Download - Samsung-HT-E453 .pdf
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Digital Home TheaterSystemModel Name HT-E453K
Model Code HT-E453K/XL
SERVICE MANUALDigital Home Theater System
HT-E453K
Contents
1. Precaution
2. Product Specification
3. Disassembly and Reassembly
4. Troubleshooting
5. PCB Diagram
6. Schematic Diagram
Refer to the service manual in the GSPN (see the rear cover) for more information.
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Contents
Contents
1. Precaution........................................................................................................................................ 1 1
1.1. Safety Precautions ................................................................................................................... 1 1
1.2. Servicing Precautions ............................................................................................................... 1 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 4
2. Product Specification ......................................................................................................................... 2 1
2.1. Product Feature ....................................................................................................................... 2 1
2.2. Specifications.......................................................................................................................... 2 2
2.2.1. HT-ES420 Specifications .............................................................................................. 2 2
2.2.2. HT-E45*/HT-E55* Specifications ................................................................................... 2 4
2.3. Specifications Analysis ............................................................................................................. 2 8
2.4. Accessories ............................................................................................................................ 2 11
2.4.1. Supplied Accessories ................................................................................................... 2 11
3. Disassembly and Reassembly .............................................................................................................. 3 1
3.1. Overall Disassembly and Reassembly .......................................................................................... 3 1
4. Troubleshooting ................................................................................................................................ 4 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 1
4.1.1. No Power................................................................................................................... 4 2
4.1.2. No Sound (waveform when 1 KHz, -20 dB signal is input) .................................................. 4 3
4.1.3. Composite (Video Out)................................................................................................. 4 5
4.1.4. No HDMI .................................................................................................................. 4 8
4.2. Measures to be taken when the Protection Circuit operates............................................................... 4 10
4.2.1. Power Protection ......................................................................................................... 4 10
4.3. Initialization & Update ............................................................................................................. 4 11
4.3.1. MICOM Initial............................................................................................................ 4 11
4.3.2. MICOM Update .......................................................................................................... 4 11
4.3.3. Checking out MICOM & MPEG flash Version .................................................................. 4 12
4.3.4. DVD flash Initialization & Update ................................................................................. 4 13
4.4. Buyer-Region Code Setting Method ............................................................................................ 4 15
4.4.1. Inserting the Region Code after replacing the Main PCB..................................................... 4 15
5. PCB Diagram ................................................................................................................................... 5 1
5.1. Wiring Diagram....................................................................................................................... 5 1
5.2. MAIN PCB Top ...................................................................................................................... 5 2
5.2.1. Pin Connection ........................................................................................................... 5 3
5.2.2. Test Point Wave Form .................................................................................................. 5 4
5.3. MAIN PCB Bottom.................................................................................................................. 5 5
5.4. SMPS PCB Top....................................................................................................................... 5 6
5.4.1. Pin Connection ........................................................................................................... 5 7
5.5. SMPS PCB Bottom.................................................................................................................. 5 8
i Copyright 1995-2012 SAMSUNG. All rights reserved.
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Contents
6. Schematic Diagram ........................................................................................................................... 6 1
6.1. Overall Block Diagram ............................................................................................................. 6 1
6.2. FRONT VFD.......................................................................................................................... 6 2
6.3. USB/KARAOKE MIC.............................................................................................................. 6 3
6.4. POWER BLOCK..................................................................................................................... 6 4
6.5. LOADER............................................................................................................................... 6 5
6.6. MAIN MPEG PART................................................................................................................. 6 6
6.6.1. Test Point Wave Form .................................................................................................. 6 7
6.7. MAIN MICOM AND TUNER ................................................................................................... 6 8
6.8. AV I/O AND FAN ................................................................................................................... 6 9
6.8.1. Test Point Wave Form .................................................................................................. 6 10
6.9. MAIN AMP ........................................................................................................................... 6 11
6.9.1. Test Point Wave Form .................................................................................................. 6 12
6.10. SMPS-1 ................................................................................................................................. 6 13
6.11. SMPS-2 ................................................................................................................................. 6 14
Copyright 1995-2012 SAMSUNG. All rights reserved. ii
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1. Precaution
1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazardssuch as electrical shock and X-rays.
1.1. Safety Precautions
1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the controlknobs and the compartment covers.
2) Make sure that there are no cabinet openings through which people (particularly children) can make contact withdangerous internal components.
3) Design Alteration Warning : Never alter or add to the mechanical or electrical design of the unit.Example : Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, anydesign changes or additions will void the manufacturers warranty.
4) Leakage Current Hot Check Figure 1.1 AC Leakage Test :
WARNING
Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complieswith American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and UnderwritersLaboratories (UL Publication UL1410, 59.7).
With the unit completely reassembled, plug the AC cord directly into a 120 V AC outlet. With the units power switchedfrom the ON to the OFF position, measure the current between a known ground and all exposed metal parts.Known Grounds - EarthKnown Metal parts - Screwheads, Metal Cabinets, etc.
DEVICEUNDER
TEST
LEAKAGECURRENT TESTER
TEST ALL EXPO SED METAL
SURFACES
2-WIRE C ORD
ALSO TEST WITH PLUG REVERSE D
(USING AC ADAPTER PLUG AS R EQUIRED)
EARTH GROUND
(READINGSHOULD NOT BE ABOVE 0.5m A)
Figure 1.1 AC Leakage Test
1-1 Copyright 1995-2012 SAMSUNG. All rights reserved.
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1. Precaution
5) Insulation Resistance Cold Check :(1) With the units AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.(2) Set the power switch to ON.(3) Measure the resistance between the shorted AC plug and any exposed metallic parts.
Example : Screwheads, Metal Cabinets, Antenna Port, etc. If any of the exposed metallic parts has a return path tothe chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measuredresistance should be infinite. If the resistance is outside these limits, a shock hazard might exist.See Figure 1.2 Insulation Resistance Test
AntennaTerm ina l
ohm
Expo se dMeta l Pa rt
Ohmmeter
Figure 1.2 Insulation Resistance Test
6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced withparts that meet the original specifications. Always determine the cause of damage or overheating, and correct anypotential hazards.
7) Observe the original lead dress, especially near the following areas :Antenna wiring, sharp edges, and especially the AC and high voltage power supplies. Always inspect for pinched,out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check theAC power cord for damage. Make sure that no wires or components touch thermally hot parts.
8) Product Safety Notice :Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visualinspection. These safety features and the protection they give might be lost if the replacement component differs fromthe originaleven if the replacement is rated for higher voltage, wattage, etc.
9) Components that are critical for safety are indicated in the circuit diagram by shading, or .Use replacement components that have the same ratings, especially for flame resistance and dielectric strengthspecifications. A replacement part that does not have the same safety characteristics as the original might createshock, fire or other hazards.
Copyright 1995-2012 SAMSUNG. All rights reserved. 1-2
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1. Precaution
1.2. Servicing Precautions
1) Servicing precautions are printed on the cabinet. Follow them.
2) Always unplug the units AC power cord from the AC power source before attempting to :(a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect atest component in parallel with an electrolytic capacitor.
3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elementsto their original position.
4) After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure thatthe portion around the serviced part has not been damaged.
5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels,input terminals and earphone jacks).
6) Insulation Checking Procedure :Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of theAC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)should be greater than 1 megohm.
7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless allsolid-state heat sinks are correctly installed.
8) Always connect a test instruments ground lead to the instrument chassis ground before connecting the positive lead;always remove the instruments ground lead last.
CAUTION
First read the Safety Precautions section of this manual. If some unforeseen circumstance creates a conflict between theservicing and safety precautions, always follow the safety precautions.
1-3 Copyright 1995-2012 SAMSUNG. All rights reserved.
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1. Precaution
1.3. Precautions for Electrostatically Sensitive Devices (ESDs)
Some semiconductor (solid state) devices are easily damaged by static electricity.Such components are called Electrostatically Sensitive Devices (ESDs).Examples include integrated circuits and some field-effect transistors.The following techniques will reduce the occurrence of component damage caused by static electricity :
1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from yourbody by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove itprior to applying powerthis is an electric shock precaution.)
2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to preventaccumulation of electrostatic charge.
3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.
5) Use only an anti-static solder removal device. Many solder removal devices are not rated as anti-static (these canaccumulate sufficient electrical charge to damage ESDs).
6) Do not remove a replacement ESD from its protective package until you are ready to install it.Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminumfoil or other conductive materials.
7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective materialto the chassis or circuit assembly into which the device will be installed.
8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, orlifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
Copyright 1995-2012 SAMSUNG. All rights reserved. 1-4
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2. Product Specification
2. Product Specification
2.1. Product Feature
Crystal Sound
Speaker Protection / Enhancing Credibility
Front Firing Subwoofer
The front subwoofer design as a firing. The duct hall set on the front will make the volume stronger and look better.
Voice Canceling
Voice Cancel function add, that mean cancelling the voice of the original singer automatic.
2-1 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
2.2. Specifications
2.2.1. HT-ES420 Specifications
Basic Specification
Weight2.3 Kg
5.07 Ibs
Dimensions430 (W) x 61 (H) x 242 (D) mm
16.9 (W) x 2.4(H) x 9.5 (D) inches
Operating TemperatureRange
+5 C to +35 C
+41 F to +95 F
General
Operating Humidity Range 10 % to 75 %
Signal/noise ratio 60 dB
Usable sensitivity 10 dBFM Tuner
Total harmonic distortion 1 %
Reading Speed : 3.49 ~ 4.06 m/sec.DVD
(Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
Reading Speed : 4.8 ~ 5.6 m/sec.CD : 12 cm / 5 inches
(COMPACT DISC) Maximum Play Time : 74 min.
Reading Speed : 4.8 ~ 5.6 m/sec.
Disc
CD : 8 cm / 3 1/2 inches
(COMPACT DISC) Maximum Play Time : 20 min.
DVD : 576i/480i (America : 480i)Video Output Composite Video
1 channel : 1.0 Vp-p (75 load)
Video/Audio HDMI 1080p, 1080i, 720p, 576p/480p (America : 480i)
Front speaker output 167 W x 2 (3 )
Subwoofer speaker output 166 W (3 )
Frequency response 20 Hz ~ 20 KHz
S/N Ratio 65 dB
Channel separation 60 dB
Amplifier
Input sensitivity (AUX) 800 mV
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-2
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2. Product Specification
HT-ES420 Speaker Specification
2.1ch speaker systemSpeaker system
Front Subwoofer
Impedance 3 3
Frequency range 140 Hz ~ 20 kHz 20 Hz ~ 160 Hz
Output sound pressurelevel
86 dB/W/M 88 dB/W/M
Rated input 167 W 166 W
Maximum input 334 W 332 W
Dimensions
(W x H x D)
Front : 68.5 x 471 x 90 mm (stand base : 162 x 162)
Subwoofer : 168 x 350 x 285 mm
Speaker
WeightsFront : 1.44 Kg
Subwoofer : 3.67 Kg
NOTE
Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
Weight and dimensions are approximate.
Design and specifications are subject to change without prior notice.
For the power supply and Power Consumption, refer to the label attached to the product.
2-3 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
2.2.2. HT-E45*/HT-E55* Specifications
Basic Specification
Weight2.3 Kg
5.07 Ibs
Dimensions430 (W) x 61 (H) x 242 (D) mm
16.9 (W) x 2.4(H) x 9.5 (D) inches
Operating TemperatureRange
+5 C to +35 C
+41 F to +95 F
General
Operating Humidity Range 10 % to 75 %
Signal/noise ratio 60 dB
Usable sensitivity 10 dBFM Tuner
Total harmonic distortion 1 %
Reading Speed : 3.49 ~ 4.06 m/sec.DVD
(Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
Reading Speed : 4.8 ~ 5.6 m/sec.CD : 12 cm / 5 inches
(COMPACT DISC) Maximum Play Time : 74 min.
Reading Speed : 4.8 ~ 5.6 m/sec.
Disc
CD : 8 cm / 3 1/2 inches
(COMPACT DISC) Maximum Play Time : 20 min.
DVD : 576i/480i (America : 480i)Video Output Composite Video
1 channel : 1.0 Vp-p (75 load)
Video/Audio HDMI 1080p, 1080i, 720p, 576p/480p (America : 480i)
Front speaker output 167 W x 2 (3 )
Center speaker output 165 W (3 )
Surround speaker output 167 W x 2 (3 )
Subwoofer speaker output 167 W (3 )
Frequency response 20 Hz ~ 20 KHz
S/N Ratio 65 dB
Channel separation 60 dB
Amplifier
Input sensitivity (AUX) 800 mV
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-4
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2. Product Specification
HT-E450 / HT-E550 Speaker Specification
5.1ch speaker systemSpeaker system
Front Surround Center Subwoofer
Impedance 3 3 3 3
Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 20 Hz ~ 160 Hz
Output sound pressurelevel
86 dB/W/M 86 dB/W/M 86 dB/W/M 88 dB/W/M
Rated input 167 W 167 W 165 W 167 W
Maximum input 334 W 334 W 330 W 334 W
Dimensions
(W x H x D)
Front : 90 x 140 x 70 mm / 3.54 x 5.5 x 2.75 inches
Surround : 77 x 108 x 70 mm / 3.03 x 4.25 x 2.75 inches
Center : 228 x 77 x 70 mm / 8.97 x 3.03 x 2.75 inches
Subwoofer : 168 x 350 x 285 mm / 6.61 x 13.78 x 11.22 inches (PS-EW2)
Subwoofer : 200 x 390 x 356 mm (PS-EW3)
Speaker
Weights
Front : 0.4 Kg / 0.89 Ibs
Surround : 0.38 Kg / 0. 84 Ibs
Center : 0.49 Kg / 1.01 Ibs
Subwoofer : 3.67 Kg / 7.64 Ibs (PS-EW2)
Subwoofer : 6.06 Kg (PS-EW3)
HT-E453 / HT-E553 Speaker Specification
5.1ch speaker systemSpeaker system
Front Surround Center Subwoofer
Impedance 3 3 3 3
Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 20 Hz ~ 160 Hz
Output sound pressurelevel
86 dB/W/M 86 dB/W/M 86 dB/W/M 88 dB/W/M
Rated input 167 W 167 W 165 W 167 W
Maximum input 334 W 334 W 330 W 334 W
Dimensions
(W x H x D)
Front : 89 x 1053 x 71 mm (stand base : 229 x 229)
Surround : 77 x 108 x 70 mm
Center : 228 x 77 x 70 mm
Subwoofer : 168 x 350 x 285 mm (PS-EW2)
Subwoofer : 200 x 390 x 356 mm (PS-EW3)
Speaker
Weights
Front : 3.16 Kg
Surround : 0.38 Kg
Center : 0.49 Kg
Subwoofer : 3.67 Kg (PS-EW2)
Subwoofer : 6.06 Kg (PS-EW3)
2-5 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
HT-E453H Speaker Specification
5.1ch speaker systemSpeaker system
Front Surround Center Subwoofer
Impedance 3 3 3 3
Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 20 Hz ~ 160 Hz
Output sound pressurelevel
86 dB/W/M 86 dB/W/M 86 dB/W/M 88 dB/W/M
Rated input 167 W 167 W 165 W 167 W
Maximum input 334 W 334 W 330 W 334 W
Dimensions
(W x H x D)
Front : 120 x 612 x 71 mm (stand base : 210 x 210)
Surround : 90 x 141 x 68 mm
Center : 360 x 74 x 68 mm
Subwoofer : 168 x 350 x 285 mm (PS-EW2)
Subwoofer : 200 x 390 x 356 mm (PS-EW3)
Speaker
Weights
Front : 1.8 Kg
Surround : 0.62 Kg
Center : 0.88 Kg
Subwoofer : 3.67 Kg (PS-EW2)
Subwoofer : 6.06 Kg (PS-EW3)
HT-E445 Speaker Specification
5.1ch speaker systemSpeaker system
Front Surround Center Subwoofer
Impedance 3 3 3 3
Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 20 Hz ~ 160 Hz
Output sound pressurelevel
86 dB/W/M 86 dB/W/M 86 dB/W/M 88 dB/W/M
Rated input 167 W 167 W 165 W 167 W
Maximum input 334 W 334 W 330 W 334 W
Dimensions
(W x H x D)
Front : 89 x 1053 x 71 mm (stand base : 229 x 229)
Surround : 89 x 1053 x 71 mm (stand base : 229 x 229)
Center : 228 x 77 x 70 mm
Subwoofer : 168 x 350 x 285 mm (PS-EW2)
Speaker
Weights
Front : 2.93 Kg
Surround : 2.93 Kg
Center : 0.49 Kg
Subwoofer : 3.67 Kg (PS-EW2)
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-6
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2. Product Specification
HT-E455 Speaker Specification
5.1ch speaker systemSpeaker system
Front Surround Center Subwoofer
Impedance 3 3 3 3
Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 20 Hz ~ 160 Hz
Output sound pressurelevel
86 dB/W/M 86 dB/W/M 86 dB/W/M 88 dB/W/M
Rated input 167 W 167 W 165 W 167 W
Maximum input 334 W 334 W 330 W 334 W
Dimensions
(W x H x D)
Front : 89 x 1053 x 71 mm (stand base : 229 x 229)
Surround : 89 x 1053 x 71 mm (stand base : 229 x 229)
Center : 228 x 77 x 70 mm
Subwoofer : 200 x 390 x 356 mm (PS-EW3)
Speaker
Weights
Front : 3.16 Kg
Surround : 3.16 Kg
Center : 0.49 Kg
Subwoofer : 6.06 Kg (PS-EW3)
NOTE
Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
Weight and dimensions are approximate.
Design and specifications are subject to change without prior notice.
For the power supply and Power Consumption, refer to the label attached to the product.
2-7 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
2.3. Specifications Analysis
Model Name HT-E550 / HT-E450 HT-D550
Photo
RMS (10% THD),REF: 1ch
1000 W 1000 W
OutputPower
Output Power (ch)
Front: 167W x 2 (3)
Center: 167W (3)
Rear: 167W x 2 (3)
Subwoofer: 167W (3)
Front : 167W x 2 (3)
Center : 167W (3)
Rear : 167W x 2 (3)
Subwoofer : 167W (3)
HDMI CEC O O
Calliope X X
Deck 1 DISC 1 DISC
DVD Disc Capacity 1 DVD 1 DVD
Front Display 1 Color - VFD 1 Color - VFD
Sleep O O
General
Dimmer O O
CD/CD-R/CD-RW O O
VCD/SVCD X X
DVD/DVD-R/DVD-RW O O
MP3 O O
JPEG Viewer O O
DVD-Audio X X
DVD-OK X X
WMA O O
AVIDivx3.11 ~ Divx5.1, XviD(Except North America)
Divx3.11 ~ Divx5.1, XviDDIVX
WMV V1/V2/V3/V7 V1/V2/V3/V7
CompatibleA/V
SACD X X
WIRELESS O O
USB HOST O O
Anynet Anynet+ Anynet+
iPod X O (iPod over USB)
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-8
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2. Product Specification
Model Name HT-E550 / HT-E450 HT-D550
Photo
Progressive Scan(NT/PAL)
O (Only NTSC) O (Only NTSC)
Logo copy X X
NTSC PAL O O
DVD(Video)
PAL M (Brazil) O O
EQ/DSP 3 Mode / 5 Mode 3 Mode / 5 ModeSoundMode User EQ O O
MP3 Enhance/P.Bass O OSoundEffect GIGA Sound O O
Dolby Digital O O
Dolby ProLogic-II O O
Dolby ProLogic-IIX X X
DTS O O
Dolby Digital EX X X
DTS ES Discrete 6.1 X X
DTS 96/24 X X
THX X X
AudioDecoding
DTS Neo 6 X X
Component X X
Composite X X
S-Video X X
VideoInputs
HDMI In X X
Component O O
Composite O O
HDMI Out O O
S-Video X X
VideoOutputs
SCART Out X X
In X X
Line In O (AUX) O (AUX)
Multi ch Out X X
AudioIn/Out
Out X X
In (Digital In) O (*1) O (*1)OpticalJack Out X X
2-9 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
Model Name HT-E550 / HT-E450 HT-D550
Photo
In X XCoaxialJack Out X X
i-Link X X
Headphone Jack (3.5) X XHeadphone/MIC Jack 2 MIC Jack (6.5) O (Only MIC Buyer) O (Only MIC Buyer)
FM O O
RDS O (Only Europe) O (Only Europe)
AM X O (Brazil Only)Tuner
Preset Memory 15 15
Universal (MBR) O ORemoteKey Key 55 Key 55 Key
Dual Voltage O (Brazil Only) O (Brazil Only)
Type (Sat/Tallboy) Sat / Tall Sat / Tall
Stand O O
Impedance (Sat/Woofer) 3 / 3 3 / 3 Speaker
Active (Powered) S/W X X
Net Weight Set 6.1 Ibs 6.1 Ibs
TIP
O : Feature Included
X : Not Included
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-10
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2. Product Specification
2.4. Accessories
2.4.1. Supplied Accessories
Accessories Item Item code Remark
Batteries (AAA size) 4301-000115
Video Cable AH39-40001V
FM Antenna AH42-00021A
Remote Control AH59-02418A
Users Manual AH68-02443K
HDMI GL39-00121A
Local Samsung Dealer
2-11 Copyright 1995-2012 SAMSUNG. All rights reserved.
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3. Disassembly and Reassembly
3. Disassembly and Reassembly
3.1. Overall Disassembly and Reassembly
CAUTION
Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.
Be sure to carefully read and understand the safety instructions before performing any work as the IC chips onthe PCB are vulnerable to static electricity.
In order to assemble reverse the order of disassembly.
Description Description Photo
1. Disassemble Cover Top.Rear 5 point screws unscrew.: BH 3 * 10 BLACK
CAUTION
Be careful not to make any scratches as you remove them.
2. Disable the Front Panel.
1) Unlock the buckle on the bottom.
11
2) Unlock the both buckle on the side.
3) Pull the front panel out.
2233
Copyright 1995-2012 SAMSUNG. All rights reserved. 3-1
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3. Disassembly and Reassembly
Description Description Photo
3. Disassemble DECK.Screws 3 point and Wire separation.: BH 3 * 8 SLIVER
4. Pull out the wire and 5 screws between PCBs.: BH 3 * 8 SILVER
5. Unscrew the 5 screws on the PCB.: BH 3 * 8 SILVER
6. Disassemble Complete.
3-2 Copyright 1995-2012 SAMSUNG. All rights reserved.
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4. Troubleshooting
4. Troubleshooting
4.1. Checkpoints by Error Mode
Oscilloscope Setting Values Normal Voltage 24 MHz 32.768 KHz
Voltage/DIV 2 V/div 0.5 V/div 0.5 V/div
TIME/DIV 100 ms/div 10 ns/div 5 us/div
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-1
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4. Troubleshooting
4.1.1. No Power
Yes
Yes
Replace Fuse . (FP801S)Check MAIN ASS'Y
- Specia lly check a roundMICOM IC. (Vcc)
Check primary s ide .Fuse (FP801 S) OK?
Check D-DC IC(ICM854) short tes t pin 7
to pin 1, 2, 3 , 4 , 5, 6 , 8 OK(means not sh ort)?
3.4 V Output Check(CNM851, pin 13, 14)
3.4 V ~ 3 .6 V
Replace IC. (ICA801)
Replace FET. (QA801)Check Check FET
(QA801 ) a ll pins are no t sh orted toeach other.
Check Sw itch ing IC (ICA801) short te st p in 8 to
pin 1, 2, 3, 4, 5, 6, 7 OK(means not sh ort)?
YesNo
No
No
No
No
Replace DIODE.(DA855, DM851)
Replace DC-DC IC.(ICM854)
Replace DC-DC IC.(ICM853)
Replace SMPS ASS 'Y.
No
No
Yes
Yes
Yes
Yes
Check D-DC IC (ICM853) short tes t pin 3 to
pin 1, 2, 4, 5 OK(means not sh ort)?
Check DA855, DM851short test Anode to ca thode .
No Power De tecte d(Sta nd by LED OFF)
4-2 Copyright 1995-2012 SAMSUNG. All rights reserved.
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4. Troubleshooting
4.1.2. No Sound (waveform when 1 KHz, -20 dB signal is input)
Check Speakers .(Speaker Change)
Yes
Yes
No
(1)Check JA5 input signals?
(1 khz signa l)
Check MPEG DACoutpout, 80, 81 , 82, 83, 84, 85 , 86, 87
of IC10 ES8398?
Check VD3.3V_PW of IC10?(Pin 8 3)
Check Po wer Lines.(Check IC18)
No Sound
No
YesReplace IC10.
No
Check Ja ck Input.
Check MPEG DACpower.
Check DAC outpu t signa l lines be tween IC10 and IC26, IC 28, IC29.
Check MPEG Ou tput.
* Refer to wave pa ttern ima ge of Fig. 4-1 .
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-3
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4. Troubleshooting
FR RR
CTSW
FLRLFL+
+33 V PGND
SW+CT-CT+SW-
SW-_
TPSW
+_
TPC-
_TP
C+_T
PRR
-_TP
RR+_
TPFR
-_T
PFR
+_TP
RL-_
TPRL
+_TP
SPK_
FL
MGND1
1265
1110
43
8217
FL-
RR+
RR-
FR-FR+
RL-
RL+
JA5
9
-
+
+
-
-
+
+
-
+
-
-
+
FR RR
CTSW
FLRLFL+
+33 V PGND
SW-_
TPSW
+_
TPC-
_TP
C+_T
PRR
-_TP
RR+_
TPFR
-_T
PFR
+_TP
RL-_
TPRL
+_TP
JA5
SW+CT-CT+SW-
SPK_
FL+
FL-
RR+
RR-
FR-FR+
RL-
RL+ MGND1
1265
1110
43
8217
9
-
+
+
-
-
+
+
-
+
-
-
+
* 6.9. MAIN AMP
AC31AC28
AL3
AC32 AC100
AC98
CN6_ OP
AL9
AC101 AC102
AC104
AR55
AC105
AC99
AC33
AC106AR56
AL11
AC103
AR17
AR57
AR18
AC34
AC65
AC107AR78
AC63
AC70
AC69
AR37 AR38
AC67
AL5
AC66
AL7
AC64
AC36
AR70
AC71
AR39
AC68
AC35
AR19
AC7 2
AR40
JA5
31
4
2
CN6 _OP
* 5.2. MAIN PCB Top
(1)
(1)
(1)
4-4 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
4.1.3. Composite (Video Out)
Composite (Video out)
No No
NoYesYes
Replace the IC23 IC.Replace the IC10.
No
Check MPEG Ou tput.
Check JACK Ou tput.
* Refe r to wave pa tte rn image of Fig. 4-2.
* Refe r to wave pa tte rn image of Fig. 4-3.
(1)Check if VDAC output
is measured a t the pin 74of IC10 ES8 398.
Check the CN9 conn ectivity a nd replace
it if necessa ry.
(2)Check if compos ite
video output is me asureda t the CN9.
Check if VDD of3.3 V is measured a t the pin
83, 75, 72 of IC10.Check P13,14 of CN8.
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-5
-
4. Troubleshooting
180
190191
115
8180
156
155
154
153
216215214213212211210209208207206205204203202201200199198197196195194193192
189188187186185184183182181
179178177176175174173172171170169168167166165164163
162
161
160
159
158
157
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
114
113
112
111
110
109
108107106105104103102101100999897969594939291908988878685848382
79787776757473727170696867666564636261605958575655
545352515049484746454443424140393837363534333231302928272625242322212019181716151413121110987654321
IC10
C82
16V
MPD
VREG
OP EN 33OHM 1/16WRMA12_O P
100NF
DGND
UART
_RX
UART
_TX
RTXD
1 1/1
6W4.
7KOH
M
4.7K
OHM
1/16
WRS
TB1
TXD
M_WP#56
ACK
C9
16V
100N
F
DGND
STB
R157 TBCK_OR158 TWS_ O100OHM 1/16W
R1651/16W
100NF16V
390OHMC137
C134C17
100NF
16V 100NF16VTP_MCLK
1/16W100OHM
C13916V100NF
PWM1_L
#89#88
PWM1_RPWM3_R
DGND
PWM2_RPWM2_L
VD3.3VVD3.3V
C23
100N
F16
V
PWM3_L
R139
DGND
C18
10V
10UF
ES8398ASC D
R1871/16W4.7KOHM
R186 4.7KOHM1/16W
1/16W6.8KOHMR170
R169 6.8KOHM1/16W
R1681/16W6.8KOHM
R167 6.8KOHM1/16W
R1661/16W6.8KOHM
R1711/16W6.8KOHM
C124 10V10UF
C125
C40
C39
C38
C129
C12810UF10V10UF10V10UF10V
10UF10V
10V10UF
10V10UF
10UF10V
C132
C123
100N
F16
V
HARC VDD1.35V
DGND
DGND
C4250V27PF27
MH
X3
R159
1/16W33OHM 10
0KOH
1/16
VD33
OP[4]
OP[3]
OP[2]
OP[1]
OP[0]
VS33
OP[5]
OP[6]
OP[7]
VDD
VSS
MCLK
VS33
VD33
PAD_REF
PAD_COMP
PAD_RSET
UDAC
VDAC
VD33VDAC
VS33VDAC
YDAC
CDAC
VD33
DAC_O1L
DAC_O2L
DAC_O2R
VD33ADAC
VS33ADAC
DAC_O3L
DAC_O3R
DAC_O1R
LINE_OL
LINE_OR
VS33AADC
MIC_R
MIC_L
VDDAADC
LINE_IN_R3
LINE_IN_L3
LINE_IN_R2
LINE_IN_L2
LINE_IN_R1
LINE_IN_L1
VD33AADC
VSS
VID_XO
VID_XI
VDD
HDMI_HPD
HDMI_HEAC
HDMI_DSDA
HDMI_DSCL
VS33
VD33
VDD_
DFG
_PL
L
VSS_
DFG
_PL
L
HDM
I_OT
P_VP
P
HDM
I_PG
ND1
HDM
I_PV
CC1
EXT_
SWIN
G
HDM
I_AG
ND
HDM
I_TX
C-
HDM
I_TX
C+
HDM
I_AV
CC
HDM
I_TX
0-
HDM
I_AG
ND
HDM
I_TX
0+
HDM
I_AV
CC
HDM
I_TX
1+
HDM
I_TX
1-
HDM
I_TX
2+
HDM
I_TX
2-
HDM
I_AG
ND
HDM
I_PG
ND2
HDM
I_PV
CC2
HDM
I_CE
C
VSS
VDD
VS33
VD33
SOU
T
SIN
SR[32
]
CLOS
ESW
AMPS
TBY
OPEN
/VO
BS
OPEN
SW
CLOS
E/VO
BS1
VGB
VPBMB
DB MP
FE TE
V165
O
REX
PI
CDLD
DVDL
D
VBO
AGC2
DVDP
D
AGC1
SPN
N
SPN
P
TRO
SLO
FOO
DMO
SLV
MIN
H
F
G
E
D
C
A
B
DRFP
DRFN
VGA
VPA
DRAS1_B
DCS1_B
VSS
DRAS2_B
DMA[10]
DMA[0]
DMA[1]
VDD
DMA[2]
DMA[3]
DMA[11]
DMA[9]
VS33
DMA[8]
VD33
MDA[7]
DMA[6]
SYSCLK
VDD
DMA[5]
VD33
DMA[4]
VREG_FORCE
USB_AGND
USB_DP
USB_DM
USB_VCCA
USB_RREF
USB_VDDA
VDD
VSS
DVCC
AVS33
AVD33
REFD
CDPD
VD33
PLL
VS33
PLL
SPDI
F_IN
SPDI
F_OU
T
VDD
SPI_
DO
DB[11
]DB
[10]
DB[9]
DB[8]
VDD
DB[0]
DB[1]
DB[2]
AUX[
7]VS
S
DB[15
]DB
[14]
DB[13
]DB
[12]
VS33
VD33
RESE
T_B
VS33
VD33
AUX[
3]AU
X[4]
AUX[
5]VD
D
AUX[
6]
SPI_
DI
VSS
SPI_
CLK
SPI_
CS3
SPI_
CS2
AUX[
0]AU
X[1]
AUX[
2]
DQM
VDD
DSC
K
VSS
DWE_
B
DCAS
_B
DRAS
0_B
DSC
0_B
DB[3 ]
VSS
DB[4]
DB[5]
DB[6]
DB[7]
VS33
VD33
16V
OP EN 33OHM 1/16W
100NF
DGND
1/16
W4.
7KOH
M
4.7K
OHM
1/16
W
16V
100N
F
DGND
100OHM 1/16W
1/16W
100NF16V
390OHM
100NF
16V 100NF16V
1/16W100OHM
16V100NF
DGND
VD3.3VVD3.3V
100N
F16
V
DGND
10V
10UF
ES8398ASC D
1/16W4.7KOHM
4.7KOHM1/16W
1/16W6.8KOHM
6.8KOHM1/16W
1/16W6.8KOHM
6.8KOHM1/16W
1/16W6.8KOHM
1/16W6.8KOHM
10V10UF
10UF10V10UF10V10UF10V
10UF10V
10V10UF
10V10UF
10UF10V
100N
F16
V
VDD1.35V
DGND
DGND50V27PF27
MH
1/16W33OHM 10
0KOH
1/16
IC10
C82
VREG
RMA12_O P
UART
_RX
UART
_TX
RTXD
1
RSTB
1
#56
C9
R157R158
R165C137
C134C17
TP_MCLK
C139
#89#88
C23
R139
C18
R187
R186
R170
R169
R168
R167
R166
R171
C124
C125
C40
C39
C38
C129
C128
C132
C123
C42
X3
R159
MPD
TXD
M_WP
ACKSTB
TBCK_OTWS_ O
PWM1_L
PWM1_RPWM3_R
PWM2_RPWM2_L
PWM3_L
HARC
180
190191
115
8180
156
155
154
153
216215214213212211210209208207206205204203202201200199198197196195194193192
189188187186185184183182181
179178177176175174173172171170169168167166165164163
162
161
160
159
158
157
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
114
113
112
111
110
109
108107106105104103102101100999897969594939291908988878685848382
79787776757473727170696867666564636261605958575655
545352515049484746454443424140393837363534333231302928272625242322212019181716151413121110987654321
VD33
OP[4]
OP[3]
OP[2]
OP[1]
OP[0]
VS33
OP[5]
OP[6]
OP[7]
VDD
VSS
MCLK
VS33
VD33
PAD_REF
PAD_COMP
PAD_RSET
UDAC
VDAC
VD33VDAC
VS33VDAC
YDAC
CDAC
VD33
DAC_O1L
DAC_O2L
DAC_O2R
VD33ADAC
VS33ADAC
DAC_O3L
DAC_O3R
DAC_O1R
LINE_OL
LINE_OR
VS33AADC
MIC_R
MIC_L
VDDAADC
LINE_IN_R3
LINE_IN_L3
LINE_IN_R2
LINE_IN_L2
LINE_IN_R1
LINE_IN_L1
VD33AADC
VSS
VID_XO
VID_XI
VDD
HDMI_HPD
HDMI_HEAC
HDMI_DSDA
HDMI_DSCL
VS33
VD33
VDD_
DFG
_PL
L
VSS_
DFG
_PL
L
HDM
I_OT
P_VP
P
HDM
I_PG
ND1
HDM
I_PV
CC1
EXT_
SWIN
G
HDM
I_AG
ND
HDM
I_TX
C-
HDM
I_TX
C+
HDM
I_AV
CC
HDM
I_TX
0-
HDM
I_AG
ND
HDM
I_TX
0+
HDM
I_AV
CC
HDM
I_TX
1+
HDM
I_TX
1-
HDM
I_TX
2+
HDM
I_TX
2-
HDM
I_AG
ND
HDM
I_PG
ND2
HDM
I_PV
CC2
HDM
I_CE
C
VSS
VDD
VS33
VD33
SOU
T
SIN
SR[32
]
CLOS
ESW
AMPS
TBY
OPEN
/VO
BS
OPEN
SW
CLOS
E/VO
BS1
VGB
VPBMB
DB MP
FE TE
V165
O
REX
PI
CDLD
DVDL
D
VBO
AGC2
DVDP
D
AGC1
SPN
N
SPN
P
TRO
SLO
FOO
DMO
SLV
MIN
H
F
G
E
D
C
A
B
DRFP
DRFN
VGA
VPA
DRAS1_B
DCS1_B
VSS
DRAS2_B
DMA[10]
DMA[0]
DMA[1]
VDD
DMA[2]
DMA[3]
DMA[11]
DMA[9]
VS33
DMA[8]
VD33
MDA[7]
DMA[6]
SYSCLK
VDD
DMA[5]
VD33
DMA[4]
VREG_FORCE
USB_AGND
USB_DP
USB_DM
USB_VCCA
USB_RREF
USB_VDDA
VDD
VSS
DVCC
AVS33
AVD33
REFD
CDPD
VD33
PLL
VS33
PLL
SPDI
F_IN
SPDI
F_OU
T
VDD
SPI_
DO
DB[11
]DB
[10]
DB[9]
DB[8]
VDD
DB[0]
DB[1]
DB[2]
AUX[
7]VS
S
DB[15
]DB
[14]
DB[13
]DB
[12]
VS33
VD33
RESE
T_B
VS33
VD33
AUX[
3]AU
X[4]
AUX[
5]VD
D
AUX[
6]
SPI_
DI
VSS
SPI_
CLK
SPI_
CS3
SPI_
CS2
AUX[
0]AU
X[1]
AUX[
2]
DQM
VDD
DSC
K
VSS
DWE_
B
DCAS
_B
DRAS
0_B
DSC
0_B
DB[3 ]
VSS
DB[4]
DB[5]
DB[6]
DB[7]
VS33
VD33
* 6.6. MAIN MPEG PART
BD13
C13 4C13 7
C12 6
R16 5C13 9
R18 7
C132
C40
R18 6
C39C
38
C42
R166
BD15 C49
C51
R8R9
R17
D3
C37
C4 R62
CLOS E_T
INSW_TMGND_T
LOADP_TSLEDN_T
C20 C19R11R13
C1
C61
C69
CN2
C88
R84
R117
C77
C79
C76
C62
C72R10 8
R97
R13 7
C71
C67
R103
R10 5
C31
OP EN_T
OUTSW_ T
LOADN_TSLEDP _T
C86C
87R1
15R1
16
R114
C16
R60
R23
C89
C15
RMA1
2_O
PIC
10
C24
C64C65
C68R56
C80
C74
C82
C84
R57
C12 1
C81
C32
C12 0
C85 L74
C83 L6
R65R70
RR5 0
RC48
C102
R112
C94C90
C92
C98C9
7
R51
R66R71
R73_
OPR2
57_O
P
VC2
R29
R30
R118
R74
R258
C91R26
C101
BD9
OPEN
_C96
_OOP
EN_C
95_O
FUR7
FUR8
FUR9
FUR6
UART_TXVL1
UART_RX
#35
R43
C93
C36
C33C10 5
BD10
C109C
99
FUR5
FUR1
FUR2
C119
C11 1R13 8
D15
C114
R144
R109
C11 2
BD11
C11 3
HR7
BD12C11 5
C148
HR9
FR22
FR2 1R32UC4
R14 9
HC3
C141
R94MRUP1
R64
R69
R140
R141 C11 7
C7
RTXD1
C17
C9
R189
C12 4
C12 8C12 5
C12 3
R154 R15 9
C136
C41R16 4
C135
C18
BD14C11 8
C23C14 0
R13 9
D18
R67
R157R158RSTB 1
I
Q
R
R
HQ
H
IT S
D
9.DCLO AD_N8.DCLO AD_P6.O UTSW7.MGND
3.S LED_N4.S LED_P5.INSW
1.LOADP_DCMO P2.LOADN_DCMON
VC3
IC2
IC10
CN2
* 5.2. MAIN PCB Top
(1)
(1)
(1)
4-6 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
(COMPOSIT E)
AUXR16
330OHM1/16 W
50V
330P
F50
V
DGND
330P
F
AUXC
8
AUXR
18
AUXC
9
DGND
1/16 W330OHM
AUXR15
*0.01OHM
BD19
AVTP
2AV
TP3
AVTP
1
AVTP7
DGND
11 11
MLV
S-06
03-E
08
ESD
D1
11M
LVS-
0603
-E08
D8M
LVS-
0603
-E08
ESD
D2
D5.0V
SPDI
F_IN
1/16
W47
0OHMR3
40
4
765
123
DTP3
CN910V10UF
C257 DTP1
*
0.01O
HM
L45
RFR-
RCA-
3PR
C15750V10PF
C158
L4
50V
150P
F
1.8UH
UNDEFINED
(COMPOSIT E)
330OHM1/16 W
50V
330P
F50
V
DGND
330P
F
DGND
1/16W330OHM
*0.01OHM
DGND
11 11
MLV
S-06
03-E
08
11M
LVS-
0603
-E08
MLV
S-06
03-E
08
D5.0V
1/16
W47
0OHM
10V10UF
*
0.01O
HM
RFR-
RCA-
3PR
50V10PF
50V
150P
F
1.8UH
UNDEFINED
AUXR16
AUXC
8
AUXR
18
AUXC
9
AUXR15
BD19
AVTP
2AV
TP3
AVTP
1
AVTP7
ESD
D1
D8
ESD
D2
R340
DTP3
CN9C257 DTP1
L45
C157
C158
L4
SPDI
F_IN
4
765
123
* 6.8. AV I/O AND FAN
AL1
AC27
AC30 AC31AC28
AC32 AC100TUC1
2_O
PTUC5_ OP
TUR1
3_O
PTU
R14_
OP
TUR9_ OP
TUC1
7_O
P
Q33
C70
C59
D35
C55
C340
TUC9
_OP
TUC1
0_O
P
C342
TUC1
1_O
PTU
C8_
OP R53 4
TUR1
2_O
PTU
R8_O
P
AUXC9
UC13
AUXR18AUXR16
ES DD1
R59
VT1_
OP
CN10
_OP
R53 1
C34 1
R520
Q30
R52 8
R51 5
AUXC8AUXR17
AUXR15
ES DD2
R53 2
Q32
R52 9 R530Q
31 R533
C156
R514
C34
751C851C
L4R3
40
D8 BD19
R52 7
R51 6
WDR11 _OPFAN_TP1_T
FAN_TP2_T
WC44_ OP
L45
C25 7CN9
WR7_O PWR5_O PWR6_O PWR9_O PWR10_ OP
WR1
_OP
WR2_O P
IPC5_ OP
AC29
CN12
WR3
_OP
WR4
_OP
1 2
3
4
TUR99 _OP
CN10_ OP
CN 9CN6_ OP
* 5.2. MAIN PCB Top
(2)
(2)
(2)
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-7
-
4. Troubleshooting
4.1.4. No HDMI
No
No
No
No
Analog (Com posite )Video OK but H DMI out
Replace MPEG IC.
Yes
Yes
Yes
Check Voltag epin 111 pin of IC10?
(1.5 V ~ 1.8 V)
Please , Ca ll to Sams ung A/S Center.Replace MPEG IC.
(1)Check pin
118, 119, 121, 12 2, 124, 1 25,127,128 of IC10?
Check if 480p outputis ok? (720p NG?)
Check PLL3.3V lines andVDD1.2V lines and
R150, R1 51, R152 va lue .
Check HDMI POWER suppl y.(PLL_3.3 V, VDD1.2v)
* Refe r to wave pa tte rn image of Fig. 4-4.
4-8 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
180
190191
115
8180
156
155
154
153
216215214213212211210209208207206205204203202201200199198197196195194193192
189188187186185184183182181
179178177176175174173172171170169168167166165164163
162
161
160
159
158
157
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
114
113
112
111
110
109
108107106105104103102101100999897969594939291908988878685848382
79787776757473727170696867666564636261605958575655
545352515049484746454443424140393837363534333231302928272625242322212019181716151413121110987654321
IC10
C82
16V
MPD
VREG
OPEN 33OHM 1/16 WRMA12_OP
100N F
DGND
UART
_RX
UART
_TX
RTXD
1 1/1
6W4.
7KOH
M
4.7K
OHM
1/16
WRS
TB1
TXD
M_WP#56
ACK
C9
16V
100N
F
DGND
STB
R157 TBCK_OR158 TWS_ O100OHM 1/16W
R1651/16W
100NF16V
390OHMC137
C134C17
100NF
16V 100NF16VTP_MCLK
1/16W100OHM
C13916V100NF
PWM1_L
#89#88
PWM1_RPWM3_R
DGND
PWM2_RPWM2_L
VD3.3VVD3.3V
C23
100N
F16
V
PWM3_L
R139
DGND
C18
10V
10UF
ES8398ASCD
R1871/16W4.7KOHM
R186 4.7KOHM1/16W
1/16W6.8KOHMR170
R169 6.8KOHM1/16W
R1681/16W6.8KOHM
R167 6.8KOHM1/16W
R1661/16W6.8KOHM
R1711/16W6.8KOHM
C124 10V10UF
C125
C40
C39
C38
C129
C12810UF10V10UF10V10UF10V
10UF10V
10V10UF
10V10UF
10UF10V
C132
C123
100N
F16
V
HARC VDD1.35V
DGND
DGND
C4250V27PF27
MH
X3
R159
1/16W33OHM 10
0KOH
1/16
VD33
OP[4]
OP[3]
OP[2]
OP[1]
OP[0]
VS33
OP[5]
OP[6]
OP[7]
VDD
VSS
MCLK
VS33
VD33
PAD_REF
PAD_COMP
PAD_RSET
UDAC
VDAC
VD33VDAC
VS33VDAC
YDAC
CDAC
VD33
DAC_O1L
DAC_O2L
DAC_O2R
VD33ADAC
VS33ADAC
DAC_O3L
DAC_O3R
DAC_O1R
LINE_OL
LINE_OR
VS33AADC
MIC_R
MIC_L
VDDAADC
LINE_IN_R3
LINE_IN_L3
LINE_IN_R2
LINE_IN_L2
LINE_IN_R1
LINE_IN_L1
VD33AADC
VSS
VID_XO
VID_XI
VDD
HDMI_HPD
HDMI_HEAC
HDMI_DSDA
HDMI_DSCL
VS33
VD33
VDD_
DFG
_PL
L
VSS_
DFG
_PL
L
HDM
I_O
TP_
VPP
HDM
I_PG
ND1
HDM
I_PV
CC1
EXT_
SWIN
G
HDM
I_AG
ND
HDM
I_TX
C-
HDM
I_TX
C+
HDM
I_AV
CC
HDM
I_TX
0-
HDM
I_AG
ND
HDM
I_TX
0+
HDM
I_AV
CC
HDM
I_TX
1+
HDM
I_TX
1-
HDM
I_TX
2+
HDM
I_TX
2-
HDM
I_AG
ND
HDM
I_PG
ND2
HDM
I_PV
CC2
HDM
I_CE
C
VSS
VDD
VS33
VD33
SOU
T
SIN
SR[32
]
CLOS
ESW
AMPS
TBY
OPEN
/VOB
S
OPEN
SW
CLOS
E/VO
BS1
VGB
VPBMB
DB MP
FE TE
V165
O
REX
PI
CDLD
DVDL
D
VBO
AGC2
DVDP
D
AGC1
SPN
N
SPN
P
TRO
SLO
FOO
DMO
SLV
MIN
H
F
G
E
D
C
A
B
DRFP
DRFN
VGA
VPA
DRAS1_B
DCS1_B
VSS
DRAS2_B
DMA[10]
DMA[0]
DMA[1]
VDD
DMA[2]
DMA[3]
DMA[11]
DMA[9]
VS33
DMA[8]
VD33
MDA[7]
DMA[6]
SYSCLK
VDD
DMA[5]
VD33
DMA[4]
VREG_FORCE
USB_AGND
USB_DP
USB_DM
USB_VCCA
USB_RREF
USB_VDDA
VDD
VSS
DVCC
AVS33
AVD33
REFD
CDPD
VD33
PLL
VS33
PLL
SPDI
F_IN
SPDI
F_O
UT
VDD
SPI_
DO
DB[11
]DB
[10]
DB[9]
DB[8]
VDD
DB[0]
DB[1]
DB[2]
AUX[
7]VS
S
DB[15
]DB
[14]
DB[13
]DB
[12]
VS33
VD33
RESE
T_B
VS33
VD33
AUX[
3]AU
X[4]
AUX[
5]VD
D
AUX[
6]
SPI_
DI
VSS
SPI_
CLK
SPI_
CS3
SPI_
CS2
AUX[
0]AU
X[1]
AUX[
2]
DQM
VDD
DSCK
VSS
DWE_
B
DCAS
_B
DRAS
0_B
DSC0
_B
DB[3 ]
VSS
DB[4]
DB[5]
DB[6]
DB[7]
VS33
VD33
16V
OPE N 33OHM 1/16 W
100N F
DGND
1/16
W4.
7KOH
M
4.7K
OHM
1/16
W
16V
100N
F
DGND
100OHM 1/16W
1/16W
100NF16V
390OHM
100NF
16V 100NF16V
1/16W100OHM
16V100NF
DGND
VD3.3VVD3.3V
100N
F16
V
DGND
10V
10UF
ES8398ASCD
1/16W4.7KOHM
4.7KOHM1/16W
1/16W6.8KOHM
6.8KOHM1/16W
1/16W6.8KOHM
6.8KOHM1/16W
1/16W6.8KOHM
1/16W6.8KOHM
10V10UF
10UF10V10UF10V10UF10V
10UF10V
10V10UF
10V10UF
10UF10V
100N
F16
V
VDD1.35V
DGND
DGND50V27PF27
MH
1/16W33OHM 10
0KOH
1/16
IC10
C82
VREG
RMA12_OP
UART
_RX
UART
_TX
RTXD
1
RSTB
1
#56
C9
R157R158
R165C137
C134C17
TP_MCLK
C139
#89#88
C23
R139
C18
R187
R186
R170
R169
R168
R167
R166
R171
C124
C125
C40
C39
C38
C129
C128
C132
C123
C42
X3
R159
MPD
TXD
M_WP
ACKSTB
TBCK_OTWS_ O
PWM1_L
PWM1_RPWM3_R
PWM2_RPWM2_L
PWM3_L
HARC
180
190191
115
8180
156
155
154
153
216215214213212211210209208207206205204203202201200199198197196195194193192
189188187186185184183182181
179178177176175174173172171170169168167166165164163
162
161
160
159
158
157
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
114
113
112
111
110
109
108107106105104103102101100999897969594939291908988878685848382
79787776757473727170696867666564636261605958575655
545352515049484746454443424140393837363534333231302928272625242322212019181716151413121110987654321
VD33
OP[4]
OP[3]
OP[2]
OP[1]
OP[0]
VS33
OP[5]
OP[6]
OP[7]
VDD
VSS
MCLK
VS33
VD33
PAD_REF
PAD_COMP
PAD_RSET
UDAC
VDAC
VD33VDAC
VS33VDAC
YDAC
CDAC
VD33
DAC_O1L
DAC_O2L
DAC_O2R
VD33ADAC
VS33ADAC
DAC_O3L
DAC_O3R
DAC_O1R
LINE_OL
LINE_OR
VS33AADC
MIC_R
MIC_L
VDDAADC
LINE_IN_R3
LINE_IN_L3
LINE_IN_R2
LINE_IN_L2
LINE_IN_R1
LINE_IN_L1
VD33AADC
VSS
VID_XO
VID_XI
VDD
HDMI_HPD
HDMI_HEAC
HDMI_DSDA
HDMI_DSCL
VS33
VD33
VDD_
DFG
_PL
L
VSS_
DFG
_PL
L
HDM
I_O
TP_
VPP
HDM
I_PG
ND1
HDM
I_PV
CC1
EXT_
SWIN
G
HDM
I_AG
ND
HDM
I_TX
C-
HDM
I_TX
C+
HDM
I_AV
CC
HDM
I_TX
0-
HDM
I_AG
ND
HDM
I_TX
0+
HDM
I_AV
CC
HDM
I_TX
1+
HDM
I_TX
1-
HDM
I_TX
2+
HDM
I_TX
2-
HDM
I_AG
ND
HDM
I_PG
ND2
HDM
I_PV
CC2
HDM
I_CE
C
VSS
VDD
VS33
VD33
SOU
T
SIN
SR[32
]
CLOS
ESW
AMPS
TBY
OPEN
/VOB
S
OPEN
SW
CLOS
E/VO
BS1
VGB
VPBMB
DB MP
FE TE
V165
O
REX
PI
CDLD
DVDL
D
VBO
AGC2
DVDP
D
AGC1
SPN
N
SPN
P
TRO
SLO
FOO
DMO
SLV
MIN
H
F
G
E
D
C
A
B
DRFP
DRFN
VGA
VPA
DRAS1_B
DCS1_B
VSS
DRAS2_B
DMA[10]
DMA[0]
DMA[1]
VDD
DMA[2]
DMA[3]
DMA[11]
DMA[9]
VS33
DMA[8]
VD33
MDA[7]
DMA[6]
SYSCLK
VDD
DMA[5]
VD33
DMA[4]
VREG_FORCE
USB_AGND
USB_DP
USB_DM
USB_VCCA
USB_RREF
USB_VDDA
VDD
VSS
DVCC
AVS33
AVD33
REFD
CDPD
VD33
PLL
VS33
PLL
SPDI
F_IN
SPDI
F_O
UT
VDD
SPI_
DO
DB[11
]DB
[10]
DB[9]
DB[8]
VDD
DB[0]
DB[1]
DB[2]
AUX[
7]VS
S
DB[15
]DB
[14]
DB[13
]DB
[12]
VS33
VD33
RESE
T_B
VS33
VD33
AUX[
3]AU
X[4]
AUX[
5]VD
D
AUX[
6]
SPI_
DI
VSS
SPI_
CLK
SPI_
CS3
SPI_
CS2
AUX[
0]AU
X[1]
AUX[
2]
DQM
VDD
DSCK
VSS
DWE_
B
DCAS
_B
DRAS
0_B
DSC0
_B
DB[3 ]
VSS
DB[4]
DB[5]
DB[6]
DB[7]
VS33
VD33
* 6.6. MAIN MPEG PART
BD13
C13 4C13 7
C12 6
R16 5C13 9
R18 7
C132
C40
R18 6
C39C
38
C42
R166
BD15 C49
C51
R8R9
R17
D3
C37
C4 R62
CLOS E_T
INSW_TMGND_T
LOADP_TSLEDN_T
C20 C19R11R13
C1
C61
C69
CN2
C88
R84
R117
C77
C79
C76
C62
C72R10 8
R97
R13 7
C71
C67
R103
R10 5
C31
OP EN_T
OUTSW_T
LOADN_TSLEDP _T
C86C
87R1
15R1
16
R114
C16
R60
R23
C89
C15
RMA1
2_O
PIC
10
C24
C64C65
C68R56
C80
C74
C82
C84
R57
C12 1
C81
C32
C12 0
C85 L74
C83 L6
R65R70
RR5 0
RC48
C102
R112
C94C90
C92
C98C9
7
R51
R66R71
R73_
OP
R257
_OP
VC2
R29
R30
R118
R74
R258
C91R26
C101
BD9
OPEN
_C96
_OOP
EN_C
95_O
FUR7
FUR8
FUR9
FUR6
UART_TXVL1
UART_RX
#35
R43
C93
C36
C33C10 5
BD10
C109C
99
FUR5
FUR1
FUR2
C119
C11 1R13 8
D15
C114
R144
R109
C11 2
BD11
C11 3
HR7
BD12C11 5
C148
HR9
FR22
FR2 1R32UC4
R14 9
HC3
C141
R94MRUP1
R64
R69
R140
R141 C11 7
C7
RTXD1
C17
C9
R189
C12 4
C12 8C12 5
C12 3
R154 R15 9
C136
C41R16 4
C135
C18
BD14C11 8
C23C14 0
R13 9
D18
R67
R157R158RSTB 1
I
Q
R
R
HQ
H
IT S
D
9.DCLO AD_N8.DCLO AD_P6.O UTSW7.MGND
3.S LED_N4.S LED_P5.INSW
1.LOADP_DCMOP2.LOADN_DC MON
VC3
IC2
IC10
CN2
* 5.2. MAIN PCB Top
(1)
(1)
(1)
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-9
-
4. Troubleshooting
4.2. Measures to be taken when the Protection Circuit operates
4.2.1. Power Protection
The Condition of Power Protection Active.
1) Voltage of SMPSs PVDD is higher or lower than Standards Normal Condition Voltage Range: PVDD about (+18 V ~ +33 V)
2) Over-current occurs to AMP IC (Over-output or Output short)
3) AMP ICs temperature exceed 150
4) The power of GVDD is higher or lower than 12 V
4-10 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
4.3. Initialization & Update
4.3.1. MICOM Initial
No Disc status, keep pressing STOP key on the remote controller about 5 seconds, the system will be initialized.(INIT and M INIT displayed, and the system will be turned off.)
4.3.2. MICOM Update
1) Prepare or Make a DISC-CD or DVD or USB that contains E450WWM.SSP file for update.
2) Play the DISC or USB, then UPDATE will appear on the screen, then Power will go out after showing completeon the screen.
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-11
-
4. Troubleshooting
4.3.3. Checking out MICOM & MPEG flash Version
1) On home menu, go to setup.
2) Go to support which is the last category on the list.
3) Go to contact Samsung and enter.
4) You can see the Flash Firmware Version on the screen, and see the Micom Firmware Version on the VFD Display (set).
4-12 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
4.3.4. DVD flash Initialization & Update
1) Prepare a DISC-CD or DVD or USB that contains D550WWB.ROM file for Update.
2) Play the DISC or USB, then UPDATE will appear on the screen, then Power will go out and on.
3) Then DISC-TRAY will OPEN, then remove the DISC or USB, making the Unit as NO DISC state.
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-13
-
4. Troubleshooting
4) Press STOP button of the remote controller for more than 5 seconds, Display Indicator shows INIT andM INIT then Power goes out.
5) Initialization complete.
4-14 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
4.4. Buyer-Region Code Setting Method
4.4.1. Inserting the Region Code after replacing the Main PCB
NOTE
When replacing the Main PBA and System Micom should be inserted the region code.
The set is not working properly if you don't insert the region code.
The region code is inserted by the remote control.
1) Press the FUNCTION' and Audio Assign button on the remote control and go to AUX ANALOG mode.
FUNCTIONTV SOURCE POW ER
1 2 3
RECEIVER SLEEP
DVD TV
2) Press the "TUNER MEMORY" button on the remote control during 4~5 seconds.
A B C D
P.BASS GIGADIMMER S.VOL
AUDIOUPSCALE
S/W LEVEL MO/ST USB REC TUNER
MEMORY
TOOLS
EXIT
INFO
RETURN
3) After step (2), you can see TEST on the VFD.
4) When you see TEST on VFD, Insert number 4, 6 to start Region Code setting mode.
TEST
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-15
-
4. Troubleshooting
5) After step (4), you can see on the VFD.Insert the Region Code (Below table) corresponding model with 0 ~ 9 buttons on the remote control.
6) After step (5), you can see 15 USA on the VFD.It means that currently System Micom program is installed by USA specification.
15 USA
7) Turn the Power off.
NOTE
In case of System Micom and EEPROM problem, you can apply to this.
For example, during Updating program of System Micom, if Updating fail is happened, it is impossible to turn on the systemfrom stand-by status.
The system will keep the stand-by status continuously, and the touch-key function will never work.
In this case, you have to change System Micom, and set up the Buyer Region code again. In case of EEPROM, you don'tneed to care about it.After set-up the Region code, System Micom will store the information of the region code to EEPROMautomatically.
4-16 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
Table 4.1 HT-E45* / HT-E55* 5.1CH Option Table
Region Code Area
00 Nigeria
01 Brazil
02 CANADA
03 China (semi_mic)
04 Europe
05 Indonesia
06 JAPAN
07 KOR
08 Latin American
09 Mexico
10 Philippines
12 Russia (semi_mic)
13 M.E.Africa
14 Taiwan
15 USA
16 NewZealand
17 England
18 Australia
19 Iran (HACO)
20 India
21 Israel
22 Saudi Arabia
23 Thailand, Malaysia
24 Vietnam, Singapore
25 HONGKONG
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-17
-
4. Troubleshooting
Table 4.2 HT-E420 2.1CH Option Table
Region Code Area
30 Nigeria
31 Brazil
32 CANADA
33 China (semi_mic)
34 Europe
35 Indonesia
36 JAPAN
37 KOR
38 Latin American
39 Mexico
40 Philippines
42 Russia (semi_mic)
43 M.E.Africa
44 Taiwan
45 USA
46 NewZealand
47 England
48 Australia
49 Iran (HACO)
50 India
51 Israel
52 Saudi Arabia
53 Thailand, Malaysia
54 Vietnam, Singapore
55 HONGKONG
4-18 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
5. PCB Diagram
5. PCB Diagram
5.1. Wiring Diagram
oo
xx oo
xx oo
x
x
o
o
o
o
o
o
o
o
x
x
o
o
o
o
o
o
oo
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-1
-
5. PCB Diagram
5.2. MAIN PCB Top
BD13
C134C137
C126
R165C139
R187
C132
C40
R186
C39C
38
C42
R166
BD15 C49
C51
R153
R151
R150
AC10
9
AC5 A
R7AR
6
AR8
AC134
AC12
51RA52CA
AL1
AC27
CS_IC4_TOPIC4
C138
D17
Q20
R300
Q23R308_OPR310_OPR320
R170
R167
R168R169
C129
UC27
X3
KR1_
OP
AR9
ABD2
R20
AC7AC6
AR16
AC9
AC8
AC26
AC30 AC31
SDA_
IC16
_TO
PIC1
6R3
29R3
22
GND_
IC16
_TOP
UC10
R171AR20
AR23AR25
R47
R48
R95
R96
R106UR27
R73
UR98_OP
UR15 UR25
KC22
_OP
KR25
_OP
KQ2_
OP
AR13
0AR
10AR
49
AR50
AC90AC89
AR51
AC88
AC94
AC28
KFCN
4_OP
WP_
IC16
_TOP VCC_IC16_TOP
UR35UR10UR11
UR22
UR20UR4
UC11
UC12
AR21AR22AR24
UR62
UR53
UC17
UR5
UR57
R49
R163
R145R155
KC1_
OPKC
28_O
P
KR11
_OP
KR2_
OP
KR20
_OP
KQ3_
OP
KC27
_OP
UC19
UC22
R68
R1010
C1010
AR52
AC14
1
AC87AC84
AC95
AL3
AC32
SCL_
IC16
_TOP
UR23 UR
3
UR9
UC9
UR84
IC15
UR59
2UR
18
KR10
_OP
KR3_
OP
UR69
AC93ABD5
BD1
AC73
AC91 AC74AR43
IC28
AC142
AC85
AC100
KC12_OP
UR17UR41 R
55
RSR1
UR101
IC18
AR42AC140
AC75
AC92
AC143
AC82
AC98
CN6_OP
KIC1_OP
UR65UR66X2
UD10UQ4
UR60
1
UR48
UR49
RCEC
1RC
EC2
ST3. 4
C146
C201
AR41
AR11
7AC
871
AC77
AR44
AR46
AR47
AC76
AR53
AC144
AC83
AC96
AC22
AL9
AC101 AC102
AC104
AR55
AC105
KFCN3_OP
KC10_OP
UR70
D4
UC23
R160_OPUR4
6UR
59
BD3
C609L73BD16
C149
BD7B
D5_
OP C1
42C1
44C1
45
C202
BD5
BD8
AR48
AR60
AR61R5
4
AC78
AC81
AC80
AC97
AR54
AC99
AC33
AC106AR56
KC6_OPBD19_OP
UR71
Q8
Q9C131
C154C6
08
AC135ABD
6AR
31AR
32
AC79 AC55
33RA95CA
35CA
AL11
AC103
AR17
AR57
UC16
KC4_OPKC7_OP
UR54
UC28
UR85
UR45
UR89
UR51UR52UR92
UC21
C130
C73
C75
C607
L1
C147BD17
ABD3
AR73
AC57
AC58
AC54AC56
AC137
AC49
AC50
AR18
AC34
R180
KC8_OPKC9_OP
UC15R124
R81
IC17
R127R40
UR94
A_OP
R142
UR31
UR81
R133R
134
R136
UR91
R132
BD20
3.3O
N C43
C52
C110
C127
C165
VT2
R77R83
C153BD6
L5
Q7 Q6
AR72
AR71
AC39
AC37AC38
IC26
AC13
1
AC15
AC60
AR34
AC65
AC107AR78
FFD1
C172
BR2
R46R38
R24
C56
C57
C60BD2
IC5
IC1
C171
R162
D7
AC41D1AR
26AR
74
AR27
AC40
AC138
AC47
AC63
AC70
AC69
AR37 AR38
IC11
USB
C6 D11
D19
C54
D2
C29
VC1
C100
C104
C44
C47
R156
R82
R126
R130
R7 R131
AR28
AR29 AR30
ABD4
R35
AC43AC42
AR35 AC139
AC45
AC48
AC61
AC67
AL5
AC66
BC2 B
R1BC
3R4
1
C53
Q10
C96
R161
C95
R179
R174
C170
R173
C63
R1285TP2_T
AC44
AC62
AR36
AC51
AL7
AC64
AC36
AR70
AC71
AR39
R129
D16
D12
C48
T1
Q11R147R146
5TP8_T5TP14_T 1
5TP19_T
CN8
AC68
AC35
AR19
AC72
AR40
JA5
SW7
D10
RSTG
ND_
TOP
RESE
T_TO
PVD
D_TO
P
UR140UR141
R3R12
D9
C133
R80
R148
761C 661C961C 861C
5TP17_T
5TP15_T
5TP18_T
5TP14_T
5TP4_T1
5TP4_T
5TP1_T1
5TP1_T
5TP3_T
UC7UR77 UR24
C8R14
R4TUC20_OPTUR6_OP
CN11
KC21_OPKR19_OP
UR10
6AR1R2
IC7
R6R22
R15
R5
C25
C30 R39
R42
R33
Q3
R44
Q4R45R52R6
3
R37
R31
C78R111R113
R110R98
TUR7
_OP
TUR1
00
CN3
C159
R178
KR5_
OP
KR26
_OP
UR10
7A
R76
R28 R
36
R25
L2
C28
Q2C3
5C2
7R6
1Q5
R34
C66R102
R107R99
D21
AUX1C1AUX1R3
AUX1
R1
AUX1C2AUX1R4
R18
C2R16
R21R27
D6
Q1 L3
R93
R101
R104R100
C4
R206
IC24
R203
R78
R200
D22
VFD
C162
R175
AUX1
R2
R8R9UR1
06
R17
D3
C37
C50
C46R
72 R75
R62
R87
R88R92
R86
C45
DVDLDO_T
RF50V_T1
IC8
C3 C5
FOCUS_P_TTRACK_N_T
CD_LDO_TCD_VR_T
C306
R53
R125R1
0R5
0
Q17
C152
C58Q18
D23
BD4
R19
CLOSE_T
INSW_TMGND_T
LOADP_TSLEDN_T
C20 C19R11R13
DVDVR_T
F_TMVREF_T
A_TC_T
SW_T
TUR16TUC13_OP
TUR1
7_OP
TUR1
1_OPTU
X1_O
PTU
C2_
OPTU
C1_
OP
IC9_
OPTU
R18_
OPTL
1_OP
R58
C11
C1
C61
C69
CN2
CN1
AR16
2AC
811BD
18
TUC6
_OP
TUC7
_OP
TUC14_OP
TUR1
0_OP
TQ2_
OP
C21
C22
C88
R84
R117
C77
C79
C76
C62
C72R108
R97
R137
C71
C67
R103
R105
C31
OP EN_T
OUTSW_T
LOADN_TSLEDP_T
C86C
87R1
15R1
16
R114
PUHRF_T
DGND_TRF50V_T
B_TD_TE_T
FOCUS_N_TTRACK_P_T
DGND_T1MPD_T
TUC1
2_OP
D14
D13
TUC5_OP
TQ1_
OP
TUR1
3_OP
TUR1
4_OP
TUR9_OP
TUC1
7_OP
TUC1
6_OP
CLK_IC4_TOP
VD33_IC4_TOP
IC2C12
C13
C14
C16
R60
R23
C89
C15
RMA1
2_O
PIC
10
C24
C64C65
C68R56
C80
C74
C82
C84
R57
C121
C81
C32
C120
C85 L74
C83 L6
Q33
C70
C59
D35
C55
C340
TUC9
_OP
TUC1
0_OP
C342
TUC1
1_OP
TUC8
_OP R534
TUR1
2_OP
TUR8
_OP
AUXC9
UC13
AUXR18AUXR16
ES DD1
R59
VT1_
OP
CN10
_OP
GND_TOP
DI_IC4_TOPDO_IC4_TOP
CS3_TOP
UESD
1
R65R70
RR50
RC48
C102
R112
C94C90
C92
C98C9
7
C160
R531
C341
R520
Q30
R528
R515
AUXC8AUXR17
AUXR15
ES DD2
KR12_OP
VFIC1
R51
R66R71
R73_
OPR2
57_
OP
VC2
R29
R30
R118
R74
R258
C91R26
C101
BD9
C161
OPEN
_C96
_OP
OPEN
_C95
_OP
C103
R119
R121
AC601
AR90
R532
Q32
R529 R530Q
31 R533
C156
R514
C34
751C851C
L4R3
40
D8 BD19
R143
FUR7
FUR8
FUR9
FUR6
UART_TXVL1
UART_RX
#35
R43
C93
C36
C33C105
BD10
C109C
99
R50_OP
C108
C107
R120
R122
R309
_O
P
C106
R123
R135
AR11
AR12
AC17
AC52
AC16
AC23
AR13
AC136
R527
R516
WDR11_OPFAN_TP1_T
FAN_TP2_T
WC44_OP
L45
C257CN9
FUR5
FUR1
FUR2
C119
C111R138
D15
C114
R144
R109
C112
BD11
C113
HR7
BD12C115
C148
HR9
HR4HC1
HC2
HR1
HR2
HR3
HR5
AC130
AC21
AR3
AC19AC18
AC24
AR14
UC43
UC29
FZD2
FR22
FR2 1R32UC4
R149
HC3
C141
HR8 HIC1
HR6
AC20 ABD1
AC1
AC132
AC10AC
13
WR7_OPWR5_OPWR6_OPWR9_OP
WR10_OP
WR1
_OP
WR2_OP
IPC5_OP
UC30A
R94MRUP1
R64
R69
R140
R141 C117
C7
RTXD1
C17
C9
R189
C124
C128C125
C123
R154 R159
C136
C41R164
C135
C18
BD14C118
C23C140
C122
R139
R152HC4 C116
AC3AC2
AR1
AC4
AR4
AR2
IC29
AC145
AC13
3
AC86
AC29
CN12
WR3
_OP
WR4
_OP
IC3
D18
R67
R157R158RSTB1
2 1
1 2
31
42
J
J
1.KEY_AD2.RMC3.P _ON4.DGND5.R12V6.N127.N128.DGND9.DGND
10.ST 3.4V_P W11.ST 3.4V_P W
12.VAR_P OWER _REF
14.PGND15.PGND16.PGND
13.R12V
17.PGND18.+3319.+3320.+3321.+3322.FA NET_RX23.FA NET_TX
F
I
AB
Q
R
R
23.RF5.0V
19.DVDVR21.DVDLDO
18.GND20.NC22.PUHRF
17.MVREF16.RF5.0V
11.C13.A15.F
12.D14.E
7.TRACK_N
9.FOCUS_P
6.FOCUS_N
8.TRACK_P10.B
3.CDLDO
5.SW(CD/DVD)
2.MPD4.DGND
1.CDVR
HQ
H
I
T
T S
D
S
K
AB
C
E
K
D
G
N
C
G F
E
N
DIP/S
MD
B
DATE:2011. 12. 10REV:00
CODE:AH41-014 81A
SIZE:247X168 /1.6 T
MODEL:HT_E550 /E450/E42 0 MAIN PC B
9.DCLOAD_N8.DCLOAD_P6.OUTSW7.MGND
3.SLED_N4.SLED_P5.INSW
1.LOADP_DCMOP2.LOADN_DCMON
B
C26
UR10
7
TUR99_OP
C10
VC3
KQ1_
OP
C143
UC18
UR16
UD3
CN11
IC2
IC4
IC1 0IC1 5
KFCN_OPVCC_IC_TOP
IC1
CN8
IC2 9 IC2 8 IC2 6
CN2
CN1
CN3 CN 10_OPCN9
CN6 _OP
TP3
TP2
TP1
(1)
(2)
TP2
(3)
5-2 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
5. PCB Diagram
5.2.1. Pin Connection
1) CN1
Connecting between MAIN and DECK
Pin No. Signal
1 CDVR
2 MPD
3 CDLDO
4 DGND
5 SW
6 FOCUS_N
7 TRACK_N
8 TRACK_P
9 FOCUS_P
10 B
11 C
12 D
13 A
14 E
15 F
16 RF5.0V
17 MVREF
18 DGND
19 DVDVR
20 NC
21 DVDLDO
22 PUHRF
23 RF5.0V
2) CN2
Connecting between MAIN and DECK
Pin No. Signal
1 LOADP_DCMOP
2 LOADN_DCMON
3 SLED_N
4 SLED_P
5 INSW
6 OUTSW
7 MGND
8 DCLOAD_P
9 DCLOAD_N
3) CN8
Connecting between MAIN and SMPS
Pin No. Signal
1 KEY_AD
2 RMC
3 P_ON
4 DGND
5 R12V
6 N12
7 N12
8 DGND
9 DGND
10 ST3.4V_PW
11 ST3.4V_PW
12 VAR_ROWER_REF
13 R12V
14 PGND
15 PGND
16 PGND
17 PGND
18 +33V
19 +33V
20 +33V
21 +33V
22 FANET_RX
23 FANET_TX
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-3
-
5. PCB Diagram
5.2.2. Test Point Wave Form
TP1 TP2 TP3
5-4 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
5. PCB Diagram
5.3. MAIN PCB Bottom
TP7 TP5
CDLD
TP8
MOCTL_P
TP2
CLOSE
INSW
LOADP
SLEDN
DVDLDO
MVREF
FOCUS_P
TRACK_N
CD_VRCD_LDO
V_3
V_4
F
DVDVR
C
A
FOCUS_NTRACK_P
V_5
V_6 V_7
OPENOUTSW
SLEDPLOADN
PUHRF
DGNDRF50V
D
E
B
MPD
T_SDIO
TUNER_R
GPIO2
V_8 V_9
V_10
VREG
T_RST
TCLK
T_SEN
TUNER_L
AVTP1
V_11
V_12 V_13
AVTP2
AVTP7
V_14 V_15
V_16
#138
AVTP3
DTP3
V_17
V_18
#137
DTP1
V_19
V_20 V_21
W_ENTW_ID
V_22 V_23
V_24
#88
TP_MCLK
#89
AC86
W_TSD1W_TBCK
V_25
V_26 V_27
#56
W_TWS
V_28 V_29
V_30
CS_IC4_BOT
CLK_IC4_BOT
DO_IC4_BOTDI_IC4_BOT
FAN_TP1
FAN_TP2
W_CLKW_DATA
W_RESET
TP4
SDA_IC16_BOT
VD33_IC4_BOTGND_BOT
VCC_IC16_BOT
WP_IC16_BOT
GND_IC16_BOT
W_5V
K4
SCL_IC16_BOT
M_
JIG_4
M_
JIG_6
M_
JIG_3
M_
JIG_5
K1
M_
JIG_2
M_
JIG_1
AC22
U_RESET_P
RESET_BOT
FL+_TP
RL-_TP
ADC_DIADC_RESET
FL-_TP
K3
RSTGND_BOTVDD_BOT
C+_TP
RL+_TP
C-_TP
SW-_TP
USB_VCC
TP3
AC51
SW+_TP
USB_GND
USB_N
USB_P
5TP15
5TP8
5TP19
5TP25TP1
FR-_TP
5TP16
5TP4
5TP3
FR+_TP
RR+_TP
RR-_TP
5TP17
TP1
5TP14
XRF
FL+
RL-
FL-
RL+
CENTER+
SW-
CENTER-
SW+
FR-
RR+
FR+
RR-
SW
5TP18
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-5
-
5. PCB Diagram
5.4. SMPS PCB Top
F_R MC851
J871
SW856
X803
EY822
SW855FC852
J869
J851
SW854
SW853
SW852
X802
SW851
CA810
RA804 RA803
528YE428YE
QA801
RA811CA806
ICA801
J80 7
J80 8
LM856CM866
J85 2
LED851
LM854 J85 5
J854
FBM
851
EY820J81 4
J81 3
FBA801
EY823
EY821
DA803
DA804
RA805
CA811
CA821
J*
CA808
CY895 SICM891
J80 6
J80 5
DM854
DM853
CM859
CM870 LM855
CNM851
CN M851
CM868 J85 7
EY815 EY819
CNM802
J8 01
SA801S
J811J812
J8 15J8 16
EY818
EY828
EY816EY817
CA801CA820
EY851
TM891S
CM856
CM858
DM851
LM852
LM853
TM892S
J862
J8 59J8 58
J860
EY810
CX803S EY811
EY803
EY827
EY829
LX802S
NT801SBD801
CY89
3S
EY852
J867LM851
EY856
EY831
EY832
LA851
ICM853
J861
CY892S
EY809
CX802S
EY812
EY806
EY804
EY808
CX801SLX801S
EY855
ZDM851 DA855J868
ICM852
CM854
CM853
DA852DA851 DA854
J864
J881
J863
CA852
CY891S
PD801S
X801
EY801 EY802
FP 801S
RX801S VX801S
J865
J872J873
EY854
CA853
CA854
DA853
J8 75
CA851
FA_NET
1
34
4
32
1
E B
OG
I
2
C
LUG
2
1
12
2
23
1
LUG
LUG
LUG
LUG
LUG
22
Input Voltag e o ption
110 V220 VDual
CNM802J80 1O XX XX O
If LED on, S MPS 3 .4V OK
CNM851
6.34V
13.AL_3.4V
14.AL_3.4V
19.PC_12V
22.IR
23.AD
9.GND10
.GND
11.PC12V
12.VPS
5.34V 7.GND 8.GND
4.34V
17.AL_12V
15.GND
16.GND
18.AL_12V
20.GND
21.P-ON
1.FA_TX 2.FA_RX 3.34V
agai nst risk of fire re place onlysame type an d ra tings of fus e
CAUTIONFor cont inue d pr otec tion aga inst
T5AH250VFUSE TESTPOI NT
VOL
+PW
RPLA
YVO
L-STOP
FUN
C
AH94-02833AAH94-02832AAH94-02831A
E-PA
SS
2011-12-01 REV:00
HT-E450 SMPS P CB
SAMSUNG VD GVVPCB code : AH4 1-01479A
(1)
5-6 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
5. PCB Diagram
5.4.1. Pin Connection
1) CNM851
Connecting between MAIN and SMPS
Pin No. Signal
1 FA_TX
2 FA_RX
3 34V
4 34V
5 34V
6 34V
7 GND
8 GND
9 GND
10 GND
11 PC12V
12 VPS
13 AL_3.4V
14 AL_3.4V
15 GND
16 GND
17 AL_12V
18 AL_12V
19 PC_12V
20 GND
21 P_ON
22 IR
23 AD
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-7
-
5. PCB Diagram
5.5. SMPS PCB Bottom
FR856
FR855
F_RMC851
FR857
FVA851
FR853J871
SW856
X803
FR858
FC851
EY822
SW855
FC852
J869
J851
FR854 SW854
SW853
RM864
RM866
RM867
RM862
RM863
FR852
CM860
CM861
CM869
ICM854
SW852
X802
RM865
RM868
FR851 CM863
CM862
CM864SW851
RA804 RA803
J814J813
EY824 EY825
CA810
QA801
RA807RA806
RA809
RA808 RA802
TRA801
CA809
CA805 CA804
DA801
DA805
ZDA802
RA811
CA806
ICA801
J807
J808
CM866
CM865
RA801
RA810
RM869
CA807
DM855
J855
J8 52
FBM851
LM856
LED851
LM854
J854
EY821
EY82