TEAM Microscope Engineering Planning
Norman Salmon
Engineering Program Manager
Seung-Kil Son Ph.D.
Staff Mechanical Engineer
December 12, 2003
Areas of Engineering Effort 2004-2007
Concept Engineering
FY2004 FY2005 FY2006 FY2007
Design/Engineering
Analysis
Fabrication
Instrumentation and Metrology
Thermal Analysis
Microscope Geometry
Sensors
Actuators
Controls
Materials
Building
Metrology
Electrical Systems
Fabrication
Mechanical Design
Initial Specification
Reset Specification Q1 2004
Critical Path for Concept Engineering and Stage Specifications
Cooling Systems
Additions to the Original Scope of Work
TEAM Stage
U of Ill - TEAM Stage Cartridge and On Stage Experiments
Cooling System
Automated Sample Loading
With Load Lock
Microscope DesignFacilities/Building Impact
Materials Be/Ceramics
62 Machine Shop
Projects and Funding that can help support an expanded scope of work
• KITECH (300K for FY2004 - ??) • Miquel Salmeron - MF• Alex Zettle (Shaul) • David Dornfeld
– Support in Equipment for Building 62 Shop (500K) – Support in Students and Post Docs to strengthen/reduce cost of
fabrication support
• Prospects – Potential Visiting Professor from Korea in PZT and Sensors
(March 2004)
– Paul Wright /Chris Talbot Applied Materials
Proposed Shift in Funding
0
100
200
300
400
2004 2005 2006 2007
TEAM Stage Funding
Current
Proposed
Engineering Effort
0
20
40
60
80
100
120
140
160
180
2004 2005 2006 2007
Concept Design
Design
Analysis
Consulting
Fabrication
Instrumentation
PurchasedComponents
Travel
Engineering Costs
• Setting up a fabrication account is essential– General and Administrative
• 46.5% GR1
• 20.6% Fab
• Detail budget should be submitted to NCEM January 1, 2004 based on limitations of scope of work
TEAM Project Management
• MS Project • Tracking of Resources • Resource Conflicts • Budgeting • Time Lines • Unique UC Numbers for
Sub-accounts to track specific project areas
Project Code Parent I.D. Description Staus
1 UC5074 501506
Design and Fabricate Fluidic Sample holder for JEM 3010 TEM probe.
Basic probe design and critcal dimensions have been modeled in SolidWorks based on LBNL drawing # 25M0266B and JEOL drawing number 8147 0528 6. - Mid January!!!!! Met with Mark on 12/111/03 - happy with current design.
2 UC 5051 503601
Design and fabricate modified cover plates for FIB with Detoronics #DTO2H-14-19PN electrical connector located and installed at the center of the cover plate.
Both plates were designed and fabricated and are referenced on LBNL drawing #s 25H206 and 25H207.
3 501506
Full Rotation Tomography Holder - Design and fabricate sample holder with +/- 70 degrees of rotation and +/- 10 degrees of tilt within 1.8mm envelope.
Concept Designs are in progress, holder blank will be from current double tilt holder for CM300 in Ti. Motor information from Clock and Kliendiek are still under investigation.
4 501506
JEOL 2010 / 3010 blank sample probe design and fabrication.Basic probe geomtry will be designed and fabricated for use as a blank for custom probe designs as needed.
Basic probe design and critcal dimensions have been modeled in SolidWorks based on LBNL drawing # 25M0266B and JEOL drawing number 8147 0528 6
5 UC4783 503601
FE SEM - Design and fabricate sample holder utilizing a parabolic mirror to collect flourescence from sample and direct it to fiber bundle.
Installation Week of Nov 10th. Installed - adjustments needed. Additional work on cooling plate design and integration.
6 UC5144 503601
A continuation of FE SEM project utilizing a 1.5mm parabolic mirror to single fiber optic.
Basic solutions have been brainstormed and concept designs are in progress.
7 XXXXX
Shaul Aloni - Joel 2010 Blank and custom probe design and fabrication. High density (80) chip contacts, high stifness, chip clamp design base on sample geometry.
Need concept design to manufacture pins. Similar to MEMS holder.
8 UC5145 511201Mems insitu tensile tester Morris Group/Andy Minor/ LLNL Ues
"3010" modular holder for this design.
9 XXXXX
Daan Hie Alsem - Contact design for fatigue test specimens used in testing fatigue and wear in silicon structural films
Norm, get together with both Shaul and Daan to look at conbining design effort.
Current Project List
Stage Concept Sketch with Autoloader
Specifications Currently Set
• Drift Specification – Dream #: 1Å / 10 mins – applications Lorentz (single spins – 1000
secs), EFTEM (for 1Å Resolution may need 5 mins exposure) – Minimum acceptable: 0.5 Å / 1 min – Present standard is 2 Å / min, so the existing minimum is almost
sufficient, but we’d really prefer to do better – This is for x, y and z
• Eucentricity – Very desirable to make any point eucentric via software control as
opposed to only having only one point in space that is eucentric. – Would represent an incredible improvement for the operator
• Range– Coarse Travel
• x & y = 2 mm • z = Dream spec 3 mm (if designing for bigger gap
microscopes, TEAM II+), minimum z = 0.5 mm for TEAM I • Note that this constraint is largely based on present 3 mm disc
size – practical reason, not an engineering – Resolution of coarse motion:
• Generally want 10 times overlap of coarse motion to fine – this dictates about 10 nm
– Range over which fine travel is in existence: 10 µm (or better)– Resolution of fine motion: 30-50pm
Specifications Currently Set (Continued 1)
• Repeatability– 5 times worse than resolution – thus, that means 250 pm (0.25 Å)
• Precision– 10 times worse than resolution – that’s then 500 pm (0.5Å)
• Repeatability between microscopes – It was noted that doing this very successfully would be very beneficial
in terms of justifying use of two columns instead of one column.– Kinematic joint for cartridge between microscopes – goal is to be able
to analyze the same nanoparticle in both the TEM and STEM columns• Repeatability resolution 250 nm coarse motion (maybe better)• Want an optical method for fine positioning • Needs to be discovered what we can expect for resolution on this, what software
exists • If better than 10 nm we’re very happy
Specifications Currently Set (Continued 2)
Specifications Currently Set (Continued 3)
• Rotations– Specimen stage: ± 20 is minimum, 45 is preferred, 70 is desired
– Resolution: 100 µrad
– Discussed in terms of requirements for TEAM I & beyond TEAM I. • Likely that TEAM I will need only 20 for routine use
• The additional tilted need for tomography will almost have to come from a special cartridge design
• Speed – Worth considering, but not a priority but a convenience
– Obviously, faster is better
– Shoot for 1 rpm
• Cartridge – Types of samples: 3mm disc, FIB, MEMS
– Sample Size: 3 mm disc as standard • Reason: if we deviate from the 3mm disc size, users will not be able to do any
sample preparation prior to use of the TEAM instrument. This is not desirable.
• Size: Thickness: 0.5 mm in center, thicker to the sides, x & y will depend on design
– Cartridge should be a kinematic fixture
Specifications Currently Set (Continued 4)
Specifications Currently Set (Continued 5)
• Materials – Non-magnetic
– Conductive
– Stiff
– Thermally stable
– UHV-compatible/bakeable
– Be? Cu-Be?
Nano/Sub-Nanometer Scale Manipulation
Control Mechanical Components Environment
1. Actuator -Piezo (No Stiction)
2. Feedback - Laser/Capacitance ~ 10 times better than target accuracy.
3. Control Technique
- Coarse/Fine (with compensation)
1. Material - Stability - CTE (Super/Invar, Zerodur) - Residual Stress - Stiffness
2. Kinematics - ABBE error - Cosine error - Axis coupling effect
3. Part Accuracy - Surface Condition - Straightness - Dimensional accuracy
1. Vibration/Acoustic - Vibration isolation - Avoiding Eigen-modes
2. Thermal - Thermal inertia - Heat isolation - Minimize heat generation
3. Electro-magnetic - Shielding & Isolation - Avoid monitors &
computers, noisy electric motors
4. Media for Sensors - Humidity, Air pressure,
Temperature change
Current Target
Technical Issues
5 ~ 10nm accuracy 0.05nm accuracy
Actuator
Feedback
Control
Thermal
5 ~ 10nm accuracy Better than 0.05nm (0.5 A)
1 nm resolution 0.01 nm (0.1 A) resolution
610accuracy
workspace 810accuracy
workspace
Low CTE materials Low CTE materials and Compensation
improvement
How to solve the problems
Piezo actuationLaser/capacitance
readbackCoarse/Fine
control
5mm PZT
5mm workspace
0.5nm open loop resolution
Laser
0.01nm resolution
Capacitance
0.01nm resolution
Target
Target
Electric field
310
610
910
1210
][m
fine motion
coarse motion
Joint bearings (fine-motion)
Bearings
Stick-slip
Error motion
Flexures
Continuous
Small error
Small workspace
System Design
• Why do we need Nanometer accuracy for the Macro-scale components?– The guiding system directly effects the system overall accuracy.
– The error amount should be within fine motion control region
1
e
2
12 e
: Orthogonality: Straightness: ABBE error
It’s not easy to get better than 0.1 mrad ABBE error with conventional machining.
)sin(_ rreerrorABBE
x-axis
y-axis guide surface
error amount ( ) < fine motion travel range (1~10 microns)),,( ef
mmradmm 51.050 (when e=0.1mrad and r=50mm)
10-3 10-4 10-5 10-6 [m]
meso machining
miniature machining
silicon µ-machining
Critical dimensions
Meso-scale machining: 10 µm ~ 1mm
Micro Milling, Drilling and Turning
Micro Stepper Motor Laminates - Produced Using 100 Micron Diameter Rotary Cutting Tools - Tech Transfer Grant for Empire Magnetics FY2002
100 Micron Diameter Micro Electrodes Produced for Alexander Zholents 2002 AFRD LDRD
Holes as small as 40 Microns can be drilled in Stainless Steel - Shown is a 70 Micron Drill compared with a Human Hair
10µm gears in silicon
25µm channel in diamond
FIB Milling
17µm cutting tool
20µm channel in graphite
1mm
Examples Meso-Machining at LBL
Micro Turbine Blades
2-translational axis manipulation for FESEM
1. Technical challenge• No-existing manipulation• collect light coming from the sample• Limited installation space• Following the table movement• Don’t hinder other instrument inside
the chamber
2. Approach• Parabola mirror• Two axis stage• Piezo actuation• Step-like actuation for stability• Open loop control
3. Installation and Test Results• Positioning accuracy: 0.02mm• Easy user control with VisualBasic• No damage on vacuum grade• No X-ray through the stage
Installation surface
X-axis stage
Sensor position
5mm
10mm
FESEM TableWith 5-DOF
Diamond turned mirror surface
Installation and test of FESEM Stage
2-axis stage
FESEM
Monitor
Outside view
Inside view
Mirror engagement
Test result
Control Panel
Hole on the parabola mirror
0.5mm
Control panel for FESEM Stage
Software : VisualBasic
Stage aging time control
+/-X axis feedrate control
Z-axis control
Stage pausing
Auto-homing
Z-axis voltage level control
X-axis voltage level control
2-rotational axis manipulation for TEM
1. Technical challenge• Sub m-radian accuracy with
with 6.5mm shaft.• Two independent rotations• Attachment to the existing
Goniometer
2. Approach• Piezo actuation• String type rotating mechanism• Jewel bearing• Minimization stick-slip
3. Expected results• 0.6 mrad accuracy tilting
(equivalent with 3micron linear displacement)
• 0.03 mrad accuracy rotation• Smooth operation• No-jittering• Easy jog control
(patent disclosure)
Fluid Holder for JEOL 3010 (Mark Williamson)
Modular Sample Holder for the JEOL 3010
Ti - 6Al4V
Delrin
Aluminum
Other Ongoing Projects
• Florescence Holder for the CM-300
• LLNL/Morris In-Situ Tensile Test Holder
• Single Tilt Full Rotation Tomography Holder
• IC Holder for Daan Hein
1mm Parabolic Mirror for TEM Sample Holder