eecs151 : introduction to digital design and ics cmos

6
inst.eecs.berkeley.edu/~eecs151 Bora Nikoliü EECS151 : Introduction to Digital Design and ICs Lecture 14 – Gate Delays 1 EECS151 L13 DELAY 1LNROLü )DOO EETimes 0RRUH¶V /DZ &RXOG 5LGH (89 IRU 0RUH <HDUV September 30, 2021, EETimes - ASML plans to introduce new extreme ultraviolet (EUV) lithography equipment that will extend the longevity of Moore’s Law for at least ten years, according to executives at the world’s only supplier of the tools, which are crucial for the world’s most advanced silicon. Starting in the first half of 2023, the company plans to offer customers equipment that takes EUV numerical aperture (NA) higher to 0.55 NA from the existing 0.33 NA. The company believes that the new equipment will help chip makers reach process nodes well beyond the current threshold (2nm) for at least another 10 years, according to ASML vice president Teun van Gogh, in an interview with EE Times. Review CMOS allows for convenient switch level abstraction CMOS pull-up and pull-down networks are complementary Graph models for CMOS gates Transistor sizing affects gate performance EECS151 L13 DELAY 2 1LNROLü )DOO CMOS Sizing 1LNROLþ )DOO 3 EECS151 L13 DELAY Transistor Sizing Impact of Wp/Wn on VTC 1LNROLþ )DOO 4 Out A VDD M2 M1 V A V Out V DD V DD 0 Switching point V DD /2 Wp/Wn 0 Switching point In the past, Wp > Wn (see Rabaey, 2 nd ed) In modern processes (ILQ)(7), Wp = Wn Wp Wn EECS151 L13 DELAY Weak dependence on Wp/Wn CMOS Delay 1LNROLþ )DOO 5 EECS151 L13 DELAY Capacitances C in is largely set by the gate cap ~WL 2xW = 2xC in It is non-linear, but we will ignore that 1LNROLþ )DOO 6 Out A VDD M2 M1 Wp Wn C in C p C p is largely set by the drain cap ~W (drain area/perimeter) 2xW = 2xC p C p = JC in W L Source (S) Drain (D) Gate (G) EECS151 L13 DELAY Gate Sizing Doubling the gate size (by doubling Ws): 1LNROLþ )DOO 7 Out A VDD M2 M1 Wp Wn C in Doubles C in Halves equivalent gate resistance Doubles C p C p EECS151 L13 DELAY Inverter Delay How to time this? 1LNROLþ )DOO 8 C load = C in (next gate) R eq, C p Each gate has an R eq and drives C in of the next gate Out In R eq, C p C in Out VDD Req,p Req,n Cp + CL EECS151 L13 DELAY

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Page 1: EECS151 : Introduction to Digital Design and ICs CMOS

inst.eecs.berkeley.edu/~eecs151

Bora Nikoli

EECS151 : Introduction to Digital Design and ICs

Lecture 14 – Gate Delays

1EECS151 L13 DELAYEETimes

September 30, 2021, EETimes - ASML plans to introduce new extreme ultraviolet (EUV) lithography equipment that will extend the longevity of Moore’s Law for at least ten years, according to executives at the world’s only supplier of the tools, which are crucial for the world’s most advanced silicon.

Starting in the first half of 2023, the company plans to offer customers equipment that takes EUV numerical aperture (NA) higher to 0.55 NA from the existing 0.33 NA. The company believes that the new equipment will help chip makers reach process nodes well beyond the current threshold (2nm) for at least another 10 years, according to ASML vice president Teun van Gogh, in an interview with EE Times.

Review

• CMOS allows for convenient switch level abstraction

• CMOS pull-up and pull-down networks are complementary• Graph models for CMOS gates

• Transistor sizing affects gate performance

EECS151 L13 DELAY 2

CMOS Sizing

3EECS151 L13 DELAY

Transistor Sizing

• Impact of Wp/Wn on VTC

4

OutA

VDD

M2

M1

VA

VOut

VDD

VDD

0

Switching pointVDD/2

Wp/Wn0

Switching point

• In the past, Wp > Wn (see Rabaey, 2nd ed)

• In modern processes ( ), Wp = Wn

Wp

Wn

EECS151 L13 DELAY

• Weak dependenceon Wp/Wn

CMOS Delay

5EECS151 L13 DELAY

Capacitances

• Cin is largely set by the gate cap• ~WL

• 2xW = 2xCin

• It is non-linear, but we will ignore that

6

OutA

VDD

M2

M1

Wp

WnCin

Cp

• Cp is largely set by the drain cap• ~W (drain area/perimeter)• 2xW = 2xCp

Cp = Cin

W

L

Source (S) Drain (D)Gate (G)

EECS151 L13 DELAY

Gate Sizing

• Doubling the gate size (by doubling Ws):

7

OutA

VDD

M2

M1

Wp

Wn

Cin

• Doubles Cin

• Halves equivalent gate resistance

• Doubles Cp

Cp

EECS151 L13 DELAY

Inverter Delay

• How to time this?

8

Cload= Cin (next gate)

Req, Cp

• Each gate has an Req and drives Cin of the next gate

OutIn

Req, Cp

Cin

Out

VDD

Req,p

Req,n

Cp + CL

EECS151 L13 DELAY

Page 2: EECS151 : Introduction to Digital Design and ICs CMOS

Inverter Delay

• High-to-low

9

OutIn

Out

VDD

Req,p

Req,n

Cp + CL

Out

Req,n

Cp + CL

0

0

Vin

Vout

In

In

VDD

VDD

VDD/2

tp

Vout=VDDet

tp,HL= (ln2) = 0.7 Req,n(Cp+CL)

= Req,n(Cp+CL)

EECS151 L13 DELAY

Inverter Delay

10

OutIn

Out

VDD

Req,p

Req,n

Cp + CL

0

0

Vin

Vout

In

In

VDD

VDD

VDD/2

tp

Vout=VDD(1 et)

tp,LH= (ln2) = 0.7 Req,p(Cp+CL)Out

VDD

Req,p

Cp + CL

EECS151 L13 DELAY

Equivalent Resistances

• Transistor IDS-VDS trajectory

• Averaging produces Req

11

VDS

IDS VGS= VDD

VGS= 0

Out

Req,n

Cp + CL

0

0

Vin

IDS

VDD

VDD

VDD/2

tp

0

t

t

t

Vout

VDDVDD/2

Req (VGS=VDD, VDS=VDD)

Req (VGS=VDD, VDS=VDD/2)

EECS151 L13 DELAY

Equivalent Resistances

• Transistor IDS-VDS trajectory

• Averaging produces Req

12

VDS

IDS VGS= VDD

VGS= 0

Out

Req,n

Cp + CL

0

0

Vin

IDS

VDD

VDD

VDD/2

tp

0

t

t

t

Vout

VDDVDD/2

Req (VGS=VDD, VDS=VDD)

Req (VGS=VDD, VDS=VDD/2)

Req = (Req,start + Req,mid)/2

EECS151 L13 DELAY

Optimal P/N Sizing

• Increasing Wp:• Reduces Rp, increases Cin,p

• Reduces tp,LH

• Increases tp,HL

• Optimum • Wp/Wn = 2 in older technologies, with velocity saturation (like 130nm)

• Wp/Wn = 1.6 in technologies with strained silicon (e.g. 28nm)

• Wp/Wn = 1 in technologies

EECS151 L13 DELAY 13

In

VDD

Wp/L

Wn/L

Out

In2

VDD

Wp/L

Wn/L

• Impacts the IDS-VDS trajectory

14

VDS

IDSVGS

Out

Req,n

Cp + CL

0

0

Vin

IDS

VDD

VDD

VDD/2

tp (tr=0)

0

t

t

t

Vout

tp (tr)

EECS151 L13 DELAY

• Impacts the IDS-VDS trajectory

15

VDS

IDSVGS

Out

Req,n

Cp + CL

0

0

Vin

IDS

VDD

VDD

VDD/2

tp (tr=0)

0

t

t

t

Vout

tp (tr)

EECS151 L13 DELAY

Impact of Supply Voltage

• Lowering VDD, slows down the circuit

16

VDS

IDSVGS

Out

Req,n

Cp + CL

0

0

Vin

IDS

VDD

VDD

VDD/2

0

t

t

t

Vout

EECS151 L13 DELAY

Page 3: EECS151 : Introduction to Digital Design and ICs CMOS

Quiz: Inverter Delay

• If we double the load capacitance, assuming the default Vout shown in blue, which of the following waveforms shows the new Vout?

17

Out

Req,n

Cp + CL

0

0

Vin

Vout

VDD

VDD

VDD/2

tp

0

Vout

VDD

VDD/2

tp

0

Vout

VDD

VDD/2

tp

0

Vout

VDD

VDD/2

tp

A

B

C

EECS151 L13 DELAY

Sizing CMOS Gates

18EECS151 L13 DELAY

Sizing for equal output resistance

• In velocity-saturated devices Ion of a stack is 2/3 (not a half) of two devices• So the correct upsizing factor is 1.5 (not 2)

• We will use 2, as it makes calculations easier

19

Out

B

VDD

A

OutA

VDD

1

1

1 1

2

2Cin = 2

Cin = 3

Cp = 2

Cp = 4

Req = 1Req = 1

EECS151 L13 DELAY

Other Gates, NOR2, NAND3

20

OutA

VDD

B

Cin = 3Cp = 4

Out

B

VDD

A

C

EECS151 L13 DELAY

Stack Ordering

21

Out

B

VDD

A

• Critical path goes on top of stack

Out

B

VDD

A

EECS151 L13 DELAY

Administrivia• Homework 5 due this week

• Lab 6 (last) this week

• Projects start next week

• There is still time to apply for undergrad scholarships in SoC design!

• Have you thought about doing undergrad research?

EECS151 L13 DELAY 22

Minimizing Logic Delay

23EECS151 L13 DELAY

Inverter RC Delay

• tp = Req(Cp + CL) = Req( Cin+ CL)• = 1 (closer to 1.2 in recent processes)

• tp = ReqCin(1+CL/Cin) = INV(1+f)• Propagation delay is proportional to fanout

• Normalized Delay = 1 + f

24

CL= Cin (next gate)

OutIn

Req, Cp

= f = CL/Cin

tp = INV(1+f)

EECS151 L13 DELAY

Page 4: EECS151 : Introduction to Digital Design and ICs CMOS

Generalizing to Arbitrary Gates• Delay has two components: d = f + p

• f: effort delay = gh (a.k.a. stage effort)• Again has two components

• g: logical effort• Measures relative ability of gate to deliver current• g = 1 for inverter

• h: electrical effort = Cout / Cin

• Ratio of output to input capacitance• Sometimes called fanout

• p: parasitic delay• Represents delay of gate driving no load• Set by internal parasitic capacitance

25EECS151 L13 DELAY

Inverter Delay

• Parasitic p is the ratio of intrinsic capacitance to an inverter

• p(inverter) =

• Logical Effort g is the ratio of input capacitance to an inverter

• g(inverter) =

• Electrical Effort h is the ratio of the load capacitance to the input capacitance

• h(inverter) =

• Delay = p + f = p + g * h = 1 + f

26

OutA

VDD

1

1

Cin = 2 Cp = 2

Req = 1

EECS151 L13 DELAY

NAND2 Gate

27

Out

B

VDD

A

OutA

VDD

1

1

1 1

2

2Cin = 2

Cin = 3

Req = 1Req = 1

EECS151 L13 DELAY

Logical Effort of NAND2 Gate

• In velocity-saturated devices Ion of a stack is 2/3 (not a half) of two devices• So the correct upsizing factor is 1.5 (not 2)

• We will use 2, as it makes calculations easier

28

Out

B

VDD

A

OutA

VDD

1

1

1 1

2

2Cin = 2

Cin = 3

Req = 1Req = 1

EECS151 L13 DELAY

NOR2 Gate

29

OutA

VDD

B

Cin = 3

OutA

VDD

1

1

Cin = 2

Req = 1

EECS151 L13 DELAY

Example: Inverter Chain

Logical Effort: g =

Electrical Effort: h =

Parasitic Delay: p =

Stage Delay: d =

Total Delay: d_total =

30

CL

In Out

1 2 N

EECS151 L13 DELAY

Example: Inverter Chain

Logical Effort: g = 1

Electrical Effort: h = 1

Parasitic Delay: p = 1

Stage Delay: d = 2

Total Delay: d_total = 2*N

31

CL

In Out

1 2 N

EECS151 L13 DELAY 32

• Estimate the delay of a fanout-of-

Logical Effort: g =

Electrical Effort: h =

Parasitic Delay: p =

Stage Delay: d =

d

EECS151 L13 DELAY

Page 5: EECS151 : Introduction to Digital Design and ICs CMOS

33

• Estimate the delay of a fanout-of-

Logical Effort: g = 1

Electrical Effort: h = 4

Parasitic Delay: p = 1

Stage Delay: d = 5

d

EECS151 L13 DELAY

Multi-stage Logic Networks

34

• Logical effort generalizes to multistage networks

• Path Logical Effort

• Path Electrical Effort

• Path Effort

iG g

out-path

in-path

CH

C

i i iF f g h

10 x y z 20g1 = 1h1 = x/10

g2 = 5/3h2 = y/x

g3 = 4/3h3 = z/y

g4 = 1h4 = 20/z

EECS151 L13 DELAY

Branching Effect

35

G = 1

H = 90 / 5 = 18

GH = 18

h1 = (15 +15) / 5 = 6

h2 = 90 / 15 = 6

B = 2

= g1g2h1h2 = 36 = BGH

5

15

1590

90

on path off path

on path

C Cb

C iB b

EECS151 L13 DELAY 36

• Delay is smallest when each stage bears same effort

• Thus minimum delay of N stage path is

• This is a key result of logical effort•• Doesn’t require calculating gate sizes

i FD d D P

1ˆ Ni if g h F

1ND NF P

EECS151 L13 DELAY

Example: Best Number of Stages

• How many stages should a path use?• Minimizing number of stages is not always fastest

• Example: drive 64-bit datapath with unit inverter

D 1/N + P

= N(64)1/N + N

37

1 1 1 1

8 4

16 8

2.8

23

64 64 64 64

Initial Driver

Datapath Load

N:f:D:

16465

2818

3415

42.815.3

Fastest

EECS151 L13 DELAY

Example: Best Number of Stages

• How many stages should a path use?• Minimizing number of stages is not always fastest

• Example: drive 64-bit datapath with unit inverter

D 1/N + P

= N(64)1/N + N

38

1 1 1 1

8 4

16 8

2.8

23

64 64 64 64

Initial Driver

Datapath Load

N:f:D:

16465

2818

3415

42.815.3

Fastest

EECS151 L13 DELAY

Best Stage Effort

• How many stages should a path use?• To drive given capacitance

1/N + Npinv

• Define best stage effort

• Neglecting parasitics (pinv = 0), we find = e = 2.718

• pinv = 1, solve numerically for = 3.59

• Choose 4 – less stages, less energy

39

CL

In Out

1 2 N

1NF

EECS151 L13 DELAY

Logical Efforts Method

40

1) Compute path effort

2) Estimate best number of stages

3) Sketch path with N stages

4) Estimate least delay

5) Determine best stage effort

6)

F GBH

4logN F1ND NF P

1ˆ Nf F

ˆi

i

i outin

g CC

f

EECS151 L13 DELAY

Page 6: EECS151 : Introduction to Digital Design and ICs CMOS

Summary

• Delay is a linear function of R and C

• Delay optimization is critical to improve the frequency of the circuit.

• The dimensions of a transistor affect its capacitance and resistance.

• We use RC delay model to describe the delay of a circuit.

• Two delay components:• Parasitic delay (p)

•• Logical effort (g): intrinsic complexity of the gate

• Electrical effort (h): load capacitance dependent

41EECS151 L13 DELAY