design tools, flows and library aspects during the fe-i4 implementation on silicon vladimir zivkovic...

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Design Tools, Flows and Library Aspects during the FE-I4 Implementation on Silicon Vladimir Zivkovic National Institute for Subatomic Physics Amsterdam, the Netherlands Microelectronics User Group (MUG) meeting Topical Workshop on Electronics for Particle Physics (TWEPP) 2011 Vienna, September 27 th 2011

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Design Tools, Flows and Library Aspects during the FE-I4 Implementation on Silicon

Vladimir ZivkovicNational Institute for Subatomic

PhysicsAmsterdam, the NetherlandsMicroelectronics User Group (MUG) meeting

Topical Workshop on Electronics for Particle Physics (TWEPP) 2011Vienna, September 27th 2011

2Vladimir ZivkovicMUG, Vienna, 27-09-

2011

FEI4-A Architecture and Design Foundations

• Radiation hardness out of the box• Good power distribution

• Essential when making the long columns• Substrate isolation (T3)

• Essential when using standard cell synthesized logic

Innovations- Region architecture (memory on pixel)- Modular approach and distributed design

- Low current operation, fault tolerance, digital and mixed-signal Test Benches for Simulation

Multi-site collaboration -> design repository necessary (SOS Cliosoft platform)

vv 8M 130 nm CMOS

3-2-3 Stack

3Vladimir ZivkovicMUG, Vienna, 27-09-

2011

Layout Foundation

Isolated NMOS / PMOS

T3 isolates the switching activity of digital circuits from the substrate and other blocks- very convenient for modular (core) – based designs

DM option chosen over LM for :• More flexibility to provide good power distribution (low resistivity M8 and M7)• Good shielding (M7 is less resistive, so M8 can be sacrificed to provide for a

solid shield)• Good for inter-block routing (low RC)• Full MOSIS support

Mind: local routing restricted to 3 metal layers due to bad local high density routing

4Vladimir ZivkovicMUG, Vienna, 27-09-

2011

Standard Cell Library – ARM

• Fully characterized and qualified, low-power version also available, as well as SEU-resistant

• Extensive use of inherited connections– Some problems during delivery exchange experienced there due to the non-

uniform distribution of the library

• All digital blocks placed in T3-isolated pwells

• A stable substrate (under T3 isolation) is guaranteed by enforcing a maximum distance of 100 μm between substrate contacts

5Vladimir ZivkovicMUG, Vienna, 27-09-

2011

Design RepositorySOS design repository from cliosoft.com Repository hosted at LBNL and mirrored at all other sites

6Vladimir ZivkovicMUG, Vienna, 27-09-

2011

Design Flow for FEI4 at NIKHEF (digital)

• RTL creation with Verilog (no VHDL!)• Two-pass mapped flow for synthesis and DfT

– Synopsys Design and DfT Compiler, Version B-2008.09-SP2 for linux

• Placement and Routing– Cadence Encounter Digital Implementation (EDI) 9.1 – Cadence SoC Encounter v07.10-s219_1 (reference, backup)

• Physical Netlist Verification and Sign-off– Statistical Timing Analysis (STA) with .spef, Synopys PrimeTime, Version B-

2008.09-SP2 for linux

• Physical Verification– Virtuoso 6.1.3 _> 6.1.4 Open Access– DRC, LVS, netlist extraction with parasitics with Calibre 2009.3_32.2

• ATPG – Synopsys TetraMAX ATPG, Version B-2008.09-SP2 for linux

• Simulations– Cadence NcSim 8.2 -> NcSim 9.2

7Vladimir ZivkovicMUG, Vienna, 27-09-

2011

Readout Core Modification• Layout boundary fixed• Pin positions fixed• Timing constraints the same• 15% larger design had still to be fit in

Design Flow going back and fourth between Synopsys and Cadence

Top-level integration issues

8Vladimir ZivkovicMUG, Vienna, 27-09-

2011

Design Flow for FEI4 at NIKHEF (analog)

• Schematic capture, layout creation– Virtuoso 6.1.3

• Simulations– MMSIM 7.0

• Physical Verification– DRC

– Assura 3.1.7 OA (easy to use, primary)– Calibre 2009.3_32.2 (final)

– LVS – Assura 3.1.7 OA– Calibre 2009.3_32.2

• Extraction – QRC EXT 7.12

9Vladimir ZivkovicMUG, Vienna, 27-09-

2011

Design Verification Efforts• Standalone block simulations with extracted parasitics • Open Verification Methodology Environment (OVM)

– This means that the real life commands/functions are converted into the testbench.

• Digital full chip simulations• Parasitic capacitances, process

variations, interconnect delays included• Digital (block interconnect) extraction

using Assura black-box approach

10Vladimir ZivkovicMUG, Vienna, 27-09-

2011

Mixed-Signal Top-level TestbenchAnalog/Mixed-signal functionality check from the top-level

Model driven test & verification development

IC model

Loadboard & instrument model

Test description

Each hardware component can be modeled at arbitrary level of abstraction

11Vladimir ZivkovicMUG, Vienna, 27-09-

2011

ATPG and Test Assembly Flow

DIB Integration

WaveForm {

Pin = rzClocks;

Drive = RZ, t1, t2;

}

WaveForm {Pin = outputs;Expect = SB, t1, t2;

}

WaveForm {

Pin = inputs;

Drive = NR, tdel;

}

tdel

vector

waveform

tdel

t

period

t1

vector

waveform

t2

t

period

t1

vector

waveform

t2

t

period

t1 t2

Timing TetraMax

ATPG

STILvectors

test bench

NCsim

DfT

Protocols

test lib

Physical netlist

ATPG constraints