Transcript
Page 1: CS-EE 481 Spring 2004 1Founders Day, 2004 University of Portland School of Engineering Project Kokanee: TTL 7400 Series Logic Tester using CMOS VLSI Team

CS-EE 481 Spring 2004

Founder’s Day, 2004 1University of Portland School of Engineering

Project Kokanee: TTL 7400 Series Logic Tester using CMOS

VLSI Team

John McGloneDrew WillisPaul Berardi

AdvisorDr. Robert Albright, Dr. Peter Osterberg

Industry RepresentativeMr. Steve Kassel Intel (Retired)

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Agenda

• Introduction Dr. Albright• Background Paul• Methods Paul & John• Results John & Drew• Conclusions Drew• Demonstration Drew

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Introduction

• The Team– Andrew Willis– John McGlone– Paul Berardi

• Advisors– Dr. Robert Albright– Dr. Peter Osterberg

• Industry Representative– Mr. Steve Kassel (Intel, Ret.)

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Introduction

A Big Thanks To– Advisors– Dr. Lu– John Felton– Sandra Ressel– Friends and Family– MOSIS– Engineering Janitor, Diep

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Introduction

• Problem– Unreliable ICs in the microprocessor lab

• Solution– A device that can quickly and reliably verify the

functionality of an IC

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Introduction

• Goal of this presentation– Background of Project Kokanee– Design methods– Results– Conclusions– Demonstration

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Background

What is an IC?Key Parts in Project Kokanee:

– CMOS VLSI Chip– Microcontroller (PIC)– Device Under Test (DUT)

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Background

• Key Functional Specifications– Simplicity– Test ten TTL 7400 Series IC’s

• Includes various 2-input, 3-input, 4-input AND, NAND, OR, NOR, XOR, and Hex Inverter chips

– Produce easy to interpret results

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Methods: Documentation

• Functional Specifications– Requirements gathering

• Project Plan– Divide project into task timeline– Estimate length of each task

• Theory of Operations– Provides conceptual documentation how the device

functions

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Methods: Design Process

• Problem– How will the user interact with the system?– How will the system test the DUT?

• Solution– Use PIC to control user interface (liquid crystal display (LCD)

screen, keypad, etc)– Use PIC to send / receive test vectors

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Methods: Design Process

• Problem– Limited I/O ports on PIC

• Solution– Use a CMOS VLSI chip to use least amount of I/O ports to

control all DUT inputs and outputs

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Methods: Design Process

• Problem– How can we verify our results?

• Solution– Thorough exhaustive testing– Define failure analysis scenarios and a subsets of key failure

scenarios to verify

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Results

• Overview– High Level Block Diagram– VLSI Chip– PIC

• User interface• Testing routine

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High Level Block Diagram

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CMOS VLSI Chip

• VLSI chip provides interface between PIC and DUT (solves pin issue)

• VLSI chip design process – Simulated in software using B2Logic– .tpr file created for fabrication – Discrete logic macro model created for testing

before VLSI chip arrived

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Results

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VLSI to DUT Pin Interface

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VLSI Chip Layout

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Results

• Uses 7 control signals from PIC– Hold I/O configuration – Send test vectors to 14 DUT pins

• 8th signal returns resulting signal from desired output pin

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PIC

• User Interface– 12 button keypad– LCD Screen– Light emitting diodes (LEDs)

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Set I/O Tri-state Buffers Set

PIC Testing Routine

Apply Test #1 Pin Values SetSet Output Pin

Read Output PinRead Value

PICValue Clear

To DUT

VLSI

Compare

Value

to

Test

Vector

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Testing Results: Chip Testing

• All possible Boolean inputs tested on each logic gate

• Failure Scenarios– Pin stuck low (voltage state)– Pin stuck high (voltage state)– Pins disconnected– Etc…

• Tester detected every failure scenario within selected subset

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Testing Results: Device Validation

• Meets all functional specifications– Accurately tests functionality of the selected IC– Testing of an IC conducted in a timely manner

• Features– Simple user interface– Actual internal testing process takes a fraction of a

second (prevents DUT from frying)– Robust electronics prevent user error affecting tester

circuitry

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Conclusions

• Met and exceeded functional specifications– Created to work for 10 14-pin chip, modular design

allows for an extendable library of chips– Allows for 16-pin chips to be tested as well!– Met deadline and released prototype early– Prototype in tangible, marketable, end-line packaging

• Leaving a legacy– Tester will be placed in UP microprocessor engineering

lab under the care of Dr. Osterberg– Learning tool for future students

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Conclusions

• Lessons We Learned– Don’t blindly trust documentation– Everything takes more time and money that expected– Patience

• Demonstration

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Demonstration

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Demonstration

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Demonstration

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Demonstration


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