electronics - dzsc.com

93
DVD PLAYER DVD- 739 SERVICE 1. Precautions 2. Reference Information 3. Product Specification 4. Operating Instructions 5. Disassembly and Reassembly 6. Circuit Descriptions 7. Troubleshooting 8. Exploded Views and Parts List 9. Electrical Parts List 10. Block Diagram 11. PCB Diagrams 12. Wiring Diagram 13. Schematic Diagrams Manual DVD PLAYER CONTENTS SERVICE MANUAL DVD-739 OPEN/ CLOSE STANDBY OPEN/ CLOSE 24bit 96kHz AUDIO D/A CONVERTER SPATIALIZER N-2-2 POWER SKIP ELECTRONICS © Samsung Electronics Co., Ltd. JUN. 1999 Printed in Korea AH68-00180A

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Page 1: ELECTRONICS - dzsc.com

DVD PLAYERDVD-739

SERVICE 1. Precautions

2. Reference Information

3. Product Specification

4. Operating Instructions

5. Disassembly and Reassembly

6. Circuit Descriptions

7. Troubleshooting

8. Exploded Views and Parts List

9. Electrical Parts List

10. Block Diagram

11. PCB Diagrams

12. Wiring Diagram

13. Schematic Diagrams

Manual

DVD PLAYER CONTENTS

SERVICE MA

NU

AL

DVD

-739OPEN/CLOSE

STANDBY

OPEN/CLOSE

24bit 96kHz AUDIO D/A CONVERTERDIGITAL VIDEO

SPATIALIZERN-2-2

POWER

SKIP

ELECTRONICS

© Samsung Electronics Co., Ltd. JUN. 1999Printed in KoreaAH68-00180A

Page 2: ELECTRONICS - dzsc.com

Samsung Electronics 1-1

1. Precautions

1-1 Safety Precautions

1) Before returning an instrument to the customer,always make a safety check of the entire instrument,including, but not limited to, the following items:

(1) Be sure that no built-in protective devices aredefective or have been defeated during servicing.(1)Protective shields are provided to protect boththe technician and the customer. Correctly replaceall missing protective shields, including anyremove for servicing convenience. (2)When reinstalling the chassis and/or other as-sembly in the cabinet, be sure to put back in placeall protective devices, including, but not limited to,nonmetallic control knobs, insulating fish papers,adjustment and compartment covers/shields, andisolation resistor/capacitor networks. Do not oper-ate this instrument or permit it to be operated with-out all protective devices correctly installed andfunctioning.

(2) Be sure that there are no cabinet openings throughwhich adults or children might be able to inserttheir fingers and contact a hazardous voltage. Suchopenings include, but are not limited to, excessive-ly wide cabinet ventilation slots, and an improper-ly fitted and/or incorrectly secured cabinet backcover.

(3) Leakage Current Hot Check-With the instrumentcompletely reassembled, plug the AC line corddirectly into a 120V AC outlet. (Do not use a isola-tion transformer during this test.) Use a leakagecurrent tester or a metering system that complieswith American National Standards institute (ANSI)C101.1 Leakage Current for Appliances andUnderwriters Laboratories (UL) 1270 (40.7). Withthe instrumentÕs AC switch first in the ON positionand then in the OFF position, measure from aknown earth ground (metal water pipe, conduit,etc.) to all exposed metal parts of the instrument(antennas, handle brackets, metal cabinets, screw-heads, metallic overlays, control shafts, etc.), espe-cially any exposed metal parts that offer an electri-cal return path to the chassis. Any current measured must not exceed 0.5mA.Reverse the instrument power cord plug in the out-let and repeat the test. See Fig. 1-1.

Any measurements not within the limits specifiedherein indicate a potential shock hazard that mustbe eliminated before returning the instrument tothe customer.

Fig. 1-1 AC Leakage Test

(4) Insulation Resistance Test Cold Check-(1) Unplugthe power supply cord and connect a jumper wirebetween the two prongs of the plug. (2) Turn on thepower switch of the instrument. (3) Measure theresistance with an ohmmeter between thejumpered AC plug and all exposed metallic cabinetparts on the instrument, such as screwheads,antenna, control shafts, handle brackets, etc. Whenan exposed metallic part has a return path to thechassis, the reading should be between 1 and 5.2megohm. When there is no return path to the chas-sis, the reading must be infinite. If the reading isnot within the limits specified, there is the possibil-ity of a shock hazard, and the instrument must bere-pared and rechecked before it is returned to thecustomer. See Fig. 1-2.

Fig. 1-2 Insulation Resistance Test

DEVICEUNDERTEST

(READING SHOULDNOT BE ABOVE

0.5mA)LEAKAGECURRENTTESTER

EARTHGROUND

TEST ALLEXPOSED METER

SURFACES

ALSO TEST WITHPLUG REVERSED

(USING AC ADAPTERPLUG AS REQUIRED)

2-WIRE CORD

AntennaTerminal

ExposedMelal Part

ohmohmmeter

Page 3: ELECTRONICS - dzsc.com

Precautions

1-2 Samsung Electronics

2) Read and comply with all caution and safety re-lated notes non or inside the cabinet, or on the chas-sis.

3) Design Alteration Warning-Do not alter of add tothe mechanical or electrical design of this instru-ment. Design alterations and additions, includingbut not limited to, circuit modifications and theaddition of items such as auxiliary audio outputconnections, might alter the safety characteristics ofthis instrument and create a hazard to the user. Anydesign alterations or additions will make you, theservice, responsible for personal injury or propertydamage resulting therefrom.

4) Observe original lead dress. Take extra care toassure correct lead dress in the following areas:(1) near sharp edges, (2) near thermally hot parts (besure that leads and components do not touch ther-mally hot parts), (3) the AC supply, (4) high voltage,and (5) antenna wiring. Always inspect in all areasfor pinched, out-of-place, or frayed wiring, Do notchange spacing between a component and theprinted-circuit board. Check the AC power cord fordamage.

5) Components, parts, and/or wiring that appear tohave overheated or that are otherwise damagedshould be replaced with components, parts and/ orwiring that meet original specifications. Additionally, determine the cause of overheatingand/or damage and, if necessary, take correctiveaction to remove any potential safety hazard.

6) Product Safety Notice-Some electrical and mechani-cal parts have special safety-related characteristicswhich are often not evident from visual inspection,nor can the protection they give necessarily beobtained by replacing them with components ratedfor higher voltage, wattage, etc. Parts that have spe-cial safety characteristics are identified by shading,an ( )or a ( )on schematics and parts lists. Useof a substitute replacement that does not have thesame safety characteristics as the recommendedreplacement part might created shock, fire and/orother hazards. Product safety is under review con-tinuously and new instructions are issued whenev-er appropriate.

Page 4: ELECTRONICS - dzsc.com

Precautions

Samsung Electronics 1-3

1-2 Servicing Precautions

CAUTION : Before servicing Instruments coveredby this service manual and its supplements, read andfollow the Safety Precautions section of this manual.

Note : If unforseen circument create conflict betweenthe following servicing precautions and any of thesafety precautions, always follow the safety precau-tions. Remember: Safety First.

1-2-1 General Servicing Precautions

(1) a. Always unplug the instrumentÕs AC power cordfrom the AC power source before (1) re-movingor reinstalling any component, circuit board,module or any other instrument assembly, (2)disconnecting any instrument electrical plug orother electrical connection, (3) connecting a testsubstitute in parallel with an electrolytic capaci-tor in the instrument.

b. Do not defeat any plug/socket B+ voltage inter-locks with which instruments covered by thisservice manual might be equipped.

c. Do not apply AC power to this instrument and/or any of its electrical assemblies unless allsolid-state device heat sinks are correctly in-stalled.

d. Always connect a test instrumentÕs ground leadto the instrument chassis ground before connect-ing the test instrument positive lead. Alwaysremove the test instrument ground lead last.

Note : Refer to the Safety Precautions section groundlead last.

(2) The service precautions are indicated or printed onthe cabinet, chassis or components. When servic-ing, follow the printed or indicated service precau-tions and service materials.

(3) The components used in the unit have a specifiedflame resistance and dielectric strength.When replacing components, use componentswhich have the same ratings. Components i-enti-fied by shading, by( ) or by ( ) in the circuit dia-gram are important for safety or for the characteris-tics of the unit. Always replace them with the exactreplacement components.

(4) An insulation tube or tape is sometimes used andsome components are raised above the printedwiring board for safety. The internal wiring issometimes clamped to prevent contact with heat-ing components. Install such elements as theywere.

(5) After servicing, always check that the removedscrews, components, and wiring have been in-stalled correctly and that the portion around theserviced part has not been damaged and so on.Further, check the insulation between the blades ofthe attachment plug and accessible conductiveparts.

1-2-2 Insulation Checking Procedure

Disconnect the attachment plug from the AC outletand turn the power ON. Connect the insulation resi-stance meter (500V) to the blades of the attachmentplug. The insulation resistance between each blade ofthe attachment plug and accessible conductiveparts(see note) should be more than 1 Megohm.

Note : Accessible conductive parts include metal pan-els, input terminals, earphone jacks, etc.

Page 5: ELECTRONICS - dzsc.com

Precautions

1-4 Samsung Electronics

1-3 ESD Precautions

Electrostatically Sensitive Devices (ESD)

Some semiconductor (solid state) devices can be dam-aged easily by static electricity.Such components commonly are called Electrostati-cally Sensitive Devices(ESD). Examples of typical ESDdevices are integrated circuits and some field-effecttransistors and semiconductor chip components. Thefollowing techniques should be used to help reducethe incidence of component damage caused by staticelectricity.

(1) Immediately before handling any semiconductorcomponent or semiconductor-equipped assembly,drain off any electrostatic charge on your body bytouching a known earth ground. Alternatively,obtain and wear a commercially available dis-charging wrist strap device, which should beremoved for potential shock reasons prior to apply-ing power to the unit under test.

(2) After removing an electrical assembly equippedwith ESD devices, place the assembly on a conduc-tive surface such as aluminum foil, to prevent elec-trostatic charge buildup or exposure of the assem-bly.

(3) Use only a grounded-tip soldering iron to solder orunsolder ESD devices.

(4) Use only an anti-static solder removal devices.Some solder removal devices not classified asÒanti-staticÓ can generate electrical charges suffi-cient to damage ESD devices.

(5) Do not use freon-propelled chemicals. These cangenerate electrical charges sufficient to damageESD devices.

(6) Do not remove a replacement ESD device from itsprotective package until immediately before yourare ready to install it.(Most replacement ESDdevices are packaged with leads electrically short-ed together by conductive foam, aluminum foil orcomparable conductive materials).

(7) Immediately before removing the protective ma-terials from the leads of a replacement ESD device,touch the protective material to the chassis or cir-cuit assembly into which the device will beinstalled.

CAUTION : Be sure no power is applied to the ch-assis or circuit, and observe all other safety precau-tions.

(8) Minimize bodily motions when handling unpack-aged replacement ESD devices. (Otherwise harm-less motion such as the brushing together of yourclothes fabric or the lifting of your foot from a car-peted floor can generate static electricity sufficientto damage an ESD device).

Page 6: ELECTRONICS - dzsc.com

Precautions

Samsung Electronics 1-5

1-4 Handling the optical pick-up

The laser diode in the optical pick up may suffer elec-trostatic breakdown because of potential static elec-tricity from clothing and your body.

The following method is recommended.(1) Place a conductive sheet on the work bench (The

black sheet used for wrapping repair parts.)

(2) Place the set on the conductive sheet so that thechassis is grounded to the sheet.

(3) Place your hands on the conductive sheet(Thisgives them the same ground as the sheet.)

(4) Remove the optical pick up block

(5) Perform work on top of the conductive sheet. Becareful not to let your clothes or any other staticsources to touch the unit.

3 Be sure to put on a wrist strap grounded to thesheet.

3 Be sure to lay a conductive sheet made of copper etc.Which is grounded to the table.

Fig.1-3

(6) Short the short terminal on the PCB, which is in-side the Pick-Up ASSÕY, before replacing the Pick-Up. (The short terminal is shorted when the Pick-Up AssÕy is being lifted or moved.)

(7) After replacing the Pick-up, open the short termi-nal on the PCB.

THE UNIT

WRIST-STRAPFOR GROUNDING

1M

1MCONDUCTIVE SHEET

Page 7: ELECTRONICS - dzsc.com

Precautions

1-6 Samsung Electronics

1-5 Pick-up disassembly and reassembly

1-5-1 Disassembly

1) Remove the power cable.2) Switch LD SW3 on deck PCB to ÒOFFÓ before

removing the FPC ( Inserted into Main PCB CN6. See Fig. 1-4)

3) Disassemble the deck.4) Disassemble the deck PCB.

1-5-2 Assembly

1) Replace the Pick-up.2) Assemble the deck PCB.3) Reassemble the deck.4) Switch LD SW3 on Deck PCB to ÒONÓ and insert

FPC into Main PCB CN6 (See Fig 1-4).

SW3

ONOFF

FPC

Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.

Fig. 1-4

Page 8: ELECTRONICS - dzsc.com

Samsung Electronics 2-1

2. Reference Information

2-1 IC Dsecriptions

2-1-1 AIC1 (AK4324 ; Digital-to-Analog Converter)

Serial InputInterface

De-emphasisControl

8XInterpolator

8XInterpolator

∆ ∑Modulator

SCF

SCF∆ ∑Modulator

Clock Divider

DIF0 DIF1 DIF2 DEM0 DEM1 AVDD AVSS

VREFDVSSDVDDCKSMCLK

LRCKBICK

SDATA

SMUTE

DFS

DZFL

AOUTL+

AOUTL-

AOUTR+

AOUTR-

DZFR

PD

NAME

DVSS

DVDD

CKS

MCLK

BICK

SDATA

PD

I / O

I

I

I

I

I

PIN

1

2

3

4

5

6

I7

LRCKI8

FUNCTION NAMEI / OPIN FUNCTIONDigital ground pin

Digital power supply

Master clock select pin (Internal pull-down pin)Nomal speed "L":MCLK = 256fs, "H":MCLK = 384fsDouble speed "L":MCLK = 128fs, "H":MCLK = 192fs

Master clock input pin

Power-Down mode pin. When at "L", the AK4324 is in power-down and is held in rest.The AK4324 should always be reset upon power-pin

I SMUTE9

I DFS10

I DEM011

Soft mute pinWhen this pin goes "H", soft mute cycle is initiatedWhen returning "L", the output mute releases.

Audio serial data input pin64fs clock is recommended to be input on this pin

Audio serial data input pin2's complement MSB-first data is input on this pin.

Double speed sampling mode pin (Internal pull-down pin)"L":normal speed, "H":double speed

L/R clock pin.

De-emphasis frequency select pin

I DEM112 De-emphasis frequency select pin

Note : Allinput pins except internal pull-down pins should not be left floating.

-

DZFLO

Lch positive analog output pin

Analog ground pin

Voltage reference input pin

Analog power supply pin.

Rch zero input detect pin

Lch zero input detect pin

I DIF013 Digital input format pin

I DIF114 Digital input format pin

I DIF215 Digital input format pin

0 AOUTR-16 Rch negative analog output pin

O AOUTR+17 Rch positive analog output pin

O AOUTL-

AOUTL+

18

O19

AVSS-20

VREFO21

AVDDO22

DZFRO23

24

Lch negative analog output pin

Page 9: ELECTRONICS - dzsc.com

Reference Information

2-2 Samsung Electronics

2-1-2 RIC1 (KS1461 ; RF)

100 99 98 97 96 95 94 93 92 91 90

VZO

CTL

PLLG

F

EQ

F

EQ

G

RD

PF

AG

CP

AG

CB

AG

CLE

VE

L

EQ

GN

D

AG

CI

AG

CC

89

RFA

GC

O

88

EQ

IN

87

BC

ATH

86

RFE

QO

85

EQ

VC

C

84

MIR

RI

83

CP

1

81M

RO

FST

80

RFR

PN

82

CB

1

78

CP

2

77

CB

2

76

RFC

T

79

RFR

P

75 BCAO

74 BCAI

73 RESET

72 OSC

71 STB

70 CLOCK

69 DATA

68 RREFDLY

67 VREFDPD

66 DPDGND

65 TE1RES

64 PLLCTL

63 DPDMUTE

62 FAUL TOUT

61 DPDEQ2

60 DPDEQ1

59 TE30FST

58 BCA

56 DPDVCC

55 DFCT2

54 DFCT1

53 DFCTTH1

52 DFCTTH2

51 DVCC

50

CC

2

49

CC

1

48

DFC

T_CP

2

47

DFC

T_CP

1

46

FOK

B

45

FOK

TH

44

DG

ND

43

EN

V

42

EN

VB

41

EN

VP

40

AB

CD

I

39

AB

CD

38

AB

CD

N

37

PD

LIMITR

ES

36

TE

35

TEN

34

FEN

33

FE

32

AG

ND

31

PD

CD

30

LDO

CD

29

PD

VD

28

LDO

DV

D

27

VR

EFLP

_BG

I

26

OFS

THO

LD

25FOFST

24VREFA

23AVCC

22DCD1

21CCD1

20BCD1

19ACD1

18DDVD1

17CDVD1

16BDVD1

15ADVD1

14F

13E

12VREFEQ

11RREF

10RREFEQ

9RREFBF

8DDVD

7CDVD

6BDVD

5ADVD

4DCD

3CCD

2BCD

1ACD

to RF EQTUNING BLOCK AGC-HOLD(OOH)

MUX

AGC_DET

RFMUX

VREFGENERATOR

CDRSEL(00H)

EQVC AMP

D

D

D

D

MUX3

GAIN_TE3(02H)

GCA

OFSTHOLD

TEOFST(04H)TBAL(01H)

TE38

SUBRF

MUX

D1B1C1A1

FE

GAIN_FE(03H)

FE_0FST(05H)

CDRSEL(00H)

ANALOGVC AMP

ALPC

LDONB(00H)

FOFST

OFS

THO

LD

MUXTESEL(OOH)

OFSTHOLD

ABCD_OFST(O6H)

ENVELOPE FOK DEFECT

MUX

ENV_SEL(02H)

EQIN

CDRSEL(OOH)

ABCDSUM

GAIN_ABCD(OOH)

DELAY_SEL(00H)PLLCTL

FAULTOUT

PDLIMITRES

TEOPST(04H)

PD,LPFDELAY

TE1_LIMIT

DELAY_SEL(OOH)PLLCTLTBAL(O1H)

HOLD_CTL(O8H)DPDMUTEDPD_MUTE(O2H)SEOFHOLDFLT_CTL(OOH)CAL_ENDB(O2H)

COM

COM

DPDEQ2

DPDEQ1

GCA

GCA

EQ

EQ

CD1S12DVD1DVD2LDONBFLT_CTLCDRSELTESELAGC-HOLDTBALGAIN_TE3ENV_SELDVCTL_SELDPD_MUTEGAIN_EQGAIN_FEGAIN_ABCDTE_OFSTFE_OFSTABCD_OFSTDELAY_CDDELAY_ABPDLIMITga_RFSUMHOLD_CTLga_PLLDPga_PLLDN

to DPDBLOCK

DPDBLOCK

S/IFBLOCK

AUTOOFSTCTL

BCABLOCK

BCA

RFCT&

MIRR

RFRP

TE1RES

CD1 S12 DVD1.2

RFEqualizer

RF SLM& AGC

A

B

C

D

GAIN_EQ(02H)

MIRR57

Page 10: ELECTRONICS - dzsc.com

Reference Information

Samsung Electronics 2-3

171615141312111098765432

CD op

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main

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tical

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C co

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ut po

rt fo

r RF

CD op

tical

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beam

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C co

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rt fo

r RF

DVD

optic

al ma

in be

am A

AC

coup

ling i

nput

port

for R

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DVD

optic

al ma

in be

am B

AC

coup

ling i

nput

port

for R

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DVD

optic

al ma

in be

am C

AC

coup

ling i

nput

port

for R

F

DVD

optic

al ma

in be

am D

AC

coup

ling i

nput

port

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RF A

MP

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resis

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BDVD

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NAM

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t por

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F env

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Botto

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conn

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nvelo

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put p

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Powe

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ircuit

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Powe

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tal c

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Resis

tanc

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nnec

tion

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for P

LL d

efec

t com

para

t-ing

leve

l set

ting

Resis

tanc

e co

nnec

tion

port

for S

ERVO

def

ect c

om-

para

ting

level

setti

ng

Defe

ct ou

tput

por

t for

SER

VO

Defe

ct ou

tput

por

t for

PLL

Powe

r volt

age

input

por

t for

DPD

TE

Mirr

or o

utpu

t por

t

BCA

outp

ut p

ort

Resis

tanc

e co

nnec

tion

port

for 3

BTE

offse

t

DPD

EQ (A

+C) o

utpu

t por

t

DPD

EQ (B

+D) o

utpu

t por

t

DPD

defe

ct wa

vefo

rm o

utpu

t por

t (M

ONITO

R)

CC1

CC2

DVCC

DVCT

TH2

DFCT

TH1

DFCT

1

DFCT

2

DPDV

CC

MIR

R

BCA

TE3O

FST

DPDE

Q1

DPDE

Q2

FAUL

TOUT

O P - -I O O P O O - O O O

64

DPD

TE M

UTE

cont

rol p

ort (

H : M

UTE)

DPD

TE P

LL va

riable

inpu

t por

t

63DP

DMUT

E

PLLC

TL

I I

FUNC

TION

PIN

NAM

EI/O

FUNC

TION

PIN

NAM

EI/O

8786858483828180797877767574737271706968676665DP

D TE

PLL

varia

ble b

ias re

sista

nce

Powe

r GND

inpu

t por

t for

DPD

TE

CAP

conn

ectio

n po

rt fo

r DPD

TE

cent

er

Bias

resis

tanc

e co

nnec

tion

port

for d

elta

block

Data

inpu

t por

t

Cloc

k inp

ut p

ort

Data

ena

ble in

put p

ort

OSC

time

cons

tant

inpu

t por

t for

aut

o of

fset b

lock

Rese

t inp

ut p

ort f

or a

uto

offse

t bloc

k (L :

RES

ET)

BCA

FILTE

R1

BCA

FILTE

R2

RF ri

pple

cent

er vo

ltage

out

put p

ort f

or m

irror

Botto

m ho

ld tim

e co

nsta

nt R

C co

nnec

tion

port

for

RFCT

gen

erat

ionPe

ak h

old ti

me co

nsta

nt R

C co

nnec

tion

port

for

RFCT

gen

erat

ion

RF ri

pple

AMP

outp

ut p

ort f

or m

irror

RF ri

pple

AMP

GAIN

inpu

t por

t for

mirr

or

RF ri

pple

offse

t con

trol p

ort f

or m

irror

Botto

m ho

ld tim

e co

nsta

nt R

C co

nnec

tion

port

for

RFCT

gen

erat

ion

Peak

hold

time

cons

tant

RC

conn

ectio

n po

rt fo

rRF

CT g

ener

ation

Input

por

t for

MIR

R sig

nal g

ener

ation

Powe

r volt

age

input

por

t for

RF E

Q

RF E

Q ou

tput

por

t

BCA

comp

arat

ing le

vel c

ontro

l por

t

TE1R

ES

DPDG

ND

VREF

DPD

RREF

DLY

DATA

CLOC

K

STB

OSC

RESE

T

BCAI

BCAO

RFCT

CB2

CP2

RFRP

RFRP

N

MRO

FST

CB1

CP1

MIR

RI

EQVC

C

RFEQ

O

BCAT

H

I P O - I I I I I O O - - O I I - - I P O I

919089

RFAG

CO in

put p

ort f

or R

F EQ

RF A

GC A

MP

outp

ut p

ort

AGC

time

cons

tant

CAP

conn

ectio

n po

rt

Whe

n AG

C is

“HOL

D”, A

GC vo

ltage

inpu

t por

t

88EQ

IN

RFAG

CO

AGCC

AGCI

I O - I

95949392Po

wer G

ND in

put p

ort f

or R

F EQ

AGC

level

cont

rol v

oltag

e inp

ut p

ort

RF bo

ttom

hold

time c

onsta

nt RC

conn

ectio

n port

for R

F AGC

RF pe

ak ho

ld tim

e con

stant

RC co

nnec

tion p

ort fo

r RF A

GC

EQGN

D

AGCL

EVEL

AGCB

AGCP

P I - -

10099989796

Bias r

esist

ance

conn

ectio

n port

for R

F EQ f

reque

ncy s

etting

RF E

Q bo

ost g

ain co

ntro

l volt

age

input

por

t

RF E

Q pe

ak fr

eque

ncy c

ontro

l volt

age

input

por

t

RF E

Q bo

ost,

peak

freq

uenc

y gain

cont

rol p

ort c

orre

-sp

ondin

g to

wide

band

PLL

(PLL

G. P

LLF r

esist

ance

inter

nal d

esign

)RF

EQ

cont

rol p

ort (

Whe

n No

. PLL

G isn

’t ad

juste

d,ap

ply D

C CT

L volt

age.)

RDPF

EQG

EQF

PLLG

F

VZOC

TL

- I I I I

Page 11: ELECTRONICS - dzsc.com

Reference Information

2-4 Samsung Electronics

2-1-3 SIC1 (KS1452 ; Digital Servo)

A/D

CO

NV

ER

TER

BLO

CK

D/A

CO

NV

ER

TER

BLO

CK

TRA

CK

CO

UN

TER

EFM

AS

YM

ETR

Y

VR

EF

EN

V

TZC

O

SM

E TE FE

CO

UT

FOD

TRD

SLD

SP

D

FBA

L

TBA

L

DV

CTL

EFM

I

RFI

AS

YD

VD

AS

YC

D

EFM

EFM

OA

PLL

HD

INTO

_224

FDC

TL

MA

GIC

O

EQ

CTL

VC

TRL

RV

CO

PLC

K

EFM

RTD

RP

D

RFD

PLL

LOC

K

MD

OU

T[3:

0]

PS

B

SE

NS

E

MD

ATA

[7:0

]

MR

DB

MW

RB

CS

B

DA

B

SC

OR

SQ

SI

SQ

CK

LDO

NB

TLK

B

FLK

B

DIRC

PS1

SSTOP/PSO

SMON

LOCK

DFCT

FOKB

MIRR

TZCA

PHI1

XOUT

XO

XI

TEST

RSTB

TILTO

TILTI

RO

M

DS

P C

OR

EFO

RD

IGIT

AL

SE

RV

O

TIM

ING

GE

NE

RAT

OR

I/O IN

TER

FAC

EB

LOC

K SU

B C

OD

ER

EA

D B

LOC

K

SY

SC

ON

INTE

RFA

CE

BLO

CK

WID

EC

AP

TUR

ER

AN

GE

PLL

Page 12: ELECTRONICS - dzsc.com

Reference Information

Samsung Electronics 2-5

33323130292827262524232221201918171615141312111098765432

Mod

e da

ta3

out c

ontro

lled

by m

icom

Limit

switc

h/sle

d po

sition

sens

or in

put p

in0

Sled

mot

or p

ositi

on se

nsor

inpu

t pin

1

Test

pin (L

: no

rmal

H : t

est)

Coun

ter c

lock

Focu

s ser

vo lo

ck si

gnal

outp

ut p

in

Track

ing se

rvo lo

ck si

gnal

outp

ut p

in

0 : 1

BIT

1 :

8BIT

Syste

m re

set s

ignal

input

pin

Mico

m ch

ip se

lect p

in

Mico

m da

ta/a

ddre

ss se

lect p

in

Mico

m wr

ite cl

ock s

ignal

input

pin

Mico

m re

ad cl

ock s

ignal

input

pin

Mico

m da

ta p

in 0

Mico

m da

ta p

in 1

Mico

m da

ta p

in 2

Mico

m da

ta p

in 3

Mico

m da

ta p

in 4

Mico

m da

ta p

in 5

Mico

m da

ta p

in 6

Mico

m da

ta p

in 7

Inter

nal s

tatu

s mon

itor p

in

Servo

logic

& R

OM V

DD p

ower

supp

ly pin

Syste

m clo

ck si

gnal

input

pin

Syste

m clo

ck si

gnal

outp

ut p

in

Cloc

k out

(33.9

688M

Hz) t

o DS

P

Servo

logic

& R

OM V

SS p

ower

supp

ly pin

Cloc

k out

put p

in fo

r sub

code

dat

a re

ad

Subc

ode

data

inpu

t pin

Timing

detec

tion i

nput

pin fo

r sub

code

data

read

Mot

or O

N sig

nal i

nput

pin

Lock

sign

al inp

ut p

in

Dire

ct jum

p co

ntro

l (fo

r 1 tr

ack j

ump)

1M

DOUT

3

SSTO

P/PS

O

PS1

TEST

COUT

FLKB

TLKB PSB

RSTB

CSB

DAB

MW

RB

MRD

B

MDA

TA0

MDA

TA1

MDA

TA2

MDA

TA3

MDA

TA4

MDA

TA5

MDA

TA6

MDA

TA7

SENS

E

DVDD XI XO XOUT

DVSS

SQCK

SQSI

SCOR

SMON

LOCK

DIRC

FUNC

TION

PIN

NAM

EI/O O I I I O O O I I I I I I I/O I/O I/O I/O I/O I/O I/O I/O O P I O O P O I I I I I

646362616059585756555453525150494847464544434241403938373635

Focu

s OK

signa

l inp

ut p

in

PLL f

requ

ency

det

ect c

ontro

l inp

ut p

in

Lase

r diod

e ON

sign

al ou

tput

pin

Defe

ct De

tecti

on si

gnal

input

pin

Mirr

or si

gnal

input

pin

PLL h

old si

gnal

from

mico

m

Servo

inte

rrupt

mon

itor p

in

PLL l

ogic

block

VDD

pow

er su

pply

pin

PLCK

Frequ

ency

lock

det

ect o

utpu

t (H

: Lo

ck L

: Unlo

ck)

Latch

ed E

FM o

utpu

t sign

al

PLL l

ogic

block

VSS

pow

er su

pply

pin

Resis

tor p

in fo

r VCO

GAI

N

Gain

adjus

t res

ister

for f

requ

ence

det

ecto

r

Gain

adjus

t res

ister

for p

hase

det

ecto

r

Cont

rol v

oltag

e fo

r VCO

Input

for h

yste

resis

cont

rol o

f FD

outp

ut (f

or te

st)

EFM

offs

et a

djustm

ent p

in

Track

ing ze

ro cr

oss o

utpu

t pin

Servo

CPU

VDD

pow

er su

pply

pin

EQ co

ntro

l sign

al

EFM

sign

al fo

r tes

t

EFM

sign

al

Asym

metri

c inp

ut si

gnal

for D

VD

Asym

metri

c inp

ut si

gnal

for C

D

RF in

put s

ignal

Servo

CPU

VSS

pow

er su

pply

pin

Analo

g blo

ck V

SS p

ower

supp

ly pin

Spind

le er

ror i

nput

pin

Refe

renc

e vo

ltage

inpu

t pin

Track

ing e

rror s

ignal

input

pin

34FO

KB

FDCT

L

LDON

B

DFCT

MIR

R

PLLH

D

INTO

_224

PVDD

PLCK

PLLL

OCK

EFM

RTD

PVSS

RVCO

RFD

RPD

VCTL

MAG

ICO

EFM

OA

TZCO

SVDD

EQCT

L

EFM

I

EFM

O

LPFD

VD

LPFC

D

RFI

SVSS

AVSS

SME

VREF TE

FUNC

TION

PIN

NAM

EI/O I I O I I I O P O O O P I I I I I I O P O I O I I I P P I I I

72717069686766

Focu

s erro

r sign

al inp

ut p

in

RF e

nvelo

pe in

put p

in

Tilt i

n (re

serve

d)

Analo

g blo

ck V

DD p

ower

supp

ly pin

Tilt o

ut (r

eser

ved)

Dept

h va

riatio

n co

ntro

l sign

al ou

tput

pin

Track

ing b

alanc

e sig

nal o

utpu

t pin

Focu

s bala

nce

signa

l out

put p

in

65FE EN

V

TILTI

AVDD

TILTO

DVCT

L

TBAL

FBAL

FUNC

TION

PIN

NAM

EI/O I I I P O O O O

8079787776757473Sl

ed m

otor

driv

e sig

nal o

utpu

t pin

Spind

le mo

tor d

rive

signa

l out

put p

in

Focu

s actu

ator

driv

e sig

nal o

utpu

t pin

Track

ing a

ctuat

or d

rive

signa

l out

put p

in

TE si

gnal

for t

rack

ing ze

ro cr

oss i

nput

pin

Mod

e da

ta 0

out

cont

rolle

d by

mico

m

Mod

e da

ta 1

out

cont

rolle

d by

mico

m

Mod

e da

ta 2

out

cont

rolle

d by

mico

m

SLD

SPD

FOD

TRD

TZCA

MDO

UT0

MDO

UT1

MDO

UT2

FUNC

TION

PIN

NAM

EI/O O O O O I O O O

Page 13: ELECTRONICS - dzsc.com

Reference Information

2-6 Samsung Electronics

2-1-4 DIC1 (KS1453 ; DVD Data Processor)

X'T

AL

&TI

MIN

G G

EN

RFC

K 1

7.58

/7.3

5KH

z

DV

D C

LV/C

AV

CD

CLV

/CAV

M

23B

IT S

R

26.1

6MH

z

32B

IT S

R16

-8 D

EM

OD

EC

SY

FRA

ME

SY

NC

DE

T/P

RO

T/IN

S

(17.

57K

Hz)

(

6, 4

, 3)

efm

wr I

D E

CC

WFC

K 1

7.58

/7.3

5KH

z

M

VC

O T

IMIN

GG

EN

ER

ATO

R

17.5

8KH

z =

26.1

6M/1

488

676.

08H

z

(208

, 192

, 17)

(182

, 172

, 11)

EC

C

VC

O T

IMIN

GG

EN

ER

ATO

R

7.35

KH

z =

4.32

18M

/588

75

Hz

(32,

28,

5)

(28,

24,

5)

CIR

C

FRA

ME

SY

NC

DE

T/P

RO

T/IN

S

(7.3

5KH

z)E

FM D

EM

OD

SU

BC

OD

E I/

FC

D-GV-

CD

, CD

-DA

SQ

-VC

D

DV

DP,

DE

INTE

RLE

AVE

&R

AM

CO

NTR

OL

(6, 4

, 3)

trans

ID E

CC

ED

C

DE

SC

RA

MB

LER

MIC

OM

I/F

MM

TO M

ICO

M (1

5)M

DAT

(7:0

), M

RZA

, ZC

S, M

WR

, M

RD

, ZIR

QZD

, ZW

AIT

, ZR

ST

TO D

RA

M25

6K*1

6(3

2)D

D(1

5:0)

DA

DR

(8:0

)ZR

AS

ZUC

AS

ZLC

AS

ZOE

(1:0

)ZW

E(1

:0)

TO A

V (1

3)S

DAT

A[0

] / C

DAT

AS

DAT

A[1

] / L

RC

KS

DAT

A[2

] / B

CLK

SD

ATA

[3] /

C2P

OS

DAT

A[4

] / S

QD

TS

DAT

A[5

] / W

FSY

SD

ATA

[6] /

SO

S1

SD

ATA

[7] /

SQ

CK

DAT

RE

QC

STR

OB

ED

TER

DAT

AC

KTO

S

TO (1

2)X

TI1

XTO

1C

K33

MI

CK

33M

O FGM

ON

MD

PM

DS

FSW

PLL

_LO

CK

CLV

_LO

CK

SE

RV

O_L

OC

K

FRO

M R

/F,

PLL

(3)

EFM

IP

LCK

BC

AR

Z

TO D

-EQ

(8)

PW

MO

(7:0

)

Mon

itor(

8) G

FS, F

RS

YZ,

TX

, EFM

O, W

FCK

, RFC

K, C

K 1

6M, D

EM

PH

A

P

ower

(34)

=VD

D(1

1)+G

ND

(23)

Te

st P

in(3

) TE

ST0

, TE

ST1

, TE

ST2

Page 14: ELECTRONICS - dzsc.com

Reference Information

Samsung Electronics 2-7

DRAM

dat

a bu

s32

DD9_

BI

Digit

al GN

D (0V

)31

DVSS

DRAM

dat

a bu

s30

DD5_

BI

DRAM

dat

a bu

s29

DD10

_BI

DRAM

dat

a bu

s28

DD4_

BI

DRAM

dat

a bu

s27

DD11

_BI

Digit

al po

wer (

+5V)

26DV

DD

DRAM

dat

a bu

s25

DD3_

BI

DRAM

dat

a bu

s24

DD12

_BI

DRAM

dat

a bu

s23

DD2_

BI

DRAM

dat

a bu

s22

DD13

_BI

Digit

al GN

D (0V

)21

DVSS

DRAM

dat

a bu

s20

DD1_

BI

DRAM

dat

a bu

s19

DD14

_BI

DRAM

dat

a bu

s18

DD0_

BI

DRAM

dat

a bu

s17

DD15

_BI

Digit

al GN

D (0V

)16

DVSS

Syste

m clo

ck o

utpu

t for

26.1

6 M

Hz15

XTO_

OUT

Syste

m clo

ck in

put f

or 2

6.16

MHz

14XT

I_IN

Digit

al po

wer (

+5V)

13DV

DD

Mico

m da

ta b

us12

MDA

T0_B

I

Mico

m da

ta b

us11

MDA

T1_B

I

Mico

m da

ta b

us10

MDA

T2_B

I

Mico

m da

ta b

us9

MDA

T3_B

I

Mico

m da

ta b

us8

MDA

T4_B

I

Mico

m da

ta b

us7

MDA

T5_B

I

Mico

m da

ta b

us6

MDA

T6_B

I

Mico

m da

ta b

us5

MDA

T7_B

I

Digit

al GN

D (0V

)4

DVSS

Mico

m re

giste

r sele

ct (L

-> R

egist

er H

-> D

ata)

3M

RZA_

IN

Chip

selec

t (Ac

tive

Low)

2ZC

S_IN

Digit

al GN

D (0V

)1

DVSS

FUN

CTIO

NPI

NN

AM

E

DVD

data

/Sub

code

fram

e sin

k (W

FSY)

65SD

ATA5

_OUT

DVD

data

/Sub

code

seria

l dat

a (S

QDT)

64SD

ATA4

_OUT

DVD

data

/CD

data

erro

r flag

(C2P

0)63

SDAT

A3_O

UT

DVD

data

/CD

data

bit

clock

(BLC

K)62

SDAT

A2_O

UT

DVD

data

/CD

data

L/R

clock

(LRC

K)61

SDAT

A1_O

UT

DVD

data

/CD

data

bits

tream

out

put

60SD

ATA0

_OUT

Digit

al po

wer (

+5V)

59DV

DD

Data

ack

nowl

edge

sign

al ou

tput

58DA

TACK

_OUT

Top

of se

ctor

57TO

S_OU

T

Digit

al GN

D (0V

)56

DVSS

Digit

al GN

D (0V

)55

DVSS

DRAM

add

ress

bus

54DA

DR3_

OUT

DRAM

add

ress

bus

53DA

DR4_

OUT

DRAM

add

ress

bus

52DA

DR2_

OUT

DRAM

add

ress

bus

51DA

DR5_

OUT

DRAM

add

ress

bus

50DA

DR1_

OUT

DRAM

add

ress

bus

49DA

DR6_

OUT

DRAM

add

ress

bus

48DA

DR0_

OUT

Digit

al GN

D (0V

)47

DVSS

DRAM

add

ress

bus

46DA

DR7_

OUT

DRAM

add

ress

bus

45DA

DR8_

OUT

DRAM

row

addr

ess s

trobe

44ZR

AS_O

UT

DRAM

out

put e

nable

043

ZOEO

_OUT

Digit

al po

wer (

+5V)

42DV

DD

DRAM

out

put e

nable

1 (1

6M, -

------

-, 16

M)

41ZO

E1_O

UT

DRAM

writ

e en

able

0 (4M

, 8M

, 16M

)40

ZWE0

_OUT

DRAM

writ

e en

able

1 (8M

ONL

Y)39

ZWE1

_OUT

DRAM

upp

er co

lumn

addr

ess s

trobe

38ZU

CAS_

OUT

DRAM

row

colum

n ad

dres

s stro

be37

ZLCA

S_OU

T

Digit

al GN

D (0V

)36

DVSS

DRAM

dat

a bu

s35

DD7_

BI

DRAM

dat

a bu

s34

DD8_

BI

DRAM

dat

a bu

s33

DD6_

BI

FUN

CTIO

NPI

NN

AM

E

Digit

al GN

D (+5

V)97

DVSS

Syste

m clo

ck o

utpu

t for

33.8

688M

Hz96

CK33

MO_

OUT

Syste

m clo

ck in

put f

or 3

3.868

8MHz

95CK

33M

I_IN

Digit

al ou

t92

TX_O

UT

Good

fram

e sy

nc d

etec

tion

resu

lt ou

tput

(“H”

activ

e)93

GFS_

OUT

Frame

sync

out

91FR

SYZ_

OUT

Digit

al GN

D (0V

)90

DVSS

Digit

al GN

D (0V

)89

DVSS

Digit

al GN

D (0V

)88

DVSS

Digit

al GN

D (0V

)87

DVSS

Digit

al po

wer (

+5V)

86DV

DD

Digit

al po

wer (

+5V)

85DV

DD

Digit

al GN

D (0V

)84

DVSS

Digit

al GN

D (0V

)83

DVSS

Digit

al GN

D (0V

)82

DVSS

PWM

out

put s

ignal

81PW

M00

_OUT

PWM

out

put s

ignal

80PW

M01

_OUT

PWM

out

put s

ignal

79PW

M02

_OUT

PWM

out

put s

ignal

78PW

M03

_OUT

Digit

al po

wer (

+5V)

77DV

DD

PWM

out

put s

ignal

76PW

M04

_OUT

PWM

out

put s

ignal

75PW

M05

_OUT

PWM

out

put s

ignal

74PW

M06

_OUT

PWM

out

put s

ignal

73PW

M07

_OUT

Digit

al GN

D (0V

)72

DVSS

DVD

data

erro

r out

put

71DT

ER_O

UT

Data

requ

est f

rom

A/V

deco

der o

r ROM

dec

oder

70DA

TREQ

_IN

Data

stro

be (c

lock)

outp

ut69

CSTR

OBE_

OUT

Digit

al GN

D (0V

)68

DVSS

DVD

data

/Sub

code

seria

l cloc

k (SQ

CK)

67SD

ATA7

_BI

DVD

data

/Sub

code

bloc

k sink

(S0S

1)66

SDAT

A6_O

UT

FUN

CTIO

NPI

NN

AM

E

Mico

m wr

ite st

robe

(sch

midt

trigg

er)

128

MW

R_IN

Mico

m re

ad st

robe

(sch

midt

trigg

er)

127

MRD

_IN

Inter

rupt

requ

est f

rom

mico

m12

6ZIR

QZD_

OUT

Mico

m re

ad/w

rite

acce

ss w

ait (“

L” w

ait)

125

ZWAI

T_OU

T

Hard

ware

rese

t acti

ve lo

w12

4ZR

ST_I

N

Digit

al GN

D (0V

)12

3DV

SS

BCA

input

sign

al12

2BC

ARZ_

IN

Whe

n DE

EMPH

ASIS

is O

N, “H

IGH”

.12

1DE

MPH

A_OU

T

2∫–¡÷

clock

of C

K33M

/16.9

34M

Hz12

0CK

16M

_OUT

Digit

al po

wer (

+5V)

119

DVDD

Digit

al po

wer (

+5V)

118

DVDD

Spind

le mo

tor o

utpu

t filt

er co

nver

sion

outp

ut (3

-sta

te)

115

FSW

_OUT

Digit

al po

wer (

+5V)

117

DVDD

EFM

/EFM

+ sig

nal i

nput

116

EFM

I_IN

Refe

renc

e sig

nal f

or C

AV11

4FG

_IN

Spind

le mo

tor O

N/OF

F con

trol o

utpu

t11

3M

ON_O

UT

Spind

le mo

tor s

peed

cont

rol s

ignal

(3-sta

te)

110

MDS

_OUT

Spind

le mo

tor p

hase

cont

rol s

ignal

(3-sta

te)

109

MDP

_OUT

Digit

al GN

D (0V

)11

2DV

SS

Digit

al GN

D (0V

)11

1DV

SS

Lock

sign

al fo

r SER

VO10

8SE

RLOC

K_OU

T

Lock

sign

al fo

r CLV

107

CLVL

OCK_

OUT

Lock

sign

al fo

r PLL

106

PLLL

OCK_

OUT

Digit

al GN

D (0V

)10

5DV

SS

Phas

e loc

ked

clock

104

PLCK

_IN

Refe

renc

e fra

me p

ulse

103

RFCK

_OUT

Writ

e fra

me p

ulse

102

WFC

K_OU

T

EFM

out

101

EFM

O_OU

T

Test

mode

setti

ng p

ort

100

TEST

2_IN

Test

mode

setti

ng p

ort

99TE

ST1_

IN

Test

mode

setti

ng p

ort

98TE

ST0_

IN

FUN

CTIO

NPI

NN

AM

E

Digit

al GN

D (0V

)94

DVSS

Page 15: ELECTRONICS - dzsc.com

Reference Information

2-8 Samsung Electronics

2-1-5 DIC2 (KM416C254BJ-6 ; CMOS DRAM)

NAME

A 0 - A 8

D Q 0 - 1 5

VSS

RAS

UCAS

L C A S

W

O E

V CC

N .C

BLOCK DIAGRAM

Control

ClocksVBB Generator

Lower

Data in

BufferDQ0

to

DQ7

OE

DQ8

to

DQ15

Lower

Data out

Buffer

Upper

Data in

Buffer

Upper

Data out

Buffer

Vcc

Vss

RAS

UCAS

LCAS

W

FUNCTION

Address Inputs

D a t a i n / O u t

Ground

Row Address Strobe

Upper Column Address Strobe

Lower Column Address Strobe

Read/Wr i te Input

Data Output Enab le

P o w e r ( + 5 V )

P o w e r ( + 3 . 3 V )

No Connection

Refresh Timer

Refresh Control

AO..

A8

Refresh Counter

Row Address Buffer

Col. Address Buffer

Row Decoder

Column Decoder

Memory Array

262,144 x 16

Cells

Page 16: ELECTRONICS - dzsc.com

Reference Information

Samsung Electronics 2-9

2-1-6 VIC1 (ZiVA-3 ; Audio/Video Decoder)

MemoryController

OSDDecoder

VideoInterface

AudioIn ter face

SubpictureDecoder

MPEGVideo

Decoder

CD-DA andLPCM Decoder

Dolby DigitalAudio

Decoder

MPEGAudio

Decoder

HostInterface

Control Logic

Secure ViewCSS

Descrambling

Bus KeyAuthentication

(Optional)

SDRAM/EDO/ROM

Interface

HostInterface

DVD/CDInterface

BLOCK DIAGRAM

VideoMixer

ZiVA-3 Decoder

Stream

Program

DecoderAudio

DSPAudio

Interface

Digital

Scrambled, Compressed Content

Descrambled, Compressed Content

Decompressed Content

Display Content

LOGIC DIAGRAM

HADDR[2:0]

RD

H D A T A [ 7 : 0 ]

WAIT/DTACK

INT

HOST8SEL

Host

In ter face

Signals

Video

In ter face

Signals

DVD/CD

Inter face

Signals

Audio

In ter face

Signals

SDRAM/EDO

Inter face

Signals

Global

In ter face

Signals

D A - D A T A [ 0 : 3 ]

DA-LRCK

DA-BCK

DA-XCK

DA-IEC

EDO-CAS

EDO-RAS

LDQM

M D A T A [ 1 5 : 0 ]

MADDR[20 :0 ]

MWE

R O M - C S

SD-CLK

SD-CAS[1:0]

UDQM

SYSCLK

VDD

VSS

A_VSS

A_VDD

P10[10:0]

RESET

V D A T A [ 7 : 0 ]

VCLK

DVD-DATA0/CD-DATA

DVD-DATA1/CD-LRCK

DVD-DATA2/CD-BCK

DVD-DATA3/CD-C2PO

DVD-DATA4/CDG-SDATA

DVD-DATA5/CDG-VFSY

DVD-DATA6/CDG-SOS1

DVD-DATA7/CDG-SCLK

VREQUEST

VSTROBE

ERROR

V-DACK/ASTROBE

AREQUEST

A-DACK

DTACKSEL

CS

R/W

VSYNC

HSYNC

SD-CAS

SD-RAS

ZiVA Decoder

Page 17: ELECTRONICS - dzsc.com

Reference Information

2-10 Samsung Electronics

2-1-7 VIC50 (SAA7128 ; Digital Video Encoder)

I2 C-

INTERFACE

SYNC/

CLOCK

MP

MP

9..16

44

20

21

I2 C-Control I2 C-Control I2 C-Control

I2 C-Control

I2 C-Control

Clock&Timing

RE

SN

40

42 41

35 34 7 8 43 37 4 25,28,31,36

SD

A

SC

L

XT

ALI

XT

AL

RC

V1

RC

V2

TT

XR

Q

XC

LK

LLC1

VD

DA

VDD I2C

SA

MP(7:0)

TTX

FADER ENCODEROUTPUT-

INTERFACE

D

A

RGB-

PROCESSOR

D

22,32,33

23

26

29

30

27

Y

C

Y

5,18,38

6,17,39 2 3

VS

S

VD

D

SP

AP

19R

TC

1

CbCr

Y

CbCr

24

R(Cr)

VSSA

G(Y)

B(Cb)

CVBS(CSYNC)

VBS(CVBS)

C(CVBS)

A

BLOCK DIAGRAM

NAME

r e s .

SP

A P

L L C 1

V SS1

V DD1

RCV1

RCV2

I / O

I

I

I

I

I

I / O

I / O

PIN

1

2

3

4

5

6

7

8

FUNCTION

Reserved pin, do not connect

Test Pin;connected to digital ground for normal operation

Test Pin;connected to digital ground for normal operation

Line-Locked Clock input;this is the 27 MHz master clock

Digital supply ground 1

Digital supply 1

Raster Contral 1 for video port. This pin receives/provides a VS/FS/FSEQ signal.

Raster Contral 2 for video port. This pin provides an HS pulse of programmable length or receives an HS pulse.

Page 18: ELECTRONICS - dzsc.com

Reference Information

Samsung Electronics 2-11

NAME

MP7

MP6

MP5

MP4

MP3

MP2

MP1

MP0

V DD2

V SS2

RTCI

VDD 1 2 C

S A

V SSA1

R (C r )

C

V DDA1

G ( Y )

VBS

V DDA2

B ( C b )

CVBS

V DDA3

V SSA2

V SSA3

X T A L

X T A L 1

I / O

I

I

I

I

I

I

I

I

I

I

I

I

I

I

O

O

I

O

O

I

O

O

I

I

I

O

I

PIN

9

1 0

1 1

1 2

1 3

1 4

1 5

1 6

1 7

1 8

1 9

2 0

2 1

2 2

2 3

2 4

2 5

2 6

2 7

2 8

2 9

3 0

3 1

3 2

3 3

3 4

3 5

FUNCTION

Digital supply voltage 2

Digital ground 2

Real Time Control input. If the LLC1 clock is provided by an SAA7111 or SAA7151B, RTCI should be connected to the RTCO pin of the respective decoder to improve the signal quality.

Sense input for 12C bus voltage;connect to 12C bus supply

Select 12C address; low selects slave address 88h, high selects slave address 8Ch.

Analog ground 1 for Red (Cr), C(CVBS), Green(Y) outputs

Analog ground 3 for the DAC reference ladder and the oscillator

Crystal oscillator output

Crystal oscillator input; if the oscillator is not used, this pin should be connected to ground.

Analog output of Red (Cr)signal

Analog output of Chrominance (CVBS) signal

Analog supply voltage 1 for R(Cr), C(CVBS) outputs

Analog output of Green(Y) signal

Analog output of VBS (CVBS) signal

Analog supply voltage 2 for VBS(CVBS), Green(Y) outputs

Analog output of Blue(Cb) signal

Analog output of CVBS(CSYNC) signal

Analog supply voltage 3 for Blue(Cb)and CVBS(CSYNC), outputs

Analog ground 2 for VBS (CVBS), Blue(Cb), CVBS(CSYNC)outputs

Double speed 54 MHzMPEG port. It is an input for "CCIR 656" sty le mult ip lexed Cb, Y, Cr data. Data are sampled on the rising and falling clock edge;data sampled on the risting edge then are sent to the encoding part of the device, data sampled on the falling edge are sent to the RGB part of the device. (or vice verse, depending on programming)

V DDA4

XCLK

V SS3

V DD3

RESN

SCL

SDA

TTXRQ

T T X

I

O

I

I

I

I

I / O

O

I

3 6

3 7

3 8

3 9

4 0

4 1

4 2

4 3

4 4

Analog supply voltage 4 for the DAC reference ladder and the oscillator

Clock output of the crystal oscillator

Digital supply ground 3

Digital supply 3

12C serial clock input

12C serial data input/output

Teletext Request output, indicating when text bits are requested

Teletext bit stream input

Reset input, active LOW. After reset is applied, all digital I/Os are in input mode; PAL-Blackburst on CVBS, VBS and C;RGB outputs set to lowest voltage.The 12C-bus receiver waits for the START condition.

Page 19: ELECTRONICS - dzsc.com

Reference Information

2-12 Samsung Electronics

2-1-8 MIC1 (TMP93CM41F ; Main Micom)

PAO~PA6 PA7(SCOUT)

P50 to P57(ANO to AN7)

AVCCAVSS

VREFHVREFL

(TXD0)P90(RXD0)P91

(SCLK0/CTS0)P92

(TXD1)P93(RXD1)P94

(SCLK1)P95

(PG 00)P60(PG 01)P61(PG 02)P62(PG 03)P63(PG 10)P64(PG 11)P65(PG 12)P66(PG 13)P67

(T10)P70

(T01)P71

(T02)P72

(T03)P73

(INT4/T14)P80(INT5/T15)P81

(T04)P82(T05)P83

(INT6/T16)P84(INT7/T17)P85

(T06)P86

(INTO)P87

VCC[3]VSS[3]

X1X2

CLK

XT1XT2AM8/16EARESETALETEST2,1

NMI

WDTOUT

P00 to P07(AD0 to AC7)

P10 to P17(AD8 to AD15/A8 toA15

P20 to P27(A0 to A7/A16 to A23)

P30(RD)P31(WR)P32(HWR)P33(WAIT)P34(BUSRQ)P35(BUSAK)P36(R/W)P37(RAS)

P40(CS0/CAS0)P41(CS1/CAS1)P42(CX2/CAS2)

PORT A

High

Frequency

OSC

Low

Frequency

OSC

INTERRUPT

CONTROLLER

WATCH-DOG

TIMER

PORT 0

PORT 2

PORT 3

CS/WAIT

CONTROLLER

(3-BLOCK)

PORT 1

10-BIT 8CH

A/D

CONVERTER

SERIAL I/O

(CH,0)

SERIAL I/O

(CH,1)

PATTERN

GENERATOR

(CH,0)

PATTERN

GENERATOR

(CH,1)

16BIT TIMER

(TIMER 4)

16BIT TIMER

(TIMER 5)

8BIT TIMER

(TIMER 0)

8BIT TIMER

(TIMER 1)

8BIT PWM

(TIMER 2)

8BIT PWM

(TIMER 3)

900L-CPU

2KB RAM

XWAXBCADEXHLXIXXIYXIZXSP

WBDH

IXIYIZSP

ACEL

32bit

FSR

P C

Page 20: ELECTRONICS - dzsc.com

Reference Information

Samsung Electronics 2-13

6059585756555453525150494847464544434241403938373635343332

-31

XT1

P96

-XT

2P9

7

Test

pin. c

onne

ct to

TES

T2TE

ST1

TEST

1

Test

pin. c

onne

ct to

TES

T1TE

ST2

TEST

2

EEPR

OM C

LOCK

ECK

PA0

EEPR

OM D

ATA

I/OED

TPA

1

EEPR

OM W

RITE

PRO

TECT

EWC

PA2

-PA

3

-PA

4

-PA

5

-PA

6

-PA

7

Addr

ess l

atch

ena

bleAL

EAL

E

VCC

Vcc

Addr

ess/

Data

0HA

D0AD

0

Addr

ess/

Data

1HA

D1AD

1

Addr

ess/

Data

2HA

D2AD

2

Addr

ess/

Data

3HA

D3AD

3

Addr

ess/

Data

4HA

D4AD

4

Addr

ess/

Data

5HA

D5AD

5

Addr

ess/

Data

6HA

D6AD

6

Addr

ess/

Data

7HA

D7AD

7

Addr

ess 8

HA8

A8

Addr

ess 9

HA9

A9

Addr

ess 1

0HA

10A1

0

Addr

ess 1

1HA

11A1

1

Addr

ess 1

2HA

12A1

2

Addr

ess 1

3HA

13A1

3

Addr

ess 1

4HA

14A1

4

Addr

ess 1

5HA

15A1

5

FUNC

TION

ASSI

GNED

NAM

EPO

RT

NAM

ENo

I/O O O - - O I/O O O O O O O O - I/O I/O I/O I/O I/O I/O I/O I/O O O O O O O O O30292827262524232221201918171615141312111098765432

A/D

Ref i

nput

(L)

1GN

DVR

EFL

A/D

GND

input

AGND

AVss

A/D

VCC

input

AVCC

AVcc

Non-

mask

able

inter

rupt

-/N

MI

DSP

H/W

rese

tZR

STP7

0

Mas

ter c

lock s

elect

MCK

_SEL

P71

AV-D

EC H

/W re

set

ZIVA_

RST

P72

Open

/clos

e bli

nking

LED

P73

Inter

rupt

from

AV-

DEC

DVDI

NT/IN

T4

Inter

rupt

from

fron

t mico

mSR

QIN

T5

Open

switc

hOP

ENP8

2

Clos

e sw

itch

CLOS

EP8

3

Inter

rupt

from

spind

le mo

tor F

GFG

INT

/INT6

-IN

T7

Requ

est t

o fro

nt m

icom

RRQ

P86

Inter

rupt

from

DSP

ZINT

INTO

Seria

l dat

a ou

tput

RXD

TXDO

Seria

l dat

a inp

utTX

DRX

DO

Seria

l dat

a clo

ckSC

LKSC

LKO

RF co

ntro

l dat

aM

DTX

D1

RF d

ata

latch

STB

094

RF co

ntro

l cloc

kM

CSC

LK1

Addr

ess m

ode

(H: 8

bit

mode

)AM

8AM

8/16

Cloc

k out

put (

Syste

m clo

ck÷2

)CL

KCL

K

VCC

Vcc

GND

GND

Vss

High

freq

uenc

y OSC

inX1

X1

High

freq

uenc

y OSC

out

X2X2

Exte

rnal

acce

ss C

S41/

CS40

/EA

/EA

Mas

ter r

eset

from

FRON

T/M

RST

/RES

ET

FUNC

TION

ASSI

GNED

NAM

EPO

RT

NAM

ENo

I/O I - - I O O O O I I I I I I O I O I I O I/O O I O - - I O I I

80 81797877767574737271706968676665646362

Wat

ch d

og ti

mer o

utpu

t61

WDT

OUT

/WDT

OUT

GND

VSS

VCC

Vcc

Addr

ess 1

6HA

16A1

6

Addr

ess 1

7 (A

V-DE

CODE

R)HA

17A1

7

Addr

ess 1

8 (D

ata

proc

esso

r)HA

18A1

8

Addr

ess 1

9HA

19A1

9

Addr

ess 2

0 (D

. SER

VO)

HA20

A20

Addr

ess 2

1HA

21A2

1

Addr

ess 2

2HA

22A2

2

Addr

ess 2

3HA

23A2

3

/Rea

d str

obe

/RD

/RD

/Writ

e str

obe

/WR

/WR

-P3

2

/Wait

/MW

AIT

/WAI

T

RCOD

EP3

4

-P3

5

-P3

6

-P3

7

Chip

selec

t 1

(SRA

M, 1

M B

it, 1

28KB

)/C

S1/C

S1

-P4

0/CS

0

FUNC

TION

ASSI

GNED

NAM

EPO

RT

NAM

ENo

I/O O - - O O O O O O O O O O I/O I I/O I/O O I/O -O

99989796959493

LOCK

mon

itor f

rom

DSP

92SL

OCK

P50

Mon

itor s

ignal

TILTO

P51

Spind

le dir

ectio

n fro

m SP

driv

erFR

P52

SENS

E mo

nitor

from

SER

VOSE

NSE

P53

Focu

s loc

k mon

itor f

rom

RFFO

KBP5

4

Track

ing lo

ck m

onito

r from

SER

VORF

RP1

P55

RF su

m sig

nal

RFO

P56

VREF

OP5

7

FUNC

TION

ASSI

GNED

NAM

EPO

RT

NAM

ENo

I/O I I I I I I I

100

A/D

Ref i

nput

(H)

AVCC

VREF

HIO I/O O O O I/O O O O -

91908988878685848382Ch

ip sle

ct 2

(EPRO

M, 4

M B

it, 5

12KB

)/C

S2/C

S2

-P6

0

Tray i

n co

ntro

l out

put

TRAY

-INP6

1

Tray o

ut co

ntro

l out

put

TRAY

-OUT

P62

IIC cl

ock (

VIDE

O EN

CODE

R)SC

LP6

3

IIC cl

ock (

VIDE

O EN

CODE

R)SD

AP6

4

D.Se

rvo IC

dat

a/Ad

dres

s sele

ctDA

BP6

5

D.Se

rvo IC

chip

selec

tCS

BP6

6

D.Se

rvo IC

rese

tRS

TBP6

7

GND

Vss

Page 21: ELECTRONICS - dzsc.com

Reference Information

2-14 Samsung Electronics

2-1-9 MIC8 (M27C801 ; 8MB (1M x 8-bit) CMOS EPROM)

NAME

A0-A19

CE

DQ0-DQ7

OE

Vcc

Vss

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

A16

A15

A12

A7

A6

A5

A4

A3

A2

A1

A0

DQ0

DQ1

DQ2

Vss

Vcc

A17

A14

A13

A8

A9

A11

OE/VPP

A10

CE

DQ7

DQ6

DQ4

DQ4

DQ3

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

TOP VIEW

Output EnableChip Enable and

Prog LogicOutput Buffers

YGating

2,097,152-BitCell Matrix

YDecoder

A0-A19Address

Inputs

OE/VPP

.

.

.

.

.

.

.

XDecoder

Data OutputsDQ0-DQ7

CE

VccVss

BLOCK DIAGRAM

FUNCTION

Address Inputs

Chip Enable Input

Data Input/Outputs

Output Enable Input

Vcc Syply Voltage

Ground

A19

A18

Page 22: ELECTRONICS - dzsc.com

Reference Information

Samsung Electronics 2-15

2-1-10 FIC2 (LC866232 ; Front Micom)

6059585756555453525150494847464544434241403938373635343332

FLT

GRID

CON

TROL

31GR

ID8

S0/T

0

FLT

GRID

CON

TROL

GRID

7S1

/T1

FLT

GRID

CON

TROL

GRID

6S2

/T2

FLT

GRID

CON

TROL

GRID

5S3

/T3

FLT

GRID

CON

TROL

GRID

4S4

/T4

FLT

GRID

CON

TROL

GRID

3S5

/T5

FLT

GRID

CON

TROL

GRID

2S6

/T6

FLT

GRID

CON

TROL

GRID

1S7

/T7

-S8

/T8

-S9

/T9

-S1

0/T1

0

FLT

SEGM

ENT

CONT

ROL

SEG2

1S1

1/T1

1

FLT

SEGM

ENT

CONT

ROL

SEG2

0S1

2/T1

2

FLT

SEGM

ENT

CONT

ROL

SEG1

9S1

3/T1

3

FLT

SEGM

ENT

CONT

ROL

SEG1

8S1

4/T1

4

FLT

SEGM

ENT

CONT

ROL

SEG1

7S1

5/T1

5

+5V

VDD

-28V

VP

FLT

SEGM

ENT

CONT

ROL

SEG1

6S1

6

FLT

SEGM

ENT

CONT

ROL

SEG1

5S1

7

FLT

SEGM

ENT

CONT

ROL

SEG1

4S1

8

FLT

SEGM

ENT

CONT

ROL

SEG1

3S1

9

FLT

SEGM

ENT

CONT

ROL

SEG1

2S2

0

FLT

SEGM

ENT

CONT

ROL

SEG1

1S2

1

FLT

SEGM

ENT

CONT

ROL

SEG1

0S2

2

FLT

SEGM

ENT

CONT

ROL

SEG9

S23

FLT

SEGM

ENT

CONT

ROL

SEG8

S24

FLT

SEGM

ENT

CONT

ROL

SEG7

S25

FLT

SEGM

ENT

CONT

ROL

SEG6

S26

FLT

SEGM

ENT

CONT

ROL

SEG5

S27

FUNC

TION

ASSI

GNED

NAM

EPO

RT

NAM

ENo

I/O O O O O O O O O O O O O O O O O - - O O O O O O O O O O O O30292827262524232221201918171615141312111098765432

Front

end

rese

t1

MRS

TP5

2

-PW

M1

D/A

Cont

rol

DFS

P20

D/A

Cont

rol

DEM

O0P2

1

D/A

Cont

rol

DEM

O1P2

2

D/A

Cont

rol

DARS

TP2

3

D/A

Cont

rol

DIF0

P24

D/A

Cont

rol

DIF1

P25

D/A

Cont

rol

DIF2

P26

D/A

Cont

rol

DARS

T1P2

7

-TE

ST1

Rese

t*R

ES

Low

frequ

ency

OSC

inGN

DXT

1

Low

frequ

ency

OSC

out

-XT

2

GND

VSS

High

freq

uenc

y OSC

in-

CF1

High

freq

uenc

y OSC

out

-CF

2

VDD

VDD

ECHO

volum

e A/

D inp

utEC

HO_V

RAN

0/P8

0

MIC

det

ect

MIC

_DET

AN1/

P81

-AN

2/P8

2

HARD

WAR

E M

ODE

SELE

CTM

ODE0

AN3/

P83

HARD

WAR

E M

ODE

SELE

CTM

ODE1

AN4/

P84

HARD

WAR

E M

ODE

SELE

CTM

ODE2

AN5/

P85

HARD

WAR

E M

ODE

SELE

CTM

ODE3

AN6/

P86

HARD

WAR

E M

ODE

SELE

CTM

ODE4

AN7/

P87

Requ

est t

o fro

nt m

icom

RRQ

P70/

INT0

-P7

1/IN

T1

-P7

2/IN

T2

REM

OCON

dat

a in

REM

OCON

P73/

INT3

FUNC

TION

ASSI

GNED

NAM

EPO

RT

NAM

ENo

I/O O - O O O O O O O O - I I I I I I I I I I I I I

80797877767574737271706968676665646362

FLT

SEGM

ENT

CONT

ROL

61SE

G4S2

8

FLT

SEGM

ENT

CONT

ROL

SEG3

S29

FLT

SEGM

ENT

CONT

ROL

SEG2

S30

FLT

SEGM

ENT

CONT

ROL

SEG1

S31

KEY

SCAN

KEY0

P00

KEY

SCAN

KEY1

P01

KEY

SCAN

KEY2

P02

GND

P03

-P0

4

-P0

5

-P0

6

Requ

est t

o M

AIN

Mico

mSR

QP0

7

SERI

AL D

ATA

OUT

TXD

P10/

S00

SERI

AL D

ATA

INRX

DP1

1/S1

0

SERI

AL C

LOCK

SCLK

P12/

SCK0

-P1

3/S0

1

-P1

4/S1

1

-P1

5/SC

K1

-P1

6/BU

Z

P17/

PWM

O

FUNC

TION

ASSI

GNED

NAM

EPO

RT

NAM

ENo

I/O O O O O I I I I O O O O O I O

1009998979695

SCAR

T CO

NTRO

L94

WID

EP4

3

SUB

WOO

PER

MUT

EAM

UTE3

P44

CENT

ER M

UTE

AMUT

E2P4

5

REAR

MUT

EAM

UTE1

P46

FRON

T M

UTE

AMUT

E0P4

7

STAN

DBY

LED

LED

P50

POW

ER O

N/OF

F CON

TROL

ON/O

FFP5

1

FUNC

TION

ASSI

GNED

NAM

EPO

RT

NAM

ENo

I/O O O O O O O O

93929190898887868584838281SH

UTTL

E DA

TAS1

P30

SHUT

TLE

DATA

S2P3

1

SHUT

TLE

DATA

S3P3

2

SHUT

TLE

DATA

S4P3

3

JOG

DATA

J1P3

4

JOG

DATA

J2P3

5

TV T

YPE

ATP3

6

TV T

YPE

ADP3

7

+5 V

VSS

GND

VDD

SCAR

T CO

NTRO

LRG

BCTL

P40

SCAR

T CO

NTRO

LSC

ON_B

P41

-P4

2

I I I I I I I I - - O O O

Page 23: ELECTRONICS - dzsc.com

Reference Information

2-16 Samsung Electronics

MEMO

Page 24: ELECTRONICS - dzsc.com

Samsung Electronics 3-1

3. Product Specifications

Power Requirements AC 120V, 60Hz

Power Consumption 18W

GENERALWeight 7.5lbs

Dimensions W 16.9 in X D 11.0 in X H 3.5 in

Operating Temperature Range +41°F ~ +95°F

Operating Humidity Range 10% to 75%

DVD Reading Speed : 11.45 ft/sec.

(Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.

CD : 5 inches Reading Speed : 3.9 to 4.6 ft/sec.

DISC(Compact Disc) Maximum Play Time : 74min.

CD : 31/2 inches Reading Speed : 3.9 to 4.6 ft/sec.

(Compact Disc) Maximum Play Time : 20min.

VCD : 5 inchesReading Speed : 3.9 to 4.6 ft/sec.

Maximum Play Time : 74min. (Video + Audio)

Component Video 1 channel : 1.0Vp-p (75ohm load)

Y : 1.0Vp-p (75ohm load)

Video OutputComponent Video Pr : 0.70Vp-p (75ohm load)

Pb : 0.70Vp-p (75ohm load)

S-VideoLuminance Signal : 1Vp-p (75ohm load)

Color Signal : 0.286Vp-p (75ohm load)

2 channel L, R

Output LevelAnalog : 2Vrms (1KHz)

Digital : 0.50Vp-p

Audio Output * Frequency Response48KHz Sampling : 4Hz to 22 KHz

96KHz Sampling : 4Hz to 44KHz

* S/N Ratio 110dB

* Dynamic Range 96dB

* Total Harmonic Distortion 0.003%

* : Nominal specification

Page 25: ELECTRONICS - dzsc.com

Product Specification

3-2 Samsung Electronics

MEMO

Page 26: ELECTRONICS - dzsc.com

Samsung Electronics 4-1

4. Operating InstructionsD

escr

iptio

n-Fr

ont P

anel

Fro

nt

Pan

el C

on

tro

ls

Fro

nt

Dis

pla

y

STA

ND

BY

LA

MP

• W

hen

the

unit

is f

irst

plug

ged

in,

the

indi

-ca

tor

light

s. W

hen

pow

er is

pre

ssed

on,

the

lam

p go

es o

ut.

PO

WE

R•

Use

to

turn

the

pow

er o

n an

d of

f.

DIS

PL

AY

(See

bel

ow)

• O

pera

tion

indi

cato

rs a

re d

ispl

ayed

her

e.

DIS

C T

RA

Y•

Pre

ss O

PE

N/C

LOS

E t

o op

en a

nd c

lose

the

disc

tra

y.

GR

EE

N L

AM

P

SK

IP/S

EA

RC

H

• U

se t

o sk

ip o

r se

arch

a s

cene

or

mus

ic.

OP

EN

/CL

OS

E•

Pre

ss t

o op

en a

nd c

lose

the

dis

c tr

ay.

PL

AY

/PA

US

E•

Beg

in o

r pa

use

disc

pla

y.

STO

P•

Sto

ps d

isc

play

.

OP

EN

/C

LO

SE

STA

ND

BY

OP

EN

/C

LO

SE

24b

it 9

6kH

z A

UD

IO D

/A C

ON

VE

RT

ER

DIG

ITA

L V

IDE

O

SPAT

IALI

ZER

N-2

-2

DV

D/V

IDE

O-C

D/C

D P

LA

YE

R

DV

D-7

09

PO

WE

R

SK

IP

DIS

C O

PE

RA

TIO

N R

OTA

RY

IND

ICA

TOR

OP

ER

AT

ION

IND

ICA

TOR

DIS

C T

YP

E IN

DIC

ATO

RT

RA

CK

IND

ICA

TOR

3D S

OU

ND

IND

ICA

TOR

AN

GL

E IN

DIC

ATO

RC

HA

PT

ER

IND

ICA

TOR

RE

PE

AT

IND

ICA

TOR

CH

AP

TE

R, T

ITL

E, T

RA

CK

& M

ES

SA

GE

IND

ICA

TOR

AL

LR

EP

EA

T IN

DIC

ATO

RA

-B R

EP

EA

T IN

DIC

ATO

RP

RO

GR

AM

PL

AY

IND

ICA

TOR

MP

EG

IND

ICA

TOR

DO

LB

YD

IGIT

AL

IND

ICA

TOR

LIN

EA

R P

CM

IND

ICA

TOR

DT

S IN

DIC

ATO

R

DIG

ITAL

AU

DIO

OU

TA

NA

LOG

AU

DIO

OU

T

RL

VID

EO

OU

TS

-VID

EO

OU

TC

OM

PO

NE

NT

VID

EO

OU

T

YP

b

Pr

Des

crip

tion-

Rear

Pan

el

DIG

ITA

LA

UD

IO O

UT

JAC

K•

Use

a c

oaxi

al d

igita

l cab

le t

o co

nnec

t to

an

A/V

Am

plifi

er t

hat

cont

ains

a D

olby

Dig

ital d

ecod

er o

r D

TS

dec

oder

.

AN

ALO

G A

UD

IO O

UT

JAC

KS

• C

onne

ct t

o th

e A

udio

inpu

t ja

cks

of y

our

tele

visi

on,

audi

o/vi

deo

rece

iver

, or

VC

R.

VID

EO

OU

TJA

CK

• U

se a

vid

eo c

able

to

conn

ect

this

jack

to

the

Vid

eo in

put

onyo

ur t

elev

isio

n.

S-V

IDE

O O

UT

JAC

K•

Use

the

S-V

ideo

cab

le t

o co

nnec

t th

is ja

ck t

o th

e S

-Vid

eo ja

ckon

you

r te

levi

sion

for

a h

ighe

r qu

ality

pic

ture

.

CO

MP

ON

EN

TV

IDE

O O

UT

JAC

KS

• U

se t

hese

jack

s if

you

have

a T

V w

ith c

ompo

nent

vid

eo in

jack

s. T

hese

jack

s pr

ovid

e P

r, P

b an

d Y

vide

o. A

long

with

S-

Vid

eo,

Com

pone

nt V

ideo

pro

vide

s th

e be

st p

ictu

re q

ualit

y.

Rea

r P

anel

Page 27: ELECTRONICS - dzsc.com

Operating Instructions

4-2 Samsung Electronics

ATo

ur o

f the

Rem

ote

Cont

rol

DV

D F

un

ctio

n B

utt

on

s

DV

D P

OW

ER

Bu

tto

n

NU

MB

ER

Bu

tto

ns

OP

EN

/CL

OS

E B

utt

on

SE

TU

PB

utt

on

• B

rings

up

the

DV

D p

laye

r’s S

etup

men

u.

ZO

OM

Bu

tto

n

SE

AR

CH

Bu

tto

ns

• A

llow

s yo

u to

sea

rch

forw

ard/

back

war

dth

roug

h a

disc

.S

TOP

Bu

tto

n

ST

EP

Bu

tto

n•

Adv

ance

s pl

ayba

ck o

ne f

ram

e at

a t

ime.

RE

TU

RN

Bu

tto

n•

Ret

urns

to

a pr

evio

us m

enu.

TOP

ME

NU

Bu

tto

n•

Acc

esse

s a

mus

ic o

r vi

deo

disp

lay

dire

ctly

.

AU

DIO

Bu

tto

n•

Use

thi

s bu

tton

to a

cces

s va

rious

aud

iofu

nctio

ns o

n a

disc

.

RE

PE

AT

Bu

tto

n•

Allo

ws

you

to r

epea

t pl

ay a

titl

e, c

hapt

er,

trac

k, o

r di

sc.

TV

PO

WE

R B

utt

on

• U

se t

o se

t th

e re

mot

e to

con

trol

a c

ompa

ti-bl

e T

V.

VO

LU

ME

CO

N. B

utt

on

• To

con

trol

the

mas

ter

volu

me

of t

he p

laye

r.

3D S

OU

ND

Bu

tto

n

BO

OK

MA

RK

Bu

tto

n

PL

AY

/PA

US

E B

utt

on

• B

egin

/Pau

se d

isc

play

.

SK

IPB

utt

on

s•

Use

to

skip

the

titl

e, c

hapt

er,

or t

rack

.

CL

EA

R B

utt

on

• U

se t

o re

mov

e m

enus

or

stat

us d

ispl

ays

from

the

scr

een.

MO

DE

Bu

tto

n•

Allo

ws

you

to p

rogr

am a

spe

cific

ord

er.

DIS

PL

AY

Bu

tto

n•

Dis

play

s th

e cu

rren

t di

sc m

ode.

ME

NU

Bu

tto

n•

Brin

gs u

p th

e D

isc

men

u.

EN

TE

R/D

IRE

CT

ION

Bu

tto

n(U

P/D

OW

N o

r L

EF

T/R

IGH

T B

utt

on

)•

Thi

s bu

tton

func

tions

as

a to

ggle

sw

itch.

AN

GL

E B

utt

on

• U

se t

o ac

cess

var

ious

cam

era

angl

es o

n a

DV

D.

SU

BT

ITL

E B

utt

on

A-B

RE

PE

AT

Bu

tto

n•

Use

to

mar

k a

segm

ent

to r

epea

t be

twee

nA

and

B.

ATo

ur o

f the

Rem

ote

Cont

rol (

Cont

’d)

TV

Fu

nct

ion

Bu

tto

ns

TV

PO

WE

R B

utt

on

TV

/VID

EO

Sel

ecti

on

Bu

tto

n

CH

AN

NE

LU

P/D

OW

N B

utt

on

s

VO

LU

ME

UP

/DO

WN

Bu

tto

ns

NO

TE

Thi

s

icon

indi

cate

s an

inva

lid b

utto

n pr

ess.

If r

emo

te d

oes

n’t

op

erat

e p

rop

erly

:

1.O

pen

the

batte

ry c

over

on

the

back

of

the

rem

ote.

2.In

sert

tw

o A

Aba

tterie

s.M

ake

sure

tha

t th

e po

lari-

ties

(+ a

nd -

) ar

e al

igne

dco

rrec

tly.

3.R

epla

ce t

he b

atte

ry c

over

.

• C

heck

the

pol

arity

+ -

of

the

batte

ries

(Dry

-Cel

l)

• C

heck

if t

he b

atte

ries

are

drai

ned.

• C

heck

if r

emot

e se

nsor

isbl

ocke

d by

obs

tacl

es.

• C

heck

if t

here

is a

ny f

luor

es-

cent

ligh

ting

near

by.

Inst

all B

atte

ries

in t

he

Rem

ote

Page 28: ELECTRONICS - dzsc.com

Operating Instructions

Samsung Electronics 4-3

Choo

sing

a C

onne

ctio

nT

he f

ollo

win

g sh

ow e

xam

ples

of

conn

ectio

ns c

omm

only

use

d to

con

nect

the

DV

D p

laye

r w

ith a

TV

and

oth

erco

mpo

nent

s.

Bef

ore

Co

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Page 29: ELECTRONICS - dzsc.com

Operating Instructions

4-4 Samsung Electronics

MEMO

Page 30: ELECTRONICS - dzsc.com

Samsung Electronics 5-1

5. Disassembly and Reassembly

5-1 Cabinet and PCB

5-1-1 Door-Tray Removal

1) Supply power and open Tray Œ. 2) Disassemble the Door-Tray ´ in direction of arrow ÒAÓ.3) Close Tray Œ and power off.

Note : If Tray Œ doesnÕt open, insert a Screw driver ¨ into the Emergency hole ˇ(as shown in detailed draw-ing) and then turn it in the direction of arrow ÒBÓ. Open Tray manually.

ˇ EMERGENCY HOLE

<Bottom View>

ΠTRAY

´ DOOR-TRAY

"A"

"B"

¨ SCREW DRIVER

Fig. 5-1 Door-Tray Removal

Page 31: ELECTRONICS - dzsc.com

5-2 Samsung Electronics

Disassembly/Reaasembly

5-1-2 Top Cabinet Removal

1) Remove 3 Screws Œ on the back Top Cabinet.2) Remove 2 Screws ´, ˇ on the left and right side.3) Lift up the Top Cabinet in direction of arrow.

Π3 SCREWS

´ 1 SCREW

ˇ 1 SCREW

Fig. 5-2 Top Cabinet Removal

Page 32: ELECTRONICS - dzsc.com

Disassembly/Reaasembly

Samsung Electronics 5-3

Π2 SCREWS

ˇ 2 SCREWS

ˆ 3 SCREWS

´ ASS'Y FRONT-PANEL

¨ POWER PCB

Ø PLAY PCB

Fig. 5-3 Ass’y Front-Panel, Power PCB, Play PCB Removal

5-1-3 Ass’y Front-Panel, Power PCB, Play PCB Removal

1) Remove 2 Screws Œ and AssÕy Front Panel ´.2) Remove 2 Screws ˇ and Power PCB ¨.3) Remove 3 Screws ˆ and Play PCB Ø.

Page 33: ELECTRONICS - dzsc.com

5-4 Samsung Electronics

Disassembly/Reaasembly

Π4 SCREWS

ˇ JACK PCB

ˆ MAIN PCB

´ 1 SCREW

¨ 3 SCREWS

Fig. 5-4 Main PCB, Jack PCB Removal

5-1-4 Main PCB, Jack PCB Removal

1) Remove 4 Screws Œ and 1 Screw ´.2) Lift up the Jack PCB ˇ.3) Remove 3 Screws ¨ and lift up the Main PCB ˆ.

Page 34: ELECTRONICS - dzsc.com

Disassembly/Reaasembly

Samsung Electronics 5-5

Π4 SCREWS

5-1-5 Ass’y Deck Removal

1) Remove 4 Screws Œ from the AssÕy Deck and lift it up.

Fig. 5-5 Ass’y Deck Removal

Page 35: ELECTRONICS - dzsc.com

5-6 Samsung Electronics

Disassembly/Reaasembly

JACK PCB

MAIN PCBPOWER PCB

PLAY PCB

5-2 PCB Location

Fig. 5-6 PCB Location

Page 36: ELECTRONICS - dzsc.com

Disassembly/Reaasembly

Samsung Electronics 5-7

NO. CONNECTOR NO. DIRECTION CONNECTOR NO.

ΠKCN2 POWER PCB JACK PCB CN18

´ CN18 JACK PCB POWER PCB KCN2

ˇ CON22 PLAY PCB JACK PCB CN16

¨ CN16 JACK PCB PLAY PCB CON22

ˆ CN12 JACK PCB MAIN PCB CN7

Ø CN7 MAIN PCB JACK PCB CN12

∏ CN11 JACK PCB MAIN PCB CN8

” CN8 MAIN PCB JACK PCB CN11

’ CN5 DECK PCB MAIN PCB CN6

˝ CN6 MAIN PCB DECK PCB CN5

CT1

CT1

CT2

CT2

CT3

CT3

CT4

CT4

CT5

CT5

Œ

´

ˆ

¨

ˇ

Ø

”’

˝

POWER PCB

JACK PCB

PLAY PCB

MAIN PCB

CT1

CT3

CT2

CT4

CT5

5-3 Connector Diagram

Fig. 5-7 Connector Diagram

Page 37: ELECTRONICS - dzsc.com

5-8 Samsung Electronics

Disassembly/Reaasembly

5-4 Deck

5-4-1 Tray Removal

1) Remove 2 Screws Œ and lift up the Cover Sheet ´, AssÕy-Deck Clamper ˇ.2) Insert a Screw driver ˆ into Emergency hole ¨ and push it in the direction of arrow ÒAÓ.

When the Tray Ø comes out a little, pull it in the direction of arrow ÒBÓ by hand.3) Pull the Tray Ø to disassemble, while simultaneously pushing the Hook ∏, ” in direction of arrow ÒAÓ, ÒBÓ.

Fig. 5-8 Tray Removal

ˇ ASS'Y - DECK CLAMPER

"C"

"B"

Ø TRAY

∏ HOOK

Π2 SCREWS

´ COVER SHEET

"D"” HOOK

¨ EMERGENCY HOLE

<Bottom View>

"A"

ˆ SCREW DRIVER

Page 38: ELECTRONICS - dzsc.com

Disassembly/Reaasembly

Samsung Electronics 5-9

5-4-2 Ass’y-Deck Sub Removal

1) Remove 2 Screws Œ and disassemble the AssÕy-PCB deck ´.2) Disassemble the AssÕy-Deck Sub ¨ in direction of arrow ÒBÓ, while simultaneously pushing the Hook ˇ in

direction of arrow ÒAÓ.

Fig. 5-9 Ass’y-Deck Sub Removal

¨ ASS'Y - DECK SUB

"B"

"A"

ˇ HOOK

´ ASS'Y - PCB DECK

Π2 SCREWS

Page 39: ELECTRONICS - dzsc.com

5-10 Samsung Electronics

Disassembly/Reaasembly

5-4-3 Chassis-Main Parts Removal

1) Lift up the Gear-Tray Œ, remove 1 Screw ´ and lift up the Gear-Cam Center ˇ.2) Lift up the Belt-Pulley ¨, remove 1 Screw ˆ and lift up the Pulley-Gear Ø.3) Remove 1 Screw ∏ and lift up the Gear-Tray A ” and Gear-Cam Sub ’.4) Remove 2 Screws ˝ and disassemble the AssÕy-Motor Load Ô.5) Remove 1 Screw and disassemble the Lever-Open S/W Ò.6) Lift up the Shaft-Syncro Ú and remove the 2 Gear-Syncro Æ in both directions.

Fig. 5-10 Chassis-Main Parts Removal

¨ BELT - PULLEY

ˆ 1 SCREW

” GEAR - TRAY A∏ 1 SCREW

Ø PULLEY - GEAR

˝ 2 SCREWS

´ 1 SCREWˇ GEAR - CAM CENTER

ˇ GEAR - CAM CENTER

Ô ASS'Y - MOTOR LOAD

Ú SHAFT - SYNCRO

Æ GEAR - SYNCRO

Æ GEAR - SYNCRO

Ò LEVER - OPEN S/W

Œ GEAR - TRAY ’ GEAR - CAM SUB

’ GEAR - CAM SUB

1 SCREW

TIMINGALIGN TWO ARROWS

Page 40: ELECTRONICS - dzsc.com

Disassembly/Reaasembly

Samsung Electronics 5-11

5-4-4 Ass’y-Brkt Deck Removal

1) Remove 4 Screws Œ.2) Lift up the AssÕy-Brkt Deck ´.

Fig. 5-11 Ass’y-Brkt Deck Removal

Π4 SCREWS

´ ASS'Y - BRKT DECK

Page 41: ELECTRONICS - dzsc.com

5-12 Samsung Electronics

Disassembly/Reaasembly

5-4-5 Ass’y-Deck Parts Removal

1) Remove 3 Screws Œ and disassemble 3 Holder-Cams ´. 2) Disassemble the Rack-Slide ˆ and AssÕy-Pickup Ø, 2 Screws ¨ while simultaneously removing the

Shaft-P/U ˇ.3) Remove 3 Screws ∏ and disassemble the AssÕy-Motor Spindle ”. 4) Remove the Washer-Plain ’ and disassemble the AssÕy-Gear Feed AU/AL ˝.5) Remove the Washer-Plain Ô and disassemble the Gear-Feed B .6) Remove the Washer-Plain Ò and disassemble the AssÕy-Gear Feed CU/CL Ú.

Fig. 5-12 Ass’y- Deck Parts Removal

Π2 SCREWS

” ASS'Y - MOTOR SPINDLE

∏ 3 SCREWS

´ HOLDER - CAM

ˇ SHAFT - P/U

ˇ SHAFT - P/U

Ø ASS'Y - PICK UP

ˆ RACK - SLIDE

¨ 2 SCREWS

˝ ASS'Y - GEAR FEED AU/AL

’ WASHER - PLAIN

GEAR - FEED B

Ô WASHER - PLAIN

Ú ASS'Y GEAR - FEED CU/CL

Ò WASHER - PLAIN

Page 42: ELECTRONICS - dzsc.com

Samsung Electronics 6-1

6. Circuit Descriptions

6-1 S.M.P.S.

6-1-1 Comparsion between Linear Power Supply and S.M.P.S.

6-1-1 (a) Linear

VregVout

+

–+

+

–Vs

(Ns)Vp

(Np)

REGULATOR

Common power(Ex.120/220V 50/60Hz)

Fig. 6-1 Linear Power Supply

3 Waveform/Description

Vs

t0

Fig. 6-2

Vs

t0

Fig. 6-3

Vout

t0

Fig. 6-4

Input : Common power to transformer (Vp).

The output Vs of transformer is determined by the ratioof 1st Np and 2nd Ns.Vs = (Ns/Np) x Vp

Vout is output (DC) by diode and condensor.

Page 43: ELECTRONICS - dzsc.com

Circuit Descriptions

6-2 Samsung Electronics

3 Advantages and disadvantages of linear power supply

1) Advantages : Little noise because the output waveform of transformer is sine wave.

2) Disadvantages :ΠAdditional margin is required because Vs is chan-

ged (depending on power source). (The regulator loss is caused by margin design).

´ Greater core size and condensor capacity are ne-eded, because the transformer works on a single power frequency.

6-1-1 (b) S.M.P.S. (Pulse width modulation method)

v

Vreg

Vout

0 t

Change by common power

Regulator loss

Fig. 6-5

3 Terms

1) 1st : Common power input to 1st winding. 2) 2nd : Circuit followings output winding of transformer.3) f (Frequency) : Switching frequency (T : Switching cycle)4) Duty : (Ton/T) x 100

Transformer Vout

(Np)

(Vp)

Switch

Vs switch

I switch

Vin

ON/OFF Control

+

+

++

+

(Vs)

(Ns)REGULATOR

Fig. 6-6

Page 44: ELECTRONICS - dzsc.com

Circuit Descriptions

Samsung Electronics 6-3

6-1-2 Circuit description (FLY-Back PWM (Plise Width Modulation) Control)

6-1-2 (a) AC Power Rectification/Smoothing Terminal

1) PD01,PD02,PD03,PD04 : Convert AC power to DC(Wave rectification)2) PE3 : Smooth the voltage converted to DC(Refer to VIN of Fig. 6-7) 3) PC01, PC02, PC10, PC11, PC12, PC13, PL01, PL02, PL03 : Noise removal at power input/output4) PVA1 : SMPS protection at power surge input (PVA1 pattern open is to remove noise)5) PR10 : Rush current limit resistance at the moment of power cord insertion.

ΠRush current = (AC input voltage x 1.414 - Diode drop voltage) / Pattern resistance + PL02,01 resis-tance + PC10 resistance + PR10) (AC230V based : approx. 26A)

´ Without PR10, the bridge diode might be damaged as the rush current increases.

6-1-2 (b) SNUBBER Circuit : PR15, PR16, PC04, PC05, PD11, PR17

0

Vswitch

dt

Toff

t

Inverted power by leakage inductance

Fig. 6-7

1) Prevent residual high voltage at the terminals of switch during switch off/Suppress noise.High inverted power occurs at switch (PIC1) off, because of the 1st winding of transformer : (V= LI xdi/dt. LI : Leakage Induction)A very high residual voltage exists on both terminals of PIC1 because dt is a very short.

2) SNUBBER circuit protects PIC1 from damage through leakage voltage suppression by RC, (Charges the leakage voltage to PD11 and PC04, and discharges to PR15 and PR16).

3) PC05, PR17 : For noise removal

6-1-2 (c) PIC1 Vcc circuit

1) PR11, PR12, PR13, PR14 : PIC1 driving resistance (PIC1 works through driving resistance at power cord in)2) PIC1 Vcc : PR18, PD12, PE6

Œ Use the output of transformer as Vcc, because the current starts to flow into transformer while PIC1 is active.´ Rectify to PD12 and smooth to PE6.ˇ Use the output of transformer as PIC1 Vcc : The loads are different before and after PIC1 driving.

(Vcc of PIC1 decreases below OFF voltage, using only the resistance due to load increase after PIC1 driving.)

Page 45: ELECTRONICS - dzsc.com

Circuit Descriptions

6-4 Samsung Electronics

1) F/B terminal of PIC1 determines output duty cycle.2) C-E(Collector-Emitter) of PIC2 and F/B potential of PIC1 are same.

3 Operation descriptions

1) Internal OP-Amp Ô+Õ base potential of PIC3 is 2.5V and external Ò-Ó input potential is connected with PR38 and PR39 to maintain Vout of 5.8V. (Vout = ((PR36 x PR39) / PR39) x 2.5V)

2) If load of 5.8 V terminal increases(or AC input voltage decreases) and Vout decreases below 5.8V, then :PIC3 ÔPÕ potential down below 2.5V --> PIC3 A-K of base current down --> PIC3 of A-K current down -->PIC2 Diode current down --> PIC2 C-E current down --> PIC2 C-E voltage up --> PIC1 F/B voltage up --> Out Duty up --> Transformer 1st current up --> Transformer 1st power up --> Vout up --> Maintain Vout 5.8V

3) If load of 5.8 V terminal decreases(or AC input voltage rises) and Vout rises above 5.8V, then :Reverse sequence of the above description --> Duty down --> Vout down --> Maintain 5.8V (i.e., the feedbackto maintains 5.8V).Œ PR35, PR36 : Reduce 5.8V overshoot´ PR37, PC44 : Prevent PIC3 oscillation(for phase correction) ˇ PC09 : Adjust feedback response rate

6-1-2 (d) Feedback Control Circuit

PIC1STR-G6153T

OCP

DRAIN

F/B

PC09PIC2

C

E

1st GND

A

K

PIC3

A

2.5V

K

P

PR36PR37 PC44

2nd GND

PR38

PR39

PR35

PC34

5.8VPL34PD33

PE33

Trans

GND

%

! @

#

$

VCC

Fig. 6-8

Page 46: ELECTRONICS - dzsc.com

Circuit Descriptions

Samsung Electronics 6-5

6-1-3 Internal Block Diagram

6-1-3 (a) Internal Block Diagram of S.M.P.S. Circuit

SmoothingCircuit

Rectified Circuit

Line Filter

Power IN(85~265V)

NoiseRemoval

(SNUBBER)

PWM ControlCircuit

(1L0380)

Converter

VoltageDetection

Circuit

FLT DrivingCircuit

3.3V RectifiedSmoothing Circuit

5V RectifiedSmoothing Circuit

8V RectifiedSmoothing Circuit

-8V RectifiedSmoothing Circuit

3.3V RectifiedVoltageCircuit

5V RectifiedVoltageCircuit (x2)

Motor 8V1 Port

8V RectifiedVoltageCircuit

-8V RectifiedVoltageCircuit

OUTPUT

Fig. 6-9

6-1-3 (b) PIC1 (STR-G6153T) Internal Block Diagram

VoltageRef.UVLO

V c c

Drain

SourceGND

Sense

SQ

R

SQ

R

OSC.

Vck

32V

Feedback

LEB

Reset7.5V

5v

Reset

ThermalProtection

OVP

2uA

6.3V Sync.

2.5R

Voffset

Rsense

R

+_

+_

1mA

Control IC

SenseFET

5

O C P

2

41

3

Fig. 6-10

Page 47: ELECTRONICS - dzsc.com

Circuit Descriptions

6-6 Samsung Electronics

6-2 RF

6-2-1 RIC1 (KS1461)

KS1461 is combined with KS1452 and KS1453 as bipolar IC developed for DVD SERVO system.Main features include DVD waveform equalizing, CD waveform equalizing, focus error signal generation, 3-beamtracking error signal generation, DPD 1-beam tracking error, defect, envelope, MIRR output, etc. after receiving thepick-up output converted into I/V.

6-2-1 (a) Basic Potentiometer

KS1461 uses a single power method and each circuit is based on V of 2.5V.V (Pin 12, 20, 24, 67) terminal is needed for IC, which uses the peripheral V.

6-2-1(b) RF signal

Fig. 6-11 shows the flow of signal generated by the pick-up.A, B, C, D signals detected from pick-up are converted in to RF signal(A+B+C+D) via RF summing AMP.

Fig. 6-12 shows the waveform-equalizing block diagram for the RF signal.It outputs to EQout (Pin 86) terminal by initially changing switching AMP gain of DVD and CD, and then adjust-ing the level in RF SUM & AGC. It controls RF SUM & AGC gain by means of Pin 89-95 and interfaces with PWMsignal, (output from PWM terminal of KS1453, via low-pass filter to adjust boost gain and peak frequency. EQout terminal is connected with EQin (Pin 86).

PICK-UP RE SUM & AGC

RF EG

DPDTE

Mhx

ENV

FOK

DEFECT

TESEL

TE

ABCDSUM

FE

ALPC

MIRR%

^

&

*

5

6

7

8

34

104

104

104

104

? . m474

104

RFAGCO EQIN MIRRI

G

,

y

I

i

T

F

P[

d

MIRR

TE

RFEQO

A

BC

DEFLDPD

wE

ABCD

FEDFCT1DFCT2FOKBENV

103

ABCDI

Fig. 6-11

Page 48: ELECTRONICS - dzsc.com

Circuit Descriptions

Samsung Electronics 6-7

REAGCO RFEQOEQIN

474

RF EQ

PWM

1EQ

G

EQF

PLLG

F

VZOC

TL

PWM

2

VREF

EQ

RFDV

CC

? . ,

‡ ° · ‚Fig. 6-12

The control parameters of DVD EQ and CD EQ are as follows.

1) DVD CD EQ control parameterΠEQG (Pin 97) : Changes the gain of peak frequency with EQ frequency characteristic. Convert PWM signal,

output from KS1453, into DC via low-pass filter. ´ EQF (Pin 98) : Changes the peak frequency with EQ frequency characteristic. Convert PWM signal, output

from KS1453, into DVD via low-pass filter.

Page 49: ELECTRONICS - dzsc.com

Circuit Descriptions

6-8 Samsung Electronics

6-3 System Control

6-3-1 Outline

The main micom peripheral circuit is composed of 16bit Micom (MIC1 ; TMP93CM41F), 8M EPROM (MIC8 ; AM27-C080) for Microcode and data save, 512 byte EE-PROM (MIC5 ; KS24C020) for permanent storage of data needed atpower off, MIC4 (74AC573) to latch only address in the bus where address and data are mixed, address decoder(MIC7 ; 74HC00) for selection of ex-ternal device chip and 20MHz clock oscillator for micom operation. The Micom(MIC1 ; TMP93CM41F) mounted in main board analizes the key commands of front panel or instructions of remotecontrol through communication with Micom (FIC1 ; LC86P6232) of front and controls the devices on board to exe-cute the corresponding commands after initializing the devices connected with micom on board at power on.

6-3-2 Block Diagram

RIC1RF AMPKS1461

SIC1DIGITAL SERVO

KS1452

VIC1A/V DECODER

ZIVA-3

VIC50VIDEO ENCODERSAA7128/7120

AIC1,2,3,4D/A CONVERTER

AK4324

DIC1DATA PROCESSOR

KS1453

MIC2ADDR LATCH

74AC573

MIC1MAIN MICOMTMP93CM41F

MIC8EPROM

AT27C080

MIC5EEPROM

KS24C020MICOMBLOCK HIGH ADDRESS LOW ADDRESS

DATA BUS

FIC1FRONT MICOM

LC86P6232

MIC7ADDR DECODER

74HC00

Fig. 6-13

Page 50: ELECTRONICS - dzsc.com

Circuit Descriptions

Samsung Electronics 6-9

6-3-3 Waveform Description

When micom accesses each device sharing bus, it falls the chip select signal of corresponding chip to (CS2:MIC8-22,/DSPCS:DIC1-2, /DVDCS:VIC1-206/SRVCS:SIC1-10) 0 (Low) before trial. So to speak, the bus is used by time-division as shown in Fig 6-14, 6-15, 6-16. Two and more devices can't be accessed simultaneously.

• CH1 : CS2 (MIC8-22, EPROM CHIP SELECT)• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)• CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT)• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)• CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL)• CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL)

/CS2

/DSPCS

/DVDCS

/SRVCS

/RD

/WR

Fig. 6-14

• CH1 : CS2 (MIC8-22, EPROM CHIP SELECT)• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)• CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT)• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)• CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL)• CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL)

/CS2

/DSPCS

/DVDCS

/SRVCS

/RD

/WR

Fig. 6-15

Page 51: ELECTRONICS - dzsc.com

Circuit Descriptions

6-10 Samsung Electronics

• CH1 : CS2 (MIC8-22, EPROM CHIP SELECT)• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)• CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT)• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)• CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL)• CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL)

/CS2

/DSPCS

/DVDCS

/SRVCS

/RD

/WR

Fig. 6-16

Page 52: ELECTRONICS - dzsc.com

Circuit Descriptions

Samsung Electronics 6-11

6-4 Servo

6-4-1 Outline

SERVO system of DVD is divided into Focusing SERVO, Tracking SERVO, SLED Linked SERVO and CLV SERVO (DISC Motor Control SERVO).

1) Focusing SERVOFocuses the optical spot output from object lens onto the disc surface. Maintains a uniform distance betweenobject lens of Pick-up and disc (for surface vibration of disc).

2) Tracking SERVOMake the object lens follow the disc track in use of tracking error signal (created from Pick-up).

3) SLED Linked SERVO When the tracking actuator inclines outwardly as the object lens follows the track during play, the SLED motor moves slightly (and counteracts the incline).

4) CLV SERVO (DISC Motor Control SERVO)Controls the disc motor to maintain a constant linear velocity (necessary for RF signal).

6-4-2 Block Diagram

Fig. 6-17

DISCSLED M/T

HALLPCB

LD PDSPINDLE M/T

CN1HA1+HA1–HA2–HA2+SLED+SLED–

AODOCOBOFOEOPDLDF–T+T–F+

SPINDLE

FOCUSING

TRACKING

SIC8NJM2903 RIC1

KS1461

MIC1TMP 93CS41F

SIC1KS1452

DRIC2KA3010D

DRIC1KA3011D

+

!x

0

&

t

1287

!@

#@%^

Page 53: ELECTRONICS - dzsc.com

Circuit Descriptions

6-12 Samsung Electronics

6-4-3 Operation

1) FOCUSING SERVO

(1) FOCUS INPUT

The focus loop is changed from open loop to closed loop, and the triangular waveform moves the object lens up and down (at pin 75 of SIC1 during Focus SERVO ON.) At that time, S curve is input to pin 65 of SIC1.

ABAD (pin 39 of RIC1) signal, summing signal of PD A, B, C, D, is generated, and zero cross(2.5V) point occurswhen S curve is focused and ABAD signal exceeds a preset,constant value. The focus loop is changed toclosed loop, and the object lens follows the disc movement, maintaining a constant distance from the disc. (these operations are same in CD and DVD).

Fig. 6-18

Vref

Vref

1.5V

Pin75 of SIC1 (FOD)

Pin65 of SIC1 (FEI)

Pin39 of RIC1 (ABCD)

(2) PLAY

When focus loop closes the loop during focus servo on, both pin 65 and pin 75 of SIC1 are controlled by VREF voltage (approx. 2.5V), and pin 1, 2 of DRIC2 are approximately 4.5V.

2) TRACKING SERVO

(1) NORMAL PLAY MODE

ΠFor DVDComposite : The signal output from PD A, B, C, D of Pick-up, the tracking error signal (pin36 of RIC1) uses thephase difference of A+C and B+D in RIC1, and inputs to terminal 64 of SIC1. Then, it is output to SIC1 pin 76 via digital equalizer, and applied to the tracking actuator through DRIC2.

Pins 17, 18 of SIC1 are controlled by VREF(approx. 2.5V) during normal play.Meanwhile, DVD repeats the track jump from 1 to 4 in inner direction at normal play (because data- read speedfrom disc is faster than data output speed on screen).

´ For CD, VCDReceive the signal output through E, F of Pick-up, from RIC1. The tracking error signal is similar to DVD.

Page 54: ELECTRONICS - dzsc.com

Circuit Descriptions

Samsung Electronics 6-13

(2) SEARCH Mode :

Search mode : Fine seek,(Moving the tracking actuator slightly little below 255 track) and coarse search, movingmuch in use of sled motor. The coarse search will be described in sled linked servo and now, the fine seek is explained shortly.If the object lens is located near target, cut off the tracking loop and give the control signal as many as desired count to move the tracking actuator via SIC1 pin 76 terminal(TRD).

3) SLED LINKED SERVO

¥ Normal play modeMove SLED motor slightly by means of PWM signal in SIC1 pin 73, as the tracking actuator moves along with track during play. Control to move the entire Pick-up as the tracking actuator moves.

¥ Coarse serach modeIn case of long-distance search (such as chapter serach), SIC1 uses sled FG (SIC8 pin 1, 7, which is generated) byrotation of sled motor via hall PCB. Then, read ID and compute the existing track count after input of next track. If the existing track count is within fine seek range, tracking begins using fine seek.

4) CLV SERVO(DISC MOTOR CONTROL SERVO)

Input RF signal (from Pick-up) to SIC1 pin59. Detect SYNC signal from RF in SIC1, and output PWM signal to SIC1 pin 55 for constant linear velocity.

Page 55: ELECTRONICS - dzsc.com

Circuit Descriptions

6-14 Samsung Electronics

6-5 DVD Data Processor

6-5-1 Outline

DIC1(KS1453) performs Sync detection, EFM/EFM demodulation and error correction and Spindle motor control(CLV control) after inputting sliced EFM signal of RF signal at disc playback and EFM read clock (PLCK) signal gen-erated from PLL. Outputs data which converted to the last audio and video from A/V decoder(VIC1). KS1453 usesexternal memory(4M DRAM) as buffer as well as for error correction and carries out Variable Bit Rate transfer func-tion. VBR function uses the external buffer as buffer to absorb the difference of transfer rate occurring because thetransfer rate of disc playback is faster than data transfer rate demanded by A/V decoder(Video/Audio SignalProcess Chip).In case of general disc refresh, the memory is almost filled up periodically. It is because Write rate to memory afterdisc playback and signal process is faster than Read of A/V decoder. When the memory is filled, this status is report-ed by interrupt to main micom, which controls the servo to kick back the pick-up to the previous track after mem-orizing the last data read from disc until now. It takes some times to jump to the previous track and return to theoriginal(jump location) again. The memory will have an empty space because A/V decoder reads out data of mem-ory.When the memory has an empty space, where data can be processed and written and the pick-up correctly gets tothe original location(before kick back location) again, it reads data again avoids the interrupt of data read previ-ously. The basic operation repeats to perform as described above.

6-5-2 Block Diagram

Fig. 6-19

AD[7..0]HA[23..8]*WR(73)

INTO(ZIRQZD)INT4(/INT)*RD(72)

MIC1 TMP93CM41F

HDATA[7..0]HADDR[3..0]

/CS/RD/WR/INT

DVD-D[7..0]VSTROBEREQUESTDACK*ERR

VIC1(ZiVA-3)192

191196200

177, 178

CLOCK 27MHzCLOCK 33.8688MHzCLOCK 27MHz

1495

6970587157

SDATA[7..0]CSTROBE

DATREQDATACK

DTERTOS

OE

WE

CAS

RAS[

[D15..0 [

[A8..0

[

[

DD15..0

[

[

DADR8..0

ZRAS

ZCAS

ZWEO

ZOEO

MDAT[7:0]MRZA(3)ZCS(2)

MWR(128)MRD(127)

ZIRQZD(126)

EFMIPLCK

116104

109110

MDPMDS

EFMPLCK

DIC1(KS1453)

DIC2(KM416C254)

Page 56: ELECTRONICS - dzsc.com

Circuit Descriptions

Samsung Electronics 6-15

6-5-3 Waveform Description

It measures the timing that data processed in DIC1 at DVD playback.

STROBE

REQ

DACK

SDATA all2 2 0 1 0

Fig. 6-20

• CH1 : STROBE (DIC1-69, CLOCK)• CH2 : REQ (DIC1-70, DATA REQUEST)• CH3 : DACK (DIC1-58, DATA ACKNOWLEDGE)• CH4 : SDATA (DIC1-60~67, DATA)

Page 57: ELECTRONICS - dzsc.com

Circuit Descriptions

6-16 Samsung Electronics

6-6 Video

6-6-1 Outline

VIC50 sends VSYNC and HSYNC from VIC1(A/V decoder) and receives 8bit video data.VIC50 does RGB encoding, copy guard processing and D/A conversion of 8bit video data inputted from VIC1(A/Vdecoder) by control of MIC1(Micom).Video signal converted into analog signal is outputted via amplifier of analog part.

(Main Board) (Output Board)

VIC1A/V Decoder

ZiVA-3

MIC1Main Micom

TMP93CM41F

Videodata

VIC50SAA7128

Videoencoder

VIC52AmplifierBA7660

VIC51AmplifierBA7660

CVBS-1

CVBS-2

Y

C

Y

Pr

Pb

Fig. 6-21 Video Output Block Diagram

Page 58: ELECTRONICS - dzsc.com

Circuit Descriptions

Samsung Electronics 6-17

6-6-2 NTSC/PAL Digital Encoder (VIC50 : SAA7128)

VIC50 inputted from pin4 with 27MHz generates HSYNC and VSYNC which are based on video signal. EachHSYNC and VSYNC outputted from Pin8 and Pin7 are inputted to Pin157 and Pin158 of A/V decoder VIC1(ZIVA-3). VIC1 is the synchronous signals with the video signal and control the output timing of 8bit video signal of ITU-R601 format. (Pin180, 182, 184 ~ 189 (MSP))8bit data is inputted to Pin9(MSB) and Pin16 of VIC50 and the inputted data is demuxed with each 8bit of Y/R-Y/B-Y. The separate signal is encoded to NTSC or PAL by control of MIC1. The above signals, that is CVBS(Composite Video Burst Synchronized)(Pin30), S-Video (Y:Pin27, C:Pin24), Y/Pb/Pr(Pin27/Pin29/Pin23) andGB(Pin26/Pin29/Pin23). In course of encoding, 8bit data can extend to 10bit or more. To convert the extended datato quantization noise as possible, VIC50 adopts 10bit D/A converter. VIC50 perform video en-coding as well ascopy protection.

VDATA[7:0]

VSYNCHSYNC27M

MRSTSDASCL

9~16

784

404241

Demultiplexer

Y

CR-CBRGB encoding

Luminaceprocessing

MACROVISION7.0.1/6.1

Cloed captionsCGMS

Chrominanceprocessor

CTRL+CFGregister

Trap 10-bit DAC

30

27

24

23

26

29

CVBS

Y

C

Cr/R

G

Cb/B

VIC1 (SSA7128)

Fig. 6-22

6-6-3 Amplifier (VIC51, VIC52 : BA7660)

VIC51 and VIC52 are 6dB amplifier. Based on CVBS signal, the final output level must be 2Vpp without 75ohm ter-minal resistance. Because the level of video encoder output is only 1.1Vpp, the level is adjusted with the specialamplifier. When mute of pin1 is high active, if the pin is floating and connected to power, the output signal is neveroutputted. CVBS, Y, C, Cr and Cb outputted from video encoder are inputted to VIC52 (Pin7, Pin2 and Pin4) andVIC51 (Pin7 and Pin4) respectively and outputted from VIC52 (Pin10, Pin15 and Pin13) and VIC51 (Pin10 and Pin13). Pin9, Pin12 and Pin14 of VIC51 and VIC52 are feedback pin to SAG compensation(DC characteristic compen-sation of signal). Resistance(VR3-VR14) which is inserted to input terminal is bias resistance for input offset. Thesignal to which gain is adjusted by amplifier is outputted from jack via 75ohm.

Page 59: ELECTRONICS - dzsc.com

Circuit Descriptions

6-18 Samsung Electronics

6-6-4 Scart Jack Output

The AV1 of scart jacks is used for connecting a TV or other display devices and the AV2 for a VCR or other players.When the DVD player is turned on, the RGB, CVBS, or S-VIDEO is outputted to AV1 and CVBS to AV2. When theplayer is turned off, CVBS signal of the TV is inputted and CVBS or RGB of a VCR inputted via AV2 is outputted.In case of AV2, the reverse signal flow to that.Switching of power on/off is controlled by SCIC1, SCIC2, and SCIC5. The control signal (Pin 9,10,11) of SCIC1 and SCIC2 is outputted from PIN100 of FIC1 and connected to the sig-nal(Pin 4) inverted by FIC3. The control signal(Pin 9,10,11) of SCIC5 is also outputted from Pin100 of FIC1 and inverted again by SCQ8.According to the characteristics that SCART Jack is supplied same pins for the output of CVBS signal and Y signaland for the R signal and C signal, SCIC3 lets the user select two signals in setup menu.This control signal (Pin 9,10,11) of the switch is outputted from Pin 92 of FIC1.The signal selected by switch is amplified by SIC4 and SIC6 and outputted through the SCART jack.The scart jack has the function select signal (Pin 8 of AV1) that the TV can select automatically RF and the externalvideo signal. SCQ1 to SCQ7 are the circuit to point, FIC1 (Pin100, 94) controls. When the TV aspect ratio is 4/3 or 16/9, it is out-putted 4.5 ~ 7V or 9.5 ~ 12V each. But, when the DVD video source is 16/9 and 16/9 wide is selected in setup menu, 4.5 ~ 7V is outputted. Otherwise, 9.5 ~ 12V is outputted. When the player is turned off, the TV works with function selection by output signal of VCR in relation of SCQ9and SCQ10.RGB control signal (Pin 16 of AV1) is outputted that the TV can select between RGB and CVBS. SCQ11 ~ SCQ14 and SCQ17 are for RGB control and controlled by FIC1 (Pin91).When the player is turned off, receives VCR input (Pin 37 of AV2) and buffers in this circuit and then outputs to Pin 16 of AV1.

SIC2(14053)Switch

SIC1(14053)Switch

SIC3(14053)Switch

SIC5(14053)Switch

SIC4(NJM2267)Amplifier

SIC6(BA7660)Amplifier

AV1TV

AV2VCR

Y_S

C_S

R_S

R_VCR_IN

G_VCR_IN

B_VCR_IN

CVBS_VCR_OUT

R_TV_OUT

G_TV_OUT

B_TV_OUT

CVBS/Y_VCR_OUT

CVBS_TV_IN

R_VCR_ING_S

G_VCR_INB_S

B_VCR_IN

CVBS_VCR_IN

CVBS_S

CVBS_TV_IN R/C_TV_OUT

G_TV_OUT

B_TV_OUT

CVBS_VCR_OUT

Fig. 6-23

Page 60: ELECTRONICS - dzsc.com

Circuit Descriptions

Samsung Electronics 6-19

6-7 Audio

6-7-1 Outline

The four data (Data 0~3) outputted from A/V decoder (VIC1 ; ZiVA-3) are supplied to DATA 0 for 2-channelmixed audio output and to DATA 1~3 for Analog audio output (5.1-channel).The audio data (0~3) transmitted from A/V decoder (VIC1 ; ZiVA-3) are converted into analog signal via audioD/A converter and outputted via post filter and amplifier.CD and VCD are outputted with only 2 channels audio data and transmit them to Data 0 and Data 1. Front L/R channel is outputted in mixed audio output (L/R output) and analog audio output and surround L/R,center and subwoofer arenÕt outputted.If DVD of 2 channels source disc is used, it is outputted by the same way with CD and VCD. If 5.1-channel source disc, front L/R channel is outputted in Data 1, Surround L/R in Data 2 and Center/Sub-woofer in Data 3. At that time, 5.1 channel can be downmixed in 2 channel in Data 0.

AIC2AK4324

D/A CONVERTER

POSTFILTERPOST

FILTER

AIC1AK4324

D/A CONVERTER

POSTFILTERPOST

FILTER

POSTFILTERPOSTFILTER

POSTFILTERPOST

FILTER

AMP

AMP

AMP

AMP

AMP

AMP

AMP

AMP

AIC3AK4324

D/A CONVERTER

AIC4AK4324

D/A CONVERTER

VIC1(ZiVA-3)

A/V Decoder

DATA0LRCKBCK

DATA1

DATA2

DATA3CENTER

SURROUND-L

SURROUND-R

L

R

FRONT-L

FRONT-R

SUB WOOFER

Mixed Audio Output (2-Channel)

Analog Audio Output (5.1-Channel)

Fig. 6-24 Audio Output Block Diagram

Page 61: ELECTRONICS - dzsc.com

Circuit Descriptions

6-20 Samsung Electronics

6-7-2 DVD Audio Output

1) Compressed Data

The audio data inputted to VIC1 (ZiVA-3) A/V decoder is divided into compressed data and uncompressed data.It is compressed data that is compressed with multi-channel audio data such as Dolby digital, MPEG, DTS, etc.The compressed data inputted to VIC1 (ZiVA-3) is converted into the uncompressed data of 2, 4, and 6 channelsthrough ZiVA-3 built-in audio decoder and is outputted to Data 0, 1, 2, and 3 through digital audio interface. The compressed data is transmitted to external AC-3 amplifier or MPEG/DTS amplifier as IEC-958/1937 trans-mission data format compressed by ZiVA-3 built-in IEC-958 output process.

2) Uncompressed Data

The uncompressed data is that data isnÕt compressed, so it is called CD-DA, LPCM data. The 2 channels data is converted through audio decoder 2-channel data and Data 0 and Data 1 are outputted indigital audio interface.Via IEC-958 output process, they is transmitted to digital amplifier or AC-3/MPEG/DTSamplifier built in the external digital input source with IEC-958/1937 transmission format.

AUDIO INPUTBUFFER

AUDIO OUTPUTBUFFER

RECEIVER or

DECODER(IEC-958/1937)

AUDIODAC

HOST or DVD/CDINTERFACE

IEC-958/1937OUTPUT PROCESS

IEC-958/1937INTERFACE

AUDIO DECODER(MPEG, DOLBY DIGITAL,

CD-DA, LPCM

DIGITAL AUDIOINTERFACE

2-, 4, or 6-CHANNEL OUTPUT

PROCESS

Uncompressed 16- or 24-bitLPCM camples atfs=44.1,48,96KHz

2-Channel LPCM, DecoderDolby Digital, Decoded MPEG

Compressed Data(MPEG, Dolby Digital),CD-DA, LPCM

VIC4, 10 (LOCAL DRAM) VIC1 (ZiVA-3 ; A/V DECODER)

Source Data Types :MPEG-1,-2, Dolby Digital,

CD-DA, LPCM

Fig. 6-25 Audio Decoder and Output Interface Datapath

Page 62: ELECTRONICS - dzsc.com

Samsung Electronics 7-1

7. Troubleshooting

No

Sear

ch O

pera

tion

PS0,

PS1

is in

put

SIC1

-2, 3

term

inal

from

SIC8

-1, 7

?

Actu

al v

eloc

ity o

ccur

sat

SIC

1-73

term

inal

?

Actu

al v

eloc

ity o

ccur

sat

DRI

C2-1

1, 1

2 te

rmin

al?

Chec

k SI

C8 p

erip

hera

l circ

uit.

0.1V

p-p

sine

wav

eoc

curs

at s

earc

h at

SIC

8-2,

6te

rmin

al?

Repl

ace

Hall

PCB

Chec

k SI

C1 p

erip

hera

l circ

uit.

Chec

k DR

IC2

perip

hera

l circ

uit.

No

No

No

No

Yes

TE o

ccur

s in

sear

ch ra

nge?

Focu

s On

?

Yes

Yes

Yes

No

Yes

A

See

"Fin

e Se

ek C

heck

"

No

FIN

E SE

EK C

heck

FIN

E SE

EK M

IRR

sign

al (R

IC1-

57) i

s m

issi

ng?

TZCO

sig

nal

(SIC

1-52

) is

occu

rs?

Trac

k in

com

min

g is

dela

yed?

TE is

with

in

2V a

nd 3

V?

Pick

-up

trans

fer s

moo

th.

Chec

k RI

C1 P

erip

hera

l cur

cuit.

Chec

k SI

C1 P

erip

hera

l cur

cuit.

Tim

e ou

t due

to m

any

jum

p co

unts

.

Chec

k SI

C1 p

erip

hera

l circ

uit.

SIC1

-76

outp

utis

nor

mal

?

DRIC

2-17

, 18

term

inal

out

puts

are

norm

al?

Chec

k CN

6 an

d pi

ck-u

p.

Chec

k M

ECHA

.

Chec

k RI

C1-3

6 te

rmin

al.

Chec

k DR

IC2

perip

hera

l circ

uit.

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

No

No

No

No

No No

Page 63: ELECTRONICS - dzsc.com

Troubleshooting

7-2 Samsung Electronics

Abn

orm

al ro

tatio

n of

di

sc m

otor

Inpu

t of R

F si

gnal

is n

orm

al?

(SIC

1-59

)

SPD

outp

ut is

nor

mal

?(S

IC1-

74)

Afte

r res

olde

ring

SIC1

.

DRIC

1-24

out

put (

FG)

is n

orm

al?

DRIC

1-23

sig

nal

MON

is "H

" ?

Chec

k or

repl

ace

disc

mot

or.

Chec

k DI

C1, M

IC1.

Chec

k DR

IC1

sold

erin

g an

d po

wer

.

Chec

k pa

th to

RIC

1 an

d SI

C1.Ch

eck

RIC1

sol

derin

g an

d po

wer

.

RIC1

-86

outp

utar

e no

rmal

?

RIC1

-88

outp

utis

nor

mal

?

Chec

k RI

C1 p

erip

hera

lci

rcui

t and

A, B

, C, D

.

Yes

Yes

Yes

Yes

Yes

Yes

No No

No

No

No

No

No

Tray

ope

n/cl

ose

MIC

1-84

, 85

isOp

en ;

"L",

"L" ?

Clos

e ; "

H", "

H"?

Chec

k DR

IC2-

26, 2

7ou

tput

at o

pen/

clos

e

Chec

k si

gnal

line

sta

te fr

om

DRIC

1-26

, 27

to tr

ay m

otor

.

Mic

om (M

IC1)

erro

e.

Chec

k DR

IC2

Yes

Yes

No

No

Page 64: ELECTRONICS - dzsc.com

Troubleshooting

Samsung Electronics 7-3

No

Dis

c re

cogn

ition

LD is

out

putte

dfro

m o

bjec

t len

s at

play

key

inpu

t?

No

focu

s in

com

ing

and

no d

isc

occu

rs.

Yes

No

B

A

No

focu

s in

com

ing

FE in

SIC

1-65

is w

ithin

spe

cifie

d ra

nge?

DRIC

4-1,

2 o

utpu

tar

e no

rmal

?

Chec

k op

en s

tate

from

DRIC

4 to

pic

k-up

.

Chec

k RI

C1 a

nd A

, B, C

, D in

put.

Chec

k DR

IC4

Yes

Yes

No

No

A

Page 65: ELECTRONICS - dzsc.com

Troubleshooting

7-4 Samsung Electronics

No

pick

-up

hom

e po

sitin

g

SELE

D FG

Ps0

, PS1

is in

put n

orm

ally

.(S

IC1-

2, 3

)

Chec

k SI

C1 s

olde

ring

and

pow

er.

Chec

k SI

C8, D

RIC2

sig

nal

trans

fer s

yste

m

Yes

No

NO

LD

ON

RIC1

-28

is 5

V?

RIC-

29 o

utpu

tis

200

mV?

Curre

nt e

xcee

ds 0

.1A?

LD o

ut p

ick-

up re

plac

e.

Open

che

ck in

rela

ted

circ

uit.LD

MPD

erro

r. Re

plac

e pi

ck-u

p

RIC1

-50

outp

ut is

0V?

Chec

k M

IC1

Yes

Yes

Yes

Yes

Yes

No

No

No

No

Divi

de R

Q1 e

mitt

er te

rmin

alvo

ltage

and

5V

real

vol

tage

diffe

renc

e in

to 3

3ohm

.

B

Page 66: ELECTRONICS - dzsc.com

Troubleshooting

Samsung Electronics 7-5

CD/V

CD/D

VD L

/R o

utpu

t err

or(M

ixed

Aud

io o

utpu

t)

Nor

mal

DAT

A 0

isin

put i

n AI

C1-7

?

Anal

og o

utpu

t of

AIC1

-16,

17,

18,

19

is n

orm

al?

Chec

k AV

J2 p

erip

hera

l so

lder

ing

shot

.

Chec

k VI

C1-1

61 o

utpu

t.

Chec

k VI

C1-1

69(C

D/VC

D ; 1

6.93

44M

Hz,

DVD

; 18.

432M

Hz)

Yes

Yes

No

No

AOP1

-1, 7

out

put

is n

orm

al?

Chec

k AO

P1 p

erip

hera

l circ

uit.

Yes

No

Base

term

inal

leve

lof

AQ1

, 2, 3

, 4ar

e "L

"?

Chec

k FI

C1-9

8 m

ute.

Yes

No

Fron

t L/R

out

put e

rror

(Ana

log

Aud

io o

utpu

t)

Nor

mal

DAT

A 1

isin

put i

n AI

C2-7

?

Anal

og o

utpu

t of

AIC2

-16,

17,

18,

19

is n

orm

al?

Chec

k AV

J3 p

erip

hera

l so

lder

ing

shot

.

Chec

k VI

C1-1

63 o

utpu

t.

Chec

k VI

C1-1

69(C

D/VC

D ; 1

6.93

44M

Hz,

DVD

; 18.

432M

Hz)

Yes

Yes

No

No

AOP2

-1, 7

out

put

is n

orm

al?

Chec

k AO

P2 p

erip

hera

l circ

uit.

Yes

No

Base

term

inal

leve

lof

AQ5

, 6, 7

, 8ar

e "L

"?

Chec

k FI

C1-9

8 m

ute.

Yes

No

Page 67: ELECTRONICS - dzsc.com

Troubleshooting

7-6 Samsung Electronics

Surr

ound

L/R

out

put e

rror

(Ana

log

Aud

io o

utpu

t)

5.1-

chan

nel i

sco

ntai

ned

in p

layi

ng d

isc?

Nor

mal

DAT

A 2

isin

put i

n AI

C3-7

?

Chec

k AV

J3 p

erip

hera

l so

lder

ing

shot

.

Outp

ut o

nly

in 2

-cha

nnel

(s

tere

o ch

anne

l)

Chec

k VI

C1-1

64 o

utpu

t.

Yes

Yes

No

No

Anal

og o

utpu

t of

AIC3

-16,

17,

18,

19

is n

orm

al?

Chec

k VI

C1-1

69 D

VD ;

18.4

32M

Hz

Yes

No

AOP3

-1, 7

outp

ut is

nor

mal

?Ch

eck

AOP3

per

iphe

ral c

ircui

t.

Yes

No

Base

term

inal

leve

lof

AQ9

, 10,

11,

12

are

"L"?

Chec

k FI

C1-9

7 m

ute.

Yes

No

Cent

er/S

ub-W

oofe

r out

put e

rror

(Ana

log

Aud

io o

utpu

t)

5.1-

chan

nel i

sco

ntai

ned

in p

layi

ng d

isc?

Nor

mal

DAT

A 3

isin

put i

n AI

C4-7

?

Chec

k AV

J3 p

erip

hera

l so

lder

ing

shot

.

Outp

ut o

nly

in 2

-cha

nnel

(s

tere

o ch

anne

l)

Chec

k VI

C1-1

65 o

utpu

t.

Yes

Yes

No

No

Anal

og o

utpu

t of

AIC4

-16,

17,

18,

19

is n

orm

al?

Chec

k VI

C1-1

69 D

VD ;

18.4

32M

Hz

Yes

No

AOP4

-1, 7

outp

ut is

nor

mal

?Ch

eck

AOP4

per

iphe

ral c

ircui

t.

Yes

No

Base

term

inal

leve

lof

AQ1

3, 1

4, 1

5, 1

6ar

e "L

"?

Chec

k FI

C1-9

5, 9

6 m

ute.

Yes

No

Page 68: ELECTRONICS - dzsc.com

Troubleshooting

Samsung Electronics 7-7

Dig

ital o

utpu

t err

or

Outp

ut in

VIC

1-15

9 is

nor

mal

?

Outp

ut in

AIC5

-6, 8

, 10

isno

rmal

?

Chec

k AV

J4 p

erip

hera

l so

lder

ing

shot

.

Chec

k VI

C1 p

erip

hera

l circ

uit.

Chec

k VI

C5.

Yes

No

No

Yes

No

Pow

er(S

tand

by L

ED O

FF)

PF01

erro

r?

PD01

vol

tage

is m

issi

ng?

Repl

ace

PIC1

.

Repl

ace

fuse

.

Chec

k PR

10.

No

No

Yes

Yes

PIC1

dra

in (p

in 1

)vo

ltage

is m

issi

ng?

Chec

k 2d

vol

tage

.

No

No

Volta

ge e

xist

s in

PIC1

-5?

Chec

k PR

11, 1

2, 1

3, 1

4.

Yes

No

Puls

e is

mis

sing

in P

IC1-

5?Re

plac

e PI

C1.

Chec

k fe

ed b

ack.

Yes

Yes

Page 69: ELECTRONICS - dzsc.com

Troubleshooting

7-8 Samsung Electronics

No

fron

t (SE

T) o

pera

tion

REF

+/-,

5V-a

ll, -2

8Vpo

wer

is s

uppl

ied.

12M

Hz o

scill

atio

n (F

Y1)?

If th

e pr

oble

m p

ersi

sts

;Ch

eck

afte

r rep

laci

ng J

ack

PCB,

w

ith a

noth

er o

ne.

Chec

k ot

her p

arts

for a

bnor

mal

fro

nt o

pera

tion

pers

ists

.

Chec

k po

wer

sta

tus.

Chec

k X-

TAL

perip

hera

l circ

uit.

Yes

Yes

No

No

Rese

t wor

king

inFI

C1-1

2?Ch

eck r

eset

perip

hera

l circ

uit of

FIC2

.

Yes

No

FIC1

sol

derin

g is

OK?

Chec

k FI

C1 s

olde

ring.

Yes

No

Oper

atio

nal w

avef

orm

is m

issi

ng in

FIC

3(F

LT) p

in?

Chec

k FI

C1 p

erip

hera

l circ

uit.

Yes

Yes

Key

of S

TOP,

PLA

Y, O

PEN

wor

k no

rmal

ly?

Chec

k S/

W in

terfa

ce.

Chec

k co

mm

unic

atio

n st

atus

with

m

ain

mic

om(C

heck

FIC

1 pi

ns 2

7, 7

2, 7

3, 7

4, 7

5)

No

No

DVD

pla

y er

ror

'NO

DISK

' app

ears

after

pick-u

p mov

es up

and

down

twice

at po

wer o

n?

27M

Hz c

lock

isin

put i

n DI

C1-1

4?

VIC1

per

iphe

ral s

olde

ring

and

shor

t che

ck.

Chec

k DIC

1, M

IC1

perip

hera

l sho

rt.

Chec

k 27

MHz

osc

illat

ing

part.

Yes

No

No

Sign

als

are

outp

utfro

m S

IC1-

42, 4

4?Re

plac

e SI

C1.

Yes

No

Yes

Page 70: ELECTRONICS - dzsc.com

Troubleshooting

Samsung Electronics 7-9

All p

ower

is me

asure

dco

rrectl

y and

fron

t cab

le is

prope

rly co

nnec

ted?

All c

locks

(20M

Hz,

33.86

88M

Hz, 2

7MHz

) of m

ain PC

Bos

cillat

e norm

ally?

Chec

k A/V

deco

der s

ignal

proc

ess b

lock.

Chec

k al

l clo

ck o

scill

atin

g pa

rts.

Yes

Yes

No

/CS2

, /RD

, /W

R si

gnal

occ

ur?

Chec

k sh

ort p

in o

ut o

f mic

om

com

mon

-bus

(8-b

it).

Chec

k sh

ort o

r ope

ratin

g of

mic

om.

Chec

k so

lder

ing

of m

icom

and

co

mm

unic

atio

n de

vice

s.

Yes

No

Play

wor

ks?

Chec

k VI

C1 p

erip

hera

l uni

t.

Yes

No

Yes

Yes

Yes

Yes

C

Key

oper

atio

n or

rem

ote

cont

rol e

rror

MIC

1-9

is fi

xed

to 0

V?

MIC

7-4,

5 p

in is

fixe

d to

0V?

Chec

k A/V

deco

der s

ignal

proc

ess b

lock.

Chec

k DV

D si

gnal

pro

cess

blo

ck.

Yes

Yes

MIC

1-10

, 19

wave

form

stat

e (0,

1)ch

ange

s whe

neve

r pre

ssing

front

key?

Chec

k M

IC1

perip

hera

l sol

derin

g.Ye

s

Chec

k ei

th a

rticl

e "N

o Fr

ont (

SET)

Ope

ratio

n"

No

C

No No

Page 71: ELECTRONICS - dzsc.com

Troubleshooting

7-10 Samsung Electronics

Vide

o ou

tput

err

or in

RCA

Jac

ks

Powe

r lev

el is

norm

al at

pin 6

, 17,

20, 2

5, 28

,31

, 36,

39 in

VIC

50?

27M

Hz c

lock

inpu

tis

nor

mal

at p

in 4

inVI

C50?

Chec

k th

e co

nnec

tion

betw

een

pin

2 in

PIC

6 an

d Em

mite

r in

PQ24

.

Chec

k th

e co

nnec

tion

betw

een

pin

10 in

VIC

6 an

d pi

n 4

in V

IC50

.

Yes

Yes

No

No

MRS

T is

hig

h st

ate

at p

in 4

0 in

VIC

50?

Yes

No

Cont

rol s

ignal

isno

rmal

at pi

n 41,

42 in

VIC

50?

(Whe

n pow

er on

or

open

)Yes

No

SYN

C si

gnal

isno

rmal

at p

in 7

, 8 in

VIC5

0?

Chec

k th

e so

lder

ing

of V

IC50

.

Yes

Chec

k th

e co

nnec

tion

betw

een

pin

1 in

FIC

1 an

d pi

n 40

in V

IC50

.

Chec

k the

conn

ectio

n betw

een

pin 86

, 87 i

n MIC1

and p

in 41

, 42 i

n VIC5

0.

Chec

k th

e co

nnec

tion

with

pi

n 18

0, 1

82, 1

84 ~

189

in V

IC1.

Vide

o da

ta a

re in

pute

dno

rmal

ly a

t pin

9 ~

16

inVI

C50?

Analo

g sign

als ou

tput

norm

ally a

t pin

30, 2

7, 24

,29

, 23,

in VI

C50?

Yes

No

Yes

D

Chan

ge V

IC50

.

No

No

Chec

k th

e so

lder

ing

of V

IC50

.

Chan

ge V

IC50

.

No

No

Analo

g sign

alsar

e inp

uted

norm

ally a

t pin

2, 4,

7 in V

IC51

, 52?

Pow

er is

nor

mal

at p

in 1

6 in

VIC

51, 5

2?

Chec

k th

e co

nnec

tion

betw

een

VIC5

0 an

d VI

C51,

52.

Chec

k th

e co

nnec

tion

betw

een

VIC5

1, 5

2 an

d Em

mite

r of P

Q24.

Yes

No

No

Pin

1 in

VIC

51, 5

2 is

in

Low

sta

te?

Yes

No

Vide

o sign

als of

abou

t 2V

appe

ar at

pin 1

0, 13

, 15

in VI

C51,

52?

Yes

No

Vide

o si

gnal

s of

ab

out 1

V ap

pear

at

outp

ut ja

cks?

Chec

k th

e so

lder

ing

of

VIC5

1, 5

2.

Yes

Conn

ect t

o gr

ound

.

Chec

k th

e co

nnec

tion

betw

een

VIC5

1, 5

2 an

d ou

tput

jack

s.

Chec

k th

e RC

A ca

ble.

Yes

D

Chan

ge V

IC51

, 52.

No

No

Page 72: ELECTRONICS - dzsc.com

Samsung Electronics 8-1

8. Exploded View and Parts List

8-1 Cabinet Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-2 Deck Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

Page

8-2

8-4

Page 73: ELECTRONICS - dzsc.com

Exploded Views and Parts List

8-2 Samsung Electronics

8-1 Cabinet Assembly

151

602

(ASS

Y-PC

B-JA

CK)

151

1

701

151 70

215

1

212

11

12

S.N

.A. (

CABI

NET-B

OTTO

M)

611

610

601

(ASS

Y-PC

B-M

AIN)

151

150

CN11

A

14

13605

151

150

101

150

S.N

.A. (

DECK

-DVD

MEC

HA)

S.N

.A. :

Ser

vice

Not

Ava

ilabl

e

S.N

.A. (

CHAS

SIS-

REAR

)UT

01

Page 74: ELECTRONICS - dzsc.com

Exploded Views and Parts List

Samsung Electronics 8-3

Loc. No Parts No. Description ; Specification Remark

1 AH95-10355E ASSY-CABINET FRONT;DVD-739,ABS94HB,XAA2 AH95-50369E ASSY-DOOR TRAY;DVD-739,ABS,XAA11 AH61-00194A HOLDER-DECK A;-,ABS 94HB,-,BLK,-,DVD-90912 AH64-80001E FOOT-FRONT;-,ABS94,HB,T2,SIL,H/STAMP,DVD13 AH61-00194B HOLDER-DECK B;-,ABS 94HB,-,BLK,-,DVD-90914 AH61-00194C HOLDER-DECK C;-,ABS 94HB,-,BLK,-,DVD-909150 6003-000275 SCREW-TAPTITE;BH,+,B,M3,L10,BLK,SWCH1018151 6003-000276 SCREW-TAPTITE;BH,+,B,M3,L10,ZPC(YEL),SWC101 AH97-00188D ASSY-CABINET TOP;DVD-739,ASSY,XAA601 AH92-00172A ASSY-PCB-MAIN;DVD-739,MAIN PCB602 AH92-00173A ASSY-PCB-JACK;DVD-739,JACK PCB605 AH63-00040A GROUND-REAR;-,PBS,T0.2,-,DVD-909610 AH39-00034A POWER CORD;KJ-10W,EP2,-,1.83M,CONNECTOR,611 3301-000132 CORE-FERRITE;AC,28.8x19.3x7.5mm,1400,290701 AH92-00167A ASSY-PCB-POWER;DVD-709/DOM,POWER LEADER702 AH92-00166A ASSY-PCB-PLAY;DVD-709/DOM,PLAY LEADERUT01 AH59-10141A REMOCON-ASS’Y;-,-,-,48,DVD-909,S.SCN11A 3809-001133 CABLE-FLAT;30V,80C,200MM,35P,1.25MM,UL28

Page 75: ELECTRONICS - dzsc.com

Exploded Views and Parts List

8-4 Samsung Electronics

8-2 Deck Assembly

903 903

225225

903225

223

217

222220

218

909201

210

212

213209908

208

231

229230

230

205203

202

227

902

207904

901211

219

903

224

905

901

907

215

220

216

220221

204

206

214

906 S.N.A.

216

S.N.A. : Service Not Available

S.N.A.

S.N.A.

Page 76: ELECTRONICS - dzsc.com

Exploded Views and Parts List

Samsung Electronics 8-5

Loc. No Parts No. Description ; Specification Remark

201 AH91-60117A ASSY-DECK CLAMPER;DVD860,-,DP-1202 AH92-00035A ASSY-PCB-DECK;DP-3,-203 3809-001125 CABLE-FLAT;30V,80C,140MM,8P,1MM,UL2896204 AH91-60147A ASSY-BRKT DECK;DP-3,DVD-909,-205 AH66-90054A TRAY-DVD;DP,ABS,-,BLK,-,DP-1206 AH91-60154A ASSY-DECK HOUSING;DP-3,DVD-909,-207 AH66-30087A LEVER-OPEN SW;DP,KEPITAL,T0.7,L26,F20-03208 AH66-20194A GEAR-CAM CENTER;DP,KEPITAL F20-03,M1.2,Z209 AH66-20183A GEAR-CAM SUB;DP,KEPITAL FT2020,M1,2,Z7,-210 AH66-20185A GEAR-TRAY A;DP,KEPITAL F20-03,M0.4/M0.5,211 AH66-10024A PULLEY-GEAR;DP,KEPITAL F20-03,BLK,DP-1212 AH66-60033A BELT-PULLEY;DP,CR,T1.5,0.08,L82.7,BLK,DP213 AH66-20184A GEAR-TRAY;DP,KEPITAL F20-03,M0.5/M0.6,Z4214 AH97-00178A ASSY-BRKT FEED;DP-3,-,SOH-DP1215 BG61-20031A HOLDER-CAM;-,POM,-,-,-,DDR-4216 AH61-50327A SHAFT-P/U;DP,SUS420J2,OD3,L84.7,S/FINISH217 AH66-20228A RACK-SLIDE;DP,KEPITAL F20-03,WHT,M0.4,P1218 AH30-20001B PICK-UP;SPU-DP1 DVD-909219 AH91-60151A ASSY-MOTOR SPINDLE;DP-3,DVD-909,-220 AH60-30020A WASHER-PLAIN;DP,-,ID3.1,OD6,T0.3,RED COL221 AH91-60120A ASSY-GEAR-FEED-AU/AL;DP-1,DVD-860,-222 AH66-20182A GEAR-FEED B;DP,KEPITAL F20-03,M0.4,Z44,W223 AH91-60121A ASSY-GEAR-FEED-CU/CL;DP-1,DVD-860,-224 AH63-30245B COVER-sheet;-,-,-,T0.7,CLR,-,BLK CARBON,225 AH73-10017A RUBBER-INSULATOR;RUBBER(LB-40),OD11,DP-1227 3809-001123 CABLE-FLAT;30V,80C,90MM,40P,1.25MM,UL289229 AH61-50323A SHAFT-SYNCRO;-,sus304,2.1,119,-,-,dvd-90230 AH66-22005A GEAR-SYNCRO-A;KEPITAL F20-03,M0.8,Z9,-,P231 AH97-00179A ASSY-HOUSING MOTOR;DP-3,-,SOH-DP1901 AH60-10151A SCREW-TAP TITE;DP,SPEC6.8 ,PH,+,CP,M2,L902 AC60-10051A SCREW-TAPPING;BH,-,-,M3,L8,FZY903 AH60-10143U SCREW-TAP TITE;DP,PH,+,SPEC,TAP1.7,L5,ZP904 AH60-10145A SCREW-TAP TITE;DP,PH,+,SPEC OD5.5 FP,TAP905 AH60-10147A SCREW-MACHINE;DP,CH,+,FP,M2,L4,ZPC,SWRCH906 AC60-10059A SCREW-TAPPING;BH,+,-,1.7,X5,ZPC2907 AH60-00010A SCREW-MACHINE-MOTOR;-,+,SWCH18AK,M1.7,L2908 AC60-10042A SCREW-TAPPING;PWH,+,-,M3,L8,-909 BG60-10020A SCREW-SP MOTOR;-,BHW TOOTH,-,-,M1.7,L3,-

Page 77: ELECTRONICS - dzsc.com

Exploded Views and Parts List

8-6 Samsung Electronics

MEMO

Page 78: ELECTRONICS - dzsc.com

Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark

Samsung Electronics 9-1

601 ASSY-PCB-MAIN;DVD-739AR1 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR2 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR3 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR4 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR5 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR6 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR7 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608AR8 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR9 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608CN6 3708-001085 CONNECTOR-FPC/FC/PIC;40P,1.25mm,STRAIGHTCN7 3711-003358 CONNECTOR-HEADER;BOX,8P,1R,2.5mm,STRAIGHCN8 3708-001364 CONNECTOR-FPC/FC/PIC;35P,1.25MM,STRAIGHTDC1 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,DC10 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC12 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC13 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC14 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC15 2203-001567 C-CERAMIC,CHIP;10pF,0.5pF,50V,CH,TP,1608DC16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC2 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,DC23 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC24 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC3 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,DC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC6 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC7 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC8 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC9 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DE1 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DIC1 AH13-10030P IC-ASIC;-,KS1453,TQFP,128P,DATA PRO. IDIC2 1105-001233 IC-DRAM;416C256,256KX16BIT,SOJ,40P,400MIDIC7 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110DL1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-DRC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC10 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC2 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC3 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC6 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC7 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC8 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC9 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRE1 2401-002075 C-AL;4.7uF,20%,50V,GP,TP,5x11,5DRE2 2401-002075 C-AL;4.7uF,20%,50V,GP,TP,5x11,5DRE3 2401-002075 C-AL;4.7uF,20%,50V,GP,TP,5x11,5DRE4 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRE5 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRE6 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRE7 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRE8 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRE9 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRIC1 1003-001130 IC-MOTOR DRIVER;KA3011DTF,SOP,28P,-,QUADDRIC2 1003-001067 IC-MOTOR DRIVER;KA3010D,SOP,28P,375MIL,QDRL1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-DRL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-DRR10 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608

DRR11 2007-000087 R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608DRR12 2007-000087 R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608DRR13 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608DRR14 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608DRR3 2007-007157 R-CHIP;1ohm,5%,1/4W,DA,TP,3216DRR4 2007-007157 R-CHIP;1ohm,5%,1/4W,DA,TP,3216DRR7 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608DRR9 2007-000616 R-CHIP;24Kohm,5%,1/16W,DA,TP,1608MC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC10 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC12 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC13 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC14 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC16 2203-001656 C-CERAMIC,CHIP;470pF,5%,50V,CH,TP,1608,1MC18 2203-001656 C-CERAMIC,CHIP;470pF,5%,50V,CH,TP,1608,1MC19 2203-001656 C-CERAMIC,CHIP;470pF,5%,50V,CH,TP,1608,1MC2 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC20 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC3 2203-000426 C-CERAMIC,CHIP;18pF,5%,50V,NPO,1608,-,TPMC4 2203-000426 C-CERAMIC,CHIP;18pF,5%,50V,NPO,1608,-,TPMC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC6 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC7 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC8 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC9 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MIC1 0903-001144 IC-MICROCONTROLLER;93CM41,8BIT,QFP,100P,MIC2 0801-002207 IC-CMOS LOGIC;74AC573,LATCH,SOP,20P,300MMIC5 1103-001133 IC-EEPROM;24C020,256x8BIT,SOP,8P,150MIL,MIC6 0801-002143 IC-CMOS LOGIC;7S32,OR GATE,SOT-25,5P,63MMIC7 0801-000379 IC-CMOS LOGIC;74HC00,NAND GATE,SOP,14P,1MIC8 1102-001090 IC-EPROM;27C081,1MX8BIT,DIP,32P,600MIL,1MIC8A 3704-000472 SOCKET-IC;32P,DIP,SN,2.54mmML1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-MQ1 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TPMR1 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR10 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR12 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR13 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR14 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR15 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR16 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR17 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR18 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR19 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR2 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608MR22 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR23 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR24 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR25 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608MR3 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR33 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608MR34 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR35 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR36 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608MR37 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608MR38 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608MR39 2007-000103 R-CHIP;120Kohm,5%,1/16W,DA,TP,1608MR4 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR40 2007-000402 R-CHIP;150ohm,5%,1/16W,DA,TP,1608MR43 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608MR5 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608

9. Electrical Parts List

Page 79: ELECTRONICS - dzsc.com

Loc.No Part No Description ; Specification RemarkLoc.No Part No Description ; Specification Remark

9-2 Samsung Electronics

Electrical Parts List

MR6 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR7 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR8 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR9 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MXTAL1 2801-000199 CRYSTAL-UNIT;20MHz,50ppm,28-AAA,16pF,50oPC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,PC2 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,PC3 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,PC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,PE1 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5PE2 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5PE3 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5PE4 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5RC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC10 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608,RC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC12 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,RC13 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,RC14 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-RC15 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC17 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC2 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC20 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC21 2203-000384 C-CERAMIC,CHIP;.015NF,5%,50V,NPO,TP,1608RC22 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC23 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC24 2203-001697 C-CERAMIC,CHIP;.082NF,5%,50V,NPO,TP,1608RC25 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC26 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC27 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC28 2203-001052 C-CERAMIC,CHIP;.56NF,10%,50V,X7R,TP,1608RC29 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC3 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC31 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC32 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC33 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC34 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC35 2203-000236 C-CERAMIC,CHIP;100pF,5%,50V,NPO,TP,1608,RC36 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608RC37 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC38 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC39 2203-000531 C-CERAMIC,CHIP;2.7nF,10%,50V,X7R,TP,1608RC4 2203-000236 C-CERAMIC,CHIP;100pF,5%,50V,NPO,TP,1608,RC40 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608,RC41 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC42 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC43 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC44 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC45 2203-001652 C-CERAMIC,CHIP;470NF,+80-20%,16V,Y5V,TP,RC46 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,RC47 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC50 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC51 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC52 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC53 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC54 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC55 2203-000888 C-CERAMIC,CHIP;4.7nF,10%,50V,X7R,TP,1608RC6 2203-001052 C-CERAMIC,CHIP;.56NF,10%,50V,X7R,TP,1608RC7 2203-001640 C-CERAMIC,CHIP;390pF,10%,50V,X7R,TP,1608RC8 2203-000384 C-CERAMIC,CHIP;.015NF,5%,50V,NPO,TP,1608RC9 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608,RD1 0401-000008 DIODE-SWITCHING;DAN217,80V,100mA,SOT-23,RD2 0403-001079 DIODE-ZENER;UDZ3.9B,7%,200MW,SOD-323,TPRD6 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-

RD7 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-RE10 2401-002036 C-AL;1uF,20%,50V,GP,TP,5x11,2.5mmRE11 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mRE12 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5RE13 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5RE17 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5RE2 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5RE8 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5RE9 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5RIC1 AH13-10030M IC-ASIC;-,KS1461,VQFP,100P,RF ICRIC2 0801-002279 IC-CMOS LOGIC;74VHC4053,MUX,SOP,16P,150MRIC3 1202-000121 IC-VOLTAGE COMP.;2903,SOP,8P,150MIL,DUALRIC4 1201-000163 IC-OP AMP;4560,SOP,8P,150MIL,DUAL,100V/MRIC6 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110RL2 2703-000398 INDUCTOR-SMD;10UH,10%,3.2X2.5X2.2MMRL3 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-RL4 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-RQ1 0501-000279 TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW,SOT-RQ2 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TPRR1 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR10 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608RR11 2007-000509 R-CHIP;2.4Kohm,1%,1/16W,DA,TP,1608RR12 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608RR13 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608RR14 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR15 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608RR16 2007-000704 R-CHIP;3.6Kohm,5%,1/16W,DA,TP,1608RR17 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608RR18 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR19 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR2 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608RR20 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR21 2007-000081 R-CHIP;2.7Kohm,5%,1/16W,DA,TP,1608RR22 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR23 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR24 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608RR25 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR26 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR27 2007-000130 R-CHIP;39Kohm,5%,1/16W,DA,TP,1608RR28 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608RR29 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608RR3 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR30 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR31 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608RR32 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR32A 2007-000108 R-CHIP;510Kohm,5%,1/16W,DA,TP,1608RR33 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608RR34 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR35 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608RR36 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR37 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR38 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR39 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR4 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR40 2007-000655 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608RR41 2007-000708 R-CHIP;3.9Kohm,1%,1/16W,DA,TP,1608RR42 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR43 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR44 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR45 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR46 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR47 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR48 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR49 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR5 2007-001056 R-CHIP;6.2Kohm,5%,1/16W,DA,TP,1608RR50 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608

Page 80: ELECTRONICS - dzsc.com

Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark

Electrical Parts List

Samsung Electronics 9-3

RR51 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608RR52 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR53 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608RR53A 2007-000087 R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608RR56 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR57 2007-000088 R-CHIP;7.5Kohm,5%,1/16W,DA,TP,1608RR58 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR59 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608RR6 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608RR62 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR63 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR65 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608RR67 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608RR68 2007-000655 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608RR69 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR69A 2007-000431 R-CHIP;16Kohm,5%,1/16W,DA,TP,1608RR7 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608RR70 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608RR71 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608RR8 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608RR9 2007-000783 R-CHIP;33OHM,5%,1/8W,DA,TP,3216SC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC10 2203-001222 C-CERAMIC,CHIP;820pF,10%,50V,X7R,TP,1608SC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC14 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608SC15 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608SC16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC17 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,SC18 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC19 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608SC2 2203-001573 C-CERAMIC,CHIP;12pF,5%,50V,CH,1608,1.6mmSC20 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC21 2203-001567 C-CERAMIC,CHIP;10pF,0.5pF,50V,CH,TP,1608SC26 2203-002398 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,1608,SC29 2203-000372 C-CERAMIC,CHIP;15nF,10%,50V,X7R,TP,1608,SC3 2203-001573 C-CERAMIC,CHIP;12pF,5%,50V,CH,1608,1.6mmSC30 2203-000372 C-CERAMIC,CHIP;15nF,10%,50V,X7R,TP,1608,SC31 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608SC32 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608SC33 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,SC34 2203-000405 C-CERAMIC,CHIP;180pF,5%,50V,NPO,TP,1608,SC36 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC37 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC38 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC39 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC6 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC7 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC9 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,SD2 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-SD3 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-SE1 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5SE2 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5SE3 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5SE4 2401-000240 C-AL;100uF,20%,10V,GP,TP,5x11,5SE5 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mSIC1 AH13-10030N IC-ASIC;-,KS1452,QFP,80P,DSSP ICSIC2 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110SIC3 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110SIC8 1202-000121 IC-VOLTAGE COMP.;2903,SOP,8P,150MIL,DUALSL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-SL3 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-SL4 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-SQ1 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TPSR1 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608

SR10 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608SR11 2007-000107 R-CHIP;470Kohm,5%,1/16W,DA,TP,1608SR12 2007-001235 R-CHIP;910Kohm,5%,1/16W,DA,TP,1608SR13 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608SR14 2007-000450 R-CHIP;180ohm,5%,1/16W,DA,TP,1608SR15 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608SR16 2007-000131 R-CHIP;91Kohm,5%,1/16W,DA,TP,1608SR17 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608SR18 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608SR19 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608SR2 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608SR20 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608SR21 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608SR22 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608SR23 2007-000130 R-CHIP;39Kohm,5%,1/16W,DA,TP,1608SR24 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608SR26 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608SR3 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608SR31 2007-000080 R-CHIP;2Kohm,5%,1/16W,DA,TP,1608SR32 2007-000080 R-CHIP;2Kohm,5%,1/16W,DA,TP,1608SR33 2007-000080 R-CHIP;2Kohm,5%,1/16W,DA,TP,1608SR34 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608SR35 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608SR36 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608SR37 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608SR38 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608SR39 2007-000458 R-CHIP;18Kohm,5%,1/16W,DA,TP,1608SR4 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608SR40 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608SR42 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608SR44 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608SR45 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608SR46 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608SR47 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608SR48 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608SR49 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608SR5 2007-000087 R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608SR50 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608SR51 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608SR52 2007-000704 R-CHIP;3.6Kohm,5%,1/16W,DA,TP,1608SR53 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608SR54 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608SR6 2007-000098 R-CHIP;56Kohm,5%,1/16W,DA,TP,1608SR7 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608SR8 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608SR9 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608SY1 2801-000261 CRYSTAL-UNIT;33.8688MHZ,50PPM,28-AAA,12PVC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC10 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC12 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC13 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC14 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC15 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC17 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC18 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC19 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC20 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC21 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC22 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC23 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC24 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC25 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC26 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC27 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

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VC28 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC29 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC3 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC30 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC31 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC32 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC33 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC34 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC35 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC36 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC37 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC38 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC39 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC40 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC41 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC42 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC43 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC44 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC45 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC47 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC48 2203-000681 C-CERAMIC,CHIP;27pF,5%,50V,NPO,1608,-,TPVC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC50 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC51 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC52 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC53 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC54 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC55 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC6 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC61 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC62 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC65 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC66 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC67 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC68 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC69 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC7 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC70 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC71 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC72 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC73 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC74 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC75 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC76 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC77 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC78 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC8 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC81 2203-000851 C-CERAMIC,CHIP;39pF,5%,50V,NPO,TP,1608,-VC82 2203-000851 C-CERAMIC,CHIP;39pF,5%,50V,NPO,TP,1608,-VC83 2203-001071 C-CERAMIC,CHIP;56pF,5%,50V,NPO,TP,1608,-VC84 2203-000236 C-CERAMIC,CHIP;100pF,5%,50V,NPO,TP,1608,VC85 2203-000236 C-CERAMIC,CHIP;100pF,5%,50V,NPO,TP,1608,VC9 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VE1 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5VE2 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5VIC1 1204-001438 IC-DECODER;ZIVA-3,VQFP,208P,1098MIL,PLASVIC10 1105-001259 IC-DRAM;416S1020,16BIT,TSOP,50P,400MIL,8VIC3 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110VIC4 1105-001259 IC-DRAM;416S1020,16BIT,TSOP,50P,400MIL,8VIC6 AH14-10004R IC;M74HCU04,SOP,TAPE 14PVL1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL10 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012VL11 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL12 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL13 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-

VL14 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL15 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL16 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL17 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL18 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL19 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL20 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL21 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL22 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL23 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL24 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL25 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL26 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL27 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL28 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL29 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL3 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL4 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL5 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL6 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VR1 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608VR10 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608VR100 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR101 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR102 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR103 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR104 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR2 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608VR21 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR22 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR23 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR24 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR25 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR26 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR27 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR28 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR3 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR30 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR31 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR32 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR33 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR34 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR35 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR36 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR37 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR38 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR39 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR4 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608VR40 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR41 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR42 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR43 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR44 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR45 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR46 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR47 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR48 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR49 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR50 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR51 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR52 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR54 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR55 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR56 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608VR57 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608

Loc.No Part No Description ; Specification Remark

9-4 Samsung Electronics

Electrical Parts List

Loc.No Part No Description ; Specification Remark

Page 82: ELECTRONICS - dzsc.com

VR58 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR59 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR60 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR61 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR62 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR63 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR64 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR65 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR66 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR67 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR68 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR69 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR7 2007-000116 R-CHIP;120ohm,5%,1/16W,DA,TP,1608VR70 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR71 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR72 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR73 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR74 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR75 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR76 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR77 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR78 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR79 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR80 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR81 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR82 2007-000402 R-CHIP;150ohm,5%,1/16W,DA,TP,1608VR83 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR84 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR85 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR86 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR87 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR88 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR89 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR9 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608VR90 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR91 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR92 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR93 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR94 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR95 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR96 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR97 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR98 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR99 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608VY1 2801-003554 CRYSTAL-UNIT;27MHz,10ppm,28-AAM,12pF,40o

602 ASSY-PCB-JACK;DVD-739AC1 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC10 2203-000444 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,-AC11 2202-000806 C-CERAMIC,MLC-AXIAL;220pF,10%,50V,Y5P,TPAC12 2203-000595 C-CERAMIC,CHIP;220pF,5%,50V,NPO,TP,2012,AC2 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC3 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VAC4 2203-000444 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,-AC5 2203-000595 C-CERAMIC,CHIP;220pF,5%,50V,NPO,TP,2012,AC56 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC6 2203-000595 C-CERAMIC,CHIP;220pF,5%,50V,NPO,TP,2012,AC60 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VAC7 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC71 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC73 2301-000161 C-FILM,PEF;12nF,5%,50V,6.5X5.5X3.0X5,5mmAC74 2301-000161 C-FILM,PEF;12nF,5%,50V,6.5X5.5X3.0X5,5mmAC8 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC90 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.AC94 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.AC95 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.AC98 2203-000239 C-CERAMIC,CHIP;100pF,5%,50V,NPO,TP,2012,AD1 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-AD2 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-AD4 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,AD5 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,AD6 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-AD7 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-AE1 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5AE10 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5AE11 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5AE2 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5AE3 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5AE30 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5AE31 2401-001969 C-AL;470uF,20%,25V,GP,TP,10x12.5,5AE4 2401-002068 C-AL;33uF,20%,16V,GP,TP,5x11,5AE5 2401-002068 C-AL;33uF,20%,16V,GP,TP,5x11,5AE6 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mAE7 2401-002068 C-AL;33uF,20%,16V,GP,TP,5x11,5AE8 2401-002068 C-AL;33uF,20%,16V,GP,TP,5x11,5AE9 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mAIC1 1002-001129 IC-D/A CONVERTER;AK4324VF,24BIT,VSOP,24PAIC5 AH14-10004R IC;M74HCU04,SOP,TAPE 14PAL1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-AL19 2901-001125 FILTER-EMI ON BOARD;50V,0.5A,-,220pF,7x7AL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-AL5 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-AL6 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-AOP1 1201-000163 IC-OP AMP;4560,SOP,8P,150MIL,DUAL,100V/MAQ1 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-AQ17 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO-AQ18 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO-AQ19 0504-001003 TR-DIGITAL;KSR2003,PNP,300MW,22K/22K,TO-AQ2 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-AQ20 0504-000156 TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22KAQ21 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TPAQ22 0504-000156 TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22KAQ3 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-AQ33 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TPAQ4 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-AR1 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012AR10 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR11 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR119 2007-000766 R-CHIP;330OHM,5%,1/10W,DA,TP,2012AR12 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR121 2007-001247 R-CHIP;91OHM,5%,1/10W,DA,TP,2012

Electrical Parts List

Samsung Electronics 9-5

Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark

Page 83: ELECTRONICS - dzsc.com

AR13 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR130 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAR134 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAR138 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012AR14 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR15 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR150 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR151 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR18 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR19 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR20 2001-000003 R-CARBON;330OHM,5%,1/8W,AA,TP,1.8X3.2MMAR21 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR22 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR23 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR24 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR25 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR26 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR27 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012AR28 2001-000003 R-CARBON;330OHM,5%,1/8W,AA,TP,1.8X3.2MMAR29 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAR30 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR31 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR32 2007-000766 R-CHIP;330OHM,5%,1/10W,DA,TP,2012AR41 2001-000003 R-CARBON;330OHM,5%,1/8W,AA,TP,1.8X3.2MMAR42 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAR8 2007-000308 R-CHIP;10OHM,5%,1/10W,DA,TP,2012AR9 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR90 2001-000241 R-CARBON;1.5KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR91 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAR92 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAVJ1 3722-001355 JACK-RCA;3P(4P),3.2MM,NI,GRN/RED/BLU,-AVJ2 3722-001358 JACK-RCA;3P,3.2MM,NI,BLK,-AVJ4 3722-001053 JACK-RCA;1P,3.2mm,NI,BLK,-AZD1 0403-000551 DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500mCN11 3708-000277 CONNECTOR-FPC/FC/PIC;35P,1.25mm,ANGLE,SNCN12 AH39-00035A LEAD CONNECTOR-ASSY;-,5264-08,35023-08,8CN16 3711-001061 CONNECTOR-HEADER;BOX,6P,1R,2mm,ANGLE,SNCN18 3711-000967 CONNECTOR-HEADER;BOX,4P,1R,2mm,ANGLE,SNFC1 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFC10 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFC14 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFC15 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFC16 2202-000173 C-CERAMIC,MLC-AXIAL;1nF,10%,50V,Y5P,TP,1FC2 2203-000389 C-CERAMIC,CHIP;15pF,5%,50V,NPO,TP,2012,-FC3 2203-000389 C-CERAMIC,CHIP;15pF,5%,50V,NPO,TP,2012,-FC4 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFC6 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFD10 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,FD6 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,FD7 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,FD8 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,FD9 0403-000551 DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500mFE1 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mFE12 2401-000240 C-AL;100uF,20%,10V,GP,TP,5x11,5FE13 2401-000240 C-AL;100uF,20%,10V,GP,TP,5x11,5FE2 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5FE5 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5FE8 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5FIC1 AH09-00010A IC-MICOM MASKING;LC866232,100PIN,QIP,FLTFIC2 1203-001252 IC-VOL. DETECTOR;7545,TO-92,3P,-,PLASTICFIC3 0801-002166 IC-CMOS LOGIC;7SHU04,INVERTER,SSOP,5P,63FIC4 AH59-60010A MODULE-REMOCON;-,GP1U281Q,38KHz,940,MESHFL1 2701-000114 INDUCTOR-AXIAL;10uH,10%,2.5x3.4mmFL2 2701-000113 INDUCTOR-AXIAL;100uH,5%,2.5x3.4mmFR1 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR10 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM

FR101 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR102 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR103 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR104 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR105 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR106 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR11 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMFR12 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMFR13 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMFR16 2001-000027 R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MMFR17 2001-000027 R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MMFR18 2001-000449 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR19 2001-000449 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR20 2001-000449 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR21 2001-000435 R-CARBON;1MOHM,5%,1/8W,AA,TP,1.8X3.2MMFR24 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMFR25 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MMFR26 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMFR31 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR32 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR33 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR34 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR35 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR36 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR37 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR43 2001-000793 R-CARBON;47OHM,5%,1/8W,AA,TP,1.8X3.2MMFR44 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR45 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR46 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR5 2001-000325 R-CARBON;120OHM,5%,1/8W,AA,TP,1.8X3.2MMFR57 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR58 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012FR59 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012FY1 2802-000108 RESONATOR-CERAMIC;12MHZ,0.5%,BK,10.0X5.0PC01 2305-001021 C-FILM,MPEF;100nF,20%,275V,TP,17.5x7x13.PC02 2305-001021 C-FILM,MPEF;100nF,20%,275V,TP,17.5x7x13.PC04 2301-000140 C-FILM,PEF;10nF,10%,630V,BK,16.5X9.5X5.7PC05 2201-000129 C-CERAMIC,DISC;100pF,10%,1KV,Y5P,TP,6x5,PC07 2301-000129 C-FILM,PEF;100nF,5%,50V,TP,10X9X4.3X5,5mPC09 2301-000415 C-FILM,PEF;22nF,5%,50V,TP,6.5x10.5x4mm,5PC10 2201-000916 C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10xPC11 2201-000916 C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10xPC12 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012PC13 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012PC14 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012PC15 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012PC44 2301-000129 C-FILM,PEF;100nF,5%,50V,TP,10X9X4.3X5,5mPCN01 3711-000178 CONNECTOR-HEADER;1WALL,2P,1R,3.96mm,STRAPD01 0402-001009 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TPPD02 0402-001009 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TPPD03 0402-001009 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TPPD04 0402-001009 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TPPD11 0402-000378 DIODE-RECTIFIER;EG01C,1000V,500mA,DO-41PD12 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DOPD3 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DOPD31 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DOPD32 0402-000430 DIODE-RECTIFIER;FML-G02S,200V,3.0A,TO-22PD33 0402-001251 DIODE-RECTIFIER;FMG-22R,200V,10A,TO-220FPD34 0402-001251 DIODE-RECTIFIER;FMG-22R,200V,10A,TO-220FPD35 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DOPD37 0402-000132 DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TPPD38 0402-000132 DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TPPE10 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5PE11 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5PE12 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5PE13 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5

Loc.No Part No Description ; Specification Remark

9-6 Samsung Electronics

Electrical Parts List

Loc.No Part No Description ; Specification Remark

Page 84: ELECTRONICS - dzsc.com

PE3 2401-001682 C-AL;82uF,20%,400V,GP,BK,22x25,10mmPE31 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5PE32 2401-001998 C-AL;1000uF,20%,25V,GP,TP,10x20,5mmPE33 2401-001998 C-AL;1000uF,20%,25V,GP,TP,10x20,5mmPE35 2401-000360 C-AL;100uF,20%,50V,GP,TP,8x11.5,5PE36 2401-001998 C-AL;1000uF,20%,25V,GP,TP,10x20,5mmPE37 2401-001134 C-AL;330uF,20%,35V,WT,TP,10x16,5PE38 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5PE39 2401-001134 C-AL;330uF,20%,35V,WT,TP,10x16,5PE4 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5PE41 2401-002036 C-AL;1uF,20%,50V,GP,TP,5x11,2.5mmPE42 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5PE43 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5PE44 2401-002036 C-AL;1uF,20%,50V,GP,TP,5x11,2.5mmPE6 2401-001583 C-AL;47uF,20%,50V,WT,TP,6.3x11,5PF0A 3601-000453 FUSE-FERRULE;250V,1.6A,SB,GLASS,5.2x20mmPIC1 1203-001721 IC-PWM CONTROLLER;STR-G6153T,T0-220,5P,1PIC2 0604-000186 PHOTO-COUPLER;TR,-,200mW,DIP-4,STPIC3 AC14-12006D IC;KA431Z,TO-92,TAPINGPIC4 1203-000122 IC-NEGA.FIXED REG.;7908,TO-220,3P,-,PLASPIC5 1203-001697 IC-VOLTAGE REGULATOR;78R08,TO-220,4P,-,PPIC6 1203-001083 IC-VOLTAGE REGULATOR;3RF23,TO-202,4P,12.PL01 AC29-30050A FILTER-LINE NOISE;-,400UH,-,250V,-PL02 AC27-92001Q COIL-LINE FILTER;BSF-2120Z,25MH,-,-,-PL03 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,PL11 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,PQ1 0501-000398 TR-SMALL SIGNAL;KSC945,NPN,250mW,TO-92,TPQ2 0501-000616 TR-SMALL SIGNAL;KSC2328A-Y,NPN,1W,TO-92LPQ21 0504-000142 TR-DIGITAL;KSR2001,PNP,300MW,4.7K/4.7K,TPQ22 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO-PQ23 0502-000298 TR-POWER;KSD73,NPN,30W,TO-220,-,120-240PQ24 0502-000298 TR-POWER;KSD73,NPN,30W,TO-220,-,120-240PQ3 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO-PQ4 0504-000142 TR-DIGITAL;KSR2001,PNP,300MW,4.7K/4.7K,TPR10 2006-000262 R-CEMENT;2.7ohm,10%,2W,CB,ST,7.5x11x20.PR11 2001-000073 R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MMPR12 2001-000073 R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MMPR13 2001-000073 R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MMPR14 2001-000073 R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MMPR15 2003-000994 R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP,3.9xPR16 2003-000994 R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP,3.9xPR17 2003-000148 R-METAL OXIDE;100OHM,5%,2W,AE,TP,6X16MMPR18 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMPR2 2003-000148 R-METAL OXIDE;100OHM,5%,2W,AE,TP,6X16MMPR20 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR3 2001-000734 R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR31 2001-000034 R-CARBON;220OHM,5%,1/4W,AA,TP,2.4X6.4MMPR32 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR33 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR34 2001-000440 R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2MMPR35 2001-000362 R-CARBON;150OHM,5%,1/8W,AA,TP,1.8X3.2MMPR36 2001-000221 R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR37 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR38 2004-000869 R-METAL;3Kohm,1%,1/8W,AA,TP,1.8x3.2mmPR39 2004-000459 R-METAL;2.2Kohm,1%,1/8W,AA,TP,1.8x3.2mPR4 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR40 2003-000111 R-METAL OXIDE;0.47ohm,5%,1W,AD,TP,4.3x12PR5 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMPR6 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPT01 AH26-00008A TRANS-SWITCHING;-,85V-240V,UL/CSA,EE2821PVA01 1405-000186 VARISTOR;470V,4500A,17x12mm,TPPZD31 0403-000716 DIODE-ZENER;MTZJ4.7B,4.7V,4.55-4.8V,500mRC12 2201-000812 C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,11xRC13 2201-000812 C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,11xRL03 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,SVJ1 3722-001375 JACK-DIN;4P,-,NI,BLK,-

VC1 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,VC10 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC100 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,VC101 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,VC102 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VVC103 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VVC104 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VVC105 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012VC11 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC12 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC13 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC14 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC2 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,VC3 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,VC4 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC5 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC6 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC7 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC8 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC9 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VE51 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5VE54 2401-000369 C-AL;100UF,20%,6.3V,GP,-,6.3X11,5VE55 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mVE58 2401-000369 C-AL;100UF,20%,6.3V,GP,-,6.3X11,5VE58A 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mVE60 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5VE61 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mVE66 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5VE67 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mVE69 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5VE70 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5VE71 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5VE72 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5VE73 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5VFD1 AH07-00002A VF-DISPLAY;SVV-08M,21SEG,25X100MM,DVD-90VIC50 1204-001366 IC-VIDEO ENCODER;SAA7128,QFP,44P,-,PLASTVIC51 1201-001419 IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,VIC52 1201-001419 IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,VL100 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL110 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,VL111 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,VL112 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL113 2701-000138 INDUCTOR-AXIAL;18uH,5%,2.4x3.4mmVL115 2701-000002 INDUCTOR-AXIAL;100uH,10%,4.2x9.8mmVL116 2701-000002 INDUCTOR-AXIAL;100uH,10%,4.2x9.8mmVL119 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VR10 2001-000008 R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR100 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMVR108 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MMVR109 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR11 2001-000008 R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR110 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR111 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR112 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR113 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR114 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR115 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR116 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR117 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MMVR12 2001-000591 R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR13 2001-000591 R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR130 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MMVR132 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MMVR133 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MMVR14 2001-000591 R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR146 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM

Electrical Parts List

Samsung Electronics 9-7

Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark

Page 85: ELECTRONICS - dzsc.com

VR15 2001-000734 R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR16 2001-000734 R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR17 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR175 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MMVR176 2001-000554 R-CARBON;270OHM,5%,1/8W,AA,TP,1.8X3.2MMVR177 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MMVR178 2001-000003 R-CARBON;330OHM,5%,1/8W,AA,TP,1.8X3.2MMVR18 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR192 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MMVR4 2001-000221 R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR5 2001-000221 R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR7 2001-000977 R-CARBON;8.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR8 2001-000977 R-CARBON;8.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR9 2001-000008 R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM

701 ASSY-PCB-POWERCON24 AH39-00033A LEAD CONNECTOR-ASSY;-,51004-04,35023-04,KD2 0601-001238 LED;ROUND,RED,3.1mm,697nmKSW2 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S

702 ASSY-PCB-PLAYCON22 AH39-00028A LEAD CONNECTOR-ASSY;-,51004-06,35023-06,FSW1 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,SFSW2 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,SFSW4 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,SFSW5 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,SFSW6 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S

202 ASSY-PCB-DECK;DP-3,-CN1 3708-001081 CONNECTOR-FPC/FC/PIC;11P,1mm,STRAIGHT,SNCN2 3708-001001 CONNECTOR-FPC/FC/PIC;20P,1mm,SMD-A,SNCN3 3711-000827 CONNECTOR-HEADER:BOX,2P,1R,2mm,STRAIGHT,CN4 3708-001108 CONNECTOR-FPC/FC/PIC;8P,1.0MM,ANGLE,SNCN5 3708-001084 CONNECTOR-FPC/FC/PIC;40P,1.25mm,ANGLE,SNDC1 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216DC2 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216DC3 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216DC4 2203-000612 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,3216,DE1 2404-000259 C-TA,CHIP;47uF,20%,6.3V,-,TP,6032,-DE2 2404-000259 C-TA,CHIP;47uF,20%,6.3V,-,TP,6032,-DL1 3301-000325 CORE-FERRITE BEAD;AB,3.2x2.5x1.3mm,-,-DLED 0601-001372 LED;ROUND,GRN,3.5MM,621NMDR1 2007-000800 R-CHIP;360ohm,5%,1/8W,DA,TP,3216DR2 2007-000451 R-CHIP;180OHM,5%,1/8W,DA,TP,3216DR3 2007-000451 R-CHIP;180OHM,5%,1/8W,DA,TP,3216DR4 2007-000303 R-CHIP;10KOHM,5%,1/8W,DA,TP,3216DR5 2007-000303 R-CHIP;10KOHM,5%,1/8W,DA,TP,3216SW1 AH34-30001A SWITCH-PUSH;2EA,6.65X7.5,-,DC5VSW2 3403-001001 SWITCH-PUSH;5V,5mA,-,OFF-ONSW3 3408-000323 SWITCH-SLIDE;SSSS712GD011/12VDC 100ma

Loc.No Part No Description ; Specification Remark

9-8 Samsung Electronics

Electrical Parts List

Loc.No Part No Description ; Specification Remark

Page 86: ELECTRONICS - dzsc.com

Samsung Electronics 10-1

10. Block Diagram

DECK ASS'Y

DiscMotor

Disc MotorDriver

Actuator &Motor Driver

FeedMotor

DIC2 4M DRAM VIC4/10 32M SDRAM

2K EEPROM

Pick-UP& I/V Amp

Remote Control

AMP

AMP

AMP

Coaxial

LT

RT

YoutCout

SIC1(KS1452)

Digital Servo

DIC1(KS1453)

DVD & CD Processor

RIC1(KS1461)

RF Amp & DPD

MIC8 8M EPROM MIC1(TMP93CM41F)Main Controller

FIC1(LC86P6232)

Front Controller

VIC1(ZiVA-3)

A/V Decoder

VIC50(SAA7128)

Video Encoder

AIC1(AK4324)

Audio DAC

CVBS

LPF

LPF

AMP

AMP

AMP

AMP

AMP

Y

Pb

Pr

Page 87: ELECTRONICS - dzsc.com

Block Diagrams

10-2 Samsung Electronics

MEMO

Page 88: ELECTRONICS - dzsc.com

Samsung Electronics 11-1

11. PCB Diagrams

11-2

11-3

11-4

11-4

11-4

11-1 Main - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-2 Jack - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-3 Power - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-4 Play - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-5 Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

Page 89: ELECTRONICS - dzsc.com

PCB Diagrams

11-2 Samsung Electronics

11-1 MainCO

MPO

NEN

T SI

DE

SOLD

ER S

IDE

Page 90: ELECTRONICS - dzsc.com

PCB Diagrams

Samsung Electronics 11-3

11-2 Jack

Page 91: ELECTRONICS - dzsc.com

PCB Diagrams

11-4 Samsung Electronics

11-5 Deck

11-4 Play

11-3 Power

Page 92: ELECTRONICS - dzsc.com

Samsung Electronics 12-1

12. Wiring Diagram

JACK PCB

MAIN PCB

DECK PCB

PLAY PCB

POWER PCB

Page 93: ELECTRONICS - dzsc.com

Wiring Diagram

12-2 Samsung Electronics

MEMO