ecwc12 - jpca show · global pcb market and technology development outlook shiuh-kao chiang...
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Conference ProgramDay 1 – November 9 (Wed.)
09:00 am Opening Ceremony of TPCA Show 2011 & ECWC12 [1F]
10:20am
ECWC12 Opening Keynote Speech [5F]Interconnect Superhighway from IC to PCBDouglas C.H. Yu, Senior Director of TSMC
Global PCB Market and Technology Development OutlookShiuh-Kao Chiang, Managing Partner of Prismark
01:30 pm
R501 R502 R503 R504a R504b+c
S1Management & Market Trend
S2Advance Laminate
Materials & Processes
S3Surface Finish Technology
S4HDI
Technology
S5Unimicron Forum
06:00 pm Reception [3F]
Day 2 - November 10 (Thu.)
09:00amEnvironmental Leadership and Technology for the Electronics Supply Chain
-- As seen from an original equipment manufacturerJacklin A. Adams, Chair of IBM Center of Excellence for Product Environmental Compliance
10:10 am
R501 R502 R503 R504a R504b+c
S6High Speed Technology
S7Metallization technology
S8Testing, Inspection,
and Reliability
S9Green
Technology
S10ITEQ Forum
12:00pm Lunch
01:30 pmS11
Embedded & Stacking
S12Metalization Technology
S13Metal Finish
S14Advance
Technology
S15Nan Ya Plastics & Nan Ya PCB Forum
Day 3 - November 11 (Fri.)
09:00am Supporting Electronic Innovations In The Future:Printed Electronics OpportunitiesHappy T. Holden, CTO of ZD Tech.
10:10 am
R501 R502 R503 R504a R504b+c
S16CAD/CAM & Automation
S17Assembly
Technology
S18PCB Process
S19FPC
Technology
S20COMPEQ Forum
12:10 pm Best Paper Award & Closing CeremonyECWC13 Preannouncement
NOTE: 1. There are four “Special Sessions” including Unimicron, ITEQ, Nan Ya Plastics & Nan Ya PCB and COMPEQ Forum. (Time Order)2. Poster Gallery is a three-day exhibition" from November 9 to November 11. The poster session would offer a Q&A exchange
platform, 3:30 pm- 5:30 pm, Thursday, November 10.3. ECWC12 host reserves the right to modify the agenda, please check the website for updates. www.ecwc12.org/Agenda/Requests for information about the agenda should be directed to:ECWC12 Host / Taiwan Printed Circuit Association (TPCA)Tel: +886-3-3815659 #405 Ms. Sylvia Yang Email: [email protected] Office Add: No 147, Sec 2, Gaotie N Rd, Dayuan, Taoyuan 33743, Taiwan
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Special EventsOpening Ceremony of TPCA Show 2011 & ECWC12◆ Time: 9:00 am- 10:00 am, Wednesday, November 9◆ Location: 1F, Taipei Nangang Exhibition Center
ECWC12 Opening Keynote Speech◆ Time: 10:20 am- 12:20 pm, Wednesday, November 9◆ Location: R 504, 5F, Taipei Nangang Exhibition Center
Joint Reception of TPCA Show 2011 & ECWC12◆ Time: 6:00 pm- 8:00 pm, Wednesday, November 9◆ Location: 3F, Taipei Nangang Exhibition Center
Poster Session◆ Time: 3:30 pm- 5:30 pm, Thursday, November 10◆ Location: 5F, Taipei Nangang Exhibition Center
ECWC12 Best Paper Award & Closing Ceremony◆ Time: 12:10 pm- 2:00 pm, Friday, November 11◆ Location: 3F, Taipei Nangang Exhibition Center
Nov 9 (Wed) Nov 10 (Thu) Nov 11 (Fri)
Morning★ Opening Ceremony★ Opening Keynote Speech
Lunch★ Best Paper Award
& ECWC12 Closing Ceremony
Afternoon ★ Poster Session
Dinner ★ Reception
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Keynote SpeechInterconnect Superhighway from IC to PCB
Douglas C.H. YuSenior DirectorTaiwan Semiconductor Manufacturing Company Limited (TSMC)R 504, 10:40 am- 11:30 am, Wednesday, November 9
◆ Education: Georgia Institute of Technology◆ Current Position: Senior Director, Integrated Interconnect and Package Division, TSMC
R&D◆ Specialties: Develop and deliver the 1st SoC technology with Cu/FSG of foundry, and the 1st Cu/low-k technology in IC industry at 0.13m node. Develop and deliver the 1st Cu/ELK and integrate with flip-chip technologies using eutectic and lead-free bumps at 45/40nm nodes. These set the standard of advanced IC interconnect and package for the industry. Currently in charge of TSMC R&D of the integration of advanced interconnects and package, including 3D-IC/TSV.◆ Award/Honored Records:- National Outstanding Invention Award- CAITA- Outstanding Scientific and Technological Worker Award- National Science Council- Industrial Technology Advancement Award- MOEA- National Outstanding R&D Managers- CPMA- Outstanding Engineers Award- Chinese Institute of Engineer.
Global PCB Market and Technology Development Outlook
Shiuh-Kao ChiangManaging PartnerPrismarkR 504, 11:30 am- 12:20 pm, Wednesday, November 9
B.Sc. from National Tsing Hua UniversityM.S. degree from University of Notre DamePh.D. from Ohio State UniversityExecutive MBA degree from Cleveland State UniversityJoined Prismark in February 1998.Shiuh-Kao is responsible for the development of Prismark’s business in Asia,as well as the management of research projects and services in Japan, Taiwan, China, Korea, Singapore, and other Asian countries. Over the past 10 years, Prismark has developed business and service relationship with most of the leading electronics, semiconductor, packaging, assembly, PCB and material companies in Asia.◆ Most of the PCB production has migrated to Asia, especially China. Raising material
prices and steadily increasing labor cost have squeezed the margins and forced the PCB industry to re-examine its business practices.
◆ The PCB industry is facing another set of critical decisions and is actively looking for sustainable solutions.
◆ Small form-factor and portable systems along with fine-pitch semiconductor devices are asking for more flexible and thinner interconnect solutions as well as higher routing-density circuit boards.
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Keynote SpeechEnvironmental Leadership and Technology for the Electronics Supply Chain –
As seen from an original equipment manufacturer
Jacklin A. AdamsSenior Technical Staff Member and ChairCenter of Excellence for Product Environmental ComplianceGlobal Supply, Integrated Supply ChainIBMR 504, 9:00 am- 9:50 am, Thursday, November 10
Jackie Joined IBM in 1991 and is currently an IBM Senior Technical Staff Member (STSM) and Chair of the Center of Excellence (CoE) for Product Environmental Compliance. She leads a global cross functional team and is the Subject Matter Expert on product environmental compliance for IBM. Her group reports into the VP of World-wide Integrated Supply Chain Engineering Operations.In this capacity, Jackie is responsible for all IBM hardware compliance for the 170 Countries IBM does business in. She is responsible for,- Worldwide technical and logistical management systems, business and process analytics- Assessment of worldwide product environmental regulations, across IBM products and services- Identification and deployment of alternative technologies
Supporting Electronic Innovations In The Future:Printed Electronics Opportunities
Happy T. HoldenChief Technical OfficerZhen Ding Technology Co.R 504, 9:00 am- 9:50 am, Friday, November 11
Happy Holden is the Chief Technical Officer for the new Zhen Ding Technology Co., formerly known as Foxconn Advanced Technology, a major part of Hon Hai Precision Industries of Taiwan. Before Foxconn, he was the Senior PCB Technologist for Mentor Graphic’s System Design Division. Prior to joining Mentor, he spent 10 years as the Advanced Technology Manager at NanYa PCB/Westwood Associates and Merix Corporations. He retired from Hewlett-Packard after over 28 years. Mr. Holden formally managed Hewlett-Packard's application organizations in Taiwan and Hong Kong. His prior assignments with H-P had been as director of PCB R&D and PCB Manufacturing Engineering Manager. He holds degrees in Chemical Engineering and Computer Science and is a member of the IPC, SMTA, IMAPS and the IEEE.- Printed Electronics (PE), also called ‘Plastic Electronics”- Applications for energy, displays, lighting, medical, sensors, information and toys- Developments of functional electronic materials (conductors; insulators; semiconductors) and new innovations for the ‘traditional’ printing methods
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session AgendaSession 1: Management & Market TrendDate: Wednesday, November 9 Time: 1:30 pm- 5:10 pmChair: Eric Fung, Tat Chun Printed Circuit Board Co. Ltd. (HKPCA)Co-chair: Kuang-Ming Liao, OMG (Asia) Electronic Chemicals Co., Ltd. R501
Time Topic & Author
1:30 pm
The 12th Five Year Planning of China Printed Circuit Industry and the Impact on EnterprisesKevin Yan, China Printed Circuit AssociationAS002
1:55 pmThe PCB Market in Europe and the Impact on the Global Electronics IndustryMichael Weinhold, European Institute of Printed CircuitsEU111
2:20 pm
The Opportunities for Taiwan Electronic Components Industry in the Emerging Application TrendsBorfeng Jiang, Industrial Economics and Knowledge Center (IEK) of ITRITW146
2:45 pm
Global Electronic Industry Supply Chain Using Leading Indicators to Forecast Growth by Product by Geographical RegionWalter Custer, Custer Consulting GroupUS110
3:10 pm Coffee Break
3:30 pm
Global Electronic Industry Supply Chain Using Leading Indicators to Forecast Growth by Product by Geographical RegionTarja Rapala-Virtanen, TTM Asia PacificAS109
3:55 pm
A Global Supply Chain Collaboration Model to Synergize Innovative Technology Achievement for Company BenefitJeffrey ChangBing Lee, IST-Integrated Service TechnologyTW126
4:20 pmICT Industry Opportunities and Challenges beyond Green EraTsu-Yu Chao, Industrial Economics and Knowledge Center (IEK) of ITRITW115
4:45 pmNext Generation Power Device Solution for Green Energy ApplicationsYa-Lan Yang, Industrial Economics and Knowledge Center (IEK) of ITRITW117
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 2: Advance Laminate Materials & ProcessesDate: Wednesday, November 9Time: 1:30 pm- 4:20 pmChair: Akio Takahashi, Yokohama National UniversityCo-chair: Albert Chen, Elite Material Co., Ltd. R502
Time Topic & Author
1:30 pm Electrical Insulation Materials with Ultralow CTEEita Horiki, Sekisui Chemical Co., Ltd.AS148
1:55 pmPreparation and Electrical Conductivity of PF/Ag/NanoG CompositesNailiang Liu, Northwestern Polytechnical University★ AS122
2:20 pm
The Manufacturing of A High Thermal Conductivity Aluminum Based Copper Clad LaminateNaidong She, Guangdong Shengyi Sci. Tech Co., Ltd.AS048
2:45 pmThermal Conductive BN/ Novolac Resin CompositesShasha Li, Northwestern Polytechnical University★ AS121
3:10 pm Coffee Break
3:30 pm
Novel Hyperbranched Polysiloxane Modified Bismaleimide/cyanate ester Resins with Simultaneously Improved Flame Retardancy and Dielectric Properties for High Performance Copper Clad LaminatesDongxian Zhuo, Soochow UniversityAS101
3:55 pmLaminated/Pressed Dielectric Thickness Theoretical Prediction Vs Experimental ResultsPan Tang, Foxconn Advanced TechnologyOT020-3
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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 3: Surface Finish TechnologyDate: Wednesday, November 9Time: 1:30 pm- 4:20 pmChair: Minsu (Tim) Lee, Doosan Corp. Electro-Materials BG (KPCA)Co-chair: Charlie Lu, Altera Corp. R503
Time Topic & Author
1:30 pm Palladium Surface Finish for Copper Wire BondingMustafa Oezkoek, Atotech Deutschland GmbHEU019
1:55 pm
Formation and Migration of Pd,NiSn4 Intermetallic Compound in Microbumps with Au/Pd/NiP Surface FinishYen-Chen Lin, Yuan Ze UniversityTW075
2:20 pmElectroless Palladium Over Bare Copper As a Surface FinishJames Trainor, OMG Electronic Chemicals Co., Ltd.US064
2:45 pmBondability Issues of Wire Bonding on Printed Circuit Board and IC SubstrateTsung-hsing Lu, Altera Corp.TW127
3:10 pm Coffee Break
3:30 pm
Effect of Ag Content on the Pad Consumption in Lead-free Sn-Ag-Cu Solder Joints under Current StressingChih-Nan Chen, Yuan Ze UniversityTW119
3:55 pm
Structural evolution and phase transformation of AuAg Alloy Nanoparticle Deposits for Interconnect ApplicationsWei-ting Chen, National Dong Hwa UniversityTW161
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 4: HDI TechnologyDate: Wednesday, November 9Time: 1:30 pm- 5:10 pmChair: Ting-Hao Lin, Kinsus Interconnect Technology Corp. (TPCA)Co-Chair: Johnson Chang, Jetchem International Co., Ltd. R504a
Time Topic & Author
1:30 pm Low Thermal Expansion Materials for Thin IC Package SubstratesShohei Hanazaki, Panasonic Electric Works Co., Ltd.AS070
1:55 pmStudy on Palladium Etching Process in the Semi-Additive ProcessHideomi Takahashi, Ebara-Udylite Co., LtdAS081
2:20 pmSubtractive Structuring of Fine Line Build up LayersCarsten Schauer, Atotech Deutschland GmbHEU083
2:45 pm
Anisotropic Etching Technology of a Subtractive Method for Ultra-Fine Pitch Pattern FormationDaisuke Katayama, MEC Company Ltd.AS082
3:10 pm Coffee Break
3:30 pmEffect of Substrate Side Copper Bumps on Reliability in Flip Chip PackageSeong-Bo Shim, LG Innotek Co., LtdAS051
3:55 pmRF Affected Factors and Control Measures in HDI PCB ManufactureJia Luo, China Circuit Technology (Shantou) CorporationAS084
4:20 pm
Laser Embedded Circuit Technology (Via2) – A Comprehensive Wiring Solution for Advanced IC Substrates in the Sub-10mm L/S-rangeDavid Baron, Atotech Deutschland GmbHEU165
4:45 pmFabrication of Micro Tool with Electrochemical EtchingJiun Weng, National Cheng Kung UniversityTW027
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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 5: Unimicron ForumNote: Special SessionDate: Wednesday, November 9Time: 1:30 pm- 5:35 pmChair: CC Chen, Senior VP of UnimicronCo-chair: Tsung-Yuan Chen, R&D Deputy Director of Unimicron R504b+c
Time Topic & Author
1:30 pm Board Level Drop Test and Simulation of Cavity-HDI CHDI PCB for Portable ApplicationsEric Wu, Unimicron Technology Corp.TW086-1
1:55 pmDC- The Natural Progression from Photolithography to Digital CircuitizationYueh-Ling Lee, DuPontTW086-2
2:20 pmDC-A Laser Structuring TechnologyWeiming Cheng, Unimicron Technology Corp.TW086-9
2:45 pmDC-A Full Additive Electroless Plating TechnologyCadmus Yu, Unimicron Technology Corp.TW086-3
3:10 pm Coffee Break
3:30 pmDC-An Innovative Patterning Technology for Next Generation PCB ManufacturingCadmus Yu, Unimicron Technology Corp.TW086-4
3:55 pmHigh Copper Pillar on IC Carrier for Package-on-Package TechnologyGaston Lee, Unimicron Technology Corp.TW086-6
4:20 pmNanotechnology for Gold Plated Surface Finishes with Organic MaterialsLawrence Yen, Advance Materials CorporationTW086-7
4:45 pm
A Unique Treatment Technique for Improving the Surface Finishing Performance of IC SubstrateJason Chen, Subtron Technology Co., Ltd.TW086-8
5:10 pmHigh Reliability Photoimageable Solder ResistHisashi Marusawa, Onstatic-GOOTW086-5
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 6: High Speed TechnologyDate: Thursday, November 10Time: 10:10 am- 11:50 amChair: Yanlin Tang, Tian Jin Printronics (CPCA)Co-chair: Harry Yang, Isola Asia Pacific (Taiwan) Inc. R501
Time Topic & Author
10:10 am
A Preliminary Study of Processing Low Loss PCB Materials for 60 GHZ and E-Band ApplicationChien-Cheng (Jason) Lee, Boardtek Electronics Corp.TW026-1
10:35 amNew Copper Surface Treatment Process for High Frequency PCBsTsuyoshi Amatani, MEC Company Ltd.AS080
11:00 amAn Ultimate Thermal Solution For High Power RFIC SubstrateChien-Cheng (Jason) Lee, Boardtek Electronics Corp.TW026-2
11:25 amHow to Interpret Material for High Speed Application?Eric Liao, Taiwan Union Technology CorporationTW061
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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 7: Metallization TechnologyDate: Thursday, November 10Time: 10:10 am- 11:50 amChair: Michael Weinhold, EIPCCo-chair: Wun-Yan Chen, MCL, ITRI R502
Time Topic & Author
10:10 am New Copper Electroplating Technology for Through Hole FillingMark Lefebvre, Dow Electronic MaterialsUS076
10:35 amA Novel Copper Plating Formula for TSV filling Using Dimensionally Stable AnodeMei-Ling Wang, National Chung Hsing UniversityTW049
11:00 amThe Influence of Super Filling in Microvia Filling by ElectroplatingZhengdan Cui, Guangzhou Fastprint Circuit Tech Co., LtdAS028
11:25 amPlating Thickness Distribution Improvement for a Panel Plating LineLouis T. Liang, Foxconn Advanced TechnologyOT020-2
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
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Session 8: Testing/Inspection/ReliabilityDate: Thursday, November 10Time: 10:10 am- 12:15 pmChair: Dieter Bergman, IPCCo-chair: Alex King, Asia Electronic Material Co., Ltd R503
Time Topic & Author
10:10 am Hi-speed 3D X-ray In-line Inspection System for Printed Circuit Board AssemblyYoshihiro Akiyama, Saki CorporationAS142
10:35 amA Validation Method to Approach Creep Corrosion Occurrence on PCBCherie Chen, IST-Integrated Service TechnologyTW114
11:00 amEffect of Interfacial IMCs on the Ball Impact Test Reliability of Sn-Ag Solder JointsBo-Chang Huang, National Dong Hwa UniversityTW156
11:25 amEmbedded Instruments – A Non-intrusive Board Test StrategyLester Tseng, ASSET InterTech Inc.TW088
11:50 am
Life Cycle Analysis of Electronic Circuits Formed Using Alternative Manufacturing Processes Based on Plastic SubstratesMadhusudanrao Neeli, Griffith UniversityOT004
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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 9: Green TechnologyDate: Thursday, November 10Time: 10:10 am- 11:50 amChair: Mukund L. Shah, IPCACo-chair: Sheng-Ho Huang, MCL, ITRI R504a
Time Topic & Author
10:10 am Green PWB Metallization PracticesSteven Tam, Cooskson Electronics Ltd. - EnthoneAS085-1
10:35 amReutilization of Nonmetallic Materials Reclaimed from Waste Printed Circuit BoardJie Guo, Shanghai Jiao Tong University★ AS103
11:00 amGreen Production and Cost Savings in the Wet Processes for Printed Circuit BoardPeitao Su, China Circuit Technology (Shantou) CorporationAS030
11:25 amGreen Palladium Remover for the Future of PWB ManufacturingNeal Wood, Atotech UK Ltd.EU069
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 10: ITEQ ForumNote: Special SessionDate: Thursday, November 10Time: 10:10 am- 12:10 pmChair: Daniel Yin, Vice president of ITEQCo-chair: Anderson Cheng, Director of ITEQ R504b+c
Time Topic & Author
10:10 am High Reliability of Halogen-Free Material for Copper Clad Laminate (CCL)Wei-Hsuan Lin, ITEQ CorporationTW106-3
10:30 am
Study on the Fire Resistant and Characterization of Novolac Cured Epoxy/Clay Nanocomposites with Clay Modified by Different Types of FullereneTsung-Yen Tsai, Chung Yuan Christian UniversityTW107-2
10:50 am
Study on the Fire Resistant and Characterization of Novolac Cured Epoxy/LDH Nanocomposites with Different Types of LDH Modified by O-CNCsTsung-Yen Tsai, Chung Yuan Christian UniversityTW107-1
11:10 amNew Generation Low Cost Halogen Free Material for Print Circuit BoardAnderson Cheng, ITEQ CorporationTW106-1
11:30 am
New Thermal Stable and UV-Resistant Siloxane-Imide–Containing Polybenzoxazines Curing Agent for CCL ApplicationKai-Chi Chen, MCL of ITRITW108
11:50 amCharacteristics of High Speed and Low Loss LaminatePaul Lee, ITEQ CorporationTW106-2
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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 11: Embedded & StackingDate: Thursday, November 10Time: 1:30 pm- 4:45 pmChair: Michael Weinhold, EIPCCo-chair: Bryan Chueh, Dow Electronic Materials R501
Time Topic & Author
1:30 pm High Dk Embedded Capacitor Materials in Organic Package SubstrateJin-Hyun Hwang, Oak-Mitsui TechnologiesUS100
1:55 pmThe Challenges Of Embedded Technology For The Integrated BoardHung-Yi Yeh, Unitech Printed Circuit Board Corp.TW010
2:20 pmWLP-IC and Passive Devices Embedded Multilayer Polyimide Wiring BoardNobuki Ueta, Fujikura Ltd.AS057
2:45 pm
A Reliable Packaging Architecture for the Expansion of DRAM Capacity by Stacking Active-embedded ComponentsYin-Po Hung, Industrial Technology Research Institute (ITRI)TW147
3:10 pm Coffee Break
3:30 pm
Highly Integrated Package Substrate of Burying Actives and Embedded Passives by Flexible PCB ProcessEden Hsu, Career Technology Mfg. Co.,LtdTW042
3:55 pmResearch on Key Technology of High Frequency Embedded Capacitance PCBJianyuan Song, Shenzhen Suntak Circuit Technology Co., Ltd.AS102
4:20 pmPractical Experience Manufacturing PCBs with Embedded Active and Passive DevicesThomas Hofmann, Hofmann Leiterplatten GmbHEU173
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 12: Metallization TechnologyDate: Thursday, November 10Time: 1:30 pm- 4:20 pmChair: Masamitsu Aoki, JPCACo-chair: Karl Chiang, TPCA R502
Time Topic & Author
1:30 pm Advanced SAP Metallization TechnologyHiroyuki Nishiwaki, Dow Electronic MaterialsAS062
1:55 pm
A Novel Synthesis Method of Cu Nanoparticles and Their Application for Seed Layer Deposition of Through Silicon ViaYiu-Hsiang Chang, National Chung Hsing UniversityTW034
2:20 pm
Comparing the Reliability of a Graphite-based Direct Metallization Process to Conventional Electroless Copper for Rigid Through-Hole Printed Circuit BoardMichael Carano, OMG Electronic Chemicals Co., Ltd.US022
2:45 pmElectroless Deposition of Barrier and Seed Layers for TSV MetallizationChia-Pei Chou, National Chung Hsing UniversityTW043
3:10 pm Coffee Break
3:30 pm
High Speed Direct Current Copper Electroplating TechnologyElie Najjar, Dow Electronic MaterialsElie Najjar, Dow Electronic MaterialsUS077
3:55 pm
Copper Ball Dissolution Method for Life Prolongation of Electroless Copper Plating SolutionHiroshi Kanemoto, Hitachi, Ltd.AS053
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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 13: Metal FinishDate: Thursday, November 10Time: 1:30 pm- 5:30 pmChair: Frank Bai, TPCACo-Chair: Michael Chang, DuPont Taiwan Ltd. R503
Time Topic & Author
1:30 pm Effects of Electromigration on Resistance Changes in Eutectic SnBi Solder JointsJia Sun, Beijing University of TechnologyAS171 ★
1:55 pm
Effects of Co additions on Electromigration Behaviors in Sn-3.0Ag-0.5Cu Based Solder JointLimin Ma, Beijing University of TechnologyAS172 ★
2:20 pmImplementing Silver Surface Finishing for Broader Segments of ElectronicsJohn Ganjei, MacDermid, Inc.US170
2:45 pm
Manufacturability Reliability Challenges with Leadless Near Chip Scale Packages in Pb-Free ProcessesCheryl Tulkoff, DfR SolutionsUS099
3:10 pm Coffee Break
3:30 pm
Ag Addition Effects on the Interfacial Reactions in Small Solder Volume Ni/SnAg/Ni System during Isothermal Aging ProcessJen-Jui Yu, National Taiwan UniversityTW052
3:55 pm
A New PCB Surface Finish – A Visible Conductive Nanofinish Outperforming Conventional Organic Surface Finishes (OSP)Yung-Herng Yau, Cookson Electronics Ltd. - EnthoneEU112
4:20 pmStudy on Thermal Stability and Solderability of Co-W-P ElectroplatingSang-Yeol Choi, Korea Polytechnic UniversityAS132
4:45 pm
Interfacial Bonding Strength and Reliability of Au Wire on Ni-P/Pd and Ni-P/Pd/Au Surface Finish ProcessesYung-Chang Hsu, Atotech Taiwan LimitedTW166
5:10 pmGold Potassium Cyanide Alternative: Study of Gold Malononitrile in Immersion GoldChong Wang, Dow Electronic MaterialsTW174
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
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Session 14: Advanced TechnologyDate: Thursday, November 10Time: 1:30 pm- 5:10 pmChair: David Bergman, IPCCo-chair: Jeffrey Lee, IST-Integrated Service Technology R504a
Time Topic & Author
1:30 pm
Development of Electro-Optical PCBs with Polymer Waveguides for High-Speed on-Board Optical InterconnectsMarika Immonen, Meadville, TTM Technology APEU087
1:55 pmCharacteristics of IMC Growth in Small Solder Volume Ni/Sn/Ni SystemM.S. Kuo, National Taiwan UniversityTW072
2:20 pm
Organic and Printed Electronics – An Experimental Approach to the Development and Application of New TechnologiesRobin Taylor, Atotech Deutschland GmbHEU164
2:45 pmOn 3-D IC Design ArchitectureKarl Cheng, Innotest Inc.TW091
3:10 pm Coffee Break
3:30 pm
Module Assembly Spacing Design Rule Improvement Study for Flip Chip Device ApplicationsShannon Pan, RF Micro Devices, Inc. (RFMD)US012
3:55 pm
Impregnation of Metal Complex into Epoxy Insulation Materials Using scCO2 & its application for Copper PlatingHidebumi Ohnuki, Oriental Printed Circuits LimitedAS011
4:20 pm
Volume Shrinkage Induced by Interfacial Reaction in Small Scale Ni/Sn/Ni Structure during Solid State AgingCheng-Chieh Li, ACPL Lab of National Taiwan UniversityTW056
4:45 pm
The Application of Mechanical Stress for the Validation of Halogen Free PCB Pad Cratering ConcernChuan-Chun Chang, IST-Integrated Service TechnologyTW024
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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 15: Nan Ya Plastics & Nan Ya PCB ForumNote: Special SessionDate: Thursday, November 10Time: 1:30 pm- 5:30 pmChair: Joshua Chiang, Unit Manager of Nan Ya PlasticsCo-chair: Jack Lin, Technical Manager of Nan Ya Plastics R504b+c
Time Topic & Author
1:30 pm The Effect of PCB Substrates on the Heat Dissipation of LED Back Lighting StripPeter Liang, Nan Ya Plastics CorporationTW116-4
1:55 pmLow Dielectric Glass FabricsJ.Y. Lin, Nan Ya Plastics CorporationTW116-6
2:20 pm
High Thermal Reliability Performance of Low Lose Material for High Frequency ApplicationGordon Lee, Nan Ya Plastics CorporationTW116-1
2:45 pmA Study for Effects of PCB Process on Signal Loss of Transmission Line at High FrequencyC.C. Hsiao, Nan Ya Plastics CorporationTW116-3
3:10 pm Coffee Break
3:30 pmPerformance of Electrodeposited Copper Foil for Flexible PCBS.C. Lin, Nan Ya Plastics CorporationTW116-5
3:50 pmHigh Reliability Halogen Free Substrate Core Development for Flip Chip ApplicationKuo-Liang Su, Nan Ya Plastics CorporationTW116-2
4:10 pmA Novel Halogen-free Material for Copper Clad LaminateC.M. Chang, Nan Ya Plastics CorporationTW116-7
4:30 pmFlip Chip CSP– Fine Line Pitch Technology DevelopmentShun-Ming Yu, Nan Ya PCB CorporationTW116-10
4:50 pmNew Challenge for HDI PCBRicky Lin, Nan Ya PCB CorporationTW116-9
5:10 pmAdvanced Substrate TechnologyYou-Chih Kuo, Nan Ya PCB CorporationTW116-8
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
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Session 16: CAD/CAM & AutomationDate: Friday, November 11Time: 10:10 am- 11:50 amChair: Mukund L. Shah, IPCACo-chair: David Tarng, Atotech Taiwan Ltd. R501
Time Topic & Author
10:10 am Printed Circuit Boards Design with Embedded Photovoltaic CellsAnkan Mitra, Cisco Systems (India) Pvt LtdAS060
10:35 amUniplate TTS The New Touchless High Volume Production TechnologyStephen Kenny, Atotech Asia Pacific Ltd.EU128
11:00 amInvestigation of Touch Free Horizontal PlatingLaurent Nicolet, Schmid China Ltd.AS162
11:25 amEnergy Saving Concepts for PCB Industry Using Canned Permanent Magnet Motor PumpJason Shih, ASSOMA INC.TW058
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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 17: Assembly TechnologyDate: Friday, November 11Time: 10:10 am- 11:50 amChair: Eric Fung, Tat Chun Printed Circuit Board Co. Ltd. (HKPCA)Co-chair: James Chu, DuPont Taiwan Ltd. R502
Time Topic & Author
10:10 am Investigation of Printed Wiring Board Strain in SMT Thermal ProcessChia-Ching Weng, Delta Electronics, Inc.TW131
10:35 amThe Effect of Temperature on Characteristic ImpedanceMing-Tsun Lu, Hannstar Board CorporationTW098-2
11:00 amThe Simulation and Prediction of Reflow Soldering ProfileJian-Huang Tseng, National Taipei University of TechnologyTW095
11:25 amThe Application and Safety Concern for Lithium Batteries Pack in Electric VehiclesBenjamin Chen, Underwriters Laboratories Taiwan Co., Ltd.TW094-2
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 18: PCB ProcessDate: Friday, November 11Time: 10:10 am- 12:15 pmChair: KyoungHee Lee, KPCACo-chair: Jerry Huang, Tripod Technology Corp. R503
Time Topic & Author
10:10 am Screen Printing and Plating Based Fabrication of Fine Flexible CircuitMinsu (Tim) Lee, Doosan Electro-MaterialsAS066-1
10:35 amThe DI Technology Application Study StatusTing-Hao Lin, Kinsus Interconnect Technology Corp.TW130
11:00 amDrilled Holes Quality OptimizationGorden F. F. Wang, Foxconn Advanced TechnologyOT020-5
11:25 am
Halogen-Free FR-4 Base Materials Evaluation for Multilayer Rigid Printed Boards with Heavy CopperShu-Ing Tzeng, Delta Electronics, Inc.TW008
11:50 amApplication of Test Vehicle for PCB Process Capability MonitorYao-wen Bai, Foxconn Advanced TechnologyOT020-1
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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 19: FPC TechnologyDate: Friday, November 11Time: 10:10 am- 12:15 pmChair: Kevin Yan, CPCACo-chair: Frank Lin, TAIFLEX Scientific Co., Ltd. R504a
Time Topic & Author
10:10 am High Speed Flexible Laminate Based on Polyimide/Fluoropolymer CompositesG. Sidney Cox, DuPontUS129
10:35 amStudy on Mechanical Drilling of PCB Ultra Small HoleLianyu Fu, Shenzhen Jinzhou Precision Technology Corp.AS025
11:00 amInkjet Printed and Sintered Conductive Silver Lines on Flexible Polymeric SubstratesKun-Ze Tu, National Kaohsiung University of Applied SciencesTW151
11:25 amNovel Flexible Materials for Impedance MatchingEun-song Baik, Doosan Electro-MaterialsAS059
11:50 amFlex Circuits As a Three-Dimensional Packaging SolutionJay Desai, MFLEX Co.US176-1
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Session 20: COMPEQ ForumNote: Special SessionDate: Friday, November 11Time: 10:10 am- 11:50 amChair: Jesse Tsai, R&D Director of COMPEQCochair: Peter Chiang, Project Director of COMPEQ R504b+c
Time Topic & Author
10:10 am Improvement of Pattern Uniformity on a Copper Plating Bath for Microvia-FillingK.H. Luo, COMPEQ Manufacturing Co., Ltd.TW163
10:35 amA Preliminary Study of Dimensional Stability Influence FactorsOhio Huang, COMPEQ Manufacturing Co., Ltd.TW145
11:00 amLow Exposure Energy Solder MaskY.C. Chiang, COMPEQ Manufacturing Co., Ltd.TW144
11:25 am
An Experimental Study of Material Electrical Properties and Impedance Design on Multi-GHz Differential Insertion LossJason Lin, COMPEQ Manufacturing Co., Ltd.TW089
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Paper Code with ★ indicates Outstanding PCB Thesis Award (Student)
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
Poster PaperNo Paper# Paper Title Author Company
1 TW009Analysis clearly typeface technology how to identify and make is on the printing circuit board.
Angus ChongTripod Technology Corporation
2 TW013The application of plugging ink performed after brown oxide
Silver Lo Unitech Printed Circuit Board Corp.
3 AS014-1A Study on the Impedance Match for the Characteristic Impedance Test of PCB
Huanxin YuanChina Circuit Technology (Shantou) Corporation
4 AS014-3Discussion on the engineering design, process control and testing techniques of the precise characteristic impedance of PCB
Huanxin YuanChina Circuit Technology (Shantou) Corporation
5 AS015-1Investigation on Curing Kinetics and Lamination Properties of No-flow Prepreg
Xinman Mo Shenzhen Fastprint Circuit Tech Co., Ltd.
6 AS015-2Investigation on Resin Flow and Gap Filling in Lamination
Xinman Mo Shenzhen Fastprint Circuit Tech Co., Ltd.
7 AS015-3Signal Loss Analysis of High Frequency Flexural Materials for FPC
Xinman Mo Shenzhen Fastprint Circuit Tech Co., Ltd.
8 TW017A biodegradable binder for preparing dry-film photoresist using in printed-circuit-board manufacturing process
Jauder JengIndustrial Technology Research Institute (ITRI)
9 OT020-4Registration in a New High Layer Count Facility
Yao-wen Bai Foxconn Advanced Technology
10 TW021The Behavior of Thermal and UV Degradation between LED Encapsulants and Their Devices
Chih-Hau Lin Industrial Technology Research Institute (ITRI)
11 TW023Interfacial Reactions between Sn and Fe-Ni Alloys
Yee-wen YenNational Taiwan University of Science and Technology
12 AS029Principle of Laminate Wrinkle and Troubleshooting in High Layer Count PCB
Dong Liu Shenzhen Suntak Multilayer PCB Co. Ltd
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
No Paper# Paper Title Author Company
13 AS031Discussion About the Production Process of the PCB with Extra-thick Copper10OZ
Zhanzhi ZhuShenzhen King Brother Electronics Technology Co.Ltd.
14 TW032A 10 GBPS AC-COUPLED CHIP-TO-CHIP INTERCONNECTION FOR 3DIC APPLICATIONS
Pei-Ju LinNational Chiao Tung University
15 AS033Resin-Clay Hybrid Nanocomposites as an Ionic Migration Inhibitor in Ag-Printed Circuits
Shin-ichiro NAKAJIMA
Japan Aviation Electronics Ind., Ltd.
16 TW035
Electrochemical Deposition of Transparent Nanostructured TiO2 Film as an Effective Blocking Layer for Dye-sensitized Solar Cells
Wen-Chi Hsu Tripod Technology Corporation
17 TW036Highly Efficient Dye-sensitized Solar Module Employed with Modified PCB Technology.pdf
Ya-Huei ChangTripod Technology Corporation
18 TW037Low Cost High stability and Easy Scalable Counter Electrode based on Nano-platinum for Dye-sensitized Solar Cell
Chi-Wei LiuTripod Technology Corporation
19 TW038Optimizing Performance of Dye-sensitized Solar Module under Fluorescent Light Condition
Jo-Lin LanTripod Technology Corporation
20 TW039 A Study of CMOS-MEMS RF Probe CardGao-Ting Jheng
Department of Mechanical Engineering, National Taipei University of Technology
21 TW040 A Novel Assembly For BiochipTien-Chia Chang
Institute of Mechatronic Engineering, National Taipei University of Technology
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
No Paper# Paper Title Author Company
22 TW041Vertical Type Probe Fabricated Using UV-LIGA Process
Hou-Jun Hsu
Institute of Mechanical and Electrical Engineering, National Taipei University of Technology
23 AS045A technology of enhancing composite materials infiltrating
Jia-jiu DiaoGuangdong Shengyi Sci. Tech Co., Ltd.
24 TW063Effects of Ga addition on microstructures and tensile properties of Sn-Zn-Ag-Ga lead-free solder alloys
Kang-I ChenTung Fang Design University
25 TW068Print Circuit Board Lamination Pressure Effect on the OCL of Embedded Ferrite
Piebear Huang
Tripod Technology Corporation
26 OT074Effects of Etching Parameters on the Uniformity of PCB Board Using the Response Surface Analysis (RSA)
Kyoung-Min Kim
High Value PCB Joint Research Center, Korea Polytechnic University
27 EU090Improving CAD to CAM Data Transfer: A Practical Approach
Karel Tavernier
Ucamco NV
28 TW094-1The Safety Concern and Evaluation of Heat Sinking Industrial Laminates
Benjamin Chen Underwriters Laboratories Taiwan Co., Ltd.
29 AS096Electrostatic separation for recycling waste printed circuit board: A study on external factor and a robust design for optimization
Shibing Hou Shanghai Jiao Tong University
30 ★ AS097Separating and recovering Pb from solder of waste printed circuit boards by evaporation and condensation
Zhan LuShanghai Jiao Tong University
31 TW098-1A Reliability Study on Various Via on Pad Structure
Ming-Tsun LuHannstar Board Corporation
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The 12th Electronic Circuits World ConventionCreativity, Challenge and Change
ECWC12www.ecwc12.org
No Paper# Paper Title Author Company
32 AS104Further study on Red spot phenomenon, trouble shooting and minimizing the red spot occurrence
Peter HuangAtotech Asia Pacific Ltd.
33 AS105Simulation of Deposit Thickness Distribution and Optimization of the CU Plating Cell
Kyu-Hwan LeeKorea Institute of Materials Science
34 AS118Synthesis of polypyrrole/Ni/graphite nanosheeets composites with the heat resistant and high conductivity
Guochen DuanNorthwestern Polytechnical Univerisity
35 ★ AS123
Thermal Conductivity and Mechanical Properties of Boron Nitride Filled Glass Fiber Reinforced Epoxy-Polysulfone Composites
Chunhua Li Northwestern Polytechnical University
36 AS135Copper Pretreatment Process for Use With Advanced Dielectric and Soldermask Materials
Ben HonAtotech Asia Pacific Ltd.
37 TW137
Measurements of CMOS Coupled Microstrip Using Thru-Reflect-Line Calibration with Application of Differential Device Characterization
Chien-Chang Huang
Yuan Ze University
38 AS140Synthesis and Dynamic of Addition-cure-type Novolac Resins
Chunhua Li Northwestern Polytechnical Univerisity
39 TW159Study on the reactivity of lignin based epoxy resin
Chang Li-ming Industrial Technology Research Institute (ITRI)
40 AS175Effect of Organic Additives on the Microstructure of the Electroplating of Sn-Cu Solder
Chul-Wung Kim
Korea Polytechnic University
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