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13-12-2016
DTU DanchipNational Center for Micro- and Nanofabrication
DTU DANCHIP
DTU Cen
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13-12-2016
Facts and figures
0
5000
10000
15000
20000
25000
30000
35000
40000
45000
50000
2015201420132012201120102009
Registered
tool time (Hou
rs)
Year
C
B
A
Total machine usage Danchip
x3
• 500 registered users
• 80 total staff, 15 research staff, 7PhD stud.
• 77 peer reviewed publications (2015) with DCH/CEN staff directly involved (authored/co-authored); 6 publications in Nature Publishing Group
• Used by 15 departments and 4 Centers of Excellence (Grundforskningscentre)
• 20 companies
• 170 ext. financed research projects with budgeted activities in Danchip/Cen last 5 years
Key numbers
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13-12-2016
Facts and figures - Total usage CEN (2015)
0
500
1000
1500
2000
2500
Registrerede
timer
DTU brug af Cen
Cat D Cat E27%
69%
4%
"Low end" mikroskopibrug (Cat D)6273 timer
Cen DTU udover Cen Kommerciel
69%
27%
4%
"High end" mikroskopibrug (Cat E)7709 timer
Cen DTU udover Cen Kommerciel
50%46%
4%
Total mikroskopibrug (Cat D+E)13981 timer
Cen DTU udover Cen Kommerciel
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Fraction of access to cleanroom
40%
31%
9%
9%
8%3%
DTU NanotechDTU FotonikDTU RemaningNILt AcademicCommercialCopenhagen University
4
Data collected from November 1st 2015 to November 1st 2016.Danchip operational access has been removed from dataset.Cap is not in effect.Total access in the period: 34134 hours
Facts and figures
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Top 20 of personnel cleanroom access0 100 200 300 400 500 600 700 800
Lasse ThamdrupSushil Tandukar
Dmitrii ViazmitinovAnders Simonsen
Hitesh SahooMaksim Zalkovskij
Hoa ThanhYi Zheng
William TiddiEvgeniy Shkondin
Artem ShikinAndrej Mironov
Maksym PlakhotnyukIlja Czolkos
Aurimas SakanasLi Lin
Kristian HagstedSøren Petersen
Xiaowei GuanPedram Sadeghi
5
Data collected from November 1st 2015 to November 1st 2016.Danchip operational access has been removed from dataset.Cap is not in effect.Total access in the period: 34134 hours
Facts and figures
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13-12-2016
A more thorough introduction to cleanroom processing
Training engineers - not operators
Prevent downtime and accidents through understanding and insight
scheduled tool package training (TPT)
Preparation,E-learning material
Including :Basic theory on the specific technology, tool manual, video of tool operation
Classroom tool specific theory run through: specific properties of the respective tools,
possible outcomes, typical mistakes
and how to detect and avoid those
Tool training at the tool in small groups
If needed: Individual 2. tool
training and ”driving license
test” at the machine
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13-12-2016
Tool package training (TPT) - StatusLithography
in place v1.0 (3h theoretical, 2 (1) practical training session(s), monthly
aim for: more electronic material, 1h theoretical, 1 practical training session, bi-weekly
SEM training
from January 2017: 3h theory 2h practical training at SEM basement 346
Mask design
from February 2017: 6-8 participants, distributed course over 2 weeks
Dry etch training
from February 2017: 3h theory, 2h practical training
Soon: Thin Film TPT
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13-12-2016
New clean room access procedure
….faster, more efficient….
a better start into the cleanroom
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13-12-2016
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13-12-2016
New clean room access procedure
Introduction:Student/postdoc signs on:
- Supervisors Email (supervisor is cc’ed)
- Project type
- Projectnumber (for labmanager)
- Teaching goals
- Expected cleanroom time
- A short project description
- A possible meeting time danchip/supervisor/student
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13-12-2016
New cleanroom access procedure
Student/postdoc get the software/e-learning package
- Theoretical safety course is E-learning (video + PP with speak)
- Instructions how to use Labmanager/Labadviser
- Access to Labmanager test site
- Exercises on usage of Labmanager/Labadviser
- Online Test on safety in cleanroom pass/fail
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13-12-2016
New cleanroom access procedure
Student/postdoc has passed and gets access to book practical safety course
- At least once a week
- Limited to 4 participants
- Includes chemistry handling, gowning, etc
- Ends with a second test pass/failed
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13-12-2016
New cleanroom access procedure
Student/postdoc has passed and books a launch meeting with Danchip and supervisor
- Process flow walk through
- Training plan, TPT, individual training
- Possible new APVs, special materials, special chemistry
- Setup regular meetings
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Professor in Silicon nanofabrication Henri Jansen started 1 nov 2016
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Danchip Technology Research
Diamond
Together with DTU Physics
Material Platform for many applications
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Danchip Technology Research
Plasma etch of Si with aspect ratio higher than 70
Material Platform for many applications
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Danchip Technology ResearchIce lithography
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Danchip Technology Research
Integrated inductor coils
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Soft matter electron microscopy
Strategic frame
characterization
not just imaging
useful for the ”wet” sciences
No professor this round….
Looking for a senior associate professor
try to exploit synergies with
possibilities at Danchip
make use of the
existing toolpark
with few but significant
additions
Acquired a used BioTwin (FEI Tecnaioptimised for soft matter microscopy)
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Oneview Camera(since July 2016)
High speedcamera
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Nanoparticle melting - Platinum• 5nm particle• Fully melting at 1020ºC• Surface melting ~750ºC
Thomas W. Hansen
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Nanoparticle melting - Platinum• 5nm particle• Solidifying at approx 800ºC
Thomas W. Hansen
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High Pressure Holder (January 2017)• DensSolution Climate S3+
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High Pressure Holder (January 2017)• DensSolution Climate S3+• https://youtu.be/5kn-71sEP48• Surface oscillation of Cu nanoparticle• Direct imaging of real-time dynamics of a catalyst Cu nanoparticle at atomic resolution (350°C,
500 mBar mixed N2+H2+O2 gas flow).
• Dr. M. Willinger & Dr. R. FarraFritz-Haber-Institute, Germany
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New (second hand) TEM (April 2017)
Manufacturer FEI
Model Tecnai 12 Bio-Twin
Emitter LaB6(or W)
Resolution 0.49 nm (point)
Acceleration voltage 40 - 120 kV
Camera Orius
Objectivelens
Cs 6.3 mmCc 5.0 mm
120 kV TEM (FEI Tecnai 12)120 kV TEM especially for soft-matter analysis.FEI Tecnai 12 Bio-Twin Information Card
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FACILITY
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Clearing out the cleanroom ghettos
• III-V will move out of A-5 (”III-V lab”)• Better, shared facilities in ballroom and E-4 & E-5• More open, sharing community• Graphene activities will move to cleanroom with
standard processes
27 13.12.2016
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New cleanroom
order
28 13.12.2016
Wet proces-sing and fume hoods
”Clean” Litho-graphy
E-beam
FringetoolsIm
prin
t. S
U8,
cl
uste
r2,
SEM
Furn
ace,
PVD
, Pl
asm
a
6” furn
MOVPE
Ste
pper
Com
mer
cial
, ALD
etc
.
Plas
ma
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Ballroom with new fume hoods and wet benches
29 13.12.2016
KOH
BHF
KOH
Nitride
7UP wafers
7UPmasks
BHF
Polyetch
Aletch
Optionaletch
Acetone
IPA
Lift-off
IPA
Techno-Franz
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The vision has become reality Behold, the brave new fume hood world is here
30 13.12.2016
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Time schedule for fume hoods and wet benches in Ballroom• 8 fume hoods for ballroom
– Most fume hoods released
• 7 Wet benches for ballroom– KOH wet bench: Expected release 15-Feb-2017– Nitride etch: Expected release 15-Jan-2017– Resist strip & lift-off: Expected release: 2017Q1– 7-Up wafers & masks: Delivery 15-Dec-2017. Expected release: 2017Q1– BHF etch, HF etch & Poly etch: Delivery 15-Dec-2017. Expected release 2017Q1
• 2 spinner wet benches + 1 cleaning fume hood for E-5 (litho)– Delivery: 15-Dec-2016– Expected release: 2017Q2
31 13.12.2016
Idea Users Funds Tender Contract FAT SAT Manual Released
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Equipment Tetris – moving stuff around and installing new things – plan per December 2016
32 13.12.2016
SüssGamma 4M spinner
SSE
Tool Moves to Date
New wet benches D-3 Nov-Dec 2016
Last old wet benches in D-3 Trash Dec 2016
Old wet benches in C-1 Trash Once newbenches ready
New spinner wet benches E-5 Dec 2016
Heidelberg MLA100 E-5 Jan 2017
New spinner for 2/4/6”UV and e-beam resist E-5 June 2017
Thermal evaporator April 2017
Table-Top SEM Basement January 2017
Diamond CVD (B-1) Apr 2017
Pegasus 2 A-1 Feb-Apr 2017
III-V fume hoods Trash
Nanoscribe 2PP Fotonik Dec 2016
Old wet benches in D-3 Trash Dec 2016
New wet benches D-3 Dec 2016
Spinner benches
Pegasus 2Diamond CVD
2 PP
Inclined UV
Thermal evaporator
EVG
620
Spin track
Old wet benches & fume hoods
Heidelberg
MLA 100
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Tools leaving the cleanroom• SSE Maximus. Has been shut down• SVG spin track. Replaced by Gamma 4M• Nanoscribe 2 photon polymerization. Will go to DTU Fotonik• Old wet benches in Ballroom (replaced by new benches and fume hoods)• Wet benches in C-1 (old yellow room)
– Replaced by new wet benches in Ballroom– Will stay until new benches are ready
• SIMS (no replacement – use external services)• PECVD-2 (replaced by PECVD-4)• Cryofox (already transferred to TI)
33 13.12.2016
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E-beam column service • 13 February 2017 to 27 February 2017• New calibration files needed afterwards• Improved spot size in field corners
34 13.12.2016
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NEW TOOLS
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New bonder tool• Pre-align in KS MA-6 aligner• Released for use• Standard processes established• No user editing of recipes• No samples smaller than 10x10 mm2
• Extra sample holder is being ordered
36 13.12.2016
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New 2/4/6” coater for e-beam and UV• 4/6” coater station
– AZ5214E– MIR 701– AZ 4562– Syringe dispense– EBR
• 2” coater station– CSAR
• Flexible tool• Potential backup for other Gamma spinners• Transfer to Gamma platform complete
– Easier training– Easier process transfer– Easier maintenance
37 13.12.2016
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New imprint tools• The blue and the white NIL
• CNI 1.5 and 2.0 from NILT
• Alignment not possible
• Heating up to 280 deg. C
38 13.12.2016
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Heidelberg maskless aligner
Idea Users Funds Tender Contract FAT SAT Manual Released
• UV LED illumination, 365 nm(can expose all g-, h-, and i-line photoresists)
• Minimum feature size: 1 µm (on 0.5 µm resist)• Linewidth variation, 3σ: 200 nm• Alignment accuracy, 3σ: 1 µm• Maximum substrate size: 6” x 6”• Minimum substrate size: 5 x 5 mm²• Maximum write area: 125 x 125 mm²• Substrate thickness: 0.1 to 6 mm• Average writing time: Ca. 4 hours for 4” wafer• Grey scale exposure possible
(Process development needed)• Suitable for rapid prototyping• Unsuitable for many wafers• NO mask making! There is no business case.
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plasma/thermal ALD from Picosun
Idea Users Funds Tender Contract FAT SAT Manual Released
Key features
- Highly flexible ALD system, thermal & plasma-ALD
- Stacked substrates (pieces – 8” wafers)
- ”Work horse” as well as new capabilities
- New chemistries, e.g. for metals and metal nitrides
- Low temperature processes
Accepted – being prepared for release January 2017
Processes (so far)
- Al2O3 , TiO2 , HfO2 , SiO2
- AlN , TiN
- acceptance tests on planar substrates and trench structures
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Idea Users Funds Tender Contract FAT SAT Manual Released
• SiO / SiN / SiON / BPSG / (Ge doped)
• Including stress-tuning capability
• Refurbished SPTS system (2011)
PECVD-4Replacement for PECVD-1/2
Installation “almost” done
- Initial functional tests done
- Started processing tests (undoped SiO2)
- Toxic lines (B2H6 and PH3) need running in
- Process transfer from PECVD-2 from Q1
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Pegasus 2 + happy Roy
Idea Users Funds Tender Contract FAT SAT Manual Released
• Background: – Bottleneck situation on Pegasus 1– Backup system & research
• 2nd hand system being installed
• Expected release around March-April 2017
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Idea Users Funds Tender Contract FAT SAT Manual Released
Key features
- Microwave Plasma CVD (2nd hand system)
- Generator: 5 kW @ 2.45 GHz
- Substrate: 4” max (2” standard)
- Gases: N2 , H2 , CH4 , O2
- Installation: Q1 2017
Diamond thin film: Seki SDS 5250S
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Thermal Evaporation: Lesker NANO 36- resistive heated boats (simple system)
Idea Users Funds Tender Contract FAT SAT Manual Released
• Background & system:– Heavy load on Wordentec– Improve flexibility/costs– single substrate (up to 200 mm)– 2 source assembly (resistive heated)
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Table-top SEM: Hitachi TM3030plus
Idea Users Funds Tender Contract FAT SAT Manual Released
- Variable pressure- BSE & SE detector- Manual stage (X-Y)- Easy access- To be released in January
(XPS-room in basement)
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MONEY
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Payment for materials
47 13.12.2016
InvoiceProjectSpecificationDanchip use
LabManagerregistrations
Yes always Commercial Yes always
Yes always DTU -externalfunding Yes always
Yes always DTU – noexternal funding Yes always
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Material price changes 2017• Cost of DUV resists is significant and will be added as a materials cost
– DUV42S-6: 3.7 kr/g– KRF M35G: 2.2 kr/g– KRF M230Y: 2.2 kr/g
• Prices for noble metals have changed significantly:– Gold: 2.7 kr/nm– Platinum: 2.1 kr/nm– Palladium: 1.2 kr/nm
• ALD sources priced at cost:– TMA: 3.2 kr/s– DEZ: 7.6 kr/s– TiCl: 1.1 kr/s
• Automatic registration:– Machine readout - crystal information, internal gauges– Logbook entries
48 13.12.2016
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Payment for services
49 13.12.2016
InvoiceProjectSpecificationDanchip/Cen service use
LabManagerregistrations
Yes always Commercial Yes always –commercial prices
Yes always DTU -externalfunding
Project getsburdened with
cost less than ‘fullcost’
Yes always DTU – no externalfunding
No invoice or costburdening
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Unified price model for Danchip/Cen serviceComplete overhaul:
– Re-evaluate cost objects for UK95 (Academic) justification– All registrations in ”Anlægs kartotek” audited and corrected for
funding agencies/infra-structure funding/private funding– Capacity/actual hours puzzle solved for the categories
Overall results– Commercial pricing: No changes– Academic pricing: Mainly increases– All SEMs at 346 move to Cat D
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Service prices – external commercial users (UK90)
a) Cleanroom access above cap of 20 hours is 0 kr/h
Service from Danchip New price2017
Present price 2016
Unit
Cleanroom access (below cap)a) 800 800 kr/h
Danchip assistance 1250 1250 kr/h
Cleanroom area 1600 1600 kr/m²/mo
Category A tools 370 370 kr/h
Category B tools 630 630 kr/h
Category C tools 3600 3600 kr/h
Category D tools 1200 1200 kr/h
Category E tools 1700 1700 kr/h
Category F toolsb) 0 0 kr/h
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Service cost - External funded projects and users (UK95, Danish academia)
a) Cleanroom access above cap of 20 hours is 0 kr/h
Service from Danchip Cost 2017 Present cost 2016
Unit
Cleanroom access (below cap)a) 550 350 kr/h
Danchip assistance 550 450 kr/h
Cleanroom area (500) (200) kr/m²/mo
Category A tools 170 160 kr/h
Category B tools 400 300 kr/h
Category C tools 2100 1800 kr/h
Category D tools 550 800 kr/h
Category E tools 1300 1200 kr/h
Category F toolsb) 0 0 kr/h
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3 TO TAKE HOME
• Changes in access procedure, safety course, training (TPT)
• Professor started – collaboration projects welcome !!
• A host of new tools• 9 wet benches, 9 Fume hoods, Oneview camera, BioTwin, Bonder,
PECVD 4, Pegasus 2, Tabletop SEM, Thermal evaporator, Diamond deposition,ALD 2, CNI NIL 1.5, CNI NIL 2.0, Maskless aligner, Resist coater station