electronics product manufacturing & software for dfm
TRANSCRIPT
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M2794.006900 D E S I G N F O R M A N U F A C T U R I N G
Week 13, November 30
Electronics Product Manufacturing
& Software for DFM
Fall 2017
Professor Sung-Hoon Ahn
Department of Mechanical and Aerospace Engineering
Seoul National University
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Electronics personal products
<Camera> <LCD display>
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Cell Phone
<LCD module> <Cell Phone exploded view>
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Electronic components
PRODUCTS
Computer
PCB
Analog Digital Hybrid
Transistors
Capacitors
Inductors
MECHANICAL ELECTRICAL/ELECTRONICS
Resistors
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Cathode Rays & the Discovery of the Electron
Basic question like the charge of the particles was
+ve or -ve remained undetermined until 19th
century.
Early research in electrical and magnetic
phenomena: 1600 to 1800
Invention of telephone : 1876
Invention of the light bulb : 1880
Invention of the radio: 1897. Electron was identified
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Semiconductor Era
First Transistor, AT&T Bell Labs, 1947
First Single Crystal Germanium, 1952
First Single Crystal Silicon, 1954
First IC device, TI, 1958
First IC product, Fairchild Camera, 1961
The first transistor, a point-contact Germanium device, was
invented at Bell Laboratories in 1947. This image shows a replica.
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Microprocessors & Microcomputers
Microprocessors invented (Intel): 1971
First commercial MPU (8080&6800): 1975
First personal computers: 1975
Apple & Radio Shack computers: 1977
IBM Personal Computer: 1981
IBM 5150 as of 1981
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1990s: Infopad
Designed to store short note
Based on the concept of a spiral notebook
Searchable and expandable
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Design flow levels of electronic components
The defined global function
of the device.
Sub-function ( coordinate
with the global function)
Assembly of these
subfunctions
The creation of specific
transistors and circuit layouts
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2010s
iPad/iPodGalaxy Tab
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Multi-scale robots
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Multi-scale Mass-deployable Cooperative Robot
Cooperative
Mass-deployableMulti-scale
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제어 및 군집 통신 기술
Internet
Fire detection
Fire detection
Finding!
Multi-scale Mass-deployable Cooperative Robot
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Multi-scale Robot
Small ScaleLarge Scale
motor motor
SMA
SMAMotor
+ SMA
motor
motor
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Multi-scale Mass-deployable Cooperative Robot (video)
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PCB Design & Manufacturing Process
Technical Needs
Conceptual Design
Circuit Drawing
PCB LayoutComponents
Assembly
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PCB Design Factors
PCB Design Factors
– Dimension of Board
– Dimension of each Components
– Connector Position
– Impedance matching
– Absolute Maximum Current(Power)
Needs from Customers
– Driving Voltage
– Driving Current
– Data Transfer Rate
– Sensors
– etc.
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Brief Design Concept of PCB
Robot Board Design
– Wireless Communication(High Speed)
– Motor Driver(DC-Motor, Step-Motor)
• Buck-Boost Converter(7.4V → 12V)
• Encoder for RPM Control
– 3-axis Gyroscope
– Indicating LED
– 8 channel SMA Driver
– Camera
– Board Outline
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Conceptual Design of PCB
Block Diagram of Functions of PCB
IndicatingLEDs
Motor Part
MCU(DSPic30F6014APT)
Wifi
DC- Motor(12V) x3
Step Motor(12V) x 2
H-Bridge(Motor
Driving IC)
Battery(Lo-Poly 7.4V)
Regulating IC(7.4V – 3.3V)
Buck-Boost IC(7.4V -> 12V)
Encoder(Hole Sensor)
x3
Low-PassFilter
8Ch SMA Driving Circuit(8 FET, 3A MAX)
IndicatingLEDs
UART
Sensor Ports
MCU(ARM cortex M-3)
Sensor Part
SMA Driving Part
Communication Part
Camera
PWM
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Components Selection
Design Factor of Components
– Size
• SMD, DIP, SO-8 etc.
– Absolute Maximum Values
• Maximum Voltage
• Maximum Current
• Etc.
– Heat dissipation
– Power Consumption
– Frequency characteristics
– Cost
– Delivery Time
– Etc.
Size of SMD(Surface-mount Device) Components
& DIP type Device
Absolute Maximum Ratings of LM741
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Circuit CAD Design
Circuit Examples (Motor Driver)
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Basic Process of PCB
1. Masking
2. Etching 3. Drilling
4. Plating For Via Hole 5. Demasking
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Design for Manufacturing in PCB
Basic Design Factors
– Clearance
• Track to Track
• Hole to Hole
• Hole to Track
– Hole Size
• Standard Holes
• 1mm, 2mm (o)
• 1.22mm (x)
– Track Width
• Current Limit
Track
Clearance
Track Width
Hole
Size
Layout of PCB
Hole misalignment
Moon, J. S. et al, 2014, "Effect of Backstitch Tool Path on Micro-drilling for Printed Circuit Board," Precision Engineering - Journal of the International Societies for Precision Engineering
and Nanotechnology
Method of measuring the positioning errors for the drilled holes
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Design for Manufacturing in PCB (cont.)
PCB Design Factors
– Plating Materials
• Gold
• Silver
• Lead
• Etc.
– Copper Film Thickness
• 0.5OZ (18μm)
• 1OZ (35μm)
• 2OZ (70μm)
Cross Section of PCB
Via Hole
Copper Film
Thickness
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PCB Design Guidance (example)
DC, AC, Peak VoltageWith Protection Layer Without Protection Layer
Minimum Clearance(mm) Minimum Clearance (mm)
0~30 0.25 0.65
31~50 0.4 0.65
51~150 0.5 0.65
151~330 0.75 1.3
301~530 1.5 2.5
Over 500 0.003 mm/V 0.005 mm/V
■ Absolute Maximum Voltage & Minimum clearance
Track Width (mm) Amps(A)
0.4 1.0
0.6 1.4
0.8 1.8
1.0 2.2
1.5 3.0
2.0 3.4
3.0 3.8
■ Absolute Maximum Current & Track Width ( Copper Film Thickness = 1OZ )
※Note : This Guidance follows HANSAEM DIGITEC Inc.
It is strongly recommended to check the specification of PCB for each company.
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PCB Layup Design
Motor Connector
Functional
Connector
Power Connector
LED ConnectorsSMA Power
Connector
SMA Driver
Connector
PCB Layout Examples
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SMT(Surface Mounting Technology)
PCB Assembly Process, WILSON PROCESS SYSTEMS
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Final Product
Camera
Communication
Antenna
Connector for Motor
Connector
for SMA
3-axis gyro sensor
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Deformable Wheel Robot
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Flexible Display
2013 Samsung Flexible OLED Phone and Tab Concept
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Design for Foldable Structure (Chair)
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Design for Foldable Structure (cont.)
Designed by
Eduard Bohtlink (1986-95)
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Design for Foldable Structure (Bicycle)
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Design for Foldable Structure (Keyboard)
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Design for Foldable Structure (Airplane)
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Attachment, Wire Bonding and Packaging
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Semiconductor Manufacturing
1. Crystal growth and wafer production
2. Oxidation: SiO2 is produced by
heating the wafer to very high temp.
3. Photolithography: Circuit patters are
formed Photolithography
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Semiconductor manufacturing (contd.)
4. Doping: The n+ and p+ dopants are added by ion
implantation.
5. Chemical Vapor Deposition
6. Interconnect creation
7. Testing and packaging
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Chipmaking Processes
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Chipmaking Processes
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Geometry of Transistor in a chip
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Chemical Mechanical Polishing (CMP)
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Chip Manufacturing (video)
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LIGA
LIGA is a German acronym for Lithographie,
Glavankformung, Abfomung (Lithography,
Electroplating and Molding) that describes a
fabrication technology used to create high-
aspect-ratio microstructures.
http://en.wikipedia.org/wiki/File:LIGA-Doppelumlenksystem.jpg
The X-ray LIGA process was originally developed to produce
nozzles for uranium enrichment.
(a) exposure
(b) Development
(c) Electroforming
(d) Stripping
(e) Replication
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Transistors per Microprocessor
http://www.singularity.com/charts/page63.html
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Moore’s Law
http://en.wikipedia.org/wiki/Moore's_law*FinFET (fin field effect transistor, 3-D Tri-Gate transistor form)
1,000
100
10
1
10 nm ?
Sca
le (n
m)
1971 1980 1990 2000 2010
Date of Introduction
2020Roadmap for miniaturization
2015
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3D transistor
FinFET (fin field effect transistor, 3-D Tri-Gate transistor form)
Intel, http://www.youtube.com/watch?v=YIkMaQJSyP8
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Commercial Silicon Wafers
Wafer (substrate for microelectronic): a thin slice of semiconductor material
used in the fabrication of integrated circuits and other micro devices
1950 1960 1970 1980 1990 2000 2010 2020
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From Design to Manufacturing
Now we are in the Manufacturing domain
Design domain:
How to create geometry
Manufacturing domain:
How to make part
Need to consider
• Manufacturing process
• Material
• Machine
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Computer-Aided Manufacturing (CAM)
Definition
– The technology concerned with the use of computer
systems to plan, manage, and control manufacturing
operations through either direct or indirect computer
interface with the plant’s production resources.
< Main Phases of discrete part manufacturing >
Design
Result
Process Planning- Operation selection
- Operation sequencing
- Design and procurement of
tooling and jigs/fixtures
- Order material
Production
- NC programming
Quality
ControlPackaging Shipping
Manufacturing Process
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CAM Software
NC software
– NC is a system in which actions are controlled by direct insertion of
numerical data at some point. The system must automatically interpret
at least some portion of this data
- Electronic Industries Association (EIA)
– Computer Numerical Control (CNC)
Robot programming software
– Selecting and positioning tools and work-pieces for NC machines
Hyundai factory BMW factory
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CAM Software (cont.)
Process planning software
– The act of preparing detailed work instructions to machine or assemble
a part of parts
- Computer-Aided Manufacturing, Chang et al., 1998
– Process plan; operation sheet; route sheet
– Computer-Aided Process Planning (CAPP)
Inspection software
– Coordinate Measuring Machine (CMM)
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Problems in Traditional Production
Some barriers Between design and
manufacturing process
Design
Knowledge
Over the Wall
Manufacturing
Manufacturing
Time lost in
trial and error
Isolated
< Diagram of tradition design and manufacturing process >
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CAD/CAM Integration
Goal of integration
– To facilitate coordination of work and information flow
across organizational boundaries – “Enterprise Integration Modeling”, Charles J. Petrie, The MIT Press
< Example concept of CAD/CAM integration >
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Integration in Product Cycle Level
Design
Need
Design
Spesifications
Feasibility Study with
Collecting Design Information
Design
Documentation
Design
Evaluation
Design
Optimization
Design
Analysis
Analysis
Model
Design
Conceptuali-
zation
Process
PlanningProduction
Planning
Design and
Procurement of
New Tools
Order Material
NC, CNC, DNC
Programming
ProducttionQuality
ControlPackaging Shipping
Marketing
MANUFACTURING PROCESS
Analysis
SynthesisDESIGN PROCESS
CAD + CAE
CAM
CAD CAE CAM
Product Data Management Product Lifecycle ManagementEnterprise Resource Planning
SupplierCustomer
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Integration in Database Level
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Integration in Commercial Package Level
Integrated CAD/CAE/CAM/PDM/…
All in one package
– Dassult systems: CATIA, DELMIA, INOVIA…
SolidWorks, CosmosWorks…
– PTC: Pro/Engineering, Windchill…
– UGS: Unigraphics, Teamcenter, Technomatix…
DESIGN-MANUFACTURING-SHOPFLOOR
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Coupling Modes in Integration
There are 3 types of coupling modes between
design and manufacturing
Coupling
ModePros Cons Example
Loose/
RepetitiveFlexible design
Cost & delay for
redesign
Conventional
CAD/CAM
Stiff/
One-wayGuaranteed Manufacturing Less design freedom
CyberCut,
MOSIS
Strong/
Bidirectional
Moderately flexible design,
guaranteed manufacturing
Some loss of design
freedom
SmartLite,
SmartFab
Reference: Ahn, S. H., McMains, S., Sequin, C. S., and Paul K. Wright*, 2002, "Mechanical Implementation Services for
Rapid Prototyping," Journal of Engineering Manufacture, Proceedings of the Institution of Mechanical Engineers Part B,
Short Communications in Manufacture and Design, Vol. 216, pp. 1193-1199, August (SCI, 0.281).
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Example Solutions of Stiff mode
CyberCut paradigm
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Manufacturing Advisory Service (MAS)
http://dfm.snu.ac.kr/mas/index.html
Charles Smith, 1999, "The Manufacturing Advisory Service: Web Based Process and Material Selection," Ph.D. thesis, UC Berkeley.
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Example Solutions of Stiff mode (cont.)
CyberCut – Feature 1. WebCAD
Ahn, S. H., Sundararajan, V., Smith, C. E., Kannan, B., D’Souza, R., Sun, G., Kim, J., McMains, S., Smith, J., Mohole, A., Sequin, C. H., and
Wright, P. K., 2001, "CyberCut : An Internet Based CAD/CAM System," ASME Journal of Computing and Information Science in Engineering,
1, pp. 52-59.
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Example Solutions of Stiff mode (cont.)
CyberCut – Feature 2. Automated Process
Planning
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Example Solutions of Stiff mode (cont.)
CyberCut – Network communication
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Example Solutions of Stiff mode (cont.)
CyberCut – Feature 3. Universal fixture
Ahn, S. H. and Paul K. Wright, 2002, "Reference Free Part Encapsulation (RFPE): An Investigation of Material Properties and the
Role of RFPE in a Taxonomy of Fixturing Systems," Journal of Manufacturing Systems, Society of Manufacturing Engineers, Vol. 21,
No. 2, pp. 101-110, November (SCIE).
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Example Solutions of Stiff mode (cont.)
CyberCut – Fabricated parts
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Web-based CAD/CAM Integration
Micro Machining System (MIMS)
– Micro machining service using the internet
– Communication with 3-tier client-server model
– Upload STL file
< Communication architecture > < Curve-based approaches >
Ahn, S. H.*, Kim, Dong-Soo, Chu, W. S., and Jun, Cha-Soo, 2005, "MIMS: Web-based Micro Machining Service," International
Journal of Computer Integrated Manufacturing, Taylor & Francis Ltd. (England), Vol. 18, No. 4, pp. 251-259, June (SCIE, IF 0.722,
DOI: 10.1080/09511920400030187, ISSN: 0951-192X).
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Micro Machining System (MIMS)
– Provide the NC code viewer
– Fabricated by micro-endmill according to scanning
and pencil-cut toolpath
Web-based CAD/CAM Integration (cont.)
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Web-based CAD/CAM Integration (cont.)
SmartFab
– Micro machining using SolidWorks
*CNC: Computer Numerical Control
*DFM: Design for Manufacturing
Micro *CNC
: Internet
: Local Network
2nd Tier Fab.3rd Tier
PolyCAM
Micro Fab.
Data base
1st Tier
CAD
Software
CAD API*DFM
Module
Tool/Material information
Design check
NC codes
Cost estimation
Machining
Plan
STL ModelWeb
Browser
NC Code
Generation
Cost
Estimation
Web
Server
< Architecture of SmartFab >
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Web-based CAD/CAM Integration (cont.)
SmartFab – Sketch validation
– Improve machinability
– Based on the tool information and DFM philosophy
< Check for minimum Gap > < Check for fillet >
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Web-based CAD/CAM Integration (cont.)
SmartFab – Pocket validation
Case I. Depth limit Case II. Depth limit and initial depth
Initial
depthStock
heightLimit of
depth
Limit of depth <
stock height – initial depth
For Multiple Pocketing:
< DFM in pocketing >
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Web-based CAD/CAM Integration (cont.)
SmartFab – Cost estimation
Cp = Tp*W Tp: Preparation time (0.35 hr)
W : Operator’s wage (2500/hr)
Cm = Com+Ct = Tm*W+Ct
Tm: Machining time (0.41 hr)
W: Operator’s wage (2500/hr)
Ct = y*(Tm/T) (11,275 won, 92% of total cost)
Ct: Tool usage cost
T: Tool life (4 hr)
y: tool cost (100,000)
20
875
11275
0
12170
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Manufacturing Advisory Service (MAS)
Concept level manufacturing and
Material selection tool
– For educating designers
– Informing experienced designers about new tech
Enquires about
Batch size
Typical tolerances
Size
Overall shape
Cost requirements
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Concurrent Engineering
Electrical &
Integrated
Circuit Design
Material &
Manufacturing
Process Selection
Heat Survey &
Cooling Method
Selection
Concurrent
Engineering
Computer
Aided
Design
Design of
Experiments
& Thermal
Simulation
Rapid
PrototypingFinal Design Fabrication
DUCADE, Domain Unified CAD Environment, is a
web enabled collaborative management system that
aids the concurrent design process of electronic
printed circuit boards and mechanical enclosures
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DUCADE
Tracks couplings between mechanical and electrical
features over the life cycle of the product
Gives feedback to designers when feature properties
(size, location, etc.) are altered and coupling criteria
are violated
Compiles history of design changes from both
domains
Electrical &
Integrated
Circuit Design
Material &
Manufacturing
Process Selection
Heat Survey &
Cooling Method
Selection
Concurrent
Engineering
Computer
Aided
Design
Design of
Experiments
& Thermal
Simulation
Rapid
PrototypingFinal Design Fabrication
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Example (Google glass)
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BEE Couplings
Thermal constraintMichael Montero, 2004, "A proposed methodology for the design of electronic-mechanical products," Ph.D. thesis, UC Berkeley.
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Design of Experiments Testbed (DOET)
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Rapid Prototyping
Clearance and fit between electrical components and
mechanical package can be verifed
Functionality and structural strength of package can also
be tested
Electrical &
Integrated
Circuit Design
Material &
Manufacturing
Process Selection
Heat Survey &
Cooling Method
Selection
Concurrent
Engineering
Computer
Aided
Design
Design of
Experiments
& Thermal
Simulation
Rapid
PrototypingFinal Design Fabrication
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Final design and Fabrication
Electrical &
Integrated
Circuit Design
Material &
Manufacturing
Process Selection
Heat Survey &
Cooling Method
Selection
Concurrent
Engineering
Computer
Aided
Design
Design of
Experiments
& Thermal
Simulation
Rapid
PrototypingFinal Design Fabrication
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Broad Integration
PDM (Product Data Management)
– Control CAD file revisions
– Manage all data related to project
PLM (Product Life-cycle Management)
– Product Development Management (PDM)
– Include all actors (company departments, business
partners, suppliers, OEM, and customers)
– Share product data
– Apply common processes
– Leverage corporate knowledge
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Data Exchange
Standard formats for data exchange
– IGES (Initial Graphics Exchange Specification)
• 3D CAD data
– STEP (Standard for the Exchange of Product model data)
– DFX (Drawing eXchange Format)
• 2D drawing data
– STL (Stereo Lithography)
• De facto standard in rapid prototyping
– VRML (Virtual Reality Modeling Language)
• 3D model on web
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Data Exchange (cont.)
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Smart Factory (Manufacturing)
Source: MOXA (http://www.moxa.com/Event/DAC/2013/Factory_Automation_IO/index.htm)
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Smart Factory (Manufacturing)
https://www.youtube.com/watch?v=9R_P8FpslBY
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Business Plan
Introduction
Mission Statement
Product Use and Market Introduction
VDM Product Description
Overview
Detailed Drawings
Design for Manufacturability
Scuba Diving Market
Economics
Demographics
Existing ProductVDM: Venus Dive Monitor
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Business Plan (cont.)
Manufacturing & Marketing
Strategy and Cost Estimates
VDM Prototypes Costs
Personnel
Overhead Costs
Prototype Production Costs
Financial Scenarios (Expected return etc.)
Appendix (Part Assembly drawings etc.)
http://www.theequitykicker.com/2007/02/28/uncertainty-and-the-need-to-plan/
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Business plan (example of VDM)
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Business plan (example of VDM)
VDM Product
Description
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Business plan (example of VDM)
Scuba Diving
Market
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Business plan (example of VDM)
Manufacturing &
Marketing
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Business plan (example of VDM)
VDM Prototypes Costs
Personnel Overhead Costs
Prototype Production Costs
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Business plan (example of VDM)
Financial Scenarios
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Business plan (example of VDM)
Financial Scenarios
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Business plan (example of VDM)
Financial Scenarios
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Design for Manufacturing Award
Award to the Best Team!!!
No money, but Honor!
You CAN do it!You CAN do it!