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INTRODUCTION
•Background of Buried Capacitance
•Performance Characteristics
•PWB Manufacturing Process
•Impedance Measurement
•Noise Measurement
•Conclusion
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Current applications with Buried Capacitance
Hi-end computersNetwork serversNetwork routers
Demand for power distribution system with low impedance
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Lower Impedance compared to discrete components
PWB with Discrete components
PWB with Buried Capacitance
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Demand for thin (<25micron) Buried Capacitance
- Improvement in electrical performance- Reduce cost - Reduce thickness of the board
Expectation by using Thin Capacitor Material
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BC 12
BC 16
BC 24
12 micronPolymerDielectric
16 micronPolymerDielectric
24 micronPolymerDielectric
BC 16T16 micronPolymerDielectricwith Hi-DkFiller
Construction
*Standard Copper thickness is 35micron**BC16T under development
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Electrical PropertiesCharacteristics Condition Unit BC 24 BC 16 BC 12 BC 16T
Capacitance 1GHz pF/in 900 1500 2000 10,000
Dk 1GHz N/A 4.6 4.6 4.6 25.0
Df 1GHz N/A 0.012 0.012 0.012 0.014
DielectricThickness Nominal Micron
Meter 24 16 12 16
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Physical PropertiesCharacteristics Condition Unit BC 24 BC 16 BC 12 BC 16T
Tg DMA Celsius 200 200 200 200
Peel Strength As received lb/in >6.0 >6.0 >6.0 >4.0
Young’s Modules JIS 2318 GPa 4.8 5.8 7.2 TBD
TensileStrength JIS 2318 MPa 180 180 180 TBD
CTE IPC TM650 PPM 30 30 30 TBD
Breakdown 1kV/sec V >5000 >4000 >4000 TBD
InsulationReliability 85C/85%/35V hr >1000 >1000 >1000 TBD
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1. Pre-Clean2. Dry Film lamination3. Expose Image 4. Pattern etching (Dual sides)5. Black Oxide or Alternative
B/O treated panel
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• Substrates Processed at Major PCB Facilities• Standard I/L Processing• Results
1. No loss due to jams2. No “blow out” of Clearance holes3. No separation from border pattern 4. 100 % Yield at Hi-Pot (500 Volts)5. Both Vertical Racked Black Oxide and Alternative Oxide used successfully
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BC12 CAPACITOR
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After processing drilling,desmear and plating
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4 Layer Board
FARADFLEX
BC12
0.6mmP.P
0.6mmP.P
P.P
P.P 0.6mm
0.6mm
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8 Layer Board
FARADFLEX
BC12
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24 Layer BoardFARADFLEX
BC12
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FARADFLEX
BC24
Micro-via Plating
Thermal Solder Shock
288C x6FARADFLEX
BC12
Reliability testDielectric Withstanding Voltage : 500V Passed, No failureT-260 Time to Delamination : BC12 6.3min, BC24 5.2minBlind Via Plating Defects : No defects foundThermal Solder Shock – 6x : No defects foundLiquid-Liquid : BC24 4.2%(500cycle)
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(Self Z)
Significant Reduction on
Impedance
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(Transfer Z)
Significant Reduction on Impedance
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(Transfer Z)
Significant Reduction of EMI
MPU (40MHz) is mounted on the other side of the board.
Vcc(3.3V)
SMA connector
MPU
P.P
P.P 0.6mm
0.6mm
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• Thinner Materials for Buried CapacitanceTM are required for improved Impedance Performance at high frequency
• Our New Substrate has excellent electrical performance and physical properties.
• It is compatible with PCB processing; a truly “drop in” material.
The Product for High Speed Boards
FARADFLEX TM
In Commercial Production!
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FARADFLEX TM
For more information contact:
John AndresakisVP of Strategic Technology
(518) [email protected]
or visit us at www.oakmitsui.com