doug sparks integrated sensing systems inc. (issys) baa 04-10 mx 391 airport industrial dr...
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Doug Sparks
Integrated Sensing Systems Inc. (ISSYS)BAA 04-10 MX
391 Airport Industrial DrYpsilanti, MI 48198 USA
www.mems-issys.com
A Universal, High-Vacuum, Wafer-Level, MEMS Packaging Technology/Service
Introductory Presentation
MEMS Vacuum Packaging
Vacuum packaging is used for many MEMS devices: gyroscopes, RF-MEMS, optical displays, IR sensors, density meters, resonant clocks, Coriolis mass flow sensors, vacuum microelectronics, density meters, pressure sensors…
Vacuum sealing can be accomplished at the package level (metal or ceramic packages) or at the chip/wafer level.
Micromachined Capping Wafer
Micromachined Device Wafer- Pyrex
Sealing Material
Bond Pads
Vacuum Cavity
Resonating Silicon MicroTube
NanoGetter
Micromachined Capping Wafer
Micromachined Device Wafer- Pyrex
Sealing Material
Bond Pads
Vacuum Cavity
Resonating Silicon MicroTube
NanoGetter
NanoGetter Thin-Film Technology
To improve the vacuum quality of ISSYS resonant sensors,reduce particle contamination and simplify the processing, a new gettering technology, called NanoGetters due to the very thin metal layers employed, was developed.
NanoGettersTM are covered by pending patents and US patent 6,499,354
The process flow for glass frit wafer bonding, including the addition of the thin film getter used to form the chip-level vacuum package.
Silicon or Pyrex Wafer
Etch
Sealing Material
A.
B.
C.
Silicon or Pyrex Wafer
Etch
Sealing Material
Silicon or Pyrex Wafer
Etch
Sealing Material
Silicon or Pyrex Wafer
Etch
Sealing Material
A.
B.
C.
NanoGetters
NanoGetters
Active Micromachine Wafer
Resonator or Tunneling Cantilever Bond Pad
Vacuum
D.
E.
Cavity
Cap Wafer
NanoGetters
NanoGetters
Active Micromachine Wafer
Resonator or Tunneling Cantilever Bond Pad
Vacuum
D.
E.
NanoGetters
NanoGetters
Active Micromachine Wafer
Resonator or Tunneling Cantilever Bond Pad
NanoGettersNanoGetters
NanoGettersNanoGetters
Active Micromachine Wafer
Resonator or Tunneling Cantilever Bond Pad
Vacuum
D.
E.
Cavity
Cap Wafer
NanoGetter and the Glass Frit Wafer Bonding Process
NanoGetter Patterning & SealingNanoGetters can be patterned using shadow masking, and various types of standard photolithography techniques.
The patterning method depends on the MEMS wafer surface topography and dimensional control requirements.
This thin film getter approach can be used with glass frit, eutectic, fusion / silicon direct, anodic and solder bonding
Q values of2,000-68,000are obtained bywafer-level vacuumpackaging
Vacuum Performance – High Q ResonatorsUsing the NanoGetter Process/Design
With No Nanogetter – the average Q value is 36, standard deviation=17
Q-Plot Silicon Tube Resonator with NanoGetters
-30
-25
-20
-15
-10
-5
0
16354 16355 16356 16357 16358
Frequency (Hz)
Ga
in (
db
)
Q=61,700
Program Goals & Status 7/04-7/05
• Optimize the getter formulation and deposition process -Done• Conduct reliability tests on the optimized getter - Done• Standardize the design guidelines and processes for integrating
the getter into the various wafer-level vacuum sealing technologies for 100mm-150mm wafer diameters – On-Going
• Insert the new design guidelines into MEMS Exchange – On-Going
• Integrate and run getters for initial DoD customers.Q versus Time @ 95C
15000
17000
19000
21000
23000
25000
27000
29000
31000
33000
0 500 1000 1500 2000
Time @ 95C (hrs)
Q