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Chapter 0Introduction
Jin-Fu LiAdvanced Reliable Systems (ARES) Laboratory
Department of Electrical EngineeringNational Central University
Jhongli, Taiwan
Advanced Reliable Systems (ARES) Lab.
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Applications of ICsConsumer Electronics Automotive Electronics
Green Power Electronics Biomedical Electronics
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System on Chip
SOC a product class and design style that integrates
technology and design elements from other system driver classes (microprocessor unit, embedded memory, analog/mixed-signal component—as well as reprogrammable logic) into a wide range of high-complexity, high-value semiconductor products (ITRS 2011)
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Trends for SOC Consumer Portable Driver
Source: ITRS 2011
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SOC Consumer Portable Driver Architecture
Source: ITRS 2011
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SOC Consumer Portable Design Complexity
Source: ITRS 2011
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SOC Consumer Portable Power Consumption
Source: ITRS 2011
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SOC Consumer Portable Processing Performance
Source: ITRS 2011
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Modern SOC Design Challenges
Power issue: Energy consumption, power dissipation,
power delivery Reliability issue Variability Soft error (single-event upset) Device degradation
Yield issue Y=e -AD
….
Multi-core chip architecture Use multiple identical cores to design a chip
Network-on-chip communication infrastructure Multiple point-to-point data links interconnected by switches (i.e.,
routers)
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Architecture of Current SOC Chips
Source: IEEE Computer, 2005.
DDR2Controller
DDR2Controller
μ Engine
Source: IEEE Micro, 2007.
RAM unit
Compute unit
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Examples
Source: IEEE JSSC, 2006.
SPARC V9 (Sun) Cell Processor (IBM)
Source: IEEE JSSC, 2006.
Teraflops processor (Intel)
Source: IEEE Micro, 2007.
Source: IEEE Micro, 2007.
4x4 mesh built with Xpipeslibrary components
Niagara2 (Sun)
Source: IEEE JSSC, 2008.
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Example: Niagara2 & POWER6 (JSSC, 2008)Niagara2 (Sun) POWER6 (IBM)
Design-for-Testability Features:
1. 32 Scans + ATPG2. BIST for arrays 3. ….
Design-for-Testability Features:
1. Logic BIST2. BIST for arrays 3. BISR for arrays4. …
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Example: SPARC (JSSC, 2011)
Process: TSMC 40nmMetal layers (Cu): 11Transistor types: 4# of Cores: 166MB L2 cacheDie area: 377mm2
# of pins: 2117
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Number of Transistors per Microprocessor Chip
Source: Proceedings of IEEE, May 2012.
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Transistor Cost
Source: Proceedings of IEEE, May 2012.
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Downsizing Rates of Audio/Video Products
Source: Proceedings of IEEE, May 2012.
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Fundamental Elements of Electronic Systems
Computation
Data (Content) Communication
Processor (multi-core architecture)
Memory Interface; Bus; Network
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3D Integration Technology
Technology evolution Bipolar CMOS Multicore 3D integration +
System-in-package (3D-SiP) System-in-package stacking dies using bonding wires
Source: ISQED, 2008.
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Emerging IC Design Technology▬3D IC 3D integration stacking dies using through
silicon via (TSV)
Source: IBM, 2008.
Energy/Power
Processor
Memory Stack
RFADCDAC
NanoDeviceMEMS
Other Sensors,Imagers
Chemical &Bio Sensors
Source: Proceedings of IEEE, Jan. 2009
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Advantages of 3D IC: Heterogeneous Integration
Combine disparate technologies DRAM, flash, RF, etc.
Combine different technology nodes For example: 65nm technology and
45nm technology
Energy/Power
Processor
Memory Stack
RFADCDAC
NanoDeviceMEMS
Other Sensors,Imagers
Chemical &Bio Sensors
Source: Proceedings of IEEE, Jan. 2009
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Advantages of 3D IC: Low Power & Small Form Factor
SIP
3D-IC
SOBPower
Technology
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Advantages of 3D IC: High Bandwidth
3D IC allows much more IO resources than 2D IC For example, Stacking of processor and memory
Memory
CPU
Bandwidth is limited by IOs
CPU
Memory
Many TSVs are allowed for high bandwidth transportation
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Applications of 3D ICs
Memory wall
Sh
ort-term M
idiu
m-term
Long
-term
Memory capacitySmart or Trusted Memory
Heterogeneous Integration
Heterogeneous Integration & High Complexity Systems (terabyte of internet traffic/sec; petabytes of data stored in the cloud; etc.)
Source: Proceedings of IEEE
Source: Proceedings of IEEE
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Possible Applications: Smart Phone
An important development direction is the interaction with the user, and sensor-based smartphones. Motion sensors, accelerometers and gesture reading devices should improve a lot this interaction, and combined with the connectivity widespread, it should create a new set of opportunities for consumers. Unfortunately, an aspect which won't mean a major leap in smartphonesdevelopment is battery life.
Augmented Reality Map
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Possible Applications: Automotive Cloud Service System
Source: IEEE Computer, June 2012.
Requirement: high bandwidth (real time) and low power; small form factor
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Possible Applications: Active Safety for Automotive
Source: IEEE Computer, June 2012.
Subaru introduced the EyeSight system version 2, introduced in 2010, which can stop a vehicle traveling at up to 30 km/h via a stereo camera mounted inside the front window. A 3D image processor analyzes the images that two cameras capture and estimates the distance to the obstacle.
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Possible Applications: Healthcare
Source: Proceedings of IEEE, May 2012.
Adhesive-bandage-type sensor
Bionic ear
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Possible Applications: Healthcare
Source: Proceedings of IEEE, May 2012.
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Possible Applications: Superspecs
Source: Mail Online, 2012.
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Challenges of 3D-IC Implementations
Yield Design for resiliency
Thermal Can we overcome it?
Test Reliability…
Source: IBM, 2008.