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1VLSI Design: CMOS Technology
VLSI DesignDesign Methods
Frank Sill TorresUniversidade Federal de Minas Gerais (UFMG), Brazil
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CMOS VLSI Design 4th Ed. 2
Layout Chips are specified with set of masks Minimum dimensions of masks determine transistor
size (and hence speed, cost, and power) Feature size f = distance between source and drain
– Set by minimum width of polysilicon Feature size improves 30% every 3 years or so Normalize for feature size when describing design
rules Express rules in terms of λ = f/2
– E.g. λ = 45nm in 90 nm process
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CMOS VLSI Design 4th Ed.
Masks
3
Several masks– n-well– Polysilicon– Diffusion (n+, p+)– Contacts– Metal 1, 2, …– …
Informative masks (names, options, …)
(Usually) no maskfor oxide
Metal
Polysilicon
Contact
n+ Diffusion
p+ Diffusion
n well
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CMOS VLSI Design 4th Ed.
Masks
4
Source Drain
Gate
Substrate
Contact
Masks are only simplifications of the real world!
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CMOS VLSI Design 4th Ed. 5
Simplified Design Rules Conservative rules to get you started
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CMOS VLSI Design 4th Ed. 6
Well spacing Wells must surround transistors by 6 λ
– Implies 12 λ between opposite transistor flavors– Leaves room for one wire track
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CMOS VLSI Design 4th Ed. 7
Wiring Tracks A wiring track is the space required for a wire
– 4 λ width, 4 λ spacing from neighbor = 8 λ pitch Transistors also consume one wiring track
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CMOS VLSI Design 4th Ed.
Wires, Contacts and Vias
8
p-tub
poly poly
n+n+
metal 1
metal 3
metal 2
contact
via1
via2
metal 1
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CMOS VLSI Design 4th Ed.
Transistor Design
9
Transistor is built from polysilicon gate, placed overa region of diffusion (also called active diffusion)
Rectangles representing edges of gate material and diffusion area (n+ or p+)
Thin gate oxide, and gate area are implied
LW
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CMOS VLSI Design 4th Ed.
Quiz Using the design rules defined on slide 5 and a
180nm process:A. What is the minimum distance between two M1
wires?B. What is the minimum distance between a
diffusion region in a substrate and an N-Well?C. What is the minimum distance between a M1
and M2 wire?D. How many contacts can be placed on a length
of 900 nm?
10
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CMOS VLSI Design 4th Ed.
Quiz Using the design rules defined on slide 5 and a
180nm process:A. What is the minimum distance between two M1
wires? 360 nmB. What is the minimum distance between a
diffusion region in a substrate and a N-Well? 540 nm
C. What is the minimum distance between a M1 and M2 wire? Does not apply
D. How many contacts can be placed on a length of 900 nm? 2 (2+3+2)
11
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CMOS VLSI Design 4th Ed. 12
Inverter Layout Transistor dimensions specified as Width / Length
– Minimum size is 4λ / 2λ, sometimes called 1 unit– In f = 90 nm process, this is 180 nm wide, 90 nm
long
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CMOS VLSI Design 4th Ed. 13
Inverter Layout
a out
+
transistors
GND
VDD
a out
bulk tiesn-well
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CMOS VLSI Design 4th Ed.
NAND layout
+
ba
out
b
a
out
VDD
GND
bulkties
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CMOS VLSI Design 4th Ed.
NOR layout
b
a
out
a
b
out
VDD
GND
bulk ties
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CMOS VLSI Design 4th Ed. 16
Stick Diagrams A stick diagram is a cartoon of a layout. Stick diagrams help plan layout quickly
– Need not be to scale– Draw with color pencils or dry-erase markers
Does show all components/vias (except possibly tub ties), relative placement.
Does not show exact placement, transistor sizes, wire lengths, wire widths, tub boundaries.
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CMOS VLSI Design 4th Ed.
Stick Layersmetal 3
metal 2
metal 1
poly
ndiff
pdiff
17
C
Ycontact
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CMOS VLSI Design 4th Ed. 18
Stick Diagrams - INV
C
Y
metal1polyndiffpdiffcontact
0ON
1OFF
VDD
A Y
GND
1. Place diffusions 2. Place
poly (forms transistors)
3. Place output + contacts
4. Place supply + contacts
c
AVDD
GND
Y
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CMOS VLSI Design 4th Ed. 19
Stick Diagrams - INV
0ON
1OFF
VDD
A Y
GND
c
AVDD
GND
Y
A Y
GND
VDD
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CMOS VLSI Design 4th Ed.
Stick Diagrams – Chain
20
VDD
GND
A B C Y
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CMOS VLSI Design 4th Ed.
Stick Diagrams – Chain
21
Pdiff
Ndiff
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CMOS VLSI Design 4th Ed.
Stick Diagrams – Chain
22
Pdiff
Ndiff
A B C
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CMOS VLSI Design 4th Ed.
Stick Diagrams – Chain
23
Pdiff
Ndiff
BA
VDD C VDD Y VDD
B C
Not so good. Can be improved!
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CMOS VLSI Design 4th Ed.
Stick Diagrams – Chain
24
Pdiff
Ndiff
BA
VDD C YVDD
B C
B GND C YGND
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CMOS VLSI Design 4th Ed.
Stick Diagrams – Chain
25
Pdiff
Ndiff
BA
VDD
CVDD C
B
GND
C
Y
GND
c c
c
c
B
VDD
c
c
B
C
c
c
c c
GND
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CMOS VLSI Design 4th Ed. 26
Stick Diagrams – NAND3
Y
AVDD
GND
B C
Y
NAND3
AB
Y
C
C
Y
metal1polyndiffpdiffcontact
C
Y
etapo yndiffpdiffcontact
C
Y
etapo y
dpdcontact
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CMOS VLSI Design 4th Ed.
Quiz Draw a stick diagramm of a NAND2 cell
27
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CMOS VLSI Design 4th Ed.
Quiz Draw a stick diagramm of a NAND2 cell
28
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CMOS VLSI Design 4th Ed. 29
Cell Layout Layout can be very time consuming
– Design cells to fit together nicely– Build a library of standard cells
Standard cell design methodology– VDD and GND should abut (standard height)– Adjacent cells should satisfy design rules– nMOS at bottom and pMOS at top– All cells include well and substrate contacts
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CMOS VLSI Design 4th Ed. 30
Standard Cells Uniform cell height Uniform well height M1 VDD and GND rails M2 Access to I/Os Well / substrate taps Exploits regularity
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CMOS VLSI Design 4th Ed. 31
Complementary CMOS Complementary CMOS logic cells
– nMOS pull-down network– pMOS pull-up network– a.k.a. static CMOS
pMOSpull-upnetwork
outputinputs
nMOSpull-downnetwork
Pull-up OFF Pull-up ONPull-down OFF Z (float) 1
Pull-down ON 0 X (crowbar)
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CMOS VLSI Design 4th Ed. 32
Series and Parallel nMOS: 1 = ON pMOS: 0 = ON Series: both must be ON Parallel: either can be ON
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CMOS VLSI Design 4th Ed. 33
Series and Parallel
(a)
a
b
a
b
g
g
0
0
a
b
0
a
b
0
a
b
OFF OFF OFF ON
(b)
a
b
a
b
g1
g2
0
0
a
b
0
1
a
b
1
0
a
b
1
1
ON OFF OFF OFF
a
b
a
b
g1 g2 0 0
a
b
0
a
b
1
a
b
11 0 1
(a)
a
b
a
b
g1
g2
0
0
a
b
0
1
a
b
1
0
a
b
1
1
OFF OFF OFF ON
a
b
a
b
g1
g2
0
0
a
b
0
1
a
b
1
0
a
b
1
1
1 2g g→ •
1 2g g→ •
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CMOS VLSI Design 4th Ed. 34
Series and Parallel(b)
b b
g
g
0
0
b
0
b
0
b
ON OFF OFF OFF
(c)
a
b
a
b
g1 g2 0 0
OFF ON ON ON
a
b
0
a
b
1
a
b
11 0 1
a
b
0 0
a
b
0
a
b
1
a
b
11 0 1
a
b
g1 g2
(c)
b b
g g 0 0
OFF ON ON ON
(d) ON ON ON OFF
b
0
b b
0
a
b
0 0
a
b
0
a
b
1
a
b
11 0 1
a
b
g1 g2
1 2g g→ +
1 2g g→ +
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CMOS VLSI Design 4th Ed.
Series and Parallel Requirement (will be detailed in later class)
– PUN only applies pMOS– PDN only applies nMOS
→ Structures of 1 stage are always inverting, because:– nMOS is on if input = 1 → if nMOS is on then output = 0
– pMOS is on if input = 0 → if pMOS is on then output = 1
35
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CMOS VLSI Design 4th Ed. 36
Conduction Complement Complementary MOS cells always produce 0 or 1 Ex: NAND cell
– Series nMOS: Y=0 when both inputs are 1– Thus Y=1 when either input is 0– Requires parallel pMOS
Rule of Conduction Complements– Pull-up network is complement of pull-down– Parallel -> series, series -> parallel
A
B
Y
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CMOS VLSI Design 4th Ed. 37
Conduction Complement Design strategy for logic formula F
– 1. Invert logic formula to receive ¬F (now, the formula represents conditions for output = 0)
– 2. Apply parallel and series connections of nMOSto represent AND and OR connections of ¬F
– 3. Invert all AND and OR connections to generate the pMOS part
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CMOS VLSI Design 4th Ed. 38
Conduction Complement Example: Y = ¬(A • B)
– 1. ¬Y = A • B– 2.
– 3. (a)
Out
GND
g1
g2
VDD
g1
g2
(c)
GN
g g
(d)
VDD
Out
g1 g2
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CMOS VLSI Design 4th Ed. 39
Compound Cells Compound cells can do any inverting function Example:
(AND-AND-OR-INVERT, AOI22)Y A B C D= • + •
A B C DA B
C D
(c) (d)
A
B
C
D
A
B
C
D
(a) (b)
Y A B C D= • + •
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CMOS VLSI Design 4th Ed. 40
Compound Cells (AND-AND-OR-INVERT, AOI22)Y A B C D= • + •
A
B
C
D
B
D
YA
CA
CB
D
Y
(e)
(f)
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CMOS VLSI Design 4th Ed.1: Circuits & Layout 41
Example: O3AI ( )Y A B C D= + + •
A B
Y
C
D
DC
B
A
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CMOS VLSI Design 4th Ed. 42
Example: O3AI( )Y A B C D= + + •
AVDD
GND
B C
Y
D
A B
Y
C
D
DC
B
A
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CMOS VLSI Design 4th Ed.
Non-Inverting Cells What about non-inverting cells, e.g. AND? => Require additional inversion, i.e. an inverter Example: AND2
43
A
B
Y
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CMOS VLSI Design 4th Ed.
Quiz Design the Schematic of a OAI22 gate
44
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CMOS VLSI Design 4th Ed.
Quiz Design the Schematic of a AOI gate
45
( ) ( )Y A B C D= + • +
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CMOS VLSI Design 4th Ed. 46
Signal Strength Strength of signal
– How close it approximates ideal voltage source VDD and GND rails are strongest 1 and 0 nMOS pass strong 0
– But degraded or weak 1 pMOS pass strong 1
– But degraded or weak 0 Thus nMOS are best for pull-down network Thus pMOS are best for pull-up network (will be detailed in later class)
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CMOS VLSI Design 4th Ed. 47
Pass Transistors Transistors can be used as switches
g = 0s d
g = 1s d
0 strong 0Input Output
1 degraded 1
g = 0s d
g = 1s d
0 degraded 0Input Output
strong 1
g = 1
g = 1
g = 0
g = 01
g
s d
g
s d
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CMOS VLSI Design 4th Ed. 48
Transmission Cells Pass transistors produce degraded outputs Transmission cells pass both 0 and 1 well
g = 0, gb = 1a b
g = 1, gb = 0a b
0 strong 0
Input Output
1 strong 1
g
gb
a b
a bg
gb
a bg
gb
a bg
gb
g = 1, gb = 0
g = 1, gb = 0
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CMOS VLSI Design 4th Ed. 49
Tristates Tristate buffer produces Z when not enabled
EN A Y0 0 Z0 1 Z1 0 01 1 1
A Y
EN
A Y
EN
EN
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CMOS VLSI Design 4th Ed. 50
Nonrestoring Tristate Transmission cell acts as tristate buffer
– Only two transistors– But nonrestoring
• Noise on A is passed on to Y
A Y
EN
EN
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CMOS VLSI Design 4th Ed. 51
Tristate Inverter Tristate inverter produces restored output
– Violates conduction complement rule– Because we want a Z output
A
YEN
A
Y
EN = 0Y = 'Z'
Y
EN = 1Y = A
A
EN
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CMOS VLSI Design 4th Ed. 52
Multiplexers 2:1 multiplexer chooses between two inputs
S D1 D0 Y
0 X 0 0
0 X 1 1
1 0 X 0
1 1 X 1
0
1
S
D0
D1Y
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CMOS VLSI Design 4th Ed. 53
Cell-Level Mux Design
How many transistors are needed? 201 0 (too many transistors)Y SD SD= +
D1
D0S Y
44
4
2
22 Y
2
D1
D0S
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CMOS VLSI Design 4th Ed. 54
Transmission Cell Mux Nonrestoring mux uses two transmission cells
– Only 4 transistorsS
S
D0
D1YS
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CMOS VLSI Design 4th Ed. 55
Inverting Mux Inverting multiplexer
– Use compound AOI22– Or pair of tristate inverters– Essentially the same thing
Noninverting multiplexer adds an inverter
S
D0 D1
Y
S
D0
D1Y
0
1S
Y
D0
D1
S
S
S
S
S
S
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CMOS VLSI Design 4th Ed. 56
4:1 Multiplexer 4:1 mux chooses one of 4 inputs using two selects
– Two levels of 2:1 muxes– Or four tristates
S0
D0
D1
0
1
0
1
0
1Y
S1
D2
D3
D0
D1
D2
D3
Y
S1S0 S1S0 S1S0 S1S0