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TDI longitudinal impedance simulation with CST PS
A. Grudiev20/03/2012
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GeometryAll metal and dielectric parts are from PEC. No losses.No ferrites are included.Magnetic wall BC is applied at the horizontal planePML BCs are applied at the up/downstream ends
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Mesh, sigma_z=500mm
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Longitudinal Wake, sigma_z=500mm
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Longitudinal impedance, sigma_z=500mm
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Longitudinal impedance, sigma_z=500mm
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Mesh, sigma_z=200mm
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Longitudinal Wake, sigma_z=200mm
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Longitudinal impedance, sigma_z=200mm
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Longitudinal impedance, sigma_z=200mm
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Mesh, sigma_z=100mm
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Longitudinal Wake, sigma_z=100mm
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Longitudinal impedance, sigma_z=100mm
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Longitudinal impedance, sigma_z=100mm
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Mesh, sigma_z=50mm
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Longitudinal Wake, sigma_z=50mm
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Longitudinal impedance, sigma_z=50mm
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Mesh, sigma_z=20mm
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Longitudinal Wake, sigma_z=20mm
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Longitudinal impedance, sigma_z=20mm
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Longitudinal Wake, Summary plots
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Longitudinal Wake, Summary plots
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Longitudinal Impedance, Summary plots
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Longitudinal Impedance, Summary plots
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Longitudinal Impedance, Summary plots
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Longitudinal Impedance, Summary plots
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Different beam locations: b0, b1, b2
b0;X=0
b1;X=-8mm
b2;X=-68mm
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Longitudinal Wake, σz=100mm: b0, b1, b2
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Longitudinal Impedance, σz=100mm: b0, b1, b2
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Longitudinal Impedance, real part, σz=100mm: b0, b1, b2
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Longitudinal Impedance, imaginary part, σz=100mm: b0, b1, b2
Half gap = 8mmb0: Z/n = 155 Ohm/250MHz * 400.8MHz/35640 = 7.0 mOhmb1: Z/n = 150 Ohm/250MHz * 400.8MHz/35640 = 6.7 mOhmb2: Z/n = 70 Ohm/200MHz * 400.8MHz/35640 = 3.9 mOhm
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Longitudinal Wake, σz=100mm: b0 PML8 -> PML16
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Longitudinal Impedance, real part, σz=100mm: b0, PML8 -> PML16
Almost no difference
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Longitudinal Wake, σz=100mm: b0 beam pipe length: 200mm -> 100mm and 300mm
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Longitudinal Impedance, σz=100mm: b0, beam pipe length 200mm -> 100mm and 300mm
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Longitudinal Impedance, σz=100mm: b0, beam pipe length 200mm -> 100mm and 300mm
Beam pipe length of 300 mm is better, but the difference is only at f ~ 0And the negative offset of the ReZl is always there at the same level.
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Ti coating of hBN blocksDear all, Here is a coating report from Wil (please follow the link), for a batch of BN coated in 2010. The specifications we had been asked to meet were Rsquare<0.5 Ohm.For a thickness of about 5 µm that means a resistivity of about 250 e-8 Ohm.m , larger than the nominal Ti value. This is likely due to the large amount of outgassing from the porous BN material. Cheers,Sergio & Wil See EDMS link https://edms.cern.ch/document/1085514/1
For this coating skin depth in the range from 10 MHz to 1 GHz is 250 um to 25 um which is bigger than the coating thickness of 5 um.
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 20
0.2
0.4
0.6
0.8
1
f [GHz]
Tra
nsm
issi
on:
Etr
/Ein
10um Cu
5um Ti flash
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Longitudinal Wake, σz=100mm: b0 PEC -> hBN
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Longitudinal Impedance real part, σz=100mm: b0, PEC -> hBN
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Longitudinal Impedance, imaginary part, σz=100mm: b0, PEC hBN
Half gap = 8mmb0, PEC: Z/n = 155 Ohm/250MHz * 400.8MHz/35640 = 7.0 mOhmb0, hBN: Z/n = 2620 Ohm/400MHz * 400.8MHz/35640 = 73.7 mOhm
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Longitudinal Impedance, real part, : b0, hBN, σz=100 - > 50 mm
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Influence of the ferrite 4S60
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Influence of the ferrite 4S60
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Longitudinal impedance gap 16mm hBN, with and w/o 4S60
NO DIFFERENCE
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Influence of Mask for RF fingers region
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Longitudinal impedance gap 16mm hBN, σz = 100 mm , with and w/o Mask
No big difference in CST wakefield solverBUTSaves a lot of mesh in HFSS eigenmode solver
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Longitudinal impedance gap 16mm hBN, σz = 50 mm , with and w/o Mask
No big difference in CST wakefield solver BUT saves a lot of mesh in HFSS eigenmode solver
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R/Q estimate from PEC impedance
00
)(4)0(;)cos()(2
)( dffZWdcsZsW RR
Reminder from classicalP. Wilson, SLAC-PUB-4547
For impedance of N modes with Q >> f/df, where df=c/s_max, for PEC Q~∞
N
nnR
N
n
dff
dff
R
N
nn
N
nn dffZdffZkWW
n
n1111
)(4)(42)0()0(
n
nRn
n
nRn
f
dffZk
Q
R
dffZk
)(44
)(2
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R/Q estimated from longitudinal impedance, hBN, b0, σz = 50 mm
4(Zl-Zl0)*df/πf is plotted where Zl0 = 71 Ohm to make the real part positive
0 0.5 1 1.5 2 2.5 3 3.510
-4
10-2
100
102
104
f [GHz]
R/Q
[O
hm]
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Go to HFSS results
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Power estimated from ReZl, hBN, hgap=8mm, σz = 85 mm, same HWHH: b0,b1,b2
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 2808, Nb = 2.2e+011, shape: Gaussian
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 1404, Nb = 3.5e+011, shape: Gaussian
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 1404, Nb = 3.5e+011, shape: cos2
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 2808, Nb = 2.2e+011, shape: cos2
b0
b1
b2Q
S
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Power estimated from ReZl, hBN, hgap=20mm, σz = 85 mm, same HWHH : b0,b1,b2
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 2808, Nb = 2.2e+011, shape: cos2
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 2808, Nb = 2.2e+011, shape: Gaussian
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 1404, Nb = 3.5e+011, shape: Gaussian
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 1404, Nb = 3.5e+011, shape: cos2
b0
b1
b2Q
S
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Power estimated from ReZl, hBN, hgap=55mm, σz = 85 mm, same HWHH : b0,b1,b2
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 1404, Nb = 3.5e+011, shape: Gauss
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 2808, Nb = 2.2e+011, shape: Gauss
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 2808, Nb = 2.2e+011, shape: cos2
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 1404, Nb = 3.5e+011, shape: cos2
b0
b1
b2Q
S
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0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 2808, Nb = 2.2e+011, shape: cos2
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 2808, Nb = 2.2e+011, shape: cos2
b0
b1
b2Q
S
0 0.5 1 1.5 2 2.5 3 3.510
-1
100
101
102
103
104
f [GHz]
P [
W]
Beam: Mb = 2808, Nb = 2.2e+011, shape: cos2
b0
b1
b2Q
S
Power estimated from ReZl, hBN, hgap=8->20->55mm, cos^2 bunch, HL-LHC 25 ns beam : b0,b1,b2
hgap=8mm
hgap=20mm
hgap=55mm
The impedance of the low frequency modes (<200MHz) weakly (far from linear) depends on the gap! At fully open jaws position a few 100s of Watts can be dissipated mainly on the block keepers and beam screen.
The impedance of the higher frequency modes (> 1 GHz) depends on the gap, roughly linear with the gap. Power dissipation is reduced from a few kilowatts down to the level of 100 Watts.
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Transverse impedance
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Transverse impedance dy=2mm, hgap=8mm, b0different materials for the hBN blocks: PEC and hBN
PEC+PEC(pure geometrical): Im{Zy}(f->0) = 600Ω/2mm = 300 kΩ/mPEC+hBN(geometrical+dielactric): Im{Zy}(f->0) = 5400Ω/2mm = 2.7 MΩ/mNon coataed hBN blocks result in 9 times higher transverse BB impedance
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Transverse impedance dy=2mm, hgap=8mm, b0hBN blocks with and without ferrite 4S60
No significant difference. Ferrite does not damp transverse modes significantly. Its location is not optimal.
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Some conclusions
• The ferrite 4S60 are not very effective in its present location• Imaginary part of the Broad band impedance both
longitudinal and transverse is increased by ~ factor 9 if no coating is assumed on the hBN blocks
• Parameters (f0, Q, R/Q) of all significant trapped modes has been calculated in FD using HFSS. R/Q and f0 agree rather well with CST estimate.
• RF heating estimate based on the CST results for half gap of 8, 20 and 55 mm are made for HL-LHC beam parameters. For cos^2 bunch shape it can reach few kW level if no coating is assumed on the hBN blocks
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Recommendations
• Maximum LHC beam parameters are assumed to be 2808 b x 1.15e+11 p/b for the operation between LS1 and LS2
1. Cu coating of hBN blocks of at least 10 um or more if possible
2. Improve cooling of the jaws to be adequate to the RF heating of the absorber block keepers which can reach 1 kW level at injection (half gap 8 mm) or 100 W level at collisions (half gap 55 mm)
3. The stainless steel beam screen must be coated with at 100-200 um of Cu. Adequate cooling if necessary has to be implemented in order to evacuate the RF heating power load of 100 W all along the screen.