digital integrated circuits designing combinational logic
TRANSCRIPT
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Digital ICIntroduction
Digital Integrated Circuits
Designing Combinational
Logic Circuits
Fuyuzhuo
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Digital IC 2
Combinational vs. Sequential Logic
Combinational Sequential
Output = f(In) Output = f(In, Previous In)
CombinationalLogicCircuit
OutInCombinational
LogicCircuit
OutIn
State
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Digital IC 3
agenda
• Static CMOS design
• Ratioed logic design___Pseudo
NMOS
• Pass transistor design
• Dynamic logic
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Digital IC 4
agenda
• Static CMOS design
• Ratioed logic design___Pseudo
NMOS
• Pass transistor design
• Dynamic logic
What is the difference between inverter and logic?
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Digital IC 5
Static CMOS logic
• CMOS static characteristic
• CMOS propagate delay
• Large fan-in technology
• Logic effort
• CMOS power analysis
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Digital IC 6
Static CMOS Circuit
• Gate output is connected to either VDD or
VSS via a low-resistive path*
• Contrast to the dynamic circuit class,
which relies on temporary storage of
signal values on the capacitance of high
impedance circuit nodes
* except during the switching transients
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Digital IC
Construction of PDN• NMOS devices in series implement a NAND
function
• NMOS devices in parallel implement a NOR
function
A
B
A • B
A B
A + B
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Digital IC
CMOS NAND
A
B
A • B
A B
A B F
0 0 1
0 1 1
1 0 1
1 1 0
A
B
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Digital IC
CMOS NOR
A + B
A
BA B F
0 0 1
0 1 0
1 0 0
1 1 0
A B
A
B
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Digital IC
Complex CMOS Gate
OUT = !(D + A • (B + C))
D
A
B C
D
A
B
C
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Digital IC
Standard Cell Layout Methodology
signals
Routing
channel
VDD
GND
What logic function is this?
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Digital IC
OAI21 Logic Graph
C
A B
X = !(C • (A + B))
B
A
C
i
j
j
VDDX
X
i
GND
AB
C
PUN
PDN
ABC
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Digital IC
Two Stick Layouts of !(C • (A + B))
A B C
X
VDD
GND
X
CA B
VDD
GND
uninterrupted diffusion strip
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Digital IC
Consistent Euler Path
j
VDDX
X
i
GND
AB
C
A B C
• For a single poly strip for every input signal, the Euler paths in the PUN and PDN must be consistent (the same)
• An uninterrupted diffusion strip is possible only if there exists a Euler path in the logic graph
• Euler path: a path through all nodes in the graph such that each edge is visited once and only once
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Digital IC
OAI22 Logic Graph
C
A B
X = !((A+B)•(C+D))
B
A
D
VDDX
X
GND
AB
C
PUN
PDN
C
D
D
ABCD
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Digital IC
OAI22 Layout
BA D
VDD
GND
C
X
Some functions have no consistent Euler path like
x = !(a + bc + de) (but x = !(bc + a + de) does!)
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Digital IC
VTC is Data-Dependent
The threshold voltage of M2 is higher than M1 due to the body effect ()
VTn2 = VTn0 + ((|2F| + Vint) - |2F|)
since VSB of M2 is not zero (when VB = 0) due to the presence of Cint
VTn1 = VTn0
A
B
F= A • B
A B
M1
M2
M3 M4
Cint
VGS1 = VB
VGS2 = VA –VDS1
D
D
S
S 0
1
2
3
0 1 2
A,B: 0 -> 1B=1, A:0 -> 1A=1, B:0->1
0.5/0.25 NMOS
0.5 /0.25 PMOS
weaker
PUN
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Digital IC 20
CMOS Properties
• Full rail-to-rail swing high noise margins
• not dependent upon device sizes ratioless
• Always a path to Vdd or Gnd low output impedance
• zero steady-state input current high input resistance
• No direct path steady state no static power
• Propagation delay function of load capacitance and
resistance of transistors
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Digital IC 21
Static CMOS logic
• CMOS static characteristic
• CMOS propagate delay
• Large fan-in technology
• Logic effort
• CMOS power analysis
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Digital IC Slide 22
Delay Definitions
• tpdr:
• tpdf:
• tpd:
• tr:
• tf: fall time
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Digital IC Slide 23
Delay Definitions
• tpdr: rising propagation delay
• From input to rising output crossing VDD/2
• tpdf: falling propagation delay
• From input to falling output crossing VDD/2
• tpd: average propagation delay(max-time)
• tpd = (tpdr + tpdf)/2
• tr: rise time
• From output crossing 0.1 VDD to 0.9 VDD
• tf: fall time
• From output crossing 0.9 VDD to 0.1 VDD
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Digital IC Slide 24
Delay Definitions
• tcdr: rising contamination delay
• Minimum time from input to rising output crossing
VDD/2
• tcdf: falling contamination delay
• Minimum time from input to falling output crossing
VDD/2
• tcd: average contamination delay(min-time)
• Minimum time from input crossing 50% to the output
crossing 50%
• tpd = (tcdr + tcdf)/2
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Digital IC Slide 25
Simulated Inverter Delay
• Solving differential equations by hand is too hard
• SPICE simulator solves the equations numerically
• Uses more accurate I-V models too!
• But simulations take time to write
(V)
0.0
0.5
1.0
1.5
2.0
t(s)0.0 200p 400p 600p 800p 1n
tpd
f = 66ps tpd
r = 83psVin
Vout
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Digital IC
Why we need estimation?
• We have timing analyzer at different levels
• The architectural/micro-architectual level
• Logic level
• Circuit level
• Layout level
• GIGO(Garbage In Garbage Out)!
• Simulation could only tell how fast…, it could not
tell how to modify the circuit
Slide 26
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Digital IC Slide 27
Delay Estimation
• We would like to be able to easily estimate delay
• Not as accurate as simulation
• But easier to ask “What if?”
• The step response usually looks like a 1st order RC response with a decaying exponential.
• Use RC delay models to estimate delay
• C = total capacitance on output node
• Use effective resistance R
• So that tpd = RC
• Characterize transistors by finding their effective R
• Depends on average current as gate switches
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Digital IC 28
Input Pattern Effects on Delay
• Delay is dependent on thepattern of inputs
• Low to high transition
• both inputs go low
• delay is 0.69 Rp/2 CL
• one input goes low
• delay is 0.69 Rp CL
• High to low transition
• both inputs go high
• delay is 0.69 2Rn CL
CL
B
Rn
A
Rp
B
Rp
A
Rn Cint
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Digital IC Slide 29
Elmore Delay
• ON transistors look like resistors
• Pullup or pulldown network modeled as RC ladder
• Elmore delay of RC ladder
R1
R2
R3
RN
C1
C2
C3
CN
nodes
1 1 1 2 2 1 2... ...
pd i to source i
i
N N
t R C
R C R R C R R R C
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Digital IC Slide 30
RC Delay Models
• Use equivalent circuits for MOS transistors
• Ideal switch + capacitance and ON resistance
• Unit nMOS has resistance R, capacitance C
• Unit pMOS has resistance 2R, capacitance C
• Capacitance proportional to width
• Resistance inversely proportional to width
kg
s
d
g
s
d
kCkC
kCR/k
kg
s
d
g
s
d
kC
kC
kC
2R/k
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Digital IC 31
Switch Delay Model
A
Req
A
Rp
A
Rp
A
Rn CL
A
CL
B
Rn
A
Rp
B
Rp
A
Rn Cint
B
Rp
A
Rp
A
Rn
B
Rn CL
Cint
NAND2 INVNOR2
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Digital IC Slide 32
Example: 3-input NAND
• Sketch a 3-input NAND with transistor widths
chosen to achieve effective rise and fall
resistances equal to a unit inverter (R)
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Digital IC Slide 33
Example: 3-input NAND
• Sketch a 3-input NAND with transistor widths
chosen to achieve effective rise and fall
resistances equal to a unit inverter (R)
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Digital IC Slide 34
Example: 3-input NAND
3
3
222
3
• Sketch a 3-input NAND with transistor widths
chosen to achieve effective rise and fall
resistances equal to a unit inverter (R)
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Digital IC Slide 35
3-input NAND Caps
• Annotate the 3-input NAND gate with gate and
diffusion capacitance.
2 2 2
3
3
33C
3C
3C
3C
2C
2C
2C
2C
2C
2C
3C
3C
3C
2C 2C 2C
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Digital IC Slide 36
3-input NAND Caps
• Annotate the 3-input NAND gate with gate and
diffusion capacitance.
9C
3C
3C3
3
3
222
5C
5C
5C
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Digital IC Slide 37
Example: 2-input NAND
• Estimate worst-case rising and falling delay of 2-
input NAND driving h identical gates.
h copies
2
2
22
B
A
x
Y
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Digital IC Slide 38
Example: 2-input NAND
• Estimate rising and falling propagation delays of
a 2-input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
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Digital IC Slide 39
Example: 2-input NAND
• Estimate rising and falling propagation delays of
a 2-input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
R
(6+4h)CY
pdrt
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Digital IC Slide 40
Example: 2-input NAND
• Estimate rising and falling propagation delays of
a 2-input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
R
(6+4h)CY RCht pdr )46(2ln
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Digital IC Slide 41
Example: 2-input NAND
• Estimate rising and falling propagation delays of
a 2-input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
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Digital IC Slide 42
Example: 2-input NAND
• Estimate rising and falling propagation delays of
a 2-input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
pdft (6+4h)C2CR/2
R/2x Y
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Digital IC Slide 43
Example: 2-input NAND
• Estimate rising and falling propagation delays of
a 2-input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
(6+4h)C2CR/2
R/2x Y
RCh
RRCh
RCtpdf
)47(2ln
)22
]()46[(2
22ln
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Digital IC Slide 44
Delay Components
• Delay has two parts
• Parasitic delay
• 6 or 7 RC
• Independent of load
• Effort delay
• 4h RC
• Proportional to load capacitance
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Digital IC Slide 45
Contamination Delay
• Best-case (contamination) delay can be
substantially less than propagation delay.
• Ex: If both inputs fall simultaneously
6C
2C2
2
22
4hC
B
A
x
Y
R
(6+4h)CYR
3 2cdrt h RC
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Digital IC Slide 46
Layout Comparison
• Which layout is better?
AV
DD
GND
B
Y
AV
DD
GND
B
Y
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Digital IC
7C
3C
3C3
3
3
222
3C
2C2C
3C3C
Isolated
Contacted
DiffusionMerged
Uncontacted
Diffusion
Shared
Contacted
Diffusion
• assumed contacted diffusion on every s / d.
• Good layout minimizes diffusion area
• Ex: NAND3 layout shares one diffusion contact
• Reduces output capacitance by 2C
• Merged uncontacted diffusion might help too
Slide 47
Diffusion Capacitance
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Digital IC 48
Transistor Sizing
CL
B
Rn
A
Rp
B
Rp
A
Rn Cint
B
Rp
A
Rp
A
Rn
B
Rn CL
Cint
2
2
2 2
11
4
4
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Digital IC 49
Transistor Sizing a Complex CMOS
Gate
OUT = D + A • (B + C)
D
A
B C
D
A
B
C
1
2
2 2
4
4
8
8
6
3
6
6
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Digital IC 50
Fan-In Considerations
DCBA
D
C
B
A CL
C3
C2
C1
Distributed RC model
(Elmore delay)
tpHL = 0.69 Reqn(C1+2C2+3C3+4CL)
Propagation delay deteriorates rapidly as a function
of fan-in quadratically in the worst case
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Digital IC51
tp (NAND)as a function of fan-in
tpL
H
t p(p
sec)
fan-in
Gates with a fan-in greater than 4 should be avoided
0
250
500
750
1000
1250
2 4 6 8 10 12 14 16
tpHL
quadratic
linear
tp
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Digital IC52
tp as a function of fan-out
2 4 6 8 10 12 14 16
tpNOR2
t p(p
sec)
eff. fan-out
tpNAND2
tpINV
All gates have the
same drive current
Slope is a function
of “driving strength”
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Digital IC
tp as a function of fan-In and
fan-out• Fan-in: quadratic due to increasing
resistance and capacitance
• Fan-out: each additional fan-out gate adds
two gate capacitances to CL
53
tp = a1FI + a2FI2 + a3FO
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Digital IC 54
Delay Dependence on Input Patterns
-0.5
0
0.5
1
1.5
2
2.5
3
0 100 200 300 400
A=B=10
A=1, B=10
A=1 0, B=1
time [ps]
Voltage [V
]
Input Data
Pattern
Delay
(psec)
A=B=01 69(max)
A=1, B=01 62
A= 01, B=1 50
A=B=10 35(min)
A=1, B=10 76
A= 10, B=1 57
NMOS = 0.5m/0.25 m
PMOS = 0.75m/0.25 m
CL = 100 fF
共享电容充电
共享电容放电
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Digital IC 55
Static CMOS logic
• CMOS static characteristic
• CMOS propagate delay
• Large fan-in technology
• Logic effort
• CMOS power analysis
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Digital IC
How to choose design
techniques for large fan-in• Larger parasitic capacitor, larger load to the
preceding gate
• Load is dominated by fan-out, the design
technique makes sense
• Solution
• Progressive transistor sizing
• Transistor ordering
• Alternative logic structures
• Isolating fan-in from fan-out using buffer
insertion
56
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Digital IC 57
Transistor ordering
C2
C1In1
In2
In3
M1
M2
M3 CL
C2
C1In3
In2
In1
M1
M2
M3 CL
critical path critical path
charged1
01charged
charged1
delay determined by time
to discharge CL, C1 and C2
delay determined by
time to discharge CL
1
1
01 charged
discharged
discharged
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Digital IC58
Progressive sizing
• Distributed RC line
• M1 > M2 > M3
> … > MN
• the closest to the
output is the smallest
• Can reduce delay by
more than 20%;
decreasing gains as
technology shrinks
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Digital IC 59
Alternative logic structures
F = ABCDEFGH
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Digital IC 60
Isolating fan-in from fan-out
using buffer insertion
CLCL
Large fan-in
Large fan-out
isolating