emc1403/emc1404 1°c temperature sensor with beta...

2014 Microchip Technology Inc.

PRODUCT FEATURES

EMC1403/EMC1404

1°C Temperature Sensor with Beta Compensation

Data Sheet

General DescriptionThe EMC1403 and EMC1404 are high accuracy, low cost, System Management Bus (SMBus) temperature sensors. Advanced features such as Resistance Error Correction (REC), Beta Compensation (to support CPU diodes requiring the BJT/transistor model including 45nm, 65nm and 90nm processors) and automatic diode type detection combine to provide a robust solut ion for complex environmental monitoring applications.

Each device provides ±1° accuracy for external diode temperatures and ±2°C accuracy for the internal diode temperature. The EMC1403 monitors three temperature channels (two external and one internal). The EMC1404monitors four temperature channels (three external and one internal).

Resistance Error Correction automatically eliminates the temperature error caused by series resistance allowing greater flexibility in routing thermal diodes. Beta Compensation eliminates temperature errors caused by low, variable beta transistors common in today's fine geometry processors. The automatic beta detection feature monitors each external diode/transistor and determines the optimum sensor settings for accurate temperature measurements regardless of processor technology. This frees the user from providing unique sensor configurations for each temperature monitoring application. These advanced features plus ±1°C measurement accuracy provide a low-cost, highly flexible and accurate solution for critical temperature monitoring applications.

Applications Notebook Computers Desktop Computers Industrial Embedded applications

Features Support for diodes requiring the BJT/transistor model

— supports 45nm, 65nm, and 90nm CPU thermal diodes. Automatically determines external diode type and

optimal settings Resistance Error Correction External Temperature Monitors

— ±1°C Accuracy (60°C < TDIODE < 100°C)— 0.125°C Resolution— Anti-parallel diodes for extra diode support

Internal Temperature Monitor— ±2°C accuracy

3.3V Supply Voltage Programmable temperature limits for ALERT and

THERM Available in these RoHS Compliant Packages

— 10-pin 3mm x 3mm DFN — 10-pin MSOP— 14-pin SOIC

DS20005272A-page 1


Data Sheet

Ordering Information:EMC1403-1-AIZL-TR for 10-pin, MSOP RoHS Compliant PackageEMC1403-2-AIZL-TR for 10-pin, MSOP RoHS Compliant PackageEMC1403-3-AIZL-TR for 10-pin, MSOP RoHS Compliant PackageEMC1403-4-AIZL-TR for 10-pin, MSOP RoHS Compliant Package

EMC1403-1-AIA-TR for 10-pin, DFN RoHS Compliant PackageEMC1403-2-AIA-TR for 10-pin, DFN RoHS Compliant PackageEMC1403-3-AIA-TR for 10-pin, DFN RoHS Compliant PackageEMC1403-4-AIA-TR for 10-pin, DFN RoHS Compliant PackageEMC1403-1-YZT-TR for 14-pin, SOIC RoHS Compliant PackageEMC1403-2-YZt-TR for 14-pin, SOIC RoHS Compliant PackageEMC1403-3-YZt-TR for 14-pin, SOIC RoHS Compliant PackageEMC1403-4-YZt-TR for 14-pin, SOIC RoHS Compliant Package

EMC1404-1-AIZL-TR for 10-pin, MSOP RoHS Compliant PackageEMC1404-2-AIZL-TR for 10-pin, MSOP RoHS Compliant PackageEMC1404-3-AIZL-TR for 10-pin, MSOP RoHS Compliant PackageEMC1404-4-AIZL-TR for 10-pin, MSOP RoHS Compliant Package

Note: See Table 1.1, "Part Selection" for SMBus addressing options.REEL SIZE IS 4,000 PIECES.

This product meets the halogen maximum concentration values per IEC61249-2-21

TO OUR VALUED CUSTOMERSIt is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected]. We welcome your feedback.

Most Current Data SheetTo obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.comYou can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

ErrataAn errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur-rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revi-sion of silicon and revision of document to which it applies.To determine if an errata sheet exists for a particular device, please check with one of the following:• Microchip’s Worldwide Web site; http://www.microchip.com• Your local Microchip sales office (see last page)When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are using.

Customer Notification SystemRegister on our web site at www.microchip.com to receive the most current information on all of our products.

DS20005272A-page 2 2014 Microchip Technology Inc.

mailto:[email protected]

http://www.microchip.com



Data Sheet

Table of Contents

Chapter 1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71.1 Part Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Chapter 2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Chapter 3 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.2 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123.3 SMBus Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Chapter 4 System Management Bus Interface Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . 144.1 System Management Bus Interface Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144.2 Write Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154.3 Read Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154.4 Send Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154.5 Receive Byte. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154.6 Alert Response Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164.7 SMBus Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164.8 SMBus Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Chapter 5 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1.1 Conversion Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185.1.2 Dynamic Averaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.2 THERM Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205.3 ALERT Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.3.1 ALERT Pin Interrupt Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205.3.2 ALERT Pin Comparator Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.4 Beta Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215.5 Resistance Error Correction (REC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215.6 Programmable External Diode Ideality Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215.7 Diode Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215.8 Consecutive Alerts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225.9 Digital Filter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225.10 Temperature Monitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235.11 Temperature Measurement Results and Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245.12 Anti-parallel Diode Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255.13 External Diode Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Chapter 6 Register Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276.1 Data Read Interlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306.2 Temperature Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306.3 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 316.4 Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 316.5 Conversion Rate Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326.6 Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 336.7 Scratchpad Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 356.8 One Shot Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 356.9 Therm Limit Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 356.10 External Diode Fault Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

2014 Microchip Technology Inc. DS20005272A-page 3


Data Sheet

6.11 Channel Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366.12 Consecutive ALERT Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376.13 Beta Configuration Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386.14 External Diode Ideality Factor Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396.15 High Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 416.16 Low Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 416.17 THERM Limit Status Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 426.18 Filter Control Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 426.19 Product ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436.20 Microchip ID Register (FEh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436.21 Revision Register (FFh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Chapter 7 Typical Operating Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Chapter 8 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 478.1 Package Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

8.1.1 EMC1404-X-AIZL (10-pin MSOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 518.1.2 EMC1403-X-AIZL (10-pin MSOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 518.1.3 EMC1403-1-AIA and EMC1403-2-AIA (10-pin DFN). . . . . . . . . . . . . . . . . . . . . . . . . . . . 518.1.4 EMC1403-YZT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Chapter 9 Data Sheet Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52



Data Sheet


List of FiguresFigure 1.1 EMC1403/EMC1404 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 2.1 EMC1403/EMC1404 Pin Diagram, MSOP-10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 2.2 EMC1403/EMC1404 Pin Diagram, DFN-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 2.3 EMC1403/EMC1404 Pin Diagram, SOIC-14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 4.1 SMBus Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Figure 5.1 System Diagram for EMC1403 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 5.2 System Diagram for EMC1404 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 5.3 Temperature Filter Step Response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Figure 5.4 Temperature Filter Impulse Response. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Figure 5.5 Block Diagram of Temperature Monitoring Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Figure 5.6 Diode Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Figure 8.1 10-Pin MSOP / TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47Figure 8.2 10-Pin DFN Package Drawing (1 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48Figure 8.3 10-Pin DFN Package Dimensions (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Figure 8.4 Package Drawing and PCB Footprint for SOIC-14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50


Data Sheet


List of TablesTable 1.1 Part Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Table 2.1 EMC1403 and EMC1404 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Table 3.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Table 3.2 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Table 3.3 SMBus Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Table 4.1 Protocol Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Table 4.2 Write Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Table 4.3 Read Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Table 4.4 Send Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Table 4.5 Receive Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Table 4.6 Alert Response Address Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Table 5.1 Supply Current vs. Conversion Rate for EMC1403 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Table 5.2 Supply Current vs. Conversion Rate for EMC1404 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Table 5.3 Temperature Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Table 6.1 Register Set in Hexadecimal Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Table 6.2 Temperature Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Table 6.3 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Table 6.4 Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Table 6.5 Conversion Rate Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Table 6.6 Conversion Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Table 6.7 Temperature Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Table 6.8 Scratchpad Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Table 6.9 One Shot Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Table 6.10 Therm Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Table 6.11 External Diode Fault Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Table 6.12 Channel Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Table 6.13 Consecutive ALERT Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Table 6.14 Consecutive Alert / THERM Settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Table 6.15 Beta Configuration Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Table 6.16 CPU Beta Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39Table 6.17 Ideality Configuration Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39Table 6.18 Ideality Factor Look-Up Table (Diode Model) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40Table 6.19 Substrate Diode Ideality Factor Look-Up Table (BJT Model) . . . . . . . . . . . . . . . . . . . . . . . . . 40Table 6.20 High Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Table 6.21 Low Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Table 6.22 THERM Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Table 6.23 Filter Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Table 6.24 Filter Settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Table 6.25 Product ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Table 6.26 Manufacturer ID Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Table 6.27 Revision Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44Table 9.1 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52


Data Sheet

Chapter 1 Block Diagram

Figure 1.1 EMC1403/EMC1404 Block Diagram

1.1 Part SelectionThe EMC1403 and EMC1404 device configuration is highlighted below.

Table 1.1 Part Selection

PARTNUMBER

SMBUSADDRESS

FUNCTIONALITY

PRODUCTID

EXTERNALDIODES

DIODE 1DEFAULT

CONFIGURATION

DIODE 2DEFAULT

CONFIGURATION OTHER

EMC1403 - 1 - AIZL 1001_100xb

2 Detect Diode w/ REC enabled

Detect Diode w/ REC enabled

Software program-mable and mas-kable High Limits

Software program-mable THERM

Limits

21h

EMC1403 - 2 - AIZL 1001_101xb

EMC1403 - 3 - AIZL 0011_000xb

EMC1403 - 4 - AIZL 0101_001xb



Data Sheet

Note 1.1 External 2 and external 3 channels have beta configuration hard wired to ‘0111b’ and REC enabled.

EMC1403 - 1 - AIA 1001_100xb





Limits

21h

EMC1403 - 2 - AIA 1001_101xb

EMC1403 - 3 - AIA 0011_000xb

EMC1403 - 4 - AIA 0101_001xb

EMC1403 - 1 - YZT 1001_100xb





Limits

21h

EMC1403 - 2 - YZT 1001_101xb

EMC1403 - 3 - YZT 0011_000xb

EMC1403 - 4 - YZT 0101_001xb

EMC1404 - 1 1001_100xb


Fixed 2N3904 in anti-parallel diode configu-

ration Note 1.1



Limits

25hEMC1404 - 2 1001_101xb

EMC1404 - 3 0011_000xb

EMC1404 - 4 0101_001xb

Table 1.1 Part Selection (continued)

PARTNUMBER

SMBUSADDRESS

FUNCTIONALITY

PRODUCTID

EXTERNALDIODES

DIODE 1DEFAULT

CONFIGURATION

DIODE 2DEFAULT

CONFIGURATION OTHER



Data Sheet

Chapter 2 Pin Description

Figure 2.1 EMC1403/EMC1404 Pin Diagram, MSOP-10

Figure 2.2 EMC1403/EMC1404 Pin Diagram, DFN-10

Figure 2.3 EMC1403/EMC1404 Pin Diagram, SOIC-14



Data Sheet

APPLICATION NOTE: For the 5V tolerant pins that have a pull-up resistor (SMCLK, SMDATA, THERM, and ALERT), the voltage difference between VDD and the pull-up voltage must never exceed 3.6V.

The pin types are described below:

Power - these pins are used to supply either VDD or GND to the device.

AIO - Analog Input / Output.

DI - Digital Input.

OD - Open Drain Digital Output.

DIOD - Digital Input / Open Drain Output.

Table 2.1 EMC1403 and EMC1404 Pin Description

PIN NUMBER

10-PIN

PIN NUMBER

14-PIN NAME FUNCTION TYPE

n/a 1 n/c Not Internally Connected n/a

1 2 VDD Power supply Power

2 3 DP1 External diode 1 positive (anode) connection

AIO

3 4 DN1 External diode 1 negative (cathode) connection

AIO

4 5DP2 / DN3 External diode 2 positive (anode)

connection / External Diode 3 negative (cathode) connection for anti-parallel diodes

AIO

5 6DN2 / DP3 External diode 2 negative (cathode)

connection / External Diode 3 positive (anode) connection for anti-parallel diodes

AIO



6 9 GND Ground Power

7 10 THERM Critical THERM output signal - requires pull-up resistor

OD (5V)

8 11 ALERT Active low digital ALERT output signal - requires pull-up resistor

OD (5V)

9 12 SMDATA SMBus Data input/output - requires pull-up resistor

DIOD (5V)

10 13 SMCLK SMBus Clock input - requires pull-up resistor

DI (5V)


DFN Bottom

Padn/a

Exposed Pad Not Internally Connected, recommend grounding.

n/a



Data Sheet

Chapter 3 Electrical Specifications

3.1 Absolute Maximum Ratings

Note: Stresses at or above those listed could cause permanent damage to the device. This is a stress rating only and functional operation of the device at any other condition above those indicated in the operation sections of this specification is not implied. When powering this device from laboratory or system power supplies, it is important that the Absolute Maximum Ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when the AC power is switched on or off. In addition, voltage transients on the AC power line may appear on the DC output. If this possibility exists, it is suggested that a clamp circuit be used.

Note 3.1 For the 5V tolerant pins that have a pull-up resistor (SMCLK, SMDATA, THERM, and ALERT), the pull-up voltage must not exceed 3.6V when the device is unpowered.

Table 3.1 Absolute Maximum Ratings

DESCRIPTION RATING UNIT

Supply Voltage (VDD) -0.3 to 4.0 V

Voltage on 5V tolerant pins (V5VT_pin) -0.3 to 5.5 V

Voltage on 5V tolerant pins (|V5VT_pin - VDD|) (see Note 3.1) -0.3 to 3.6 V

Voltage on any other pin to Ground -0.3 to VDD +0.3 V

Operating Temperature Range -40 to +125 °C

Storage Temperature Range -55 to +150 °C

Lead Temperature Range Refer to JEDEC Spec. J-STD-020

Package Thermal Characteristics for MSOP-10

Thermal Resistance (j-a) 132.2 °C/W

Package Thermal Characteristics for SOIC-14


Package Thermal Characteristics for DFN-10


ESD Rating, All pins HBM 2000 V



Data Sheet

3.2 Electrical Specifications

Table 3.2 Electrical Specifications

VDD = 3.0V to 3.6V, TA = -40°C to 125°C, all typical values at TA = 27°C unless otherwise noted.

CHARACTERISTIC SYMBOL MIN TYP MAX UNITS CONDITIONS

DC Power

Supply Voltage VDD 3.0 3.3 3.6 V

Supply Current IDD 430 850 uA 1 conversion / sec, dynamic averaging disabled

930 1200 uA 4 conversions / sec, dynamic averaging enabled

1120 uA > 16 conversions / sec, dynamic averaging enabled

Standby Supply Current IDD 170 230 uA Device in Standby mode, no SMBus communications, ALERT and THERM pins not asserted.

Internal Temperature Monitor

Temperature Accuracy ±0.25 ±1 °C -5°C < TA < 100°C

±2 °C -40°C < TA < 125°C

Temperature Resolution 0.125 °C

External Temperature Monitor

Temperature Accuracy ±0.25 ±1 °C +20°C < TDIODE < +110°C 0°C < TA < 100°C

±0.5 ±2 °C -40°C < TDIODE < 127°C

Temperature Resolution 0.125 °C

tCONV 190 ms EMC1403, default settings

tCONV 150 ms EMC1404, default settings

Capacitive Filter CFILTER 2.2 2.5 nF Connected across external diode

ALERT and THERM pins

Output Low Voltage VOL 0.4 V ISINK = 8mA

Leakage Current ILEAK ±5 uA ALERT and THERM pinsDevice powered or unpoweredTA < 85°Cpull-up voltage < 3.6V



Data Sheet

3.3 SMBus Electrical Characteristics

Table 3.3 SMBus Electrical Specifications

VDD = 3.0V to 3.6V, TA = -40°C to 125°C, all typical values are at TA = 27°C unless otherwise noted.

CHARACTERISTIC SYMBOL MIN TYP MAX UNITS CONDITIONS

SMBus Interface

Input High Voltage VIH 2.0 VDD V 5V Tolerant

Input Low Voltage VIL -0.3 0.8 V 5V Tolerant

Input High/Low Current IIH / IIL ±5 uA Powered or unpoweredTA < 85°C

Hysteresis 420 mV

Input Capacitance CIN 5 pF

Output Low Sink Current IOL 8.2 15 mA SMDATA = 0.4V

SMBus Timing

Clock Frequency fSMB 10 400 kHz

Spike Suppression tSP 50 ns

Bus free time Start to Stop

tBUF 1.3 us

Hold Time: Start tHD:STA 0.6 us

Setup Time: Start tSU:STA 0.6 us

Setup Time: Stop tSU:STP 0.6 us

Data Hold Time tHD:DAT 0 us When transmitting to the master

Data Hold Time tHD:DAT 0.3 us When receiving from the master

Data Setup Time tSU:DAT 100 ns

Clock Low Period tLOW 1.3 us

Clock High Period tHIGH 0.6 us

Clock/Data Fall time tFALL 300 ns Min = 20+0.1CLOAD ns

Clock/Data Rise time tRISE 300 ns Min = 20+0.1CLOAD ns

Capacitive Load CLOAD 400 pF per bus line



Data Sheet

Chapter 4 System Management Bus Interface Protocol

4.1 System Management Bus Interface ProtocolThe EMC1403 and EMC1404 communicate with a host controller, such as an SIO, through the SMBus. The SMBus is a two-wire serial communication protocol between a computer host and its peripheral devices. A detailed timing diagram is shown in Figure 4.1.

For the first 15ms after power-up the device may not respond to SMBus communications. .

The EMC1403 and EMC1404 are SMBus 2.0 compatible and support Send Byte, Read Byte, Write Byte, Receive Byte, and the Alert Response Address as valid protocols as shown below.

All of the below protocols use the convention in Table 4.1.

Attempting to communicate with the EMC1403 and EMC1404 SMBus interface with an invalid slave address or invalid protocol will result in no response from the device and will not affect its register contents. Stretching of the SMCLK signal is supported, provided other devices on the SMBus control the timing.

Figure 4.1 SMBus Timing Diagram

Table 4.1 Protocol Format

DATA SENT TO DEVICE

DATA SENT TO THE HOST

# of bits sent # of bits sent



Data Sheet

4.2 Write ByteThe Write Byte is used to write one byte of data to the registers as shown below Table 4.2:

4.3 Read ByteThe Read Byte protocol is used to read one byte of data from the registers as shown in Table 4.3.

4.4 Send ByteThe Send Byte protocol is used to set the internal address register pointer to the correct address location. No data is transferred during the Send Byte protocol as shown in Table 4.4.

4.5 Receive ByteThe Receive Byte protocol is used to read data from a register when the internal register address pointer is known to be at the right location (e.g. set via Send Byte). This is used for consecutive reads of the same register as shown in Table 4.5.

Table 4.2 Write Byte Protocol

STARTSLAVE

ADDRESS WR ACKREGISTER ADDRESS ACK

REGISTER DATA ACK STOP

1 -> 0 1001_100 0 0 XXh 0 XXh 0 0 -> 1

Table 4.3 Read Byte Protocol

START SLAVE ADDRESS

WR ACK REGISTER ADDRESS

ACK START SLAVE ADDRESS

RD ACK REGISTER DATA

NACK STOP

1 -> 0 1001_100 0 1 XXh 0 1 -> 0 1001_100 1 1 XX 1 0 -> 1

Table 4.4 Send Byte Protocol

STARTSLAVE

ADDRESS WR ACKREGISTER ADDRESS ACK STOP

1 -> 0 1001_100 0 0 XXh 0 0 -> 1

Table 4.5 Receive Byte Protocol

STARTSLAVE

ADDRESS RD ACK REGISTER DATA NACK STOP

1 -> 0 1001_100 1 0 XXh 1 0 -> 1



Data Sheet

4.6 Alert Response AddressThe ALERT output can be used as a processor interrupt or as an SMBus Alert.

When it detects that the ALERT pin is asserted, the host will send the Alert Response Address (ARA) to the general address of 0001_100xb. All devices with active interrupts will respond with their client address as shown in Table 4.6.

The EMC1403 and EMC1404 will respond to the ARA in the following way:

1. Send Slave Address and verify that full slave address was sent (i.e. the SMBus communication from the device was not prematurely stopped due to a bus contention event).

2. Set the MASK bit to clear the ALERT pin.

APPLICATION NOTE: The ARA does not clear the Status Register and if the MASK bit is cleared prior to the Status Register being cleared, the ALERT pin will be reasserted.

4.7 SMBus AddressThe EMC1403 and EMC1404 respond to hard-wired SMBus slave address as shown in Table 1.1.

Note: Other addresses are available. Contact Microchip for more information.

4.8 SMBus TimeoutThe EMC1403 and EMC1404 support SMBus Timeout. If the clock line is held low for longer than 30ms, the device will reset its SMBus protocol. This function can be enabled by setting the TIMEOUT bit in the Consecutive Alert Register (see Section 6.12).

Table 4.6 Alert Response Address Protocol

START

ALERT RESPONSE ADDRESS RD ACK

DEVICE ADDRESS NACK STOP

1 -> 0 0001_100 1 0 1001_1000 1 0 -> 1



Data Sheet

Chapter 5 Product Description

The EMC1403 and EMC1404 are SMBus temperature sensors. The EMC1403 monitors one internal diode and two externally connected temperature diodes. The EMC1404 monitors one internal diode and three externally connected temperature diodes.

Thermal management is performed in cooperation with a host device. This consists of the host reading the temperature data of both the external and internal temperature diodes of the EMC1403 and EMC1404 and using that data to control the speed of one or more fans.

The EMC1403 and EMC1404 have two levels of monitoring. The first provides a maskable ALERTsignal to the host when the measured temperatures exceeds user programmable limits. This allows the EMC1403 or EMC1404 to be used as an independent thermal watchdog to warn the host of temperature hot spots without direct control by the host. The second level of monitoring provides a non maskable interrupt on the THERM pin if the measured temperatures meet or exceed a second programmable limit.

Since the EMC1403 and EMC1404 automatically correct for temperature errors due to series resistance in temperature diode lines, there is greater flexibility in where external diodes are positioned and better measurement accuracy than previously available with non-resistance error correcting devices. The automatic beta detection feature means that there is no need to program the device according to which type of diode is present on the External Diode 1 channel. This also includes CPU diodes that require the transistor or BJT model for monitoring their temperature. Therefore, the EMC1403/EMC1404 can power up ready to operate for any system configuration.

For the EMC1404, External Diode channels 2 and 3 are only compatible with general purpose diodes (such as a 2N3904).

Figure 5.1 shows a system level block diagram of the EMC1403. Figure 5.2 shows a system level block diagram of the EMC1404.

Figure 5.1 System Diagram for EMC1403



Data Sheet

5.1 Modes of OperationThe EMC1403 and EMC1404 have two modes of operation.

Active (Run) - In this mode of operation, the ADC is converting on all temperature channels at the programmed conversion rate. The temperature data is updated at the end of every conversion and the limits are checked. In Active mode, writing to the one-shot register will do nothing.

Standby (Stop) - In this mode of operation, the majority of circuitry is powered down to reduce supply current. The temperature data is not updated and the limits are not checked. In this mode of operation, the SMBus is fully active and the part will return requested data. Writing to the one-shot register will enable the device to update all temperature channels. Once all the channels are updated, the device will return to the Standby mode.

5.1.1 Conversion RatesThe EMC1403 and EMC1404 may be configured for different conversion rates based on the system requirements. The conversion rate is configured as described in Section 6.5. The default conversion rate is 4 conversions per second. Other available conversion rates are shown in Table 6.6.

5.1.2 Dynamic AveragingDynamic averaging causes the EMC1403 and EMC1404 to measure the external diode channels for an extended time based on the selected conversion rate. This functionality can be disabled for increased power savings at the lower conversion rates (see Section 6.4). When dynamic averaging is enabled, the device will automatically adjust the sampling and measurement time for the external diode channels. This allows the device to average 2x or 16x longer than the normal 11 bit operation (nominally 21ms per channel) while still maintaining the selected conversion rate. The benefits of dynamic averaging are improved noise rejection due to the longer integration time as well as less random variation of the temperature measurement.

When enabled, the dynamic averaging applies when a one-shot command is issued. The device will perform the desired averaging during the one-shot operation according to the selected conversion rate.

When enabled, the dynamic averaging will affect the average supply current based on the chosen conversion rate as shown in Table 5.1 for EMC1403.

Figure 5.2 System Diagram for EMC1404



Data Sheet

When enabled, the dynamic averaging will affect the average supply current based on the chosen conversion rate as shown in Table 5.2 for EMC1404.

Table 5.1 Supply Current vs. Conversion Rate for EMC1403

CONVERSION RATE

AVERAGE SUPPLY CURRENTAVERAGING FACTOR (BASED ON

11-BIT OPERATION)

ENABLED(DEFAULT) DISABLED

ENABLED(DEFAULT) DISABLED

1 / 16 sec 660uA 430uA 16x 1x

1 / 8 sec 660uA 430uA 16x 1x

1 / 4 sec 660uA 430uA 16x 1x

1 / 2 sec 660uA 430uA 16x 1x

1 / sec 660uA 430uA 16x 1x

2 / sec 930uA 475uA 8x 1x

4 / sec (default) 950uA 510uA 4x 1x

8 / sec 1010uA 630uA 2x 1x

16 / sec 1020uA 775uA 1x 1x

32 / sec 1050uA 1050uA 0.5x 0.5x

64 / sec 1100uA 1100uA 0.25x 0.25x

Table 5.2 Supply Current vs. Conversion Rate for EMC1404

CONVERSION RATE

AVERAGE SUPPLY CURRENTAVERAGING FACTOR (BASED ON 11-BIT

OPERATION)

ENABLED (DEFAULT) DISABLED


1 / 16 sec 660uA 430uA 16x 1x

1 / 8 sec 660uA 430uA 16x 1x

1 / 4 sec 660uA 430uA 16x 1x

1 / 2 sec 660uA 430uA 16x 1x

1 / sec 660uA 430uA 8x 1x

2 / sec 930uA 475uA 4x 1x

4 / sec (default) 950uA 510uA 2x 1x

8 / sec 1010uA 630uA 1x 1x

16 / sec 1020uA 775uA 0.5x 0.5x



Data Sheet

5.2 THERM OutputThe THERM output is asserted independently of the ALERT output and cannot be masked. Whenever any of the measured temperatures exceed the user programmed THERM Limit values for the programmed number of consecutive measurements, the THERM output is asserted. Once it has been asserted, it will remain asserted until all measured temperatures drop below the THERM Limit minus the THERM Hysteresis (also programmable).

When the THERM pin is asserted, the Therm status bits will likewise be set. Reading these bits will not clear them until the THERM pin is deasserted. Once the THERM pin is deasserted, the THERM status bits will be automatically cleared.

5.3 ALERT OutputThe ALERT pin is an open drain output and requires a pull-up resistor to VDD and has two modes of operation: interrupt mode and comparator Mode. The mode of the ALERT output is selected via the ALERT / COMP bit in the Configuration Register (see Section 6.4).

5.3.1 ALERT Pin Interrupt ModeWhen configured to operate in interrupt mode, the ALERT pin asserts low when an out of limit measurement (> high limit or < low limit) is detected on any diode or when a diode fault is detected. The ALERT pin will remain asserted as long as an out-of-limit condition remains. Once the out-of-limit condition has been removed, the ALERT pin will remain asserted until the appropriate status bits are cleared.

The ALERT pin can be masked by setting the MASK bit. Once the ALERT pin has been masked, it will be de-asserted and remain de-asserted until the MASK bit is cleared by the user. Any interrupt conditions that occur while the ALERT pin is masked will update the Status Register normally.

The ALERT pin is used as an interrupt signal or as an Smbus Alert signal that allows an SMBus slave to communicate an error condition to the master. One or more ALERT outputs can be hard-wired together.

5.3.2 ALERT Pin Comparator ModeWhen the ALERT pin is configured to operate in comparator mode it will be asserted if any of the measured temperatures exceeds the respective high limit. The ALERT pin will remain asserted until all temperatures drop below the corresponding high limit minus the THERM Hysteresis value.

When the ALERT pin is asserted in comparator mode, the corresponding high limit status bits will be set. Reading these bits will not clear them until the ALERT pin is deasserted. Once the ALERT pin is deasserted, the status bits will be automatically cleared.

The MASK bit will not block the ALERT pin in this mode, however the individual channel masks (see Section 6.11) will prevent the respective channel from asserting the ALERT pin.

32 / sec 1050uA 1050uA 0.25x 0.25x

64 / sec 1100uA 1100uA 0.125x 0.125x

Table 5.2 Supply Current vs. Conversion Rate for EMC1404 (continued)

CONVERSION RATE

AVERAGE SUPPLY CURRENTAVERAGING FACTOR (BASED ON 11-BIT

OPERATION)





Data Sheet

5.4 Beta CompensationThe EMC1403 and EMC1404 are configured to monitor the temperature of basic diodes (e.g. 2N3904), or CPU thermal diodes. It automatically detects the type of external diode (CPU diode or diode connected transistor) and determines the optimal setting to reduce temperature errors introduced by beta variation for the External Diode 1 channel only. Compensating for this error is also known as implementing the transistor or BJT model for temperature measurement.

For discrete transistors configured with the collector and base shorted together, the beta is generally sufficiently high such that the percent change in beta variation is very small. For example, a 10% variation in beta for two forced emitter currents with a transistor whose ideal beta is 50 would contribute approximately 0.25°C error at 100°C. However for substrate transistors where the base-emitter junction is used for temperature measurement and the collector is tied to the substrate, the proportional beta variation will cause large error. For example, a 10% variation in beta for two forced emitter currents with a transistor whose ideal beta is 0.5 would contribute approximately 8.25°C error at 100°C.

The External Diode 2 and External Diode 3 channels do not support Beta Compensation.

5.5 Resistance Error Correction (REC)Parasitic resistance in series with the external diodes will limit the accuracy obtainable from temperature measurement devices. The voltage developed across this resistance by the switching diode currents cause the temperature measurement to read higher than the true temperature. Contributors to series resistance are PCB trace resistance, on die (i.e. on the processor) metal resistance, bulk resistance in the base and emitter of the temperature transistor. Typically, the error caused by series resistance is +0.7°C per ohm. The EMC1403 and EMC1404 automatically correct up to 100 ohms of series resistance.

5.6 Programmable External Diode Ideality FactorThe EMC1403 and EMC1404 is designed for external diodes with an ideality factor of 1.008. Not all external diodes, processor or discrete, will have this exact value. This variation of the ideality factor introduces error in the temperature measurement which must be corrected for. This correction is typically done using programmable offset registers. Since an ideality factor mismatch introduces an error that is a function of temperature, this correction is only accurate within a small range of temperatures. To provide maximum flexibility to the user, the EMC1403 and EMC1404 provides a 6-bit register for each external diode where the ideality factor of the diode used is programmed to eliminate errors across all temperatures.

APPLICATION NOTE: When monitoring a substrate transistor or CPU diode and beta compensation is enabled, the Ideality Factor should not be adjusted. Beta Compensation automatically corrects for most ideality errors.

5.7 Diode FaultsThe EMC1403 and EMC1404 detect an open on the DP and DN pins, and a short across the DP and DN pins. For each temperature measurement made, the device checks for a diode fault on the external diode channel(s). When a diode fault is detected, the ALERT pin asserts (unless masked, see Section 5.8) and the temperature data reads 00h in the MSB and LSB registers (note: the low limit will not be checked). A diode fault is defined as one of the following: an open between DP and DN, a short from VDD to DP, or a short from VDD to DN.

If a short occurs across DP and DN or a short occurs from DP to GND, the low limit status bit is set and the ALERT pin asserts (unless masked). This condition is indistinguishable from a temperature measurement of 0.000degC (-64°C in extended range) resulting in temperature data of 00h in the MSB and LSB registers.

If a short from DN to GND occurs (with a diode connected), temperature measurements will continue as normal with no alerts.



Data Sheet

5.8 Consecutive AlertsThe EMC1403 and EMC1404 contain multiple consecutive alert counters. One set of counters applies to the ALERT pin and the second set of counters applies to the THERM pin. Each temperature measurement channel has a separate consecutive alert counter for each of the ALERT and THERMpins. All counters are user programmable and determine the number of consecutive measurements that a temperature channel(s) must be out-of-limit or reporting a diode fault before the corresponding pin is asserted.

See Section 6.12 for more details on the consecutive alert function.

5.9 Digital FilterTo reduce the effect of noise and temperature spikes on the reported temperature, the External Diode1 channel uses a programmable digital filter. This filter can be configured as Level 1, Level 2, or Disabled. The typical filter performance is shown in Figure 5.3 and Figure 5.4.

Figure 5.3 Temperature Filter Step Response



Data Sheet

5.10 Temperature MonitorsIn general, thermal diode temperature measurements are based on the change in forward bias voltage of a diode when operated at two different currents. This VBE is proportional to absolute temperature as shown in the following equation:

Figure 5.5 shows a block diagram of the temperature measurement circuit. The negative terminal for the remote temperature diode, DN, is internally biased with a forward diode voltage referenced to ground.

Figure 5.4 Temperature Filter Impulse Response

where:k = Boltzmann’s constantT = absolute temperature in Kelvin [1]q = electron charge = diode ideality factor



Data Sheet

5.11 Temperature Measurement Results and DataThe temperature measurement results are stored in the internal and external temperature registers. These are then compared with the values stored in the high and low limit registers. Both external and internal temperature measurements are stored in 11-bit format with the eight (8) most significant bits stored in a high byte register and the three (3) least significant bits stored in the three (3) MSB positions of the low byte register. All other bits of the low byte register are set to zero.

The EMC1403 and EMC1404 have two selectable temperature ranges. The default range is from 0°C to +127°C and the temperature is represented as binary number able to report a temperature from 0°C to +127.875°C in 0.125°C steps.

The extended range is an extended temperature range from -64°C to +191°C. The data format is a binary number offset by 64°C. The extended range is used to measure temperature diodes with a large known offset (such as AMD processor diodes) where the diode temperature plus the offset would be equivalent to a temperature higher than +127°C.

Table 5.3 shows the default and extended range formats.

Figure 5.5 Block Diagram of Temperature Monitoring Circuit

Table 5.3 Temperature Data Format

TEMPERATURE (°C) DEFAULT RANGE 0°C TO 127°C EXTENDED RANGE -64°C TO 191°C

Diode Fault 000 0000 0000 000 0000 0000

-64 000 0000 0000 000 0000 0000Note 5.2

-1 000 0000 0000 001 1111 1000

0 000 0000 0000Note 5.1

010 0000 0000

0.125 000 0000 0001 010 0000 0001

1 000 0000 1000 010 0000 1000



Data Sheet

Note 5.1 In default mode, all temperatures < 0°C will be reported as 0°C.

Note 5.2 In the extended range, all temperatures < -64°C will be reported as -64°C.

Note 5.3 For the default range, all temperatures > +127.875°C will be reported as +127.875°C.

Note 5.4 For the extended range, all temperatures > +191.875°C will be reported as +191.875°C.

5.12 Anti-parallel Diode Connections The EMC1404 supports reading two external diodes on the same set of pins (DP2, DN2). These diodes are connected as shown in Figure 5.2. Due to the anti-parallel connection of these diodes, both diodes will be reverse biased by a VBE voltage (approximately 0.7V). Because of this reverse bias, only discrete thermal diodes (such as a 2N3904) are recommended to be placed on these pins.

5.13 External Diode ConnectionsThe EMC1403 can be configured to measure a CPU substrate transistor, a discrete 2N3904 thermal diode, or an AMD processor diode. The diodes can be connected in a variety of ways as indicated in Figure 5.6.

The EMC1404 can be configured to measure a CPU substrate transistor, a discrete 2N3904 thermal diode, or an AMD processor diode on the External Diode 1 channel only. The External Diode 2 and External Diode 3 channels are configured to measure a pair of discrete anti-parallel diodes (shared on pins DP2 and DN2). The supported configurations for the external diode channels are shown in Figure 5.6.

64 010 0000 0000 100 0000 0000

65 010 0000 1000 100 0000 1000

127 011 1111 1000 101 1111 1000

127.875 011 1111 1111 101 1111 1111

128 011 1111 1111Note 5.3

110 0000 0000

190 011 1111 1111 111 1111 0000

191 011 1111 1111 111 1111 1000

>= 191.875 011 1111 1111 111 1111 1111Note 5.4

Table 5.3 Temperature Data Format (continued)

TEMPERATURE (°C) DEFAULT RANGE 0°C TO 127°C EXTENDED RANGE -64°C TO 191°C



Data Sheet

Figure 5.6 Diode Configurations



Data Sheet

Chapter 6 Register Description

The registers shown in Table 6.1 are accessible through the SMBus. An entry of ‘-’ indicates that the bit is not used and will always read ‘0’.

Table 6.1 Register Set in Hexadecimal Order

REGISTERADDRESS R/W REGISTER NAME FUNCTION

DEFAULT VALUE PAGE

00h R Internal Diode Data High Byte

Stores the integer data for the Internal Diode 00h

Page 3001h R External Diode 1

Data High ByteStores the integer data for External

Diode 1 00h

02h R Status Stores the status bits for the Internal Diode and External Diodes 00h Page 31

03h R/W ConfigurationControls the general operation of the device (mirrored at address

09h)00h Page 31

04h R/W Conversion RateControls the conversion rate for

updating temperature data (mirrored at address 0Ah)

06h(4/sec) Page 32

05h R/W Internal Diode High Limit

Stores the 8-bit high limit for the Internal Diode (mirrored at address

0Bh)

55h (85°C)

Page 33

06h R/W Internal Diode Low Limit

Stores the 8-bit low limit for the Internal Diode (mirrored at address

0Ch)

00h(0°C)

07h R/W External Diode 1 High Limit High Byte

Stores the integer portion of the high limit for External Diode 1

(mirrored at register 0Dh)

55h (85°C)

08h R/W External Diode 1 Low Limit High Byte

Stores the integer portion of the low limit for External Diode 1

(mirrored at register 0Eh)

00h(0°C)

09h R/W ConfigurationControls the general operation of the device (mirrored at address

03h)00h Page 31

0Ah R/W Conversion RateControls the conversion rate for

updating temperature data (mirrored at address 04h)

06h(4/sec) Page 32



Data Sheet

0Bh R/W Internal Diode High Limit

Stores the 8-bit high limit for the Internal Diode (mirrored at address

05h)

55h (85°C)

Page 33

0Ch R/W Internal Diode Low Limit

Stores the 8-bit low limit for the Internal Diode (mirrored at address

06h)

00h(0°C)

0Dh R/W External Diode 1 High Limit High Byte


(mirrored at register 07h)

55h (85°C)

0Eh R/W External Diode 1 Low Limit High Byte

Stores the integer portion of the low limit for External Diode 1

(mirrored at register 08h)

00h(0°C)

0Fh W One shot A write to this register initiates a one shot update. 00h Page 35

10h R External Diode 1 Data Low Byte

Stores the fractional data for External Diode 1 00h Page 30

11h R/W Scratchpad Scratchpad register for software compatibility 00h Page 35

12h R/W Scratchpad Scratchpad register for software compatibility 00h Page 35

13h R/W External Diode 1 High Limit Low Byte

Stores the fractional portion of the high limit for External Diode 1 00h

Page 3314h R/W External Diode 1 Low

Limit Low ByteStores the fractional portion of the

low limit for External Diode 1 00h

15h R/W External Diode 2 High Limit High Byte


55h(85°C)

Page 3316h R/W External DIode 2 Low

Limit High ByteStores the integer portion of the

low limit for External Diode 200h

(0°C)

17h R/W External Diode 2 High Limit Low Byte

Stores the fractional portion of the high limit External Diode 2 00h

Page 3318h R/W External Diode 2 Low

Limit Low ByteStores the fractional portion of the

low limit for External Diode 2 00h

19h R/W External Diode 1 THERM Limit

Stores the 8-bit critical temperature limit for External Diode 1

55h (85°C) Page 35

1Ah R/W External Diode 2 THERM Limit


55h(85°C) Page 35

1Bh R-C External Diode FaultStores status bits indicating which external diode detected a diode

fault00h Page 36

1Fh R/W Channel Mask Register

Controls the masking of individual channels 00h Page 36

Table 6.1 Register Set in Hexadecimal Order (continued)


DEFAULT VALUE PAGE



Data Sheet

20h R/W Internal Diode THERM Limit

Stores the 8-bit critical temperature limit for the Internal Diode

55h(85°C)

Page 3521h R/W THERM Hysteresis Stores the 8-bit hysteresis value

that applies to all THERM limits0Ah

(10°C)

22h R/W Consecutive ALERTControls the number of out-of-limit conditions that must occur before

an interrupt is asserted 70h Page 37

23h R External Diode 2 Data High Byte

Stores the integer data for External Diode 2 00h

Page 3024h R External Diode 2

Data Low ByteStores the fractional data for

External Diode 2 00h

25h R/W External Diode 1 Beta Configuration

Stores the Beta Compensation circuitry settings for External Diode

108h Page 38

26h R/W External Diode 2 Beta Configuration

Stores the Beta Compensation circuitry settings for External Diode

208h or 07h Page 38

27h R/W External Diode 1 Ideality Factor

Stores the ideality factor for External Diode 1

12h(1.008) Page 39



12h(1.008) Page 39

29h R Internal Diode Data Low Byte

Stores the fractional data for the Internal Diode 00h Page 30

2Ah R External Diode 3 High Byte

Stores the integer data for External Diode 3 00h

Page 302Bh R External Diode 3 Low

ByteStores the fractional data for

External Diode 3 00h

2Ch R/W External Diode 3 High Limit High Byte


55h (85°C)

Page 332Dh R/W External Diode 3 Low

Limit High ByteStores the integer portion of the

low limit for External Diode 300h

(0°C)

2Eh R/W External Diode 3 High Limit Low Byte

Stores the fractional portion of the high limit for External Diode 3 00h

2Fh R/W External Diode 3 Low Limit Low Byte

Stores the fractional portion of the low limit for External Diode 3 00h

30h R/W External Diode 3 THERM Limit


55h(85°C) Page 35



12h(1.008) Page 39

35h R-C High Limit Status Status bits for the High Limits 00h Page 41

36h R-C Low Limit Status Status bits for the Low Limits 00h Page 41



DEFAULT VALUE PAGE



Data Sheet

6.1 Data Read InterlockWhen any temperature channel high byte register is read, the corresponding low byte is copied into an internal ‘shadow’ register. The user is free to read the low byte at any time and be guaranteed that it will correspond to the previously read high byte. Regardless if the low byte is read or not, reading from the same high byte register again will automatically refresh this stored low byte data.

6.2 Temperature Data Registers

As shown in Table 6.2, all temperatures are stored as an 11-bit value with the high byte representing the integer value and the low byte representing the fractional value left justified to occupy the MSBits.

37h R THERM Limit Status Status bits for the THERM Limits 00h Page 42

40h R/W Filter Control Controls the digital filter setting for the External Diode 1 channel 00h Page 42

FDh R Product ID Stores a fixed value that identifies each product Table 6.25 Page 43

FEh R Microchip ID Stores a fixed value that represents Microchip 5Dh Page 43

FFh R Revision Stores a fixed value that represents the revision number 01h or 04h Page 44

Table 6.2 Temperature Data Registers

ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

00h R Internal Diode High Byte 128 64 32 16 8 4 2 1 00h

29h R Internal Diode Low Byte 0.5 0.25 0.125 - - - - - 00h

01h R External Diode 1 High Byte 128 64 32 16 8 4 2 1 00h

10h R External Diode 1 Low Byte 0.5 0.25 0.125 - - - - - 00h

23h R External Diode 2 High Byte 128 64 32 16 8 4 2 1 00h

24h R External Diode 2 Low Byte 0.5 0.25 0.125 - - - - - 00h

2Ah R External Diode 3 High Byte 128 64 32 16 8 4 2 1 00h

2Bh R External Diode 3 Low Byte 0.5 0.25 0.125 - - - - - 00h



DEFAULT VALUE PAGE



Data Sheet

A

ADDR ULT

03hh

09h

6.3 Status Register

The Status Register reports general error conditions. To identify specific channels, refer to Section 6.10, Section 6.15, Section 6.16, and Section 6.17. The individual Status Register bits are cleared when the appropriate High Limit, Low Limit, or THERM Limit register has been read or cleared.

Bit 7 - BUSY - This bit indicates that the ADC is currently converting. This bit does not cause eitherthe ALERT or THERM pins to be asserted.

Bit 4 - HIGH - This bit is set when any of the temperature channels exceeds its programmed high limit. See the High Limit Status Register for specific channel information (Section 6.15). When set, this bit will assert the ALERT pin.

Bit 3 - LOW - This bit is set when any of the temperature channels drops below its programmed low limit. See the Low Limit Status Register for specific channel information (Section 6.16). When set, this bit will assert the ALERT pin.

Bit 2 - FAULT - This bit is asserted when a diode fault is detected on any of the external diode channels. See the External Diode Fault Register for specific channel information (Section 6.10). When set, this bit will assert the ALERT pin.

Bit 1 - THERM - This bit is set when the any of the temperature channels exceeds its programmed THERM limit. See the THERM Limit Status Register for specific channel information (Section 6.17). When set, this bit will assert the THERM pin.

6.4 Configuration Register

The Configuration Register controls the basic operation of the device. This register is fully accessible at either address.

Bit 7 - MASK_ALL - Masks the ALERT pin from asserting.

‘0’ (default) - The ALERT pin is not masked. If any of the appropriate status bits are set the ALERT pin will be asserted.

‘1’ - The ALERT pin is masked. It will not be asserted for any interrupt condition unless it is configured as a secondary THERM pin. The Status Registers will be updated normally.

Bit 6 - RUN / STOP - Controls Active/Standby modes.

‘0’ (default) - The device is in Active mode and converting on all channels.

‘1’ -The device is in Standby mode and not converting.

Table 6.3 Status Register

DDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

02h R Status BUSY - - HIGH LOW FAULT THERM - 00h

Table 6.4 Configuration Register

R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFA

R/W Configuration MASK_ALL

RUN/STOP

ALERT/COMP RECD1 RECD2 RANGE DAVG_

DIS-

APDD 00



Data Sheet

Bit 5 - ALERT/COMP - Controls the operation of the ALERT pin.

‘0’ (default) - The ALERT pin acts as described in Section 5.3.

‘1’ - The ALERT pin acts in comparator mode as described in Section 5.3.2. In this mode the MASK_ALL bit is ignored.

Bit 4 - RECD1 - Disables the Resistance Error Correction (REC) for External Diode 1.

‘0’ (default)- REC is enabled for External Diode 1.

‘1’ - REC is disabled for External Diode 1.

Bit 3 - RECD2 - Disables the Resistance Error Correction (REC) for External Diode 2 and External Diode 3.

‘0’ (default) - REC is enabled for External Diode 2 and External Diode 3.

‘1’ - REC is disabled for External Diode 2 and External Diode 3.

Bit 2 - RANGE - Configures the measurement range and data format of the temperature channels.

‘0’ (default) - The temperature measurement range is 0°C to +127.875°C and the data format is binary.

‘1’ -The temperature measurement range is -64°C to +191.875°C and the data format is offset binary (see Table 5.3).

Bit 1 - DAVG_DIS - Disables the dynamic averaging feature on all temperature channels.

‘0’ (default) - The dynamic averaging feature is enabled. All temperature channels will be converted with an averaging factor that is based on the conversion rate as shown in Table 5.1 and Table 5.2.

‘1’ - The dynamic averaging feature is disabled. All temperature channels will be converted with a maximum averaging factor of 1x (equivalent to 11-bit conversion). For higher conversion rates, this averaging factor will be reduced as shown in Table 5.1 and Table 5.2.

Bit 0 - APDD (EMC1404 only) - Disables the anti-parallel diode operation. Beta Compensation is disabled on External Diode 2 and 3 regardless of APDD setting. In addition, External Diode 2 Beta Configuration register will be ignored.

‘0’ (default) - Anti-parallel diode mode is enabled. Two external diodes will be measured on the DP2 and DN2 pins.

‘1’ - Anti-parallel diode mode is disabled. Only one external diode will be measured on the DP2 and DN2 pins.

6.5 Conversion Rate Register

The Conversion Rate Register controls how often the temperature measurement channels are updated and compared against the limits. This register is fully accessible at either address.

Bits 3-0 - CONV[3:0] - Determines the conversion rate as shown in Table 6.6.

Table 6.5 Conversion Rate Register


04hR/W Conversion

Rate - - - - CONV[3:0] 06h(4/sec)0Ah



Data Sheet

6.6 Limit Registers

Table 6.6 Conversion Rate

CONV[3:0]

CONVERSIONS / SECONDHEX 3 2 1 0

0h 0 0 0 0 1 / 16

1h 0 0 0 1 1 / 8

2h 0 0 1 0 1 / 4

3h 0 0 1 1 1 / 2

4h 0 1 0 0 1

5h 0 1 0 1 2

6h 0 1 1 0 4 (default)

7h 0 1 1 1 8

8h 1 0 0 0 16

9h 1 0 0 1 32

Ah 1 0 1 0 64

Bh - Fh All others 1

Table 6.7 Temperature Limit Registers

ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

05hR/W Internal Diode

High Limit 128 64 32 16 8 4 2 1 55h(85°C)0Bh

06hR/W Internal Diode

Low Limit 128 64 32 16 8 4 2 1 00h(0°C)0Ch

07h

R/W

External Diode 1 High

Limit High Byte

128 64 32 16 8 4 2 1 55h(85°C)0Dh

13h R/W


Limit Low Byte

0.5 0.25 0.125 - - - - - 00h

08h

R/W

External Diode 1 Low

Limit High Byte

128 64 32 16 8 4 2 1 00h(0°C)0Eh



Data Sheet

The device contains both high and low limits for all temperature channels. If the measured temperature exceeds the high limit, then the corresponding status bit is set and the ALERT pin is asserted. Likewise, if the measured temperature is less than or equal to the low limit, the corresponding status bit is set and the ALERT pin is asserted.

The data format for the limits must match the selected data format for the temperature so that if the extended temperature range is used, the limits must be programmed in the extended data format.

The limit registers with multiple addresses are fully accessible at either address.

When the device is in standby mode, updating the limit registers will have no affect until the next conversion cycle occurs. This can be initiated via a write to the One Shot Register or by clearing the RUN / STOP bit in the Configuration Register (see Section 6.4).

14h R/W


Limit Low Byte

0.5 0.25 0.125 - - - - - 00h

15h R/W


Limit High Byte

128 64 32 16 8 4 2 1 55h(85°C)

16h R/W


Limit High Byte

128 64 32 16 8 4 2 1 00h(0°C)

17h R/W


Limit Low Byte

0.5 0.25 0.125 - - - - - 00h

18h R/W


Limit Low Byte

0.5 0.25 0.125 - - - - - 00h

2Ch R/W


Limit High Byte

128 64 32 16 8 4 2 1 55h(85°C)

2Dh R/W


Limit High Byte

128 64 32 16 8 4 2 1 00h(0°C)

2Eh R/W


Limit Low Byte

0.5 0.25 0.125 - - - - - 00h

2Fh R/W


Limit Low Byte

0.5 0.25 0.125 - - - - - 00h

Table 6.7 Temperature Limit Registers (continued)




Data Sheet

6.7 Scratchpad Registers

The Scratchpad Registers are Read Write registers that are used for place holders to be software compatible with legacy programs. Reading from the registers will return what is written to them.

6.8 One Shot Register

The One Shot Register is used to initiate a one shot command. Writing to the one shot register, when the device is in standby mode and BUSY bit (in Status Register) is ‘0’, will immediately cause the ADC to update all temperature measurements. Writing to the One Shot Register while the device is in active mode will have no affect.

6.9 Therm Limit Registers

The THERM Limit Registers are used to determine whether a critical thermal event has occurred. If the measured temperature exceeds the THERM Limit, then the THERM pin is asserted. The limit setting must match the chosen data format of the temperature reading registers.

Table 6.8 Scratchpad Register


11h R/W Scratchpad 7 6 5 4 3 2 1 0 00h

12h R/W Scratchpad 7 6 5 4 3 2 1 0 00h

Table 6.9 One Shot Register


0Fh W One Shot Writing to this register initiates a single conversion cycle. Data is not stored and always reads 00h 00h

Table 6.10 Therm Limit Registers


19h R/WExternal Diode 1

THERM Limit128 64 32 16 8 4 2 1 55h

(85°C)

1Ah R/WExternal Diode 2

THERM Limit128 64 32 16 8 4 2 1 55h

(85°C)

20h R/W Internal Diode THERM Limit 128 64 32 16 8 4 2 1 55h

(85°C)

21h R/W THERM Hysteresis 128 64 32 16 8 4 2 1 0Ah

(10°C)

30h R/WExternal Diode 3

THERM Limit128 64 32 16 8 4 2 1 55h

(85°C)



Data Sheet

Unlike the ALERT pin, the THERM pin cannot be masked. Additionally, the THERM pin will be released once the temperature drops below the corresponding threshold minus the THERM Hysteresis.

6.10 External Diode Fault Register

The External Diode Fault Register indicates which of the external diodes caused the FAULT bit in the Status Register to be set. This register is cleared when it is read.

Bit 3 - E3FLT - This bit is set if the External Diode 3 channel reported a diode fault.



6.11 Channel Mask Register

The Channel Mask Register controls individual channel masking. When a channel is masked, the ALERT pin will not be asserted when the masked channel reads a diode fault or out of limit error. The channel mask does not mask the THERM pin.

Bit 3 - E3MASK - Masks the ALERT pin from asserting when the External Diode 3 channel is out of limit or reports a diode fault.

‘0’ (default) - The External Diode 3 channel will cause the ALERT pin to be asserted if it is out of limit or reports a diode fault.

‘1’ - The External Diode 3 channel will not cause the ALERT pin to be asserted if it is out of limit or reports a diode fault.







Table 6.11 External Diode Fault Register


1Bh R-C External Diode Fault - - - - E3FLT E2FLT E1FLT - 00h

Table 6.12 Channel Mask Register


1Fh R/W Channel Mask - - - - E3

MASKE2

MASKE1

MASKINT

MASK 00h



Data Sheet

Bit 0 - INTMASK - Masks the ALERT pin from asserting when the Internal Diode temperature is out of limit.

‘0’ (default) - The Internal Diode channel will cause the ALERT pin to be asserted if it is out of limit.

‘1’ - The Internal Diode channel will not cause the ALERT pin to be asserted if it is out of limit.

6.12 Consecutive ALERT Register

The Consecutive ALERT Register determines how many times an out-of-limit error or diode fault must be detected in consecutive measurements before the ALERT or THERM pin is asserted. Additionally, the Consecutive ALERT Register controls the SMBus Timeout functionality.

An out-of-limit condition (i.e. HIGH, LOW, or FAULT) occurring on the same temperature channel in consecutive measurements will increment the consecutive alert counter. The counters will also be reset if no out-of-limit condition or diode fault condition occurs in a consecutive reading.

When the ALERT pin is configured as an interrupt, when the consecutive alert counter reaches its programmed value, the following will occur: the STATUS bit(s) for that channel and the last error condition(s) (i.e. E1HIGH, or E2LOW and/or E2FAULT) will be set to ‘1’, the ALERT pin will be asserted, the consecutive alert counter will be cleared, and measurements will continue.

When the ALERT pin is configured as a comparator, the consecutive alert counter will ignore diode fault and low limit errors and only increment if the measured temperature exceeds the High Limit. Additionally, once the consecutive alert counter reaches the programmed limit, the ALERT pin will be asserted, but the counter will not be reset. It will remain set until the temperature drops below the High Limit minus the THERM Hysteresis value.

For example, if the CALRT[2:0] bits are set for 4 consecutive alerts on an EMC1403 device, the high limits are set at 70°C, and none of the channels are masked, then the ALERT pin will be asserted after the following four measurements:

1. Internal Diode reads 71°C and both external diodes read 69°C. Consecutive alert counter for INT is incremented to 1.

2. Both Internal Diode and External Diode 1 read 71°C and External Diode 2 reads 68°C. Consecutive alert counter for INT is incremented to 2 and for EXT1 is set to 1.

3. The External Diode 1 reads 71°C and both the Internal Diode and External Diode 2 read 69°C. Consecutive alert counter for INT and EXT2 are cleared and EXT1 is incremented to 2.

4. The Internal Diode reads 71°C and both external diodes read 71°C. Consecutive alert counter for INT is set to 1, EXT2 is set to 1, and EXT1 is incremented to 3.

5. The Internal Diode reads 71°C and both the external diodes read 71°C. Consecutive alert counter for INT is incremented to 2, EXT2 is set to 2, and EXT1 is incremented to 4. The appropriate status bits are set for EXT1 and the ALERT pin is asserted. EXT1 counter is reset to 0 and all other counters hold the last value until the next temperature measurement.

Bit 7 - TIMEOUT - Determines whether the SMBus Timeout function is enabled.

‘0’ (default) - The SMBus Timeout feature is disabled. The SMCLK line can be held low indefinitely without the device resetting its SMBus protocol.

‘1’ - The SMBus Timeout feature is enabled. If the SMCLK line is held low for more than 30ms, then the device will reset the SMBus protocol.

Table 6.13 Consecutive ALERT Register


22h R/W Consecutive ALERT

TIME OUT CTHRM[2:0] CALRT[2:0] - 70h



Data Sheet

Bits 6-4 - CTHRM[2:0] - Determines the number of consecutive measurements that must exceed the corresponding THERM Limit before the THERM pin is asserted. All temperature channels use this value to set the respective counters. The consecutive THERM counter is incremented whenever any measurement exceed the corresponding THERM Limit.

If the temperature drops below the THERM limit, then the counter is reset. If a number of consecutive measurements above the THERM limit occurs, then the THERM pin is asserted low.

Once the THERM pin has been asserted, the consecutive therm counter will not reset until the corresponding temperature drops below the THERM Limit minus the THERM Hysteresis value.

The bits are decoded as shown in Table 6.14. The default setting is 4 consecutive out of limit conversions.

Bits 3-1 - CALRT[2:0] - Determine the number of consecutive measurements that must have an out of limit condition or diode fault before the ALERT pin is asserted. All temperature channels use this value to set the respective counters. The bits are decoded as shown in Table 6.14. The default setting is 1 consecutive out of limit conversion.

6.13 Beta Configuration Registers

This register is used to set the Beta Compensation factor that is used for the external diode channels.

Bit 3 - ENABLEx - Enables the Beta Compensation factor autodetection function. This function shall be disabled for External Diode 2.

‘0’ - The Beta Compensation Factor autodetection circuitry is disabled. The External Diode will always use the Beta Compensation factor set by the BETAx[2:0] bits.

‘1’ (default) - The Beta Compensation factor autodetection circuitry is enabled. At the beginning of every conversion, the optimal Beta Compensation factor setting will be determined and applied. The BETAx[2:0] bits will be automatically updated to indicate the current setting.

Table 6.14 Consecutive Alert / THERM Settings

2 1 0NUMBER OF CONSECUTIVE OUT OF LIMIT

MEASUREMENTS

0 0 0 1 (default for CALRT[2:0])

0 0 1 2

0 1 1 3

1 1 1 4 (default for CTHRM[2:0])

Table 6.15 Beta Configuration Registers


25h R/WExternal

Diode 1 Beta Configuration

- - - - ENABLE1 BETA1[2:0] 08h

26h R/WExternal

Diode 2 Beta Configuration

- - - - ENABLE2 BETA2[2:0]

08h for EMC1403 or 07h for EMC1404



Data Sheet

Bit 2-0 - BETAx[2:0] - These bits always reflect the current beta configuration settings. If autodetection circuitry is enabled, then these bits will be updated automatically and writing to these bits will have no effect. If the autodetection circuitry is disabled, then these bits will determine the beta configuration setting that is used for their respective channels.

Care should be taken when setting the BETAx[2:0] bits when the autodetection circuitry is disabled. If the Beta Compensation factor is set at a beta value that is higher than the transistor beta, then the circuit may introduce measurement errors. When measuring a discrete thermal diode (such as 2N3904) or a CPU diode that functions like a discrete thermal diode (such as an AMD processor diode), then the BETAx[2:0] bits should be set to ‘111b’.

6.14 External Diode Ideality Factor Registers

These registers store the ideality factors that are applied to the external diodes. Table 6.18 defines each setting and the corresponding ideality factor. Beta Compensation and Resistance Error Correction

Table 6.16 CPU Beta Values

HEX ENABLEX

BETAX[2:0]

MINIMUM BETA2 1 0

0h 0 0 0 0 0.11

1h 0 0 0 1 0.18

2h 0 0 1 0 0.25

3h 0 0 1 1 0.33

4h 0 1 0 0 0.43

5h 0 1 0 1 1.00

6h 0 1 1 0 2.33

7h 0 1 1 1 Disabled

8h - Fh 1 X X X Autodetection

Table 6.17 Ideality Configuration Registers


27h R/W

External Diode 1 Ideality Factor

- - IDEALITY1[5:0] 12h

28h R/W



31h R/W





Data Sheet

automatically correct for most diode ideality errors, therefore it is not recommended that these settings be updated without consulting Microchip.

For CPU substrate transistors that require the BJT transistor model, the ideality factor behaves slightly differently than for discrete diode-connected transistors. Refer to Table 6.19 when using a CPU substrate transistor.

Table 6.18 Ideality Factor Look-Up Table (Diode Model)

SETTING FACTOR SETTING FACTOR SETTING FACTOR

08h 0.9949 18h 1.0159 28h 1.0371

09h 0.9962 19h 1.0172 29h 1.0384

0Ah 0.9975 1Ah 1.0185 2Ah 1.0397

0Bh 0.9988 1Bh 1.0200 2Bh 1.0410

0Ch 1.0001 1Ch 1.0212 2Ch 1.0423

0Dh 1.0014 1Dh 1.0226 2Dh 1.0436

0Eh 1.0027 1Eh 1.0239 2Eh 1.0449

0Fh 1.0040 1Fh 1.0253 2Fh 1.0462

10h 1.0053 20h 1.0267 30h 1.0475

11h 1.0066 21h 1.0280 31h 1.0488

12h 1.0080 22h 1.0293 32h 1.0501

13h 1.0093 23h 1.0306 33h 1.0514

14h 1.0106 24h 1.0319 34h 1.0527

15h 1.0119 25h 1.0332 35h 1.0540

16h 1.0133 26h 1.0345 36h 1.0553

17h 1.0146 27h 1.0358 37h 1.0566

Table 6.19 Substrate Diode Ideality Factor Look-Up Table (BJT Model)


08h 0.9869 18h 1.0079 28h 1.0291

09h 0.9882 19h 1.0092 29h 1.0304

0Ah 0.9895 1Ah 1.0105 2Ah 1.0317

0Bh 0.9908 1Bh 1.0120 2Bh 1.0330

0Ch 0.9921 1Ch 1.0132 2Ch 1.0343

0Dh 0.9934 1Dh 1.0146 2Dh 1.0356

0Eh 0.9947 1Eh 1.0159 2Eh 1.0369

0Fh 0.9960 1Fh 1.0173 2Fh 1.0382

10h 0.9973 20h 1.0187 30h 1.0395



Data Sheet

A

APPLICATION NOTE: When measuring a 65nm Intel CPUs, the Ideality Setting should be the default 12h. When measuring 45nm Intel CPUs, the Ideality Setting should be 15h.

6.15 High Limit Status Register

The High Limit Status Register contains the status bits that are set when a temperature channel high limit is exceeded. If any of these bits are set, then the HIGH status bit in the Status Register is set. Reading from the High Limit Status Register will clear all bits if. Reading from the register will also clear the HIGH status bit in the Status Register.

The ALERT pin will be set if the programmed number of consecutive alert counts have been met and any of these status bits are set.

The status bits will remain set until read unless the ALERT pin is configured as a comparator output (see Section 5.3.2).

Bit 3 - E3HIGH - This bit is set when the External Diode 3 channel exceeds its programmed high limit.



Bit 0 - IHIGH - This bit is set when the Internal Diode channel exceeds its programmed high limit.

6.16 Low Limit Status Register

The Low Limit Status Register contains the status bits that are set when a temperature channel drops below the low limit. If any of these bits are set, then the LOW status bit in the Status Register is set.

11h 0.9986 21h 1.0200 31h 1.0408

12h 1.0000 22h 1.0213 32h 1.0421

13h 1.0013 23h 1.0226 33h 1.0434

14h 1.0026 24h 1.0239 34h 1.0447

15h 1.0039 25h 1.0252 35h 1.0460

16h 1.0053 26h 1.0265 36h 1.0473

17h 1.0066 27h 1.0278 37h 1.0486

Table 6.20 High Limit Status Register

DDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

35h R-C High Limit Status - - - - E3HIGH E2HIGH E1HIGH IHIGH 00h

Table 6.21 Low Limit Status Register


36h R-C Low Limit Status - - - - E3LOW E2LOW E1LOW ILOW 00h

Table 6.19 Substrate Diode Ideality Factor Look-Up Table (BJT Model) (continued)




Data Sheet

A

Reading from the Low Limit Status Register will clear all bits. Reading from the register will also clear the LOW status bit in the Status Register.

The ALERT pin will be set if the programmed number of consecutive alert counts have been met and any of these status bits are set.

The status bits will remain set until read unless the ALERT pin is configured as a comparator output (see Section 5.3.2).

Bit 3 - E3LOW - This bit is set when the External Diode 3 channel drops below its programmed low limit.



Bit 0 - ILOW - This bit is set when the Internal Diode channel drops below its programmed low limit.

6.17 THERM Limit Status Register

The THERM Limit Status Register contains the status bits that are set when a temperature channel THERM Limit is exceeded. If any of these bits are set, then the THERM status bit in the Status Register is set. Reading from the THERM Limit Status Register will not clear the status bits. Once the temperature drops below the THERM Limit minus the THERM Hysteresis, the corresponding status bits will be automatically cleared. The THERM bit in the Status Register will be cleared when all individual channel THERM bits are cleared.

Bit 3 - E3THERM - This bit is set when the External Diode 3 channel exceeds its programmed THERM Limit. When set, this bit will assert the THERM pin.

Bit 2 - E2THERM - This bit is set when the External Diode 2 channel exceeds its programmed THERM Limit. When set, this bit will assert the THERM pin.

Bit 1 - E1THERM - This bit is set when the External Diode 1 channel exceeds its programmed THERM limit. When set, this bit will assert the THERM pin.

Bit 0- ITHERM - This bit is set when the Internal Diode channel exceeds its programmed THERM limit. When set, this bit will assert the THERM pin.

6.18 Filter Control Register

The Filter Configuration Register controls the digital filter on the External Diode 1 channel.

Table 6.22 THERM Limit Status Register

DDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT

37h R-CTHERM

Limit Status

- - - - E3 THERM

E2 THERM

E1 THERM ITHERM 00h

Table 6.23 Filter Configuration Register


40h R/W Filter Control - - - - - - FILTER[1:0] 00h



Data Sheet

Bits 1-0 - FILTER[1:0] - Control the level of digital filtering that is applied to the External Diode temperature measurements as shown in Table 6.24. See Figure 5.3and Figure 5.4 for examples on the filter behavior.

6.19 Product ID Register

The Product ID Register holds a unique value that identifies the device.

6.20 Microchip ID Register (FEh)

The Manufacturer ID register contains an 8 bit word that identifies the Microchip as the manufacturer of the EMC1403 and EMC1404.

Table 6.24 Filter Settings

FILTER[1:0]

AVERAGING1 0

0 0 Disabled (default)

0 1 Level 1

1 0 Level 1

1 1 Level 2

Table 6.25 Product ID Register


FDh R Product ID 0 0 1 0 0 0 0 1 21hEMC1403

FDh R Product ID 0 0 1 0 0 1 0 1 25hEMC1404

Table 6.26 Manufacturer ID Register


FEh R MCHP ID 0 1 0 1 1 1 0 1 5Dh



Data Sheet

6.21 Revision Register (FFh)

The Revision register contains an 8-bit word that identifies the die revision. It can be 01h or 04h.

Table 6.27 Revision Register


FFh R Revision 0 0 0 0 0 0 0 1 01h

FFh R Revision 0 0 0 0 0 1 0 0 04h



Data Sheet

Chapter 7 Typical Operating Curves



Data Sheet



Data Sheet

Chapter 8 Package InformationNote: For the most current package drawings, see the Microchip Packaging Specification at

http://www.microchip.com/packaging.

Figure 8.1 10-Pin MSOP / TSSOP Package



Data Sheet

Figure 8.2 10-Pin DFN Package Drawing (1 of 2)

Not

e: F

or th

e m

ost c

urre

nt p

acka

ge d

raw

ings

, se

e th

e M

icro

chip

Pac

kagi

ng S

peci

ficat

ion

at

http

://w

ww

.mic

roch

ip.c

om/p

acka

ging



Data Sheet

Figure 8.3 10-Pin DFN Package Dimensions (2 of 2)

Not

e: F

or th

e m

ost c

urre

nt p

acka

ge d

raw

ings

, se

e th

e M

icro

chip

Pac

kagi

ng S

peci

ficat

ion

at

http

://w

ww

.mic

roch

ip.c

om/p

acka

ging



Data Sheet

Figure 8.4 Package Drawing and PCB Footprint for SOIC-14

Not

e: F

or th

e m

ost c

urre

nt p

acka

ge d

raw

ings

, se

e th

e M

icro

chip

Pac

kagi

ng S

peci

ficat

ion

at

http

://w

ww

.mic

roch

ip.c

om/p

acka

ging



Data Sheet

8.1 Package Markings

8.1.1 EMC1404-X-AIZL (10-pin MSOP)All devices will be marked on the first line of the top side with “1404”. On the second line, they will be marked with the appropriate -X number (-1, -2, etc), the Functional Revision “B” and Country Code (CC).

8.1.2 EMC1403-X-AIZL (10-pin MSOP)All devices will be marked on the first line of the top side with “1403”. On the second line, packages will be marked with the appropriate -X number (-1, -2, etc), the Functional Revision “B” and Country Code (CC).

8.1.3 EMC1403-1-AIA and EMC1403-2-AIA (10-pin DFN)The EMC1403-1-AIA will be marked on the first line of the top side with the code “31” followed by the first two characters of the last 6 characters of the Lot Number. The EMC1403-2-AIA is marked with the code “32” followed by the first two characters of the last 6 characters of the Lot Number. On the second line, packages will be marked with the last 4 characters of the Lot Number.

For example: If the Lot Number is “2H123456A”, the first line on the EMC1403-1-AIA will read “3123” and the second line will read “456A”.

8.1.4 EMC1403-YZTAll devices will be marked on the first line of the top side with “EMC1403” followed by “-X” where X is the appropriate -X number (-1, -2, etc). On the second line, packages will be marked with Functional Revision “B”, date code and the last 7 characters of Lot Number.



Data Sheet

Chapter 9 Data Sheet Revision History

Table 9.1 Revision History

REVISION LEVEL & DATE SECTION/FIGURE/ENTRY CORRECTION

REV A REV A replaces previous SMSC version Rev. 2.0 (08-10-12)

Rev. 2.0 (08-10-12) Table 3.3, "SMBus Electrical Specifications"

Added conditions for tHD:DAT. Data hold time minimum of 0.3μs is required when receiving from the master. Data hold time is 0μs min when transmitting to the master.

Section 6.21, "Revision Register (FFh)"

Added row to indicate that revision ID can be 04h. Revision ID may be 04h or 01h.

Rev. 1.38 (02-28-12) Figure 2.2, "EMC1403/EMC1404 Pin Diagram, DFN-10"

Added exposed pad and updated so it looks more like a square.

Table 2.1, "EMC1403 and EMC1404 Pin Description"

Added last row for DFN bottom pad. Recommendation is to connect it to ground.

Rev. 1.37 (01-06-10) Section 8.1.4, "EMC1403-YZT"

Added to last sentence: “Revision “B”, date code and the last 7 characters of” before “Lot Number”.

Section 8.1.3, "EMC1403-1-AIA and EMC1403-2-AIA (10-pin DFN)"

Corrected device code. Instead of being “32” for both devices in the 10-pin DFN package, the code is “31” for the EMC1403-1-AIA and “32” for the EMC1403-2-AIA.

Rev. 1.36 (07-02-09) Table 2.1, "EMC1403 and EMC1404 Pin Description"

In pin description table, added to function column: “requires pull-up resistor” for SMDATA and SMCLK pins

Table 2.1, "EMC1403 and EMC1404 Pin Description"

Identified 5V tolerant pins. Added the following application note below table: “For the 5V tolerant pins that have a pull-up resistor (SMCLK, SMDATA, THERM, and ALERT), the voltage difference between VDD and the pull-up voltage must never exceed 3.6V.”

Table 3.1, "Absolute Maximum Ratings"

Updated voltage limits for 5V tolerant pins with pull-up resistors.

Added the following note below table: “For the 5V tolerant pins that have a pull-up resistor (SMCLK, SMDATA, THERM, and ALERT), the pull-up voltage must not exceed 3.6V when the device is unpowered.”

Table 3.2, "Electrical Specifications"

Added leakage current.



Data Sheet

Rev. 1.35 (04-14-09) Figure 8.2, "10-Pin DFN Package Drawing (1 of 2)"

Figure 8.3, "10-Pin DFN Package Dimensions (2 of 2)"

Figure 8.4, "10 Pin DFN PCB Footprint"

Diagrams updated

Table 3.1, "Absolute Maximum Ratings"

Updated thermal resistance numbers

Rev. 1.34 (02-27-09) Table 5.3, "Temperature Data Format"

Extended range for -1 updated from 001 1111 1111 to 001 1111 1000

Rev. 1.33 (08-18-08) Ordering Information and Table 1.1, "Part Selection"

Added EMC1403-3 and EMC1403-4 for all package options


Added EMC1404-4


Added EMC1404-2 and EMC1404-3

Table 9.1 Revision History (continued)

REVISION LEVEL & DATE SECTION/FIGURE/ENTRY CORRECTION



Data Sheet


Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implic-itly or otherwise, under any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

A more complete list of registered trademarks and common law trademarks owned by Standard Microsystems Corporation (“SMSC”) is available at: www.smsc.com. The absence of a trademark (name, logo, etc.) from the list does not constitute a waiver of any intellectual property rights that SMSC has established in any of its trademarks.

All other trademarks mentioned herein are property of their respective companies.

© 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

ISBN: 9781620779439

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.


AMERICASCorporate Office2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277Technical Support: http://www.microchip.com/supportWeb Address: www.microchip.comAtlantaDuluth, GA Tel: 678-957-9614 Fax: 678-957-1455Austin, TXTel: 512-257-3370 BostonWestborough, MA Tel: 774-760-0087 Fax: 774-760-0088ChicagoItasca, IL Tel: 630-285-0071 Fax: 630-285-0075ClevelandIndependence, OH Tel: 216-447-0464 Fax: 216-447-0643DallasAddison, TX Tel: 972-818-7423 Fax: 972-818-2924DetroitNovi, MI Tel: 248-848-4000Houston, TX Tel: 281-894-5983IndianapolisNoblesville, IN Tel: 317-773-8323Fax: 317-773-5453Los AngelesMission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608New York, NY Tel: 631-435-6000San Jose, CA Tel: 408-735-9110Canada - TorontoTel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFICAsia Pacific OfficeSuites 3707-14, 37th FloorTower 6, The GatewayHarbour City, KowloonHong KongTel: 852-2401-1200Fax: 852-2401-3431Australia - SydneyTel: 61-2-9868-6733Fax: 61-2-9868-6755China - BeijingTel: 86-10-8569-7000 Fax: 86-10-8528-2104China - ChengduTel: 86-28-8665-5511Fax: 86-28-8665-7889China - ChongqingTel: 86-23-8980-9588Fax: 86-23-8980-9500China - HangzhouTel: 86-571-2819-3187 Fax: 86-571-2819-3189China - Hong Kong SARTel: 852-2943-5100 Fax: 852-2401-3431China - NanjingTel: 86-25-8473-2460Fax: 86-25-8473-2470China - QingdaoTel: 86-532-8502-7355Fax: 86-532-8502-7205China - ShanghaiTel: 86-21-5407-5533 Fax: 86-21-5407-5066China - ShenyangTel: 86-24-2334-2829Fax: 86-24-2334-2393China - ShenzhenTel: 86-755-8864-2200 Fax: 86-755-8203-1760China - WuhanTel: 86-27-5980-5300Fax: 86-27-5980-5118China - XianTel: 86-29-8833-7252Fax: 86-29-8833-7256China - XiamenTel: 86-592-2388138 Fax: 86-592-2388130China - ZhuhaiTel: 86-756-3210040 Fax: 86-756-3210049

ASIA/PACIFICIndia - BangaloreTel: 91-80-3090-4444 Fax: 91-80-3090-4123India - New DelhiTel: 91-11-4160-8631Fax: 91-11-4160-8632India - PuneTel: 91-20-3019-1500Japan - OsakaTel: 81-6-6152-7160 Fax: 81-6-6152-9310Japan - TokyoTel: 81-3-6880- 3770 Fax: 81-3-6880-3771Korea - DaeguTel: 82-53-744-4301Fax: 82-53-744-4302Korea - SeoulTel: 82-2-554-7200Fax: 82-2-558-5932 or 82-2-558-5934Malaysia - Kuala LumpurTel: 60-3-6201-9857Fax: 60-3-6201-9859Malaysia - PenangTel: 60-4-227-8870Fax: 60-4-227-4068Philippines - ManilaTel: 63-2-634-9065Fax: 63-2-634-9069SingaporeTel: 65-6334-8870Fax: 65-6334-8850Taiwan - Hsin ChuTel: 886-3-5778-366Fax: 886-3-5770-955Taiwan - KaohsiungTel: 886-7-213-7830Taiwan - TaipeiTel: 886-2-2508-8600 Fax: 886-2-2508-0102Thailand - BangkokTel: 66-2-694-1351Fax: 66-2-694-1350

EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828 Fax: 45-4485-2829France - ParisTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79Germany - DusseldorfTel: 49-2129-3766400Germany - MunichTel: 49-89-627-144-0 Fax: 49-89-627-144-44Germany - PforzheimTel: 49-7231-424750Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781Italy - VeniceTel: 39-049-7625286 Netherlands - DrunenTel: 31-416-690399 Fax: 31-416-690340Poland - WarsawTel: 48-22-3325737 Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91Sweden - StockholmTel: 46-8-5090-4654UK - WokinghamTel: 44-118-921-5800Fax: 44-118-921-5820

Worldwide Sales and Service

10/28/13

http://support.microchip.com


emc1403/emc1404 1°c temperature sensor with beta...

Documents