© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM330D – 6-Axis MEMS Inertial Module 1
9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France
Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr
August 2012 - Version 1
Written by: Romain FRAUX
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic
estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is
made of the contents of this report. The quoted trademarks are property of their owners.
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Table of Contents Glossary
1. Overview / Introduction……….……….…………….…........…4 – Executive Summary – Reverse Costing Methodology
2. STMicroelectronics Company Profile……….……....…….....6 – STMicroelectronics Profile – MEMS Inertial Modules Portfolio – LSM330D Characteristics
3. LSM330D Physical Analysis…………...……….............…...13 – Physical Analysis Methodology – LSM330D - Package
Package Characteristics & Markings Package Pin-Out Package Opening
– LSM330D - Accelerometer Accelerometer Cross-section Accelerometer ASIC – Dimensions Accelerometer ASIC – Markings Accelerometer ASIC – Delayering Accelerometer ASIC – Cross-Section Accelerometer MEMS – Dimensions Accelerometer MEMS – Markings Accelerometer MEMS – Bond Pads Opening Accelerometer MEMS – Cap Opening Accelerometer MEMS – Cap Accelerometer MEMS – Sensing Area Accelerometer MEMS – Cross-section
– LSM330D - Gyroscope Gyroscope ASIC – Dimensions Gyroscope ASIC – Markings Gyroscope ASIC – Delayering Gyroscope ASIC – Cross-Section Gyroscope MEMS – Dimensions Gyroscope MEMS – Markings Gyroscope MEMS – Bond Pads Opening Gyroscope MEMS – Cap Opening Gyroscope MEMS – Cap Gyroscope MEMS – Sensing Area Gyroscope MEMS – Cross-section
– ST 3-Axis Accelerometers MEMS Dies Comparison – ST 3-Axis Gyroscopes MEMS Dies Comparison
4. Manufacturing Process Flow…….………………………..…….86 – Global Overview – ASICs Process Flow – Description of the ASICs Wafer Fabrication Unit – MEMSs Process Overview – MEMSs Sensor Process Flow – MEMSs Cap Process Flow – MEMSs Wafer Bonding Process Flow – Description of the MEMSs Wafer Fabrication Unit
5. Cost Analysis………………………….……………………..…..104
– Synthesis of the Cost Analysis – Main Steps of Economic Analysis – Yields Explanation – Yields Hypotheses – Die per wafer & Probe Test – ASIC Front-End : Hypotheses – ASIC Front-End Cost – ASIC Back-End 0 : Probe Test, Backgrinding & Dicing – ASIC Dies Cost – MEMS Front-End : Hypotheses – MEMS Front-End Cost – MEMS Front-End Cost per Process Steps – MEMS Front-End : Equipment Cost per Family – MEMS Front-End : Material Cost per Family – MEMS Back-End 0 : Probe Test & Dicing – MEMS Dies Cost (Front End + Back End 0) – Back-End 1 : Packaging Cost – Back-End 1 : Final test & Calibration Cost – LSM330D Component Cost (FE + BE 0 + BE 1)
6. Estimated Price Analysis….………………….……………......133 – Definition of Prices – Manufacturer Financial Ratios – LSM330D Estimated Manufacturer Price – LSM330D Estimated Selling Price
Contact…….………………………………………...……………….140
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM330D – 6-Axis MEMS Inertial Module 3
Executive Summary
• This full reverse costing study has been conducted to provide insight on technology
data, manufacturing cost and selling price of the STMicroelectronics LSM330D
component.
• The LSM330D is a 6-axis MEMS Inertial Module (3-axis accelerometer + 3-axis
gyroscope) manufactured using a surface micromachining process (THELMA
process).
• They are suitable for further applications (GPS navigation systems, Impact
recognition and logging, Gaming and virtual reality input devices, Motion activated
functions, Intelligent power saving for handheld devices, Vibration monitoring and
compensation, Free-fall detection, 6D orientation detection).
• Compatible with SMD process, the LSM330D is provided in a 3x5.5x1mm LGA 28-pin
package.
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Package Characteristics & Markings
• Package type: 28-pin LGA
• Dimensions: 3mm x 5.5mm x 1mm
• Pin pitch: 0.45mm
• Marking:
145
330
Package Top view
Package back view Package side view
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ST's Shared dies
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Accelerometer MEMS – Cap Opening
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Accelerometer MEMS - Cross-Section
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Gyroscope ASIC – Cross-Section
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Gyroscope MEMS – Bond Pads Opening
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MEMS – Cap Opening
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ST's 3-Axis Accelerometers MEMS Dies Comparison
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Sensor Process Flow (Accelero & Gyro)
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Si wafer
• Thinning 300µm
• Isolation oxide (Oxide1) deposit
Si wafer
• Buried Poly (Poly1) deposition
• Ion implantation
• Pattern & etch
Si wafer
• Sacrificial oxide (Oxide 2) deposit
• Pattern & etch
Si wafer
• Structural Layer (Poly 2) deposit
• CMP & ion implant
Sensor Process Flow (Accelero & Gyro) 1/2
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ASIC Front-End Cost
Probe Test Cost
Backgrinding & Dicing Cost
• We perform the economic analysis of the ASICs with the IC Price+ software.
• We perform the economic analysis of the MEMSs and the packaging with the MEMS CoSim+ software.
Packaging Cost
Final Test & Calibration Cost
Component Cost
MEMS Front-End Cost
Probe Test Cost
Dicing Cost
Main steps of economic analysis
LSM330D
Back-End 0
Back-End 1
Front-End
Accelerometer Gyroscope
ASIC Front-End Cost
Probe Test Cost
Backgrinding & Dicing Cost
MEMS Front-End Cost
Probe Test Cost
Dicing Cost
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ASIC Dies Cost (Front-End + Back-End 0)
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LSM330D MEMS Dies Cost (FE + BE 0)
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LSM330D Component Cost (FE+BE 0+BE 1)
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LSM330D Estimated Selling Price (Medium Yield)