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Sébastien Cases
SoftMEMS
MEMS Design Flow
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Moore’s laws …
1965 , the 1st ‘law’:
« Semiconductors complexity will double every year at constant
price »
1975: Moore altered his projection to
« doubling the amount of transistors on integrated circuits every
two years »
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… Limitations and
Workarounds
Limitations:
Atom Size : 0.1 - 0.5nm
Photolitography : EUV, Multibeam Maskless, Nanoimprint
Thermodynamic Barrier : High Frequency
Last but not the least : Manufacturing costs
Workarounds:
Multi-core architectures
Asynchronous designs
Nothing Else ?!
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There is plenty of Room …
on the Top
MEMS : Micro-electro-mechanical systems
SiP : System in Package
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MEMS : An alternative
What are MEMS :
Sensors: Pressure Sensors, Inertial
Measurements Units (Accelerometers,
Gyroscopes).
Actuators: Ink-Jet heads, Switches
(RF or Optical), Scanning Mirrors
(DLP).
Why MEMS:
MEMS devices are manufactured
using batch fabrication techniques
similar to those used for integrated
circuits
Sourc
e: Analo
g D
evic
es
Sourc
e:
Univ
Colo
rado
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Some Market Areas
over 4 decades
1980 1990 2000 2010
Consumer
Electronic
DLP
Automotive
Inkjet Heads
First MEMS Applications
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Accelerometer Airbag System
Motion Control
Gyroscopes GPS
Roll Over
Vehicule Dynamic Control (ESP)
Pressure Sensors Engine Management
Hydraulic Transmission Control
Tire Pressure Monitoring System
Automotive
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Pressure Sensor Altimeter
Silicon Microphone Voice sensing
Accelerometer User motion sensing
Gyroscope Hand jitter measurement
Stabilized camera sensors
Micromirror Picoprojectors
Microdisplay Low power display
RF switch and varicaps Tunable matching networks
BAW/FBAR filters WCDMA duplexers
Oscillators Timing references
Micro fuel cells Disposable fuel cartridge
Micro autofocus Autofocus
Consumer Electronic : Mobile
Phones Applcations
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MEMS Market
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MEMS Companies
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MEMS R&D and Fabs in Europe
LETI
CNM
Fraunhofer
IMEC
CSEM
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Problems & Solutions
MEMS Design Flows
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Component
Designer
MEMS Design Team
Back End
Designer
Front End
Designer
IC part
System
Designer
Analysis
Designer
MEMS part
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MEMS Design Team : Typical
Problems
No Natural Links between the Different Teams
Electrical Engineers are Not Familiar with FEA Solutions
Mechanical Designers are Not Familiar with IC Simulations
languages
No Software Links between the Different Teams
Schematics, Layouts, 3D Models, …, are Created
Manually and Independently
Difficult to Reuse the Results (FEA – IC)
14
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MEMS Design
Structural
Fluid
Thermal
Electrostatic
Electrical
Magnetic
EMAG
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MEMS Design : Typical
Problems
The Increasing Integration of MEMS Devices has
pushed the demand for CAD Tools to support Rapid
Design of Systems involving Physical Interactions
between Multiple Domains such as Electrical,
Mechanical, and Thermal.
16
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Front End
Designer
IC part
MEMS Design Flow : Objective
17 17
Analysis
Designer
MEMS part
Component
Designer
Back End
Designer
System
Designer
Back End
Designer
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MEMS Design Flow : Objective
Unify and Enable Exchange of Data between these
Multi-Disciplinary Teams
Introduce a Coherent Design Platform for MEMS
Inspired of Microelectronics Methodologies
Automatic Layout Generation
Fast and Accurate Simulations
Usage of Libraries
18
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MEMS Design Flows
The Neanderthal Model
Design Process is not
optimized
Each Iteration is costy and
lengthy
New Prototype Idea ?
Draw Masks
Manufacture
Characterize
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MEMS Design Flows
The Athenian Model
New Prototype Idea ?
Guess what Masks can
give you the designed
object in 3D
Manual Verification
Manufacture
Characterize
Iteration on lengthy FEM
Simulations
Validate FEM Problem
Draw 3D in CAD Tools
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MEMS Design Flows
Modern Times Model : Top-down Methodology
Capture Schematic
Import Masks
DRC Verification
Generate Meshed
3D Model for FEM
LVS
Manufacture
Characterize
Extract Behavioral
Model
MEMS / IC
System Level
Simulation
Simulate MEMS
New Prototype Idea ?
Validate FEM Problem
Availablity of Simulation
Models
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Modern Times Model : Bottom-up Methodology
MEMS Design Flows
DRC Verification
Generate Meshed
3D Model for FEM
Manufacture
Characterize
Extract Behavioral
Model
MEMS / IC
System Level
Simulation
New Prototype Idea ?
Validate FEM Problem
Draw Masks
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Proposed MEMS Design Flow
Bottom-up Methodology
Top-down Methodology
Masks Design
3D Models
Device Level
Reduced Order Model
Subsystem Level
System Models
&Simulation
System Level
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Modeling
System Layout Easy MEMS &
Verification
Layout
Editor
Process
Description
&
3D Model
Generator
Tools Architecture
Design Entry &
MEMS Libraries
Behavioral Model Generation
Schematic
Editor
Electronic
Simulator
Analytical
Equations
FEM
Simulations
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MEMS Pro Architecture
T-Spice Pro L-Edit Pro L-Edit
Editor
2D/3D Modeler
S-Edit
Editor
T-Spice
Simulator
MEMS Libraries of
Symbols & Models Easy MEMS &
Verification
DRC
UPI
Technology
Manager
Reduced Order
Model
Generation
Equations Based
Model
Generation
Compact Model Builder
Oofelie MultiPhysics
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MEMS Pro
From Design to Manufacturing
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MEMS Pro Suite
Stand-alone PC based Design Product
Generic Product, Fully Customizable
Potentially Provides Support for
Additional Foundries MEMScAP (MUMPs)
Analog Devices (iMEMS)
Sandia (ITT)
MOSIS (NIST)
Seamless Design Flow from Schematic
to Simulation to Layout with Link to
OOFELIE Solver.
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MEMS Pro Architecture
T-Spice Pro L-Edit Pro L-Edit
Editor
2D/3D Modeler
S-Edit
Editor
T-Spice
Simulator
MEMS Libraries of
Symbols & Models Easy MEMS &
Verification
DRC
UPI
Technology
Manager
Reduced Order
Model
Generation
Equations Based
Model
Generation
Compact Model Builder
Oofelie MultiPhysics
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MEMS Pro : L-Edit
Layout Editor with MEMS
Design Capabilities
Full Custom Layout Editor
Fully Supports Curves and Non-
Manhattan Shapes
Supports GDSII / CIF
Formats
Import/Export DXF Files
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MEMS Pro : L-Edit
MEMS Component Libraries EasyMEMS Libraries with
standard MEMS components
Design Rules Checker for MEMS Mixed MEMS and IC design
rule sets
Compatible with curves and non-Manhattan (all-angle) shapes
Compatibility checking between layout and fabrication capability
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Technology Manager
Single Tool to define and
gather :
Material properties
3D process steps definition
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MEMS Pro : 3D Modeler
Automatically Generates a
3D View of your Device
From the Layout Export in IGES or SAT
Technology Steps and
Cross Section Viewer Supports Stacks of Wafers
Electroplating command
Handles Bulk and Surface
micromachining
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MEMS Pro : 3D Modeler
Supports MEMS and IC
Process steps as:
Wetiso / WetAniso Etching
Conformal Deposition
Implantation for
PiezoResistive Elements
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MEMS Pro : 3D Modeler
Customizable for
Documentation needs:
Exploded Wafer Stacked view
3D Cross-Section
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MEMS Pro : MemsModeler
Link between Component Designers and System
Designers Generates Behavioral Model of MEMS Component by using a
reduced order method on a Finite Element Model
Supports Structural, Electro-Structural and coupled Thermo-
Structural applications
Supports multiple language output (VHDL-AMS, Verilog-A and
C based T-Spice Model)
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MEMS Pro : Model Generator
Generates T-Spice C-model of MEMS Component by
using user-defined Equations
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MEMS Pro : T-Spice Pro
Schematic and Simulation Environment supporting: Mixed MEMS and Electronic Designs
Libraries of MEMS Devices
T-Spice Netlist Format
Optimization
Statistical Analysis
MEMS Libraries Mechanical Elements and
Actuators
Piezoelectric and
Piezoresistive Elements
Optical Elements
Thermal Elements