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    CHAPTER 1

    INTRODUCTION

    1.1 Need of Protective Devices

    Current flow in a conductor always generates heat. Excess heat is damaging to

    electrical components. Over current protection devices are used to protect conductors from

    excessive current flow. Thus protective devices are designed to keep the flow of current in a

    circuit at a safe level to prevent the circuit conductors from overheating.

    1.2 What is Fuse

    A fuse is a one-time over-current protection device employing a fusible link that

    melts (blows) after the current exceeds a certain level for a certain length of time. Typically,

    a wire or chemical compound breaks the circuit when the current exceeds the rated value. A

    fuse interrupts excessive current so that further damage by overheating or fire is prevented.

    Wiring regulations often define a maximum fuse current rating for particular circuits. Over

    current protection devices are essential in electrical systems to limit threats to human life

    and property damage. Fuses are selected to allow passage of normal current and of excessive

    current only for short periods.

    1.3 What is a Polyfuse

    Polyfuse is a resettable fuse that doesnt need to be replaced like the conventional

    fuse. Many manufacturers also call it PolySwitch or Multi-Fuse .Polyfuse are designed and

    made of PPTC material in thin chip form. It is placed in series to protect a circuit. Polyfuse

    provide over-current protection and automatic restoration.

    Like traditional fuses, PPTC devices limit the flow of dangerously high current

    during fault condition. Unlike traditional fuses, PPTC devices reset after the fault is cleared

    and the power to the circuit is removed. Because a PPTC device does not usually have to be

    replaced after it trips and because it is small enough to be mounted directly into a motor or

    on a circuit board, it can be located inside electronic modules.

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    1.4 Over Current Protection

    Polyfuse is a series element in a circuit. The PPTC device protects the circuit by

    going from a low-resistance to a high-resistance state in response to an over current

    condition in fig1.1.

    Fig.1.1: Over Current Protection Circuit Using Polyfuse device.

    This refers to tripping the device. In normal operation the device has a resistance that

    is much lower than the remainder of the circuit. In response to an over current condition, the

    device increases in resistance (trips), reducing the current in the circuit to a value that can be

    safely carried by any of the circuit elements. This change is the result of a rapid increase in

    the temperature of the device, caused by I2R heating.

    1.5 What is a PPTC Device

    A PPTC device is a form of thermistor. A thermistors is a type of resistor

    whose resistance varies significantly with temperature, more so than in standard resistors.

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    The word is a portmanteau of thermal and resistor. Thermistors are, widely used as inrush

    current limiters, temperature sensors, self-resetting over current protectors and self-

    regulating heating element.

    Fig.1.2: A Type of PPTC Device

    Thermistors differ from resistance temperature detectors (RTD) in that the material

    used in a thermistor is generally a ceramic or polymer, while RTDs use pure metals. The

    temperature response is also different; RTDs are useful over larger temperature ranges,

    while thermistors typically achieve a higher precision within a limited temperature range,

    typically 90 C to 130

    .

    Fig.1.3: Thermistor symbol

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    Assuming, as a first-order approximation, that the relationship between resistance

    and temperature is linear then:

    Where,

    R = change in resistance

    T= change in temperature

    k= first-order temperature coefficient of resistance.

    Thermistors can be classified into two types, depending on the sign of k. Ifkis

    positive the resistance increases with increasing temperature, and the device is called a

    positive temperature coefficient (NTC) thermistor or posistor. Ifkis negative, the resistance

    decreases with increasing temperature, and the device is called a negative temperature

    coefficient (NTC) thermistor. Resistors that are not thermistors are designed to have a kas

    close to zero as possible, so that their resistance remains nearly constant over a wide

    temperature range. When a polymer film is attached to PTC thermistors these are known as

    PPTC devices.

    1.6 Resistance Temperature Characteristics

    The resistance/temperature characteristics of the two types are shown in Fig.1. Theresistance the NTC falls following an exponential characteristic over a wide temperature

    range. The NTC Thermistor shows a large increase of resistance over a small temperature

    range of power dissipation within the component. When thermistors, especially the small

    bead type, are used for temperature measurement, the power dissipation must be kept to a

    low level to avoid inaccuracies due to self-heating. Fig1.3 shows the voltage-current

    characteristic of an NTC thermistor. Initially the relationship is linear, since, at low power

    levels, the dissipation is insufficient to raise the temperature above ambient. At higher power

    levels.

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    Fig.1.3: Resistance &Temperature Characteristics of NTC and PTC Thermistor

    resistance falls and a value of voltage Emax is reached when further increases of current

    cause a fall in potential across the thermistor. Dissipation factor and thermal time-constant

    are two further properties frequently quoted. The first of these is the power expressed in mill

    watts required to raise the temperature of the thermistor by 1 deg C. The time constant is the

    time for the resistance of the thermistor to change by 63 % of the total change when

    subjected to a step function change in temperature.

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    CHAPTER 2

    PRINCIPLE OF OPERATION

    Technically these are not fuses but Polymeric Positive Temperature Coefficient

    (PPTC) Thermistors. Polyfuse device operation is based on an overall energy balance.

    Under normal operating conditions, the heat generated by the device and the heat lost by the

    device to the environment are in balance at a relatively low temperature, as shown in Point

    A of Figure. Point A is that point which shows that polyfuse works in normal working

    conditions i.e. normal current flows through the circuit .If the current through the device is

    increased while the ambient temperature is kept constant, the temperature of the device

    increases. Further increases in either current, ambient temperature or both will cause thedevice to reach a temperature where the resistance rapidly increases as shown in fig 2.1.

    Fig2.1: Temperature versus Resistance Characteristics of Polyfuse

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    Any further increase in current or ambient temperature will cause the device to

    generate heat at a rate greater than the rate at which heat can be dissipated, thus causing the

    device to heat up rapidly. At this stage, a very large increase in resistance occurs for a very

    small change in temperature, between points B and C of Figure2.1.Point C is that point at

    which transition from low resistance state to high resistance state takes place. This is the

    normal operating region for a device in the tripped state. This large change in resistance

    causes a corresponding decrease in the current flowing in the circuit. This relation holds

    until the device resistance reaches the upper knee of the curve (Point C of Figure2.1). At this

    point maximum resistance of the device can be obtained. As long as the applied voltage

    remains at this level, the device will remain in the tripped state (that is, the device will

    remain latched in its protective state). Once the voltage is decreased and the power is

    removed the device will reset.

    2.1 Voltage-Temperature Characteristics

    Thermistors can also be made with a positive temperature coefficient of resistance

    but, as shown in Fig.2.2 their characteristic is not the inverse of the NTC type. These

    thermistors are made from barium titanate. When used in its monocrystalline form this

    material has a resistance which varies inversely with temperature. A polyfuse is not however

    monocrystalline but rather numerous small crystals bonded together during the sintering

    process. At a certain temperature, barrier layers form at the inter crystalline boundaries and

    impedance to the electron flow. As the temperature rises, so does the resistance of these

    barrier layers until, above a certain limit, the material resumes its normal negative

    characteristics, but at a much higher resistance value. The nature of this resistance-

    temperature characteristic prevents a simple mathematical relationship and manufacturers

    usually quote a resistance at 25C together with resistance values at other temperatures.

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    Fig2.2: Voltage versus Temperature Characteristics of Polyfuse

    . The term 'switch temperature, Tsw' is introduced to denote the temperature at which the

    resistance starts to rise rapidly. It is defined as that temperature at which the thermistor has a

    resistance equal to twice its minimum value. Examination of the voltage-current

    characteristic (Fig.2.2) shows the initial linear portion of the curve where voltage and

    current rise together followed by the rapid drop in current that occurs once the thermistor

    has changed to its high resistance state.

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    CHAPTER 3

    CONSTRUCTION & WORKING

    PPTC fuses are constructed with a non-conductive polymer plastic film that exhibits

    two phases. The first phase is a crystalline or semi-crystalline state where the molecules

    form long chains and arrange in a regular structure. As the temperature increases the

    polymer maintains this structure but eventually transitions to an amorphous phase where the

    molecules are aligned randomly, and there is an increase in volume. The polymer is

    combined with highly conductive carbon. In the crystalline phase the carbon particles are

    packed into the crystalline boundaries and form many conductor combination has a low

    resistance.

    Fig.3.1: Conductive paths and the Polymer Carbon

    A current flowing through the device generates heat (I2R losses). As long as the

    temperature increase does not cause a phase change, nothing happens. However, if the

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    current increases enough so that corresponding temperature rise causes a phase change, the

    polymers crystalline structure disappears, the volume expands, and the conducting carbon

    chains are broken. The result is a dramatic increase in resistance. Whereas before in the

    phase change a polymer-carbon combination may have a resistance measured milliohms or

    ohms, after the phase change the same structures resistance may be measured in mega

    ohms. Current flow is reduced accordingly, but the small residual current and associated I2R

    loss is enough to latch the polymer in this state, and the fuse will stay open until power is

    removed.

    Fig.3.2: Polymer Molecules in Amorphous State

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    Fig3.3: Transition of Molecules from Semicrytalline to Amorphous State

    At normal working conditions, the molecules of the device are in low resistance

    state, which is known as crystalline structure of the Polyfuse. When current starts to flow

    through the device, the temperature of the molecules tends to increase and when the current

    exceeds from a certain level the temperature increases and the resistance increases. So the

    molecules of the material go into high resistance state so the current reduces accordingly in

    the device. Due to leakage current and I2R losses the circuit is still open, until the power is

    fully removed from the circuit then the molecules of the device cooled down and reforms in

    its original structure so the Polyfuse resets.

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    3.1 Operating Parameters

    There are few operating parameters of the Polyfuse which are described below:

    Initial Resistance: It is the resistance of the device as received from the factory ofmanufacturing.

    Operating Voltage: The maximum voltage a device can withstand without damageat the rated current.

    Holding Current: Safe current passing through the device under normal operatingconditions.

    Trip Current: It is known as the value of current at which the device interrupts thecurrent of the device.

    Time to Trip: The time it takes for the device to trip at a given temperature. Tripped State: Transition from the low resistance state to the high resistance state

    due to an overload.

    Leakage Current: A small value of stray current flowing through the device after ithas switched to high resistance mode.

    Trip Cycle: The number of trip cycles (at rated voltage and current) the devicesustains without failure.

    Trip Endurance: The duration of time the device sustains its maximum ratedvoltage in the tripped state without failure.

    Power Dissipation: Power dissipated by the device in its tripped state. Thermal Duration: Influence of ambient temperature. Hysteresis: The period between the actual beginning of the signaling of the device to

    trip and the actual tripping of the device.

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    3.2 Hold and Trip Current as a Function of Temperature

    Fig.3.4 illustrates the hold and trip-current behavior of Polyfuse devices as a function

    of temperature. One such curve can be defined for each available device. Region A

    describes the combinations of current and temperature at which the Polyfuse device will trip

    (go into the high-resistance state) and protect the circuit. Region B describes the

    combinations of current and temperature at which the Polyfuse device will allow for normal

    operation of the circuit. In Region C, it is possible for the device to either trip or remains in

    the low-resistance state (depending on individual device resistance).

    Figure 3.4: Hold current & Trip current variation with temperature

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    3.3 Operating Characteristics

    Fig.3.5 shows a typical pair of operating curves for a PPTC device in still air at 0oC

    and 75oC. The curves are different because the heat required to trip the device comes both

    from electrical I2R heating and from the device environment. At 75

    oC the heat input from

    the environment is substantially greater than it is at 0oC, so the additional I

    2R needed to trip

    the device is correspondingly less, resulting in a lower trip current at a given trip time (or a

    faster trip at given trip current).

    Fig3.5: Operating characteristics of Polyfuse as Current Increases with Time

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    CHAPTER 4

    ADVANTAGES OF POLYFUSE

    4.1 Utilities over Conventional Fuses

    Conventional thermal fuses are not resettable and are therefore limited in their ability

    to match the low temperature protection of PPTC devices. The selection of a low fusing

    temperature in conventional thermal fuses is limited by the need to avoid nuisance tripping

    in temporary high ambient temperature environments, such as car dashboards on a hot day

    or high storage temperatures. Even thermal fuses with 94C or higher fusing temperatures

    often nuisance trip during normal operation or pack assembly. As we know that

    conventional fuses use some protecting cover, this increases the size of the conventional

    fuses while the Polyfuse are installed in a thin chip form so the size of the Polyfuse is much

    less in comparison to traditional fuses. Polyfuses are considered as more safe than traditional

    fuses as these are connected internally in series with the devices and reduces the arcing

    probability in the circuit and there are much less power losses in Polyfuses as these requires

    less amount of energy for its operation. The table for comparison of Polyfuse with some

    other useful PPTC devices is given below:

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    Table 4.1: Comparison between Different PPTC devices

    Hence, the major benefits of Polyfuse are as-

    Low base resistance Latching (non-cycling) operation Automatic reset ability Short time to trip No arcing during faulty situations Small dimensions and compact design Internationally standardized and approved No accidental hot plugging

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    4.2 Typical Resistance Recovery by Polyfuse after a Trip Event

    Figure 4.1 shows typical behavior of a Polyfuse device that is tripped and then

    allowed to cool over an extended period of time, device resistance will continue to fall and

    will eventually approach initial resistance. However, since this time can be days, months, or

    years, it is not practical to expect that the device resistance will reach the original value for

    operation purposes. Therefore, when Polyfuse devices are chosen R1MAX should be taken

    into consideration when determining hold current. R1MAX is the resistance of the device one

    hour after the thermal event.

    Fig.4.1: Typical Resistance Recovery after a Trip Event

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    CHAPTER 5

    APPLICATIONS

    Polyfuses are used in automobiles, batteries, computers and peripherals, industrial

    controls, consumer electronics, medical electronics, lighting, security and fire alarm

    systems, telecommunication equipment and a host of other applications where circuit

    protection is required.

    Some of its applications in protecting various equipments are discussed as below-

    5.1 In Transformer Protection

    Fig.5.1: Transformer protection by Polyfuse

    The equipment powered by a transformer gets overheated due to excessive current or

    short-circuit. A Polyfuse on the secondary side of the transformer will protect the equipment

    against overload as shown in Figure 5.1.

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    5.2 In Speaker Protection:

    Nowadays speakers are designed and sold independently of amplifiers. Therefore,

    there are possibilities of damage due to mismatches. The protection choices for loudspeaker

    systems are limited. Fuses protect the speaker, but a blown fuse is always a source of

    frustration. Using a Polyfuse in series with the speaker as shown in figure will protect it

    from over-current/overheating.

    Fig.5.2: Speaker Protection by Polyfuse

    5.3 In Motors, Fans and Blowers

    If the motors are under overload, the extremely fine wire will be damaged by

    overheating. Install of PPTC in motors and blowers to prevent from overheating .As in given

    figure a Polyfuse (PPTC Device) is attached in series to the circuit instead of a conventional

    fuse. This does not damage the circuit as this is a resettable device and protect it from

    overheating. So the Polyfuses are widely used for motors. fans and blowers.

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    Fig.5.3: Application of Polyfuse in motor protection

    5.4 In Industrial Process Controls

    As we know that different type of controllers are needed to control the different

    process of any industry and these controllers require some overcurrent protecting devices to

    be protectected from overheating.So polyfuses are best suitable devices for these controllers

    as these are resettable devices and doesnt need to be replaced again and again.

    Fig.5.4: Application of Polyfuse in Industrial Controllers

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    5.5 In Computers

    5.5.1. Keyboard/ mouse:

    The operating current of keyboard mouse is usually from 200 to 500 mA, but in a

    short circuit the current will increase many times. Using Polyfuse in series between the

    connector and host power supply will limit the current cut the keyboard mouse port to the

    specified maximum.

    Fig5.5: Use of PPTC Device in Keyboard/Mouse

    5.5.2 Hard Disk Driver:

    Hard disk driver is a important tool for computers. So we require an efficient over

    current protection device to protect the circuit .In hard disk driver the Polyfuse (PPTC

    device) is connected in series with platon motor and head actuator when the over current

    flows through the circuit, the operation of Polyfuse takes place and Polyfuse provide

    protection from overheating of the elements.

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    Fig.5.6: Application of Polyfuses in Hard Disk Driver

    5.6 InRechargeable Battery Packs

    PPTC in series within battery pack will avoid the followed faults occurring:

    a. Shorting of the positive and negative terminals.

    b. A runaway charging condition in which the charger during charging, fails to stop

    supplying current to the package when it is fully charged.

    c. Using the wrong charger or the pack is reverse changed.

    Fig.5.7: Polyfuses in rechargeable Battery Packs

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    5.7 In Automotive Sectors

    5.7.1Automotive harness:

    The conventional solution in wire harnesses is that groups similar circuits together

    and protects them with a single fuse. In order to limit risk of fire, the wire high current

    carrying capability, and the oversized wire is commonly used. If anyone circuit under the

    same fuse short, the other circuits will all stop. PPTC devices can be installed to each circuit,

    which allows the optimum wire to be selected. And the other hand, the circuits don't have to

    be through the central fuse box, thus reducing the length of wire required.

    Fig.5.8: Polyfuses in Automotive Circuits for the Solution of Wire Harness

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    5.7.2 Automotive Electronics:

    Automotive electronics is the electronics used in automobiles. Automotive

    electronics or automotive embedded systems are the distributed systems. So there are some

    types of polyfuses used for automotive electronics equipments for over current protection.

    The following figure shows that a Polyfuse is connected in automotive electronics

    equipments to protect the circuit.

    10

    Fig5.9: Use of Polyfuse in Automotive Electronics

    5.8 In Telecom Sectors

    5.8.1Network Equipment:

    The telecom networks are potentially exposed to AC power crosses, thunder hazard,

    induced over current in the networks. The PPTC devices which are in series with line feed

    resistor and in paralleled with MOV will protect against these fault and prevent network

    equipments from damage.

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    Fig.5.10: Polyfuses used for Network Equipment in Telecom Sectors

    5.9 EXAMPLESOF THE POLYFUSES CLASSIFIED ON THE BASIS OF THE

    APPLICATIONS

    5.9.1 Automotive Devices:

    Polyfuse automotive devices are qualified and sold under PS400 specification which

    is derived from AECQ200, the standard for electronic components used in the automotive

    industry. These devices have successfully passed to meet the demanding environmental

    conditions that can be found in automotive applications. In the following fig.5.11 the

    polyfuses used in the automotive devices are shown. These devices have ratings according

    to the devices.

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    Fig.5.11: Automotive Polyfuse devices

    5.9.2 Radial-Leaded Devices:

    For design or volume applications,the polyfuse radial-leaded devices represent the

    most comprehensive and complete set of PPTC available in the industry today.

    Fig.5.12: Radial-Leaded Polyfuse Devices

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    5.9.3 Surface Mount Devices:

    These devices are preferred circuit protection method for computer, consumer

    multimedia, portable and automotive electronics application. Surface mount devices are

    shown in figure given below-

    Fig.5.13: Surfacemount Polyfuse Devices

    5.9.4 Strap Battery Devices:

    Many materials platforms and device forms factors allowing the engineer greater

    design flexiblility. Polyfuse devices for battery protection include SRP, LTP,LR4,VLP,VLR

    and MXP series, disc and special application strap devices.

    Fig.5.14: Strap Battery Polyfuse Devices

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    5.9.5 Telecom and Networking Devices:

    These devices, for telecommunication and networking applications, help provide

    protection against power cross and power induction surge as defined in ITU, Telcordia, and

    Ul, available in chip, surface mount and radial leaded configurations, these devices also

    helps to improve the reliability of consumers.

    Fig.5.15: Telecom and Networking Polyfuse Devices

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    CONCLUSION

    Polyfuses are designed for todays demanding electronic and electrical industries.

    The concept of a self-resetting fuse of course predates this technology. Bimetal fuses, for

    example are widely used in appliances such as hairdryers, but these are generally large

    current devices. PPTC resettable fuses compete with another common over current

    protection device, namely positive temperature coefficient (PTC) ceramic thermistors.

    However, Polyfuses offer several advantages. First, they have lower resistance and therefore

    lower I2R heating, and can be rated for much higher currents. Second, the ratio between

    open-resistance and close-resistance is much higher than with ceramic PTC fuses. For

    example, the resistance change in PTC thermistors is generally in the range of 12 orders of

    magnitude, but with Polyfuses, the change may be 67 orders of magnitude. However,

    ceramic PTC fuses dont exhibit the increase in resistance after a reset.

    The vast majority PPTC fuses on the market have trip times in the range 110

    seconds, but there are PPTC fuses with trip times of a few milliseconds. Generally speaking,

    however, these devices are considered slow-trip fuses. The blow time depends on the over

    current, so that a fuse that may open within a few milliseconds with a severe overload, may

    take tens of seconds for a light overload. They are ideal for all low voltage DC and AC

    application.

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    3. O.Saburi and K.Wakino, Techniques and Applications of PTC ThermistorsIEEETransactions on Component Parts,1970

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    composites: An effective media-percolation approach,in Polymer Engr. and

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    5. F. A. Doljack, PolySwitch PTC Devices-S new low-resistance conductive polymer-based FTC device for overcurrent protection,IEEE Transaction Component,

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    6. M. Stoessl, Positive temperature coefficient conductive polymer resistors protectelectronic equipment, in Power Control in MotionJune 1993

    7. W. Loser and C. Mattheck, Theory of the thermal switching behavior of a PTC-resistor device, Physieu Status Solidi,1973

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    10. M. Alavi et al., A PROM element based on salicide agglomeration of polyfuses ina CMOS logic process, in 1997.