Transcript
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Component Miniaturization and
High-Density Technologies in Space Applications
Wrap up of The 27th Microelectronics Workshop
October 24 , 2014
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Keywords Parts level : ASIC / ClassY/ SoC/ MCM Non space parts application Assembly level : CCGA / BGA / CSP / FC New PCB New technology : Wireless
Summary of MEWS 27 Presentation : 28 Attendee : 272
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5um(5000nm)@1977 ⇒ 1um (1000nm)⇒ 500nm ⇒ 130nm@2011
Parts level
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Parts level
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Parts level
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Parts level
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Parts level
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Parts level
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Parts level
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Assembly level
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Assembly level
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Assembly level
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Assembly level
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New Technology
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Challenge
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Challenge
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Thank you very much & See you next MEWS !