digital integrated circuits© prentice hall 1995 introduction vlsi design domain l practical...
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Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
VLSI DESIGN DOMAIN
Practical application of VLSI Design?
Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
INTRODUCTION
Systems based on Magnetically controlled switches
Vacuum Tubes» Analog» Digital
Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
HISTORICAL PERSPECTIVE
1930 - O.Heil and Lilienfeld – FET 1947 – Bardeen, Brattain and Shockley, AT & T Bell
Labs, - BJT 1958 – Jack Kilby, Texas Instruments, Hybrid IC Jack Kilby was awarded the year 2000 Nobel prize
Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
LEVEL OF INTEGRATION
Level of Number Typical Integration of Gates Applications
SSI 1-10 Basic Gates
MSI 10-100 Counters,Decoder, Encoder
LSI 100-1000 Memories, ADC/DAC
VLSI 1000-10,000 MPU’s
ULSI 10,000-100,000 DSP, DEC ALPHA
Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
Evolution in Speed/Performance
Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
Silicon in 2010
Die Area: 2.5x2.5 cmVoltage: 0.6 VTechnology: 0.07 m
Density Access Time(Gbits/cm2) (ns)
DRAM 8.5 10DRAM (Logic) 2.5 10SRAM (Cache) 0.3 1.5
Density Max. Ave. Power Clock Rate(Mgates/cm2) (W/cm2) (GHz)
Custom 25 54 3Std. Cell 10 27 1.5
Gate Array 5 18 1Single-Mask GA 2.5 12.5 0.7
FPGA 0.4 4.5 0.25
Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
TERMINOLOGY
Manufacturing Lead Time(Turnaround Time) – The time it takes to make an IC excluding the design time.
Integrated Circuit – Combination of circuit elements inseparably associated on or within a substrate.
Substrate – Supporting material. Monolithic IC – An IC whose elements are formed on or
within a substrate. Hybrid IC – Consists of a combination of two or more
ICs or an IC with some discrete components.
Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
TERMINOLOGY
Wafer(Slice) – Contains many ICs. Circular in nature. Diameter – 4, 5, or 6 inches.
Chip(die or bar) – Repeated ICs on a wafer. Test Plug(Process Control Bar Process Control
Monitor) - Special Chip Used to monitor the process parameters of the technology.Used to derive the timing models-Wafer can be discarded.
Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
Defect Density - Lethal defects per cm2
Yield - Yield = No. of Good Chips on a Wafer/Total Number of Chips
Utilization Factor - Utilization Factor = Used Chip Area/Total Chip Area
SOC- System On Chip
TERMINOLOGY
Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
SEMICONDUCTOR PHYSICS
Intrinsic Si Ideal crystal structure Valance 4 Almost no free carriers Almost no conduction
Digital Integrated Circuits © Prentice Hall 1995IntroductionIntroduction
SEMICONDUCTOR PHYSICS
Doping with valance 5 atoms (Phosphor, Arsenic) introduces “Loose electrons”
Electron donor Conductivity depends on
doping level