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Electroactive Polymers andRapid Prototyping

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Cambridge University Press978-1-107-41203-3 - Electroactive Polymers and Rapid PrototypingEdited by Yoseph Bar-Cohen, Qiming M. Zhang, Eiichi Fukada, Siegfried Bauer, Douglas B. Chrisey and Stephen C. Danforth FrontmatterMore information

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MATERIALS RESEARCH SOCIETYSYMPOSIUM PROCEEDINGS VOLUME 698

Electroactive Polymers andRapid Prototyping

Symposia held November 26-30, 2001, Boston, Massachusetts, U.S.A.

EDITORS:

Yoseph Bar-CohenJet Propulsion Laboratory

Pasadena, California, U.S.A.

Qiming M. ZhangPennsylvania State University

University Park, Pennsylvania, U.S.A.

Eiichi FukadaKobayasi Institute of Physical Research

Tokyo, Japan

Siegfried BauerJohannes-Kepler Universitaet Linz

Linz, Austria

Douglas B. ChriseyNaval Research Laboratory

Washington, DC, U.S.A.

Stephen C. DanforthRutgers University

Piscataway, New Jersey, U.S.A.

IMIRIS1Materials Research Society

Warrendale, Pennsylvania






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CONTENTS

Preface: Symposium EE xi

Preface: Symposium Q xiii

Materials Research Society Symposium Proceedings xiv

SYMPOSIUM EE

NOVEL ELECTROACTIVE POLYMERACTUATOR MATERIALS

* Conducting Polymers and Carbon Nanotubes asElectromechanical Actuators and Strain Sensors 5

Geoffrey M. Spinks, Gordon G. Wallace, Lu Liu,and Dezhi Zhou

Fabrication and Characterization of Polyaniline IntegrallySkinned Asymmetric Membranes for the Construction ofMonolithic Chemical Actuators 17

Junbo Gao, Jose-Maria Sansinena, and Hsing-Lin Wang

Parallel Electrochemical Methods to Accelerate ElectroactiveMaterial Discovery and Optimization 23

Peter G. Madden, John D. Madden, and Ian W. Hunter

* Electroactive Polymers Based Skin and Muscles for Man MachineInterfaces 29

Federico Carpi, Federico Lorussi, Alberto Mazzoldi,Giovanni Pioggia, Enzo Pasquale Scilingo, and Danilo De Rossi

ELECTROACTIVE POLYMER DEVICEAPPLICATIONS (INCLUDING THIN FILMS)

The Electroactive Polymers Infrastructure 37Yoseph Bar-Cohen

* Sound Reflection and Absorption by Piezoelectric Polymer Films 43Hidekazu Kodama, Tomonao Okubo, Munehiro Date,and Eiichi Fukada

* Ferroelectric Polymers for High Pressure and Shock CompressionSensors 53

Francois Bauer

* Invited Paper






Device Fabrication and Performance of ElectrostrictiveP(VDF-TrFE) Based Actuators and Transducers 65

Z.-Y. Cheng, T.-B. Xu, J. Hundal, and Q.M. Zhang

* Thickness Dependence of Ferroelectric Properties in Copolymersof Vinylidene Fluoride and Trifluoroethylene 71

Takeo Furukawa, Shigeru Sakai, and Yoshiyuki Takahashi

Finite Size Effect in Thin and Ultra-Thin Ferroelectric PolymerFilms 79

Feng Xia, B. Razavi, Z.-Y. Cheng, and Q.M. Zhang

Morphology, Annealing, and Melting of Ferroelectric Langmuir-Blodgett Films of Vinylidene Fluoride (70%) Trifluoroethylene (30%)Copolymer 85

M. Bai, Matt Poulsen, A.V. Sorokin, Stephen Ducharme,and V.M. Fridkin

NOVEL ELECTROACTIVE POLYMERS I

Sensing Mechanism of Conducting Polymer Sensor for VolatileOrganic Compounds 95

Jeung-Soo Huh, Ha Ryong Hwang, Jin Gyu Roh,Duk Dong Lee, and Jeong-Ok Lim

Surface Modification of Neural Recording Microelectrodes WithConducting Polymers 101

Xinyan Tracy Cui and David C. Martin

Ferroelectric Polarization Reversal of Polymers Under HighHydrostatic Pressure 107

Susumu Ikeda, Toshinao Yuki, Takeshi Nojiri,Hideshige Suzuki, and Tomonori Koda

High Frequency Dielectric Relaxation in Polymers Filled WithFerroelectric Ceramics 113

N. Noda and J. Obrzut

NOVEL ELECTROACTIVE POLYMERS II

* Toward Molecular Muscles: Design of SingleMolecule Electromechanical Actuators Based onPoly(Tetra[2,3-thienylene])s 121

Michael J. Marsella

* Invited Paper






Giant Optical Rotatory Power and Light Modulation in PolylacticAcid Film 125

Yoshiro Tajitsu

Load and Time Dependence of Displacement in a ConductingPolymer Actuator 137

John D. Madden, Peter G. Madden, Patrick A. Anquetil,and Ian W. Hunter

Characterization of the Electromechanical Properties of IPMC 145Yoseph Bar-Cohen, Xiaoqi Bao, Shyh-Shiuh Lih,Kaushik Bhattacharya, and Xiao Yu

Factors Affecting Electro-Actuation Rate in Partially NeutralizedPolyelectrolytes Gels 151

LA. Rousseau and P.T. Mather

Finite-Elastic Mechanical Analysis of Bending Gel Actuators 159Steven P. Marra, K.T. Ramesh, and Andrew S. Douglas

Multifunctional Electroelastomer Rolls 165Qibing Pei, Ron Pelrine, Scott Stanford, Roy Kornbluh,Marcus Rosenthal, Kenneth Meijer, and Robert Full

NOVEL ELECTROACTIVE POLYMERS HI

Heterogeneous Space Charge Electrets: Materials With Large andBroadband Piezoelectricity 173

S. Bauer, S. Bauer-Gogonea, M. Dansachmuller, M. Lindner,and R. Schwodiauer

* Thermally Stimulated Current Spectroscopy of Polymers 179Kazuo Ikezaki

Characterization and Development of P(VDF-TrFE) Based HighPerformance Electroactive Terpolymers 191

D. Olson, H.S. Xu, Hengfeng Li, Z.-Y. Cheng, Q.M. Zhang,R. Ting, G. Abdul-Sedat, K.D. Belfield, T. Ramotowski,R. Hughes, and G. Kavarnos

Molecular Modeling Studies on High-Strain, ElectrostrictiveTerpolymers 197

George J. Kavarnos, Thomas Ramotowski, Richard Hughes,Qiming Zhang, and Dana Olson

* Invited Paper






Chemical and Physical Changes Associated With High-StrainElectrostriction in Beta-Irradiated PVDF-TrFE 203

Thomas Ramotowski, O. Richard Hughes, George Kavamos,Karen Gleason, Qiming Zhang, and Robert Ting

New Ferroelectric Fluoro-Terpolymers Based on VDF, TrFE,Bulky Termonomers; High Dielectric Constant and Large ElectricResponse at Ambient Temperature 211

T.C. Chung and A. Petchsuk

Model Development for High Performance Piezoelectric Polymers 217Ralph C. Smith and Zoubeida Ounaies

SYMPOSIUM Q

DIRECT WRITING ELECTRONICCOMPONENTS

* Rapid Prototyping of Plastic Micro Devices by Excimer LaserAblation 227

Thomas Klotzbuecher, Peyman Mirtaheri, and Torsten Braune

* An Integrated Tool for Rapid Prototyping of Electronic CircuitsUsing a Laser Direct Write Technique 239

Scott A. Mathews, Michael Duignan, Paolina Atanassova,Hugh Denham, Rohit Modi, and Ray Auyeung

RAPID PROTOTYPING SENSORSAND STRUCTURES

Rapid Prototyping of Ceramic Based Photonic BandgapStructures 251

Jennifer Synowczynski, Samuel Hirsch, and Bonnie Gersten

Processing and Characterization of A12O3 and Al2O3/Cu AlloyComposites 257

R.C. McCuiston, S.C. Danforth, and D.E. Niesz

ENERGY STORAGE AND MODELING

* Direct Write Microbatteries for Next-Generation MicroelectronicDevices 265

Karen E. Swider-Lyons, Alberto Pique, Craig B. Arnold, andRyan C. Wartena

Vll l






Laser Direct Writing of Hydrous Ruthenium DioxideMicro-Pseudocapacitors 275

Craig B. Arnold, Ryan C. Wartena, Bhanu Pratap,Karen E. Swider-Lyons, and Alberto Pique

Direct-Write Processes as Enabling Tools for Novel AntennaDevelopment 281

Bryan S. Irwin, Robert M. Taylor, Michael J. Wilhelm,Kenneth H. Church, James W. Culver, and Douglas H. Werner

Dielectric Properties of Spray Deposited BaTiO3 and Ba0.68Sro.32Ti03 287Kipyung Ahn, Bruce W. Wessels, Robert Greenlaw, andSanjay Sampath

Microstructural Study and Thermal Modeling of Laser FormedTi-6A1-4V 293

S.M. Kelly and S.L. Kampe

Plume and Jetting Regimes in a Laser Based Forward TransferProcess as Observed by Time-Resolved Optical Microscopy 301

D. Young, R.C.Y. Auyeung, A. Pique, D.B. Chrisey, H. Denham,and Dana D. Dlott

LIQUID AND DISPENSINGDEPOSITION

Direct Ink Jet Printing of Alumina Components 309C. Ainsley, N. Reis, and B. Derby

Analysis of Drop-On-Demand Ink Jet Print Head for RapidPrototyping 315

Dong-Youn Shin, Paul Grassia, and Brian Derby

Chemical Vapor Deposition by Pulsed Ultrasonic Direct Injectionof Liquid Precursors Produces Versatile Method for Creation ofThin Film Circuits and Devices 321

Mark W. Leiby

TISSUE ENGINEERING

* Cell-by-Cell Construction of Living Tissue 329Bradley R. Ringeisen, Heungsoo Kim, H. Daniel Young,Barry J. Spargo, R.C.Y. Auyeung, Alberto Pique,Douglas Chrisey, and Peter K. Wu






Aerosol-Based Direct-Write of Biological Materials for BiomedicalApplications 343

Gregory J. Marquez, Michael J. Renn, and W. Doyle Miller

Direct-Write Construction of Tissue-Engineered Scaffolds 351Anatoly M. Kachurin, Robert L. Stewart, Kenneth H. Church,William L. Warren, John P. Fisher, Antonios G. Mikos,Stine-Katherine Kraeft, and Lan Bo Chen

Author Index 357

Subject Index 359






SYMPOSIUM EE

PREFACE

Since the first MRS meeting on Electroactive Polymers (EAP) that was held in 1999, thefield continued to emerge from its anonymity to the spotlight of the science and engineeringcommunity. The characteristics of inducing large displacements, lightweight, easy processing,low cost and the functionality to emulate biological muscles are making EAPs attractive forconsideration in an increasing number of applications. To make these materials actuators-of-choice, it is now well recognized that it would be necessary to solidify the technical foundationsand identify niche applications where their unique capabilities provide the necessary edge. Thissecond MRS symposium, Symposium EE, "Electroactive Polymers and Their Applications asActuators, Sensors, and Artificial Muscles," held November 26-27 at the 2001 MRS FallMeeting in Boston, Massachusetts, has been another important forum for researchers toexchange information, stimulate discussions, and present their recent advances to theparticipants. The symposium title reflects the wide range of issues that were covered rangingfrom fundamental materials understanding and characterization, to new material development,and to novel device concepts and demonstrations.

The presentations covered progress in the various areas of the EAP infrastructure. Thepapers focused on issues that can forge the transition to practical use, including improvedmaterials, better understanding of the principles responsible for the electromechanicalbehavior, analytical modeling, processing and characterization methods and considerations ofvarious applications. Papers in this symposium covered the following topics:

• Electroactive polymers (ferroelectric, conductive, IPMC, gel, etc.) and non-electroactive-polymers

• Models, analysis and simulation of EAP behavior• Methods of testing and characterization of EAP properties and performance• Support technologies including control, design and fabrication processes• Applications of EAP actuators

The efforts described in these papers are starting to show results in improved understandingof the materials electromechanical principles and better methods of addressing the challengesto the materials applications. Researchers are developing analytical and theoretical models todescribe the electrochemical and electromechanical processes, non-linear behavior as well asmethodologies of design and control. EAPs with improved response were described includingIPMC, dielectric and electrostrictive types. The invited speakers in this symposium helpedfocused on selected key topics. G. Spinks (University of Wollongong, Australia) reportedinvestigation on employing conducting polymer and carbon nanotubes as actuators for smartgloves in which conducting polymer coated stretched fibers were also used as sensors.Application to devices was described in the paper led by D. de Rossi (University of Pisa, Italy)covering research and development towards making EAP-based skin and muscles for manmachine interfaces. Progress towards developing molecular EAP was presented by M. Marsella(University of California-Riverside). F. Kremer (University Leipzig, Germany) presented aninteresting experimental finding of very high electromechanical responses from a side chainliquid crystalline elastomer. The molecular origin of this "giant" electrostrictive response isbased on the electroclinic effect. The work in the electrostrictive P(VDF-TrFE) shows that bythe terpolymer approach an electroactive polymer with electrostrictive strain higher than 5%and elastic energy density more than 1.4 J/cm3 can be realized. Other presenters described thedemonstration of exciting applications that were enabled by these high performanceelectroactive polymers. Another interesting topic of the symposium was the ferroelectric thinand ultrathin films. These films are attractive for memory and data storage devices, IRimaging, and MEMS. Overall this symposium included about 40 papers and it was well attended






by leading world experts in the field including members of academia, industry, and governmentagencies from the U.S.A. and overseas.

In closing, we would like to extend a special thanks to all the symposium attendees andsession chairs. A special thanks is extended to the MRS staff who helped make this symposiuma great success. We would also like to acknowledge the financial support to this symposiumfrom the Office of Naval Research and from Daikin US Corporation.

Yoseph Bar-CohenQiming M. ZhangEiichi FukadaSiegfried Bauer

January 2002






SYMPOSIUM Q

PREFACE

The goal of Symposium Q, "Rapid Prototyping Technologies—From Tissue Engineering toConformal Electronics," held November 28-30 at the 2001 MRS Fall Meeting in Boston,Massachusetts, was to identify and develop new materials approaches based on the rapidprototyping technique and to demonstrate the required electronic or other device performance.This symposium was a continuation of the very first Direct Write Symposium held at an MRSMeeting, i.e., Symposium V, "Materials Development for Direct Write Technologies," heldApril 24-26 at the 2000 MRS Spring Meeting in San Francisco, California, but there were alsotwo additional subject areas that the organizers wanted to combine with this original topic:rapid prototyping of 3-D structures as in Solid Free-Form Fabrication and the application ofrapid prototyping and direct writing to tissue engineering. Many different rapid prototypingapproaches were presented at this symposium, including fused deposition of ceramics,stereolithography, microstamping, directed assembly, plasma spray, laser particle guidance,MAPLE DW, laser CVD, micropen, inkjet and several novel liquid or droplet microdispensingapproaches. One theme common to all techniques for the rapid prototyping of inorganic andelectronic material was their dependence on high-quality starting materials, typically withspecially tailored chemistries and/or rheological properties. The multidisciplinary nature ofMRS was evident at the end of the symposium as a complete section was devoted to tissueengineering. Tissue and scaffolding materials were both rapidly prototyped and the symposiumtook on a very biological ambience. New materials and approaches were used to depositbiological tissue constructs as well as biocompatible scaffolding. For this application area, theissues and concerns are totally different from purely electronic and structural materials and it isimportant that the particular technique applied not be irreversibly destructive in nature. Ingeneral for Symposium Q, it was concluded that optimized starting materials are required forhigh-quality performance in the final structure produced.

Douglas B. ChriseyStephen C. Danforth

March 2002






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 664— Amorphous and Heterogeneous Silicon-Based Films—2001, M. Stutzmann, J.B. Boyce,J.D. Cohen, R.W. Collins, J. Hanna, 2001, ISBN: 1-55899-600-1

Volume 665— Electronic, Optical and Optoelectronic Polymers and Oligomers, G.E. Jabbour, B. Meijer,N.S. Sariciftci, T.M. Swager, 2002, ISBN: 1-55899-601-X

Volume 666— Transport and Microstructural Phenomena in Oxide Electronics, D.S. Ginley, M.E. Hawley,D.C. Paine, D.H. Blank, S.K. Streiffer, 2001, ISBN: 1-55899-602-8

Volume 667— Luminescence and Luminescent Materials, K.C. Mishra, J. McKittrick, B. DiBartolo,A. Srivastava, P.C. Schmidt, 2001, ISBN: 1-55899-603-6

Volume 668— II-VI Compound Semiconductor Photovoltaic Materials, R. Noufi, R.W. Birkmire, D. Lincot,H.W. Schock, 2001, ISBN: 1-55899-604-4

Volume 669— Si Front-End Processing—Physics and Technology of Dopant-Defect Interactions III, M.A. Foad,J. Matsuo, P. Stolk, M.D. Giles, K.S. Jones, 2001, ISBN: 1-55899-605-2

Volume 670— Gate Stack and Silicide Issues in Silicon Processing II, S.A. Campbell, C.C. Hobbs, L. Clevenger,P. Griffin, 2002, ISBN: 1-55899-606-0

Volume 671— Chemical-Mechanical Polishing 2001—Advances and Future Challenges, S.V. Babu, K.C. Cadien,J.G. Ryan, H. Yano, 2001, ISBN: 1-55899-607-9

Volume 672— Mechanisms of Surface and Microstrucure Evolution in Deposited Films and Film Structures,J. Sanchez, Jr., J.G. Amar, R. Murty, G. Gilmer, 2001, ISBN: 1-55899-608-7

Volume 673— Dislocations and Deformation Mechanisms in Thin Films and Small Structures, O. Kraft,K. Schwarz, S.P. Baker, B. Freund, R. Hull, 2001, ISBN: 1-55899-609-5

Volume 674— Applications of Ferromagnetic and Optical Materials, Storage and Magnetoelectronics, W.C. Black,H.J. Borg, K. Bussmann, L. Hesselink, S.A. Majetich, E.S. Murdock, B.J.H. Stadler, M. Vazquez,M. Wuttig, J.Q. Xiao, 2001, ISBN: 1-55899-610-9

Volume 675— Nanotubes, Fullerenes, Nanostructured and Disordered Carbon, J. Robertson, T.A. Friedmann,D.B. Geohegan, D.E. Luzzi, R.S. Ruoff, 2001, ISBN: 1-55899-611-7

Volume 676— Synthesis, Functional Properties and Applications of Nanostructures, H.W. Hahn, D.L. Feldheim,C.P. Kubiak, R. Tannenbaum, R.W. Siegel, 2002, ISBN: 1-55899-612-5

Volume 677— Advances in Materials Theory and Modeling—Bridging Over Multiple-Length and Time Scales,L. Colombo, V. Bulatov, F. Cleri, L. Lewis, N. Mousseau, 2001, ISBN: 1-55899-613-3

Volume 678— Applications of Synchrotron Radiation Techniques to Materials Science VI, P.G. Allen, S.M. Mini,D.L. Perry, S.R. Stock, 2001, ISBN: 1-55899-614-1

Volume 679E—Molecular and Biomolecular Electronics, A. Christou, E.A. Chandross, W.M. Tolles, S. Tolbert,2001, ISBN: 1-55899-615-X

Volume 680E—Wide-Bandgap Electronics, T.E. Kazior, P. Parikh, C. Nguyen, E.T. Yu, 2001,ISBN: 1-55899-616-8

Volume 68IE—Wafer Bonding and Thinning Techniques for Materials Integration, T.E. Haynes, U.M. Gosele,M. Nastasi, T. Yonehara, 2001, ISBN: 1-55899-617-6

Volume 682E—Microelectronics and Microsystems Packaging, J.C. Boudreaux, R.H. Dauskardt, H.R. Last,F.P. McCluskey, 2001, ISBN: 1-55899-618-4

Volume 683E—Material Instabilities and Patterning in Metals, H.M. Zbib, G.H. Campbell, M. Victoria,D.A. Hughes, L.E. Levine, 2001, ISBN: 1-55899-619-2

Volume 684E—Impacting Society Through Materials Science and Engineering Education, L. Broadbelt,K. Constant, S. Gleixner, 2001, ISBN: 1-55899-620-6

Volume 685E—Advanced Materials and Devices for Large-Area Electronics, J.S. Im, J.H. Werner, S. Uchikoga,T.E. Felter, T.T. Voutsas, H.J. Kim, 2001, ISBN: 1-55899-621-4

Volume 686— Materials Issues in Novel Si-Based Technology, W. En, E.C. Jones, J.C. Sturm, S. Tiwari,M. Hirose, M. Chan, 2002, ISBN: 1-55899-622-2

Volume 687— Materials Science of Microelectromechanical Systems (MEMS) Devices IV, A.A. Ayon,S.M. Spearing, T. Buchheit, H. Kahn, 2002, ISBN: 1-55899-623-0

Volume 688— Ferroelectric Thin Films X, S.R. Gilbert, Y. Miyasaka, D. Wouters, S. Trolier-McKinstry,S.K. Streiffer, 2002, ISBN: 1-55899-624-9






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 689— Materials for High-Temperature Superconductor Technologies, M.P. Paranthaman, M.W. Rupich,K. Salama, J. Mannhart, T. Hasegawa, 2002, ISBN: 1-55899-625-7

Volume 690— Spintronics, TJ. Klemmer, J.Z. Sun, A. Fert, J. Bass, 2002, ISBN: 1-55899-626-5Volume 691— Thermoelectric Materials 2001—Research and Applications, G.S. Nolas, D.C. Johnson,

D.G. Mandrus, 2002, ISBN: 1-55899-627-3Volume 692— Progress in Semiconductor Materials for Optoelectronic Applications, E.D. Jones, M.O. Manasreh,

K.D. Choquette, D. Friedman, 2002, ISBN: 1-55899-628-1Volume 693— GaN and Related Alloys—2001, J.E. Northrup, J. Neugebauer, S.F. Chichibu, D.C. Look,

H. Riechert, 2002, ISBN: 1-55899-629-XVolume 695— Thin Films: Stresses and Mechanical Properties IX, C.S. Ozkan, R.C. Cammarata, L.B. Freund,

H. Gao, 2002, ISBN: 1-55899-631-1Volume 696— Current Issues in Heteroepitaxial Growth—Stress Relaxation and Self Assembly, E. Stach,

E. Chason, R. Hull, S. Bader, 2002, ISBN: 1-55899-632-XVolume 697— Surface Engineering 2001—Fundamentals and Applications, W.J. Meng, A. Kumar, Y-W. Chung,

G.L. Doll, Y-T. Cheng, S. Veprek, 2002, ISBN: 1-55899-633-8Volume 698— Electroactive Polymers and Rapid Prototyping, Y. Bar-Cohen, D.B. Chrisey, Q.M. Zhang,

S. Bauer, E. Fukada, S.C. Danforth, 2002, ISBN: 1-55899-634-6Volume 699— Electrically Based Microstructural Characterization III, R.A. Gerhardt, A. Washabaugh, M.A. Alim,

G.M. Choi, 2002, ISBN: 1-55899-635-4Volume 700— Combinatorial and Artificial Intelligence Methods in Materials Science, I. Takeuchi, C. Buelens,

H. Koinuma, E.J. Amis, J.M. Newsam, L.T. Wille, 2002, ISBN: 1-55899-636-2Volume 702— Advanced Fibers, Plastics, Laminates and Composites, F.T. Wallenberger, N. Weston, K. Chawla,

R. Ford, R.P. Wool, 2002, ISBN: 1-55899-638-9Volume 703— Nanophase and Nanocomposite Materials IV, S. Komarneni, R.A. Vaia, G.Q. Lu, J-I. Matsushita,

J.C. Parker, 2002, ISBN: 1-55899-639-7Volume 704— Nanoparticle Materials, R.K. Singh, R. Partch, M. Muhammed, M. Senna, H. Hofmann, 2002,

ISBN: 1-55899-640-0Volume 705— Nanopatterning—From Ultralarge-Scale Integration to Biotechnology, L. Merhari, K.E. Gonsalves,

E.A. Dobisz, M. Angelopoulos, D. Herr, 2002, ISBN: 1-55899-641-9Volume 706— Making Functional Materials with Nanotubes, P. Nikolaev, P. Bernier, P. Ajayan, Y. Iwasa, 2002,

ISBN: 1-55899-642-7Volume 707— Self-Assembly Processes in Materials, S. Moss, 2002, ISBN: 1-55899-643-5Volume 708— Organic and Optoelectronic Materials, Processing and Devices, S. Moss, 2002,

ISBN: 1-55899-644-3Volume 709— Advances in Liquid Crystalline Materials and Technologies, P.T. Mather, D.J. Broer, T.J. Bunning,

D.M. Walba, R. Zentel, 2002, ISBN: 1-55899-645-1Volume 710— Polymer Interfaces and Thin Films, C.W. Frank, 2002, ISBN: 1-55899-646-XVolume 711— Advanced Biomaterials—Characterization, Tissue Engineering and Complexity, 2002,

ISBN: 1-55899-647-8Volume 712— Materials Issues in Art and Archaeology VI, P.B. Vandiver, M. Goodway, J.R. Druzik, J.L. Mass,

2002, ISBN: 1-55899-648-6Volume 713— Scientific Basis for Nuclear Waste Management XXV, B.P. McGrail, G.A. Cragnolino, 2002,

ISBN: 1-55899-649-4Volume 714E—Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics II,

S. Lahiri, 2002, ISBN: 1-55899-650-8

Prior Materials Research Society Symposium Proceedings available by contacting Materials Research Society






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