embedded - amazon s3s3.amazonaws.com/.../data_modul/datamodul...web.pdf · 8 |...

EMBEDDED

EMBEDDED SOLUTIONS

DATA MODUL offers perfectly coordinated embedded computer systems based on x86

and ARM architectures. From pre-configured kits, complete custom baseboard design

to professional embedded computing design – DATA MODUL provides the full range of

embedded solutions. Display control technology is offered in a wide variety of building

blocks and solutions based on DATA MODUL’s proprietary know-how.

› CPU boards

› Embedded box PCs › eMotion LCD controller boards

› Embedded computing design

INDEX

Competencies .......................................................... 4

Technologies and Brands ....................................... 8

Markets and References ....................................... 10

Products ................................................................. 12

2 | www.data-modul.com [email protected] 3

› Proven reference design based on

Computer-On-Modules

› Building blocks for reduced

development time and cost

› All performance levels

FULL-CUSTOM DESIGN


› Large product portfolio of x86 and ARM

based embedded boards

› Various form-factors and performance

levels

› Long-term partnership with world-leading

manufacturers of embedded products

› Intel based COM Express® Modules

› Single board computers & baseboard

designs

› High-end board solutions for displays

up to UHD/4k resolution

› Latest display interfaces and inputs

› Fully configured plug & play kits with

converter, power supply, cables and

OSD board

› For outstanding image quality

CPU BOARDS eMotion LCD CONTROLLER BOARDS

DATA MODUL embedded solutions comprise CPU modules, baseboards, single board computers

and LCD controller boards developed entirely in-house.

› Pre-configured kits consisting of embedded

board, display and fitting cable set

› Adaption and integration of all available

displays (TFT-LVDS, TFT-TTL, eDP) incl.

inverters, tested cables and adapted

power ON/OFF timing

› Customized images for embedded

operating systems

› Custom embedded OS services

› Cooling solutions

EASYKIT-SOLUTIONS

COMPETENCIES


› Long-term availability of at least 5 years

› Professional PCN/EOL processes

› In-house FAE team and worldwide sales offices to

quickly and flexibly meet even major challenges

and deadlines

› Long-term partnership with world-leading

manufacturers of embedded products

› Adaption and integration of TFTs including video

BIOS (certified settings for each TFT available)

› Accessories like memory modules, mass-storage

and extension modules

› Customization based on standard products

› Programmable logic

› BIOS/UEFI support

› Bootloader support

› Driver development, APIs

› Board support packages

› Mainline based Yocto Linux OS

SOFTWARE DEVELOPMENTEMBEDDED COMPUTING DESIGN SERVICES & SUPPORT CUSTOMER ADVANTAGES

DATA MODUL is greatly expanding its display control expertise. An experienced engineering team

dedicated to developing professional embedded computing designs now supports high quality

product development for industrial use. Customers benefit from the modular concept resulting in

validated core components, reduced development time and less time for validation.

› Schematic and layout review

› Design validation

› Comprehensive technical support

› Compliance measurements

› Custom embedded OS services

(WES8, WES7, WinXPe, WinCE6,

WinEC7, WinEC2013, Win10IoT,

Embedded Linux)

› Standard and customized computer-on-modules,

baseboard designs and single board computers

› Latest CPU platforms

› Latest professional measuring equipment

› Failure mode and effects analysis

› R & D sites in Germany

› System integration with all other key technologies

including display, touch sensor and certifications

› From low power single-core designs up to high end

multi-core solutions

› Part selection in consideration of cost and quality

COMPETENCIES

› Form factors, e.g. ATX, Micro-ATX, Mini

ITX, Pico ITX, 3.5” and more

› No carrier board needed

› Self-developed SBCs

› “Off-the-shelf” solutions

› Form Factors, e.g. COM Express, Qseven,

SMARC, Colibri and more

› Customer-specific carrier board

› x86-based modules

› ARM-based modules

Pico-ITX 100 x 72 mm / 3.9” x 2.8”

3.5” 102 x 145 mm / 4.02” x 5.71”

Mini-ITX 170 x 170 mm / 6.69” x 6.69”

COM Express mini 84 x 55 mm

COM Express compact 95 x 95 mm

COM Express basic 125 x 95 mm


In addition to the product portfolios of all major embedded manufacturers, DATA MODUL offers

a wide range of professionally designed embedded solutions, developed and designed by the

in-house development team based in Deggendorf. a

TECHNOLOGIES & BRANDS

SINGLE BOARD COMPUTER (SBC) COMPUTER-ON-MODULES (COM)

EMBEDDED CONCEPT

eMOTION LCD CONTROLLER BOARDS

VISUAL & TOUCH SOLUTIONS

COM MODULES & SBCs


DATA MODUL understands that embedded technology is a rapidly growing market. Its aim is to further consolidate this market growth through its innovative product portfolio. The following applications are just an example.

› Dedicated certifications

› Particular electromagnetic

compatibility (EMC)

› Long-term availability

› High performance CPU boards

› Embedded solution with

custom dimensions

› Independent driving of

several displays

› Ultrasonic devices

› Computer tomography

› Non-invasive ventilation

› Slot machines

› Player tracking systems

› Kiosk

› Long life solutions

› Shock resistance

› Obsolescence management

› Computer numeric control

› Diagnostic systems

› Machine control

› Low power consumption

› Vibration resistance

› High signal-to-noise-ratio

› Passenger information system

› Ticket vending machines

› Control stand applications

› Reliable operation

› High durability

› Extended temperature range

› Human machine interfaces

› Sensors

› Motion control

› IOT-ready embedded

solutions

› Driving solutions for high

resolution displays

› Low power consumption

› Building automation

› Security

› Access control systems

MARKET DEMANDS MARKET DEMANDS

REFERENCE APPLICATIONS REFERENCE APPLICATIONS

MEDICINE & HEALTHCARE

MECHANICAL ENGINEERING

AUTOMATION & ROBOTICS

BUILDING TECHNOLOGY

TRANSPORTATIONDIGITAL SIGNAGE & GAMING

MARKETS & REFERENCES

Mechanical Engineering

Gam

ing

Ou

tdo

or MaritimeAutomotive

Transportation

Point of Sales

Digital Signage

Automation & Robotics

MedicineBuilding Technology

Wh

ite Go

od

s Portable Application


COM EXPRESS MODULES

SKYLAKE

› 6th Gen Intel® Core™

processor

APOLLO LAKE

› 5th Gen Intel® Atom™

SoC processor

COFFEE LAKE

› 8th Gen Intel®

Core™ processor

eDM-COMB-CF6 eDM-COMB-AL6

Form factor COM Express Basic Type 6 COM Express Compact Type 6

Processor8th Gen. Intel® Core™ up to 6 cores/Intel® Xeon® E3

Intel® Pentium® N4200, QC 2.50 GHzCeleron® N3350 DC 2.40 GHzAtomTM x5-E3950 QC 2.00 GHzAtomTM x5-E3940 QC 1.80 GHzAtomTM x5-E3930 DC 1.80 GHz

Chipset Mobile Intel®300 series, QM370, HM370 and CM246 Integrated in SoC

DRAM2x DDR4 SO-DIMMs up to 2666MT/s and32 Gbyte/ECC optional

2x DDR3L SO-DIMMs up to 1866MT/s and 8 GByte

Mass storage 4x SATA 32x SATA 3, 1x microSD card socket (opt.) max. 64 Gbyte eMMC onboard

Bus 8x PCIe Gen 3, 1x PEG x16 Gen 3, LPC, SPI, I²C; GPIOs 5x PCIe Gen 2, LPC, SPI, I²C, GPIO

Ethernet 10/100/1000BaseT 10/100/1000BaseT

I/O8x USB 2.0 , 4 x USB 3.0/USB 3.1, 2x USB Type C2 x UART (COM1/2)

8x USB 2.0 , 4x USB 3.0 , 2x UART (COM1/2)

Panel Interface LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI) LVDS 2x 24/eDP 1.3, 2x DDI (DP++, HDMI, DVI), 1x VGA (opt.)

Audio HD Audio HD Audio

Others DMEC Board Controller, TPM 1.2 / TPM 2.0 DMEC board controller, TPM 1.2/TPM 2.0

KABYLAKE

› 7th Gen Intel®

Core™ processor

eDM-COMB-KL6 eDM-COMB-SL6

Form factor COM Express Basic Type 6 COM Express Basic Type 6

Processor 7th Gen Intel® Core™ i3/i5/i7/Intel® Xeon® E36th Gen Intel® Core™ i3/i5/i7/Intel® Xeon® E3, Celeron® G3900E/G3902E

Chipset Mobile Intel® 100 series, QM175, HM175 and CM238 Mobile Intel® 100 series, QM170, HM170 and CM236

DRAM2x DDR4 SO-DIMMs up to 2400MT/s and 32 Gbyte, Intel® Xeon® and Intel® i3 with ECC support

2x DDR4 SO-DIMMs up to 2133MT/s and 32 GByte, Intel® Xeon® with ECC support

Mass storage 4x SATA 3 4x SATA 3

Bus 8x PCIe Gen 3, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO 8x PCIe Gen 3, 1x PEG x16 Gen 3, LPC, SPI, I²C, GPIO

Ethernet 10/100/1000BaseT 10/100/1000BaseT

I/O 8x USB 2.0 , 4x USB 3.0, 2x UART (COM1/2) 8x USB 2.0 , 4x USB 3.0 , 2x UART (COM1/2)

Panel Interface LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI), 1x VGA (opt.) LVDS 2x 24/eDP, 3x DDI (DP++, HDMI, DVI), 1x VGA (opt.)

Audio HD Audio HD Audio

Others DMEC board controller, TPM 1.2/TPM 2.0, Intel® Optane memory DMEC board controller, TPM 1.2/TPM 2.0

COM EXPRESS™COM Express™ is an open Computer-on-Module standard, defined and

maintained by the PICMG.

With its different form factors and pin-outs, this form factor offers the widest

scalability in computing performance and power consumption.

It is designed for the latest chip sets and serial signaling protocols, inclu-

ding PCI Express Gen 3, 10GbE, SATA, up to USB 3.1, and high resolution video interfaces.

COM EXPRESS TYPE 6COM Express Type 6 is the most popular and widely

used computer-on-module form factor on the

market. It brings Computer-on-Modules in

line with current and future technology

trends by providing for the latest graphics

interfaces (DisplayPort/DVI/HDMI).

COM Express Basic Type 6 pinout has also additional legacy

functions replaced by Digital Display interfaces (DDI), additional

PCI Express lanes, and reserved pins for future technologies.

The COM Express Compact Type 6 pinout form factor is ideally suited to single chip x86 solutions (SoCs)

with a power range between 5 to 20 watts. Utilizing both Intel®

Core™ and Atom® SoCs, Compact size modules are typically

targeted at mid- and entry level applications.


› LCD-controllers especially designed for the

needs of industrial customers

› Long term availability and product stability

› Fully configured plug & play kits

› Outstanding image quality

eMotion UHD eMotion USB

Input/s 2x DP (1.2)/HDMI (1.4)/DVI (Dual-Link) 1x USB Type C with Alternate Mode

Display Support V-BY-One 8 lanes, eDP 8 lanes 2 channel LVDS interface

Color Depth 24/30 Bit (1,07 Mrd) 6/8 Bit

Max. Resolution Up to 3840 x 2160 pixel @60Hz (UHD) Up to 1920 x 1200 pixel

Dimming Support Analog and PWM Analog and PWM

Power 12/24V USB-PD (5 to 20 VDC)

Mechanical Dimensions

140 x 140mm 80 x 100mm

Special Features DDC/CI support, OSD keyboard or IR commanderUSB Type C Input (DP-signals with USB-PD), 1x USB 2.0 (external for e.g. keyboard/mouse), 1x USB 2.0 (internal for e.g. touch controller), 1x stereo audio out

Summary High-end board for UHD/4k displaysThe new cost effective "one cable solution" for compact & slim monitor designs

eMotion ST2:2/eMotion ST2:3 eMotion ST1:3

Input/s RGB/DVI on ST2:2, DP(1.1)/DVI-I on ST2:3 DP (1.1)/RGB/DVI

Display Support 2 channel LVDS interface 2 channel LVDS interface

Color Depth 6/8 Bit 6/8 Bit

Max. Resolution Up to 1920 x 1200 pixel Up to 1920 x 1200 pixel


Power 12/24V 12/24V


96 x 96mm 149.9 x 110mm

Special Features DDC/CI support, OSD via RS232DDC/CI support, OSD via RS232, large screen support, 24V->12V DC/DC converter for 12V backlight

Summary Entry level board with attractive price Midrange board, especially for large screen applications

eMotion ST5:3 eMotion ST3:4

Input/s DP (1.1)/RGB/DVI (via special connector) DP (1.2)/HDMI (1.4)/DVI/RGB/CVBS / YC

Display Support 2 channel LVDS interface 4 channel LVDS interface and DisplayPort output

Color Depth 6/8 Bit 8/10 Bit

Max. Resolution Up to 1920 x 1200 pixel Up to 2560 x 1600 pixel


Power 12/24V 5/12V


120 x 100 x 8.5mm 155 x 115mm

Special FeaturesDDC/CI support, OSD via RS232, low profile for special applications

DDC/CI support, OSD via RS232, IR option, onboard memory, DP daisy chaining, support for large screens and ambient light sensor, PIP, PBP, 10bit support, FRC (60->120Hz), up- /downscaling

SummaryEntry level board for low profile or DisplayPort only applications

High-end board for all possible requirements

LCD CONTROLLER BOARDS SINGLE BOARD COMPUTER

With the SBC form factor, especially designed for slim PPCs, DATA MODUL is standardizing ARM boards for the

first time, as these allow the slim implementation of particularly popular display formats such as 7’’, 10.1’’ 12’’

and 15.6’’. Standard kits, consisting of display, the easyTouch sensor, also developed by DATA MODUL, controller

and corresponding cabling, also only require short lead times.

With its 130mm x 80mm dimensions, this format offers 30% more room in width and thus allows more leeway for

interfaces than Pico-ITX. To be able to make use of the maximum installation space behind a 7’’ LCD, the height

was increased to 80 compared to the Pico-ITX of 72 mm. The assembly can reach the extremely low depth of max.

13 mm by using flat connectors, where the mating connectors are applied at the side. In this way, no installation

height is lost through the connection of the interfaces and the network cable bushing (RJ45) remains the highest

point of the assembly.

eDM-SBC-iMX6-PPC

Form factor 130 x 80 x 13 mm (DM Slim PPC-Format)

ProcessorNXP® i.MX6 Solo, Cortex A9 800 MHz, 1C, 512KB L2 Cache, GC880 NXP® i.MX6 DualLite, Cortex A9 800 MHz, 2C, 512KB L2 Cache, GC880 NXP® i.MX6 Dual, Cortex A9 800 MHz, 2C, 1MB L2 Cache, GC2000 NXP® i.MX6 Quad, Cortex A9 800 MHz, 4C, 1MB L2 Cache, GC2000

DRAM Onboard up to 2 GByte DDR3 (1066MT/s)

Mass storage Onboard eMMC up to 64GByte

GraphicsIntegrated Graphics Processing Unit with 2D, 3D Vector Graphics 1080p 30fps video decode and encode

Display interfaces1 x HDMI 1.4 (Micro-HDMI, Type D), 1 x Dual Channel 24 Bit LVDS for up to e.g. Full HD 1920 x 1080 Pixel

Operating Systems Linux (Yocto)

Ethernet Gigabit Ethernet Controller, 10/100/1000 Mbps with Texas Instruments DP83867IR PHY

I/O

4 x USB 2.0 (EHCI), 1 x USB OTG, 4 x UART, 1 x RS485 full-duplex (optional), 1 x Micro-SD card slot, 1 x SATA II (3Gb/s) on mPCIe Socket (only on Dual/Quad Version), 1 x PCIe 2.0 Lane on mPCIe Socket, 1 x SPI, 1 x I²C, 1 x PWM, 8 x GPIO, 2 x CAN with up to 1 Mbit/s (1 optional with isolated Transceiver), 1 x M.2 WLAN/Bluetooth module (optional), Intel Wireless-AC 8265

Power Supply VCC: 24V (+/-30%) , optional: +12 V (+/-5%)

Operating Systems Linux (Yocto) Kernel 4.9

Temperature Operating: -40°C to +85°C, Storage: -40°C to +85°C

Humidity Operating: < 80% RH non-condensing

Safety, Shock and Vibration Designed to meet EN60950, IEC/EN60068-2-27 and IEC/EN60068-2-6

ARM BASED SBC

13mm


conga-TS170 conga-TS370 conga-TCA5

Form factor COM Express Basic Type 6 COM Express Basic Type 6 COM Express Compact Type 6

Processor6th Gen. Intel® Core™ /Intel® Xeon® E3 processor

8th Gen. Intel® Core™ /Intel® Xeon® E3 processor

5th Gen. Intel® Atom™ processor family, Intel® Atom™ x7-E3950 2,0 GHz, Intel® Atom™ x5-E3940/E3930 1,8 GHz, Intel® Pentium® N4200 2,5 GHz, Intel® Celeron® N3350 2,4 GHz

Chipset Mobile Intel® 100 SeriesMobile Intel® PCH-H QM370 Series or CM246 Series for Intel Xeon Processor

Integrated in SoC

DRAM2x DDR4 SO-DIMMs up to 2133MT/s and 32 Gbyte

2x DDR4 SO-DIMMs up to 2666MT/s and 32 Gbyte / ECC optional

2 x DDR3L SO-DIMMs up to 1687MT/s and 8 Gbyte

Mass storage 4x SATA Gen 3 4x SATA Gen 32x SATA 3.0Up to 64 Gbyte eMMC onboard

Bus 8x PCIe Gen 3, LPC, I²C, 2x UART 8x PCIe Gen 3, LPC, I²C, 2x UART 5x PCIe, LPC, SPI, I²C, 2x UART

Ethernet 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT

I/O 8x USB 2.0, 4x USB 3.0 8x USB 2.0, 4x USB 3.1 8x USB 2.0, 4x USB 3.0

Panel Interface 3x DP 1.2/HDMI, LVDS 2x 24bit 3x DP 1.2 / HDMI, LVDS or eDP, VGA2x DP/HDMI, LVDS 2x24 bit, 1x eDP optional

Audio HD Audio HD Audio HD Audio

Others ACPI 4.0 with battery support ACPI 4.0 with battery supportACPI 5.0 with battery support, ext. temp. versions available

conga-B7AC conga-B7XD conga-MA5

Form factor COM Express Type 7 COM Express Type 7 COM Express Mini Type 10

ProcessorUp to Intel® Atom™ C3958 with 16 cores and 16MB Cache

Up to Intel® Xeon™ D1577 with 16 cores and 24MB Cache

5th Gen. Intel® Atom™ processor family

Chipset Integrated in SOC Integrated in SOC Integrated in SOC

DRAMUp to 3 SO-DIMM sockets for DDR4 memory modules up to 16GByte each

Up to 3 SO-DIMM sockets for DDR4 memory modules up to 16GByte each

Up to 8GByte DDR3L onboard

Mass storage 2x SATA 3.0 2x SATA 3.0 2x SATA 3.0, up to 64 GByte eMMC

Bus 4x PCIe, LPC, I²C, SMBus, SPI 3x PCIe, I²C, 2x UART, SMBus 3x/4x PCIe, I²C, 2x UART, SMBus

Ethernet 4x 10GbE 2x 10GbE, 1x Intel I210AT/IT GbE 10/100/1000BaseT

I/O 4x USB 2.0, 4x USB 3.0 4x USB 2.0, 2x USB 3.0 6x USB 2.0, 2x USB 3.0/2.0

Panel Interface n.a. n.a.LVDS 1x 18 bit/1x 24 bit or eDP, 1x DP/HDMI

Audio n.a. n.a. HD Audio

Others ACPI 5.0 with battery support ACPI 5.0 with battery support ACPI 5.0 with battery support

conga-QA5 conga-QMX8 conga-SMX8 conga-SA5

Form factor Qseven™ (70 x 70 mm) Qseven™ (70 x 70 mm) SMARC 2.0 (82 x 50 mm) SMARC 2.0 (82 x 50 mm)

Processor

5th Gen. Intel® Atom™ processor family, Intel® Atom™ x7-E3950 2,0 GHz , Intel® Atom™ x5-E3940/E3930 1,8 GHz, Intel® Pentium® N4200 2,5 GHz, Intel® Celeron® N3350 2,4 GHz

NXP i.MX8 ARM Cortex A72, Cortex A53 and M4F

NXP i.MX8 ARM Cortex A72, Cortex A53 and M4F

5th Gen. Intel® Atom™ processor family, Intel® Atom™ x7-E3950 2,0 GHz, Intel® Atom™ x5-E3940/E3930 1,8 GHz, Intel® Pentium® N4200 2,5 GHz, Intel® Celeron® N3350 2,4 GHz

Chipset Integrated in SOC Integrated in SOC Integrated in SOC Integrated in SOC

DRAM Up to 8 GByte DDR3 onboard Up to 8GByte LPDDR4 onboard Up to 8GByte LPDDR4 onboard Up to 8GByte LPDDR4 onboard

Mass storage2x SATA 3.0Up to 64 GByte eMMC onboard

1x SATA 3.0Up to 64 GByte eMMC 5.0 onboard

1x SATA 3.0 Up to 64 GByte eMMC 5.0 onboard

1x SATA 3.0,Up to 64 Gbyte eMMC onboard

Bus SPI, I²C, 1x PCIe, LPC SPI, I²C, 3x PCIe, CAN SPI, I²C, 3x PCIe 4x PCIe, 2x I²C, 2x SPI

Ethernet 10/100/1000BaseT 10/100/1000BaseT 10/100/1000BaseT 10/100/1000 BaseT

I/O 5x USB 2.0, 1x USB 3.0/2.0 5x USB 2.0, 1x USB 3.0 5x USB 2.0, 1x USB 3.0 4x USB 2.0, 2x USB 3.0

Panel InterfaceLVDS (single/dual channel) /eDPHDMI or DP

LVDS 2x24, HDMI or DP/eDP LVDS 2x24, HDMI or DP/eDPLVDS 2x24 /eDPHDMI or DP

Audio HD Audio I²S 2x I²S HD Audio / integrated Audio DSP

Others1x MIPI-CSI x4 /1x MIPI-CSI x2, smart battery management, ext. temp. versions available

Watchdog Timer, JTAG debug interface, high precision real time clock

1x MIPI-CSI x4 / 1x MIPI-CSI x2, ext. temp. versions available

1x MIPI-CSI x4 /1x MIPI-CSI x2, smart battery management, ext. temp. versions available

COMPUTER-ON-MODULE ADVANTAGES COMPARED TO FULL CUSTOM DESIGNS

CONCEPT

› CPU module with standard PC core

functions

› Carrier board with customer specific

functions & size

› Logical alternative to a chip-down

design effort

BENEFITS

› Faster time to market

› Reduced development costs

› Scalable product range

› Allows customer focus on system

features

› Faster reaction to market trends

› Second source philosophy

› Minimize inventory cost

COMPUTER-ON-MODULES


EFUS™/PICOCORE™ The new small “efus™” SOM product family with the latest scalable NXP® I.MX processors, offers solution for

every application.

ARMSTONE™ armStone™ SBC product family is the fastest way to start a project, an addition carrier board is not required.

efus™A9 efus™A9X efus™A7UL efus™A53LS

Form factor efus™ (47 x 62.1 mm)

OSAndroid, Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license

Android, Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license



ProcessorNXP® i.MX 6 Cortex-A9(Solo-/ DualLite/ Quad) upto 1.2 GHz

NXP® i.MX 6 Cortex-A9 SoloX max. 1.0 GHz and Cortex M4 200Mhz

NXP® i.MX 6 Cortex-A7 UltraLite max. 696 MHz

NXP® QorIQ®LS1012ACortex®-A53-800MHz (Layerscape)

DRAM Max. 2 GByte onboard Max. 2 GByte onboard Max. 1 GByte onboard 512MB onboard

Mass storageMax. 32 GByte eMMC, 1 GByteNAND, SATA

Max. 32 GByte eMMC, 1 GByteNAND

Max. 32GByte eMMC, 1 GByteNAND

64 MB QSPI NOR Flash

Ethernet 10/100/1000MBit 2x 10/100/1000MBit 2x 10/100/1000MBit 2 x 10/100/1000MBit

I/O2x CAN, 4x UART, 2x USB, I²C,2x SPI, PCIe

2x CAN, 4x UART, 2x USB, I²C,SPI

2x CAN, 4x UART, 2x USB, I²C,SPI

1x CAN, 1 x UART, 1x USB 3.0 OTG, 1 x PCIe, 1 x SATA, 1 x SDIO

GraphicsVivante GPU up to Full HD(1080p)

integrated up to 1280 x 1024WXGA

integrated up to 1280 x 1024WXGA

Panel Interface 18bit TTL-RGB, 2x24Bit LVDS 18bit TTL-RGB, 24Bit LVDS 18 bit TTL-RGB

Audio I²S I²S I²S

OthersTemp. 0°C to +70°(-20°C to +85°C)

Optional: IEEE802.11b/g/n,BT3.0, temp. 0°C to +70° (-20°C to +85°C)

Optional: IEEE802.11b/g/n,BT3.0, temp. 0°C to +70°(-20°C to +85°C)

Bluetooth 4.0, WLAN, temp. 0°C to +70°(-20°C to +85°C)

armStoneA5 armStoneA8 armStoneA9 armStoneA9r2

Form factor Pico-ITX (100 x 72 mm)

OS Linux or Win CE6, Win EC7,Win EC 2013 incl. runtime license

ProcessorNXP® Vybrid Cortex-A5 500 MHz/Cortex-M4 167 MHz

Samsung S5PV210 Cortex-A8 800 MHz 1.0 Ghz

NXP® i.MX 6 Cortex-A9 (Solo-/Dual-/Quad), 800 Mhz up to 1.0 GHz

NXP® i.MX 6 Cortex-A9 (Solo/ DualLite/QuadPlus) 1.0 GHz

DRAM Max. 1 GByte onboard Max. 1 GByte onboard Max. 4 GByte onboard Max. 4 GByte onboard

Mass storage Max. 512 MByte onboard Max. 512 MByte onboard Max.1 GByte NANDMax. 32 GByte eMMC, 1 GByte NAND

Ethernet 1-2 ETH 10/100 MBit 1-2 ETH 10/100 MBit 10/100/1000 MBit 10/100/1000 MBit

I/O1-2x CAN, 3x UART, 2x USB, I²C, SPI

1x CAN, 3x UART, 2x USB, I²C, SPI

1-2x CAN, 3x UART, 5x USB, I²C,SPI, mPCIe, SATA

2x CAN, 5x UART, 5x USB, I²C, SPI, mPCIe, SATA

GraphicsIntegrated up to 1024 x 768 pixel

Integrated up to Full HD (1080p)

Vivante GPU up to Full HD (1080p)

Vivante GPU up to Full HD (1080p)

Panel Interface

18 Bit TTL-RGB, 18Bit LVDS 18 Bit LVDS, HDMI18 Bit TTL-RGB, 2x 24Bit LVDS, HDMI

18 Bit TTL-RGB, 2x 24Bit LVDS, HDMI

Audio In/Out/Mic

OthersMax. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)

Max. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)

Max. 66 x GPIO, temp. 0°C to 70°C (-20°C to 85°C)

Bluetooth BT3.0 IEEE 802.11a/b/g/n

ARM BASED COM-MODULES

COLIBRI & APALIS The Colibri product family ARM® envelop currently twenty scalable boards from low power to high performance.

The latest SOM product family integrates high performance ARM® embedded processors from Nvidia®and NXP®.

ARM BASED COM-MODULES

Apalis T30 Apalis i.MX6 Apalis TK1 eDM-CB-Colibri

Form factor MXM3 (82.0 x 45.0 x 6.0 mm) MXM3 (82.0 x 45.0 x 6.0 mm) MXM3 (82.0 x 45.0 x 6.0 mm) Colibri form (115 x 76 mm)

OS Linux or Win EC7, Win EC 2013 Linux or Win EC7, Win EC 2013 Linux

ProcessorNVIDIA®Tegra 3 CortexA9 Quad-Core up to 1.4 GHz

NXP® i.MX 6 Cortex-A9 (Dual-/ Quad-Core) up to 1.0 GHz

NVIDIA®Tegra K1 CortexA15 Quad-Core up to 2.2 GHz

RAM 1 GByte/2 GByte RAM onboard512 MByte/1 GByte/2 GByte RAM onboard

2 GByte RAM onboard

Mass storage 4 GByte/8 GB eMMC flash onboard 4 GByte eMMC flash onboard 16 GByte eMMC flash onboard

Ethernet 10/100/1000 MBit 10/100/1000 MBit 10/100/1000 MBit

I/O2x CAN, 4x UART, 3x USB, 3x I²C, 2x SPI, PCIe, SATA, 4-wire res. touch

2x CAN, 5x UART, 5x USB, 3x I²C, 3x SPI, PCIe, SATA, 4-wire res. touch

2x CAN, 10x UART, 3x USB 3.0, 7x I²C, 5x SPI, 1 x USB 2.0, PCIe, 1 x SATA 2, 4-wire res. touch

3x USB 2.0 Type-A Host2x USB 2.0 Host Pin header, 1x USB OTG Micro, SPI, UART, PWM, GPIO, Analog Input, I2C, CAN, RS-485, RS-422

Graphics NVIDIA GPU up to Full HD (1080p) Vivante up to Full HD (1080p) NVIDIA GPU up to Ultra-HD (4k)

Panel Interface24 Bit TTL-RGB, 2x 24 Bit LVDS, VGA, HDMI

24 Bit TTL-RGB, 2x 24 Bit LVDS, VGA, HDMI

1 x 24 Bit LVDS, HDMI24 Bit TTL-RGB, 2x24Bit LVDS,HDMI, VGA

Audio In/Out/Mic

OthersMax. 127 GPIOs, 4x ADC, temp. 0°C to 70°C (-40°C to 85°C)

Max. 135 GPIOs, 4x ADC, temp. 0°C to 70° C (-40°C to 85°C)

Max. 92 GPIOs, 21 x AI (12Bit), temp. -20°C to 85°C

6 to 24 VDC

Colibri VF61 Colibri iMX7D/7S Colibri iMX6DL/6S Colibri T20

Form factor SO-DIMM, (67.6 x 36.7 mm)

OSLinux or Win CE6, Win EC7,Win EC 2013 incl. runtime license

Linux or Win EC7,Win EC 2013 incl. runtime license

Linux or Win EC7,Win EC 2013 incl. runtime license

Linux or Win CE6, Win EC7

ProcessorNXP® Vybrid™ ARM Cortex™-A5 500MHz, Cortex™-M4 167 MHz

NXP® i.MX 7Solo/Dual ARM Cortex™-A7800MHz/ 1.0GHz, Cortex™-M4 200MHz

NXP® i.MX6 Solo /I.MX6 DualLite, 1x Cortex-A9 1.0 GHz / 2x Cortex-A9 1.0 GHz

NVIDIA® Tegra 2 Cortex-A9 Dual 1.0 GHz

RAM 256 MByte DDR3256 MByte/512 MByte/1 GByte DDR3

512 MByte/256 MByte DDR3 512 MByte/256 MByte DDR3

Mass storage 512 MByte SLC NAND 512 MByte SLC NAND 4 GByte eMMC 512 MByte/1 GByte NAND

Touch interfaces

4-wire res. touch/I²C/USB/UART 4-wire res. touch/I²C/USB/ UART4-wire res. touch/I²C/USB/ UART

4-wire res. touch/I²C/USB/ UART

Ethernet 10/100Mbit IEEE1588 + 2nd RGMI 10/100Mbit IEEE1588 + 2nd RGMI 10/100 Mbit IEEE1588 10/100 Mbit

I/O2x CAN, 5x UART, 2x USB, 4x I²C, 17x PWM

2x CAN, UART, 2x USB, I²C, SPI, PWM

2x CAN, UART, 2x USB, I²C, SPI, PWM

5x UART, 2x USB, 2x I²C, 4x SPI, 4x PWM

Graphics2D acceleration max. 1024 x 768 pixel

2D acceleration max. 1920 x 1080 pixel

Vivante up to Full HD (1080p) Nvidia up to Full HD (1080p)

Panel Interface 24Bit TTL-RGB 24Bit TTL-RGB 24 Bit TTL-RGB, HDMI 24 Bit TTL-RGB, HDMI , VGA

Audio In/Out/Mic In/Out/Mic In/Out/Mic In/Out/Mic

OthersMax. 101 GPIOs, 2x analog input, 1x camera interface, temp. 0°C to 70°C (-20°C to 85° C)

External bus: 16 Bit temp. -20°C to 85°C

External Bus 32Bit, max 110 GPIOs, 4x ADC, temp. 0°C to +70° (-40°C to +85°C)

Max. 110 GPIOs, 4x analog input, temp. 0°C to 70°C (-20°C to 85°C)


3.5” SBC-210 MS-98F6 / MS-98G6 MS-98J8 ECM-APL

Form factor 3.5“

ProcessorIntel® Celeron® N2930 1.83 GHz / J1900 2.0 GHz

Intel® Celeron® N2930 1.83 GHz / J1900 2.0 GHz

Intel® Atom™ E3930/E3940 / Celeron® N3350 / Pentium N4200

Intel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)

Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated

DRAM max. 8 GByte DDR3L 1333 max. 8 GByte DDR3L 1333 max. 8 GByte DDR3L 1866 max. 8 GByte DDR3L 1866

Mass storage 2x SATA, 1x mSATA1x SATA 1x mSATA

1x SATA 1x mSATA

1x SATA, 1x M.2

Bus 2x Mini PCIe 2x Mini PCIe 1x Mini PCIe, 1x M.2 1x Mini PCIe, 1x M.2

Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT

I/O2x USB 3.0, 6 x USB 2.0, 4x COM"

1x USB 3.0, 7x USB 2.0, 6x COM



Panel Interface CRT/LVDS 2x24/HDMICRT/LVDS 2x24/HDMI (MS-98G6: DVI)

LVDS 2x24/HDMI/DP LVDS 2x24/2x HDMI

Audio HD Audio HD Audio with Amplifier HD Audio HD Audio

Others 8x GPIO 8x GPIO 8x GPIO8x GPIO, extended Temp. -40°C to +85°C (optional)

Power requirement 9 to 36 VDC 12 VDC / 19 VDC / 24 VDC 9 to 36 VDC 12 to 26 VDC

SINGLE BOARD COMPUTERS

Pico-ITX MS-98J6 MS-98I6 EPX-APL SOM-P101

Form factor Pico-ITX

ProcessorIntel® Celeron® J3455 (Apollo Lake)

Intel® Atom™ E3930/E3940/Celeron® N3350/ Pentium® N4200

Intel® Celeron® N3350/ Pentium® N4200

Intel® Celeron® N3350 / Pentium® N4200


DRAM max. 8 GByte DDR3L 1600 4 GByte DDR4 onboard max. 8 GByte DDR3L 1600 max. 8 GByte DDR3L 1600

Mass storage 1x SATA, 1x mSATA 1x SATA, 1x mSATA 1x SATA, 1x M.2 1x SATA, 1x mSATA

Bus 1x Mini PCIe, 1x M.2 2x Mini PCIe (one half-size) 2x M.2 1x Mini PCIe, 1x M.2

Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT Dual 10/100/1000BaseT 10/100/1000BaseT

I/O2x USB 3.0, 4x USB 2.0, 2x COM




Panel InterfaceLVDS 2x24/HDMI/ Mini-DP

LVDS 2x24/HDMI/ Mini-DP

LVDS 2x 24/HDMI/ DP

LVDS 2x 24/HDMI

Audio HD Audio HD Audio HD Audio with Amplifier HD Audio

Others 8x GPIO 16x GPIO, MIPI-CSI 8x GPIO 8x GPIO, MIOe Extension

Power requirement 12 VDC 12 VDC 12 VDC 12 VDC

Small-sized and fully-integrated single board computers with a wide range of performance levels.

3.5” MS-98E6 SBC-230(-WT) MS-98F3 MS-98H3

Form factor 3.5”

ProcessorIntel® Atom™ E3930/E3940/Celeron® N3350/Pentium® N4200

Intel® Atom™ E3930/E3940/E3950/Celeron® N3350/ Pentium® N4200"

Intel® Broadwell ULT, i3-5010U 2.1 GHz/ i5-5350U 1.8 GHz/ i7-5650U 2.2 GHz

Intel® Skylake/Kabylake ULT Celeron/i3/i5/i7 processors


DRAM max. 8 GByte DDR3L 1866 max. 16 GByte DDR3L 1866 max. 8 GByte DDR3L 1600 max. 16 GByte DDR4 2133

Mass storage 1x SATA, 1x mSATA 1x SATA, 1x mSATA 2x SATA, 1x mSATA 2x SATA, 1x mSATA

Bus 2x Mini PCIe 2x Mini PCIe 2x Mini PCIe (one half-size) 2x Mini PCIe






Panel Interface2x LVDS 2x24/eDP/ HDMI/DP

CRT/LVDS(eDP)/HDMI CRT or DP/LVDS 2x 24/HDMI eDP/LVDS/HDMI/DP

Audio HD Audio HD Audio HD Audio HD Audio

Others16x GPIO, extended temp. -40° to +85°C (optional), MIPI-CSI

8x GPIO, extended temp. (optional)

8x GPIO 16x GPIO, Nano SIM Holder

Power requirement 12 to 24 VDC 9 to 36 VDC 12 or 19 or 24 VDC 12 to 24 VDC

3.5” ECM-SKLU SBC-330 ECM-KBLH ECM-CFS

Form factor 3.5”

ProcessorIntel® Skylake ULT, i3-6100U 2.3 GHz/ i5-6300U 2.4 GHz/ i7-6600U 2.6 GHz

Intel® Skylake ULT, i3-6100U 2.3 GHz/ i5-6300U 2.4 GHz/ i7-6600U 2.6 GHz

Intel® Kabylake-H, i3-7100E 2.9 GHz/ i5-7440EQ 2.9 GHz/ i7-7820EQ 3.0 GHz

Intel® Coffee Lake (8th Gen.) Celeron/i3/i5/i7 processors

Chipset Intel® SoC integrated Intel® SoC integrated Intel® QM175 Express Intel® Q370 Express

DRAM max. 16 GByte DDR4 2133 max. 32 GByte DDR4 2133 max. 16 GByte DDR4 2400 max. 16 GByte DDR4 2400

Mass storage 1x SATA, 1x mSATA 2x SATA, 1x mSATA 2x SATA, 1x mSATA, 1x M.2 2x SATA, 1x mSATA

Bus 1x Mini PCIe, 1x M.2 2x Mini PCIe 1x Mini PCIe, 1x M.2 1x Mini PCIe






Graphics LVDS 2x 24/2x HDMI LVDS 2x 24/2x DP LVDS 2x 24/2x HDMI LVDS 2x 24/2x HDMI

Audio HD Audio HD Audio HD Audio HD Audio

Others 8x GPIO 8x GPIO 8x GPIO 8x GPIO

Power requirement 12 to 26 VDC 12 to 36 VDC 12 VDC 12 VDC


Mini-ITX MS-98J0 MS-9892 EMX-APLP IMB-159

Form factor Mini-ITX (170 x 170mm)

ProcessorIntel® Atom™ E3940/ Celeron® N3350

Intel® Atom™/Celeron®/ Pentium® SoC (Apollo Lake)

Intel® Celeron® N4200 (Apollo Lake)

Intel® Celeron® N4100 (Gemini Lake)


DRAM max. 8 GByte DDR3L 1866 Max. 16 GByte DDR3L 1866 Max. 16 GByte DDR3L 1866 max. 8 GByte DDR4 2400

Mass storage 1x SATA, 1x M.2 2x SATA, 1x mSATA2x SATA, 1x mSATA, SD card slot

1x SATA, 1x M.2

Bus 2x M.2, 1x PCIe x1 2x Mini PCIe, 1x PCIe x1 1x Mini PCIe, 1x M.21x Mini PCIe, 2x M.2, 1x PCIe x1






Panel interface LVDS 2x 24/HDMI/DP LVDS 2x 24/eDP/HDMI/DP LVDS 2x 24/HDMI/2x DP CRT/LVDS 2x 24/eDP/DP

Audio HD Audio with Amplifier HD audio with amplifier HD audio with amplifier HD Audio with Amplifier

Others 8x GPIO16x GPIO, ext. temp. -40° to 85° C (optional)

8x GPIO, eMMC (optional) 16x GPIO

Power requirement

12 VDC 12 to 24VDC 12 to 24 VDC 12 VDC or 19 to 28 VDC

Mini-ITX EMX-SKLUP MS-98J4 MS-98K1 IMB-1213

Form factor Mini-ITX (170 x 170mm)

ProcessorIntel® Skylake ULT, i3-6100U 2.3 GHz/i5-6300U 2.4 GHz/i7-6600U 2.6 GHz

Intel® Skylake/Kabylake ULT Celeron/i3/i5/i7 processors

Intel® Socket LGA1151 for 6th/7th Gen. I3/i5/i7 processors (Skylake/Kabylake-S)

Intel® Socket LGA1151 for 8th Gen. Celeron/i3/i5/i7 processors (Coffee Lake)

Chipset Intel® SoC integrated Intel® SoC integrated Intel® H110/Q170 Intel® Q370 Express

DRAM max. 32 GByte DDR4 2133 max. 32 GByte DDR4 2133 max. 32 GByte DDR4 2400 max. 32 GByte DDR4 2400

Mass storage 2x SATA, 1x M.2, SD Card 2x SATA, 1x mSATA, 1x M.2 2x SATA, 1x M.2 2x SATA, 1x M.2

Bus 2x M.2, 1x PCIe x12x Mini PCIe, 2x M.2, 1x PCIe x4

1x Mini PCIe, 1x PCIe x161x Mini PCIe, 1x M.2, 1x PCIe x16

Ethernet Dual 10/100/1000BaseT Dual 10/100/1000BaseT 2 or 4x 10/100/1000BaseT Dual 10/100/1000BaseT



max. 8x USB 3.0, max. 5x USB 2.0, 4x COM


Panel interface LVDS 2x 24/HDMI/DP2x LVDS 2x 24/2x HDMI/ 2x DP

LVDS/HDMI/DP/2xDVI 2xDVI"

LVDS 2x24/eDP/3xDP

Audio HD Audio with Amplifier HD Audio with Amplifier HD Audio with Amplifier HD Audio with Amplifier

Others 16x GPIO, SIM Card 8x GPIO 16x GPIO, Nano SIM Holder 8x GPIO, TPM, RAID Fun ction

Power requirement

12 to 24 VDC 12 to 24 VDC 12 to 24 VDC 12 VDC or 19 to 28 VDC

Embedded motherboards for industrial applications that require competitive pricing,

long-term support (5+ years), proven reliability and strict revision control.

Box PCs MS-9A89 MS-9A95 EMS-SKLU EPS-KBLHE

ProcessorIntel® Atom™ E3940/E3950 or Intel® Core i3-7100U (Kabylake ULT)

Intel® Kabylake ULT i3/i5/i7 processors

Intel® Skylake ULT, i3-6100U 2.3 GHz/i5-6300U 2.4 GHz/i7-6600U 2.6 GHz

Intel® Kabylake-H, i3-7100E 2.9 GHz/i5-7440EQ 2.9 GHz/i7-7820EQ 3.0 GHz

Chipset Intel® SoC integrated Intel® SoC integrated Intel® SoC integrated Intel® QM175 Express

DRAMmax. 8 GByte DDR3L or 16 GByte DDR4

max. 32 GByte DDR4 2133



Display1x HDMI, 1x DP, DVI/LVDS (optional)

1x DVI, 1x HDMI, 1x DP 1x DP 2x HDMI

External I/O2x LAN (4x LAN as option), 4x USB 3.0, 4x USB 2.0, 6x COM, 16x GPIO, Audio

2x LAN, 4x USB 3.0, 2x USB 2.0, 2x COM, Audio

2x LAN, 4x USB 3.0, 2x COM, Audio, 12x GPIO

2x LAN, 4x USB 3.0, 2x USB 2.0, 2x COM, Audio

Expansion interface 2x Mini PCIe 2x Mini PCIe, 1x M.2 1x Mini PCIe, 1x M.2 1x Mini PCIe, 1x M.2

Storage mSATA, 1x 2.5" Drive Bay mSATA, 1x 2.5" Drive Bay 1x M.2, 1x 2.5" Drive Bay 1x mSATA, 2x 2.5" Drive Bay

Power requirement 12 to 24 VDC 19 VDC 9 to 32 VDC 12 VDC

Dimension (W x H x D) 215 x 155 x 55 mm 196 x 285 x 29 mm 240 x 170 x 45 mm 250 x 220 x 60 mm

Weight 1.55 kg 2.45 kg 2.0 kg 4.5 kg

Operating temp. -10° to +60°C with SSD-10° to +40°C with HDD -10° to +50°C with SSD

-20° to +60°C with SSD -10° to +50°C with SSD

Fanless operation Yes Yes Yes Yes

MountingWall Mount, VESA Mount, DIN Rail Mount

Wall Mount, VESA Mount, DIN Rail Mount

Wall Mount, DIN Rail Mount Wall Mount

Options Wifi, 3G/4G, CAN Wifi, 3G/4GExpandable via IET Interface, Marine Certification

Wifi, 3G/4G, wide DC-input, TPM

Box PCs MS-9A65 MS-9A59 EPC-APL VMS-APL

ProcessorIntel® Celeron® J1900 2.0 GHz

Intel® Celeron® N3160Intel® Celeron® N3350/Pentium N4200

Intel® Atom™ E3930/E3940/E3950 / Celeron® N3350 / Pentium® N4200


DRAM max. 8 GByte DDR3L 1333 2 GByte DDR3L 1600 max. 8 GByte DDR3L 1866 max. 8 GByte DDR3L 1866

Display 1x HDMI, 1x DVI1x HDMI, 1x DP, (LVDS or DVI optional)

1x VGA, 2x HDMI 1x DP, 1x LVDS

External I/O2x LAN, 2x USB 2.0, 1x USB 3.0, 1x COM, Audio

1x LAN, 2x USB 2.0, 2x USB 3.0, 2x COM, Audio, GPIO

2x LAN, 4x USB 3.0, 1x COM2x LAN, 4x USB 3.0, 2x COM, 8x GPIO, Audio

Expansion interface 2x Mini PCIe 1x Mini PCIe 2x Mini PCIe2x Mini PCIe, Avalue IET Interface

Storage mSATA, 1x 2.5" Drive Bay mSATA, 1x 2.5" Drive Bay mSATA, 1x 2.5" Drive BayM.2, 1x 2.5" Drive Bay, SD Card

Power requirement 19 VDC 12 VDC 12 to 26 VDC 9 to 36 VDC

Dimension (W x H x D) 180 x 255 x 19 mm 155 x 105 x 55 mm 177 x 123 x 43.5 mm 239 x 186 x 62 mm

Weight 1.30 kg 0.9 kg 1.20 kg tbd

Operating temp.0° to +40°C with HDD -10° to +60°C with SSD

-10° to +45°C with HDD -10° to +55°C with SSD

0° to +45°C with HDD -10° to +50°C with SSD

-40 or 20°C to +70°C depending on CPU

Fanless operation Yes Yes Yes Yes

Mounting VESA MountVESA Mount, Wall Mount, DIN Rail

Stand, VESA Mount, DIN Rail Mount

Wall Mount

Options Wifi Wifi Wifi CAN, Wifi

EMBEDDED BOX PCSINDUSTRIAL MOTHERBOARDS

A L L T E C H N O LO G I E S . A L L CO M P E T E N C I E S . O N E S P E C I A L I S T.

www.data-modul.com

More information and worldwide locations can be found at

DATA MODUL AG

Landsberger Straße 322 DE-80687 Munich Phone: +49 89 56017 0

DATA MODUL WEIKERSHEIM GMBH

Lindenstraße 8 DE-97990 Weikersheim Phone: +49 7934 101 0

18

10

-1

embedded - amazon s3s3.amazonaws.com/.../data_modul/datamodul...web.pdf · 8 |...

Documents