Download - Tft Product Presentation June 2009
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Thin Film Technology-ForewordThank you for your interest in Thin Film Technology. This CD contains our 2009 Catalog, New Product data sheets for your reference, as well as a Power Point presentation on TFT’s products and capabilities. The presentation focuses on four of our newer products:
• Passive Equalizers
•High Speed Bessel Filters
•20 Ghz and 10Ghz Crossover SMT/BGA Devices (1208 size)
•High Power Chip Resistors
All of these parts are currently in production and samples are available upon request.
Sincerely,
Michael R. Walsh
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TFT Product Portfolio
TFT Development Engineering
Updated April 15, 2009
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Contents: About TFT
TFT’s Products: Equalizer High Order, Absorptive, Low Pass Filter 20 Ghz Crossover chip Power Resistor
Closing.
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“The Art of Combination”…the essence of thin film technology.
CoreTechnology
EngineeringSkill Sets
PackagingInnovation
Unique “Niche” ProductsTo serve the high speed world
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Design
Simulation
Components Package and footprint
optimization BGA, Wirebond
Process Proto to Mass Production
Validation Testing CMM’s and Measurement
TFT Capabilities:
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TFT Capabilities - Design: Custom Design Capabilities:
Design flow for customizing filters to customer requirements:
Filter ConceptStart with ADSFilter Design
Guide
Add EnhancementElements in ADSCircuit Schematic
Translate CircuitDesign to ADS
Momentum Layout
ArrangeComponents to fit
into Package
Run MomentumOptimization
Verify FinalElectrical and
Physical ResultsCreate Mask Sets
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About Thin Film Technology (TFT): Thin Film Technology Corporation (TFT) is an electronic
component manufacturer servicing: High Speed Digital Communications
ATE, Test, & Measurement Power Management
Computing Automotive Markets
Medical Defence
TFT utilizes thin film processes for the design and manufacture of high performance passive electrical components ranging from:
Signal Integrity Solutions Power Management
Compensation and Matching Networks High Precision High Stability Resistive Products
TFT provides high performance service for your design support including fast turn custom prototypes to full production capacity start to finish. We can conceptualize, synthesize, and realize FAST!
TFT simulates, designs, & manufactures signal integrity solutions from its ISO-registered facility making shipments worldwide.
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ADS Simulation Capability:
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E-M Simulation:
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Design Capabilities: Mechanical & Thermal Simulation Capability
• Cosmos/Works (EMS) • Cosmos/DesignStar
• Cosmos - Thermal
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TFT Capabilities – Test Verification:Simulation Correlation
to Physical Demo
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TFT Passive Equalizers
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Equalizer Product:ATE Internal
Equalizer (Custom)
1810 Chip Dimension Absorptive, High Order 50Ω Impedance Matched Thin Film Construction on
a Alumina Carrier
0603 Chip Dimension 0402 Foot Print Thin Film Construction
on a Alumina Carrier Face Down Mounted for
High Speed Signal Integrity
0603 Single-Ended Chip Equalizer
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Equalization in the Freq. Domain:
Goal of Passive Equalization: Flatten the loss through
the working bandwidth. Extend the bandwidth
performance.
50cm Stripline Example: -3dB Bandwidth Extension:
4.5 GHz (2.73 GHz to 7.25 GHz)
Fund. Freq. “Normalized” Loss: Trace & Pogo Loss + Internal EQ
- 4.4 dB Resultant f-Domain Function
- 2.2 dB
Passive Equalization:
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THE CHALLENGE IS NOT THAT THERE IS LOSS, IS THAT THE LOSS IS FREQUENCY DEPENDENT!!!
Effects of Loss in Time/Frequency:
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Simulation Results:
Frequency Domain:5.5GHz Bandwidth Extension Jitter Reduction = 10.6ps = 63% (16.8 – 6.2ps)
Measured Results:
No Equalizers(Integrated EQ & Test Fixture EQ)
ATE Integrated EQ onlyJitter Reduction = 8.9ps = 35.7% (24.9 – 16.0ps)
Int. EQ & Test Fixture EQ
Tests Results: ATE to Test Fixture End
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Equalizer Market Linear Amp.: Product Explanation:
Equalizer Application for: Driver/Amplifier Gain flattening.
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Equalizer Market - UWB:
Equalization – Channel tilt – the wider the channel the greater the attenuation tilt between high and low frequencies in the channel. To correct the tilt distortion, equalization can be performed in the receiver or reverse tilt pre-distortion can be done in the transmitter.
Time
200ns 202ns 204ns 206ns 208ns 210ns 212ns 214ns 216ns 218ns 220nsV(N136445) V(N150485)
-10mV
0V
10mV
20mV
30mV
40mV
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TFT Bessel Filters
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High Order Absorptive Low Pass Filters:• Simulation Service + Filter Production Capability
• Frequencies up to 25 GHz
• 50Ω Impedance Matched (Absorptive)
• 20ps Group Delay Ripple Thru Passband
• Multiple Filter Orders (7th & 9th Order Capability)
• Footprint + Package Characterized
• BGA Packages
• Wire Bondable Filter Packages
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Electro-Optical Filter Market
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Duo Binary Application Requires TFT’s Filter:
Driver Output
Signal on the Fiber
Filter Output (Duo Binary)
9th order absorptive filter produce dual binary signal to be injected into the laser modulator.
Filters exhibit flat group delay and –15 dB return loss well beyond the cutoff frequency.
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Receiver Sensitivity Applications:
• Signal is converted from optical back to electrical.
The combination of the photodiode and Trans-impedance amplifier convert optical power to current to voltage.
TIA bandwidth, noise, group delay (eye quality) are critically influenced by the equivalent circuit of the input photodiode (laser).
Using high order low pass filter can recover some of the “damaged” eye pattern.
TFT Filter
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TFT Custom Passive Filters
TFT has the capability for fast turn arounds, from conception to production. The following is an example of a custom requirement for a diplexer. The only information supplied were the frequencies.
From the customer: We have a new project beginning that needs a highpass/lowpass duplexer to split 1230 MHz (lowpass) and 1570 MHz (highpass). I would prefer this to be done with RC/RCL circuits, but we might also consider LTCC as an option. We do not have a solution to combine the 2 bands at this moment so a solution from you would be very good
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TFT Custom Filter Capabilities - TFT Response to requirement
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TFT Custom Filter Capabilities - Diplexer Simulations
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TFT Custom Filter Capabilities - DiplexerNRE
TFT approaches NRE’s with a multi-phase approach which targets important stages in the filter design. At these critical stages the customer can elect to discontinue, or proceed with the NRE based on TFT’s findings. The targeted critical stages usually consist of size, specifications, and/or cost.
In the Diplexer example size is the issue with a 1206 size SMT BGA as the target. The following is a breakdown of how the design/NRE stages have or will be scheduled.
• Customer supplies design requirement
•TFT performs initial simulations to determine feasibility. No cost
•TFT supplies initial simulations and proposal to customer which produces targets specs.
•Phase one - Mask and Layout based on proposed specs to determine package size <$1K
•Phase two - Initial lot run w/ 4 designs to determine optimum performance. $1.2K
•Phase Three - 20 deliverable filters, Test Module, and finalization of specs. $1.3K
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TFT 10 Ghz & 20 GhzCrossover Chip
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TFT High frequency Crossover Chip
The 20 Ghz crossover Chip was designed as a result of a customers idea for a needed product not currently available. Highest bandwidth available was a 7Ghz device
In order to address cost/performance issues we also developed a 10Ghz crossover chip;
Initial Customer Request
Features and Advantages:This high frequency crossover device is a surface mount component that provides excellent signal integrity characteristics beyond 20 GHz to be achieved while allowing circuit routing transitions with traditional BGA manufacturing techniques on single layer board layouts that normally require significantly more expensive multi-layer RF
and microwave PCB manufacturing or RF cabling assemblies.
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TFT 20 Ghz Crossover Chip
Customer request for a 20GHz plus performance jumper to allow for HF routing on 40 Gbps optical circuits.
This is important because the complexity of the circuit does not require multilayer PCB. Plus, Multilayer circuits boards could cost several thousands of dollars extra. It seems just one or two crossovers could facilitate difficult circuit layouts without the multilayer costs and problems.
History
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20 Ghz Cross Over Chip
• 2dB Max Ins. Loss
•10dB Min Ret. Loss
•20dB min. Isol
•1208 Package
•RoHS compliant
•50 Ohm impedance
•Exceeds 20 Ghz
•Minimizes Layout
•Reduces Design time
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Crossover Chip – Schematic, O.D., & Land Pattern
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Crossover Chip – Specifications & S-Parameters
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10 Ghz Crossover Chip
• <1dB Max Ins. Loss
•12dB Min Ret. Loss
•30dB min. Isol
•1208 Package
•RoHS compliant
•50 Ohm impedance
•Exceeds 20 Ghz
•Minimizes Layout
•Reduces Design time
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10 Ghz O.D & Land Pattern
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10 Ghz S-Parameters
Insertion Loss Return Loss Isolation (Crosstalk)
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TFT High Power Chip Resistors
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Power Resistor Product: DC 2512 Pkg. Component:
E-12 CP 2512 Series. 2512 RF Termination Power Resistors.
1206, 1W Package Component: Market study shows that the market is requesting RF
Power Resistors in smaller packages.
Wireless Communication RF Termination Component: 10 Watt to 200 Watt RF component series
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Power Resistor Market: Power Management Market.
Power Amplifiers Isolators/Circulators
RF Isolators Applications
Medical High Precision Amplifiers Power Supplies for Medical Equipment
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TFT Power Products
For more detailed information on TFT’s DC and RF Power Resistors request or reference our Power Products CD.
CFA1206 - 1-3watts RF in a 1206 packageCPA2512 - 10 watts RF plus in a 2512 packageCPA2512 - 10 watts plus in a 2512 packageCFN2525 - 60 watts RF in a 2525 packageCFA2335 - 100 watts RF in a 2335 packageERL/KRL - .3W to 5W current sense resistorsRP series - 0402 to 0805 package 1/6w to 1/3w
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Thank you!Thank you!• Contact us so that we can help meet your
High Speed Compensation requirements.
Thin Film Technology
1980 Commerce Drive
North Mankato, MN 56003
Phone: 507-625-8445Fax: 507-625-3523
Your regional Sales Manager is:
Mike Walsh 781-779-1161
See us on the web at www.thin-film.com www.thin-film.com