Transcript

MEMS Based Reconfigurable RF Systems for Software

Radio, Wireless Sensors, and MMID Technology

(MOSART)

Jussi Varis

VTT Technical Research Centre of Finland

Sweden, FOI: R. Malmqvist, C. Samuelsson

Sweden, Uppsala University: A. Rydberg, X. Hu

Finland, VTT: J. Varis, P. Rantakari, J. Säily, M. Lahti, M. Kaunisto, J. Saijets, and T. Vähä-

Heikkilä

NORDITE Conference 2011

Quality Hotel 33, Oslo

June 14th, 2011

2 NORDITE Conference 2011, June 14th, 2011

Outline

1. Project overview

2. Motivation and applications

3. Produced devices and modules

• RF MEMS Devices

• Antennas on LTCC

• LTCC packaged RF MEMS devices

• Sub-system modules

4. Related on-going efforts

5. Benefits from MOSART

6. Summary

3 NORDITE Conference 2009, Nov. 4th, 2009

Project overview

• 36 month VINNOVA, Tekes, and VTT funded project.

• Main goal: Successful integration of MEMS components, active RF circuits, and sub-systems into a LTCC packaged re-configurable RF front-end demonstrators at 10-40 GHz.

• Research partners: FOI, Uppsala University (SWE), VTT (FIN)

• Industry partners: Nera Networks (NOR), Ericsson Research (SWE), Saab Microwave Systems (SWE), Silex Microsystems (SWE), Syncore Technologies (SWE), Elektrobit Wireless Communications (FIN), Selmic (FIN).

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Motivation

• RF MEMS

wireless RF systems with better performance

(compared with a use of today’s of the shelf technologies)

• RF MEMS in point-to-point communication and RF sensing (5-40 GHz),

reconfigurable electronic multi-band (frequency-agile) front-ends

Lowers component count, reduces complexity and cost

• RF MEMS switch technology

High linearity

Low insertion loss and DC power consumption candidate for re-configurable front-

ends and beam steering

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Applications

• 35 GHz low loss electrically steerable antennas (low power radars)

• 10-30 GHz re-configurable/tunable amplifiers (for Pt-to-Pt communications)

mm wave sensors

radio links

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MOSART RF MEMS devices

VTT 30-40 GHz

wideband matching

network

(1.0 mm x 0.9 mm). FOI RF MEMS

switch (0.7 mm x

1.0 mm).

VTT 35 GHz analog phase

shifter.

FOI 20-30 GHz SPDT with

places for LNAs (4.5 mm x

3.0 mm).

VTT 20-30 GHz SPDT (5.0

mm x 3.0 mm).

FOI 35 GHz 3-bit switched delay

phase shifter (9.3 mm x 3.0 mm).

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MOSART antennas on LTCC

Uppsala 35 GHz 4x1 slot-coupled

antenna array (21.0 mm x 12.5 mm).

Uppsala 20-30 GHz microstrip

bow tie antenna array

(8.0 mm x 18 mm).

VTT 20-30 GHz end-fire dipole antenna

(8.5 mm x 8.0 mm). VTT 20-30 GHz Vivaldi antenna

(5.7 mm x 17 mm).

VTT 35 GHz co-planar 4x1 antenna

array with EBG structure

(20 mm x 12 mm).

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MOSART LTCC packaged RF MEMS devices

LTCC packaged wideband RF MEMS

impedance tuner (9.0 mm x 9.5 mm).

LTCC packaged 20-30 GHz RF MEMS SPDT

switch(12 mm x 9.0 mm).

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MOSART sub-system modules

20-30 GHz switchable LNA/driver

module (16 mm x 15 mm).

25/35 GHz switchable LNA

module(20 mm x 11 mm).

35 GHz narrowband digital phased array

Rx module (45 mm x 29 mm).

35 GHz narrowband analog phased

array Rx module (71 mm x 25 mm).

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Main remaining challenges

• RF MEMS reliability Process quality (residuals, layer thicknesses).

Design parameter stability (MEMS switch gap height, capacitance ratio, pull-in

voltage)

Environmental susceptibility (temperature, mechanical, charging, etc.)

• Integration Flip-chip bonding vs. ribbon bonding

Alignment accuracy on LTCC

MEMS temperature tolerance in various integration and post integration

phases.

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Related on-going efforts

• Rx modules on Taclam.

• Tunable LNAs and drivers on quartz. wire bond

or

flip-chip

Quartz substrate with RF MEMS

impedance matching networks.

LNA/PA

MMIC

RX1

RX2 Rx modules on

Taclam substrates.

Antenna arrays.

RF MEMS

phase shifters.

MMIC

LNAs.

Benefits from MOSART

• Nordic countries and Europe have in place technologies to produce

packaged re-configurable radio modules.

RF MEMS

LTCC

MMICs

• Benefits to industry partners in MOSART

Saab: electrically steerable phased array front-ends for sensor applications

Nera, Ericsson, Elektrobit: re-configurable/tunable radio sub-systems for Pt-to-Pt

applications

Syncore: novel integated sub-systems

Selmic: micro and mm wave frequency LTCC module processing

Silex: micro and mm wave RF MEMS processing

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Benefits from MOSART

• Expanding European frontiers in RF MEMS and LTCC related

development

MEMS-4-MMIC (EU FP7, 2008-2011, on-chip integration of MMIC and RF

MEMS): OMMIC and CNRS-IEMN (FRA), FOI and Saab (SWE), IMST (GER),

IMT (ROM), VTT (FIN)

SATURNE (EU FP7, 2010-2013, GaN and RF MEMS for space applications):

UU (SWE), Thales and CNRS-IEMN (FRA), EADS (GER), Thales Alenia

Space (ITA), TopGAN (POL)

MiniMEMS (EU FP7, 2010-2013, miniaturised RF MEMS for airport and

weather radar systems): ÅAC Microtec and UU (SWE), Thales and CNRS-

IEMN (FRA), Vaisala (FIN)

MEMSMOD (ESA and participants, 2010-2012, LTCC packaged RF MEMS

switch reliability and environmental testing and assessment): EADS (GER),

Selmic and VTT (FIN)

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Towards commercial systems

• RF MEMS switches and sub-systems

(circuits & antennas) have been

demonstrated with state-of-the-art

performance from DC-100 GHz and beyond

• Enabling technology for miniaturized, low-

power high performance re-configurable RF

systems (e.g. for wireless comm., space,

security & defense)

• High reliability (switch cycles) and

fabrication yields needed for a higher market

penetration

• Today, just a few commercial vendors

offering RF MEMS as packaged (discrete)

components: RadantMEMS (US), OMRON

(JPN), DELFMEMS (FR)

• A few MMIC foundries developing RF-

MEMS: OMMIC (FR) – GaAs, IHP (GE) –

SiGe, Selex (IT) – GaN

• RF-MEMS technology in the US (e.g.

Radant) has demonstrated a much higher

TRL than what is currently available in

Europe.

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Summary

• MOSART has demonstrated

RF MEMS matching networks, phase shifters and SPDT switches

Antenna arrays and wideband antennas on LTCC

Module concepts for electronically steerable or re-configurable radio systems

Processing technologies for manufacturing RF MEMS devices and LTCC modules.

• MOSART has

Brought together a large number of Nordic companies and research institutes.

Utilised synergy (for example MMIC design and manufacturing) from other related on-

going projects and networks.

Expanded RF MEMS and LTCC related development to include more Nordic and

European companies and institutes in Nordic, EU, and ESA related projects.

• Challenges remain

RF MEMS reliability and stability

Integration related issues.

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Contact information

• Project manager and national contact in Finland:

Dr. Jussi Varis, VTT, [email protected], tel: +358-40-569 4089, fax: +358-20-722 7013

• National contact in Sweden:

Prof. Anders Rydberg, Uppsala University, [email protected], tel: +46-18-471 3228, fax: +46-18-555096

• Chairman of the Steering Group:

Dr. Robert Malmqvist, FOI Swedish Defense Research Agency, [email protected], tel: +46-13-378 353, fax: +46-13-378 519


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