© 2011 ANSYS, Inc. June 25, 2014 1
Multi-Physics Analysis with Thermo-fluidic and EM/HF simulation
Jeongwon Lee FBU Application Engineer, Ph.D
ANSYS, Inc. Korea
© 2011 ANSYS, Inc. June 25, 2014 2
Contents
• Overview of Multi-Physics Simulation Workflow
• Case Study : HFSS-Icepak co-simulation – Connector
• Case Study : Maxwell-Icepak co-simulation – Busbar
• Summary
© 2011 ANSYS, Inc. June 25, 2014 3
Multi-Physics Simulation Workflow
Maxwell
HFSS
Siwave
Q3D
Apache
Icepak
Fluent
(CFD)
Mechanical
Parameterization and Optimization
ANSYS Workbench
© 2011 ANSYS, Inc. June 25, 2014 4
Icepak vs Fluent vs ANSYS Mechanical
ANSYS Mechanical
Conduction, Radiation (No Flow)
Only Temperature
ANSYS Fluent
Conduction, Radiation and Convection
Flow and Temperature
ANSYS Icepak
Customization
Modeling, Trace import
Meshing, Electronic Libraries
ANSYS Fluent
Conduction, Radiation and Convection
Flow and Temperature
© 2011 ANSYS, Inc. June 25, 2014 5
• SIwave and ANSYS Icepak exchange both power map and temperature data
– Accounts for copper resistive losses in printed circuit boards and packages for accurate PCB temperatures
Coupling with SIwave
Current Density (SIwave)
Temperature (Icepak)
Power Map
Temperature
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• Import volumetric and surface losses from Q3D into Icepak
– Conservative mapping of loss to Icepak mesh
Coupling with Q3D Extractor
Forced convection cooling of a coaxial cable, DC computation in Q3D to compute losses for Icepak thermal simulation
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• Import resistive and dielectric loss information from HFSS into Icepak
– Volumetric and surface loss
– Conservative mapping of loss to Icepak mesh
Coupling with HFSS
Forced convection cooling of a hybrid ring plate. The model includes resistive losses in copper traces and dielectric loss in the substrate layer
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• Import resistive loss information from Maxwell into Icepak
– Magnetostatic and eddy losses
– Conservative mapping of loss to Icepak mesh
Coupling with Maxwell
Natural convection cooling of a coil and plate assembly with eddy current heating
© 2011 ANSYS, Inc. June 25, 2014 9
• Apache Sentinel TI and ANSYS Icepak exchange converged power map and convective film coefficients
– Enables thermal evaluation of package in actual operating environment to accurately simulate junction temperatures
Coupling with Apache Sentinel TI
Power Map
HTC
Apache Sentinel TI Package Model
Icepak System Model with Package
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• Import temperature data from ANSYS Icepak to ANSYS Mechanical for thermal-stress analysis
Coupling with ANSYS Mechanical
Thermal-stress simulation for a computer graphics card -performed in the ANSYS Workbench environment
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• Simplorer extracts thermal RC network models from transient parametric sweeps calculated with ANSYS Icepak
– Based on linear superposition of Icepak results
Coupling with Simplorer
Run parametric trials in Icepak
Report files from Icepak
Read Icepak files into
Simplorer
Automatic creation of RC network
model in Simplorer
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• Perform design point studies, optimization, design of experiments and robust design solutions with Icepak and DesignXplorer
Optimization with DesignXplorer
Design of Experiments solution to obtain response surface and MOGA used to find power values from measured temperatures for PBGA package model
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HFSS-Icepak Co-simulation : Connector
© 2011 ANSYS, Inc. June 25, 2014 14
Introduction
• Real world system conditions = Multi-physics environment • Areas of concern
Electromagnetics
ANSYS HFSS
CFD & Heat transfer
ANSYS Icepak
Structural
ANSYS Mechanical
RF Losses
Temperature field
Temperature dependent
EM Properties
Thermal stress
Cyclic loads
Thermal
deformation
Fatigue
Failure
Design Revisions
Frequency drifts
from intended design
Overview HFSS Design Modeler Icepak Summary
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Multi-Physics : Starting point
• Temperature field born out of EM All possible problems start here
• HFSS-Icepak analysis should follow HFSS analysis
Electromagnetics
ANSYS HFSS
CFD & Heat transfer
ANSYS Icepak
RF Losses
© 2011 ANSYS, Inc. June 25, 2014 16
Heat loss in RF/Microwave Applications
• Metals and dielectrics – both play important roles in high frequency electromagnetics
• RF losses can be converted to heat dissipation in both
• Dielectrics – heat is generated as volumetric heat density : qvol
• Electric conductors (metals)
Current flow is limited to a very narrow skin at the surface Effectively, heat is generated as surface heat flux : qsurf
© 2011 ANSYS, Inc. June 25, 2014 17
Summary of Workflow Complete
the HFSS analysis
Establish connection
for geometry sharing
Establish connection for
volume/surface losses mapping
Select volume/surface
mapping in Icepak
Complete data mapping
by selecting zones
in Icepak
Complete
the setup in Icepak
and update solution
© 2011 ANSYS, Inc. June 25, 2014 18
Setup in Icepak : Volumetric Losses
• Open EM Mapping panel in Icepak File → EM Mapping
• Select Volumetric heat losses option
• Volumetric heat losses panel Lists all Icepak Blocks and Plates Select all components for volumetric
heat losses are needed Click Accept to close panel
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Setup in Icepak : Surface Losses
• Open EM Mapping panel in Icepak File → EM Mapping
• Select Surface heat losses option
• Surface heat losses panel Lists all Icepak Blocks and Plates Select all components for surface heat
losses are needed Click Accept to close panel
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Check EM Losses Mapping
Data assigned to selected Fluent solid zones ... Total loss on zone 134 is 3.431e-24 (Watt) Total loss on zone 136 is 0.000e+00 (Watt) Total loss on zone 138 is 0.000e+00 (Watt) ∙ ∙ ∙ Total loss on zone 178 is 4.112e-20 (Watt) Total loss is : 4.0170e-14 (Watt) "Ok"
Mapped volume loss on fluent
Calculated volume loss from HFSS
Volume Losses are
well mapped
on FLUENT domain
© 2011 ANSYS, Inc. June 25, 2014 21
Post-Processing for Icepak : Temperature
Temperature field on all components
Temperature field on connectors
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Post-Processing for Icepak : Flow Field
© 2011 ANSYS, Inc. June 25, 2014 23
Maxwell-Icepak Co-simulation : Busbar
© 2011 ANSYS, Inc. June 25, 2014 24
Introduction
• Real world system conditions = Multi-physics environment • Areas of concern
Electromagnetics
ANSYS Maxwell
CFD & Heat transfer
ANSYS Icepak
Structural
ANSYS Mechanical
EM Losses
Temperature field
Temperature dependent
EM Properties
Thermal stress
Cyclic loads
Thermal
deformation
Fatigue
Failure
Design Revisions
Frequency drifts
from intended design
© 2011 ANSYS, Inc. June 25, 2014 25
Multi-Physics : Starting point
• Temperature field born out of EM All possible problems start here
• Maxwell-Icepak analysis should follow Maxwell analysis
Electromagnetics
ANSYS Maxwell
CFD & Heat transfer
ANSYS Icepak
EM Losses
© 2011 ANSYS, Inc. June 25, 2014 26
Electric Machine Electromagnetic and Thermal Coupled Design
• Important aspects of electric machine design
– Electromagnetic
– Thermal
– Thermal stress and deformation
• Electromagnetic and thermal designs are interrelated
– Losses from electromagnetic design affect thermal
– Temperature rise will change material properties
– Thermal induced mechanical stress
• Electromagnetic and thermal coupled design is highly desired
© 2011 ANSYS, Inc. June 25, 2014 27
Summary of Workflow Complete
the Maxwell analysis
Establish connection
for geometry sharing
Establish connection for
volume losses mapping
Select volume
mapping in Icepak
Complete data mapping
by selecting zones
in Icepak
Complete
the setup in Icepak
and update solution
© 2011 ANSYS, Inc. June 25, 2014 28
Post-Processing for Icepak : Temperature
© 2011 ANSYS, Inc. June 25, 2014 29
Post-Processing for Icepak : Flow Field
© 2011 ANSYS, Inc. June 25, 2014 30
Summary
• Based on the ANSYS EM/HF-Icepak coupling analysis for PCB connector and Busbar, the following conclusions can be drawn :
EM/HF simulates the Electromagnetic fields including current density,
magnetic field and EM losses on PCB connector and busbar.
Design Modeler can help the user easily sharing the geometry from EM/HF to Icepak, as well as clearing unnecessary parts to Icepak.
Information of EM losses on EM/HF simulation can be easily transferred to Icepak through the GUI based connection on ANSYS Workbench environment.
Icepak can generate meshes through Mesh-generator with a little efforts of mesh-control parameters.
Volumetric and surface losses are well mapped on the Icepak without loss of quantity. Based on these precise EM losses information, Icepak can give us physically reliable results on both flow and thermal analysis.
© 2011 ANSYS, Inc. June 25, 2014 31
Questions and Answers
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