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The Role of
Functionalisation in the
Graphene Supply Chain
HVM Graphene 2014, Oxford
15/05/2014©Haydale 2014
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Haydale evolution
Haydale set up 2003
Innovative Carbon Ltd. (ICL) purchased Haydale in May 2010
Invested £5m to January 2014 to support expansion and growth
Process patent applications in 2009-2012. International phase started Significant work on CNTs Added mined graphite in November 2011
Production of Graphene Nano Platelets (“GNPs”)
New bespoke facility for processing nano materials opened in May 2013- cost £0.5m
Market testing on UK conductive Graphene based ink in June 2013
No metal additives, 20 ohms/sq, coverage 550 cm²/gm
Current functionalisation of nano particles: up to 1 tonne
Functionalisation process positively reported on by NPL
ISO 9001 accreditation Jan 2014
Launched IPO 14th April
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Graphene
Issues
• Graphene is inert until functionalised
• Graphene supply quality is inconsistent
• Graphene needs to be an affordable price
• Need standardised classification of materials
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Why Functionalise ?
Graphene is inert
Correct functionalisation
produces enhanced product
performance
Bespoke
Applications
Cost-Benefit
Improvement
Consistent Product Performance
Produces Homogeneous Material
Enables Dispersion and
Facilitates Mixing©Haydale 2014
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The Haydale approach
©Haydale 2014
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HDPlas™ : standard
functionalisation processes
6
O2
Ar
NH3
COOH
N2 Plasma Process
Low temperatureLow energy
‘F’
©Haydale 2014
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Haydale split plasma processing
• Low pressure, low temperature gas plasma
• Controlled gas and vapour mixtures for bespoke functionalisation
• Plasma interacts with the CNT / GNP surface, attaching “free radicals”
Graphene Nanoparticle
High-energy electrons generated in the plasma can “split” or disassociate molecules
into their component parts. These charged particles readily bond with a surface.
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Haydale Process Benefits
• No acid processing
• No toxic waste stream
• No post processing drying
• Low temperature processing
• Bespoke materials
• Controlled functionalisation of nano materials
• No catastrophic microstructural damage
• A scalable production route
Functionalisation verified by National Physical Laboratory
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De-agglomerationC
NTs
GN
Ps
HDPlas™ Industrial
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Exfoliating Clean Undamaged CNTs and
Graphenes by Split Plasma
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TEM images of MWCNT
As manufactured MWCNT After plasma processingAfter acid functionalisation
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Dispersion in Liquids
12©Haydale 2014
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Dispersion in Resins
0.5 wt%
Functionalised
HDPlas CNTs in
epoxy resin
0.5 wt% NON
Functionalised
CNT in epoxy
resin
Epoxy (no filler)
©Haydale 2014
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Customer comment about
HDPlasTM GNP material
“Our tensile strength and modulus
results have been outstanding and
increases as a function of loading
have shown continuous increases
of over 100% at relatively higher
loading levels.
Your split plasma method is very
efficient with regards to uniformity”.
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Multitude of applications
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70%
80%
90%
100%
110%
120%
130%
NO
RM
ALI
SED
% V
ALU
ES
Tensile Performance of GNP Modified HDPE
Tensile Strength Young's Modulus
60%
70%
80%
90%
100%
110%
120%
130%
140%
Control Graphene 1
Nitrogen
Graphene 1
Oxygen
Graphene 2
Nitrogen
No
rmal
ise
d %
Val
ue
s
Tensile Performance of GNP Modified PA66
Tensile Strength
Young's Modulus
Modified Thermoplastics
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HDPlas™ Graphene Inks
HDPlas™ Graphene Ink IGSC02001
Screen Printable Conductive Graphene Ink
Solids Content 40.0 – 42.0 %
Viscosity 7.0 – 11.0 Pa.s
Coverage 1g of ink will cover
approximately 550 sq cm
Sheet Resistance <20 Ω/sq(230 SS mesh, 13 micron emulsion)
Cured Thickness Typical 12 microns
CUSTOMISATION AND FORMULATION SUPPORT AVAILABLE
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Flexible Conductive Graphene Ink
©Haydale 2014
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HDPlas™ Graphene PEDOT
HDPlas™ Graphene PEDOT
PEDOT transparent conductive inks are
enhanced with HDPlas™ Graphene.
Improved electrical performance with minimal effect on light transmission.