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Semiconductor Packaging and Test
A supply chain challenge
16th European Manufacturing Test Conference (EMTC)
Session 3: Impact of new markets on test and the supply chain
Semicon Europa, Grenoble, Oct 9th, 2014
Jean-Marc Yannou
Andrea Körtvelyessy
ASE Group
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Keywords throughout this presentation
1
Supply chain
Value chain
System in Package System on board
Industry branch, sector
The “Internet of Things”
Semiconductor packaging
Test
The next big thing ?
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Outline
1. ASE Group introduction
2. IoT, the next big thing?
3. SiPs or Modules ?
4. SiP packaging roadmap
5. Test innovations and challenges
6. Conclusion
2
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ASE Group Introduction
3
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ASE Group: Business Units
Chairman
Jason Chang
Richard Chang
ASE ATM
Tien Wu
COO
USI
Tien Wu
CEO
Real Estate
2013 revenues: $4.8B $2.7B
4
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ASE Group Synergies
ASE USI
Main operations IC assembly and test (A&T)
services
Module/System Design and Manufacturing
Services (DMS)
Main technologies die attach, wire bonding,
bumping, flip chip,
moulding, IC test, Wafer
level packaging
Compartment Shielding, Conformal
Shielding, Hi-Density SMT, and Embedded
Technologies.
Accuracy range 1µm – 50µm 20µm-100µm
Business models - Outsourced IC assembly
and test services.
ASE is a service company
- Module/System design and manufacture
including Supply chain and Services.
USI is a service company
5
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ASE’s Role in the Manufacturing Value Chain Unique assets
for an OSAT
6
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ASE Group Value
- Market share gain
* Strategic investment
* Technology leadership
- System integration
* OSAT & EMS expertise and customers
* Assembly & Test + System Design
* Total Service & Manufacturing Solution
Organic Growth
New Driver
ASE + USI Leadership
7
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ASE Broad Portfolio: A&T
• Full Turnkey Service • Assembly • Test • Substrate • EMS
• Lowering Cost/Creating Value • Cu Wire Bond • High Density Matrix • Low Pin & Discrete • Economies of Scale
8
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IC Assembly & Test
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Products
&
Market
Positions
Wireless
Networking
40%
Storage &
Computers
25%
Industrial
Products
15%
Visual
Products
10%
Car
Electronics
10%
Wi-Fi SiP WW No.2 for
Smart Phone
& Tablet
M2M Module For Home
Appliance
Diversified & Balanced Businesses with Leading Market Positions
SSD & NAS WW No. 1 for
Enterprise &
SMB
X-86 M/B No. 2 for
Customers in
DT and Server
LCD X-Y Board WW No.2 for
TV, NB, Monitor
LED Back Light For TV, NB,
Monitor
POS WW No.2 for
Hospitality &
Retail Market
SHD WW No.1 for
Logistics &
Warehousing
Regulator No.1 for China OE
Charging System
LED Lighting WW No.2 for
Lighting System
Segment
2013
Revenue
USI Businesses & Positions: DMS
10
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Kunshan, CN Shanghai, CN ZJ Shenzhen, CN. Nantou, TW Guadalajara, MX
R/D
Manufacturing
Global Sales
RMA & Logistics
Beijing, CN
Guadalajara, MX
Sunnyvale, CA
RTP, NC, US
Yokohama, JP
Kunshan, CN
Shenzhen, CN
Nantou, TW
Hsinchu, TW
Taipei, TW
Long Island, New York, US
Shanghai, CN
Jinqiao, CN
Shanghai, CN JQ
Paris, FR
USI Worldwide Locations
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The “Internet of Things” The next big thing in the industry?
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Aerospace Thousands Units
Mainframe Millions Units
PC (PM) 350M+ Units
Cell Phone (PP) 1.8B+ Units
Smart
Computing
(PMP) 10B+ Units
Internet of
Things (IOT)
(PMMP) 100B+ Units
Exponential
Connectivity &
Big Data
1970s 1980s 1990s 2000s 2010s
Long Tail
We are here
Volume Paradigm: 10X in 10Y, accelerating
2020s
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IoT is a not a market, it’s a tech trend
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IoT is a not a market, it’s a tech trend
Home Heating Automation
Home Smart Lighting
Connected Car
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Low power wireless module vendors
16
Texas Instruments, Silicon
Laboratories, Freescale, Atmel,
Microchip, Renesas, GreenPeak,
NXP
CSR, Texas Instruments, Nordic
Semiconductor, ST Microelectronics,
Broadcom
Nordic Semiconductor,
Texas Instruments
Microchip, Redpine
Signals, GainSpan,
Ozmo
Sigma Designs
Rohm, Texas Instruments
DSP Group, Dialog
Semiconductor, Lantiq
SPORTS & FITNESS
HOME AUTOMATION
ENERGY
HARVESTING
WEARABLES
SMART ENERGY
Which RF comm standard will prevail for
IoT Applications?
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Home Heating Automation: Technology & Architecture (Option 1)
17
3 G
3 G
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Home Heating Automation: Technology & Architecture (Option 2)
18
3 G
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Home Heating Automation: Technology & Architecture (Option 3)
19
3 G
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Home Heating Automation: Supply Chain
20
Router
Thermostat Consumer Electrician
Internet
Service
Provider
Telecom
Service
Provider
Heating
System
Mobile
Phone
Energy
Provider
British Gas
Kelag
RWE
…
?
?
OS
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Do you remember how and when mobile telephony soared?
21
1982-1987
EU agreements
develop and deploy
a common cellular telephone
system across Europe,
GSM to become a mandatory
standard
1987-1990
“Groupe Spécial Mobile” is placed
under ETSI (European
Telecommunications Standards
Institute). First specification is
released. Extension from 900MHz
to 1800MHz.
1990-1995 Networks are deployed by main telecommunication
companies in Europe. GSM becomes “Global System for Mobile
communications”
1995 commercial launch
subscription business model
1995-2000 Strong growth of the European electronics industry
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System integration packaging challenges for “smart lighting”
22
H
System in
Package ?
Wireless
Connectivity
LED
Packaging
Sensor
Packaging
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The connected car opportunities
23
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SiPs or Modules?
or SiPs in Modules?
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What is an SiP Module?
SiP module is a package that contains an electronic
system or sub-system and is miniaturized through IC
assembly technologies.
Miniaturized
Module Package
Electronic System
Functionality
IC Assembly Technology
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Conformal Shielding -RF EMI Shielding
Compartment Shielding -Pkg. Internal RF EMI Shielding
AoP (Antenna on Package) -Antenna Integration for 2.4G/5G/60GHz
IPD and Embedded SBS -Integrated Passive Devices -EDS & EPS
Thermal Enhancement Irregular Cu-Pillar -Thermal Dissipation
WLP -Bare die package -SMT
Stacked Die / Pkg -Flip Chip & Wire Bond
SMT -Passives -Connectors -Rigid or Flex
SiP Module Technologies
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SoC to SiP/SiM Evolution Technology complexity vs. system complexity
Device Package
Module System
3D IC
APU, Memory
2.5D IC
FPGA, GPU, NPU
RF / FEM Connectivity
Camera
Projector
Biometric
Headset
SmartWatch Fitness
PMU
IC Developer
Driven
System OEM
Driven
Card Reader
SiP
SiM
ASE Confidential
SSD
MEMS
27
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SiP / Module Comparison
SiP Module
Technology
definition
Use of either
W/B or flip
chip or IC
embedding.
“one package
solution”
SMT soldering
Business
model
definition
Service
assembly and
test
Service
assembly and
test or
branded
products
Components
are
Consigned by
customer
Purchased by
module
assembler
Supply chain
& product
liability
Lower higher
Issues
–test liability and the known good
die issue
–System liability and test of the
system
Why not reinvent SiP so as to use SiP technologies following the Modules business model? Or any combination of the 2?
Will only be possible with standardization (catalog products)
Will be low cost when high volumes
28
new ways are possible
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ASE Group’s agile business models
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SiP value mapping
30
Above chart from Sony Tsugio Makimoto and Infineon Grit Sommer (2005)
In many cases, systems are made of a weighted mix of SoC, SiP and SoB
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Where (for which App) does SiP make sense?
IoT main segments vehicles buildings wearable industrial
cars trucks trains, ships homes offices
commercial
public buildings (airports
, hospitals
) watches glasses infrastructure utilities
equipment
Need for miniaturization
Need for low power for autonomy
(connected or not to the grid)
High volumes (scaling effect for
lower cost)
ASiP value add
31
SiP not a ubiquitous solution for IoT
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Miniaturisation does not matter for smart home ?
tailor-made furniture object … $$$
cost of a router that does not spoil the look … ?
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The upstream supply chain From components to hardware Can a single company make it all?
33
Modularization
Standardization
Partnerships
Test and packaging
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Trend of Modularized Subsystems
Flexible Scalable
cost & security
Time-to-
market
Eco-mobius by
ZTE
Project Ara by
puzzlephone by
puzzlephone
Concept by
Phonebloks
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ASE SiP packaging roadmap
35
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SiP Module Roadmap for system integration
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SiP Module Roadmap for miniaturization
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SiP Module Roadmap advanced process
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Test innovation and challenges
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Test challenges
Systems require system functional testing of the system –Is self testing (BIST) the solution?
–Why not use the radio stages of the system under test to
perform RF testing?
Less contacts are needed to the external world
Invent the SUT concept (System Under Test) as opposed to DUT (Device Under test)
If sensors, specific handlers are needed
Multiple sensors in a system is becoming the norm –Complete environmental handlers are needed
For example Pressure, temperature, humidity, CO, CO2 sensors in a single device
Test cost to enable scaling
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Bringing down testing costs (multi-row) QFN strip testing Strip/panel testing consists in performing final test in parallel on all the devices on a strip or panel before final singulation
Needed Investments: strip handlers and testers
Some additional process steps, but the throughput benefits offset the amortization costs
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A specific flow
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Molding
Post-mold
cure
Half-cut
Strip test
Smart
marking
Singulation
FVI
Molding
Post-mold
cure
Final test
marking
Singulation
FVI
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Conclusion
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Conclusion
IoT is not a market. It is a tech trend, in many different industrial sectors, each
one with a specific supply chain. To make these segments boom does not depend on us. This will primarily require political will, industry standardization efforts, and determined leaders:
–IoT = many opportunities for the European industry! But European companies should partner, not compete against one another
Application software, services and usability are key
SiP will offer value for some of these opportunities only, and will only be cost-effective for high volumes (tens of millions annual units)
–Modularization of the systems will contribute to the scaling effect reaching
the billions units order of magnitude
Most Packaging and Test Technologies are here (hardware is ready, unless software!). But we can prepare ourselves to “the big hit” –Standardization of package interfaces for modularization
–Battery integration
–Just like packaging, test should be brought cost-effectively up to the system-level
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Thank You
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