Download - Technology solutions for PCBs in Europe
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Technologysolutions for
PCBs in Europe
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RD51 Collaboration meeting MPGD stability :
ELVIA PCB, a solution for industrialproduction of MPGD
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SUMMARY
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1. ELVIA PCB Overview
2. Product portfolio
3. MPGD detector production
4. Conclusion
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Overview: The strengths of a European leader
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➢ In the top 5 of the
European PCB industry
▪ N°1 European leader for
Aeronautics, Space and
Defence solutions
▪ 600 employees
▪ 5 manufacturing locations
▪ Established since 1976
➢ Expertise – across all
technologies
▪ End-to-end in-house
manufacturing solutions
▪ All PCB technologies available
▪ Innovation for industrialization
through our own engineering
team
➢ Global customer base
▪ World ranking OEMs and EMS
▪ Companies from aerospace,
defence, automotive and other
sectors
▪ Development of efficient and
innovative service models for our
customers
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Our industrial organisation: 5 main plants
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▪ Elvia PCB main plant (HQ) Coutances (205 people)
▪ Medium to large series
▪ Aerospace, Military, Medical, Telecom, Automotive and Industrial
▪ Elvia A&P Lithos plant Chateaubourg (105 people)
▪ Small to medium series
▪ Military Aerospace
▪ Elvia BREE plant Puiseaux (105 people)
▪ Medium to large series
▪ Automotive & Telecom
▪ Elvia Ciretec plant Saint Ay (95 people)
▪ Small to medium series
▪ Military Aerospace
▪ Elvia Plantin plant Saint Benoit (56 people)
▪ Small to medium series
▪ General industry
▪ CQCI Laboratories
▪ Lannion & Toulouse
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Our Markets: A winning diversification
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Technology solutions for PCB’s in EuropeDriver Coutances
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Standard Multilayers
Séquentiel HDI Multilayers
Coutances
Back Panel/Planar
Thermal management/Power
HDI Flex-Rigid/ Semi flex
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Technology solutions for PCB’s in EuropeMix Material
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Type Technology Application
HDI Multilayers
Mix material
Mix material: RF/FR4 Htg
RF : Megtron 6 (Panasonic)4000 series (Rogers)NY series (Neltec)Meteorwave series (Neltec)
Polyimide : Arlon, N7000 series
Flex Kapton (Pyralux)
HTg R1755V (Panasonic)EM827 (EMC)VT 47 (Ventec)
Aeronautics
Defense
Automotive
TIC
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Technology solutions for PCB’s in EuropeSequential Build Up
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Type Technology Application
HDI Multilayers
Sequential Build Up (SBU)
Number of layers : 2 à 32 µvia layers: 1 to 3Pitch BGA : 0,8 à 0,5 mmStack-up : sequential and //Thickness : Jusqu’à 4,5 Material : HTg et Low CTE
Aeronautics
Defense
Automotive
Medical
TIC
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Technology solutions for PCB’s in EuropeHDI Multilayers (µvia Inpad )
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Type Technology Application
HDI Multilayers
µvia Filling (In Pad)
3 levels
Number of layers : 18 layersMetallic finishes : ENEPIGImpedance : ± 10%Pitch BGA : 0,8 mmØ µvia : 120 µmSoldermask : Probimer 77/Tayio CC01Thickness : 2,4 mmMaterial : HTg Low CTE
Aeronautics
Defense
Médical
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Technology solutions for PCB’s in EuropeFine Line
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Type Technology Application
HDI Multilayers
Fine Line
Track/Space Std external layers : 90 µm /90 µmTrack/Space Std inner layers : 70µm/70 µmTrack/Space High tech external layers : 50 µm /50 µm *Track/Space High tech inner layers : 40 µm/40 µmProcess : Ammonium and acid etching
*µvia compatibility : In progress
Aeronautics
Defense
Médical
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Technology solutions for PCB’s in EuropeHDI Flex-Rigid
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Type Technology Application
HDI Multilayers
Flex-rigid
Number of layers : 4 à 26 layersStack-up : Séquential 3+N+3Pitch BGA : 0,8 à 0,5 mmFlex : Kapton + coverlayMaterial : HTgØ through hole : 0,2 mm
Aeronautics
Defense
Automotive
Médical
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Technology solutions for PCB’s in EuropeHeavy Copper
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Type Technology Application
Power management
Heavy Copper
Number of layers : 2 à 26Copper thickness: 70/105/210/400 µm
Minimum Space: Cu 70 µm ➔ 210 µmCu 105 µm ➔ 210 µmCu 210 µm ➔ 310 µmCu 400 µm ➔ 410 µm
Current density : 5 A/ mm²
Aeronautics
Defense
Rail
Automotive
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Technology solutions for PCB’s in EuropeBusbar
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Type Technology Application
Power management
Busbar
Metallic finishes : ENIGCopper thickness: 1 / 1,5 / 2 / 2,5 mmMachining : MechanicalMaterial: HTg
Aeronautics
Defense
Rail
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Technology solutions for PCB’s in EuropeBack Panel
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Type Technology Application
Back panel
Number of layers : 24 layersMetallic finishes : ENEPIGDimension : 400 mm x 230 mmPitch BGA : 0,8 mmSoldermask : Probimer 77Thickness: 4,2 mmMaterial : Hyper
Aeronautics
Defense
Médical
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Technology solutions for PCB’s in EuropePassive (embedded) resistors
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Type Technology Application
HDI Multilayers
Passive (embedded) resistors
SBU Compatible : YES Precision : ± 10 %Type : Tycer, Ohméga ply
Aeronautics
Defense
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4. MPGD detector production
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Geoazur : Geology of subsoils
Product description :• 2400 x 500 mm
• 3 layers
• Resistive paste silkscreen
• Bulk : 3 layers of photo-imageablecoverlay + 1 mesh
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4. MPGD detector production
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Geoazur : Resistive paste silkscreen
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4. MPGD detector production
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Compass : LHC experiment Product description :• 800 x 600 mm
• 3 layers
• Rohacell foam laminated underautoclave
• Bulk : 3 layers of photo-imageablecoverlay + 1 mesh
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4. MPGD detector production
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TF10 :
Product description :• 248 x 360 mm
• Double sided
• Bulk : 3 layers of photo-imageablecoverlay + 1 mesh
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4. MPGD detector production
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MCUBE : Project Scan pyramid
Product description :• 550 x 550 mm
• 6 layers
• Burried vias + blind vias
• Kapton (resistive paste) gluing
• Silver paste screen printing
• Bulk : 3 layers of photo-imageablecoverlay + 1 mesh
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4. MPGD detector production
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LEMWA105 :
Product description :
• 500 x 500 mm
• 6 layers
• Blind vias
• High NPTH density :• Ø 0,5 mm• Pitch 0,750 mm
• RIM specification
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4. MPGD detector production
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Detecteurs zig-zag :
Product description :
• Standard size
• 4 layers
• Zig-zag design with 20 µm spaces
CEA SACLAY
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4. MPGD detector production
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Micromegas detector : Project ATLAS NSW
Product description :• Single sided• Track/Space : 100 µm/100 µm• Size up to 2187 x 550 mm• Kapton with resistive pattern• Silverpaste screen printing• Pillar creation : photoimageable coverlay• Precision milling/image +/- 0,1 mm• Chemical silver
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4. MPGD detector production
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Micromegas detector : Project ATLAS
Kapton glued with FR4 based material
Copper pattern
Chemical silver
Silver paste
Coverlay pattern
Resistive pattern
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4. MPGD detector production
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Micromegas detector : Project ATLAS
High technology project➔ development of specific knowledge :
• CADCAM standard procedure for big sized boards
• Adaptating standard PCB process to big sized boards
• Resistive pattern : Resistivity management during autoclave lamination (influence of pressure, temperature, time)
• Special processes step : silverpaste silkscreen, coverlay
• Alignement of milling and copper image over big dimensions
• Adaptation of most of standard processes to big sized boards
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4. MPGD detector production
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Micromegas detector : Project ATLAS
Industrial project➔ development of ‘handicraft skills’ and adaptated equipment
• Team dedicated to big sized products and no-standard processes
• High competencies for MPGD detector production
• Big sized equipment :• Autoclave →multilayers, kapton gluing• Lamination system + big size exposure machine → Copper image• Etching line → Copper image• AOI• Drilling/milling equipment• Spray coating for solder mask
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4. Conclusion
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WE HAVE THE SOLUTION
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DISCUSSION
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QUESTIONS ?
Please find below my contact details. Feel free to contact me if you have any needs :
Boris Couroussé
00 33 (0)2 33 76 32 76