dominant tm opto technologies primaxplus innovating … · 2017. 9. 21. · 350 ingan yellow:...

17/05/2017 V5.01

Features:

> Super high brightness surface mount LED> 120° viewing angle.> Compact package outline (LxW) of 3.7 x 3.5 mm.> Ultra low height profile - 0.8mm.> Low thermal resistance.> Compatible to IR reflow soldering.> Environmental friendly; RoHS compliance.> Superior corrosion resistant.> Compliance to automotive standard; AEC-Q101.

PrimaxSynonymous with function and performance, enter the Primax, the new era of high intensity illumination in LED. With its high flux output and high luminous intensity, Primax transcends today LED lightings technology and how we perceive it. The small package outline (3.7 x 3.5 x 0.8 mm) and high intensity make it an ideal choice for backlighting, signage, exterior automotive lighting and decorative lighting.

DATA SHEET :

PrimaxPlus350 InGaN Yellow : MAZY-YZHG

All rights reserved. Product specifications are subject to change without notice.

Applications:

> Automotive: Exterior application: eg: Turn Signal, Side Marker.

DOMINANTOpto TechnologiesInnovating Illumination

TM

17/05/2017 V5.02

350 InGaN Yellow: MAZY-YZHG

Part OrderingNumber

Color ViewingAngle˚

Luminous Flux @ 350mA (lm) Appx. 1.2

MAZY-YZHG-TU2-1 InGaN Yellow 120 67.2

Electrical Characteristics at Tj=250CVf @ If = 350 mA Appx. 3.1

3.2

Part NumberMin. (V) Typ. (V) Max. (V)

MAZY-YZHG 2.9 3.4

Optical Characteristics at Tj=250C

Min. Typ. Max.

87.4 99.4


TM

Unit

Absolute Maximum RatingsMaximum Value

DC forward current

Peak pulse current (tp<=10μs, Duty cycle=0.10)

Reverse voltage

ESD threshold (HBM)

LED junction temperature

Operating temperature

Storage temperature

Thermal resistance- Real Thermal Resistance Junction / solder point, Rth JS real (typ = 12)- Electrical Thermal Resistance Junction / solder point, Rth JS el (typ = 8)(Mounting on DOMINANT standard PCB)

500

750

Not designed for reverse bias

4000

150

-40 … +125

-40 … +125

15

10

mA

mA

V

V

˚C

˚C

˚C

K/W

K/W

17/05/2017 V5.03


TM

MAZY-YZHG, Color Grouping Appx. 2.1


Color Bin Structure

Bin

5E0.55360.4221

Cx Cy

0.57050.4289

0.58830.4111

0.57640.4075

1 2 3 4

Bin 1 2 3 4 15E Cx 0.5536 0.5705 0.5883 0.5764 0.5536

Cy 0.4221 0.4289 0.4111 0.4075 0.4221

0.45

0 41

0.42

0.43

0.44

5E

0.38

0.39

0.40

0.41

5E

0.380.54 0.55 0.56 0.57 0.58 0.59 0.60

17/05/2017 V5.04

T2T3U2

67.2 ... 76.576.5 ... 87.487.4 ... 99.4

Brightness Group Luminous Flux IV (lm) Appx. 1.2

Luminous Intensity Group at Tj=250C


TM


Group Wavelength distribution (nm)Forward Voltage (V) Appx. 3.1

Vf Binning (Optional)

Vf Bin @ 350mA

V1

V2

2.80 ... 3.10

3.10 ... 3.40

Please consult sales and marketing for special part number to incorporate Vf binning.

17/05/2017 V5.05


TM


Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C

Forward Voltage VF (V)Forward Current IF (mA)

Forw

ard

Cur

rent

I F (m

A)

Rel

ativ

e Lu

min

ous

Flux

Фre

l

Relative Luminous Flux Vs Forward CurrentФV/ФV(350mA) = f(IF); Tj = 25°C

Forw

ard

Cur

rent

I F (m

A)

Temperature T(°C)

Maximum Current Vs TemperatureIF=f(T)

Forward Current IF (mA)

Chromaticity Coordinate Shift Vs Forward Current∆Cx, ∆Cy = f(IF);Tj = 25°C

Rel

ativ

e Lu

min

ous

Flux

Фre

l

Wavelength λ (nm)

Allo

wab

le F

orw

ard

Cur

rent

I F( m

A )

Duty Ratio, %

Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs )

∆Cx,

∆C

y

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0 50 100 150 200 250 300 350 400 450 5000

50

100

150

200

250

300

350

400

450

500

2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7

Rela

tive L

um

ino

us F

lux

rel

Fo

rward

Cu

rren

t I F


Relative Luminous Flux Vs Forward CurrentV/V(350mA) = f(IF); Tj = 25C

Forward Current Vs Forward VoltageIF = f(VF); Tj = 25C

Forward Voltage VF (V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800 850

Rela

tive L

um

ino

us In

ten

sit

y

Relative Spectral Emissionrel = f(); Tj = 25C; IF = 350mA

Wavelength (nm)

Fo

rward

Cu

rren

t I F

(mA

)

Maximum Current Vs TemperatureIF = f (T)

Temperature T(°C)

TS

0

50

100

150

200

250

300

350

400

450

500

550

0 20 40 60 80 100 120 140

TS = Solder Point Temperature

Allo

wab

le F

orw

ard

Cu

rren

t I F

( m

A )

Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp 10s )

Duty Ratio, %

10

100

1000

0.1 1 10 100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0 50 100 150 200 250 300 350 400 450 5000

50

100

150

200

250

300

350

400

450

500

2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7

Rela

tive L

um

ino

us F

lux

rel

Fo

rward

Cu

rren

t I F





0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800 850

Rela

tive L

um

ino

us In

ten

sit

y


Wavelength (nm)

Fo

rward

Cu

rren

t I F

(mA

)


Temperature T(°C)

TS

0

50

100

150

200

250

300

350

400

450

500

550

0 20 40 60 80 100 120 140


Allo

wab

le F

orw

ard

Cu

rren

t I F

( m

A )


Duty Ratio, %

10

100

1000

0.1 1 10 100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0 50 100 150 200 250 300 350 400 450 5000

50

100

150

200

250

300

350

400

450

500

2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7

Rela

tive L

um

ino

us F

lux

rel

Fo

rward

Cu

rren

t I F





0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800 850

Rela

tive L

um

ino

us In

ten

sit

y


Wavelength (nm)

Fo

rward

Cu

rren

t I F

(mA

)


Temperature T(°C)

TS

0

50

100

150

200

250

300

350

400

450

500

550

0 20 40 60 80 100 120 140


Allo

wab

le F

orw

ard

Cu

rren

t I F

( m

A )


Duty Ratio, %

10

100

1000

0.1 1 10 100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0 50 100 150 200 250 300 350 400 450 5000

50

100

150

200

250

300

350

400

450

500

2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7

Rela

tive L

um

ino

us F

lux

rel

Fo

rward

Cu

rren

t I F





0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800 850

Rela

tive L

um

ino

us In

ten

sit

y


Wavelength (nm)

Fo

rward

Cu

rren

t I F

(mA

)


Temperature T(°C)

TS

0

50

100

150

200

250

300

350

400

450

500

550

0 20 40 60 80 100 120 140


Allo

wab

le F

orw

ard

Cu

rren

t I F

( m

A )


Duty Ratio, %

10

100

1000

0.1 1 10 100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0 50 100 150 200 250 300 350 400 450 5000

50

100

150

200

250

300

350

400

450

500

2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7R

ela

tive L

um

ino

us F

lux

rel

Fo

rward

Cu

rren

t I F





0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800 850

Rela

tive L

um

ino

us In

ten

sit

y


Wavelength (nm)

Fo

rward

Cu

rren

t I F

(mA

)


Temperature T(°C)

TS

0

50

100

150

200

250

300

350

400

450

500

550

0 20 40 60 80 100 120 140


Allo

wab

le F

orw

ard

Cu

rren

t I F

( m

A )


Duty Ratio, %

10

100

1000

0.1 1 10 100

-0.05

-0.04

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03

0.04

0.05

0 50 100 150 200 250 300 350 400 450 500

Rela

tive W

avele

ng

th

rel

Relative Wavelength Shift Vs Forward Current


Cx, C

y

Chromaticity Coordinate Shift Vs Forward CurrentCx, Cy = f(IF);Tj = 25°C


Redundant Cy

Cx

Relative Spectral EmissionФrel = f(λ); Tj = 25°C; IF = 350mA

17/05/2017 V5.06


TM


Radiation Pattern

Junction Temperature Tj(°C)

Rel

ativ

e Fo

rwar

d Vo

ltage

∆V F (

V)

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF =350mA


Rel

ativ

e Lu

min

ious

Flu

x Ф

rel

Relative Luminious Flux Vs Junction TemperatureФV/ФV(25°C) = f(Tj); IF = 350mA


∆Cx

, ∆C

yChromaticity Coordinate Shift Vs Junction Temperature

∆Cx, ∆Cy = f(Tj); IF = 350mA

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

-50 -30 -10 10 30 50 70 90 110 130 150

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

-50 -30 -10 10 30 50 70 90 110 130 150

Rela

tive F

orw

ard

Vo

ltag

e

VF

(V)

Relative Forward Voltage Vs Junction Temperature


Rela

tive L

um

ino

us F

lux

rel

Relative Luminous Flux Vs Junction TemperatureV/V(25°C) = f(Tj); IF = 350mA


-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

-50 -30 -10 10 30 50 70 90 110 130 150

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

-50 -30 -10 10 30 50 70 90 110 130 150

Rela

tive F

orw

ard

Vo

ltag

e

VF

(V)

Relative Forward Voltage Vs Junction Temperature


Rela

tive L

um

ino

us F

lux

rel

Relative Luminous Flux Vs Junction TemperatureV/V(25°C) = f(Tj); IF = 350mA


-10.0

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

10.0

-50 -30 -10 10 30 50 70 90 110 130 150

Cx

Cy

-0.05

-0.04

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03

0.04

0.05

-50 -30 -10 10 30 50 70 90 110 130 150

Rela

tive W

avele

ng

th d

om

(nm

)

Relative Wavelength Vs Junction Temperaturedom = dom - dom (25°C) = f(Tj); IF = 350mA

Cx, C

yChromaticity Coordinate Shift Vs Junction Temperature

Cx, Cy = f(Tj); IF = 350mA

Junction Temperature Tj(°C) Junction Temperature Tj(°C)

Redundant

08/12/2016 V7.09

InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination

TM

Radiation Pattern


Rela

tive

Forw

ard

Volta

ge ∆

V F (V)


Rela

tive

Lum

inou

s In

tens

ity I re

l

Relative Luminous Intensity Vs Junction TemperatureIV/IV(25°C) = f(Tj); IF = 20mA


∆Cx

, ∆Cy

Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 20mA

0.270°

90°

80°

0

60°

50°

40°

30° 20°

0.6

0.4

1.0

0.8

10° 0°

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

-50 -30 -10 10 30 50 70 90 110 1300.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

-50 -30 -10 10 30 50 70 90 110 130

Rela

tive

Forw

ard

Volta

ge ∆

V F (V

)

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA


Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA

Rela

tive

Lum

inou

s In

tens

ity I r

el

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

-50 -30 -10 10 30 50 70 90 110 1300.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

-50 -30 -10 10 30 50 70 90 110 130

Rela

tive

Forw

ard

Volta

ge ∆

V F (V

)

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA


Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA

Rela

tive

Lum

inou

s In

tens

ity I r

el

Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF =20mA

-10.0

-8.0

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

8.0

10.0

-50 -30 -10 10 30 50 70 90 110 130

∆Cx

∆Cy

-0.030

-0.025

-0.020

-0.015

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

0.025

0.030

-50 -30 -10 10 30 50 70 90 110 130

Rela

tive

Wav

elen

gth ∆λ

dom

(nm

)

Relative Wavelength Vs Junction Temperature∆λdom = λdom - λdom (25°C) = f(Tj); IF = 20mA

∆Cx,

∆Cy

Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 20mA


17/05/2017 V5.07

PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant Soldering Leads

Cu Alloy With Au Plating

High Temperature Resistant Plastic

Silicone

Au Plating


TM

Note: This product is Pb free


14/06/2016 V3.08

PrimaxPlus • 180 InGaN White: MBWW-KZHG Package Outlines

Material

Material

Lead-frame

Package




Silicone Resin

Au Plating


180 InGaN White: MBWW-KZHGDOMINANTOpto TechnologiesInnovating Illumination

TM

Note : Primary thermal path is through Cathode lead of LED package.

12/10/2016 V3.0

7


Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads



Silicone

Au Plating

DOMINANT

Opto Technologies

Innovating IlluminationTM




DOMINANT Opto Technologies

09/05/14

PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx

Page 1 of 9

PRELIMINARY

UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to

change without notice.

Super high brightness surface mount LED for automotive applications.

120 viewing angle.

Compact package outline (LxW) of 3.7 x 3.5 mm.

Ultra low height profile – 0.8 mm.

Low thermal resistance;

Superior corrosion robustness.

Compatible to IR reflow soldering.

PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0

7

Primax • 175 InGaN White: MBWW-FSC Package Outlines

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads

Cu Alloy With Ag Plating


Silicone Resin

Ag Plating

DOMINANT

Opto Technologies



175 InGaN White: MBWW-FSC

18/04/2016 V1.0

8

PrimaxPlus 100 InGaN White: PQW-SSG Package OutlinesInGaN White: PQW-SSG

DOMINANT

Opto Technologies


Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads



Silicone Resin

Sn Plating



24/09/13

PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx

Page 1 of 14

PRELIMINARY

UNDER DEVELOPMENT



Super high brightness surface mount LED.

120 viewing angle.



Low thermal resistance.


PrimaxPlus 100mA Warm White: MAF-PSC

Note : Primary thermal path is through Cathode lead of LED package

InGaN Warm White: DDF-LJG08/12/2016 V7.0

10

DomiLED • InGaN Warm White: DDF-LJG Package Outlines

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads


High Temperature Resistant Plastic, PPA

Silicone Resin

Sn-Sn Plating

DOMINANT

Opto Technologies



07/07/2011 V4.0

6

SPNovaTM • InGaN White : NPW-RSZ Package Outlines

InGaN White : NPW-RSZ

Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads



Silicone Resin

Sn-Sn Plating

DOMINANT

Opto Technologies


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

12/10/2016 V3.07


Material

Material

Lead-frame

Package




Silicone

Au Plating


TM





09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9

PRELIMINARY UNDER DEVELOPMENT

Engineering reference data are not verified. The specifications are subject to change without notice.


120 viewing angle.






PrimaxPlus 350mA White: MAW-YZHG

31/05/2013 V1.07


Material

Material

Lead-frame

Package




Silicone Resin

Ag Plating


TM



18/04/2016 V1.08

PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines

InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination

TM

Material

Material

Lead-frame

Package




Silicone Resin

Sn Plating



24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14




120 viewing angle.







InGaN Warm White: DDF-LJG

08/12/2016 V7.010


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

12/10/2016 V3.07


Material

Material

Lead-frame

Package




Silicone

Au Plating


TM









120 viewing angle.







31/05/2013 V1.07


Material

Material

Lead-frame

Package




Silicone Resin

Ag Plating


TM



18/04/2016 V1.08



TM

Material

Material

Lead-frame

Package




Silicone Resin

Sn Plating







120 viewing angle.








08/12/2016 V7.010


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

12/10/2016 V3.07


Material

Material

Lead-frame

Package




Silicone

Au Plating


TM









120 viewing angle.







31/05/2013 V1.07


Material

Material

Lead-frame

Package




Silicone Resin

Ag Plating


TM



18/04/2016 V1.08



TM

Material

Material

Lead-frame

Package




Silicone Resin

Sn Plating







120 viewing angle.








08/12/2016 V7.010


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

12/10/2016 V3.0

7


Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads



Silicone

Au Plating

DOMINANT

Opto Technologies






09/05/14

PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx

Page 1 of 9

PRELIMINARY

UNDER DEVELOPMENT




120 viewing angle.






PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0

7


Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads



Silicone Resin

Ag Plating

DOMINANT

Opto Technologies




18/04/2016 V1.0

8

PrimaxPlus 100 InGaN White: PQW-SSG Package OutlinesInGaN White: PQW-SSG

DOMINANT

Opto Technologies


Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads



Silicone Resin

Sn Plating



24/09/13

PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx

Page 1 of 14

PRELIMINARY

UNDER DEVELOPMENT




120 viewing angle.







InGaN Warm White: DDF-LJG08/12/2016 V7.0

10


Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads



Silicone Resin

Sn-Sn Plating

DOMINANT

Opto Technologies



07/07/2011 V4.0

6



Material

Material

Lead-frame

Package

Encapsulant

Soldering Leads



Silicone Resin

Sn-Sn Plating

DOMINANT

Opto Technologies


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

12/10/2016 V3.07


Material

Material

Lead-frame

Package




Silicone

Au Plating


TM









120 viewing angle.







31/05/2013 V1.07


Material

Material

Lead-frame

Package




Silicone Resin

Ag Plating


TM



18/04/2016 V1.08



TM

Material

Material

Lead-frame

Package




Silicone Resin

Sn Plating







120 viewing angle.








08/12/2016 V7.010


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

12/10/2016 V3.07


Material

Material

Lead-frame

Package




Silicone

Au Plating


TM









120 viewing angle.







31/05/2013 V1.07


Material

Material

Lead-frame

Package




Silicone Resin

Ag Plating


TM



18/04/2016 V1.08



TM

Material

Material

Lead-frame

Package




Silicone Resin

Sn Plating







120 viewing angle.








08/12/2016 V7.010


Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM


07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

07/07/2011 V4.06



Material

Material

Lead-frame

Package




Silicone Resin

Sn-Sn Plating


TM

Notes:Primary thermal path is through Cathode lead of LED package.General tolerance: +/- 0.1mm.

17/05/2017 V5.08

Recommended Solder Pad


TM


17/05/2017 V5.09

Taping and orientation

• Reels come in quantity of 1000 units.• Reel diameter is 180 mm.


TM


17/05/2017 V5.010

Packaging Specification


TM


26/01/2015 V2.011



TM

350 InGaN White: MAW-YZHG

17/05/2017 V5.011


TM



Average 1pc PrimaxPlus 1 completed bag (1000pcs)

0.034 190 ± 10Weight (gram)

CardboardBox

Dimensions (mm) Empty BoxWeight (kg)

Super Small

Small

Medium

Large

For PrimaxPlus

Reel / BoxCardboard BoxSize

Weight (gram) 0.034 230 ± 10

DOMINANT TM

Moisture sensitivity level

Moisture absorbent material +Moisture indicator

The reel, moisture absorbent material and moisture indicator aresealed inside the moisture proof foil bag

Reel

Barcode label

Label

(L) Lot No : lotno

(P) Part No : partno

(C) Cust No : partno

(G) Grouping : group

(Q) Quantity : quantity

(D) D/C : date code

(S) S/N : serial no

DOMINANT Opto TechnologiesML TEMP2 260˚CRoHS Compliant

Made in Malaysia

325 x 225 x 190

325 x 225 x 280

570 x 440 x 230

570 x 440 x 460

0.38

0.54

1.46

1.92

7 reels MAX

11 reels MAX

48 reels MAX

96 reels MAX

17/05/2017 V5.012

Time (sec)0 50 100 150 200

300

250

225

200

175

150

125

100

75

50

25

275

Tem

pera

ture

(˚C

)Classification Reflow Profile (JEDEC J-STD-020C)

Ramp-up3˚C/sec max.

255-260˚C10-30s

60-150s

Ramp-down

6˚C/secmax.

Preheat 60-180s

480s max

217˚C

Recommended Pb-free Soldering Profile


TM


17/05/2017 V5.013


TM


Appendix

1) Brightness:1.1 Luminous intensity is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).1.2 Luminous flux is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).

2) Color:2.1 Chromaticity coordinate groups are measured with an internal reproducibility of ± 0.005 and an expanded uncertainty of ± 0.01 (accordingly to GUM with a coverage factor of k=3).2.2 DOMINANT wavelength is measured with an internal reproducibility of ± 0.5nm and an expanded uncertainty of ± 1nm (accordingly to GUM with a coverage factor of k=3).

3) Voltage:3.1 Forward Voltage, Vf is measured with an internal reproducibility of ± 0.05V and an expanded uncertainty of ± 0.1V (accordingly to GUM with a coverage factor of k=3).

Revision History

NOTE

All the information contained in this document is considered to be reliable at the time of publishing. However, DOMINANT

Opto Technologies does not assume any liability arising out of the application or use of any product described herein.

DOMINANT Opto Technologies reserves the right to make changes to any products in order to improve reliability, function

or design.

DOMINANT Opto Technologies products are not authorized for use as critical components in life support devices or sys-

tems without the express written approval from the Managing Director of DOMINANT Opto Technologies.

Page

-

2, 5

1, 2, 5, 6, 7, 11, 13

1, 7, 8

2, 7

Subjects

Initial Release

Update VfAdd Vf Binning

Update Features and ApplicationUpdate Thermal Resistance

Update GraphUpdate Package Outline Typo error on Material

Update Packaging SpecificationAdd Appendix

Update FeaturesUpdate on Package Outline

Update Recommended Solder Pad

Typo Error on Peak Pulse CurrentUpdate Package Outline

Date of Modification

26 Sep 2014

03 Jun 2015

12 Oct 2016

17 Mar 2017

17 May 2017

17/05/2017 V5.014


TM


About Us

DOMINANT Opto Technologies is a dynamic company that is amongst the world’s leading automotive LED manu-factures. With an extensive industry experience and relentless pursuit of innovation, DOMINANT’s state-of-art manufacturing and development capabilities have become a trusted and reliable brand across the globe. More in-formation about DOMINANT Opto Technologies, a ISO/TS 16949 and ISO 14001 certified company, can be found under http://www.dominant-semi.com.


TM


Please contact us for more information:

DOMINANT Opto Technologies Sdn. BhdLot 6, Batu Berendam, FTZ Phase III, 75350 Melaka, Malaysia.Tel: +606 283 3566 Fax: +606 283 0566E-mail: [email protected]

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