Vishay Semiconductors
02-02 1www.vishay.comDocument Number 80103
The Constituents of Semiconductor ComponentsResponsible electronic component and equipmentmanufacturers are already preparing for the time whenthe lifespan of their products comes to an end by scru-tinizing the materials incorporated and their futurerecylcability. Recycling laws have already come intoforce in Germany (“Kreislauf-Wirtschaftsgesetz”) andguidelines for electronic scrap are in preparation.
The aim is a suitable waste disposal program and �as a preventative measure � a reduction in the con-tent of hazardous damaging materials in suchcomponents. In order to conform to this procedure, de-tailed information about the materials and theirquantities is needed.
This overview answers questions put forward bycustomers as to the constituents and their function inthe most important of Vishay Semiconductors’ssemiconductor products. Special significance is givento so-called “Hazardous Substances”. It demonstratesthat Vishay Semiconductors products under normaloperating conditions do not expose the applier orenvironment to any hazard. However, most productsnevertheless contain small but necessary quantities of“Hazardous Substances” which can � if not treatedcorrectly or through accidents � be released on asmall scale into the environment.
The present information was produced with thegreatest possible care. Any suggestions forimprovement of this brochure are welcome.
DefinitionsVishay Semiconductors offers a wide range of semi-conductor components including transistors, diodesand opto-electronic components. These have beenmanufactured in various standard packages.
On the following pages, these packages are listedtogether with their materials shown in weightpercentages. In order to limit the number of tables, allcomponents whose structure and composition are thesame have been compiled in families. In many cases,different lead frames together with chips of differentsizes may be used for the one package. This usuallymeans that there may be slight differences in thequantities of the declared material. The weight percentis, however, valid for a representative sample of therelevant family. In order to sensibly reduce the numberand quantities of materials contained in the respectivecomponents, quantities smaller than 0.1% by weighthave been stated in the following list as traces . Thisis the case unless lower limits are forced by law, e.g.,cadmium < 75 ppm and PCDD as well as PCDF(known as dioxin) < 2 ppb. In the lists themselves,
details of content and composition are separated intothe individual parts of the semiconductor component.The most important of these are:
Active element: The active element is either a siliconchip or for optoelectronic components a chipcontaining combinations of Ga (Al) (As, P). These aredoped with very small amounts of boron, arsenic,phosphorus, zinc and germanium etc. Themetallisation consists of thin layers of aluminium, goldor titanium. The chips are generally bonded to the leadframe with a silver epoxy and have gold or aluminiumwires bonded to the lead frame.Lead frame: For electrical connection, a metal leadframe made from alloys such as FeNi (42) or CuFe (2)and partly or totally plated with silver is commonlyused. The metal alloys contain traces of silver, zincand phosphorus. Part of the lead frame is also coatedwith tin/ lead.Case: The semiconductor chip is protected from theenvironment by a case of glass, plastic or metal.The glass is composed of oxides of silicon and leadtogether with boron and aluminium.Plastic cases are composed of an epoxy resin filledwith up to 70% by weight of quartz particles. Antimonytrioxide and brominated epoxy resin (no TBA) areadded as flame retardents. Antimony and bromineamount to about 1.6 and 1.0% respectively.In use: In use, it is the content of hazardoussubstances which is of importance. In Germany, thereare a series of lists which give the materials which arepotentially hazardous to people and the environment,for example:Appendix II and IV of the “Hazardous MaterialsRegulations”, the TRGS 900 (“MAK-Wert-Liste”) andthe “Catalog of Materials Hazardous to the WaterSupply”. These lists, however, are only partiallyconsistent.The names used are often different for materials withthe same chemical composition. Furthermore, the useof trivial and trade names often adds to the confusion.Vishay Semiconductors therefore for theirdescriptions use that proposed by the ZentralverbandElektrotechnik und Elektronikindustrie e.V. (ZVEI;Central Association of Electrical Engineering andElectronic Industry) for the harmonization of thenomenclature of hazardous substances.Statements are made on the safety precautions to beused during storage and disposal by mechanical,chemical and thermal means of the more importantchemicals (so-called “Leitchemikalien”). These arelisted in the tables in the order of their potential risk.
Vishay Semiconductors
02-02 2www.vishay.comDocument Number 80103
Their effect upon people and the environment are alsolisted and any special precautions emphasized.Notes: The following information has been prepared
to be as exact and reliable as possible.The manufacture of semiconductorcomponents is, however, subject to regularchange without special notification.The publication of this brochure excludes anyresponsibility resulting from its use.
Explanation of Abbreviations 1While the information on weight percent is believedcorrect, discrepancies depending upon componenttype may be possible.1) Material information etc. Material listed as
“Material Hazardous in Production”2) S: Trace material < 0.1% by weight;
Cd < 75 ppm; concerning Cd see ***)
PCDD and PCDF < 2 ppb*) Dioxin content – lies below agreed limits**) No. 85 “Rules for Hazardous Materials”, to be
replaced as soon as a technically suitablealternative material is available
***) Traces of cadmium can only be found in leadframes made of copper
CMT: Material containing carcinogens, mutagens orterratogens
Tox: Material is toxic or very toxicS Material with allergy producing characteristicsHAL Halogen containing materialWKG Material hazardous to the water supplyL Storage, suitable for disposalD DisposableM Mechanical disposalN Chemical disposalT Thermal disposalH Handling
Ozone Depleting Substances 2The use of Ozone Depleting Substances has been to-tally eliminated by Vishay Semiconductors and bydoing so meets the legal requirements as defined inthe following documents.
1. The “Montreal Protocol” together with the “LondonAmendments” Appendix A, B, and the “List ofTransitional Substances”
2. “Clean Air Act”, Amendments 1990, “Environmen-tal Protection Agency” (EPA), USA, Class I and II– Ozone Depleting Substances
3. “European Council Resolution” number88/540/EEC and 91/690/eec Appendix A, B and C(Transitional Substances)
Vishay Semiconductors guarantees that its compo-nents do not contain and are manufactured without theuse of Ozone Depleting Substances.
Vishay Semiconductors
02-02 3www.vishay.comDocument Number 80103
The Constituents of Package FormsPackage form 1:
Total weight 30 mg
Epoxy resin (10.0%)50% resin50% hardener
Reflector (47.8%)66.7%amodel33.3%glass fibre
Lead frame (42.0%)95% copper2% iron2% Silver1% SnPbTraces of Ni, Zn, P, Cd***)
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
LED chip (< 0.1%)50% gallium50% arsenic and
phosphorusTraces of Al, Au, Zn, Ge, In, Ti
IR chip (0.17%)50% gallium50% arsenic Traces of Al, Au, Zn, Ge, Ti
Detector chip (0.2%)99% siliconTraces of Ag, Al, Au, Sb, Ti,SiO2
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 2:
Total weight 84 mg
Mold (38%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (55%)94% copper2% iron2% tin2% silverTraces of Ni, Zn, P, Cd***)
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Detector chip (7%)99% siliconTraces of Ag, Al, Ni, Ti, V
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Halide compounds � � � Mold 0.6 � � �
2 Antimony and -compounds � � Mold 1.0 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 4www.vishay.comDocument Number 80103
Package form 3:
Total weight 200 mg
Epoxy resin (58%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (39%)96% copper2% iron2% silverTraces of Ni, Zn, P, Cd***)
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Detector chip(2.9%)99% siliconTraces ofAg, Al, Ni, Ti, V
Silver epoxy (<0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 4:
Total weight 219 mg
Epoxy resin (58%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (39%)96% copper2% iron2% silverTraces of Ni, Zn, P, Cd***)
Detector chip(2.9%)99% siliconTraces ofAg, Al, Ni, Ti, V
Silver epoxy (<0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 5www.vishay.comDocument Number 80103
Package form 5:
Total weight 193 mg
Epoxy resin (46%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (51%)96% copper2% iron2% silverTraces of Ni, Zn, P, Cd***)
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Detector chip(2.9%)99% siliconTraces ofAg, Al, Ni, Ti, V
Silver epoxy (<0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 6:
Total weight 159 mg
Epoxy resin (40%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (60%)92% copper2% iron2% silver4% SnPbTraces of Ni, Zn, P, Cd***)
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Detector chip (< 0.1%)99% siliconTraces of Ag, Al, Au, Sb, Ti, SiO2
Capacitor (< 0.1%)98% alumnium trioxideTraces of Ag, Pd, Ni
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 6www.vishay.comDocument Number 80103
Package form 7:
Total weight 130 mg
Epoxy resin (55.0%)50% resin50% hardener
Lead frame (44.7%)96% copper2% iron2% silverTraces of Ni, Ag, Zn, P, Cd ***)
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
IR chip (< 0.1%)50.0%gallium50.0%arsenicTraces of Al, Au, Zn, Ge, Ti
Detector chip (< 0.1%)99.9%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2
Bond wire (< 0.1%)99.99% goldTraces of BE, Mg
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 8:
Total weight (5 mm) 310 mg
Epoxy resin (58%)50% resin50% hardener
Lead frame (42 %)93% iron2% copper2% silver3% SnPbTraces ofNi, Zn, P, Cd ***)
Silver epoxy (< 0.1%)80% silver10% resin10% hardener
LED chip (< 0.1%)50% gallium50% arsenic and
phosphorusTraces of Al, Au, Zn, Ge, In, Ti
IR chip (0.1%)50% gallium50% arsenic Traces of Al, Au, Zn, Ge, Ti
Bond wire (< 0.1%)99.99% goldTraces of BE, Mg
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 7www.vishay.comDocument Number 80103
Package form 9:
Total weight (5mm) 310 mg
Epoxy resin (50%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (50%)96% copper2% iron2% silverTraces of Ni, Zn, P, Cd***)
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Detector chip (<0.1%)99% siliconTraces ofAg, Al, Ni, Ti, V
Silver epoxy (<0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 10:
Total weight (3mm)132 mg
Epoxy resin (25%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (75%)96% copper2% iron2% silverTraces of Ni, Zn, P, Cd***)
Detector chip (< 0.1%)99% siliconTraces ofAg, Al, Au, Sb, Ti, SiO2
Silver epoxy (<0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 8www.vishay.comDocument Number 80103
Package form 11:
Total weight (3mm) 130 mg
Epoxy resin (30%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (70%)90% iron4% copper2% silver4% SnPbTraces ofNi, Zn, P, Cd***)
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
LED chip (< 0.1%)50% gallium50% arsenic and
phosphorusTraces of Al, Au, Zn, Ge, In, Ti
IR chip (0.1%)50% gallium50% arsenic Traces of Al, Au, Zn, Ge, Ti
Detector chip (< 0.1%)99% siliconTraces ofAg, Al, Au, Sb, Ti, SiO2
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 12:
Total weight 345 mg
Header & cap(99.9%)37.5%iron20.5%nickel12.5%cobalt29.0%glas0.5% goldTraces of K, P
Silver epoxy (< 0.1%)80.0%silver10.0%resin10.0%hardenerTraces of Cl, Na, K
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
IR chip (<0.1%)50% gallium50% arsenic Traces of Al, Au, Zn, Ge, Ti
Photo trans. chip (<0.1%)99.0%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2
Photo diode chip (<0.1%)99.0%siliconTraces of Ag, Al, Ni, Ti, V
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 9www.vishay.comDocument Number 80103
Package form 13:
Total weight 850 mg
Header & cap(99.9%)37.5%iron20.5%nickel12.5%cobalt29.0%glas0.5% goldTraces of K, P
Silver epoxy (< 0.1%)80.0%silver10.0%resin10.0%hardenerTraces of Cl, Na, K
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Photo diode chip (<0.1%)99.0%siliconTraces of Ag, Al, Ni, Ti, V
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 14:
Case Weight/ mg
7 mm 70010 mm 115013 mm 2090
Epoxy resin (42.9%)44.0%resin48.0%hardener8.0% diffuser
Reflector (39.8%)73.0%Pocan27.0%TiO2
Lead frame (17.3%)98.8%copper1.2% ironTraces ofNi, Ag, Zn, Cd ***)
LED chip (< 0.1%)50.0%gallium50.0%arsenic and
phosphorusTraces of Al, Au, Zn, Ge, In, Ti
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Silver epoxy (<0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Arsenic � � � Chip Traces � � �
2 Epoxy resin Mold 43.0 �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 10www.vishay.comDocument Number 80103
Package form 15:
Total weight 1060 mg
Epoxy resin (55.0%)55.5%resin44.5%hardener
Lead frame (43.7%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)
Capacitor (< 0.1%)98.0%aluminium
trioxideTraces of Ag, Pd, Ni
Resistor (< 0.1%)99.0%aluminium
trioxideTraces of Ag, Pd, Ni
Photo diode (< 0.1%)99.0%siliconTraces of As, Al, Ni. Ti,V
IC chip (< 0.1%)99.0%siliconTraces of SiO2, Al,Al3N4
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Epoxy resin Mold 54.5 �
Package form 16:
Total weight 485 mg
Epoxy resin (63.3%)55.5%resin44.5%hardener
Lead frame (36.3%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P,SN, PB, Cd ***)
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Photo diode (< 0.1%)99.0%siliconTraces ofAS, Al, Ni, Ti, V
IC chip (< 0.1%)99.0%siliconTraces of SiO2, Al,Al3N4
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Epoxy resin Mold 54.5 �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 11www.vishay.comDocument Number 80103
Package form 17:
Total weight 503 mg
Mold (62.0%)71.4%SiO226.0%epoxy resin1.6% Sb (as antimony
trioxide) **)
1.0% bromine(no TBA) *)
Traces of N, Fe, C, Cl
Lead frame (27.5%)98.0%copper2.0% ironTraces of Ni, Ag, Zn, P, Cd ***)
Solder plating (0.4%)85.0%tin15.0%lead
Reflector (7.6%)100.0% pocan
Epoxy resin (2.4%)50.0%resin50.0%hardener
Emitter chip (0.1%)50.0%gallium50.0%arsenicTraces ofAl, Au, Zn, Ge, In, Ti
Detector chip (< 0.1%)99.0%siliconTraces ofAg, Al, Au, Sb, Ti, SiO2
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Halide compounds � � � Mold 0.6 � � �
2 Antimony and -compounds � � Mold 1.0 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 12www.vishay.comDocument Number 80103
Package form 18:
Type Weight/ mg
DIP4 250DIP8 550DIP16 1100
13946
Mold (64.5%)27.0%SiO236.0%epoxy resin30.0%TiO23.0% Al (OH)32.5% antimony **)
1.5% Br (no TBA) *)
Traces of N, Fe, C, Cl
Lead frame (29.0%)98.0%copper2.0% ironTraces of Ni, Ag, Zn, P, Cd ***)
Emitter chip (< 0.1%)50.0%gallium50.0%arsenicTraces ofAl, Au, Ge, Si3N4
Detector chip (< 0.1%)99.0%siliconTraces of Al, SiO2,Al3N4
Solder plating (0.4%)80.0%tin20.0%lead
Silicon (6.1%)90.9%resin9.1% hardener
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Halide compounds � � � Mold 2.2 � � �
2 Antimony and -compounds � � Mold 1.6 � � �
Package form 19:
Type Weight/ mg
CNY64 730CNY65 1400CNY66 1700
9510536
Epoxy resin (56.0%)50.0%resin49.5%hardener0.5% Br (no TBA) *)
Case (25.0%)70.0%Crastin30.0%SiO2
Bushing (7.0%)73.0%Lexan30.0%TiO2
Lead frame (12.0%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P,Cd ***)
Detector chip (< 0.1%)99.0%siliconTraces of SiO2, Al,Al3N4
Emitter chip (< 0.1%)50.0%gallium50.0%arsenicTraces of Al, Au, Si3N4
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Halide compounds � � � Mold 0.3 � � �
2 Arsenic � � � Chip Traces � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 13www.vishay.comDocument Number 80103
Package form 20:
Type Weight/ m g
TCSS1100/TCST1000/TCST1x0x 800TCSS2100/TCST2000/TCST2x0x 900TCST1030 250TCST1230 280TCST5123TCST1210
� IR emitting diode
Epoxy resin (55.0%)55.5%resin45.5%hardener
Lead frame (44.7%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)
Emitter chip (< 0.1%)50.0%gallium50.0%arsenic and
phosphorusTraces of Al, Au, Zn, Ge, Si3N4
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Bond wire (< 0.1%)99.99% gold
� IR photodetector
Epoxy resin (54.0%)55.5%resin45.5%hardener
Lead frame (45.7%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)
Detector chip (< 0.1%)50.0%siliconTraces of SiO2, Al,Al3N4
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Bond wire (< 0.1%)99.99% gold
� Housing 100% Polycarbonate
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Arsenic � � � Chip Traces � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 14www.vishay.comDocument Number 80103
Package form 21:
Total weight 150 mg
94 9318
Epoxy resin (31.1%)47.0%resin50.0%hardener3.0% filter color
Mold (20.1%)70.0%PBTP30.0%glas fiber
Lead frame (48.8%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)
Bond wire (< 0.1%)99.99% gold
Emitter chip (< 0.1%)50.0%gallium50.0%arsenic and
phosphorusTraces of Al, Au, Zn, Ge, Si3N4
Detector chip (< 0.1%)99.0%siliconTraces of Al, SiO2,Si3N4
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Arsenic � � � Chip Traces � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 15www.vishay.comDocument Number 80103
Package form 22:
Total weight 230 mg
94 9442
� Housing 100% Polycarbonate� IR emitting diodeEpoxy resin (34.5%)50.0% resin50.0% hardenerTraces of N, Fe, C, ClLead frame (65.2%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)
IR emitting diode(0.2%)50.0%gallium50.0%arsenic and
phosphorusTraces of Al, Au, Zn, Ge, Si3N4
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
� IR photodetectorEpoxy resin (29%)50.0%resin50.0%hardenerTraces of Fe, C, ClLead frame (70.7%)89.0%iron4.1% copper2.4% silver4.5% SnPbTraces of Ni, Zn, PBond wire (< 0.1%)99.99% goldTraces of Be, MgIR Photodetector (<0.1%)99.0%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2
Silver epoxy (< 0.1%)80.0%silver10.0%resin10.0%hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Arsenic � � � Chip Traces � � �
2 Lead and -compounds � � Lead frame 0.4 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 16www.vishay.comDocument Number 80103
Package form 23:
12776
Epoxy resin (40%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (39%)79% copper17% Ni4% AuTraces of Ag, Fe, Co, Zu, Su, Al
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Detector chip (17%)99% siliconTraces ofAg, Al, Ni, Ti, V
Silver epoxy (<0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Fibreglas (21%)63% oxygen19% silicon8% calcium6% aluminum4% carbon
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 17www.vishay.comDocument Number 80103
Package form 24:
TCYS6201Total weight 2700 mg
TCYS5201Total weight 1100 mg
95 10755
95 10756
� Housing 100% Polycarbonate
� Connector (10%)40% polyamid59% copper1% SnPb (60/40)� IR emitting diodeEpoxy resin (34.5%)50.0% resin50.0% hardenerTraces of N, Fe, C, ClLead frame (65.2%)98.8% copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)
IR emitting diode(0.2%)50.0%gallium50.0%arsenic and
phosphorusTraces of Al, Au, Zn, Ge, Si3N4
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
PWB (20%)53.9% glass41% Epoxy resin
(50% hardener50% resin)
5.1% copper>0.1% PVC (Solder Resist)_� IR photodetectorEpoxy resin (29%)50.0% resin50.0% hardenerTraces of Fe, C, ClLead frame (70.7%)89.0%iron4.1% copper2.4% silver4.5% SnPbTraces of Ni, Zn, PBond wire (< 0.1%)99.99% goldTraces of Be, MgIR Photodetector (<0.1%)99.0%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2
Silver epoxy (< 0.1%)80.0%silver10.0%resin10.0%hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Arsenic � � � Chip Traces � � �
2 Lead and -compounds � � Lead frame 0.4 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 18www.vishay.comDocument Number 80103
Package form 25:
CNY70Total weight 700 mg
94 9320
� Housing 100% Polycarbonate� IR emitting diodeEpoxy resin (34.5%)50.0% resin50.0% hardenerTraces of N, Fe, C, ClLead frame (65.2%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)
IR emitting diode(0.2%)50.0%gallium50.0%arsenic and
phosphorusTraces of Al, Au, Zn, Ge, Si3N4
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
� IR photodetectorEpoxy resin (29%)50.0%resin50.0%hardenerTraces of Fe, C, ClLead frame (70.7%)89.0%iron4.1% copper2.4% silver4.5% SnPbTraces of Ni, Zn, PBond wire (< 0.1%)99.99% goldTraces of Be, MgIR Photodetector (<0.1%)99.0%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2
Silver epoxy (< 0.1%)80.0%silver10.0%resin10.0%hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Arsenic � � � Chip Traces � � �
2 Lead and -compounds � � Lead frame 0.4 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 19www.vishay.comDocument Number 80103
Package form 26:
TCUT1200Total weight 150 mg
TCPT1200Total weight 150 mg
1484814849
Molding Compound(77.6%)71.4% SiO226% Epoxy resin1.6% Sb (as antimony trixide)Traces of N,Fe,C,CI ***)
Lead frame (65.2%)58% copper42% nickelTraces of Ag, Zn, P, Cd ***)
Emitter – Chip(<0.1%)50.0%gallium50.0%arsenic and
phosphorusTraces of Al, Au, Zn, Ge, Si3N4
Bond wire (< 0.1%)99.99% goldDetector–Chip (< 0.1%)99.0%siliconTraces of Al, Al3, N4, SiO2
Silver epoxy (< 0.1%)78.0%silver11.0%resin11.0%hardener
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Halide compounds � � � Mold 0.6 � � �
2 Antimony and -compounds � � Mold 1.0 � � �
Package form 27:
Total weight 100 mg
94 8639
Epoxy resin (25%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (75%)96% copper2% iron2% silverTraces of Ni, Zn, P, Cd***)
Detector chip (< 0.1%)99% siliconTraces ofAg, Al, Au, Sb, Ti, SiO2
Silver epoxy (<0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 20www.vishay.comDocument Number 80103
Package form 28:
Total weight 350 mg
94 8390
Epoxy resin (30%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (70%)90% iron4% copper2% silver4% SnPbTraces ofNi, Zn, P, Cd***)
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
LED chip (< 0.1%)50% gallium50% arsenic and
phosphorusTraces of Al, Au, Zn, Ge, In, Ti
IR chip (0.1%)50% gallium50% arsenic Traces of Al, Au, Zn, Ge, Ti
Detector chip (< 0.1%)99% siliconTraces ofAg, Al, Au, Sb, Ti, SiO2
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 29:
Total weight 16.5 mg
15 969
15 970
Epoxy resin (55.0%)50% resin50% hardener
Lead frame (44.7%)96% copper2% iron2% silverTraces of Ni, Ag, Zn, P, Cd ***)
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
IR chip (< 0.1%)50.0%gallium50.0%arsenicTraces of Al, Au, Zn, Ge, Ti
Detector chip (< 0.1%)99.9%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2
Bond wire (< 0.1%)99.99% goldTraces of BE, Mg
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 21www.vishay.comDocument Number 80103
Package form 30:
Total weight 400 mg
12785
Epoxy resin (50%)50% resin50% hardenerTraces of Fe, C, Cl
Lead frame (50%)96% copper2% iron2% silverTraces of Ni, Zn, P, Cd***)
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Detector chip (<0.1%)99% siliconTraces ofAg, Al, Ni, Ti, V
Silver epoxy (<0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 31:
Total weight 120 mg
94 8673
Epoxy resin (55.0%)55.5%resin44.5%hardener
Lead frame (43.7%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)
Photo diode chip (< 0.1%)99.0%siliconTraces of As, Al, Ni, Ti, V
IR chip (< 0.1%)50% galium50% arsenicTraces of Al, Au,Zn,Ge,Ti
Bond wire (< 0.1%)99.99% goldTraces of Be, Mg
Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Epoxy resin Mold 54.5 �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 22www.vishay.comDocument Number 80103
Package form 32:
Total weight 102 mg
Epoxy molding compound (74%)
Lead frame (26%)98.8%copper1.2% FeTraces ofNi, Ag, Zn, P, Cd***)
Emitter ( 0.001%)50.0% Ga50.0% Al + AsTraces of Au
Bond wire (< 0.1%)99.99% gold
Conductive Epoxy (< 0.1%)78.0% silver22.0% epoxy
IC chip (0.02%)99.0% siliconTraces of Al, Si3N4, SiO2
Detector chip ( 0.01%)99% siliconTraces ofAl, Si3N4, SiO2
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 33: TFDU4xxx, TFDU5xxx, TFDU6xxx Baby Face (Universal)
Total weight 203 mg
Epoxy molding compound (73.5%)
Lead frame (26.4%)98.8%copper1.2% FeTraces ofNi, Ag, Zn, P, Cd***)
Emitter chip ( 0.001%)54.0% As43.0% Ga3.0% AlTraces of Au
Bond wire (< 0.1%)99.99% gold
Conductive Epoxy (< 0.1%)78.0% silver22.0% epoxy
IC chip (0.02%)99.0% siliconTraces of Al, Si3N4, SiO2
Detector chip ( 0.01%)99% siliconTraces ofAl, Si3N4, SiO2
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 23www.vishay.comDocument Number 80103
Package form 34: TFDT4xxx, TFDT5xxx, TFDT6xxx
Top View
Total weight 390 mg
Epoxy moldingcompound (73.5%)
Lead frame (26.4%)98.8%copper1.2% FeTraces ofNi, Ag, Zn, P, Cd***)
Emitter chip ( 0.001%)54.0% As43.0% Ga3.0% AlTraces of Au
Bond wire (< 0.1%)99.99% gold
Conductive Epoxy (< 0.1%)78.0% silver22.0% epoxy
IC chip (0.02%)99.0% siliconTraces of Al, Si3N4, SiO2
Detector chip ( 0.01%)99% siliconTraces ofAl, Si3N4, SiO2
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 35: TFDS4xxx, TFDS5xxx, TFDS6xxx Side View
Total weight 390 mg
Epoxy molding compound (73.5%)
Lead frame (26.4%)98.8%copper1.2% FeTraces ofNi, Ag, Zn, P, Cd***)
Emitter chip ( 0.001%)54.0% As43.0% Ga3.0% AlTraces of Au
Bond wire (< 0.1%)99.99% gold
Conductive Epoxy (< 0.1%)78.0% silver22.0% epoxy
IC chip (0.02%)99.0% siliconTraces of Al, Si3N4, SiO2
Detector chip ( 0.01%)99% siliconTraces ofAl, Si3N4, SiO2
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
Vishay Semiconductors
02-02 24www.vishay.comDocument Number 80103
Package form 36:
Total weight 224 mg
TFDS–Dracula Side View
Epoxy moldingcompound (73.5%)
Lead frame (26.4%)98.8%copper1.2% FeTraces ofNi, Ag, Zn, P, Cd***)
Emitter chip ( 0.001%)54.0% As43.0% Ga3.0% AlTraces of Au
Bond wire (< 0.1%)99.99% gold
Conductive Epoxy (< 0.1%)78.0% silver22.0% epoxy
IC chip (0.02%)99.0% siliconTraces of Al, Si3N4, SiO2
Detector chip ( 0.01%)99% siliconTraces ofAl, Si3N4, SiO2
Significant Materials for Disposal
No. Material and/or Group 1)CMT
TOX S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Lead and lead compounds � � Lead plating 0.1 � � �
Package form 37:
Total weight 150 mg
TOIM3000, TOIM3232 SO16 Package
Epoxy moldingcompound (55.0%)72.0% SiO225.5% epoxy resin1.5% Sb (as anti-mony trioxide) **)
1.0% Br (no TBA) *)
Lead frame (40.1%)98.8%copper2.0% ironTraces ofPb, Sn, Cd***)
Tin plating (0.2%)20.0% lead80.0% tin
Silver epoxy (1.4%)70.0% silver30.0% epoxy resin
Silicon chip ( 3.2%)99% silicon0.7% SiO2, Si3N40.3% aluminiumTraces ofAs, B, P, Ti
Bond wire (<0.1%)99.99% gold
Significant Materials for Disposal
No. Material and/or Group 1)CMT T S
HAL
WGK
Available in the CompoundUsed for
Part in 2)
WeightPercent L D M N T H
1 Antimony and –compounds � � Mold 0.8 � � �
2 Orgo–bromide compounds � � � Mold 0.55 � � �
Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2