ddi materials smta-houstonchapter11 10 · nelco 4000-13 ep si 210 9-13 3.40% 30+ 10+ 350 3.40 3.3...
TRANSCRIPT
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DDI Technology
PCB Laminate Materials
SMTA-Houston/GC Chapter9Nov2010
Mark [email protected]
(512) 828-3030
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Notice
• Notification of Proprietary Information: This document contains proprietary information of DDi Corp. and its receipt or possession does not convey any rights to reproduce or disclose its contents, or to manufacture, use, or sell anything it may describe. Reproduction, dissemination, disclosure, or use, in whole or in part, without specific written authorization of DDi Corp. is strictly forbidden. All data contained within this document are subject to this restriction.
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Overview
What is FR-4 and how is it specified• Laminate construction• Basic electrical properties• Controlled material stack-up
Advanced Materials• Special purpose & low loss• Industry specifications• Relative cost
Hybrid Constructions
Printed Circuit Materials Overview
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PCB Material Properties
Material properties are playing an increasingly important role in advanced system designs as speed, power dissipation
and process temperatures increase
Electrical Design:Dielectric constant
Loss tangent
Thermal Mechanical:X,Y,Z CTE
Conduction cooling
Factors that influence material selection
Reliability:Lead free assembly
Long term life
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• Copper Foil
• Glass Fibers
• Woven Glass Fabrics
• Resin
A Stage = Liquid Form
B Stage = Partially Cured Resin
C Stage = Fully Cured ResinA
B
C
Glass Fabrics
Cu Foil
What Is “FR-4” , Laminate Composition
Laminate Components
Resin Stages
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• Tetrafunctional ResinTg =130° - 140° C εr = 4.4Tan δ = 0.024
• Multifunctional ResinTg = 140° to 160° Cεr = 4.3Tan δ = 0.022
• High Temperature Multifunctional ResinTg 170° - 175° CΕr = 4.1Tan δ = 0.019
• Enhanced Multifunctional Resin (Low loss)Tg 180° - 210° Cεr = 3.7Tan δ = 0.010
“FR-4” Standard Resin Systems
• Lead Free Solder Compatible ResinsTg = 170° - 185° Cεr = 4.1 – 4.4Tan δ = 0.015 0.02Td = > 350° CCTE (z) = 2.7% - 3.2%
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Material Tg CTE T260 T288 Td εr Tan δ UL 94 X-Y Z 1 Ghz 10 Ghz 1 Ghz 10 GhzPPM/C PPM/C
FR-4 and ModifiedIsola FR406 170 13 3.50% 10 300 3.95 3.92 0.016 0.017 V-0Isola IS410 180 11 3.50% 60 >15 350 3.90 3.87 0.018 0.23 V-0Isola IS415 200 13-14 2.80% 60 >20 370 3.83 3.8 0.012 0.012 V-0Isola FR408 HR 200 13-14 2.80% 60 30 360 3.69 3.65 0.009 0.0095 V-0
Nelco 4000-6 FC 175 12-15 4.10% 4-8 0 325 4.10 4.0 0.023 0.022 V-0Nelco 4000-11 175 12-14 3.20% 30 0 345 4.10 3.8 0.016 0.02 V-0Nelco 4000-29 185 15-17 3.00% 60 15 350 4.30 4.2 0.015 0.017 V-0Nelco 4000-13 EP 210 10-14 3.40% 30+ 10+ 350 3.70 3.6 0.009 0.008 V-0Nelco 4000-13 EP SI 210 9-13 3.40% 30+ 10+ 350 3.40 3.3 0.008 0.007 V-0Isola 370HR 180 13-14 2.80% 60 30 340 4.17 3.92 0.016 0.025 V-0
“FR-4” Standard Resin Systems
Standard and High Performance EpoxyStandard and High Performance Epoxy--Glass LaminatesGlass Laminates
• High Tg multifunctional epoxy• Lead Free compatible High Tg multifunctional epoxy (Design & Process limited)• Advanced Lead Free compatible High Tg multifunctional epoxy• Low Loss High Tg multifunctional epoxy
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Material Tg CTE T260 T288 Td ε ε ε εr Tan δ δ δ δ X-Y Z 1 Ghz 10 Ghz 1 Ghz 10 GhzPPM/C PPM/C
FR-4 Isola FR406 170 13 3.50% 10 300 3.95 3.92 0.016 0.017Isola IS410 180 11 3.50% 60 >15 350 3.90 3.87 0.018 0.023Isola IS415 200 13-14 2.80% 60 >20 370 3.83 3.8 0.012 0.012
Nelco 4000-6 FC 175 12-15 4.10% 4-8 0 325 4.10 4.0 0.023 0.02 2Nelco 4000-11 175 12-14 3.20% 30 0 345 4.10 3.8 0.016 0.02Nelco 4000-29 185 15-17 3.00% 60 15 350 4.30 4.2 0.015 0.017Isola 370 HR 180 13-14 2.80% 60 30 340 4.17 3.92 0.016 0.025ITEQ IT-180 180 15-17 3% >60 >20 350 4.1 3.8 0.016ITEQ IT-158 155 15-17 3.3% >60 >20 345 4.1 3.8 0.016Nanya NP 170TL 170 15-18 3.8 3.9 0.014Panasonic R1755V 170 15-17 2.80% 65 16 350 4.3 4.16 0.015 0.0 22
“FR-4” Standard Resin Systems
Standard and High Temperature FR4 EpoxyStandard and High Temperature FR4 Epoxy--Glass Laminates Glass Laminates
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“FR-4” Standard Resin Systems
High Performance FR4 EpoxyHigh Performance FR4 Epoxy--Glass LaminatesGlass Laminates
Megtron 6 - PPE Blend = PolyPhenylene Ether
Material Tg CTE T260 T288 Td ε ε ε εr Tan δ δ δ δ X-Y Z 1 Ghz 10 Ghz 1 Ghz 10 GhzPPM/C PPM/C
FR-4 DSCIsola FR408 HR 200 13-14 2.80% 60 30 360 3.69 3.65 0.009 0.0095Nelco 4000-13 EP 210 10-14 3.40% 30+ 10+ 350 3.70 3.6 0.009 0.008Nelco 4000-13 EP SI 210 9-13 3.40% 30+ 10+ 350 3.40 3.3 0.008 0.007
DMA 2 GHz 2 GHz
Panasonic Megtron 6 210 >60 3.60 3.4 0.002 0.004
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“Lead Free” Materials (RoHS Compatible)
(DSC) (1 GHz)
Material Resin Sys tem Tg Dk Df
Nelco N4000-29 Multifunctional 185°C 4.3 0.015
Isola 370 HR High Performance Epoxy 180 °C 4.17 0.016
Nelco N4000-11 Multifunctional 175°C 4.1 0.016
Nelco N4000-13EP Enhanced Epoxy 210°C 3.7 0.009
ITEQ IT-180 Multifunctional Epoxy 180°C 4.3 0.018
Panasonic 1755V Multifunctional Epoxy 170°C 4.3 0.015
Panasonic Megtron 6 PPE Blend 210°C 3.60 0.002
Preferred Materials Preferred Materials ““lead Freelead Free”” Solder CyclesSolder Cycles
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Offshore Laminate CompatibilityProto/Ramp Quantities Can Be Produced By DDi North America
• Range of FR4:Type Tg Td Dk Df
• IT158 155C 340C 4.1 0.016
• S1141 140C 310C 4.1 0.020
• IT180A 175C 340C 4.2 0.018
• S1000-2 180C 340C 4.0 0.020
Halogen-Free
• NPG-170TL 170C 4.5 0.013
• NPGN-150R 140C 4.2 0.013
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• Shengyi Sci.Tech.– S-1000-2
• Available for lead-free process, meet IPC-4101B/126 requirement .
• High Tg180℃(DSC) ,UV Blocking and AOI compatible.
• High thermal performance,Td≥340℃, T288=20min T300=7min .
• Low Z-axis CTE from ambient to 260℃.• Excellent chemical resistance & lower water
absorption.• Excellent CAF resistance.
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• ITEQ Corporation• IT-180
– · Multifunctional Epoxy Resin– · Tg ≥ 175℃ (DSC)– · Low Z-axis Coefficient of Thermal Expansion– · Excellent Dimensional Stability and Heat
Resistance– · Low Water Absorption– · Good Drilling Properties– · UL 94 V-0– · AOI and UV Blocking Characteristics
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Dielectric Properties of “FR-4” Laminate
• Signal frequency• Temperature• Moisture content• Glass composition • Ratio of epoxy resin to glass in the construction
Factors that influence dielectric constant and loss tangent:
Controlled dielectric constructions are becoming increasingly important as circuits push the limits of FR-4 through improved simulation
Epoxy ResinSystem
Glass FabricComposition
Resin/Glass Ratio
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Dielectric Constant of “FR-4” Laminate
• Standard “FR4” epoxy-glass laminates can maintain a dielectric constant tolerance of less than +/- 0.2 based on a specific laminateconstruction and resin content
• Standard tolerance on prepreg resin content is +/- 1.5% as supplied by vendors, +/- 1.0% can be attained for criticalapplications (special order)
• Resin content in prepreg varies for each style of prepreg
• Glass fabric style can have an impact on impedance control as trace geometries continue to shrink
• Selection of glass styles can impact board warping
• Heavy glass fabric can lead to directional impedance control issues
Design Considerations:
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16Photo Courtesy of Park Nelco
Epoxy-Glass Laminate Construction
• Dielectric constant of the composite laminate is a function of the resin/glass ratio
• Composite laminates can have manydifferent resin/glass constructions
• Heavy glass fabric can have fiber bundles that are Larger than the actual copper trace
PWB Cross-Section
Copper Foil
Woven glass fabric
High dielectric constant (εr ~ 6)
Epoxy resin
Low dielectric constant (εr ~ 3.5)
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NOTE:
The plain weave yarn consists of yarns interlaced in an alternating fashion one over and one under every yarn.
Source: Isola
Epoxy-Glass Laminate Construction
Glass Style: 106Plain Weave
Count: 56x56 (ends/in)Thickness: 0.0015”
Glass Style: 1080Plain Weave
Count: 60x47 (ends/in)Thickness: 0.0025”
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18Source: Isola
Epoxy-Glass Laminate Construction
Glass Style: 2113Plain Weave
Count: 60x56 (ends/in)Thickness: 0.0029”
Glass Style: 2116Plain Weave
Count: 60x58 (ends/in)Thickness: 0.0038”
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Epoxy-Glass Laminate Construction
Source: Isola
Glass Style: 1652Plain Weave
Count: 52x52 (ends/in)Thickness: 0.004”
Glass Style: 7628Plain Weave
Count: 44x32 (ends/in)Thickness: 0.0068 (in)
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Data Source: Isola
Dielectric properties based on construction & frequency
Epoxy Glass Laminate Properties IS370HR
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Dielectric ConstantThickness Tolerance Construction RC% 1MHz Tol. 1GHz Tol. 2.5 GHz Tol. 10 GHz Tol.
0.0020 0.0005 1x 106 68.3 3.43 0.14 3.33 0.14 3.24 0.14 3.21 0.140.0025 0.0005 1x 108 55.2 3.77 0.16 3.67 0.16 3.57 0.15 3.54 0.150.0030 0.0005 1x 2113 42.7 4.09 0.16 3.99 0.16 3.88 0.15 3.84 0.150.0030 0.0005 1x 1080 61.2 3.61 0.12 3.51 0.12 3.42 0.12 3.39 0.110.0035 0.0005 2x 106 64.6 3.52 0.10 3.42 0.10 3.33 0.09 3.30 0.090.0035 0.0005 1x 2113 48.8 3.93 0.13 3.83 0.13 3.73 0.12 3.69 0.120.0040 0.0005 1x 1080 1x 106 56.9 3.72 0.10 3.62 0.10 3.53 0.10 3.49 0.090.0040 0.0005 1x 2113 53.8 3.80 0.10 3.70 0.10 3.61 0.10 3.57 0.100.0042 0.0005 1x 1080 1x 106 58.6 3.68 0.09 3.58 0.09 3.49 0.09 3.45 0.090.0045 0.0005 2x 1080 51.4 3.86 0.10 3.76 0.10 3.66 0.09 3.63 0.090.0045 0.0005 1x 1080 1x 106 60.8 3.62 0.08 3.52 0.08 3.43 0.08 3.40 0.080.0047 0.0005 1x 1080 1x 1080 53.0 3.82 0.09 3.72 0.09 3.62 0.09 3.59 0.090.0050 0.00075 1x 1080 1x 1080 55.2 3.77 0.12 3.67 0.12 3.57 0.12 3.54 0.120.0050 0.00075 1x 2116 51.0 3.87 0.13 3.77 0.13 3.67 0.13 3.64 0.120.0050 0.00075 1x 2113 1x 106 52.0 3.85 0.13 3.75 0.13 3.65 0.12 3.62 0.120.0051 0.00075 1x 1080 1x 1080 55.9 3.75 0.12 3.65 0.12 3.55 0.11 3.52 0.110.0053 0.00075 2x 1080 57.2 3.72 0.11 3.61 0.11 3.52 0.11 3.49 0.110.0055 0.00075 2x 1080 58.4 3.68 0.10 3.58 0.10 3.49 0.10 3.46 0.100.0060 0.00075 2x 2113 42.7 4.09 0.12 3.99 0.12 3.88 0.12 3.84 0.120.0060 0.00075 1x 1652 47.5 3.96 0.11 3.86 0.11 3.76 0.11 3.72 0.110.0060 0.00075 1x 2116 1x 106 50.0 3.90 0.11 3.80 0.11 3.70 0.11 3.66 0.110.0060 0.00075 1x 1080 1x 2113 51.4 3.86 0.11 3.76 0.11 3.66 0.11 3.63 0.100.0060 0.00075 1x 106 1x 2116 50.0 3.90 0.11 3.80 0.11 3.70 0.11 3.66 0.110.0070 0.001 2x 2113 48.8 3.93 0.13 3.83 0.13 3.73 0.12 3.69 0.120.0075 0.001 1x 7628 41.0 4.13 0.13 4.03 0.13 3.93 0.13 3.89 0.130.0080 0.001 2x 2116 42.3 4.10 0.12 4.00 0.12 3.89 0.12 3.85 0.120.0080 0.001 1x 2116 1x 2113 47.8 3.96 0.11 3.86 0.11 3.75 0.11 3.72 0.110.0090 0.001 1x 2116 1x 2116 47.0 3.98 0.10 3.88 0.10 3.77 0.10 3.74 0.100.0095 0.001 1x 2116 1x 2116 49.1 3.92 0.10 3.82 0.10 3.72 0.09 3.69 0.090.0100 0.001 2x 2116 51.0 3.87 0.09 3.77 0.09 3.67 0.09 3.64 0.080.0100 0.001 1x 7628 1x 1080 44.3 4.05 0.10 3.95 0.10 3.84 0.09 3.80 0.09
Data Source: Park Nelco
Dielectric properties & frequency (N4000-13 EP)
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3.6
3.7
3.8
3.9
4
4.1
4.2
4.3
4.4
1 Mhz 1 Ghz 2.5 Ghz
N4000-6N4000-11FR406370HR
Dielectric constant with respect to frequency
Dielectric Properties of “FR-4” Laminate
Data based on available data for 50% resin contentData based on available data for 50% resin content
FrequencyFrequency
εεrr
Frequency dependant properties vary with different resin systems
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3.83.9
44.14.24.34.44.54.6
0.05 0.2 0.4 0.6 0.8 1 1.2
Frequency in GHz
Die
lect
ric
Co
nst
ant
0.05% MC
0.45% MC
0.75% MC
Dielectric Properties of “FR-4” Laminate
0.002
0.007
0.012
0.017
0.022
20C 40C 60C 80C
FR-4Df
Temperature
Dissipation Factor with respect to
temperature @ 1.0 GHz
Dielectric Constant with respect to moisture &
Frequency
FR-406 44.6 % epoxy resin
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“FR-4” Thickness vs Dielectric Constant
Based on N4000-6 at 1.0 Ghz
Glass fabric and resin content vary with different laminate constructionsas a result the dielectric constant is a variable that is construction dependant
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Controlled Material Stack-up
• By pre-engineering PCB stack-up’s in the design phase of a project material properties and line geometries can be confirmed
• On critical designs both prepreg plies and core constructions can be assigned
• Stack-ups should be saved as a control document
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Halogen Free (EU WEEE Directive)What is a Halogen? Bromine
What is Halogen Free Material?
Bromine-Free Flame Retardant
Is Halogen Free Material considered Green?
Yes
Lead Free (EU RoHS Directive)Does NOT contain Lead (also Cadmium, etc)
TBBA (Bromine) as Flame Retardant
Higher Assembly Temp/Dwell for Lead-Free Solders
Laminates need to be more Temperature “Robust”
>345deg C Td
Halogen Free/Lead Free Materials
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(TMA) (1 GHz)
Material Resin System Tg Dk Df
Hitachi MCL-BE-67G(H) Halogen-Free FR4 150°C 4.4 .010
NAN YA NPG-170TL Halogen-Free FR4 170°C (DSC) 4.5 .013(1 MHz)
NAN YA NPGN-150R Halogen-Free FR4 140°C (TMA) 4.2 .013
Surface Finish = OSP, Immersion Gold, or Immersion Silver
Solder Mask = Taiyo PSR4000 HFX Green (Halogen-Free ) Taiyo PSR4000 HFX Black (Halogen-Free) Taiyo PSR4000 HFX Blue (Halogen-Free) Taiyo PSR4000 HFX White (Halogen-Free) Taiyo PSR4000 HFX Clear (Halogen-Free) Taiyo PSR4000 HFX Red (Halogen-Free)
Legend = Taiyo PSR4100 WLHD (white)Enthone 10 Series (105 white)
Halogen Free & Lead Free SolutionsHalogen Free “FR-4” Solutions (“Green”)
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28www.ddiglobal.com
Overview
What is FR-4 and how is it specified• Laminate construction• Basic electrical properties• Controlled material stack-up
Advanced Materials• Special purpose & low loss• Industry specifications• Relative cost
Hybrid Constructions
Printed Circuit Materials Overview
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Special Purpose Laminate Materials
Often times unique design requirements dictate the use of special purpose laminate:
Factors: • Coefficient of thermal expansion• Moisture absorption • Operating temperature• Dielectric constant• Loss tangent
Polyimide BTHydrocarbon
CeramicsPTFE
Isola P96Nelco N7000-1
Isola G200Nelco 5000
Rogers 4000 seriesRogers TMM series
Rogers 3000 seriesRogers 5000 series
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Polyimide Laminates
• Tg 260C• Td 382C• ZCTE 1.5%• T260 60 Min.• T-288 60 Min.• Dk @ 2.0GHz 3.85• Dk @ 10 GHz 3.83• Df @ 2.0 GHz 0.018• Df @ 10 GHz 0.024• Moisture Abs. 0.4%• Max temp 210C• UL Max temp 140C
• High temperature applications• IC Burn-in boards• Engine controls• Down hole instruments• Extreme chemical resistance• Severe assembly applications
ApplicationsPolyimide resin reinforced with woven E-glass, Typical properties
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Bismaleimide-Triazine (BT) Laminates
• Tg 180C• Td 325C• ZCTE 3.3%• T260 12 Min.• Dk @ 2.0GHz 3.70• Dk @ 10 GHz 3.65• Df @ 2.0 GHz 0.013• Df @ 10 GHz 0.015• Moisture Abs. 0.2%• Max temp 150C• UL Max temp 140C
• Multiple thermal excursions• Low moisture absorption • IC substrates• High voltage applications• Chemical and thermal resistance
ApplicationsBT resin reinforced with woven E-glass, Typical properties
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Hydrocarbon Ceramic Laminates
• RF Microstrip circuits• RF Multilayer Stripline• RF filters and power dividers
Applications
Rogers 4003 4350B: Hydrocarbon resinwith ceramic filler reinforced woven glass• Precise dielectric constant• Low loss tangent
Rogers TMM 3, 6, 10: Hydrocarbon resinwith ceramic filler• Precise dielectric constant • Homogeneous dielectric• Electrical properties stable over temperature• Low loss tangent
• Microwave Microstrip circuits• Microwave power circuits• Microwave filters & power dividers• Antenna applications
Applications
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PTFE Based Laminates
• Microwave Microstrip circuits• Microwave Multilayer Stripline• Microwave filters & power dividers• Antenna applications
ApplicationsRogers 3003, 3006, 3010: PTFEceramic filler• Precise dielectric constant• Low loss tangent• Homogeneous dielectric• Stable mechanical properties allowing mixed dielectric constants
Rogers 5880: PTFE with glass random glassmicrofiber reinforcement • Precise dielectric constant • Very low dielectric constant• Homogeneous dielectric• Electrical properties stable over temperature• Low loss tangent into the Ku band (12 to 18 GHz)
• Microwave Microstrip circuits• Microwave power circuits• Microwave filters & power dividers• Antenna applications
Applications
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Specifying Laminate Materials
There are three methods to specify laminate materials:
All laminates are not created equal !
Thermal-mechanical & electrical properties
•IPC 4101 Slash Sheet •number
Resin brand and construction
Issues: Difficult to interpret and trade-offs are almostalways encountered in engineering and planning
Dk Df Tg CTE /24 /29 /41Isola 370HRTwo ply 1080or equivalent
Issues: IPC slash numbersare generic categories and on critical designs, propertiesmay vary too much within a given slash sheet number
Issues: The best method to specify laminates however,when using multiple vendorsthey may not all support the specific materials
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IPC 4101 Slash Sheet Matrix: Isola Materials
Source: Isola
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Advanced Low Loss Dielectric Laminates
Source: Rogers
Relative Laminate Cost Per Square Foot vs Loss Tangent
Based on 0.020” Laminate
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Material Group/ Resin System Vendor Specific Estimated Cost Factor
170 Tg FR4 (Baseline sqft. Price) Nelco N4000-6FC 1
High Tg/Reliability-No Filler Nelco 4000-11 1
High Tg/Reliability-Filled Nelco 4000-29, Isola 370 HR 1.1
High Speed/Loss Nelco 4000-13 EP, Isola FR408 HR 1.8
High Speed/ Very Low Loss Nelco 4000-13 EP SI 2.6
Polyimide Nelco N7000-2, Isola P96, Arlon 35N 3.1
High Frequency Isola IS 680, Arlon 25N 4
Rogers 4350B, RO4003 8.5
Buried Resistance Assuming 170 Tg FR4 Resin 15
Microwave Laminates Rogers 3000 5000 6000 series 20-40
Note: Based on average square foot pricing normalized To 170 Tg FR4
Laminate Cost Factors Based on Resin System
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Overview
What is FR-4 and how is it specified• Laminate construction• Basic electrical properties• Controlled material stack-up
Advanced Materials• Special purpose & low loss• Industry specifications• Relative cost
Hybrid Constructions
Printed Circuit Materials Overview
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Mixed Dielectric Substrates
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
FR-4 Prepreg
FR-4 Substrate(4 Layer)
Low loss Dielectric(4350, 3003 ect.)
Typical mixed dielectric construction with low loss cap layer
• Mixed dielectric constructions reduce cost by only using more expensive low loss materials where needed
• FR-4 Epoxy-Glass Sub-Cores provide structural support when using PTFE based laminates
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Mixed Dielectric Circuit Constructions
Mixed Dielectric: Rogers 4350/FR-4
Roger 4350 FR-4
Cross-Section
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.0045” Ref.
.004” Ref.
Layer 1 Solder Mask
Solder Mask
.0045” Ref.
.004” Ref.
.0045” Ref.
Layer 13
Layer 14
Layer 15
Layer 18
.0045” Ref.
.004” Ref.
.0045” Ref.
.004” Ref. .004” Ref.
.002” Ref. BC
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
Layer 7
Layer 8
Layer 9
Layer 10
Layer 11
Layer 12
Layer 16
.0045” Ref.
Layer 17
.0045” Ref.
.0045” Ref.
.004” Ref.
Stacked MicroViasLayer 1 – 2, 2-3 & 3-4 Layers 24-23, 22-21 & 21-20.012” pad .006” laser drillsolid copper plate
.0035” Ref. 370 HR
.0035” Ref. 370 HR
½ oz Signal
3/8 oz Gnd
3/8 oz Signal
.002” Ref. BC
½ oz Signal
Finish Thickness = .120” +/- .012”Material = N4000-13 EP & Isola 370 HR
.004” Ref.
.0045” Ref.
.004” Ref.
.0045” Ref.
Layer 19
Layer 20
Layer 21
Layer 22
½ oz Gnd
½ oz Gnd
½ oz Signal
½ oz Gnd
½ oz Gnd
½ oz Signal
½ oz Gnd
½ oz Signal
1 oz Vcc
1 oz Gnd
½ oz Signal
½ oz Signal
1 oz Gnd1 oz Vcc
½ oz Gnd
½ oz Signal
3/8 oz Signal
3/8 oz Vcc
.0035” Ref. 370 HR
Layer 23
Layer 24 .0035” Ref. 370 HR
3/8 oz Vcc
3/8 oz Gnd
Layer 3 - 22 = Buried Vias.020” pad & .010” drill
Layer 1 - 24 = Through Vias.024” pad & .012” drill
Hybrid HDI
IPC Class 2
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Summary
Laminate materials play an important role in PCB performance:
• Laminates consist of a resin system and reinforcement material, depending upon the laminate they are woven glass, ceramic or glass microfibers
• Dielectric properties are highly dependant on the ratio of resin to the reinforcing material
• Specialty laminates are often required when thermal-mechanical or high frequency requirements exceed the properties of standard multifunctional epoxy based laminates
• Care should be taken when specifying laminate materials so boards can be produced consistently from lot to lot
• Specialty or “exotic” laminates come at a significant cost premium and hybrid constructions can offer significant cost reduction
• Engage your FAE/DDi-Asia team when discussions include possible transfer to offshore partners…many Asian laminates are NOT “drop-in” replacements
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