emerging non-volatile memory (nvm) 2018...4 table of contents executive summary standard memory...
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February © 2015
From Technologies to Market
Emerging Non-Volatile Memory
(NVM) 2018
SAMPLE
From Technologiesto Market
Cover source: Getty Images
© 2018
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Biography & contact
ABOUT THE AUTHORS
Simone Bertolazzi, Ph.D.
Simone is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division.He is member of the Yole’s memory team and he contributes on a day-to-day basis to the analysis of nonvolatile memorytechnologies, their related materials and fabrication processes.
Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developednovel flash memory device based on heterostructures of 2D materials and high-κ dielectrics.
Contact: [email protected]
Yann de Charentenay
Yann de Charentenay works as a Technology & Market Senior Analyst for Yole Développement (Yole). As part of theSemiconductor division, Yann is strongly involved in the technology & market analysis of the applications of disruptivetechnologies and components: memory, MEMS and sensors... Yann is daily contributing to the development of Yole’s activitieswith a dedicated collection of market & technology reports as well as custom consulting projects.
Prior his mission at Yole, Yann was engaged as a marketing engineer at the Commissariat à l’Energie Atomique (CEA, France)as well as a consultant at Algoe (France). He has spoken in numerous international conferences and has authored or co-authored numerous press articles.
Yann graduated from the University of Compiegne (France) with a master degree in innovation management. He is alsograduated from INP Phelma (Grenoble, France) with a master degree in materials science.
Contact: [email protected]
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4DS, A*STAR, Adesto, Aeroflex, Apple, Atmel, Avalanche, Buffalo, Canon, CEA Leti, Cisco, CNE, Crocus, Crossbar, Cypress, Dell,
EBay, EMC, Evaderis, Everspin, Facebook, Ferroelectric Memory Company, Freescale, Fujitsu, Fusion IO, Fujian Jinhua Integrated
Circuit Co., Ltd, Gemalto, Giesecke & Devrient, GigaDevice, GlobalFoundries, Google, Hefei Chang Xin, H-Grace, Hikstor, HLMC,
Honeywell, HP, Huawei, IBM, Imec, Infineon, Intermolecular, Innovative Silicon, Intel, ITRI, Lenovo, Macronix, Materion, Maxim,
Mediatek, Microchip, Micron-Elpida, Morpho, Mythic, Nantero, Nanya, National Tsing Hua University, NEC, NetApp, Nike, Nokia,
Numonyx, NXP, Oberthur, Panasonic, Qualcomm, Quantum, Rambus - Unity, Reliance, Renesas, Samsung, Sandisk, Seagate, SGI,
Sino King Technology, SK Hynix, Smart Modular Technologies, SMIC, Sony, Spansion, Spin Memory, Spreadtrum, STMicroelectronics,
Stanford University, STEC, Sun, Syntiant, TDK, Tezzaron, TMS, Tohoku University, TEL, TEL Magnetic Solutions, Teledyne e2v, Toshiba,
Towerjazz, TPSCO, Tsinghua Unigroup , TSMC, UMC, Violin Memory, Weebit, Western Digital, Winbond, XFab, XMC, Yangtze River
Storage Technologies, new Chinese emerging NVM players and more.
COMPANIES CITED IN THIS REPORT
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TABLE OF CONTENTS
Executive summary
Standard memory market introduction
Market and technology overview
• NAND
• DRAM
• NVDIMM
• Niche stand-alone memory
• Embedded MCU/SoC memory
Memory market players overview
China memory landscape
Emerging NVM overview
Emerging NVM applications
Market segments
• Industrial, Transportation & Consumer Electronics
Applications
• Enterprise Storage SCM Applications
• Client SCM Applications
• Mass Storage NAND Applications
• Embedded NVM in Microcontrollers (MCUs)
• Embedded Cache Memory in Mobile Devices
• Embedded Cache Memory in High-End Processors
• Embedded NVM for Artificial Intelligence
13
44
54
86
95
100
127
138
MRAM/STT-MRAM technology, forecast, and players
• Technology description, roadmap, time to market/application,
forecast by application, key players, key products, main trends
RRAM technology, forecast, and players
• Technology description, roadmap, time to market/application,
forecast by application, key players, key products, main trends
PCM technology, forecast, and players
• Technology description, roadmap, time to market/application,
forecast by application, key players, key products, main trends
Other emerging NVM
General conclusions
Noteworthy news 2017-2018
Yole Développement’s presentation
190
215
242
263
270
280
286
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MARKET RESEARCH – SCOPE AND METHODOLOGY
Market research scope:
o This report surveys emerging non-volatile memory technologies, their applications and markets.
o An introduction to standard memory, flash NAND, DRAM, NVDIMMs is given in order to provide an overall analysis ofmemory technology & market trends
o The market study focuses on the following emerging non-volatile technologies: (STT-)MRAM, RRAM and PCM.
o We have not included memory types that are in early research phase, i.e. zero capacitor (ZRAM), quantum dot RAM andpolymer printed memory, as we believe these are unlikely to be widely commercialized before 2023.
o We did not include FRAM in our market study. Although conventional FRAM has currently a larger market (~$240M in2017) compared to other emerging memories, it will remain a static niche market (CAGR2017-2023≈3.7%).
o New memories could emerge in the next 5 years, such as HfO2-based FeFET and NRAM. Although promising, thesememories are still at the early stages and there is lack of certainty about their future adoption in commercial products. Dueto lack of detailed information, we could not include these technologies in our market projection study.
o Market estimates pertain to the 2017 – 2023 time period and are given in USD (with $1.1 = 1€)
Methodology:
o Our research is derived from:
• Primary information sources: direct interviews with companies across the value chain (memory manufacturers, IP companies, equipment and materials suppliers, etc.)
• Secondary information sources: conferences, web sites, newsletters, etc.
o All data, graphs, tables, and calculations in this report are part of Yole Développement’s investigation.
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2017 REPORT UPDATES
New content compared to the 2016 version
Redefinition of embedded market segments, highlighting newly emerging AI applications as well as eDRAM/SRAM
replacement in mobile AP and high-end processors
Updated market forecast for phase-change memory (PCM), (STT-)MRAM, and RRAM
Updated analysis of technical trends for PCM, (STT-)MRAM, and RRAM
Updated analysis of the stand-alone and embedded memory markets
Updated analysis of China’s memory market, and a detailed list of emerging Chinese NVM players
In-depth analysis of NVDIMM technology and its market
Analysis of PCM’s development history, including the latest news on Micron and Intel’s 3D XPoint activities
Review of materials suppliers and equipment players
Analysis of 3D XPoint products, and comparison with Samsung’s Z-NAND
Examination of newly emerging technologies, including FeFET and NRAM
Updated analysis of new entrants and startup funding
Analysis of memory technologies for artificial intelligence (AI) applications
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© 2018
Standard Memory Market Introduction
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SOLID-STATE STAND-ALONE MEMORY – MARKET STATUS
Stand-alone memory market revenue evolution:
• $XXB in 2015: CAGR ~ +X%
• CAGRDRAM ~ -XX%
• CAGRNAND ~ +XX%
• $XXB in 2016: CAGR ~ -X%
• CAGRDRAM ~ -XX%
• CAGRNAND ~ +XX%
• $XXB in 2017: CAGR ~ +XX%
• CAGRDRAM ~ +XX%
• CAGRNAND ~ +XX%
NAND and DRAM dominate the stand-alone memory market
achieving together more than XX% of sales.
Record DRAM sales were recorded in 2017 (~$XXB) due to high
demand from mobile products and servers which has driven tight supply and
upward price pressure on DRAM chips.
DRAM sales keep growing in 2018: expected CAGRDRAM ~ +XX%
Semiconductor Memory Market 2017
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© 2018
NVDIMM Market and Technology Overview
Source: SNIA 2018
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NVDIMM –TECHNOLOGY AND MARKET
Key NVDIMM players
Expected increasing adoption of NVDIMM-N in servers
NVDIMM-N market
in 2017 ~$XX
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© 2018
Embedded MCU/SoCMemory Overview
Source: STMicroelectronics
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EMBEDDED MEMORY – MARKET SIZE
• Embedded memory is a submarket of the MCU/SoC
markets. It is generally not estimated because it is not a
stand-alone market.
o MCU memory business:
o NVM: $XXB, equal to XX% of MCU cost
o SRAM: $XXB, equal to XX% of MCU cost
o Mobile AP memory business:
o SRAM ~ $XXB, equal to XX% of AP cost
o High-performance processor memory business
o SRAM ~ $XXB, equal to XX% of CPU cost
• Total 2017 embedded memory ~ $XXB. This
represents 19% of the stand-alone memory business. In
the long-term, emerging NVM could also replace SRAM in
processor business.Yole Développement © October 2018
~ $23.7B
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© 2018
Memory Market Players Overview
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STAND-ALONE MEMORY - SUPPLY CHAIN
Key market players
Market concentration has increased over the last few years: 5 players owns XX% of the business
NAND DRAM NOR / 3D XPoint
Alliance:
Toshiba Sandisk/WD
Acquired Inotera memory from Nanya in Dec. 2016
• Samsung, Micron, SK Hynix,Toshiba and Sandisk/WD are dominating the stand-alone memory business.
• In June 2018, Toshiba completes $18B sale of its memory business to an investment group led by Bain Capital (US).
The consortium includes Apple, SK Hynix, Dell, and Seagate Technology.
3DJV IM Flash Technologies
(NAND collaboration
ending soon after 3rd generation
3D NAND development)
WD acquired Sandisk
in 2016
JV IM Flash Technologies
(3D XPoint collaboration
ending soon after 2nd generation
XPoint development)
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NAND MEMORY – MAIN MARKET PLAYERS
• A highly-concentrated market dominated by Samsung (~XX%) followed by the Japanese-US alliance of Toshiba and Sandisk (the latter
was acquired by Western Digital in 2016) with a market share of ~XX%. SK Hynix is the next in the line together with Micron.
2017 NAND memory players market share by revenue
Total NAND market
in 2017 ~$XXB
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DRAM MEMORY – MAIN MARKET PLAYERS
2017 DRAM memory players market share by revenue
• A highly-concentrated market (3 main players) dominated by Korean (Samsung and SK Hynix) and US (Micron) players.
• Taiwanese players (Nanya,Winbond, Powerchip) achieve an overall market share of ~XX%.
Total DRAM market
in 2017 ~$XXB
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© 2018
China Memory Landscape
Source: STMicroelectronicsSource: DOIT Media Group
China’s fabs entering in production in 2019 (orange)
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CHINA MEMORY EXPANSION & EMERGING NVM PLAYERS
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© 2018
Emerging NVM Overview
Image credit: Dreamstime
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OVERVIEW OF EMERGING NVM TECHNOLOGY
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EMERGING NVM MARKET – FORECAST BY TECHNOLOGY (2017-2023)
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EMERGING NVM MARKET – FORECAST BY TECHNOLOGY (2017-2023)
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© 2018
Emerging Non-Volatile Memory Applications
Memristor for
cybersecurity
Image credit: Brian Long
University of California, Santa Barbara
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EMERGING NVM –APPLICATIONS
Emerging NVM Applications
Industry & Transportation &
consumer electronics
Enterprise Storage
Client SCMMass Storage
MemoryNVM in
MicrocontrollersCache in Mobile
DevicesCache in High-End processors
NVM for Artificial Intelligence
Industrial Automation
Journal Memory
Automotive
SCM
NAND
Memory
Smartphones
& Tablets
NVDIMM-NGeneral Purpose
Automotive
Work Station
Notebook
Smart card
Stand alone Embedded
Increasing density Increasing density
IoT
AI at the edge
Smart Meters
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EMERGING NVM –APPLICATIONS
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EMERGING NVM MARKET – FORECAST BY TECHNOLOGY (2017-2023)
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(STT-)MRAM –TECHNOLOGY AND MARKET TRENDS
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RRAM –TECHNOLOGY AND MARKET TRENDS
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PCM –TECHNOLOGY AND MARKET TRENDS
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OTHER EMERGING NVM TECHNOLOGIES
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RELATED REPORT
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Ever-growing data generation driven by mobile devices, the cloud, the internet of things (IoT), and big data, as well as novel AI applications, requires continuous advancements in memory technologies. Flash NAND (non-volatile) and Dynamic Random Access Memory (DRAM - volatile) are the stand-alone workhorse options, and will maintain their leading position for another several years thanks to new technical solutions that enable further scalability. However, there exists a large speed-capacity gap between NAND and DRAM, one which must be reduced to improve overall performance of computing systems. Storage-class memory (SCM) serves precisely this purpose and has long been awaited.
Hitherto, emerging non-volatile memories (NVMs) – e.g. phase-change memory (PCM), magnetoresistive random access memory (MRAM), spin transfer torque MRAM (STT-MRAM) and resistive RAM (RRAM) – have been restricted to niche applications because of poor scalability, high cost, and a lack of support from major memory makers. In 2015, Micron and Intel presented a new SCM technology, 3D XPoint, which uses phase-change memory (PCM) materials that the companies researched for more than 15 years. The first 3D XPoint products
– OptaneTM Solid State Drives (SSDs) and storage accelerators – were introduced by Intel in 2017, and persistent-memory modules (OptaneTM Dual Inline Memory Modules (DIMMs)) are expected in 2019. Despite the coming end of the Intel-Micron joint venture (IMFT), Micron has confirmed its continuing strategic involvement with 3D XPoint by announcing its acquisition of Intel’s stake in IMFT, along with plans to introduce its own 3D XPoint products (QuantXTM) in 2019.
Over the next three years, 3D XPoint sales will grow by more than one order of magnitude thanks to Intel’s dominant position in the enterprise processor business. Optane DIMMs will be sold in combination with the latest generation of Intel’s Xeon server processors (i.e. Cascade Lake). Moreover, Intel’s new brand strategy for client systems that includes Optane caching pre-installed (Intel Core i+), will support sales growth.
Due to the rise of 3D XPoint sales, SCM is expected to be the dominant application for emerging NVMs in the coming years, reaching more than 90% of the emerging NVM market by 2019.
EMERGING NON-VOLATILE MEMORY 2018Market & Technology report - November 2018
EMERGING NVM SALES WILL GROW BY MORE THAN ONE ORDER OF MAGNITUDE IN THE NEXT THREE YEARS, THANKS TO SCM APPLICATIONS
After more than 15 years in development, PCM has finally taken off in stand-alone applications. STT-MRAM will lead the embedded memory race.
KEY FEATURES• 2017 - 2023 market forecast in units,
Gbit, $US, and number of wafers• Competitive landscape and market
dynamics• Emerging non-volatile memory
(NVM) - potential applications and market drivers
• Technology roadmap, with time-to-market
• Price evolution, by application and technology
• Technology description and main technical trends by technology, along with overview of main players, and roadmap
WHAT’S NEW•Redefinitionofembeddedmarket
segments, highlighting newly emergingartificialintelligence(AI)applications as well as eDynamic RandomAccessMemory(eDRAM)/StaticRandomAccessMemory(SRAM)replacementinmobileAPandhigh-endprocessors
• Updated market forecast for phase-change memory (PCM), spintransfertorqueMRAM(STT-MRAM)andresistiveRAM(RRAM)
• Updated analysis of technical trends forPCM,(STT-)MRAM,andRRAM
• Updated analysis of the stand-alone and embedded memory markets
• Updated analysis of China’s memory market, and a detailed list of emerging Chinese NVM players
•In-depthanalysisofNon-VolatileDualInlineMemoryModules(NVDIMM)technologyanditsmarket
•AnalysisofPCM’sdevelopmenthistory, including the latest news onMicronandIntel’s3DXPointactivities
• Review of materials suppliers and equipment players
•Analysisof3DXPointproducts,and comparison with Samsung’s Z-NAND
• Examination of newly emerging technologies, including Ferroelectric Field-Effect Transistor (FeFET) and NanotubeRAM(NRAM)
• Updated analysis of new entrants and startup funding
•Analysisofmemorytechnologiesforartificialintelligence(AI)applications
(Yole Développement, November 2018)
2017~$99M
2018~$280M
2019~$1.08B
CAGR2017-2019~230%
Embedded Non Volatile Memory - Microcontrollers (MCU)
Industrial and transportation and consumer electronics
Entreprise storage-class memory (SCM)
Client storage-class memory
Emerging non-volatile memory market – breakdown by application
In the stand-alone business, emerging NVMs will not replace DRAM and NAND but will be used in combination with them inside memory modules, e.g. SSDs, DIMMs, and NVDIMMs. In 2023, PCM
will maintain its lead in the stand-alone memory market thanks to the increasing adoption of 3D XPoint as an enterprise and client SCM. It is worth noting that Samsung and Toshiba took a different
IN THE NEXT FIVE YEARS, PCM-BASED 3D XPOINT WILL DRIVE THE STAND-ALONE EMERGING NVM MARKET, WHEREAS STT-MRAM WILL LEAD EMBEDDED TECHNOLOGY
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EMERGING NON-VOLATILE MEMORY 2018
EMERGING NVM PLAYERS WILL USE “TROJAN HORSE” STRATEGIES TO INTRODUCE THEIR TECHNOLOGIES TO THE MEMORY MARKET
In the stand-alone business, emerging NVM brings new features and functionalities, but at a higher price. Thus, new solutions must be found for triggering this NVM’s market penetration. Among big IDMs, Intel has a unique position: it is both a stand-alone memory supplier and a Central Processing Unit (CPU) leader.
Intel can combine its 3D XPoint products with its new generation of Xeon processors, which will act as the aforementioned Trojan horse for introducing 3D XPoint into the data-center technology market.
STT-MRAM developers are rather small companies (e.g. Everspin, Avalanche, Spin Memory) that view memory module suppliers (Smart Modular, for example) as the ideal partner for entering the enterprise storage market. These module suppliers are midsized companies inclined to develop niche applications in the early stages.
In the embedded business, the top foundries are the key decision makers: they can promote the adoption of new embedded NVM in applications such as MCUs or cache memory. Therefore, it is critical for IP memory companies to convince foundries to develop edge-node (28/22nm) technology platforms for emerging NVM, a goal that has already been achieved by STT-MRAM players. In fact, RRAM has been adopted at 22nm by TSMC, but other foundries are hesitating to scale down to 28/22nm.
Yole Développement invites you to read our comprehensive analysis on the ecosystem and market landscape, highlighting the challenges and opportunities towards large adoption of emerging NVM.
strategic path by developing 3D NAND-based SCM solutions such as Z-NAND (Samsung) and XL-Flash (Toshiba, showcased in August 2018). However, these technologies will be used in enterprise SSDs and will not compete with DDR4-compatible Optane DIMMs, which we expect will represent more than 50% of overall 3D XPoint sales.
Resistive RAM (RRAM) was expected to be the first stand-alone technology to compete with 3D XPoint, but it has suffered repeated delays due to technical challenges. We presume that RRAM could return in the race for SCM after 2020, and possibly start competing with NAND for mass storage applications.
Spin transfer torque MRAM (STT-MRAM), thanks to its high speed and high endurance, is promising for enterprise storage SCM. However, its success will be much lower compared to stand-alone PCM due to higher costs, greater fabrication complexity, and challenging scalability.
Compared to stand alone, the embedded emerging NVM market is relatively small, representing ~3% of the emerging NVM market in 2017. The market is dominated today by RRAM, since only a few RRAM-based microcontrollers (MCUs) are available on the market. However, all top foundries are now getting ready with 28/22nm technology processes for STT-MRAM whereas RRAM adoption has been delayed by approximately two years by SMIC and UMC. Therefore, we expect that STT-MRAM will be the first to take-off in the coming years and will lead the embedded emerging NVM market, especially MCUs, which represent the most important embedded segment.
Emerging memory will first replace eFlash, which is facing major scaling challenges due to rising fabrication complexity/costs for technology nodes ≤ 28nm. The adoption of STT-MRAM as an embedded cache memory (SRAM or eDRAM) in high-end processors and mobile AP will occur later due to more strict scalability requirements (≤ 14nm).
AI on the edge is the most innovative application for embedded emerging NVM. Crossbar recently demonstrated various AI applications, i.e. face recognition, through the use of RRAM chips. We expect that such RRAM-based AI devices will enter the market after 2021.
Examples of market entry strategies for stand-aloneand embedded emerging non-volatile memory*
(Yole Développement, November 2018)
Evolution of the emerging non-volatile memory market – breakdownby technology for stand-alone and embedded memories
(Yole Développement, November 2018)
~$6.4M ~$1.1B
~$273M ~$6.1B
2018 2023
Resistive random accessmemory (RRAM)
(Spin transfer torque)magnetoresistive randomaccess memory ((STT)MRAM)
Phase-change memory (PCM)
Stand-alone
Embedded
Source: Everspin
Source: STMicroelectronics
Stand-alone chip provider Modules Systems
FlashCoreTM Module
OptaneTM DIMM
XeonTM Processor
Embedded NVM IP** provider
STT-MRAM
Enterprise-StoragePlayers
3D XPoint
IoT, general purposeand automotive MCUs***
integrators
Foundries
Bundle
* Non exhaustive list of companies **Non Volatile Memory Intellectual Property***Microcontrollers
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MARKET & TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)4DS, A*STAR, Adesto, Aeroflex, Apple, Atmel, Avalanche, Buffalo, Canon, CEA Leti, Cisco, CNE, Crocus, Crossbar, Cypress, Dell, EBay, EMC, Evaderis, Everspin, Facebook, Ferroelectric Memory Company, Freescale, Fujitsu, Fusion IO, Fujian Jinhua Integrated Circuit Co., Ltd, Gemalto, Giesecke & Devrient, GigaDevice, GlobalFoundries, Google, Hefei Chang Xin, H-Grace, Hikstor, HLMC, Honeywell, HP, Huawei, IBM, Imec, Infineon, Intermolecular, Innovative Silicon, Intel, ITRI, Lenovo, Materion, Macronix, Maxim, Mediatek, Microchip, Micron-Elpida, Morpho, Mythic, Nantero, Nanya, National Tsing Hua University, NEC, NetApp, Nike, Nokia, Numonyx, NXP, Oberthur, Panasonic, Qualcomm, Quantum, Rambus - Unity, Reliance, Renesas, Samsung, Sandisk, Seagate, SGI, Sino King Technology, SK Hynix, Smart Modular Technologies, SMIC, Sony, Spansion, Spin Memory, Spreadtrum, STMicroelectronics, Stanford University, STEC, Sun, Syntiant, TDK, Tezzaron, TMS, Tohoku University, TEL, TEL Magnetic Solutions, Teledyne e2v, Toshiba, Towerjazz, TPSCO, Tsinghua Unigroup , TSMC, UMC, Violin Memory, Weebit, Western Digital, Winbond, XFab, XMC, Yangtze River Storage Technologies, new Chinese emerging NVM players and more…
Find more details about
this report here:
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Technology Report 2017Find all our reports on www.i-micronews.com
Simone Bertolazzi, PhD is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of the Yole’s memory team and he contributes on a day-to-day basis to the analysis of nonvolatile memory technologies, their related materials and fabrication processes. He (co-) authored more than tenpapersinhigh-impactscientificjournals.Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerldand), where he investigatednovelflashmemorycellsbasedon heterostructures of 2D materials and high-k dielectrics.
AUTHORS
Executive summary 13
Standard memory market introduction 44
Market and technology overview 54> NAND > DRAM > NVDIMM> Niche stand-alone memory> Embedded MCU/SoC memory
Memory market players overview 86
China memory landscape 95
Emerging NVM overview 100
Emerging NVM applications 127
Market segments 138> Industrial, transportation & consumer> Electronics applications> Enterprise storage SCM applications> Client SCM Aapplications> Mass storage NAND applications> Embedded NVM in Microcontrollers (MCUs)> Embedded cache memory in mobile devices
> Embedded cache memory in high-end processors
> Embedded NVM for artificial intelligence
MRAM/STT-MRAM technology, forecast, and players 190
> Technology description, roadmap, time to market/application, forecast by application, key players, key products, main trends
RRAM technology, forecast, and players 215> Technology description, roadmap, time to
market/application, forecast by application, key players, key products, main trends
PCM technology, forecast, and players 242> Technology description, roadmap, time to
market/application, forecast by application, key players, key products, main trends
Other emerging NVM 263
General conclusions 270Noteworthy news 2017-2018 280Yole Développement’s presentation 286
TABLE OF CONTENTS (complete content on i-Micronews.com)
OBJECTIVES OF THE REPORTPresent an overview of the semiconductor memory market:•NAND,DRAM,NVDIMM,embeddedMCU,andmobileAP-mainmarkets,marketforecast,
and main trends• Current technological status and roadmap for the coming years• Market landscape Provide an understanding of emerging NVM applications:•Atotalofeightapplicationfields-fourforstand-aloneandfourforembedded:totaladdressable
market, market drivers and challenges, technology roadmap, players, main trends• Roadmap with time-to-market, by applicationDeliver market forecasts for emerging NVM businesses:•2017-2023marketforecastinunits,Gb,$US/Gb,andnumberofwafers• Price evolution, by application and technology•Forecastforeightapplicationsandthreetechnologies(MRAM/STT-MRAM,RRAM,PCM)Describe emerging NVM technologies:•Workingprinciple,manufacturingmethods,advantages/limitations,developmentstatus,price,
time-to-market• Roadmap with technology nodes, chip-density evolution, and main players• Latest product development status for each key market playerDetail and analyze the competitive landscape: • Recent acquisitions and funding• Latest company news• Key players, by technologies and applications
Yann de Charentenay works as a Technology & MarketSeniorAnalystforYole Développement (Yole). Yann is strongly involved in the technology & market analysis of the applications of disruptive technologies and components: memory, MEMS and sensors... Prior his mission at Yole, Yann was engaged as a marketing engineer at the Commissariat à l’Energie Atomique(CEA, France) as well as a consultant atAlgoe(France).Hehasspokeninnumerousinternational conferences and has authored or co-authored numerous press articles. Yann graduated from the University of Compiegne (France) with a master degree in innovation management. He is also graduated fromINPPhelma(Grenoble,France)withamaster degree in materials science.
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o PATENT ANALYSES – by KnowMade
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
& Cost Report
− Fan-Out Packaging 2018 – Market & Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process & Cost Report
MANUFACTURING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology & Market Trends
for Lithography & Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology & Market Trends for
Lithography & Bonding/Debonding 2018 – Market & Technology Report
− Wafer Bonding Comparison 2018 – Structure, Process & Cost Report
Update : 2017 version still available / *To be confirmed
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12©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (3/4)MEMORY
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND & DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND & DRAM)
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− DRAM Technology & Cost Review 2018
− NAND Memory Technology & Cost Review 2018
o PATENT ANALYSES – by KnowMade
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Power SiC 2018: Materials, Devices, and Applications – Market & Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process & Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market & Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process & Cost Report
− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market & Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market & Technology Report – Update
− Automotive Power Module Packaging Comparison 2018 – Structure, Process & Cost Report
− Power ICs Market Monitor 2018 – Quarterly Update**
− Power ICs Market Comparison 2018* – Structure, Process & Cost Report
BATTERY AND ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –Update
o PATENT ANALYSES – by KnowMade
− Status of the Battery Patents – Patent Watch 2018 & Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market & Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer
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13©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (4/4)
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market & Technology
Report
− VCSELs Comparison 2018 – Structure, Process & Cost Report
DISPLAYS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market & Technology Report – Update
o PATENT ANALYSES – by KnowMade
− MicroLED Display – Patent Landscape Analysis
MEDTECH
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences & Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market & Technology Analysis 2017
o PATENT ANALYSES – by KnowMade
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Organs-On-Chips 2017 – Market & Technology Report
− Organ-on-a-Chip – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed
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14©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN & REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).
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15©2018 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility. They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience. Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronews e-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager
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16©2018 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US &
Canada
Email: [email protected] – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US &
Canada
Email: [email protected] – +1 704 859-0453
• Japan & Rest of Asia:
• Takashi Onozawa, General Manager, Asia Business
Development (India & ROA)
Email: [email protected] - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: [email protected] - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Korea & Singapore)
Email: [email protected] - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: [email protected] - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: [email protected] - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email [email protected] - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership with Woodside
Capital Partners)
• Jean-Christophe Eloy, CEO & President
Email: [email protected] - +33 4 72 83 01 80
• Ivan Donaldson, VP of Financial Market Development
Email: [email protected] - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar, Technical Project Development Director
Email: [email protected] - +33 6 27 68 69 33
o GENERAL
• Sandrine Leroy, Director, Public Relations
Email: [email protected] - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Email: [email protected] - +33 4 72 83 01 80
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