iNEMI Medical Packaging WorkshopSeptember 17, 2010, Berlin
State of the Art of Assembly and Packagingof Electronic Modules for Medical Implants
J. GoßlerMicro Systems Engineering GmbH
Schlegelweg 17D-95180 Berg/Germany
© Micro Systems Technologies Sept. 17, 2010iNEMI Medical Packaging Workshop; Berlin
MST Group – 5 highly innovative technology companies
Solutions for medical devices from conceptto serial production
© Micro Systems Technologies Sept. 17, 2010iNEMI Medical Packaging Workshop; Berlin
MST Group – 8 locations, more than 900 employees
• System develop.& VLSI design
• Advanced assembly (med-tech)
MSEI*Lake Oswego - Denver
- Houston, USA
• LTCC substrates• Adv. assembly• Design services
MSEB**Berg, Germany
• Feedthroughs for med-tech implants
CC FeedthroughsErlangen, Germany
• Batteries for med-tech implants
LITRONIKPirna, Germany
• Electrophysiology products
VascoMedBinzen, Germany
• High-reliability HDI/microvia substrates
DYCONEXBassersdorf,Switzerland
* MSEI: Micro Systems Engineering, Inc.**MSEB: Micro Systems Engineering GmbH, Berg Holding company: Micro Systems Technologies GmbH, Baar, Switzerland
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Topics
1. Introduction
2. Substrates
3. Assembly
4. Interfaces
5. Systems
6. Future
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Introduction
Major challenges for electronics in biomedical implants
• Reliability (active lifetime up to somedecades)
• Compatibility with hermeticenvironment
• high packaging density / low weight
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Introduction
Benefits from human body environmentand hermetic housing
• constant moderate temperature
• very dry and inert atmosphericenvironment
• no severe vibration or mechanicalshock
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Substrates
Circuit Board Technology
• Packaging and wiring density against requirements of expected integration level
• Basic requirements for functional properties as
HF performance
dielectric strength
system reliability
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Substrates
Rating
Cost
LTCC HTCC PCB FR4 PCB PI
Wiring Density
HF-Performance
Conductor Resistance
3D
Humidity Absorption
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Substrates
LTCC / HTCCPCB rigid (FR4)
PCB flex (Polyimide)
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Electronic Modules
Can
Feedthrough
Battery
Elektronic module
Typical assembly; example heart pacemaker
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Assembly
Interconnect technology options
• Chip&Wire Technology
(always combined with standard SMT)
• Chip Scale Package (CSP)
• µBGA
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Assembly
Chip&Wire-Technology
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Assembly
Chip&Wire-Technology
Advantages Disadvantages
no additional packaging stepsafter waferfab
increased floorspacerequirements
reliable, well knowntechnology reduced HF performance
configuration flexibility bydifferent bond options
sequential (slow) interconnectprocess
some flexibility in case of die shrinks
mechanical protectionrequired
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Assembly
Chip&Wire-Technology
Single chamber pacemaker
Substrate / Hybrid:- thickfilm hybrid on Al2O3 substrate- printed resistors- 9 up array on 4“ square panel- 2 interconnect layers- one side SMT, one side C&W
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Assembly
Chip&Wire-Technology
Single chamber pacemakerwith increased functionality
Substrate / Hybrid:- 4 layer LTCC substrate- printed resistors- 6 up array on square panel- 5 interconnect layers- one side SMT, one side C&W- no SMDs on C&W side- perforated straight edges for
singulation after assembly
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Assembly
Chip&Wire-Technology
Three chamber pacemaker withhome monitoring functionality
Substrate/ Hybrid:- 6 layer LTCC substrate on 4“ square panel- 7 interconnect layers- overall conductor length 2,01 m- 642 vias- perforated „D shape“ for singulation after assembly
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Assembly
Chip Scale Package (CSP)
Sn63Pb37
Polymer
Al-PadDie-Passivation
CuUBM
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Assembly
Chip Scale Package (CSP)
Advantages Disadvantages
small package (down to real chip size)
additional wafer scaleprocesses (redistribution + bumping)
can be attached in standardsurface mount processes
redistribution layer criticalconcerning crosstalk
parallel (fast) interconnectprocess underfill recommended
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Assembly
Dual chamber pacemaker withhome monitoring functionality
Substrate/ Module:- rigid flex PI substrate- 2 interconnect layers- test points outside circuit on panel- laser singulation
Chip Scale Package (CSP)
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Assembly
µBGA
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Assembly
µBGA
Advantages Disadvantages
rugged package additional packaging (wirebond, transfer mold)
can be attached in standardsurface mount processes reduced HF performance
parallel (fast) interconnectprocess
limited availability if not „high volume“
full electrical test afterpackaging
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Assembly
µBGA
Dual chamberpacemaker on FR4 PCB
Substrate/ Module:- FR4 substrate- 4 interconnect layers- 6 up array on panel- no clean solder
assembly- laser singulation
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Interfaces
Typical interface requirements
• I/Os to external actors and/or sensorsfor diagnostic or therapy
• Communication
• Internal
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Interfaces
Electrodeplugs
Feedthroughs
Requirements:
- hermeticity in human bodyenvironment for implant lifetime
- reliable internal and externalinterconnects
- external interconnects compatiblewith human body environment
Internalinterconnects to battery
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Interfaces
Feedthroughs
Quadrupolar feedthroughfor two bipolar electrodes
Bipolar feedthrough solderedto flex interconnect
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Interfaces
Communication coils and antennas
Freestanding coil withinterconnects by welding
Laminated flat coil withsoldered interconnects
Antenna for RF communication in header
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Systems
Dual chamberpacemaker
Welded and glued coil on topof soldered SMDs
Glued acceleration sensor, interconnect by soldered flex
Glued plastic lid
Components attached inChip&Wire technology
- HTCC substrate- SMT- Chip&Wire- welded and glued coil- plastic lid
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Systems
Dual chamber pacemakeron rigid flex substrate
- flex arm with connectors forbattery
- flex arm with solderedfeedthrough
- chip scale packages
- trim resistor µBGA
- acceleration sensor
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Systems
Schematic of technology:rigid flex withCSP
IC mit Umverdrahtungund Lotbumps
Underfill (optional)
Polyimid mit Cu-Metallisierung undMikro-Vias
Versteifungsmaterial(z.B. FR-4)
Flexibler Bereich zumFalten der Schaltung undzur Realisierungintegrierter Verbindungs-elemente (z.B. zur Batterie)
Flexible area for foldingand external connections(battery, feedthrough)
IC with redistributionlayer
Polyimide with Cu metallization and microvias
Stiffener(FR4)
Underfill (optional)
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Systems
Finished foldedmodule and assembly schematic
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Systems
Implantable Rescue Device (IRD)Single chamber pacemaker with limiteddefibrillator function and RF telemetry
- LTCC hybrid for controller
- FR4 PCB with SMT and Chip on Board for high voltage and power section as daughterboard
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Systems
Implantable Cardioverter/Defibrillator(ICD)
Assembly schematic
Unfolded Module
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Future
Further miniaturization of components
• COB-technology in power section
• 3-D-packaging for ASICS
• Integrated arrays for passive components
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Thank you for your attention.
Micro Systems Engineering GmbHSchlegelweg 17DE-95180 BergGermanywww.mst.com/[email protected] +49 (9293) 78-0Fax +49 (9293) 78-41
Micro Systems TechnologiesNeuhofstrasse 4CH-6341 [email protected] +41 (43) 266 11 00Fax +41 (43) 266 11 11