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E by SIPLACE
Specification from SR.709.0, 11/2015 Edition
New Standards in Quality, Performance and Usability
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E by SIPLACEContent
Overview of Technical Data 5Optimum Values 5
E by SIPLACE 6Machine Description 6
E by SIPLACE Placement Heads 8Overview 8SIPLACE CP14 9SIPLACE CP12 10SIPLACE CP6 11SIPLACE TH 12SIPLACE PP 13Nozzle Changer 14
Board Conveyor 15Technical Data 16
PCB Warpage 17
Component Feeding 19Component Trolley 19Technical Data 20SIPLACE SmartFeeder E 21Manual Tray Holder and Tray Setup Plate 22SIPLACE JTF-MW 23Technical Data 24Alternative Feeder Modules 25
Digital SIPLACE Vision System 26Checking the Component Quality 27
Vision Sensor Technology 29PCB Position Recognition 29Bad Board Recognition 30
01005 Placement 31
SIPLACE Software Suite 32General 32Customer Benefit 33SIPLACE Station Software 35SIPLACE Station Programming 37
Technical Data 38SMEMA Interface 38Electrical Ratings, Energy Consumption and Compressed Air supply 40Dimensions and Setup Conditions 41
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E by SIPLACEContent
Placement System Dimensions 42Placement System Center of Gravity 42Maneuvering Radii for the Component Trolleys 43Dimensions with JTF-MW 44Transportation and Delivery Configuration 45
Configuration List 46
List of Options 48
ESD Certificate 49
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Overview of Technical DataOptimum Values
Placement Head CP14 CP12 CP12/PP CP6/PP THE-Component Range
01005 to 6 x 6mm
01005 to 18.7 x 18.7 mm
01005 to 45 x 98 mm
0201 to 45 x 98 mm
0201 to 200 x 110 mm
E-Component Height
4 mm 7.5 mm 19 mm 19 mm 25 mm
E-Accuracy (3σ) 41 µm 41 µm 37.5 µm 37.5 µm 22 µmE-Speed 45,300 cph 24,300 cph 24,200 cph 13,700 cph 5,200 cphIPC Speed 25,000 cph 14,700 cph 14,700 cph 9,500 cph 4,400 cph
Placement Machine
E by SIPLACE
Heads CP14, CP12, CP12/PP, CP6/PP, THBoard format (lengtha x width)
a) With „Long board“ option
1200 mm x 460 mmFeeder capacity 120 x SIPLACE SmartFeeder 8 mm EPCB thickness 0.3 - 4.5 mm PCB weightb
b) The board weight value refers to the weight of the board plus the weight of the components
up to 2 kgAir Consumption 90 NL/Min. 90 NL/Min. 140 NL/Min. 140 NL/Min. 185 NL/Min.Machine dimen-sion (L x W)c
c) Without changeover table or fixed table
1,500 mm x 1,666 mm
Machine weightd
d) Single-Sided machine
1,850 kg
Protective covers: Telegray 4(RAL 7047)
Covers: Telegray 4(RAL 7047)
Machine colors
Cover strip: Red(RAL 3003)
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E by SIPLACEMachine Description
E by SIPLACEThe E by SIPLACE mid-speed SMT placement plat-form was developed espe-cially for small and medium-sized electronics production environments. Thanks to its high-end vision system, highly precise linear motors and placement force sensors it sets new standards in the mid-speed segment. It impresses with an E-speed of 45,300 cph (components per hour), an E-accuracy of 22µ/3Sigma and is able to place components from 01005 to 200 mm x 110 mm.E-Placement QualityAs far as its technology and accuracy are concerned, the E by SIPLACE shines with features that were not previ-ously available on mid-speed machines. The digital vision system inspects each com-ponent in high resolution and with component-specific light settings. And each nozzle is equipped with placement force sensors to ensure the gentle placement of compo-nents - even when the PCB is warped. Another quality fea-ture are the SIPLACE Smart-Feeders E, which receive data and power wirelessly, and the highly precise linear drives on all axes for the exact positioning of gantry and heads.
E-Placement PerformanceFive head options can be configured to perfectly meet the production needs. The SIPLACE CP14 high-speed head handles components ranging from 01005 to6 mm x 6 mm with a speed of 45.300 cph. Whereas, the SIPLACE CP12/PP is very unique and innovative in this segment. Its collect-and-place unit places up to 24,300 components per hour in sizes ranging from 01005 to 18.7 mm x 18.7 mm, while its pick-and-place unit han-dles the high-precision placement of large compo-nents such as connectors or odd-shaped components. With this flexibility, the SIPLACE CP12/PP turns a single-gantry E by SIPLACE machine into a fully func-tional SMT line that is espe-cially well suited for the flexible production of proto-types or short runs.
Easy operationThe innovations in the E by SIPLACE go far beyond technical details such as the vision system, placement heads, SIPLACE Smart-Feeders E and software. SIPLACE's developer paid special attention to ease of operation, user-friendliness and lowest costs of opera-tion. The E by SIPLACE's software wizards and touch panel make programming or teaching new components as easy as possible. And for operation and cleaning and checking, SIPLACE has set up a special E-Xperience area on the Internet, where customers will find check-lists, documents and lots of videos for training, operation and cleaning/checking. Instead of hiring sometimes expensive external techni-cians, customers can train their own teams to further reduce their cost. Addition-ally our distribution network with its global network of partners also offer what today's customers in the mid-speed segment want.
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E by SIPLACEMachine Description
100% uptime with intelligent feeder modules The E by SIPLACE operates with intelligent feeder mod-ules, which simplify the upgrade and conversion tasks significantly. For exam-ple, the SIPLACE Smart-Feeder E modules can even be converted during produc-tion, thereby reducing machine stoppages.With these advanced fea-tures, SIPLACE has estab-lished a class of its own for SMT production, which ranks way above all other place-ment solutions on the mar-ket.
01005 placement without compromise The E by SIPLACE is designed for placement of 01005 components.Specially developed nozzles are available for use with 01005 components. With these preparations, tiny com-ponents can be processed without any loss of quality and speed. These compo-nents can be placed with minimum pitch and irrespec-tive of the larger components which are next to the 01005 component. This equates to true 01005 capability.
Further informationIf you're interested in further technical details, if you'd like to contact us directly, or if you'd like to enquire about the appointed distributor for your region, please visit us at www.e-by-siplace.com.
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E by SIPLACE Placement HeadsOverview
Collect&Place principleThe SIPLACE CP14/12/6 operates according to the Collect&Place principle i.e. one cycle includes pickup or "collection" of 14/12/6 com-ponents, their optical center-ing on the board and their rotation into the required placement angle and posi-tion. They are then placed gently and accurately onto the PCB. This principle is particularly suitable for high-speed placement of standard components.Pick&Place principleThe high-precision SIPLACE TwinHead or P&P module functions according to the Pick&Place principle. One or two components are picked up by the SIPLACE Twin-Head/PP, optically centered on the way to the placement position and then rotated into the required placement angle. This principle is ideally suitable for fast and precise placement of special compo-nents in the fine pitch or super fine pitch field, plus complex and heavy compo-nents which may need grip-pers.
Control and self-learning functionsThe reliability of the SIPLACE placement heads can be enhanced even fur-ther with various checking and self-learning functions.• Component sensor
Checks the presence of the components on the nozzle before the pickup and placement process
• Digital cameraChecks the position of each component on the nozzle. This check is per-formed in a single step, with no extra time involved but with optimum scan-ning of each individual component.
• Force sensorMonitors the prescribed component set-down force. The sensor stop proce-dure enables compensa-tion of height differences during pickup and PCB warpage during place-ment.
• Vacuum sensorChecks whether the com-ponent was correctly picked up or placed.
Camera Configurations
Head 1 Camera Optional Head 2 Standard Camera Optionala
a) Flip-Chip Camera, Type 25 GigE as additional stationary camera is possible
CP14 Type 23 GigE -- -- -- --
CP12 Type 30 GigE -- -- -- --
CP12 Type 30 GigE -- PP Type 36 GigE Type 33 GigE
CP6 Type 30 GigE -- PP Type 36 GigE Type 33 GigE
-- -- -- TH Type 36 GigE Type 33 GigE
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Placement HeadsSIPLACE CP14
SIPLACE CP14
with component camera type 23 GigE
Component rangea
a) Please note that the placeable component range is also affected by the pad geometry, the customer-spe-cific standards, the component packaging tolerances and the component tolerances.
01005 to 2220, Melf, SOT, SOD
Component spec. Max. heightMin. lead pitchMin. lead widthMin. ball pitch
Min. ball diameter
Min. dimensionsMax. dimensionsMax. weight
4 mm0.25 mm0.1 mm0.4 mm
0.2 mm
0.4 mm x 0.2 mm6 mm x 6 mm
0.25 gProgrammable set-down force
1.3 - 4.5 N
Nozzle types 4xxxX/Y accuracyb
b) The SIPLACE accuracy value is measured during the machine acceptance tests. It corresponds to the conditions set out in the SIPLACE scope of service and supply.
± 41 µm/3σ
Angular accuracy ± 0.5° / 3σ
Illumination level 5Possible illumination level settings
2565
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Placement HeadsSIPLACE CP12
SIPLACE CP12
with component camera type 30 GigERange of componentsa
a) Please note that the component range that can be placed is also affected by the pad geometry, the customer-specific standards and the packaging tolerances.
01005 to flip-chip, bare die, PLCC44, BGA, µBGA, TSOP, QFP, SO to SO32, DRAM
Component specificationMax. heightMin. lead pitchMin. lead widthMin. ball pitchMin. ball diameterMin. dimensionsMax. dimensionsMax. weight
8.5 mm b
0.3 mm0.15 mm0.25 mm0.14 mm0.4 x 0.2 mm²18.7 x 18.7 mm²2 g
b) 8.5 mm on Flex machines, 7.5 mm on Speed machines
Nozzle types 30xx
X/Y accuracyc
c) The accuracy value was measured using the vendor-neutral IPC standard
± 41 μm/3σ
Angular accuracy ± 0.5°/3σ
Component range 98.5%Illumination levels 5Possible illumination level setting
2565
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Placement HeadsSIPLACE CP6
SIPLACE CP6
with component camera, type 30 GigERange of componentsa
a) Please note that the component range that can be placed is also affected by the pad geometry, the custom-er-specific standards and the packaging tolerances.
0201 to 27 x 27 mm²Component specification
Max. heightMin. lead pitchMin. lead widthMin. ball pitch
Min. ball diameter
Min. dimensionsMax. dimensionsMax. weight
8.5 mmb 0.3 mm0.15 mm0.25 mm for components< 18 x 18 mm²0.35 mm for components ≥18 x 18 mm²0.14 mm for components < 18 x 18 mm²0.2 mm for components ≥ 18 x 18 mm²0.6 x 0.3 mm²27 x 27 mm²5 g
b) 8.5 mm on Flex machines. No Speed machine configuration
Nozzle types 38xx, 39xxX/Y accuracyc
c) The accuracy value was measured using the vendor-neutral IPC standard
± 52.5 μm/3σ
Angular accuracy ± 0.225°/3σ
Illumination levels 5Possible illumination level setting 2565
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Placement HeadsSIPLACE TH
SIPLACE TH
with stationarycamera type 36 GigE
(Standard)
with stationary camera type 33 GigE
(Fine pitch)
with stationary camera type 25 GigE
(Flip chip)Component rangea
a) Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the component packaging tolerances and the component tolerances.
0603 to SO, PLCC, QFP, BGA, special components, bare dies, flip-chips
0402 to SO, PLCC, QFP, BGA, special components, bare dies, flip-chips
0201 to SO, PLCC, QFP, sockets, plugs, BGA, spe-cial components, bare dies, flip-chips, shields
Component specsMax. heightMin. lead pitchMin. lead widthMin. ball pitchMin. ball diameterMin. dimensionsMax. dimensions
Max. weightb
b) If standard nozzles are used
25 mm0.4 mm 0.24 mm0.56 mm0.32 mm1.6 x 0.8 mm²32 x 32 mm²(single measurement)
For use with two nozzles:50 mm x 50 mm or 69 mm x 10 mmFor use with one nozzle (multiple measurement):78 mm x 78 mm or 110 mm x 10 mmup to 200 mm x 110 mm (with restrictions)100 g
25 mm0.3 mm 0.15 mm0.35 mm0.2 mm1.0 mm x 0.5 mm55 mm x 45 mm (single measurement)
For use with two nozzles:50 mm x 50 mm or 69 mm x 10 mmFor use with one nozzle (multi-ple measurement):78 mm x 78 mm or 110 mm x 10 mmup to 200 mm x 110 mm (with restrictions)100 g
25 mm0.25 mm 0.1 mm0.14 mm0.08 mm0.6 mm x 0.3 mm16 mm x 16 mm (single measurement)
55 mm x 55 mm (multiple measurement)
100 gProgrammable set-down force
1.0 N - 15 N 1.0 N - 15 N 1.0 N - 15 N
Nozzle typesc
c) Over 300 different nozzles and 100 gripper types are available, with an extensive nozzle database available online.
5xx (standard)4xx + adapter8xx + adapter9xx + adapter
5xx (standard)4xx + adapter8xx + adapter9xx + adapter
5xx (standard)4xx + adapter8xx + adapter9xx + adapter
Nozzle spacing for P&P heads
70.8 mm 70.8 mm 70.8 mm
X/Y accuracyd
d) The SIPLACE accuracy value is measured during the machine acceptance tests. It corresponds to the conditions set out in the SIPLACE scope of service and supply.
± 50 µm/3σ ± 50 µm / 3σ ± 22 µm / 3σAngular accuracy ± 0.05°/3σ ± 0.05° / 3σ ± 0.05° / 3σIllumination level 6 6 6Possible illumination level settings
2566 2566 2566
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Placement HeadsSIPLACE PP
SIPLACE PP
with stationarycamera type 36 GigE
(Standard)
with stationary camera type 33 GigE
(Fine pitch)
with stationary camera type 25 GigE
(Flip chip)
Range of componentsa
a) Please note that the range of components that can be placed is also affected by the pad geometry, customer-specific standards, component packaging tolerances and component tolerances.
0603 to SO, PLCC, QFP, BGA, special components, bare dies, flip-chips
0402 to SO, PLCC, QFP, BGA, special components, bare dies, flip-chips
0201 to SO, PLCC, QFP, sockets, plugs, BGA, special components, bare dies, flip-chips, shields
Component specificationMax. heightbMin. lead pitchMin. lead widthMin. ball pitchMin. ball diameterMin. dimensionsMax. dimensions
Max. weight c
b) 19 mm if one nozzle of the CP12/CP6 is removed. 8.5 mm if no nozzle of the CP12/CP6 is removed.c) If standard nozzles are used
19 mm0.4 mm 0.24 mm0.56 mm0.32 mm1.6 mm x 0.8 mm32 mm x 32 mm(single measurement)45 mm x 98 mm
100 g
19 mm0.3 mm0.15 mm0.35 mm0.2 mm1.0 mm x 0.5 mm55 mm x 45 mm(single measurement)45 mm x 98 mm
100 g
19 mm0.25 mm 0.1 mm0.14 mm0.08 mm0.6 mm x 0.3 mm16 mm x 16 mm(single measurement)
100 g
Programmable set-down force 1.0 N - 15 N 1.0 N - 15 N 1.0 N - 15 N
Nozzle types 5xx (standard)4xx + adapter8xx + adapter9xx + adapter
5xx (standard)4xx + adapter8xx + adapter9xx + adapter
5xx (standard)4xx + adapter8xx + adapter9xx + adapter
X/Y accuracyd
d) The accuracy value was measured using the vendor-neutral IPC standard
± 50 µm/3σ ± 50 µm/3σ ± 37.5 µm/3σ
Angular accuracy ± 0.053°/3σ ± 0.053°/3σ ± 0.053°/3σ
Illumination levels 6 6 6
Possible illumination level settings
2566 2566 2566
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Placement HeadsNozzle Changer
Nozzle changer for the SIPLACE CP14Number of nozzle holders max. 80Number of nozzle magazines 4Nozzle types 4xxxNozzle changeover time Approx. 2s per nozzleCompressed air connection 0.45 MPa (4.5 bar)
Nozzle changer for the SIPLACE CP12Number of nozzle holders max. 48Number of nozzle magazines 4Nozzle types 30xxNozzle changeover time Approx. 2s per nozzleCompressed air connection 0.45 MPa (4.5 bar)
Nozzle changer for the SIPLACE CP6Number of nozzle holders
38xx39xx
max. 24max. 48
Number of nozzle magazines 4Nozzle types 38xx/39xxNozzle changeover time Approx. 2s per nozzleCompressed air connection 0.45 MPa (4.5 bar)
Nozzle changer for the SIPLACE TH/PPNumber of nozzle holders max. 16 for standard nozzles
4 for special nozzles or grippers Nozzle types 5xx, standard
4xx with adapter8xx with adapter9xx with adapter
Nozzle changeover time Approx. 2 s per nozzle
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Board Conveyor
Boards are moved behind one another, along a con-veyor lane and into the placement machine, where they are placed. This con-veyor variant is particularly suitable for very wide boardsConveyor transport principleWhen the board reaches the placement area, it is gently slowed down (braked). As soon as the board has reached its target position, the conveyor belt is stopped and the board is clamped from below. The placement process begins immediately afterwards. The transporta-tion and clamping of the boards is monitored.
Position of conveyor sidesThe conveyor can be easily adjusted with the automatic electrical width adjustment system, to accommodate various different board widths.
Single conveyor
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Board ConveyorTechnical Data
Single conveyorStandard dimensions (length x width)
With bufferingWithout bufferinga
a) On request
50 mm x 50 mm to 460 mm x 460 mm50 mm x 50 mm to 490 mm x 460 mm
With “Long Board”option 1030 (length x width)Single step modeTwo step modea
50 mm x 50 mm to 610 mm x 460 mm50 mm x 50 mm to 1030 mm x 460 mm
With “Long Board”option 1200 (length x width) 70 mm x 50 mm to 1200 mm x 460 mmStationary conveyor side Right, LeftAutomatic electrical width adjustment StandardPCB thickness
Standard 0.3 mm to 4.5 mm PCB warpage See page 17PCB weightb
Standard
b) The board weight value refers to the weight of the board plus the weight of the components.
max. 2.0 kg Clearance on PCB undersidec
c) The free positioning of support pins is limited by the stop bar.
25 mm PCB conveyor height
Standard:Option:
900 mm to 930 mm 950 mm
Type of interface:Standard: SMEMA
Component-free PCB handling edge 3.0 mmPCB changeover time
Single conveyor < 1.5 seconds
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PCB Warpage
PCB warpage across the direction of travelmax. 1 % of the PCB diagonal, but not exceeding 2 mm
PCB warpage on the conveyor
Fixed clamped edge
Movable clamping device
PCB
Fixed clamped edge
Conveyor beltPCB transport direction
Front board edge
Front board edge
PCB warpage in direction of travel + PCB thickness < 5.5 mmBending up of front board edge max. 2.5 mm
Left conveyor belt Right conveyor belt
PCB transport direction
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PCB Warpage
PCB warpage during placement
PCB warpage downwards max. 0.5 mmUse the magnetic pin supports, to achieve this value.
When there is warpage under 2 mm, the inkspots in the center of the board are also within the focus of the digital camera. When all the tolerances are taken into account, this value is reduced to 1.5 mm. You should also note that the warpage reduces the component height.
Magnetic pin support
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Component FeedingComponent Trolley
Component trolley E by SIPLACE
The E by SIPLACE compo-nent trolleys are independent and easily maneuverable modules. The E by SIPLACE machines can accommodate up to two component trolleys, each with 60 tracks. The tape reels are taken up into the tape container of the compo-nent trolley. A cutting device on the machine automatically cuts the used tape material. The component trolleys can be set up directly on the machine or at an external setup area with feeder mod-ules. The benefits of offline setup are that the configura-tions can be prepared with-out stopping the line. This allows the setup to be changed very quickly using the changeover table princi-ple. The E by SIPLACE com-ponent trolleys also support fast setting up and tearing down of feeder modules even during the placement process.
The component feeders are at rest during the placement process - allowing tapes to be spliced without stopping the machine. For safety reasons, unoccu-pied locations are fitted with so-called dummy feeder modules.
Component trolley E by SIPLACE
Tape container
Waste container for remaining empty tape
Changeover table
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Component FeedingComponent Trolley/Fixed TableTechnical Data
Feeder locationsChangeover table with 60 tracksFixed table with 60 tracks
60 feeders with SIPLACE SmartFeeder 8mm E60 feeders with SIPLACE SmartFeeder 8mm E
Changeover table changeover time < 1 minuteMax. component feeding
E by SIPLACE double sidedE by SIPLACE single sided
120 locations for feeders with SIPLACE SmartFeeder 8mm E60 locations for feeders with SIPLACE SmartFeeder 8mm E
Feeder module types (E by SIPLACE) SIPLACE SmartFeeder ESIPLACE StickFeeder ESIPLACE Component Reject Conveyor ELabel Feeder (OEM Product)Manual Tray holder E (Speed)Manual Tray holder E (Flex)SIPLACE JTF-MW
Feeding capacity(2 change over tables on the E by SIPLACE)
120 tape feeder modules, SIPLACE SmartFeeder 8 mm E 60 tape feeder modules, SIPLACE SmartFeeder 2x8 mm E60 tape feeder modules, SIPLACE SmartFeeder 12 mm E60 tape feeder modules, SIPLACE SmartFeeder 16 mm E40 tape feeder modules, SIPLACE SmartFeeder 24 mm E 30 tape feeder modules, SIPLACE SmartFeeder 32 mm E 24 tape feeder modules, SIPLACE SmartFeeder 44 mm E 20 tape feeder modules, SIPLACE SmartFeeder 56 mm E
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Component FeedingSIPLACE SmartFeeder E
SIPLACE SmartFeeder E modules are intelligent tape feeder modules for flexible production environments, which simplify upgrading and conversion tasks consider-ably. All SIPLACE Smart-Feeder E modules support tape splicing as a standard, which prevents machine stoppages when refilling.The benefits at a glance:Conversion-friendly• The SIPLACE Smart-
Feeder E modules are designed as single-track feeder modules. This min-imizes any restrictions during conversion.
• Omega profiles on the tape feeder module and table facilitate safe and reliable upgrading and conversion of tape feeder modules during ongoing production.
Robust• Brushless motors extend
the service life of the SIPLACE SmartFeeder E modules.
Intelligent• A unique tape feeder mod-
ule ID ensures a precise assignment of the compo-nent to the tape feeder module. This makes reli-able setup verification very simple.
• Component pitch, feeder speed and other functions are automatically set when the setup program is downloaded.
High feeding accuracy• Closed loop control path
measurement ensures highly accurate compo-nent feeding, even for 01005 placements.
Operator-friendly• Contactless data and
power transmission make it easier to attach/remove the tape feeder modules
• A multicolor status display signals the operating sta-tuses of the SIPLACE SmartFeeder E module:- Green: "Ready for opera-tion/in current setup"- Orange: "Component runs empty"- Red: "Malfunction"- LED off: "Tape feeder module is not in current setup and can be torn down"
Technical data
Tape feeder module L x H[mm]
Width[mm]
Location Transport increment
[mm]
Max. tape height[mm]
SIPLACE SmartFeeder 8 mm E 587x200 10,8 1 1/2/4/8 3,5SIPLACE SmartFeeder 2x8 mm E 587x200 22,9 2 1/2/4/8 3,5SIPLACE SmartFeeder 12 mm E 587x200 22,6 2 4 - 16a 16SIPLACE SmartFeeder 16 mm E 587x200 22,6 2 4 - 20a 16SIPLACE SmartFeeder 24 mm E 587x200 34,4 3 4 - 32a 25SIPLACE SmartFeeder 32 mm E 587x200 46,2 4 4 - 40a 25SIPLACE SmartFeeder 44 mm E 587x200 58,0 5 4 - 52a 25SIPLACE SmartFeeder 56 mm E 587x200 69,8 6 4 - 64a 25
Tape reels 178 to 432 mm in diameter (7“ - 19“)Changeover time ≤ 8 s
a) In 4mm steps
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Component FeedingManual Tray Holder and Tray Setup Plate
Manual Tray Holder
The Manual Tray Holder is used at Location 2 of an E by SIPLACE, to provide tray support for 2x standard JE-DEC trays at one time. Com-ponents can be made available quickly on JEDEC trays with the help of the Manual Tray Holder.
If the Manual Tray Holder is not present, you can use all 60 feeder tracks on the E by SIPLACE changeover table or the fixed table. When the E by SIPLACE is a single sided machine, there is a plate (Ar-bitray Plate E) instead of the changeover table/fixed table that allows a Manual Tray Holder setup.
To use the Manual Tray Holder on an E by SIPLACE changeover table, you need to fit the machine with a mod-ified empty tape channel.
Tray Setup PlateThe Tray Setup Plate is the possibility to mount manual trays into a single sided machine on location 2.
A maximum of 3x JEDEC trays can be arranged on this plate.
Technical Data
Occupation of locations on the changeover table/fixed tableManual Tray holder E SpeedManual Tray holder E Flex
1 to 32a
1 to 29b
a) Tracks 33-60 are available for SIPLACE SmartFeeder E dockingb) Tracks 30-60 are available for SIPLACE SmartFeeder E docking
Configuration in the placement machineE by SIPLACE Location 2
Placement head range SIPLACE TH, PP, CP14/12/6
Max. waffle pack tray height including componentsWith SIPLACE TH / SIPLACE PP 25 mm
Manual Tray Holder E
Manual Tray Holder E Flex
Manual Tray Holder E Speed
Tray Setup Plate
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Component FeedingSIPLACE JTF-MW
The SIPLACE JTF-MW is an automatic and fast changer for standard JEDEC waffle pack trays.On E by SIPLACE machines, a JTF-MW tray feeder can be installed on a changeover table.
The SIPLACE JTF-MW oc-cupies a fixed area of tracks on the changeover table.
The SIPLACE JTF-MW stores up to 30 JEDEC waffle pack trays in an cassette and supplies them as required.The placement machine can therefore be supplied with different component types at variable changeover times.
JTF-MW
Changeover table
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Component FeedingSIPLACE JTF-MWTechnical Data
Description JTF-MWDimensions
Width 322.40 mmHeight 946 mmLength 1209 mm
Location on E by SIPLACE Installed / docked at location 2 onlyJEDEC waffle pack tray specification JEDEC Standard: 95-1 & IEC 60286-5Storage capacity 30 JEDEC waffle pack trays
15 cookie trays, each can hold 2 JEDEC traysMax component height from tray base 10.8 mm (zero tray level skipping)
24.6mm (1 tray level skipping) 38.4mm (2 tray level skipping)
CassetteDimensions (L x W x H) 344 mm x 300 mm x 228 mmTotal weight loading 30 kg (cookie tray + components)Max. weight per cookie tray 2.0 kg ± 10%
Pneumatics 5 bar to 10 barCompressed air consumption 28.3 NL/min.Communication Pogo-pin interface, Can bus
Weight ~ 45 kg excluding cookie trays & magnets~ 60 kg including 15 cookie trays & magnets
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Component FeedingAlternative Feeder Modules
SIPLACE StickFeeder E
SIPLACE StickFeeder EThe SIPLACE StickFeeder E for E by SIPLACE can be used on any E by SIPLACE feeder table and can setup any number of stick / tube, with a combined stick width up to 100mm. The Stick-Feeder for E by SIPLACE will occupy 10 tracks on the feeder table.
Feeder Adapter E
Label FeederLabel Feeder (OEM Product)Via a dedicated Feeder Adapter E, the Label Feeders ALF12 and ALF14 can be setup and used on E by SIPLACE. For further technical details please visit http://label-feeder.com and contact your dedicated E by SIPLACE distribu-tor.
SIPLACE Component Reject Conveyor E
SIPLACE Component Reject Conveyor E
The SIPLACE Component Reject Conveyor E is designed so that defective components (verified by placement machine vision system) are placed onto conveyor belt and transferred out of machine for operator retrieval. The SIPLACE Component Reject Conveyor E will be used on the changeover table for E by SIPLACE.
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Digital SIPLACE Vision System
The digital Vision system ensures fast and reliable component recognition, cou-pled with user-friendly han-dling. The system identifies each individual component by its geometry and color. Even complex component shapes, such as flip chip or CCGA are detected with high reliability.
This component recognition check is performed in a sin-gle step, with no extra time involved but with optimum scanning of each individual component.This digital Vision system is not only used in the compo-nent cameras but also in the PCB camera. In addition to the precise recognition of components, this also guar-antees reliable detection of inkspots and PCB fiducials.
The benefits at a glance:• Extremely fast and reliable
component recognition• Shortest cycle times • Robust measurement
based on the geometry and color
• Straightforward program-ming
• Offline programming of component shapes
• Rapid introduction of new products (NPI)
• Open architecture allows you to quickly adapt to new requirements
• Optimum placement results based on individ-ual measurement of each component
The SIPLACE Vision sys-tem offers inspection rou-tines and functions to enhance the quality of com-ponent recognition.The benefits at a glance:• Maximum placement
quality• High first pass yield• Reduction of operating
costs
Digital vision cameras
Component camera, type 23 GigEComponent camera, type 25 GigEComponent camera, type 30 GigEComponent camera, type 33 GigEComponent camera, type 36 GigE
Examples of digital vision system analysis times
Evaluation times only play a role in the P&P process.
01005 9 msPLC44 17 msBGA 225 balls 18 ms
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Digital SIPLACE Vision SystemChecking the Component QualityOverview of Key Functions
Recognizing the collinearity of componentsDamaged or bent leads are recognized. This helps avoid solder-free connections during the subsequent solder-ing process.
Damaged leads Damaged leads
Recognizing flipped (face down) or upright componentsBoth chip and IC component shapes (e.g. SOT) recognized in flipped (turned face down) or upright state.
SOT OK SOT “face down”
Flipped chip Chip upright
Checking the lead widthThe optical checking of the lead width recognizes tilted or damaged leads. This helps to recognize e.g. diodes with tilted leads.
Lead width OK Tilted lead
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Digital SIPLACE Vision SystemChecking the Component QualityOverview of Key Functions
Checking the lead length
The lead length check determines whether the leads have been distorted. This inspection is possible by checking whether leads of the same type e.g. chip shapes have different lengths. Flipped and rotated components can also be detected.
Component OK in this position Rotated
Detecting special shapes with rectangular functions
When using certain special component shapes, it is sometimes necessary to program parts on the components or outlines as rectangular shapes. This ensures that they can be processed more reliably.
Rectangular function on the component Rectangular component with irregular edges
Detecting incorrect component descriptions
The Vision system checks whether the position of the component corresponds to the measured Vision data. The following example has more leads than were programmed in the component shape description.
Teaching complex BGA structures
Complex BGA structures can be taught within only a few seconds.
Placing when inkspot is not presentA fiducial can now be defined for the omission of panels. If a fiducial is found (cross, circle, etc.), this panel will be omitted.
Checking the inner area of circular fiducialsTo differentiate circular fiducials from other structures on the board, a brightness check is performed in the inner area of these fiducials.
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Vision Sensor TechnologyPCB Position Recognition
Description
The optimum fiducial shapes vary according to the condi-tion of the surface. When using bare copper surfaces with low oxidation, it is advis-able to take the single cross, as the high amount of infor-
mation provided helps achieve the greatest accuracy. Rectangle, square and circle are less "informa-tive" but save space and can even be used when oxidation is at an advanced stage. Cir-cle or square are advisable for tin-plated structures as
the ratio of the fiducial dimensions to the presolder thickness is particularly favorable.
Fiducial criteria
Locate 2 fiducialsLocate 3 fiducials
X-/Y-position, rotation angle, mean PCB distortionadditional: shearing, distortion separately in X and Y direc-tion
Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, dia-mond, circular, square and rectangular contours, double cross, pattern: any
Fiducial surfaceCopperTin
Without oxidation and solder resistWarpage of fiducial ≤ 1/10 of structure width, both with good contrast to environment
Dimensions of patternsmin. sizemax. size
0.5 mm3 mm
Fiducial environment Clearance around reference fiducial not necessary if there is no similar fiducial structure in the search area
Dimensions of synthetic fiducialsMin. X/Y size for circle and rectangle 0.25 mmMin. X/Y size for annulus and rectangle 0.3 mmMin. X/Y size for cross 0.3 mmMin. X/Y size for double cross 0.5 mmMin. X/Y size for diamond 0.35 mmMin. frame width for annulus and rectangle 0.1 mmMin. bar width / bar distance for cross, double-cross 0.1 mmMax. X/Y size for all fiducial shapes 3 mmMax. bar width for cross/double-cross 1.5 mmMinimum tolerances generally 2% of nominal dimensionMax. tolerances generally 20% of nominal dimension
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Vision Sensor TechnologyPCB Position RecognitionBad Board Recognition
Ink spot criteria
Methods • Synthetic fiducial recognition method• Mean gray scale value• Histogram method• Template matching
Shapes and sizes of fiducials/structures forsynthetic fiducials
other methods
For dimensions of synthetic fiducials, see page 29
min. 0.3 mmmax. 5 mm
Masking material Good coverage
Recognition time Depends on the method: 20 ms - 200ms
DescriptionIn the cluster technology each subpanel is assigned an inkspot. If this is present
during the measurement via the PCB vision module, the corresponding subpanel is populated. This function helps prevent unnecessary
costs caused by placement of defective panels.
Technical data for PCB position detection
PCB fiducials
Local fiducialsLibrary of bad panel recognition
Up to 3 (subpanels and multiple panels)Up to 6 for the long board option (optional PCB fiducials are output by the optimization.)Up to 2 per PCB (may be of different type)Up to 255 fiducial types per subpanel
Image analysis Edge detection method (singular feature) based on gray scale values
Illumination type Front lighting
Fiducial recognition time 0.1 s
Field of vision 5.78 mm x 5.78 mm
Virtual inkspot handler (option)The virtual inkspot handler allows you to scan in inkspots from an external system. These ink-spots can then be allocated to the relevant board.
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01005 Placement
In its standard version, the E by SIPLACE is designed for placement of 01005 compo-nents (0.4 mm x 0.2 mm).The SIPLACE component library already contains the contours and dimensions of 01005 components. Spe-cially developed component nozzles of type 1005 are also available for the E by SIPLACE. These are adjusted to the shape and size of the 01005 compo-nents and have - as with all other SIPLACE nozzles - a highly wear-proof ceramic tip and flexible nozzle seat. This guarantees maximum preci-sion and process reliability. Optimized pickup is guaran-teed by the ideal feeding conditions in the SIPLACE SmartFeeder E module. The smaller the elements to be picked up, the more accurate the pickup needs to be. Pickup is performed contact-free to compensate minor inaccuracies e.g. from com-ponent or pocket tolerances and to prevent mechanical damage to the components.
The design of the SIPLACE SmartFeeder E modules takes this problem into account: new motors and the reduced use of fine mechan-ics help. Small components can be placed without perfor-mance loss with minimum pitch and irrespective of the larger components which are next to the 01005 compo-nent. This equates to true 01005 capability. As a rule with 01005 placement, a finely tuned overall process is the basic requirement if you want to achieve excel-lent results.
All the process parameters must be optimized. The SIPLACE team will be pleased to advise you on how to do this.
01005 measurement results and ambient conditionsAs the dpm values and pickup rates for 01005 place-ment depend greatly on the respective measuring condi-tions, it is not advisable to specify these without consid-ering the corresponding ambient conditions.
The following table shows typical values for 01005 placement, which can be achieved with a E by SIPLACE, provided the rel-evant underlying conditions are fulfilled:
Machine type E by SIPLACEPlacement head SIPLACE CP14 with
component camera type 23 GigE
Feeder module type SIPLACE SmartFeeder 8 mm E orSIPLACE SmartFeeder 2x8 mm E
Pickup rate ≥ 99,97%
Dpm rate ≤ 5
Pad width ≥ 200 µm
Pitch ≥ 100 µm
Components (L x W x H) 400 µm x 200 µm x 200 µm (±20 µm)
Number of pixels for a 01005 component
275
Solder paste type 5
Template thickness 60 µm
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SIPLACE Software SuiteGeneral
SIPLACE provides compre-hensive solutions based on modular software tools for SMT machines, lines and production management: the SIPLACE software suite.
Product definition, optimi-zation and line control
Fast, fault-free introduction of products and optimum uti-lization of production lines are essential to maximize production output. The pro-grams from the SIPLACE software suite allow you to easily program products, fine-tune the programs you have created and then find the balance for them within your SMT production lines.
Production monitoring & process control
To achieve the production targets that are set, it is important to constantly moni-tor and check the production facilities. The SIPLACE soft-ware suite contains monitor-ing products tailored to suit the user group. These signal immediately if limits are exceeded on the machine or the production line.
Setup verification & traceability
Setup errors lead to series errors. The user-friendly SIPLACE software programs help you to avoid such errors, and thus ensure high quality in your electronics production.
The benefits of the SIPLACE software suite at a glance:
• User-friendly
• Simple operation
• Fast programming and error detection
• Reduces changeover times and stoppages
• Ensures optimum utiliza-tion of your production line's productivity
• Real-time information from the production area
• Incredibly fast distribution of information
• Optimum use of resources
• Timely notification when production materials need to be re-ordered
• Coordination of mainte-nance
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SIPLACE Software SuiteCustomer Benefit
Floating Changeover Based on Split Table ModeThe SIPLACE Pro setup mode "Split Table" (available Q1 / 2016) enables you to keep certain locations on the tables free at the setup opti-mization stage. Already kit-ted feeders for the next setup can then be configured on these free locations during the production process. Benefit:• Random configuration of
components for next setup when the machine is run-ning.
• The downtime for change-over is reduced to normal recipe change time.
Alternative ComponentsAn alternative component can completely replace another component. An alter-native component offers the same functional features as the standard component. By defining alternative compo-nents you can replace the components for the relevant placement positions when the production is in progress without performing a new download afterwards.
Alternative components are defined per placement posi-tion. Functions in the SIPLACE Pro PCB editor support the user to apply these alternatives to other placement positions.General Requirements:• Alternative components
have to be set up on the same head type.
• Alternative components require the same nozzle type.
• Alternative components require feeders of the same feeder type, such as tape feeder, tray feeders or stick feeders (e.g. switching from 16mmE tape feeder to a 24mmE tape feeder is supported; switching from a tape feeder to a stick feeder is not supported).
• Components must have their own part number to be able to treat alternative and standard compo-nents.
The tables in the current setup are divided into the areas I and II. This setup has been optimized so that only table area I is used. When product A is produced, Random Setup allows the next setup B to be configured in table area II during the production process. The setup in area A or B can also be a family setup, meaning that it contains the components needed for various products
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SIPLACE Software SuiteCustomer Benefit
Random Setup1. Configuring spare tracks
while machine is runningYou can avoid the need to splice refill reels if you config-ure spare tracks. This makes the refilling of components more flexible and leads to fewer malfunctions.2. Reduced component
sorting time in the pre-setup area:
• No need to sort by location or track for the whole line.
• Faster and more flexible setup of prepared feeders
• Random setup is faster than configuration of only one certain track.
• Additional configuration of spare tracks without changing the setup in SIPLACE Pro.
3. The next setup can be prepared during ongoing production
The user interface for the function Next Setup provides support functions to feeder changeover (e.g. LED con-trols, user interface display showing which components have already been config-ured for the next setup and which are still missing). The next setup can be conve-niently configured using the "Next Setup" function in Setup Center.
This function shows the fol-lowing:• Status display for the next
setup (based on the actual setup in the line).
• Which components have been set up or are still missing from the next set-up?
• Which components are configured on the wrong location? (for Random Setup within a table)
• Which spare tracks and multiple setup compo-nents are in the line?
• Which components will not be used in the next setup?
TIP: This function allows you also to print a delta-list of materials; basically compar-ing both setups.
SIPLACE TraceabilityThe SIPLACE Component Verification System prevents machine operators from refilling wrong components during production. Together with a PCB Bar-code Scanner the SIPLACE Component Verification Sys-tem allows the registration of all incoming material during the placement process. If some of the placed compo-nents subsequently turn out to have faults, it can be ascertained which other PCBs are also fitted with these faulty components, while taking into account the area of uncertainty around a new reel.
As a result, it is possible to recall only those boards that really have faults. In addition, the scope for providing evi-dence to be used in liability claims against component suppliers is of benefit to the customer.Range of Functions :• The end-user can specify
which data has to be regis-tered for Traceability e.g. Lot ID, Vendor ID, Date Code etc. This information can be encoded on a sin-gle barcode or on multiple barcodes onto the compo-nent reel. Component information can also be verified after a single scan of a "unique reel ID" which links to the reels data set in a database.
• The Component Level Indicator counts the com-ponent usage per track during the placement pro-cess. If a limit value is exceeded, the operator is forced to refill this track and to register all relevant data for Traceability.
• During production, the traceability data can be combined with the manu-facturing order (Job ID) and the product name, as well as the time frame during which the corre-sponding manufacturing order (Job ID) has been produced.
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SIPLACE Software SuiteSIPLACE Station Software
The diversity of functions and applications in the station software version 709.0 illus-trates the extreme flexibility of the E by SIPLACE.
This software supports oper-ators in their daily work, help-ing them to simplify processes on the machine and to increase productivity along the line. Four different user levels ensure that each operator has access to the information and options required to perform his spe-cific work on the machine.The benefits of the station software 709.0 at a glance:• Simple and innovative
user guidance, ideal for both inexperienced users (-> Smart GUI) and experts
• Fast, direct access to all machine functions and systems, as required.
• "Best in Class" NPI fea-tures
• Very user-friendly• Highly robust in the place-
ment process
User-friendly "new product introduction" processThe enhanced options for new product introduction (NPI) on the line is one of the key features in the SIPLACE station software 709.0.New products need to be produced error-free right from the very first board. The SIPLACE station software satisfies this requirement by supporting users during product introduction with a range of functions, including the following.Placement list at the station
The station always shows the placement list for the board currently being pro-cessed. This placement list includes the following infor-mation:• The placements in the
selected placement area• The order in which the
components are placed• The placement head
which places the compo-nents
• The feeder module from which the components are picked up
• The status of the place-ment position.
The status of the placement positions can be changed online at the station. If certain components on the line are to be omitted, the user can delay placement of these and perform it at a later time.The status of the placement position is divided into the following categories (position options):• Place• Skip (The placement posi-
tion will not be placed. This status can either be selected for the current board or for the complete job. This component will then be ignored on the fol-lowing boards until a new job is sent to the line.)
• Postpone. (The compo-nent will be placed at the end of the placement cycle.)
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SIPLACE Software SuiteSIPLACE Station Software
Individual measurement dataThe individual measurement data determined by the SIPLACE station software (measurement contexts) can be saved at the station. This can be linked to the following conditions (Vision measure-ment options):1. Unable to measure com-
ponent and measurement data (measurement con-texts) should be saved.
These measurement data can then be used for opti-mization purposes in a subsequent analysis. As with other optical inspec-tion systems, pseudo errors can be differentiat-ed from other errors and the affected component shape can then be opti-mized.
2. Vision measurement logs should always be written for this compo-nent.
Whenever there is general uncertainty about the quality of a component, the Vision logs can be writ-ten for all components.
3. As soon as Vision errors occur for the component, the machine will stop.
If you want to avoid com-ponent rejection, particu-larly for very expensive components, this option can be used to correct all measurement errors occurring, without the need for any rejections. The machine waits with the component, in front of the camera, so that the component can be checked.
In addition, pickup and place positions can be checked with the PCB camera. This makes 100% placement con-trol possible in the machine.Teaching components
Component shapes which are not part of the standard component shape library can be generated using the offline programming system SIPLACE Pro, with the help of data sheets, or with the offline Vision teach station and a sample component.Alternatively, a component shape can be marked as incomplete and transferred to the station with this status. The description can be com-pleted after the first pickup run on the line.After completion of the description, a robustness analysis can be performed at the station, to ensure that this component is always recognized reliably, even under different conditions.
You can also program the placement positions on the board in the station software. This software provides advanced support functions which allow you, for exam-ple, to combine images from the PCB camera with data from the placement program. This boosts the productivity significantly for production environments with frequent new production introductions or product changeovers.The SIPLACE station soft-ware makes daily work eas-ier for usersMany other features in the station software make day-to-day work easier for the users and optimize the SMT production processes.• Calibration process con-
trol is fully integrated into the SW
• Self-repair routines for nozzles and feeder mod-ules
• Self-determination of feeder module cycle
• "Alarms" - at a glance• "FaceDown" recognition• Direct access to board
conveyor functions, such as "nonstop board trans-port".
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SIPLACE Software SuiteSIPLACE Station Programming
In the SIPLACE Station Pro-gramming mode, the user can create a placement pro-gram (PCB, components, component shapes, setup) directly at the placement machine.
The specified fiducials and placement positions are exactly measured by the PCB camera. After a local optimizing run, the placement process can be started at the station.In this case, the placement machine can be used inde-pendently without a network connection to a programming system.
For a manual data exchange, the placement programs can be exported from the place-ment machine or imported into the placement machine.In order to implement the sta-tion programming mode, the SIPLACE Pro software including the SQL database is integrated on the station computer. The layout of the SIPLACE Pro GUI has been adapted to the look and feel of the station software GUI and is displayed as SIPLACE Station Programming desk-top in the station software.
The SIPLACE Station Pro-gramming provides the user at the station with all means that are required for a com-plete description of the placement program.
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Technical DataSMEMA InterfaceConnector Assignment
Signal interfacea (14 pin connection, interface standard "IPC-SMEMA-9851")
a) For more details, refer to the interface standard "IPC-SMEMA-9851".
Predecessor station X1 Successor station X2
Pin 1 MACHINE READY TO RECEIVE + Pin 1 MACHINE READY TO RECEIVE +
Pin 2 MACHINE READY TO RECEIVE – Pin 2 MACHINE READY TO RECEIVE –
Pin 3 BOARD AVAILABLE + Pin 3 BOARD AVAILABLE +
Pin 4 BOARD AVAILABLE – Pin 4 BOARD AVAILABLE –
Pin 5 Not in use Pin 5 Not in use
Pin 6 Not in use Pin 6 Not in use
Pin 7 FAILED BOARD AVAILABLE+ Pin 7 FAILED BOARD AVAILABLE+
Pin 8 FAILED BOARD AVAILABLE- Pin 8 FAILED BOARD AVAILABLE-
Pin 9 Reserved Pin 9 Reserved
Pin 10 Reserved Pin 10 Reserved
Pin 11 Reserved Pin 11 Reserved
Pin 12 Reserved Pin 12 Reserved
Pin 13 Reserved Pin 13 Reserved
Pin 14 Reserved Pin 14 Reserved
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Technical DataSMEMA InterfaceSignal Path
1. After switching on the station
Direction of transport
Conveyor n Conveyor n+1PCB sensor PCB sensor
Station n transports PCB to transfer position
Conveyor n running Conveyor n+1 stopped
BOARD AVAIL-ABLEPermission
Station n+1is not ready
1
0
2. PCB transfer has started
Direction of transport
Conveyor n Conveyor n+1PCB sensor
Station n transfersPCB to station n+1
Conveyor n running Conveyor n+1 runningStation n+1 expects PCB from station n
3. PCB is transferred
Direction of transport
Conveyor n Conveyor n+1PCB sensor PCB sensor
Station n has just trans-ferred PCB
Conveyor n stopped Conveyor n+1 runningStation n+1 expects PCBfrom station n, PCB has not yet arrived
PCB sensor
4. PCB transfer has been completed
Direction of transport
Conveyor n Conveyor n+1PCB sensor PCB sensor
Station n
Conveyor n stopped Conveyor n+1 running
Station n+1PCB has arrived
Request
NOT READY
BOARD AVAIL-ABLEPermission
1
1
Request
MACHINE READY TO RECEIVE
BOARD AVAIL-ABLEPermission
0
1
Request
MACHINE READY TO RECEIVE
BOARD AVAIL-ABLEPermission
0
0
Request
MACHINE READY TO RECEIVE
To start a new PCB transfer, both signals must be at least 50 ms "0".
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Technical DataElectrical Ratings, Energy Consumption and Compressed Air supply
Electrical ratingsSupply voltage Fuse
Main power supply 3 x 200 V~ up to 3 x 230 V~; ± 10 %; 50/60 Hz)a
3 x 380 V~ up to 3 x 415 V~; ± 10 %; 50/60 Hz
a) with adapter kit (US option)
3 x 16 A characteristic C3 x 16 A characteristic C
Mains power connection Cable 4 x 4 mm² with CEKON connector Energy consumption
Energy consumptionwith vacuum pump
Nominal active power 1.8 kWNominal apparent power 2.3 kVA
Compressed air supplyCompressed air pressure values
pmin pmax
0.5 MPa = 5.0 bar1.0 MPa = 10 bar
Operating pressure 0.48 MPa ± 0.025 MPa (4.8 bar ± 0.25 bar)Compressed air connection R 3/4" inner thread (pipe thread) with 1/2" hose connection
Ambient conditions for packaging, transportation and storageTemperature range Between -25°C and 55°CAtmospheric humidity Up to 95%Ambient pressure Up to 3000 m height without pressure equalization
Ambient conditions for machine operationRoom temperature Between 15°C and 35°CAtmospheric humidity 30% to 75 % (no higher than 45% on average to prevent any possibility of
condensation on the machine)Ambient pressure > 890 mbar (corresponds to 1000 m above mean sea level)
Compressed air consumptiona
a) Average consumption values
Placement head configura-tion
Compressed air consumptionb with vacuum pumpc
b) Under normal atmospheric conditions at 20°C and 1013 hPa.c) Vacuum pump for SIPLACE CP14/CP12/CP6 head only.
E by SIPLACE CP14CP12CP12 / PPCP6 / PPTH
90 Nl/min90 Nl/min140 Nl/min140 Nl/min185 Nl/min
Compressed air specification according to DIN ISO 8573-1:2010Particle size (ISO class 1) 0.1 µmParticle density (ISO class 1) 0.1 mg/m³Maximum oil content (ISO class 1) 0.01 mg/m³Pressure dewpoint (ISO class 4) + 3°
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Technical DataDimensions and Setup Conditions
Length of the machineE by SIPLACE 1500 mm
Width of the machineE by SIPLACE 1666 mm
Height of the machinewith indicator lamp
With folded-up protective covers(for PCB conveyor height 900 mm)(for PCB conveyor height 930 mm)(for PCB conveyor height 950 mm)
max. 1760mm
1750 mm 1780 mm 1800 mm
Machine ground clearance(for PCB conveyor height 900 mm)(for PCB conveyor height 930 mm)(for PCB conveyor height 950 mm)
120 mm ± 15 mm150 mm ± 15 mm 170 mm ± 15 mm
Weight of E by SIPLACESingle sidedDouble sided
1850 kg2050 kg
Weight of component tableChangeover table 60Changeover table 60 (fully configured)Fixed table 60Fixed table 60 (fully configured)
88 kg138 kg53 kg104 kg
Floor space for E by SIPLACESingle sided with 1 x changeover table 60Double sided with 2 x changeover table 60
2.835 m²3.338 m²
Floor stiffnessMinimum vertical floor stiffnessRecommended vertical floor stiffness
0,5E8 N/m≥ 1,5E8 N/m
The load per unit area calculation included an additional working space of 0.5 m on each side of the machine.Load per unit area for E by SIPLACE
Single sided Double sided
5.02 kN/m²5.04 kN/m²
Number of machine feet 4
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Technical DataPlacement System DimensionsPlacement System Center of Gravity
X = 0 mmY = 0 mmZ = 721 mm
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Technical DataManeuvering Radii for the Component Trolleys
Location 1 / Location2Maneuvering radius R 700 mmDistance L1: Machine center to outer edge of changeover table 1205 mmDistance L2: Machine center to wall 1905 mm
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Technical DataDimensions with JTF-MW
a) All dimensions in mm
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Technical DataTransportation and Delivery Configuration
DescriptionWithin Europe, the machine is delivered on a robust wooden pallet. If sent over-seas, the machine is pack-aged in a wooden crate.
Configuration when delivered• The lane on the single con-
veyor is set to a width of 210 mm.
• Both keyboards, the oper-ating panel and the moni-tors are dismantled.
• The indicator lamp is dis-mantled.
Transport dimensions (L x W x H) and weight
Means of transportA fork-lift truck with the following specification will be needed to carry the machine in its crate:
StandardExtended (with 1200 mm LBO)
2180 mm x 1770 mm x 1830 mm
2180 mm x 2330 mm x 1830 mm
Weight Dispatch Dispatchwithin Europe overseas2500 kg 2800 kg
Fork lengthLifting powerClear fork width
Min. 1800 mmMin. 6000 kgmin. 350 mm
Attachment point for the fork-lift
Attachment point for the fork-lift
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Configuration List
Configuration features NotesLocation 2 upgrade kit (f. E-series) XFixed table system XLocation 1 Fixed Side Covers XAdapter plate cpl. DLM4 XFixed Conveyor Rail Right E XFixed Conveyor Rail Left E XETD 25mm right XTray setup plate LOC2 XMovable table system XLOC1 upg. kit fixed to mov. table sys. XLocation 2 Movable Table Covers XCable harness, COTi 60 LOC1 XTable kit f. JTF-MW XLocation 2 Cover for Single-Side M/C XE-switch assembly XE-series US option power conversion kit XConveyor Height 950 XError lamp (2 lights) XError lamp (3 lights) XHuman-Machine-Interface Loc2 XComponent camera C+P (type 23) 6x6 GigE XComponent camera C+P (type30) 27x27 GigE XStationary camera (type 36) GigE w/ fastening XStationary camera (type 33) GigE w/ fastening XComponent camera stationary P+P (type25) 16x16 GigE XFlip-chip camera kit (E-series) XTwin-Pick+Place-Head/THK XPick+Place module THK R2 XCP12 compl./DLM4 XCP6 compl./DLM4 XPlacement head CP14P w/o camera XConfig kit Speed_CP12, E-series XConfig kit TwinHead E-series XConfig kit FLEX_RV+Twin/2_E-series XConfig kit CP14 f. E-series XNozzle changer TWIN std. cpl. X
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Configuration List
Configuration features NotesNozzle changer SPEED CP14 LOC1 cpl. XNozzle magazine type 40xx XNozzle changer SPEED kit reject bin small XModule, sensor, reject box Loc1 XVision Head Interface (VHI) cpl. XVision Base Interface (VBI) cpl. XMGCU assy (w/ screws) XMachine label kit_E-series (110) XVacuum Pump Kit Complete XReject bin, small XSensor reject box, location 2 X
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List of Options
Available options NotesComponent trolley E by SIPLACE 60 XFixed table E by SIPLACE 60 XHuman-Machine-Interface Loc2 XSIPLACE JTF-MW X On location 2 onlySIPLACE SmartFeeder E, 8 mm to 56 mm X SIPLACE SmartFeeder E can be used on
the E by SIPLACE only.Manual Tray Holder E Flex XManual Tray Holder E Speed X"Long Board Option" LBO E, 1030 Right X The "Long Board" option facilitates the
placement of boards which are longer than the specified length, up to a length of 460 mm.
"Long Board Option" LBO E, 1030 Left X"Long Board Option" LBO E, 1200 Right X"Long Board Option" LBO E, 1200 Left XNozzle Changer TH, location 2 XNozzle Changer RV6, location 1 XNozzle Changer RV6, location 2 XNozzle Changer CP14, location 2 XNozzle Changer RV12 location 1 XNozzle Changer RV12 location 2 XNozzle magazine, type 30xx XNozzle magazine, type 38xx XNozzle magazine, type 39xx XNozzle magazine, type 40xx XConveyor Height 950 XConversion kit, USA (3 X 208 VAC) XPower Supply COT E XDummy feeder module XSIPLACE PowerAdaptor E XSIPLACE Preparation Table E XSIPLACE Component Recject Conveyor E X
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ESD Certificate
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www.e-by-siplace.com
ASM Assembly Systems Singapore Pte ltd2 Corporation Road#01-03 Corporation PlaceSingapore 618494Tel.: +65 6877-3900Fax: +65 6877-3901e-mail: [email protected]
The information in this brochure is merely a general description and lists performance features that will not necessarily be present as de-scribed in the specific application, or that may be modified if the prod-uct is further developed. The desired performance features are only binding if expressly agreed when the contract is concluded.
All technical data according to our Scope of Service and Delivery.We reserve the right to make changes.Copyright © ASM Assembly Systems
Order no. A10011-ASM-T45-EN - Edition 2 1115 E-ePrinted by ASM Assembly Systems GmbH & Co. KG