applications> Client SCM Aapplications> Mass storage NAND applications> Embedded NVM in Microcontrollers (MCUs)> Embedded cache memory in mobile devices

> Embedded cache memory in high-end processors

> Embedded NVM for artificial intelligence

MRAM/STT-MRAM technology, forecast, and players 190

> Technology description, roadmap, time to market/application, forecast by application, key players, key products, main trends

RRAM technology, forecast, and players 215> Technology description, roadmap, time to

market/application, forecast by application, key players, key products, main trends

PCM technology, forecast, and players 242> Technology description, roadmap, time to

market/application, forecast by application, key players, key products, main trends

Other emerging NVM 263

General conclusions 270Noteworthy news 2017-2018 280Yole Développement’s presentation 286

TABLE OF CONTENTS (complete content on i-Micronews.com)

OBJECTIVES OF THE REPORTPresent an overview of the semiconductor memory market:•NAND,DRAM,NVDIMM,embeddedMCU,andmobileAP-mainmarkets,marketforecast,

and main trends• Current technological status and roadmap for the coming years• Market landscape Provide an understanding of emerging NVM applications:•Atotalofeightapplicationfields-fourforstand-aloneandfourforembedded:totaladdressable

market, market drivers and challenges, technology roadmap, players, main trends• Roadmap with time-to-market, by applicationDeliver market forecasts for emerging NVM businesses:•2017-2023marketforecastinunits,Gb,$US/Gb,andnumberofwafers• Price evolution, by application and technology•Forecastforeightapplicationsandthreetechnologies(MRAM/STT-MRAM,RRAM,PCM)Describe emerging NVM technologies:•Workingprinciple,manufacturingmethods,advantages/limitations,developmentstatus,price,

time-to-market• Roadmap with technology nodes, chip-density evolution, and main players• Latest product development status for each key market playerDetail and analyze the competitive landscape: • Recent acquisitions and funding• Latest company news• Key players, by technologies and applications

Yann de Charentenay works as a Technology & MarketSeniorAnalystforYole Développement (Yole). Yann is strongly involved in the technology & market analysis of the applications of disruptive technologies and components: memory, MEMS and sensors... Prior his mission at Yole, Yann was engaged as a marketing engineer at the Commissariat à l’Energie Atomique(CEA, France) as well as a consultant atAlgoe(France).Hehasspokeninnumerousinternational conferences and has authored or co-authored numerous press articles. Yann graduated from the University of Compiegne (France) with a master degree in innovation management. He is also graduated fromINPPhelma(Grenoble,France)withamaster degree in materials science.

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+886 979 336 809 – wang@yole.fr• Specific inquiries: +33 472 830 180 – info@yole.fr

(1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: November 15, 2018

/

ABOUT YOLE DEVELOPPEMENT

BILL TO

Name (Mr/Ms/Dr/Pr):

Job Title:

Company:

Address:

City:

State:

Postcode/Zip:

Country*:

*VAT ID Number for EU members:

Tel:

Email:

Date:

PRODUCT ORDER - Ref YD18048Please enter my order for above named report: One user license*: Euro 5,990 Multi user license: Euro 6,490- The report will be ready for delivery from December 10, 2018- For price in dollars, please use the day’s exchange rate. All reports are

delivered electronically at payment reception. For French customers, add 20% for VAT

I hereby accept Yole Développement’s Terms and Conditions of Sale(1)

Signature:

*One user license means only one person at the company can use the report.

Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and Image Sensors, Compound Semiconductors, RF Devices & Technologies, Solid-State Lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

CONSULTING AND ANALYSIS• Market data & research, marketing analysis• Technology analysis• Strategy consulting• Reverse engineering & costing• Patent analysis• Design and characterization of innovative optical systems• Financial services (due diligence, M&A with our partner)More information on www.yole.fr

MEDIA & EVENTS• i-Micronews.com website & related @Micronews e-newsletter• Communication & webcast services• Events: TechDays, forums…More information on www.i-Micronews.com

REPORTS• Market & technology reports• Patent investigation and patent infringement risk analysis• Structure, process and cost analysis• Cost simulation toolMore information on www.i-micronews.com/reports

CONTACTSFor more information about :• Consulting & Financial Services: Jean-Christophe Eloy (eloy@yole.fr)• Reports: David Jourdan (jourdan@yole.fr) Yole Group of Companies• Press Relations & Corporate Communication: Sandrine Leroy (leroy@yole.fr)

© 2018

Yole Développement

From Technologies to Market

Source: Wikimedia Commons

2©2018 | www.yole.fr | About Yole Développement

YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE

Life Sciences

& Healthcare o Microfluidic

o BioMEMS

o Inkjet Printing

o Solid-State Medical Imaging & BioPhotonics

o Bio Technologies

Power

& Wireless

o RF Devices & Technology

o Compound Semiconductors & Emerging Materials

o Power Electronics

o Batteries & Energy Management

Semiconductor

& Software o Package & Assembly & Substrates

o Semiconductor Manufacturing

o Memory

o Software & Computing

Photonics,

Sensing & Display

o Solid-State Lighting & Display

o MEMS, Sensors & Actuators

o Imaging

o Photonics & Optoelectronics

Semiconductor

& Software

Power & Wireless

Photonics,

Sensing

& Display

Life

Sciences &

Healthcare

3©2018 | www.yole.fr | About Yole Développement

4 BUSINESS MODELS

o Consulting and Analysis

• Market data & research,

marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

• Design and characterization

of innovative optical systems

• Financial services (due

diligence, M&A with our

partner)

www.yole.fr

o Syndicated reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

• Teardowns & reverse costing

analysis

• Cost simulation tool

www.i-Micronews.com/reports o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Communication & webcast

services

• Events: TechDays, forums,…

www.i-Micronews.com

o Monitors

• Monthly and/or Quarterly

update

• Excel database covering supply,

demand, and technology

• Price, market, demand and

production forecasts

• Supplier market shares

www.i-Micronews.com/reports

4©2018 | www.yole.fr | About Yole Développement

6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies

5©2018 | www.yole.fr | About Yole Développement

OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Yole Inc.

Phoenix

Yole Korea

Seoul

Palo Alto

6©2018 | www.yole.fr | About Yole Développement

ANALYSIS SERVICES - CONTENT COMPARISON

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

High

Low

7©2018 | www.yole.fr | About Yole Développement

SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plans along the entire

supply chain

Integrators, end-

users and software

developers

Device manufacturers

Suppliers: material, equipment,

OSAT, foundries…

Financial investors, R&D centers

8©2018 | www.yole.fr | About Yole Développement

SERVING MULTIPLE INDUSTRIAL FIELDS

We workacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and

consumer

electronics

Automotive

Medical

systems

Industrial

and defense

Energy

management

9©2018 | www.yole.fr | About Yole Développement

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a

collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent

investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain…

Our reports are for you!

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.

In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.

o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Bundled Offer and receive at least a 36% discount.

REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Advanced substrates

• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

• Software

• Memory

10©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (1/4)

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the MEMS Industry 2018 – Update

− Silicon Photonics 2018 – Update

− Consumer Biometrics: Hardware & Software 2018 – Update

− Inkjet Functional and Additive Manufacturing for Electronics 2018

− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Acoustic MEMS and Audio Solutions 2017

− MEMS & Sensors for Automotive Market & Technology Trends 2017

− High End Inertial Sensors 2017

− Magnetic Sensor 2017

o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

– by System Plus Consulting

− Piezo MEMS 2018 *

o PATENT ANALYSES – by KnowMade

− MEMS Microphone – Patent Landscape Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product

Mapping 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− MEMS Pressure Sensor 2018 – Market & Technology Report

− MEMS Pressure Sensor Comparison 2018 – Structure, Process & Cost Report

− Gas & Particles 2018 – Market & Technology Report

− Gas & Particles Comparison 2018 – Structure, Process & Cost Report

− LiDARs for Automotive and Industrial Applications 2018 – Market &

Technology Report

− LiDAR for Automotive 2018 – Patent Landscape Analysis

− MEMS Packaging 2017 – Market & Technology Report

− MEMS Packaging Comparison 2017 – Structure, Process & Cost Report

RF DEVICES AND TECHNOLOGIES

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Wireless technologies (Radar, V2X) for Automotive 2018

− RF Standards and Technologies for Connected Objects 2018

− RF & Photonic Components & Technologies for 5G Infrastructure 2018

o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System

Plus Consulting

− Automotive Radar Comparison 2018

o PATENT ANALYSES – by KnowMade

− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market

& Technology Report – Update

− RF Front-End Module Comparison 2018 – Structure, Process & Cost Report

− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis

− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology

Report – Update*

− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process

& Cost Report

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023

Market & Technology Report – Update

− RF GaN Comparison 2018* – Structure, Process & Cost Report

− RF GaN 2018 – Patent Landscape Analysis

SOFTWARE

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Consumer Biometrics: Sensors & Software 2018 – Update

− Processing Hardware and Software for AI 2018 - Vol. 1 & 2

− From Image Processing to Deep Learning, Introduction to Hardware and Software

Update : 2017 version still available / *To be confirmed

11©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (2/4)

IMAGING & OPTOELECTRONICS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the Compact Camera Module and Wafer Level Optics

− Industry 2018 – Update

− 3D Imaging and Sensing 2018 – Update

− Sensors for Robotic Vehicles 2018

− Machine Vision for Industry and Automation 2018

− Imagers and Detectors for Security and Smart Buildings 2018

− Uncooled Infrared Imagers 2017

o PATENT ANALYSES – by KnowMade

− iPhone X Dot Projector – Patent-to-Product Mapping

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Status of the CMOS Image Sensor Industry 2018 – Market & Technology Report -

Update

− CMOS Image Sensor Comparison 2018 – Structure, Process & Cost Report

− CMOS Image Sensors Monitor 2018* – Quarterly Update**

− Camera Module 2017 – Market & Technology Report

− Compact Camera Module Comparison 2018 – Structure, Process & Cost Report

− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology

Report

− LiDAR for Automotive 2018 – Patent Landscape Analysis

ADVANCED PACKAGING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Advanced Packaging Industry 2018 – Update

− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends

− 3D TSV and Monolithic Business Update 2018 – Update

− Power Modules Packaging 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Status of Panel Level Packaging 2018

− Trends in Automotive Packaging 2018

− Hardware and Software for AI 2018 - Vol. 1 & 2

− Thin-Film Integrated Passive Devices 2018

− Memory Packaging Market and Technology Report 2018 – Update*

o PATENT ANALYSES – by KnowMade

− Hybrid Bonding for 3D Stack – Patent Landscape Analysis

o LINKED REPORTS– by Yole Développement and System Plus Consulting

− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report -

Update*

− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process

& Cost Report

− Fan-Out Packaging 2018 – Market & Technology Report – Update*

− Fan-Out Packaging Comparison 2018* – Structure, Process & Cost Report

MANUFACTURING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Wafer Starts for More Than Moore Applications 2018

− Equipment for More than Moore: Technology & Market Trends

for Lithography & Bonding/Debonding 2018

− Polymeric Materials for wafer-level Advanced Packaging 2018

− Laser Technologies for Semiconductor Manufacturing 2017

− Glass Substrate Manufacturing in the Semiconductor Field 2017

− Equipment and Materials for Fan-Out Packaging 2017

− Equipment and Materials for 3D TSV Applications 2017

o LINKED REPORTS – by Yole Développement and System Plus Consulting

− Equipment for More than Moore: Technology & Market Trends for

Lithography & Bonding/Debonding 2018 – Market & Technology Report

− Wafer Bonding Comparison 2018 – Structure, Process & Cost Report

Update : 2017 version still available / *To be confirmed

12©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (3/4)MEMORY

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Emerging Non Volatile Memory 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update*

o QUARTERLY UPDATE – by Yole Développement**

− Memory Market Monitor 2018 (NAND & DRAM)

o MONTHLY UPDATE – by Yole Développement**

− Memory Pricing Monitor 2018 (NAND & DRAM)

o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting

− DRAM Technology & Cost Review 2018

− NAND Memory Technology & Cost Review 2018

o PATENT ANALYSES – by KnowMade

− 3D Non-Volatile Memories – Patent Landscape

COMPOUND SEMICONDUCTORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Compound Semiconductor Industry 2018*

− GaAs Materials, Devices and Applications 2018

− InP Materials, Devices and Applications 2018

− Bulk GaN Substrate Market 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Power SiC 2018: Materials, Devices, and Applications – Market & Technology

Report – Update

− SiC Transistor Comparison 2018 – Structure, Process & Cost Report

− Power SiC 2018 – Patent Landscape Analysis

− Power GaN 2018: Materials, Devices, and Applications – Market & Technology Report

– Update

− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process & Cost Report

− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023

– Market & Technology Report – Update

− RF GaN – Patent Landscape Analysis

POWER ELECTRONICS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Power Electronics Industry 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Power Electronics for Electric Vehicles 2018 – Update

− Integrated Passive Devices (IPD) 2018

− Wireless Charging Market Expectations and Technology Trends 2018

− Thermal Management Technology and Market Perspectives in Power

− Electronics and LEDs 2017

− Gate Driver 2017

− Power MOSFET 2017

− IGBT 2017

− Market Opportunities for Thermal Management Components in Smartphones 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting

and KnowMade

− Power Modules Packaging 2018 – Market & Technology Report – Update

− Automotive Power Module Packaging Comparison 2018 – Structure, Process & Cost Report

− Power ICs Market Monitor 2018 – Quarterly Update**

− Power ICs Market Comparison 2018* – Structure, Process & Cost Report

BATTERY AND ENERGY MANAGEMENT

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –Update

o PATENT ANALYSES – by KnowMade

− Status of the Battery Patents – Patent Watch 2018 & Patent Activity 2017

o LINKED REPORTS – by Yole Développement and KnowMade

− Solid State Electrolyte Battery 2018 – Market & Technology Report

− Solid-State Batteries 2018 – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

13©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (4/4)

SOLID STATE LIGHTING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update

− Automotive Lighting 2018: Technology, Industry and Market Trends – Update

− UV LEDs 2018: Technology, Industry and Market Trends – Update

− LiFi: Technology, Industry and Market Trends

− LED Lighting Module Technology, Industry and Market Trends 2017

− CSP LED Lighting Modules

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− Horticultural Lighting 2017

o LINKED REPORTS – by Yole Développement and System Plus Consulting

− VCSELs 2018: Technology, Industry and Market Trends – Market & Technology

Report

− VCSELs Comparison 2018 – Structure, Process & Cost Report

DISPLAYS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update

− Displays and Optical Vision Systems for VR/AR/MR 2018

− MicroLED Displays 2018 – Market & Technology Report – Update

o PATENT ANALYSES – by KnowMade

− MicroLED Display – Patent Landscape Analysis

MEDTECH

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical

− Applications 2018 – Update

− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update

− Neurotechnologies and Brain Computer Interface 2018

− CRISPR-Cas9 Technology: From Lab to Industries 2018

− Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018

− Inkjet Functional and Additive Manufacturing for Electronics 2018

− Liquid Biopsy: from Isolation to Downstream Applications 2018

− Chinese Microfluidics Industry 2018

− Scientific Cameras for the Life Sciences & Analytical Instrumentation

Laboratory Markets 2018*

− Artificial Organ Technology and Market 2017

− Connected Medical Devices Market and Business Models 2017

− Status of the Microfluidics Industry 2017

− Organs-On-Chips 2017

− Solid-State Medical Imaging 2017

− Medical Robotics Market & Technology Analysis 2017

o PATENT ANALYSES – by KnowMade

− Microfluidic IC Cooling – Patent Landscape

− Circulating Tumor Cell Isolation – Patent Landscape

− OCT Medical Imaging – Patent Landscape

− Pumps for Microfluidic Devices – Patent Landscape 2017

− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017

− FLUIDIGM – Patent Portfolio Analysis 2017

− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Organs-On-Chips 2017 – Market & Technology Report

− Organ-on-a-Chip – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed

14©2018 | www.yole.fr | About Yole Développement

OUR 2017 PUBLISHED REPORTS LIST (3/3)

OUR PARTNERS’ REPORTS

PATENT ANALYSES – by KnowMade

− Wireless Charging Patent Landscape Analysis

− RF Acoustic Wave Filters Patent Landscape Analysis

− NMC Lithium-Ion Batteries Patent Landscape Analysis

− Pumps for Microfluidic Devices Patent Landscape

− III-N Patent Watch

− FLUIDIGM Patent Portfolio Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets

− Microfluidic Technologies for Diagnostic Applications Patent Landscape

TEARDOWN & REVERSE COSTING – by System Plus Consulting

More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017

MORE INFORMATION

o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.

o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up

to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports

automatically (multi-user format). Contact your sales team according to your location (see the last slide).

15©2018 | www.yole.fr | About Yole Développement

MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ONLINE ONSITE INPERSON

@Micronews e-newsletter

i-Micronews.com

i-Micronewsjp.com

FreeFullPDF.com

Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

for improving your

product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person. Events

are the best way to exchange

ideas with your customers,

partners, prospects while

increasing your brand/product

visibility.

Targeted audience

involvement equals clear,

concise perception of your

company’s message.

Webcasts are a smart,

innovative way of

communicating to a wider

targeted audience. Webcasts

create very useful, dynamic

reference material for

attendees and also for

absentees, thanks to the

recording technology.

Benefit from the i-Micronews.com

traffic generated by the 11,200+

monthly unique visitors, the

10,500+ weekly readers of

@Micronews e-newsletter

Several key events planned for

2018 on different topics to

attract 120 attendees on average

Gain new leads for your business

from an average of 340

registrants per webcast

Contact: Camille Veyrier (veyrier@yole.fr), Marketing & Communication Project Manager

16©2018 | www.yole.fr | About Yole Développement

CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS, REPORT

BUSINESS

• North America:

• Steve LaFerriere, Senior Sales Director for Western US &

Canada

Email: laferriere@yole.fr – + 1 310 600-8267

• Troy Blanchette, Senior Sales Director for Eastern US &

Canada

Email: troy.blanchette@yole.fr – +1 704 859-0453

• Japan & Rest of Asia:

• Takashi Onozawa, General Manager, Asia Business

Development (India & ROA)

Email: onozawa@yole.fr - +81 34405-9204

• Miho Othake, Account Manager (Japan)

Email: ohtake@yole.fr - +81 3 4405 9204

• Itsuyo Oshiba, Account Manager (Korea & Singapore)

Email: oshiba@yole.fr - +81-80-3577-3042

• Greater China: Mavis Wang, Director of Greater China Business

Development

Email: wang@yole.fr - +886 979 336 809

• Europe: Lizzie Levenez, EMEA Business Development Manager

Email: levenez@yole.fr - +49 15 123 544 182

• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement

Email eloy@yole.fr - +33 4 72 83 01 80

o FINANCIAL SERVICES (in partnership with Woodside

Capital Partners)

• Jean-Christophe Eloy, CEO & President

Email: eloy@yole.fr - +33 4 72 83 01 80

• Ivan Donaldson, VP of Financial Market Development

Email: ivan.donaldson@yole.fr - +1 208 850 3914

o CUSTOM PROJECT SERVICES

• Jérome Azémar, Technical Project Development Director

Email: azemar@yole.fr - +33 6 27 68 69 33

o GENERAL

• Sandrine Leroy, Director, Public Relations

Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55

• Email: info@yole.fr - +33 4 72 83 01 80

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