AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben Tel +43 (0) 3842 200-0
www.ats.net
AT&SFirst choice for advanced applications
Investor and Analyst PresentationMarch 2018
Investor and Analyst Presentation 1
Table of Contents
Company Overview
Strategy & Market
Financials
Annex
Investor and Analyst Presentation 2
AT&S – a world leading high-tech PCB & IC substrates company
High-end interconnect solutionsfor
Mobile Devices, Automotive, Industrial,
Medical Applications and Semiconductor
Industry
Continuously
outperforming
market growth
€ 814.9mrevenue in FY
2016/17
# 1 manufacturer in
Europe
# 3 in high-end technology
worldwide
10,039employees
Cost-competitive production
footprint with
6 plants in Europe and Asia
Investor and Analyst Presentation 3
What guides us
VISION
FIRST CHOICE FOR ADVANCED APPLICATIONS
MISSIONWe set the highest quality standards in our industry
We industrialize leading-edge technology
We care about people
We reduce our ecological footprint
We create value
Investor and Analyst Presentation 4
Market Segments & Product Applications served by AT&S
4
Computer, Communication,
Consumer
Smartphones, Tablets, Wearables, Ultrabooks,
Cameras…
Industrial
Machine-2-Machine Communication,
Robots, Industrial Computer,
X2X Communication
…
Automotive
Advanced Driver Assistance Systems,
Emergency-Call, X2X Communication
…
Medical
Patient Monitoring, Hearing Aids,
Pacemaker, Neurostimulation, Drug
Delivery, Prosthesis
…
IC substrates
High Performance Computer, Microserver
…
Segment Mobile Devices & Substrates Segment Automotive, Industrial, Medical
Investor and Analyst Presentation 5
Our competitive advantages
Strategic focus on high-end technologies and applications
Outstanding process know-how and process efficiency
First high-end IC substrates manufacturer in China
Scale innovation and technology leverage between customer segments
Highest quality
Investor and Analyst Presentation 6
AT&S – Key Facts
542590
667
763815
615
766
102127
168 168131*
102*
190
31 5490 77*
7* 12* 89
2012/13 2013/14 2014/15 2015/16 2016/17 Q1-32016/17
Q1-32017/18
Revenue EBITDA EBIT
Good track record1 Balanced portfolio/Global customer base2
7%
Split revenue: Business Unit, Q1-3 2017/18
Split revenue: Customer Region, Q1-3 2017/18based on sold to party
+9% +13% +14% +7%
* Based on ramp-up effects for new plants in China
Revenue growth
€ in millions
67%
33%Mobile Devices & Substrates
Automotive, Industrial, Medical
63%21%
10%6% Americas
Germany/Austria
Asia
Other European countries
+24.5%
Investor and Analyst Presentation 7
Global footprint ensures proximity to supply chain & cost efficiency
1,012* 394* 1,136* 2,388* 4,725* 309*
Plant Shanghai China
Plant AnsanKorea
Plant ChongqingChina
Plant Leoben, HeadquartersAustria
Plant FehringAustria
Plant NanjangudIndia
AT&S plant & sales office
AT&S sales office
AT&S Headquarters
*Staff, Average, FTE, Q1-3 2017/18; 73 employees in other locations
Investor and Analyst Presentation 8
Table of Contents
Company Overview
Strategy & Market
Financials
Annex
Investor and Analyst Presentation 9
From vision to strategy
Targets/Key PerformanceIndicators
Strategy
Expansion of technology leadership• Leading provider of new interconnect solutions• Innovation revenue rate: > 20%
Focus on high-end technologies and applications Focus on innovative solutions
Long-term profitable growth• Medium-term EBITDA margin target of > 20%• Short-term revenue target of € 1 billion
Focus on fast-growing and profitable applications Highest service level and customer orientation Operational excellence Focus on cash flow generation
Creation of shareholder value• Long-term ROCE of 12%
Sustainable business development with focus on ROCE
Transparent dividend payout
Vision:“First choice for advanced application”
The best employees and management team members• Talent programs• Training and continuing development• Leadership Excellence program
Sustainable business leadershipBenchmark in the industry through reduction of:• 5% in CO2 emissions p.a.• 3% in freshwater consumption p.a.
Capital Excellence• Equity ratio: > 40%• Financing costs of < 2% (in a
corresponding interest environment)• Payback period of debt of < 3 years
Investor and Analyst Presentation 10
Strategic focus on high-end technologies
AT&S Revenue structure in H1 2017/18 – based on technologies
High-endHDI PCBs andIC substrates
~ 30%
Single-sided (SS), double-sided (DS), multilayer- (ML), flex and rigid-flex (RF) PCBs
~ 70%
High-end technology share > 75% HDI and any-layer PCBs, Embedding
Complementary technology share: < 25% SS, DS, ML,
Flex, RF
Structure of general PCB market – based on technologies
Source: Prismark PCB Report 2Q17/ August 2017; AT&S Controlling
Investor and Analyst Presentation 11
PCB market – Overview
14.6 14.5
15.3 17.3
7.68.7
5.26.13.7
4.52.4
2.848.8
53.9
2017 2021Computing Communication
Consumer Automotive
Industrial/Medical Military/Aerospace
5.0%
4.0%
3.5%
(0.2%)
3.0%
Forecast for the total PCB market until 2021: CAAGR of 2.5%
3.8%
USD in billions
11
AT&S outperformed a flat market in the past 6 years and is set to continue to do so also in the future.
100.5 101.3 103.7 96.9 95.1
105.4114.8
129.8148.4
158.5
6080
100120140160
2011* 2012 2013 2014 2015 2016
Index (2011 = 100)*
PCB & substrates market AT&S revenue
* Basis 2011:PCB & substrates market: USD 55.4bn AT&S revenue: € 514m
AT&S outperformed the market by scaling high-end any-layer technology and by leveraging HDI technology to the Computer-, Consumer-, Automotive-, Industrial and Medical market.
Source: Prismark, February 2017, Yole April 2017
Investor and Analyst Presentation 12
Market Player/Position HDI Technology
12
Market position HDI Technology
Revenue (USD in millions)
Rank Country Supplier HDI Non HDI PCBs IC substrates Total revenue
1 TWN Unimicron 802 490 830 2,122
2 TWN Compeq 679 716 - 1,395
3 AUT AT&S 596 248 -* 844
4 USA TTM 501 1,987 - 2,488
5 JPN Ibiden 368 - 929 1,297
6 TWN Tripod 316 1,052 - 1,368
7 TWN Unitech 311 123 - 434
8 KOR SEMCO 296 204 844 1,344
9 JPN Meiko 251 474 - 725
10 KOR DAP 226 - - 226
Source: Prismark 2016; NTI 2016; AT&S Strategy
* N/A due to single customer
Investor and Analyst Presentation 13
Driving the future: Internet of Things (IoT) Applications Healthcare & Fitness Smart Watches and Glasses
Wearable Electronics
Smart Mobility Autonomous Driving Car2X Communication
Smart City Smart Lighting
Smart Buildings Home/Building Automatization Smart Home Devices
Smart Production/Industry 4.0 Automatization/Robotics Machine-to-Machine Communication
Smart Healthcare Connected Patient Monitoring Systems Connected Consumer Healthcare Devices
Smart Energy Smart Metering
Building Blocks of IoT Modules: Sensing, Connectivity, Energy Storage/Harvesting, Power Management
30-50 billion of „Things“ will be connected in 2020
Wearable electronic devices offer revenue opportunities of USD 61.7bn beyond the smartphone market in 2020Source: Gartner Inc. 2016
Investor and Analyst Presentation 14
Driving the industry: miniaturization & modularization
?
2003/04 2013 2017 202X
TYPE Mobile Phone Smartphone Smartphone All in One
PCB 125x55mm 85x20mm 80x20mm 25x25mm?
FORM FACTOR 1 0.25 0.23 0.06?
LINE/SPACE 100/100µm 40/40µm 30/30µm 10/10µm
TECHNOLOGY 1-n-1 Any-layer mSAP – Any-layer FO/SAP/mSAP
Investor and Analyst Presentation 15
R&D as the key for technological leadership
7.7% R&D Quota
(in % in relation to revenue) 227 Patents
International R&D Partners
As of FY 2016/17 (ended 31/03/2017)* Revenue generated with products with new, innovative technologies introduced to the market within the last three years
21.8%Innovation Revenue Rate *
R&DHeadquarters
AustriaIndustrialization at the respective
production site
Investor and Analyst Presentation 16
Future positioning as leading high-end interconnect solutions provider
Core businessNew technologies and interconnect
solutions
Extended technology toolbox
Additional customers
Additional applications
Broader positioning in the value chain
+
Mo
re t
han
AT&
S
Overview of the transformation from a high-endPCB manufacturer to a high-end interconnect solutions provider:
Investor and Analyst Presentation 17
Table of Contents
Company Overview
Strategy & Market
Financials
Annex
18Investor and Analyst Presentation
Strong top-line growth and profitability, improved Cash Flow
Revenue YoY growth
Operating Cash FlowYoY development
EBITDA and EBITDA margin
High demand, additional revenue contribution from both plants in Chongqing. Negative FX impact of € 23.9m.
General high operational performance, successful implementation & optimization of mSAP technology.
Solid operating cash flow reflects strong earnings in first nine months.
€ in millions€ in millions € in millions; %
541.7589.9
667.0
762.9814.9
615.1
765.9
102.4127.2
167.6 167.5130.9
102.1
190.3
18.9% 21.6% 25.1% 22.0% 16.1% 16.6% 24.8%
71.7
104.8
143.9 136.9 136.4
16.8
121.0
19Investor and Analyst Presentation
Business Development – Mobile Devices & Substrates
88.7
120.9104.5
115.9112.2
123.4 101.0 97.7 126.6
148.6
113.7113.6
197.6 199.6
Q22014/15
Q32014/15
Q42014/15
Q12015/16
Q22015/16
Q32015/16
Q42015/16
Q12016/17
Q22016/17
Q32016/17
Q42016/17
Q12017/18
Q22017/18
Q32017/18
Revenue increase mainly on the back of the two plants in Chongqing
EBITDA improvements as a result of general efficiency measures and higher contribution margin
Price pressure on IC substrates remains
€ in millions (unless otherwise indicated)
Q1-3 2016/17 Q1-3 2017/18 Change in %
Revenue 438.6 580.0 32.2%
Revenue with external customers
372.9 510.8 37.0%
EBITDA 56.1 155.3 177.0%
EBITDA margin 12.8% 26.8% -
€ in millions; * Revenue with external customers
Revenue per quarter*
Trendline expressingseasonality
20Investor and Analyst Presentation
Business Development – Automotive, Industrial, Medical
71.7
65.9
72.6
77.8 79.572.7
76.6 80.4 79.9 78.984.9 85.0 87.3
79.3
Q22014/15
Q32014/15
Q42014/15
Q12015/16
Q22015/16
Q32015/16
Q42015/16
Q12016/17
Q22016/17
Q32016/17
Q42016/17
Q12017/18
Q22017/18
Q32017/18
Continued growth path in all sub-segments, particularly in Industrial and Medical
EBITDA below last year’s level which included a reversal of provision of € 3.3m for previously unused space – EBITDA margin impacted by negative FX effects, higher raw material prices
€ in millions (unless otherwise indicated)
Q1-3 2016/17 Q1-3 2017/18 Change in %
Revenue 262.0 270.8 3.4%
Revenue with external customers
239.2 251.6 5.2%
EBITDA 37.0 32.3 (12.6%)
EBITDA margin 14.1% 11.9% -
Revenue per quarter*
€ in millions; * Revenue with external customers
Investor and Analyst Presentation 21
Net CAPEX & Staff
Net CAPEXQ1-Q3: € 124.6m for maintenance incl. technology upgrades and Chongqing phase 1
STAFF*The increased headcount is primarily based onChongqing.
€ in millions
40.5
90.3
164.8
254.3240.7
124.6
2012/13 2013/14 2014/15 2015/16 2016/17 Q1-3 2017/18
7,321 7,0277,638
8,7599,526
10,039
2012/13 2013/14 2014/15 2015/16 2016/17 Q1-3 2017/18
* incl. contractors, FTE, average for the period
Investor and Analyst Presentation 22
Financials Q1-3 2017/18
High demand, additional revenue contribution from both plants in Chongqing. Negative FX impact of € 23.9m.
General high operational performance, successful implementation & optimization of mSAP technology.
Positive FX effects of € 2.0m (Q1-Q3 2016/17: FX expense 8.2m.
Reduced tax scheme in Shanghai still pending.
€ in thousands (unless otherwise stated)Q1-3 2016/17 Q1-3 2017/18
Change
YoY
STATEMENT OF PROFIT OR LOSS
Revenue 615,063 765,900 24.5%
produced in Asia 82% 85% 3pp
produced in Europe 18% 15% (3pp)
EBITDA 102,108 190,276 86.3%
EBITDA margin 16.6% 24.8% 8.2pp
EBIT 11,840 88,801 >100%
EBIT margin 1.9% 11.6% 9.7pp
Finance costs – net (18,551) (11,283) 39.2%
Income taxes (13,038) (29,742) (>100%)
Profit for the period (19,749) 47,776 >100%
Earnings per share (€ 0.51) € 1.21 >100%
Investor and Analyst Presentation 23
Financials Q1-3 2017/18
Increase as a result of hybrid bond issueand net profit
Negative FX effects (mainly RMB-EUR and USD-EUR) of € 57.9m. Positive: Hybrid bond issue (€ 173.0m)
Ususal seasonal increase in BU MS
€ in thousands (unless otherwise stated)31 Mar 2017 31 Dec 2017 Change
STATEMENT OF FINANCIAL
POSITION
Non-current assets 1,029,363 953,813 (7.3%)
Current assets 407,331 579,581 42.3%
Equity 540,094 699,129 29.4%
Non-current liabilities 569,849 556,116 (2.4%)
Current liabilities 326,751 278,149 (14.9%)
Total assets 1,436,694 1,533,394 6.7%
Net debt 380,549 217,028 (43.0%)
Net gearing 70.5% 31.0% (39.5pp)
Net working capital 24,374 73,412 >100%
Net working capital per revenue 3.0% 7.2% 4.2pp
Equity ratio 37.6% 45.6% 8.0pp
Hybrid bond issue
Investor and Analyst Presentation 24
Key credit figures
299
372405
523
593545
82
261 274
260212
328
217
111131
263
381
217
2012/13 2013/14 2014/15 2015/16 2016/17 Q1-3 2017/18
Gross debt Financial assets and cash Net debt
2.1
0.9 0.8
1.6
2.9
2012/13 2013/14 2014/15 2015/16 2016/17
Target: < 3x
Net debt/EBITDA
Net debt decrease based on lower net capex (Chongqing phase I finished) & Hybrid bond issue
€ in millions
Gross debt, financial assets and cash, net debt
Multiple
Investor and Analyst Presentation 25
€ in millions* < 1 Year 1-5 Years > 5 Years Total
Promissory note loans 2014 1.6 48.6 5.0 55.2
Promissory note loans 2015 0.7 217.6 - 218.3
Promissory note loans 2016 0.3 49.9 100.0 150.2
Subsidized loans 24.6 45.6 - 70.2
Bank Borrowings and others 16.4 34.5 - 50.9
Total 31/12/2017 43.6 396.2 105.0 544.8
Total 31/03/2017 73.0 348.3 171.5 592.8
Overview Debt Portfolio Duration Maturity
* Including accrued interest and placement costs
83.7%
16.3%
Currency mix of debt portfolio
EUR USD
Average debt portfolio duration: 3.3 years (2016/17: 3.7 years)
Average financing costs: 2.5% (31/03/2017: 2.6%)
€ 191m of credit lines not utilized (31/03/2017: € 201m)
Currency mix of EUR and USD to support natural hedging strategy
Investor and Analyst Presentation 26
Financials Q1-3 2017/18
Hybrid bond issue
Main drivers: increase of inventory by € 30.5m and increase of receivables by € 34.2m
€ in thousandsQ1-3 2016/17 Q1-3 2017/18
Change
YoY
STATEMENT OF CASH FLOWS
Operating result (EBIT) 11,840 88,801 >100%
Paid/received interests (11,628) (10,446) 10.2%
Paid taxes (10,706) (14,697) (37.3%)
Non cash bearing of profit or loss 85,004 106,647 25.5%
Cash flow from operating activities
before changes in working capital74,509 170,305 >100%
Changes in working capital (57,705) (49,293) 14.6%
Cash flow from operating activities 16,804 121,012 >100%
Cash flow from investing activities (108,650) (246,612) (>100%)
Cash flow from financing activities 78,440 135,419 72.6%
Change in cash and cash equivalents (13,406) 9,819 >100%
Operating free cash flow1) (175,473) (3,631) 97.9%
Free cash flow2) (91,846) (125,600) (36.8%)
1) Cash flow from operating activities minus Net CAPEX2) Cash flow from operating activities minus cash flow from investing activities
Investor and Analyst Presentation 27
Net Working Capital Management
€ in millions; % of revenue
Net Working Capital development
103
92 95
88
24
73
19.0%
15.6%14.3%
11.6%
3.0%
7.3%
2012/13 2013/14 2014/15 2015/16 2016/17 Q1-3 2017/18
Net working capital Net working capital per revenue
Investor and Analyst Presentation 28
AT&S – Stock ProfileListing: Vienna Stock Exchange,
Prime Standard
Indices: ATX Prime, WBI
Thomson Reuters (A): ATSV.VI
Bloomberg (A): ATS:AV
Annual results 2017/18 08 May 2018
Record date Annual General Meeting 25 June 2018
24th Annual General Meeting 05 July 2018
Ex-dividend day 24 July 2018
Record date dividend 25 July 2018
Dividend payment day 26 July 2018
Financial Calendar Shareholder structure
# of shares outstanding 38.85m
Average daily volume*: ~ 102,690 shares
Performance 1 year*: +124%
Dividend 2016/17: € 0.10 per share
Dividend yield: 1.0%* 01/03/2017 – 28/02/2018
Investor and Analyst Presentation 29
Outlook FY 2017/18
For Q4:
> usual seasonality
> continuous price pressure – particularly for IC substrates
FY 2017/18 – provided a stable market environment and exchange rate development:
> revenue growth of 20-25%
> EBITDA margin: based on strong Q1-Q3 earnings - slightly above given forecast
of 19-22%
> additional depreciation of € ~15m
Investor and Analyst Presentation 30
Table of Contents
Company Overview
Strategy & Market
Financials
Annex
Investor and Analyst Presentation 31
AT&S Product Portfolio – I
ECP®:Embedded Component Packaging IC substrates Substrate-like printed circuit boards
mSAP
Embedded Component Packaging allows to embed active/passive components (e.g. wafer level dies) within the layers of a PCB – contributes to miniaturization.
IC substrates serve as interconnection platform withhigher density (Line/Space < 15 micron) between semiconductors (Chips) & PCBs .
Substrate-like PCBs (mSAP technology) are the next evolution of high-end HDI PCBs with higher density: Line/Space < 30 micron.
Production siteLeoben, Shanghai Chongqing Chongqing, Shanghai
ApplicationsDevices such as smartphones, tablets, digitalcameras and hearing aids
High-end processors for Computer, Communication, Automotive, Industrial
Mobile applications like smartphones
Investor and Analyst Presentation 32
HDI any-layer printed circuit
boards
HDI microvia printed circuit boards – high density interconnect
Multilayer printed circuit boards
Double-sided printed circuit boards
IMS printed circuit boards – insulated metal
substrate
Further technological enhancement to HDI microvia: All electrical connections in HDI any-layer boards consist of laser-drilled microvias. Advantage: further miniaturization, and higher performance and reliability. AT&S produces HDI any-layer in 4 to 12 layers.
HDI: high density interconnect, meaninglaser-drilled connections (microvias). HDI is first step towards miniaturization.AT&S can produce 4-layerlaser PCBs up to 6-n-6HDI multi layer PCBs.
Found in almost every area of industrial electronics. AT&S produces printed circuit boards with 4 to 28 layers, in quantities from individual prototypes to small batches and mass production.
Used in all areas of electronics. AT&S focuses on double-sided printed circuit boards with thicknesses in the range of 0.1-3.2mm.
IMS: insulated metal substrate. Primary function: heat dissipation for use mainly with LEDs and power components.
Production siteShanghai Shanghai, Leoben Leoben, Nanjangud, Fehring Fehring, Nanjangud Fehring
ApplicationsSmartphones, Tablets, Notebooks
Mobile phones and nearly all electronic applications including automotive (navigation, infotainment and driver assistance systems)
Used in all electronic applications including touch panels, and in products ranging from aircraft to motorcycles, from storage power plants to solar arrays
Primarily industrial and automotive applications
Lighting industry
AT&S Product Portfolio – II
Investor and Analyst Presentation 33
Flexible printed circuit boards
Semi-flexible printed circuit boards
Rigid-flex printed circuit boards
Flexible printed circuitboards on aluminum
AT&S patentedtechnologies
Used to replace wiring and connectors, allowing for connections and geometries that are not possible with rigid printed circuit boards.
More limited bend radius than flexible printed circuitboards. The use of astandard thin laminatemakes them a cost-effective alternative.
Combine theadvantages of flexibleand rigid printed circuitboards, yielding benefitsfor signal transmission,size and stability.
Used when installing LEDsin car headlights, forexample, where theprinted circuit board isbonded to an aluminumheat sink to which theLEDs are then attached.
Production siteAnsan, Fehring Fehring Leoben, Ansan Ansan
ApplicationsNearly all areas ofelectronics, includingmeasuring devices andmedical applications
Automotive applications Industrial electronics,such as productionmachines and industrialrobots
Lighting, automotive,building lighting
AT&S Product Portfolio – III
ECP®: Embedded Component PackagingECP® is a patented AT&S packaging
technology used to embed active and passive electronic components in the inner layers of a printed circuit
board. ECP® technology is used in ever smaller, more efficient and more powerful devices, such as
smartphones, tablets, digital cameras and hearing aids.Production sites: Leoben, Shanghai
2.5D® Technology PlatformCombines mechanical and electronic miniaturization, and enables partial reduction of the thickness of a
circuit board. Advantage: populated assemblies have a thinner profile. Can be also used to make cavities in
the printed circuit board, e.g. for acoustic channels. Major application for this technology is the 2.5D® rigid-
flex printed circuit board, a lower cost alternative for flex-to install applications.
Production sites: Leoben, Shanghai
Investor and Analyst Presentation 34
Management
Andreas Gerstenmayer, CEO
Joined AT&S as CEO in 2010
Previous positions include:
18 years of work experience at Siemens, including Managing Director with Siemens Transportation Systems GmbH Austria and CEO of the Drive Technology business unit in Graz from 2003 to 2008
Partner at FOCUSON Business Consulting GmbH after leaving Siemens
Education:
Degree in Production Engineering from Rosenheim University of Applied Sciences
Monika Stoisser-Göhring, CFO
CFO since 2017 Previous positions include:
Since 2011 with AT&S in seniorpositions in Finance and Human Resources
Various positions at international accounting and tax consulting companies
Education: Training as Tax Consultant Degree in Business Administration
from Karl-Franzens University Graz
Heinz Moitzi, COO
COO since 2005; with AT&S since 19811)
Previous positions include: Various management positions
within AT&S Measurement engineer with Leoben
University of Mining and Metallurgy Education:
Degree from Higher Technical College of Electrical Engineering
1)He was already with the founding company of AT&S
Investor and Analyst Presentation 35
Milestones in the Group’s history
1987Founding of the Group, emerging
from several companies owned by
the Austrian State Owned
Industries
1994Privatization and
acquisition by Messrs
Androsch, Dörflinger, Zoidl
1999Initial public offering on Frankfurt Stock Exchange
(„Neuer Markt“). Acquisition of Indal Electronics
Ltd., largest Indian printed circuit board plant
(Nanjangud) – today, AT&S India Private Limited
2002Start of production at new Shanghai
facility – one of the leading HDI
production sites in the world
2010Start of production
at plant II in India
2009New production direction: Austrian
plants produce for high-value niches
in the automotive and industrial
segment; Shanghai focuses on the
high-end mobile devices segment
2008AT&S change
to Vienna Stock
Exchange 2006Acquisition of Korean
flexible printed circuit
board manufacturer,
Tofic Co. Ltd. – today,
AT&S Korea Co., Ltd.
2015AT&S again achieves record high sales and earnings for
financial year 2014/15 and decides to increase the investment
program in Chongqing from € 350 million to € 480 million
2011 Construction starts on new
plant in Chongqing, China
Capacity increase in
Shanghai by 30%
2013AT&S enters the IC substrate
market in cooperation with a
leading manufacturer of
semiconductors 2016AT&S starts serial production of
IC substrates at the plant in
Chongqing
Investor and Analyst Presentation 36
A sustainability benchmark in the industry
36
“Highest resourceefficiency“
“Highest standards at all locations worldwide“
“Highesttransparency“
* Basis for CO2 output: 2015/16
Sustainability reporting since 2012/13 Gold recognition from the Responsible
Business Alliance Conflict minerals reporting Public CDP reporting on climate change
(C score) and water (B score)
Resourceconsumptionstable/declining
Revenue growth Environment: ISO 14001 Safety: OHSAS 18001 Energy: ISO 50001 Quality: ISO 9001, ISO/TS 16949
AS/EN 9100, DS/EN 13485
Investor and Analyst Presentation 37
AT&S – First choice for advanced applications
IR contactJohannes Mattner
Fabriksgasse 13, 8700 Leoben/Austria
Tel: +43 3842 200 5450Mobile: +43 676 8955 6093Fax: +43 3842 200 [email protected]
www.ats.net
Visit: www.ats.net; @AT&S IR_PR; AtundS
Investor and Analyst Presentation 38
DisclaimerThis presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria (“AT&S”), and thecontents are proprietary to AT&S and for information only.
AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein, and noreliance may be placed for any purpose whatsoever on the information contained in this presentation, which has not been independently verified. You are expressly cautioned notto place undue reliance on this information.
This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management‘s expectationsand assumptions. However, such statements are by their very nature subject to known and unknown risks and uncertainties. As a result, actual developments, results, performanceor events may vary significantly from the statements contained explicitly or implicitly herein.
Neither AT&S, nor any affiliated company, or any of their directors, officers, employees, advisors or agents accept any responsibility or liability (for negligence or otherwise) for anyloss whatsoever out of the use of or otherwise in connection with this presentation. AT&S undertakes no obligation to update or revise any forward-looking statements, whether asa result of changed assumptions or expectations, new information or future events.
This presentation does not constitute a recommendation, an offer or invitation, or solicitation of an offer, to subscribe for or purchase any securities, and neither this presentationnor anything contained herein shall form the basis of any contract or commitment whatsoever. This presentation does not constitute any financial analysis or financial research andmay not be construed to be or form part of a prospectus. This presentation is not directed at, or intended for distribution to or use by, any person or entity that is a citizen orresident or located in any locality, state, country or other jurisdiction where such distribution, publication, availability or use would be contrary to law or regulation or which wouldrequire any registration or licensing within such jurisdiction.