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Developing for the Connected Car

Nilesh Parekh, Director Product Management, Qualcomm Technologies, Inc. Shyam Sundar, Principal Engineer/Manager, Qualcomm Innovation Center, Inc. Andrew Poliak, Director Global Business Development, QNX Software Systems

Qualcomm® Snapdragon™ Automotive Solutions

Nilesh Parekh, Director Product Management, Qualcomm Technologies

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc.

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Source: ABI, 2013, Gartner, Jan. ‘14

Changing Transportation

shipped in 2017 will be connected through mobile technology.

~60% New cars

By 2018, one in five new cars on the road will be ‘self aware’

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More than 10 million vehicles deployed globally across 15+

auto OEMS

Qualcomm Technologies’ Connected Car Leadership

In 2014, Qualcomm Technologies has 35+ connected car programs

from 13 OEMs in production

Majority of the world’s Tier 1 and Tier 2 connected car program

Majority of the world automakers connected car programs.

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Technologies developed for the smartphone industry will enable the next generation of automotive infotainment

Voice

Email/Calendar

News/ Entertainment

Apps Video

Movies Photography

Internet access

Maps

Text

Social networking Shopping

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HD Quality Graphics

3D Maps

Instrumentation

Navigation

Multimedia streaming

Bluetooth Wi-Fi hotspot

This use case is a hypothetical depiction of potential applications for Gobi and Snapdragon product offerings – not actual connected car and infotainment product. All screen images are simulated.

Rear seat entertainment

Content sharing

Mobile device integration

Driver assistance

Snapdragon automotive solution for smart, connected infotainment

Qualcomm Technologies’ integrated automotive solutions are

designed to speed up change in the in-car experience

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Safety

Head unit connectivity

Vehicle diagnostics

Wi-Fi hotspot

Navigation services

Vehicle to vehicle communication (DSRC)

Enhanced security features Object detection

Security

Drivers for connectivity: Moving to LTE From telematics to enabled cloud services

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Introducing Snapdragon Automotive Solutions Announced at CES 2014: Bringing connected infotainment with Snapdragon 602A

Qualcomm Gobi is a product of Qualcomm Technologies, Inc. Qualcomm VIVE and Qualcomm Izat are products of Qualcomm Atheros, Inc.

Snapdragon Automotive Solution

Qualcomm® Gobi™ 4G LTE Advanced modem (9x15, 9x30)

First Snapdragon 602A automotive grade processor

First 2-stream Wi-Fi and Bluetooth for automotive

Qualcomm® Izat™ GNSS (GPS, Glonass, DR)

Support for Android, Linux and QNX HLOS with automotive optimizations for critical services fast boot

HW and SW tightly optimized and integrated for infotainment systems

Snapdragon Automotive Development Platform (ADP) to enable ecosystem to take advantage of integrated offering and rapidly build and test solutions

Integrated and Optimized Solution

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Chipsets based on Snapdragon for automotive integrate: 1.5 GHz Quad Core Qualcomm® Krait™ CPU 400 MHz Qualcomm® Adreno™ 320 GPU 500 MHz Qualcomm® Hexagon™ DSP Wi-Fi and Bluetooth connectivity GNSS receiver and dead reckoning Power Management ICs Camera and video engines with compression, decompression and

image processing Multi-display support (Center Stack, Rear Seat, Instrument Cluster) Audio cores Security cores Multi-mode modem technology (3G, 4G-LTE)

HLOS support: QNX, Android, Linux Targeting high and mid tier infotainment platforms

Meets automotive temperature, quality and reliability requirements AEC-Q100 Temp range (Ta = -40C to +85C) Failure rates

Qualcomm Technologies’ Infotainment SoC Snapdragon 602A is Qualcomm Technologies first automotive grade SoC

Qualcomm Krait, Qualcomm Adreno and Qualcomm Hexagon are products of Qualcomm Technologies, Inc.

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Snapdragon ADP: Overview The Snapdragon ADP enables the development of a comprehensive and broad range of LTE connected infotainment systems

• Snapdragon ADP provides a fully-featured application development environment for rapid development of high performance and power efficient connected infotainment offerings

• The integrated system approach can help lower development cost, reduce risk, and speed time to market.

Main Board

Network Board

Radio Board

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Snapdragon ADP: Hardware Specifications Summary Chipset

– S602A 23x23, PMM8920, QCA6574, RGR7640

Memory

– 4GB (3GB accessible)/2GB DDR3L-1066

– 64 GB eMMC

– 64MB SPI NOR Flash

– One SD card slot

Three Display Outputs

– LVDS to FPDLINK III

– HDMI

– DSI to HDMI

– Touch screen on FDPLINK III display

– Additional touch screen on USB interface

Cameras Inputs

– FPD-LINK II Input

– CVBS video input

Sensors

– Accelerometer, Compass

Main board connectors

– 12V DC jack

– USB2.0: One micro OTG, three host type-A;

– One SD card slot

– One SIM card slot

– One SATA connector

– JTAG, USB to UART debug connector

– Display: FDPLINK III x1, HDMI x2 (1080p x1, 720p x1)

– Camera: FPDLINK II x1, CVBS in x 3 (2 concurrent)

– Antenna: 2 WAN, 2 WLAN/BT, 1 GPS

– RCM connector

Radio board connectors

– Speaker amp DC power input

– Speaker output x4, Line output x2

– Microphone input x4

– Aux audio input jack

– Radio antenna connectors

– JTAG

Network board connectors

– Ethernet socket x1

– CAN connector x2, LIN connector x1

Audio

– NXP Dirana3 car audio and radio system

– 6-ch audio output (speaker x4, line out x2)

– 4 microphone input

– MDM modem audio support

– Early sound play with analog audio from the network processor

Wireless Connectivity

‒ WLAN: 802.11ac, 2.5GHz/5GHz,

‒ BT 4.0

‒ GPS

WWAN

– MDM9x15 LTE module

Wired Connectivity

– Atmel SAM4E/SAMV71 Network processor

– Ethernet AVB support (limited function with SAM4E)

– CAN interface x2, LIN interface x1

Hard Keys

– Four SW definable buttons

– Power and reset buttons

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Snapdragon ADP Ordering Process Intrinsyc distributes and supports Snapdragon ADP

• Place an order on the Intrinsyc website (intrinsyc.com/adp)

− Specify HDCP licensee or non-licensee

− Add to your cart and select quantities

− Review and accept the click-through EULA at the bottom of the page

− Enter payment and shipping information

• Once approved, Intrinsyc will ship the ADP units directly to the address indicated in the order

− Android BSP will be shipped with all units from Intrinsyc

− QNX BSP coming at a later date at Intrinsyc

• Intrinsyc provides Tier-1 and Tier-2 support

− Included Technical support (via email and phone)

− Additional support on a time and material basis

− SW updates and RMA support

Android for Snapdragon Automotive Development Platform (ADP)

Shyam Sundar Linux/Android Project Engineer, Snapdragon Automotive, Qualcomm Innovation Center, Inc.

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ADP Ecosystem Receives:

- ADP Platform. - Binary Component Package. - Build & Debugging Tools. - Documentation.

- Linux Kernel 3.4. - Android Open Source Project (Kitkat).

ADP Software Build

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Automotive Android Solution

UART BSP

OpenCL 1.0 OMX IL Video Codecs

Adreno 320 Driver Video Driver & Firmware ADSP Driver & Firmware

OpenGL ES 2.0

Location API

Feature Interfaces

OMX IL Audio Codecs Modem Interface WiFi Driver & Firmware

Stagefright

Libraries & Middleware Audio HAL Video HAL Audio Policy Audio & Video Codecs

SurfaceFlinger

Vehicle Networks Interface

WiFi & Soft AP BlueDroid

DR Plugin Engine

Kernel & Boot

Linux Kernel 3.4

Proprietary Bootloaders & Little Kernel (LK)

HSUSB SD/eMMC SDIO 3.0 PCIe 2.0 SATA I2C I2S Keypad Touch Display ALSA

Clock PMIC ADV7282 GSS WLAN KGSL V4L2

SensorOne Interface

Audio Flinger Radio Interface Layer Location Provider

Sensors HAL

Framework Video Audio Camera Display Telephony & Data Location Connectivity Vehicle Networks Graphics

Authored by QuIC, Inc.

Minor Modifications/Extensions

Applications

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Automotive Android Solution – Areas of Impact & Changes

Multiple Displays Description: Driver-level support for 3 simultaneous displays over LVDS, DSI and HDMI. Developer API Impact: None

Audio Description: Multi-stream Multi-device concurrencies over an Automotive Audio/Radio interface. Developer API Impact: New API Extensions Added.

Quick Boot Description: Optimizations to Bootloader, LK, Kernel and Android Startup sequence to meet Automotive Boot Times. Developer API Impact: None

Camera Description: Android Camera API is currently NOP due to Safety-Domain Camera architecture. Non-safety-domain Camera applications are planned, but not currently supported. DeveloperAPI Impact: Camera Applications will not be functional.

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Automotive Android Solution – Areas of Impact & Changes

Vehicle Networks Description: New API and Events Interface to propagate Vehicle Events from sources such as the CAN bus. Serves Vehicle Events to Android Applications as well as internal components. Developer API Impact: New API Extensions Added.

Bluetooth

Description: Automotive Profiles (HFP Sink, A2DP Sink, etc.) Developer API Impact: New API Extensions Added.

Telephony & WWAN Data Description: Integration to an Automotive-grade external modem module over HSUSB. Integrated Telephony and Data functionality over Android Telephony API and RIL. Developer API Impact: None

GPS with DR Plugin Engine Description: GPS solution with DR Plugin Interface that allows plugging in any 3rd party DR solution. DeveloperAPI Impact: None

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Qualcomm Automotive Android Solution

Other APIs Supported

• OpenMAX IL • OpenGL ES • OpenCL • ALSA • Qualcomm® Hexagon™ SDK

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Opportunities for Ecosystem

Virtualization/Hypervisor

Audio/Video Codecs

OpenDSP Extensions

Voice Recognition

OTA Updates

iAP/iAP2/CarPlay

GAL

Ethernet AVB

MultiDisplay/MultiWindow

HMI & Applications

Authored by QuIC, Inc.

QNX for Snapdragon Automotive Development Platform

Andrew Poliak Director of Business Development, QNX Software Systems

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Overview of QNX in the automotive industry

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QNX in the Automotive Market

QNX software is deployed by over 40 OEMs (Original Equipment Manufacturers) in tens of millions of vehicles throughout North America, Europe, and Asia

Tier ones

OEMs

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QNX supports today’s broadest cross-platform mobile development environments

QNX CAR Platform supports HMI and app environments using Qt, HTML5, .apk, and OpenGL ES combined in numerous ways

Plus Elektrobit GUIDE and Crank Storyboard UX tools

Best Application Platform

Mobile development environment

Supported platforms

Qt iOS, Android, BlackBerry 10

HTML5 iOS, Android, BlackBerry 10, Win8

C++/OpenGl ES iOS, Android, BlackBerry 10

Java (.apk) Android, BlackBerry 10

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QNX CAR Platform Design Principles

Speed customer’s time-to-market

Leverage industry-standard HTML5, Android, and Qt mobile app development

Integrate best of breed automotive technologies − Voice recognition, navigation, and connectivity

Solve development and integration issues − Code reuse, boot times, and memory footprint

Provide customer with flexibility

Support multiple simultaneous HMI frameworks − Cleanly separated UI and service layers

Fully abstracted component subsystems − Substitute for preferences or regional needs

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Key features of QNX CAR Platform

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QNX CAR Platform Demo

Demo of QNX CAR Platform is focused on stability and concurrence of core automotive features

Dashboard summarizes current system activity and basic settings: − Navigation

− Weather

− Music playing

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Navigation

QNX platform can be configured for multiple navigation engines: − Elektrobit street director

− Nokia HERE

− Other

Snapdragon graphics chipset with QNX platform has the required performance quality to support advanced graphics − 3-D accelerated graphics in navigation

Smooth rendering performance

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Media Framework

Displays controls for discovering and playing audio and video files on different sources: Play Radio, Play Music, Play Video, and Search

Smooth scrolling animations

Compositing windowing system integrates multiple graphics and user interface (UI) technologies into a single display

Supports multiple graphics technologies: − Video

− Open GL ES

− HTML5

− Qt 5

Can have multiple displays and multiple cameras

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Connectivity

The QNX OS provides support for the latest in wired and wireless networking, and connectivity options out of the box − LTE cellular

− Bluetooth

− Wifi

− USB 3.0, USB On-The-Go, USB device

Allows messages and media to display in the head unit from a mobile device

Have mastered the difficult task of providing concurrency, stability, and performance

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Key Performance Points

Fastboot − Flexibility to optimize the order of the boot process and stage the boot process

− Instant Device Activation (IDA) loads drivers during boot process, giving access to critical resources 50ms after power-on-reset

Power Management − Tickless mode, tolerant timers, lazy interrupts

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For more information on Qualcomm, visit us at: www.qualcomm.com & www.qualcomm.com/blog

©2013-2014 Qualcomm Technologies, Inc. and/or its affiliated companies. All Rights Reserved. Qualcomm, Snapdragon, Gobi, Adreno, VIVE and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. IZat and Krait are trademarks of Qualcomm Incorporated. All Qualcomm Incorporated trademarks are used with permission. Other products and brand names may be trademarks or registered trademarks of their respective owners. References in this presentation to “Qualcomm” may mean Qualcomm Incorporated, Qualcomm Technologies, Inc., and/or other subsidiaries or business units within the Qualcomm corporate structure, as applicable. Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering, research and development functions, and substantially all of its product and services businesses, including its semiconductor business, QCT.

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