dummy and pad c hips
DESCRIPTION
Dummy and Pad C hips. Needed for various activities (interconnection tests, mass tests, assembly,…) Production of masks, processing, thinning and dicing of wafers presumably takes about 2-3 months. Dummy chips. Pad chips. 15 mm x 30 mm 50 um thick Metal pads and traces on SiO 2 /Si - PowerPoint PPT PresentationTRANSCRIPT
Dummy and Pad Chips• Needed for various activities (interconnection tests, mass tests, assembly,…)• Production of masks, processing, thinning and dicing of wafers presumably takes about 2-3 months.
Pad chips
• 15 mm x 30 mm• 50 um thick• Metal pads and traces on SiO2/Si• Daisy chain connections
Dummy chips
• 15 mm x 30 mm• 50 um thick• Blank silicon
WP6 meeting 16/01/14 - P. Riedler
Component status
• Some chips left of each type, but not sufficient for the activities in 2014!
• Collect needs from the different activities and start producing dummy + pad chips– WP4,6,7,8,9
Next:• Purchase wafers for dummy and pad chips• Thin and dice wafers for dummy chips• Pad chips: define layout and produce patterned wafers
followed by thinning and dicing
WP6 meeting 16/01/14 - P. Riedler
Pad chips – main parameters tbd
Chip dimension: • Approximately 15 mm x 30 mm (tbc)
– Studies on stave arrangement and new beam-pipe ongoing– Study the possibility to use the full reticle length (32 mm)
Number of pads:• Assume 88 contacts (32 VDDD, 32 VDDA, 8 SUB, 8 DATA, 4 CLK, 4 Conf)
– Feed-back from FPC design needed (e.g. distance of pads from the edge, etc.)
Pad positions:• Should be as close as possible to final layout (TDR version)• File ready soonPad form:• Square or octagonal preferred over round pad form
– Impact of the pad form on soldering needs to be evaluated on dummy chips
Pad diameter:• Has to take into account the alignment precision of the holes on the FPC• Tentative diameters: 250, 300 and 350 um to be evaluated on dummy chips
WP6 meeting 16/01/14 - P. Riedler
Question:
How many components are needed for the activities in WP6:• # of dummy chips• # of pad chips needed
WP6 meeting 16/01/14 - P. Riedler
WP4 Laser soldering Tab bonding Post-processing Mass test
Evaluation Pad form Pad form Test of metallurgy and supplier
PALPIDE-FS for contact tests
Pad size Pad size
Results El. tests+ metallurgical analysis
El. tests+ metallurgical analysis
El. tests+ metallurgical analysis
Single chip assemblies
Single chip assemblies
Single chip assemblies
IB+OB HIC IB+OB HIC IB+OB HIC
# chips needed
WP6 meeting 16/01/14 - P. Riedler