electronic costing & technology experts€¦ · • the fingerprint sensor die has been first...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

August 2016 – Version 1 – Written by Stéphane ELISABETH

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

Qualcomm Snapdragon Sense ID Fingerprint sensor

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Glossary

1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 10

– Qualcomm

3. Physical Analysis 13

– Synthesis of the Physical Analysis

– LeEco LeMax Pro X820 disassembly 15

– Fingerprint sensor Removal

– Fingerprint sensor assembly view

– Fingerprint sensor Cross Section

– Sensor Die 41

– Sensor Die View, Marking & Dimensions

– Sensor Die PMUT

– Sensor Die Edge Contacts

– Sensor Delayering & main Blocs

– Sensor Die Process

– Sensor Die Cross-Section

– IC Control Unit 67

– Package View, Marking & Dimensions

– Die View, Marking & Dimensions

– Die Overview & Delayering

– Die Main Blocks ID

– Die Process

– Die Cross-Section

– Process Characteristics

4. Sensor Manufacturing Process 86

– Sensor Die Front-End Process & Fabrication Unit

– ASIC Die Front-End Process & Fabrication Unit

– Final Test & Packaging Fabrication unit

– Synthesis of the main parts

– Ultrasonic Sensor – Process Flow

– Fingerprint Assembly – Process Flow

5. Cost Analysis 99

– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields Explanation & Hypotheses

– QBIC Component 104

– QBIC Die Wafer Cost

– QBIC Die Cost

– QBIC Component Packaging Cost

– Sensor die 108

– Sensor Die Front-End Cost

– Sensor Die Probe Test, Thinning & Dicing

– Sensor Die Wafer Cost

– Sensor Die Cost

– Complete Module Fingerprint 114

– Assembled Components Cost

– Synthesis of the assembling

– Fingerprint Component Cost

– Fingerprint Component Price

6. Fingerprint sensors Comparison 124

7. Related Reports 130

Contact

Customer Satisfaction Survey 134[New]


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the Qualcomm Snapdragon Sense ID Ultrasonic Fingerprint

Sensor.

• The fingerprint sensor die has been first introduced in the LeEco LeMax Pro. Located on the back of

the device under 400 µm of metal and supported by stainless metal, the fingerprint sensor uses

ultrasonic technology developed by Qualcomm offering 3D imaging of the fingerprint.

• The sensor has a resolution of 14,400 pixels with a pixel density of 508ppi. It uses the Qualcomm

Ultrasonic Sensing Principle to take an image of the fingerprint providing a more secure, reliable

alternative to capacitive-based fingerprint sensor.

• The sensor die is manufactured on glass with LTPS technology and it is connected to flex PCB. The

solution features a QBIC (Qualcomm Biometric Integrated Circuit) designed to protect user’

biometric information enhancing the user experience with convenient, secure alternative to

password and by consistently scanning through common fingerprint contaminants, including water

and oil.

• The report includes comparisons with the latest Huawei’s, Samsung’s and Apple’s fingerprints

buttons.


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Fingerprint sensor Cross-section plane – Optical View


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Fingerprint sensor Cross-section – SEM view


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PMUTs


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• Reverse costing analysis represents the best cost/price evaluation given the publically available data, andestimates completed by industry experts.

• Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10%correction on the manufacturing cost (if all parameters are cumulated)

• These results are open for discussion. We can reevaluate this circuit with your information. Please contactus:

electronic costing & technology experts€¦ · • the fingerprint sensor die has been first...

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