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Delivering the Datacenter of the Future Making the Open Compute Vision a Reality
Eric Hooper Director, Rack Scale Architecture Cloud Platforms Group Intel Corporation
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All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Intel® Xeon®, Intel® Atom™, Intel® Open Network Platform, Intel® Rack Scale Architecture, Intel® Lustre*, Intel® SSD, Intel® Ethernet Controllers and the Intel logo are trademarks of Intel Corporation or in the US and other countries.
Copyright © 2014, Intel Corporation. All rights reserved.
* Other brands and names may be claimed as the property of others.
Legal Disclaimer
* Other brands and names may be claimed as the property of others. 3
Making the Open Compute Vision a Reality
3
Development
Contributions
Adoption
* Other brands and names may be claimed as the property of others.
Intel® Rack Scale Architecture Vision
• Flexible Compute Platform Support range of Intel® Xeon® or Atom® processor based nodes
• Open Network Platform & Photonics Interconnect – Network switch on standard hardware
• Storage & Memory Systems – Modular tray with range of technologies
Modular systems
(Pooled Resources) Logical
Architecture
Enables Software Defined
Orchestration
Flexibility – Capital Efficiency – Lower TCO
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Rack Scale Architecture – Near Term
OCP Boards
Open Network Platform
Silicon Photonics
Interconnect
Remote Direct Attach
Storage Density
Up to
1.5X2
Provisioned Power
Up to
5X2
Cables
Up to
3X1
NW Downlink
Up to
25X1
So#ware and workloads used in performance tests may have been op9mized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, so#ware, opera9ons and func9ons. Any change to any of those factors may cause the results to vary. You should consult other informa9on and performance tests to assist you in fully evalua9ng your contemplated purchases, including the performance of that product when combined with other products. Results have been es9mated based on internal Intel analysis and are provided for informa9onal purposes only. Any difference in system hardware or so#ware Results have been es9mated based on internal Intel analysis and are provided for informa9onal purposes only. Any difference in system hardware or so#ware design or configura9on may affect actual performance. 1. Improvement based on standard rack with 40 DP servers, 48 port ToR switch, 1GE downlink/server and 4 x10GE uplinks, Cables: 40 downlink and 4 uplink vs . rack with 42 DP servers, SiPh patch panel, 25Gb/s downlink, 100Gb/s uplink, , Cables: 14 op9cal downlink, and 1 op9cal uplink. Actual improvement will vary depending on configura9on and actual implementa9on. 2. Improvement as compared to 20 Dell PowerEdge R720, N+1 redundant power, 705W PSU x2, peak power provisioned 30,000 WaZs vs. same server, shared DC power using 1 power shelf of 7x 700W modules and 4200W (N+1) : power provisioned 4900 WaZs hZp://www.opencompute.org/wp/wp-‐content/uploads/2013/01/Open_Compute_Project_Power_Shelf_v0.3.pdf
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3 Generations of OCP Boards
Decathlete
Certified Boards
Windmill
Panther Leopard
New Boards Next Generation Intel® Xeon® Processor E5-2600 Product Family
Intel® Atom™ Processor C2000 Product Family
First Functional Rack Scale Architecture Demo with Next Generation Intel® Xeon® Processor * Other brands and names may be claimed as the property of others.
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January 2013 January 2014
Intel Silicon Photonics What a difference a year can make
Design is
IN PROCESS….
Design Guide
DRAFT Available…
MXC connector design is COMPLETE
FUNCTIONAL Silicon Photonics interconnect in Rack Scale Architecture
OEM SAMPLING & designs
Making the Open Compute Vision a Reality
8
Development
Contributions
Adoption
* Other brands and names may be claimed as the property of others.
Supporting Community Adoption
9 * Other brands and names may be claimed as the property of others.
Partnership with the OCP Grant Richard Goldman Sachs Technology Fellow, Managing Director
* Other brands and names may be claimed as the property of others. 11
Goldman Sachs Technology At a Glance
68 Firm and Public Designed Data
Centers
500,000 Compute Cores
34 Megawatts Available
16MM+ Software changes
per month
4,000 Applications
1.2BN Lines of code
28 PB Storage
8,000+ Engineers &
Technologists
10,000 Network Devices
118,000+ Servers in the
“GS Cloud”
59,000 Databases
45,000 Servers
50,000 Remote Desktop
Sessions
Source – Internal Goldman Sachs data 12
GS Partnership with the OCP
GS is a founding member of the Board of Directors of the Facebook
Open Compute Foundation
Works with financial and other members on 19” Intel & AMD form
factor contributions
Future: Deploy OCP form factors in production
GS attends OCP formation and issues press statement supporting
Partners for formation of Hardware Management Track Assists with of C&I Track creation
2011 2014+ Open Compute Project
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How does GS leverage OCP? Requirement: " A single scale out 19” motherboard (from Intel – Decathlete) for remote desktop,
risk calculation, storage and cloud for traditional cabinets
Technical Engagement: " GS Compute Engineering members materially contributed to.. " Technical specifications " Review with CPU manufacturers detail designs " Testing of BIOS and other firmware for functionality and performance
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Supply Chain Model Transformation " Transformation in supply chain brings both disruption and benefits " New partners, vendors and ecosystem to manage
Classic Today and Tomorrow
Manufacturers
Integrators Customers
Integrators Manufacturers Customers
Bridging hyper-scale technology, which embraces Open Compute principles, with the conventional data centers and applications
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Making the Open Compute Vision a Reality
15
Development
Contributions
Adoption
* Other brands and names may be claimed as the property of others.