Agenda Wide Bandgap Devices and Applications Short Course
Nov. 7-‐9, 2017 PowerAmerica Offices, 930 Main Campus Dr., Suite 200, Raleigh, NC
Tuesday, Nov. 7 8 AM-‐8:30 AM Registration/Breakfast/Opening Remarks 8:30 AM–10:15 AM Power GaN Transistor Design Fundamentals and Application
David Reusch, EPC 10:15 AM-‐10:30 AM Break 10:30 AM-‐11:15 AM Power GaN Transistor Design Fundamentals and Application
David Reusch, EPC 11:15 AM-‐12:30 PM Practical Implementation of SiC MOSFETs for Power Converter
Design David Levett, Infineon
12:30 PM-‐1:15PM Lunch 1:15 PM-‐2:15 PM Practical Implementation of SiC MOSFETs for Power Converter
Design David Levett, Infineon
2:15 PM-‐2:30 PM Break 2:30 PM-‐4:00 PM Introduction to WBG Module Packaging and Impact on Circuit
Design Doug Hopkins, N.C. State University
4:00 PM-‐4:10 PM Break 4:10 PM-‐5:30 PM Introduction to WBG Module Packaging and Impact on Circuit
Design Doug Hopkins, N.C. State University
Wednesday, Nov. 8 8:00 AM-‐8:15 AM Breakfast 8:15 AM-‐9:15 AM Introduction to WBG Module Packaging and Impact on Circuit Design
Robert Shawn, Wolfspeed 9:15 AM-‐9:30 AM Break 9:30 AM-‐10:20 AM MV Fast Charger System Specification, Design Requirements
Srdjan Lukic, N.C. State University 10:20 AM-‐10:30 AM Break 10:30 AM-‐11:20 AM WBG SiC Inverter for Electric and Hybrid Vehicles
Iqbal Husain, N.C. State University 11:20 AM-‐11:30 AM Break
POWERAMERICANext Generation Power Electronics Manufacturing Innovation Institute
11:30 AM-‐12:20 PM High Voltage SiC Power Device Characterization and Converter Applications Subhashish Bhattacharya, N.C. State University
12:20 PM-‐1:00 PM Lunch 1:00 PM-‐5:30 PM Packaging Lab Module
Fab and Testing Lab Module Applications Lab Module Attendees will be divided into three groups and rotate through three teaching modules
1:00PM-‐2:30PM 2:30PM-‐4:00PM 4:00PM-‐5:30PM Group A Packaging lab module Fab lab module(2:30PM-‐3:00PM)
Testing lab module(3:15PM-‐3:45PM) System lab module
Group B Fab lab module(1PM-‐1:30PM) Testing lab module(1:45PM-‐2:15PM)
System lab module Packaging lab module
Group C System lab module Packaging lab module Fab lab module(4PM-‐4:30PM) Testing lab module(4:45PM-‐5:15PM)
6:00 PM-‐8:30PM Networking Dinner Reception
Thursday, Nov. 9 8:00 AM-‐8:30 AM Breakfast 8:30 AM-‐9:00AM SiC Bulk Substrate: Advantages, Challenges and Solutions
Elif Balkas, Wolfspeed 9:00 AM-‐9:40 AM SiC Epitaxial Technology
Al Burk, Wolfspeed 9:40 AM-‐9:50 AM Break 9:50 AM-‐11:20 AM SiC Design, Fabrication, Roadmap and Cost Analysis
Victor Veliadis, PowerAmerica 11:20 AM-‐11:30 AM Break 11:30 AM-‐12:30 PM Wide Bandgap Testing Techniques
Teja Kothamasu, Keysight Technologies 12:30 PM Adjourn
