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Thermal Management
Solutions for Electronics
ThermaCool® Interface MaterialsProviding Cost-Effective, Easy-to-Use Solutions to
Difficult Cooling Problems
Theseproductsarebasedupon50 yearsoftapemanufacturingexperience,designingthermalinterfaceswithcreativematerialsandqualityconstructionstoachievemaximum performance. The ThermaCool® product line give maximum thermal performance in a cost-effective form.
• ThermaCool thermal management products provide an effective path for heat dissipation with minimal complication to manufacturing processes. ThermaCool products are designed to simplify our customers’ manufacturing processes.
• ThermaCool products ensure excel-lent system performance, which is critical to optimize operating effi-ciency and expected life of modern microprocessors and other electronic components. This is even more criti-cal with increasing power density of microprocessors and electronic sys-tems. With sufficient cooling, micro-processors will operate at speeds lower than their design capability and operating life may be signifi-cantly reduced.
• System designers no longer need to sacrifice the thermal reliability in order to simplify the assembly process. ThermaCool products allow designers to have effective thermal solutions while keeping assembly costs to a minimum.
Solutions for Electronics
What is Thermal Management?A thermal management system consists of materials designed to remove the heat generated by an electronic device (such as a power transistor or a microprocessor) to the ambient environment in order to ensure the reliable operation of the system.
ContentsBackground Theory of Thermal Management . . . . . . . . . . . . . . 1
Definitions for Thermal Interface Design . . . . . . . . . . . . . . . . . . . . . . 1
Saint-Gobain’s Thermal Test Methods . . . . . . . . . . . . . . . . . . . . . . . . .2
How Thermal Interface Materials Ensure:
More Dependable and Reliable System Operation . . . . . . . . . . .3
The Right Thermal Interface Material for Your Application . . . . . . . . 5
Thermal Phase Change . . . . . . . . . . . . . . . .6
Thermal Tapes and Transfer Adhesives . . . . . . . . . . . . . . . . . . . . 7
Thermal Fabrics . . . . . . . . . . . . . . . . . . . . . . .8
Gap Fillers . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
ThermaCool Thermal Interface Materials Are Designed For Easy System AssemblySaint-Gobainrealizesthatthecompetitivenatureoftoday’scomputerassemblymarketrequiresautomatedmassproductiontechniques.That’swhyourthermalmanagementproductsaredesignedtoprovideaneffectivepathforheatdissipationwithminimalcomplicationtothemanufacturingprocess.Inordertoaccomplishthisobjective,Saint-Gobainutilizesover50yearsoftapemanufacturingexperiencetodesignthermalinterfaceswithcreativematerialsandqualityconstructionsthatwilldelivermaximumperformance.Theresultisaproductlinethatbalancesthemaximumthermalperformanceinacost-effectiveform(seeDiagram1).Maximumthermalperformanceofasystemiscriticaltooptimizetheprocessingspeedandtheexpectedlifeofmodernmicroprocessors,andbecomesevenmorecrucialasthepowerofmicroprocessorsandthepowerdensityofcomputerassembliescontinuetoincrease.Ifamicroprocessorisinsufficientlycooled,itwilloperateatspeedslowerthanitiscapableof.Inaddition,whenamicroprocessorisexposedtoelevatedtemperaturesforextendedtimeperiods,itsoperatinglifewillbedecreasedoritcanevenbedestroyed.Computerdesignersnolongerneedtosacrificethethermalreliabilityoftheirsystemsinordertosimplifytheassemblyprocess.Saint-Gobainallowsdesignerstoincorporatethenecessarythermalinterfacewhilekeepingtheirassemblycoststoaminimum.Thiscombinationcanproduceareliablesystemataverycompetitivecost.
DIAGRAM 1
Max Completelycon-formstosurfaceroughnessandconcavity
Messyandlaborintensivetoapply
Pre-formedinterfacewhichcannotbepreattachedtoheatsink/CPU
Canbeappliedtoheatsink/CPUwithspecialequipment
CanbepreattachedtoheatsinkorCPU
Surfaceadhesivewetsoutatlowpressures(10psi)
Requirespressure>25psitoensuresurfacebonding
Requireshighpressuretoper-formeffectively(300psi)
Min
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Thermal Grease
Phase ChangeC1100 C1055 C1060
Gap FillerTC3000 TC100
R10404
Thermal TapesC695 C675 K272 K271
Phase ChangeC1095x01
Thermal Fabrics TF1860 TF400 TF1818 TF1870
ThEr
MA
L PE
rFO
rMA
NCE
EasyDifficult EASE OF uSE
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Choosing Thermal Interface Materials
Low TC2900 C1100 KC100 (Less than TC3005 C1055 15 psi) TC3006 C1095 R10404 C1060
Medium TC3001HCT C6910 TC100U Tab C695 K271 TC3001 C675 K272 TC100U TR3/5 K275
high TC100 TC1870 (Over TC400 100 psi) TC1860 TC1818
Define Contact
Pressure in Operation
Electrical Isolation
requirements
Determine Interface Gap
required
high None high None high
>20 Mils <7 Mils
7-20 Mils
Gap Filler
Width of Gap
T Fabric Tape Tape P Chg
STAGE 1Determineinterfacegaptofill—Iflargerthan20mils,agapfillerisused;below20mils,tapesandfabricsareused.
STAGE 2Iselectricisolationrequired?
STAGE 3Howmuchpressureillbesuedtocreatecontactbetweentwosurfacesandinterfacematerial?Higertheforceavailable,thehardertheinterfaceshouldbe.
STAGE 4: ChOOSE ThE LOWEST ThErMAL CONDuCTIvITy Or IMPEDANCE
• Theabovestepswillhavenarrowedthepotentiallistofinterfacechoices.
• Thermalresistancevaluesshouldbemeasuredunderconditionsascloseaspossibletotheactualapplication.
• Testconditionsmustbethesameinordertocomparethermalresistancevalues.
• Dependingontheapplicationgivenperformancecanbegovernedbybulkthermalconductivityorthermalimpedance,asdepictedindiagramsatright.Itcanalsobedepictedintermsof“resistorinseries”model.
ProDuCT SELECTor GuIDE
2
3
1
3
Product Line Overview
TheThermaCoolproductlineprovidescost-effective,highperformancesolutionstoheattransferneedsinmanyelectricaland/orelectronicapplications.Frommicropro-cessorstohighpowerswitchgear,ThermaCoolproductsprovidestherightsolution— Simply the Coolest
Gap FillersThermallyconductive,lowdurometer,filledsiliconepolymersheetsusedtoprovidethermalsolutionswheninter-facegapsaregreaterthan20mils.
•TC100 — Unreinforcedsilicone
•TC100U — Uncuredmaterialthatcuresinplace
•TC3001 —Newcompliantproducts—positionedagainstChromerics1674
•TC3001HCT — HigherconductivitygapfillerpositionedagainstBergquistA3000
•TC3005 — VerycompliantgapfillerpositionedagainstBergquistVOUltraSoft
Thermally Conductive FabricsFabricreinforcedsiliconepolymersheetsusedtoprovidethermalsolu-tionswereinterfacegapsarelessthan20milsandhightorqueapplicationisrequired.
•TF1818 — Thermallyconductiverein-forcedelastomer
•TF187X — Higherperformancethermallyconductivereinforcedelastomer
•TF400 —Mediumperformanceproductwithexcellentvalue—Chromerics1674
Thermally Conductive TapesTapesystemswiththermallyconductiveadhesivesandsubstratesthatcaneitherbeelectricallyisolating/thermallyconduc-tiveoronlythermallyconductive.
•Kapton Tapes — K271, K272 and K275
•Aluminum Foil — C675
•Graphoil Tape — C695 and C6910
•Transfer Adhesive — TR-3 and TR-5
•Mostformulationsuseacrylicadhesivebutsiliconesystemisavailable.
Phase Change MaterialsHighperformancesystemsusedtocou-pleheatsinkandmicroprocessorsandotherminiatureelectroniccomponentsandprovidelowestthermalimpedanceofallThermaCoolthermalinterfacematerials.
•C1055 — OlderPCTIMmaintainedforprints
•C1060 — FabricreinforcedversionofC1055
•C1095 X01 —No-stickPCTIM
•C1100 and C1100F — HighestperformanceproductforhigherpowerMPUsvsShin-Etsugrease
Data sheets and other information for the Thermal Management Line can be found on the web site:
www.thermacool.saint-gobain.com1
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Thermal Fabrics
ProDuCT ovErvIEWThermallyConductiveFabricsarefiberglass-reinforcedceramic-filledsiliconepolymersheetsusedtoprovidethermaltransferandelectricalisolationwhereinterfacegapsarelessthan20milsandhightorqueapplicationisrequired.Thefiberglass/ceramic-filledsiliconecompoundconstructionprovidesexcellentcut-thruresistance,highthermaltransferandeffectiveelectricalisolation.Thesematerialsaretypicallyusedincomputerpowersuppliesandamplifierswherethecombinationofcut-thruresistanceandhighthermaltransferprovidesacost-effectivesolution.
TYPICAL APPLICATIoNS•Productstofilltheneedofvaryingcomponentclampingforcesandmethods
•Electricallyisolatingcomponentswhileprovidingexcellentthermaltransfertoheatsinks
•Electronicmodulesforpowersuppliesandtelecommunications
•FitsbetweenCPUandHeatSpreader
•HeatTransferpadsinMemoryModules
ProDuCTS AND DESCrIPTIoN•TF400 Series:Cost-effectivethermallyconductivesiliconecoatedfabricsuppliedinthicknessof7.0and 9.0milsthick.
•TF1870 Series:Similarto TF400Seriesbutimprovedthermalperformance.
•TF1818:18.0milthickthermallyconductivesiliconecoatedfabric.Increasedbreakstrengthandextrasmoothsurface.
•All Products:Canbesuppliedwithathermallyconductiveacrylicadhesiveononeside.
Product Color Thickness Flame rating Thermal Thermal Name (mils) vertical Burn Conductivity Impedance UL 94 (W/mK) (°C in.2/W) ASTM E1530 ASTM E1530
CONSTruCTION MEChANICAL ThErMAL COMMENTS
TF1867 Gray 7 VTM-0 0.9 0.65 Lowestcostfabric
TF1869 Gray 9 VTM-1 0.9 0.70
TF407 Gray 7 V0 0.9 0.31 Mediumperformancematerial
TF409 Gray 9 V0 0.9 0.39
TF412 Gray 12 V0 0.9 0.48
TF1818 Gray 18 V0 0.8 0.89 Verythickfabricforhighpuncture
TF1877 Green 7 V0 1.3 0.24 Higherthermalperformance
TF1879 Green 9 V0 1.3 0.28
All products RoHS compliant
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Gap Fillers
ProDuCT ovErvIEWGapFillersarethermallyconductive,compliantceramic-filledsiliconepolymersheetsusedtoprovidethermalsolutionswheninterfacegapsaregreaterthan20mils.GapFillerscanbeusedtospanairgaps,enhancingthermalperformanceofcomputermemorymodules,telecommunicationequipmentandotherelectronicdevices.TheThermaCoolGapFillerfamilyincludesproductsinavarietyofthicknessesandarangeofhardnessestoeffectivelyclosegapswhileprovidingthethermaltransferneededindemandingelectronicapplications.
TYPICAL APPLICATIoNS•Fillingareasofirregularsurfacestoprovideathermalinterfacetotheheatsink
•Electricallyisolatingcomponentswhileprovidinggoodthermaltransfertoheatsinks
•FitsbetweenCPUandHeatSpreader
•HeatTransferpadsinMemoryModules
•CDROMCooling
•Cushioningtoremovedamagecausedbyvibration
•HeatPipeAssemblies
ProDuCTS AND DESCrIPTIoN•R 10404:Thermallyconductiveclosedcellspongeforgasketingheattransferandcushioning.Providedinsheetsoryardgoodsforeaseofcuttinginthicknessfrom0.032 –0.250.
•TC100: Thermallyconductivesolidsiliconerubber,providedinyardgoodsfrom0.025 – 0.062thickforfillingairgapsunderhighloadforce.
•TC100U:SimilartotheTC100butsuppliedina“B”Stageconfigurationtofillgapsandbonddissimilarmaterialsinplaceprovidingathermaltransferpath.
•TC 3000 Family: Thermallyconductiveconformablesiliconerubber,providedin24" x 24"sheetsfrom15–220milsthickforfillingairgapsunderhighloadforce.TheproducthasUL94 V-0flamerating.Theproductisnaturallytackyandhasaverylowthermalresistance.
–TC3001:Verysoft(5–10ShoreA) –TC3002:Soft(25–30ShoreA) –TC3005:Extremelysoft(<5ShoreA)
Product Standard Surfaces* Flame hardness Thermal Name Thicknesses Burn rating (Shore A) Conductivity (mils) UL 94 vertical ASTM E1530 (W/mK)
CONSTr. MEChANICAL ThErMAL COMMENTS
TC2900 30–220 Neat,1–6 V01 5–10 1.3 Lowcost,mediumperformancegapfiller
TC3001 20–220 Neat,1–6 V0 5–10 1.5 Softgapfiller
TC3005 20–220 Neat,1–6 V0 <5 1.5 Verycompliantforlargercompressionvalue
TC3001HCT 40–220 Neat,1–6 V01 5–10 3.0 Higherthermalconductivitygapfiller
TC3006 20–220 Neat,1–6 V01 5–10/Shore 00 1.1 Extremelysoftforverylargecompression
R10404 1/32"–1/4" Neat,1–6 V1 15 0.3–0.6 Conductivesponge
TC100 25, 32, 62 Neat,1–6 HB 65 1.3 Verytoughgapfiller,mediumperformance
TC100U 15, 32, 62 Neat,1–6 — 652 1.3 Uncuredmaterialforbondingandgapfilling
1 Pending2Aftercure
* 1 BN–ononesidenostick 3 PolyimideFilm 5 MTKapton
2 PETfilm 4 FabricScrim 6 ThermalFabric
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Thermal Tapes
ProDuCT ovErvIEWThermallyConductiveTapeshavethermallyconductivepressure-sensitiveadhesivesappliedtosubstratesthatcaneitherbeelectricallyisolating/thermallyconductiveoronlythermallyconductive.Theyareusedtojoinheatsinkstocomputerprocessorsinplaceofmechanicalfasteners,enhancetheperformanceofheatsinksbylaterallyspreadingheat,orelectricallyisolatecomponentsofapowersupplywhilestillprovidinganexcellentthermalconductionpath.
TYPICAL APPLICATIoNS•Bondingheatsinkstoceramicormetalpackagedmicroelectroniccomponentsoncircuitboards
•Electricallyisolatingcomponentswhileprovidinggoodthermaltransfertoheatsinksorbackplanes
•Providingbondingmethodsformaterialsthataresuppliedwithoutadhesiveforeaseinassembly
•Replacingmechanicalfastenerswithapowerfulbondingsystemthatallowsrapidassembly
ProDuCTS AND DESCrIPTIoN•KAPTON Tapes:Thermallyconductiveandelectricallyisolating
–K271—One-sidedadhesivecoatedThermalKaptonMT®tape
– K272—Two-sidedsiliconecoatedThermalKaptonMT®tape
– K275—Two-sidedadhesivecoatedThermalKaptonMT®tape
•Metal Foil Tapes: Thermallyconductivemetalfoiltapes
–C675—Aluminumfoilwithacrylicthermallyconductiveadhesive
•Grafoil® Tapes:Thermallyconductiveflexiblegraphitetape
–C695 and C6910 —Graphitetapewithacrylicthermaladhesiveononeside
•Thermally Conductive Transfer Adhesives
–TR3 & TR5—Thermallyconductiveacrylicadhesives
Product Carrier Thickness Adhesion Dielectric Strength Thermal Conductivity Thermal Impedance Name (mils) (oz./in.2) (volts total) (W/mK) ASTM E1530 (°C in.2/W) ASTM E1530
CONSTruCTION MECh. ELECTrICAL ThErMAL COMMENTS
K271 MTKapton 4.5 30 / 601 7000 0.6 0.40 Onesideadhesive,oneside siliconeonKapton
K272 MTKapton 6.0 None 7000 0.9 0.30 TwosidesiliconeonKapton K275 MTKapton 30 / 601 6500 0.4 0.49 TwosideadhesiveonKapton
C675 Aluminum 6.0 30 / 601 Non- 2.0 0.10 Bondingtapetompu Foil insulating forheatsinks
C695 Graphite 6.0 3-52 Non- 2.0 0.12 Veryhighconductivity, Paper insulating goodforheatspread
C6910 Graphite 11.0 3-52 Non- 2.6 0.15 ThickerversionofC695 Paper insulating
TR3 PET 3.0 30 Non- 0.4 0.3 Thermallyconductive insulating transferadhesive– 3mils
TR5 PET 5.0 60 Non- 0.4 0.5 Thermallyconductive
insulating transferadhesive–5mils
1 Adhesion to steel (value after thermosetting); 2 Adhesion to aluminumAll products RoHS compliant
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Thermal Phase Change
ProDuCT ovErvIEWPhaseChangeMaterialschangefromasolidtoaliquid-likematerialatmicroprocessortemperatures,significantlyenhancingthermalperformanceincomputerapplications.ThermaCoolphasechangeproductsprovidehighperformanceheattransferwithoutthemanufacturingorassemblyproblemsassociatedwithmessythermalgreases.Thesephasechangematerialsprovideexcellentthermalcouplingbetweencomputermicropro-cessorsandheatsinks,ensuringhighsystemperformanceinacost-effectiveformat.
•C1095 x01: Athermallyconductivepolymericinterfacematerialdesignedspecificallyforapplicationrequiringathermalinterfacematerial(TIM)thatwillnotcreateanybondlineadhesionbetweenaheatsinkorotherheatdissipatingdeviseandthemetalcasesurfaceofamicroprocessor(MPU)orotherheatgeneratingdevice.
•ThermaCool C1100: familyofhighperformancephasechangingcompoundswhichselfadheretotheheatsinkatroomtemperature.ThisadhesivequalityalsocreatesaconformableinterfacebetweenthesinkandMPUanddramaticallyimprovingheattransfer.
ProDuCTS AND DESCrIPTIoN•C1055 & C1060:Thermallyconductiveproductsdesignedtoexhibitexceptionalviscoelastic(creepandflow)properties.Effectsofviscosityandelasticitydetermineconformability.Minimalforceisrequiredforthismaterialtoflowandachievetotalwet-out.Astemperaturedecreasesthematerialdoesnotstiffen.Themodulusremainsuniformbetween0°Cand130°C.TheseuniqueviscoelasticpropertiesoftheC1055,combinedwiththeinherentlowthermalresistance,insureminimalcontactresistanceandahighlyeffectivepathforheatdissipation.
TYPICAL APPLICATIoNS•Createshighperformancethermalcouplingbetweenflipchiporheatspreadertoheatsink
•Materialscanbeprovidedinanon-bondingformulationtopreventanyadhesionbetweenmicroprocessorandheatsink,whilestillhavingexcellentthermalperformance
•Replacingmessythermalgreaseinrapidmicroelectronicassembly
Product reinforcing Thickness Phase Change Thermal Conductivity Thermal Impedance Name Carrier (mils) Temperature (°C) (W/mK) ASTM E1530 (°C in.2/W) ASTM E1530
CONSTruCTION ThErMAL COMMENTS
C1055 None 3.0 3.5 & 6.0 1.0 0.04 Highperformancephasechange
C1060 Fiberglass 3.5 45 0.7 0.10 Reinforcedversionof C1055
C1095 Polymer 2.5 >50 0.6 0.13 Nostickphasechangefor Film easydisassembly
C1100 None 3.5 & 6.0 37 1.0 0.03 Greaselikeperformance,easytouse
C1100F Aluminum 3.5 & 6.0 40 1.0 0.05 Nostickversionof C1100 Foil
All products RoHS compliant
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Saint-Gobain’s Thermal Test Methods
Saint-Gobain employs two standard thermal conductivity/thermal resistance test methods.
ASTM e1530Oneistheguardedheatflowmetermethod,whichconformstoASTME1530(Diagram1)andismostlyapplicabletosamplesthatrangeinthicknessfrom0.5–25mm.Inthismethodanevenreproduciblepressureisappliedtothetestsamplebypneumaticcylindersthatallowtestpressuresrangingfrom0psi(contact)to300psi.Thesampleisheldbetweentwopolishedmetalsurfaceswheretheupperplateisheatedandthelowerplateischilled,establishingatemperaturegradientthroughthestack.Thelowerplateisalsopartofacalibratedheatfluxtransducer.
ASTM D5470 Theothertestingmethodisforthermaltransmissionpropertiesofthinthermallyconductiveelectricallyinsulating
materials,whichconformstoASTMD5470andisapplicabletosamplesranginginthicknessfrom0.02 – 10mm.Inthismethodanevenreproduciblepressureisappliedtothetestsamplebypneumaticcylindersthatallowtestpressuresrangingfrom0psi(contact)to500psi.Thesampleisheldbetweentwopolished
metalsurfaceswherethelowerplateisheatedandtheupperplateischilled,establishingatemperaturegradientthroughthestackthatismeasuredvia4thermocouples,asdepictedonDiagram2.Thermalimpedancecanbedeterminedbymeasuringthetempera-tureresistanceacrossthesample.
Definitions for Thermal Interface Design
INTErFACE GAP Thegapwhichresultsbetweenthemicroprocessorandtheheatsinkduetothestack-upofflatnessspecificationtolerances.Twonominallyflatsurfaceswillalwaysproduceaninterfacegapwhenplacedtogether.
CoNTACT rESISTANCE Inthermaltransfer,airequalsresistance.Thus,contactresistanceisatheoreticalmeasureofthevolumeofairvoidsalongtheinterfaceofanytwosurfaces.Thesemicroscopicvoidsareformedbysurfaceroughness,surfaceconcavityortheinter-facematerialineffectivelyconformingtoacomponent’ssurface.ThisisillustratedinthemagnifiedsectionofDiagram2.
ThErMAL CoNDuCTIvITY Theabilityofamaterialtoconductheat
aftertheheathasenteredthatmaterial.Thermalconductivityvaluescanbemisleadingwhenusedtoevaluatethermalinterfacematerialssinceactualperformanceisaffectedbythecontactresistancewithboththeheatsinkandthemicroprocessor.ThermalconductivityistypicallyexpressedinunitsofW/m-K.
ThErMAL IMPEDANCE Adefinedparameterwhichiscalculatedbydividingthetemperaturedifferenceacrosstheinterfacebythepoweroutputofthemicroprocessor.Thermalimpedancevaluesarequitevaluableinthermalmanagementdesignsincetheyinherentlyreflecttheimpactofcontactresistancesoninterfaceperformance.Lowthermalresistancesindicateasystemwhichdissipatesheateffectively.Thermalimpedanceistypicallyexpressedinunitsof°C-in2/W.
DIELECTrIC STrENGTh Ameasureofthevoltagerequiredtocauseabreakdownofaspecificthicknessofinterfacematerial.Dielectricstrengthistypicallyexpressedinunitsofvolts/mil.
CoNTACT PrESSurE Thepressurebetweenthemicroprocessorandtheheatsink.Thispressureistypicallygeneratedandmaintainedbytheheatsinkclipswhichattachtoasocket.Contactpressureistypicallymea-suredinpoundspersquareinch(psi).
APPLICATIoN PrESSurE Thepressurerequiredtoattachaninterfacematerialtoaheatsinkortoamicroprocessor.Applicationpressureistypicallymeasuredinpoundspersquareinch(psi).
LOAD LOAD
upper Meter Block
Insulation
heater
upper Plate Tu •
Specimen
Guar
d he
ater
Guar
d he
ater
heat Sink
Lower Plate TM •
Bottom heater TL•
Plate
hFT
T1
T2
T3
T4
Specimen“T” Type Thermo Couple
Lower Meter Block
heating Block
+–
Water in Water outCu Block
ASTM D5470ASTM e1530
DIAGRAM 1 DIAGRAM 2
9
Non Conformable Conductive
Non Conformable Conductive — uncured
Conformable Closed Cell Sponge
Conformable Low hardness
Conformable Medium hardness
very Conformable very Soft
TC100
TC100U
R10404
TC3001
TC3002
TC3005
N/A
Therm-A-Form T646
N/A
Therm-A-Gap
A174/T174/F174
Therm-A-GapA274/T274
Therm-A-GapA574/574
N/A
N/A
N/A
Gap-PadA2000
Gap-Pad1500, 1500R
Gap-PadVOUltraSoft,Gap-Pad 1500
SarconGTR
N/A
N/A
SarconHR,GR-d,GR
SarconHR,GR-d,GR
N/A
Description ThermaCool Chomerics Bergquist Fujipoly
ThErMAL GAP FILLErS
Graphite foil with 1 side PSA
Aluminum foil with 2 side PSA
MT Kapton with 2 side PSA
MT Kapton with 1 side PSA/1 side silicone
Transfer Adhesives
C695
C695
K275
K271
TR3 & TR5
N/A
Thermattach T405, T412
Thermattach T404, T414
ChoTherm 1680
Thermattach T413
N/A
Q-PadII
Bond-Ply 660
Sil-Pad K4, K6
Bond-Ply 100
Description ThermaCool Chomerics Bergquist
ThErMAL TAPES
Low Cost Thermal Fabric
Mid Performance Fabric
high Performance Fabric
TF400
1818, 1877, 1879
TF500
ChoTherm 1674
ChoTherm 1674
ChoTherm 1671, 1678, T500
Sil-Pad 400
Sil-Pad 600
Sil-Pad 800, 900S, A1500
Description ThermaCool Chomerics Bergquist
ThErMAL FABrICS
high Power MPu
high Power MPu with Al Foil one side
reinforced
Non Stick one side
C1055, C1100
C1100F
C1060
C1095-X01
Thermflow T725
ThermflowT766
Thermflow T443
N/A
Hi-Flow225U, 225UT, 625
Hi-Flow225FT, 225FAC
Hi-Flow115-AC, 200G
N/A
T-PCM900, T-PCM-HP105
N/A
N/A
N/A
Description ThermaCool Chomerics Bergquist Fujipoly
ThErMAL PhASE ChANGE
Thermal Management Materials Competitive offsets
AFF-XXXX-0M -0907 -SGCS ©2007 Saint-Gobain Performance Plastics Corporation
Limited Warranty: For a period of 6 months from the date of t sale, Saint-Gobain Performance Plastics Corporation warrants this product(s) to be free from defects in manufacturing. Our only obligation will be to provide replacement product for any portion proving defective, or at our option, to refund the purchase price thereof. User assumes all other risks, if any, including the risk of injury, loss or damage, whether direct or consequential, arising out of the use, misuse, or inability to use this product(s). SAINT-GOBAIN PERFORMANCE PLASTICS DISCLAIMS ANY AND ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
NOTE: Saint-Gobain Performance Plastics Corporation does not assume any responsibility or liability for any advice furnished by it, or for the performance or results of any installation or use of the product(s) or of any al product into which the product(s) may be incorporated by the purchaser and/or user. The pur-chaser and/or user should perform its own tests to determine the suitability and s of the product(s) for the particular purpose desired in any given situation.
Saint-Gobain Performance PlasticsCorporation 14 McCa rey Street Hoosick Falls, New York 12090-0320 www. f.saint-gobain.com
For Customer or Technical Support:(800)962-2666Tel: (518) 686-7301Fax: (800) 526-8479
Saint-Gobain Performance PlasticsCorporation 717 Plantation StreetWorcester, MA 01605Tel: (508) 852-3072Fax: (508) 852-3759www. f.saint-gobain.com
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Ph: (716)[email protected]
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