d2 maintenance manual
TRANSCRIPT
Huawei Ascend D2 Maintenance Manual V1.0
Prepared by Pan Linghan Date 2012-12-25
Reviewed by Date
Approved by Date
Huawei Technologies Co., Ltd.
All rights reserved
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Revision Record
Date Revision Version
Revision Cause
Section Number
Change Description
Author
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Contents
1 Product Overview ......................................................................................................................... 7
1.1 Appearance ....................................................................................................................................................... 7
1.2 Specifications ................................................................................................................................................. 10
2 Applicable Scope and Precautions .......................................................................................... 11
2.1 Applicable Scope ............................................................................................................................................ 11
2.2 Precautions ..................................................................................................................................................... 11
2.3 How to Obtain Product and Repair Information ............................................................................................ 12
3 Exploded View............................................................................................................................. 12
3.1 Exploded View ............................................................................................................................................... 12
3.2 Product BOM ................................................................................................................................................. 13
4 Components on the PCBA ......................................................................................................... 19
4.1 Components on the PCBA ............................................................................................................................. 19
4.2 PCBA Component List ................................................................................................................................... 21
5 Software Upgrade ....................................................................................................................... 95
5.1 Preparing for the Upgrade .............................................................................................................................. 95
5.2 Installing the Driver ....................................................................................................................................... 95
5.3 Installing the Driver ....................................................................................................................................... 95
5.4 Login Tool ...................................................................................................................................................... 96
5.5 Configuration Tools ........................................................................................................................................ 96
5.6 Start Upgrade ................................................................................................................................................. 98
5.7 Other Upgrade Modes .................................................................................................................................... 98
6 Repair Tools ................................................................................................................................. 99
7 Disassembly Procedure ............................................................................................................ 100
7.1 Disassembly Preparation .............................................................................................................................. 100
7.2 Disassembly Procedure (Read the Notes to Save Workload) ....................................................................... 101
7.2.1 Removing the Battery Cover ............................................................................................................... 101
7.2.2 Removing the SIM Card Component .................................................................................................. 102
7.2.3 Removing Screws of Cover C ............................................................................................................. 103
7.2.4 Removing Motor Support Insulation Mylar. ....................................................................................... 103
7.2.5 Removing Cover C Components ........................................................................................................ 103
7.2.6 Removing Motor Support Screws ....................................................................................................... 105
7.2.7 Removing the Fixed Speaker Box Screw ............................................................................................ 106
7.2.8 Removing the Primary Camera ........................................................................................................... 107
7.2.9 Removing the Secondary Microphone Cover ..................................................................................... 107
7.2.10 Removing Main Board Screws ......................................................................................................... 108
7.2.11 Removing the Main Board Graphite Sheet ....................................................................................... 108
7.2.12 Removing the conductive fabric of the LCD Connector ................................................................... 109
7.2.13 Removing the Side Button Connector Mylar .................................................................................... 109
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7.2.14 Removing the Motor Support Component ........................................................................................ 110
7.2.15 Removing Speaker Box .................................................................................................................... 110
7.2.16 Removing the Main Board Component ............................................................................................ 111
7.2.17 Removing Screws at the Left of the Earphone .................................................................................. 113
7.2.18 Removing the Coaxial Connector at the Antenna PCB Side ............................................................. 113
7.2.19 Removing the TP-LCD Component .................................................................................................. 113
7.2.20 Removing the Main FPC ................................................................................................................... 115
7.2.21 Removing the Antenna PCB and Its Screws ..................................................................................... 116
7.2.22 Removing the Receiver Ornament .................................................................................................... 117
7.2.23 Removing the Silicon Pad of the Potoreceptor ................................................................................. 117
7.2.24 Remove the Magnesium Support of the Middle Cover ..................................................................... 117
7.2.25 Remove REC-FPC and Receiver ...................................................................................................... 118
7.2.26 Remove the USB-FPC ...................................................................................................................... 119
7.2.27 Removing Side Key FPC and Side Keys .......................................................................................... 120
7.2.28 Remove the Battery. .......................................................................................................................... 121
7.2.29 Removing the Antenna Coaxial Cable .............................................................................................. 122
7.2.30 Removing the Main Microphone FPC .............................................................................................. 123
7.2.31 Removing the Motor ......................................................................................................................... 123
7.2.32 Removing the Earphone Sealing Ring .............................................................................................. 124
7.2.33 Removing the Speaker Sealing Ring ................................................................................................. 124
7.3 Disassembly Panoroma ................................................................................................................................ 125
8 Assembly Procedure ................................................................................................................. 125
8.1 Assembly Preparation ................................................................................................................................... 125
8.2 Assembly Procedure (Read the Notes to Save Workload) ............................................................................ 126
8.2.1 Installing the Front Cover Components .............................................................................................. 126
8.2.2 Installing the TP-LCD Assemblies ...................................................................................................... 129
8.2.3 Installing the Shielding Cover of the Main Board .............................................................................. 130
8.2.4 Installing the Camera .......................................................................................................................... 130
8.2.5 Installing the Secondary Microphone Sheath ...................................................................................... 130
8.2.6 Installing the Main Board ................................................................................................................... 131
8.2.7 Installing the Antenna Board ............................................................................................................... 131
8.2.8 Installing the Battery ........................................................................................................................... 132
8.2.9 Installing the Main Microphone .......................................................................................................... 132
8.2.10 Installing the Motor, Main FPC, and the Speaker Box ..................................................................... 133
8.2.11 Connecting the ZIF Connector of the Main FPC with the Side Key FPC ......................................... 134
8.2.12 Sticking the Conductive Fabric and Graphite Sheet to the Main Board ........................................... 135
8.2.13 Installing Cover C ............................................................................................................................. 135
8.2.14 Installing the Battery Cover .............................................................................................................. 136
9 Troubleshooting Common Faults .......................................................................................... 136
9.1 Working Principles of the Phone .................................................................................................................. 137
9.2 Startup Failure .............................................................................................................................................. 142
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9.2.2 Excessive Current (DC Power Supply) ............................................................................................... 143
9.2.3 Weak Current (DC Power Supply) ...................................................................................................... 144
9.2.4 No Current (DC Power Supply) .......................................................................................................... 147
9.3 Charging Failure ........................................................................................................................................... 149
9.4 Display Failure ............................................................................................................................................. 150
9.5 Vibration Failure .......................................................................................................................................... 151
9.6 SIM Card Identification Failure ................................................................................................................... 152
9.7 Touchscreen Failure ..................................................................................................................................... 153
9.8 Proximity Sensor and Automatic Light Sensor Failure ................................................................................ 155
9.8.2 9.10 Accelerometer Failure ................................................................................................................. 155
9.9 Compass Sensor Failure ............................................................................................................................... 156
9.9.2 9.12 Gyroscope Failure ....................................................................................................................... 157
9.10 Camera Failure ........................................................................................................................................... 157
9.11 Audio Failure .............................................................................................................................................. 158
9.11.1 Ringtone Failure ................................................................................................................................ 158
9.11.2 Call Transmitting Failure .................................................................................................................. 159
9.11.3 Call Receiving Failure ....................................................................................................................... 160
9.12 Headphone Audio Failure ........................................................................................................................... 161
9.12.1 Headphone Silence Failure ............................................................................................................... 161
9.12.2 Headphone Transmitting Failure ....................................................................................................... 162
9.13 Speaker Noise Failure ................................................................................................................................ 162
9.14 Wi-Fi and Bluetooth Failure ....................................................................................................................... 164
9.14.1 2.4 GHz WIFI ................................................................................................................................... 164
9.14.2 5 GHz Wi-Fi ...................................................................................................................................... 165
9.15 FM Failure (D2 Is Not Equipped with the FM Function.) ......................................................................... 168
9.15.1 9.19 GPS Failure ............................................................................................................................... 168
9.16 Mobile High-Definition Link (MHL) Failure ............................................................................................ 170
9.17 UIM1 Card Detection Failure..................................................................................................................... 171
9.18 UIM2 Card Detection Failure..................................................................................................................... 172
9.19 RF Reception Failure-CDMA (D2-2010) ................................................................................................... 173
9.20 RF Sending Failure-CDMA (D2-2010) ...................................................................................................... 174
9.21 RF Signal Receiving Failure-GSM (D2-2010) ........................................................................................... 175
9.22 RF Signal Sending Failure-GSM (D2-2010) .............................................................................................. 176
9.23 RF Reception Failure-WCDMA (D2-5000) ............................................................................................... 177
9.24 RF Sending Failure-CDMA (D2-5000) ...................................................................................................... 178
9.25 RF Signal Receiving Failure-GSM (D2-5000) ........................................................................................... 179
9.26 RF Signal Sending Failure-GSM (D2-5000) .............................................................................................. 180
10 Chapter Ten Function Tests .................................................................................................. 181
10.1 Keys ........................................................................................................................................................... 181
10.2 MMI Tests .................................................................................................................................................. 181
10.3 Wi-Fi Test ................................................................................................................................................... 181
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10.4 Voice Call Test ............................................................................................................................................ 182
11 Solder Points on the PCB and the BGA Chip .................................................................... 182
12 PCBA Layout ............................................................................................................................ 184
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1 Product Overview
1.1 Appearance
Figure 1-1 Appearance
HUAWEI D2-5000
HUAWEI D2-2010
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HUAWEI D2-0082
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1.2 Specifications
Table 1-1 D2 Specifications
Item Description
Type Bar-type touchscreen smartphone
Dimensions (H x W x D) 140.0 mm *71.1 mm *10.2 mm (Recommended depth for promotion is 9.9
mm)
Frequency bands D2-5000
TD-SCDMA A band(2010 to 2025 MHz)/F band(1880 to 1920 MHz)/E
band(2320-2370 MHz)GSM 850/900/1800/1900 MHz
TDD LTE Band 38/38/40, FDD Band7, WCDMA850/900/1900/2100
D2-0082
GSM 850/900/1800/1900 MHz WCDMA850/900/2100
FDD LTE Band1/3/7
D2-2010
GSM 900/1800/1900 MHz
CDMA 2000 EVDO Rev.A/1x 800 MHz
Weight About 168 g
Network mode D2-5000 and D2-0082 are single SIM phones. D2-2010 are dual-SIM
phones.
System platform D2-5000 & D2-0082:K3V20 + Balong; OS: Android 4.1
D2-2010: K3V200 + MTK6252 + QSC6085; OS: Android 4.1
Memory D2-5000& D2-0082:
Application processor (AP) side:16 Gb DDR2 DRAM;MCP-32GB
(32Gbx8) EMMC
Modem side: flashless,1G DDR
D2-2010:
Application processor (AP) side:16 Gb DDR2 DRAM;MCP-32GB
(32Gbx8) EMMC
Modem side: MCP-1Gb(64M x 16) NAND FLASH
Ports Micro USB for charging and data connection, 3.5 mm headset jack, MHL
port
Battery 2.9 mAh lithium ion battery (minimum)/ 300 mAh lithium ion battery
(typical)
Standy time: up to 140 hours. Talk time: at least 1000 minutes. Charging
time: 2.5 hours.
Display 5'' FHD screen. Resolution 1920 x 1080.
MicroSD card slot Not supported
Antenna Includes main antenna, GPS antenna, Wi-Fi/Bluetooth antenna, 5.0 Wi-Fi
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Item Description
antenna, diversity antenna
Camera Primary camera: 13 MP CMOS camera, with flash. Secondary camera: 1.3
MP HD
Bluetooth TI WL1873 with Bluetooth 4.0
WIFI WL1873 Wi-Fi module (802.11 a/b/g/n, supporting 2.4/5 GHz bands)
GPS WL1873 GPS module, supporting GPS/GLONASS/AGPS
FM Not supported
Feature Android 4.1(Jelly Bean)
Quad-core 1.5 GHz CPU K3V2
5 inch TFT IPS + touch screen, supporting auto-rotation
D2-2010:2 GB RAM+32 GB ROM;D2-0082/D2-5000: 2 GB RAM+16
GB ROM
Wi-Fi 802.11 a/b/g/n
Supports MHL to HDMI video output (1080 P/30 FPS).
13 megapixel primary camera + 1.3 megapixel secondary camera
Dolby surround sound, Digital Plus decoding technology
DLNA
BT4.0, supporting connecting to a keyboard and a mouse through
Bluetooth.
Proximity sensor
Light sensor
Accelerator
Compass
Gyroscope
USB OTG Host, supporting connecting to a keyboard, mouse or USB
drive through USB ports.
2 Applicable Scope and Precautions
2.1 Applicable Scope
This document provides maintenance instructions for technical support at the authorized service centers.
Being Huawei proprietary, this document is accessible only for authorized service centers and companies.
Although every effort was made to ensure the accuracy of this document, errors may still exist. If you find
any errors or have any suggestions, contact Huawei's customer service.
2.2 Precautions
Only qualified technicians are allowed to perform maintenance and calibration.
Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps throughout
the operations.
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Ensure that all the components, screws, and insulators are properly installed after maintenance and
calibration, and that all cables and wires are installed and connected correctly.
Ensure that the soldering is lead-free and compliant with eco-friendly requirements.
ESD is the main cause of damage to electrostatic-sensitive components. Each ASC
must exercise caution to avoid ESD damage and comply with the ESD protection
requirements in this manual.
2.3 How to Obtain Product and Repair Information
To obtain product and maintenance information, visit Huawei website at:
http://www.huaweidevice.com/cn/technicaIndex.do
The component list is for your reference only and subject to changes without notices. The latest
component list is available in Huawei's ITEM information system. If you have any questions, contact
your local technical support.
3 Exploded View
3.1 Exploded View
The components listed in Figure 3-1 are structural parts of the phone, and cannot be used as reference when requesting
spare parts.
Figure 3-1 Exploded View
RCV ornament
Proximity and illuminance sensor
sealing sheath
USB conductive fabric
Graphite sheet
Primary camera
Battery assembly
Graphite sheet
Antenna support assembly
Battery cover assembly
Graphite sheet
Secondary camera
SIM card tray assembly
Motor
TP protective film
TP-LCD assembly
Front cover assembly
Motor support
Co-axial cable
Antenna mini-board
Main microphone FPC
SPK assembly
Main FPC assembly
NOTE
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3.2 Product BOM
Table 3-1 Product BOM
D2-5000:
No. Code Name Quantity
1 51151628 WCDMA Handset-D2-0082-32G ROM/GSM Quad-core,
W2100/W1900/W1700/W900/W850 Handset-White
1.0 PCS
2 03021YX
M
Manufactured Board,D2-5000,HL1D25000M,Ascend D2 Handset
Main Board,Terminal used,2*2
1.0 PCS
3 03021UQN Manufactured Board,D2-0082,HD1U9800DL,D2-0082 Main
FPC-1*1
1.0 PCS
4 03021USK Manufactured Board,D2-0082,HD1U9800DMIC,D2-0082 MIC
FPC,1*1
1.0 PCS
5 03021WQ
X
Manufactured Board,D2-5000,HT1T9800LA,D2-5000 Antenna
Board,6*6
1.0 PCS
6 02230VBS Front Housing Assy(Silver) 1.0 PCS
7 51623849 RECEIVER-ASSY-C9800D 1.0 PCS
8 51660AKN Sim Card Housing Assy-T9800L 1.0 PCS
9 51660AHK Sim Card Housing Assy-T9800L 1.0 PCS
10 51634067 Submic Gasket Assy-C9800D 1.0 PCS
11 51634068 MOTOR Frame Assy-C9800D 1.0 PCS
12 51660AH
M
Sub Camera Frame Assy-C9800D 1.0 PCS
13 51634070 Sensor Rubber Assy-C9800D 1.0 PCS
14 51634242 DKBA80932335,A-COVER-TP-ADHENSIVE,C9800D 1.0 PCS
15 51634071 O-Ring-Earjack-C9800D 1.0 PCS
16 51634073 O-Ring-SPK-C9800D 1.0 PCS
17 51634075 Mainboard Conductive Copper-C9800D 1.0 PCS
18 51634074 Main Fpczif-Mylar-C9800D 1.0 PCS
19 51634244 DKBA80933187,MOTOR-zif-mylar,C9800D 1.0 PCS
20 51634245 DKBA80932887,Main-cam-electic-fabric,C9800D 1.0 PCS
21 51634246 DKBA80933311,SUB-mic-dustproof,C9800D 1.0 PCS
22 51622215 M 1.4*3*2.5*0.5(T5)-NY 6.0 PCS
23 51622228 M1.4*2.0*2.5*0.5 3.0 PCS
24 51623361 DKBA89000766,Screw-T5 3.0 PCS
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No. Code Name Quantity
25 51621198 DKBA8.900.0504,T5 pan head mechanical
screw,M1.4*4.0*D2.6*0.8,Plated with black
zinc,NY,Unitary(non-priority)
2.0 PCS
26 51650888 DKBA8.817.7194,warranty label,2.5mm,General 1.0 PCS
27 51623896 TOP-SHIELD COVER-1-YD-T9800L 1.0 PCS
28 51623895 TOP-SHIELD COVER-2-YD-T9800L 1.0 PCS
29 51623892 BOT-SHIELD COVER-1-YD-T9800L 1.0 PCS
30 51623886 BOT-SHIELD COVER-2-YD-T9800L 1.0 PCS
31 51634118 GRAPHITE L-FILM_TOP_YD_T9800L 1.0 PCS
32 51634119 GRAPHITE FILM_BTM_T9800L 1.0 PCS
33 23040290 LCD Indication
Module,SIGNAL,TFT,4.97,1920*1080,16.7M,16:9,2.29TYP,with
touch panel,BTB
1.0 PCS
34 23060094 Camera Module Group,1/3'',CMOS RGBW BI sensor,13M,Terminal
Dedicated
1.0 PCS
35 23060099 Camera Module Group,1/6",CMOS 1M HD FSI
sensor,FF,MIPI,6.0*6.0*3.3,Terminal
1.0 PCS
36 32050039 Vibrating Motor,Cylindrical,2.0V,0.080A,0rpm,D10*3mm,Spring
Contact Terminals,23ohm,Terminal Dedicated
1.0 PCS
37 22020107 Speaker,8ohm,1W,D2 box,40*16.5*6.7 1.0 PCS
38 24021174 Rechargeable Battery,Li-polymer
Battery,HB5U1V,3.8V,2.9Ah,Single Cell,Max 5.5*56.0*71.0mm,
Embedded,4.35V High Voltage,Chinese & English,Screen
Printing,Terminal Dedicated
1.0 PCS
39 4050532 Out Sourcing Cable,RF Coaxing Cable,87mm,fit
14240433,0.087,Terminal Dedicated
1.0 PCS
40 51624192 DKBA80359900,Volume-box-grounding-contact,C9800D 1.0 PCS
41 51634303 Thermal-Pad,T0.76mm,D2,Terminal Dedicated 1.0 PCS
42 27161242 Terminal
Antenna,1.565GHz-1.605GHz,2.4GHz-2.5GHz,5GHz-6GHz,1880M
Hz-1920MHz,2.01GHz-2.025GHz,2300MHz-2400MHz,2570MHz-2
620MHz,larger than -3dBi,isotropic,linear polarization,smaller than
3,4W,D2-5000 antenna on C cover,LDS antenna ,Skycross
1.0 PCS
43 27161241 Terminal
Antenna,824MHz-960MHz,1710MHz-2170MHz,2.3GHz-2.4GHz,2.
5GHz-2.7GHz,larger than -3dBi,isotropic,smaller than
3,4W,D2-2010 main antenna,FPC antenna,Skycross
1.0 PCS
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D2-0082:
No. Part Number Name Quantity
1 51130066 TD-SCDMA Phone,D2-5000,TD-SCDMA/GSM
Handset,White,China,China Mobile
1.0 PCS
2 03021YFH Manufactured Board,D2-5000,HL1D25000M,D2-5000 Handset
Main Board(16G ROM/GSM),Terminal Dedicated,2*2
1.0 PCS
3 03021UQN Manufactured Board,D2-0082,HD1U9800DL,D2-0082 Main
FPC-1*1
1.0 PCS
4 03021USK Manufactured Board,D2-0082,HD1U9800DMIC,D2-0082 MIC
FPC,1*1
1.0 PCS
5 03021WQX Manufactured Board,D2-5000,HT1T9800LA,D2-5000 Antenna
Board,6*6
1.0 PCS
6 02230VBS Front Housing Assy(Silver) 1.0 PCS
7 51623849 RECEIVER-ASSY-C9800D 1.0 PCS
8 51660AKM BATTERY COVER-ASSY-WHITE-T9800L 1.0 PCS
9 51660AHK Sim Card Housing Assy-T9800L 1.0 PCS
10 51634067 Submic Gasket Assy-C9800D 1.0 PCS
11 51634068 MOTOR Frame Assy-C9800D 1.0 PCS
12 51660AHM Sub Camera Frame Assy-C9800D 1.0 PCS
13 51634070 Sensor Rubber Assy-C9800D 1.0 PCS
14 51634242 DKBA80932335,A-COVER-TP-ADHENSIVE,C9800D 1.0 PCS
15 51634071 O-Ring-Earjack-C9800D 1.0 PCS
16 51634073 O-Ring-SPK-C9800D 1.0 PCS
17 51634075 Mainboard Conductive Copper-C9800D 1.0 PCS
18 51634074 Main Fpczif-Mylar-C9800D 1.0 PCS
19 51634244 DKBA80933187,MOTOR-zif-mylar,C9800D 1.0 PCS
20 51634245 DKBA80932887,Main-cam-electic-fabric,C9800D 1.0 PCS
21 51634246 DKBA80933311,SUB-mic-dustproof,C9800D 1.0 PCS
22 51622215 M 1.4*3*2.5*0.5(T5)-NY 6.0 PCS
23 51622228 M1.4*2.0*2.5*0.5 3.0 PCS
24 51623361 DKBA89000766,Screw-T5 3.0 PCS
25 51621198 DKBA8.900.0504,T5 pan head mechanical
screw,M1.4*4.0*D2.6*0.8,Plated with black
zinc,NY,Unitary(non-priority)
2.0 PCS
26 51650888 DKBA8.817.7194,warranty label,2.5mm,General 1.0 PCS
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No. Part Number Name Quantity
27 51623896 TOP-SHIELD COVER-1-YD-T9800L 1.0 PCS
28 51623895 TOP-SHIELD COVER-2-YD-T9800L 1.0 PCS
29 51623892 BOT-SHIELD COVER-1-YD-T9800L 1.0 PCS
30 51623886 BOT-SHIELD COVER-2-YD-T9800L 1.0 PCS
31 51634118 GRAPHITE L-FILM_TOP_YD_T9800L 1.0 PCS
32 51634119 GRAPHITE FILM_BTM_T9800L 1.0 PCS
33 23040290 LCD Indication
Module,SIGNAL,TFT,4.97,1920*1080,16.7M,16:9,2.29TYP,wit
h touch panel,BTB
1.0 PCS
34 23060094 Camera Module Group,1/3'',CMOS RGBW BI
sensor,13M,Terminal Dedicated
1.0 PCS
35 23060099 Camera Module Group,1/6",CMOS 1M HD FSI
sensor,FF,MIPI,6.0*6.0*3.3,Terminal 1.0 PCS
36 32050039 Vibrating
Motor,Cylindrical,2.0V,0.080A,0rpm,D10*3mm,Spring Contact
Terminals,23ohm,Terminal Dedicated
1.0 PCS
37 22020107 Speaker,8ohm,1W,D2 box,40*16.5*6.7 1.0 PCS
38 24021174 Rechargeable Battery,Li-polymer
Battery,HB5U1V,3.8V,2.9Ah,Single Cell,Max
5.5*56.0*71.0mm, Embedded,4.35V High Voltage,Chinese &
English,Screen Printing,Terminal Dedicated
1.0 PCS
39 4050532 Out Sourcing Cable,RF Coaxing Cable,87mm,fit
14240433,0.087,Terminal Dedicated
1.0 PCS
40 51624192 DKBA80359900,Volume-box-grounding-contact,C9800D 1.0 PCS
41 27161241 Terminal
Antenna,824MHz-960MHz,1710MHz-2170MHz,2.3GHz-2.4GH
z,2.5GHz-2.7GHz,larger than -3dBi,isotropic,smaller than
3,4W,D2-2010 main antenna,FPC antenna,Skycross
1.0 PCS
42 27161242 Terminal
Antenna,1.565GHz-1.605GHz,2.4GHz-2.5GHz,5GHz-6GHz,188
0MHz-1920MHz,2.01GHz-2.025GHz,2300MHz-2400MHz,2570
MHz-2620MHz,larger than -3dBi,isotropic,linear
polarization,smaller than 3,4W,D2-5000 antenna on C cover,LDS
antenna ,Skycross
1.0 PCS
43 51634303 Thermal-Pad,T0.76mm,D2,Terminal Dedicated 1.0 PCS
D2-2010:
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No. Part Number Name Quantity
1 51141791 CDMA Mobile Phone,D2-2010,Chinese-English Version,5.0
FHD 16M Color LCD,Android,Double R-UIM,BT,WLAN,GPS
1.0 PCS
2 03021UPQ Manufactured Board-CDMA D2-2010-HC1C9800DM-D2-2010
Handset Main Board -2*2
1.0 PCS
3 03021UQN Manufactured Board,D2-0082,HD1U9800DL,D2-0082 Main
FPC-1*1
1.0 PCS
4 03021USK Manufactured Board,D2-0082,HD1U9800DMIC,D2-0082 MIC
FPC,1*1
1.0 PCS
5 03021UQV Manufactured Board-D2-2010-HC1C9800DA-D2-2010 Antenna
Board-6*6
1.0 PCS
6 02230THS ASSEMBLE,D2-2010/5000/0082 FRONT ASSEMBLE HOUSE 1.0 PCS
7 23040290 LCD Indication
Module,SIGNAL,TFT,4.97,1920*1080,16.7M,16:9,2.29TYP,wit
h touch panel,BTB
1.0 PCS
8 23060094 Camera Module Group,1/3'',CMOS RGBW BI
sensor,13M,Terminal Dedicated
1.0 PCS
9 23060099 Camera Module Group,1/6",CMOS 1M HD FSI
sensor,FF,MIPI,6.0*6.0*3.3,Terminal
1.0 PCS
10 32050039 Vibrating
Motor,Cylindrical,2.0V,0.080A,0rpm,D10*3mm,Spring Contact
Terminals,23ohm,Terminal Dedicated
1.0 PCS
11 22020107 Speaker,8ohm,1W,D2 box,40*16.5*6.7 1.0 PCS
12 24021174 Rechargeable Battery,Li-polymer
Battery,HB5U1V,3.8V,2.9Ah,Single Cell,Max
5.5*56.0*71.0mm, Embedded,4.35V High Voltage,Chinese &
English,Screen Printing,Terminal Dedicated
1.0 PCS
13 51623849 RECEIVER-ASSY-C9800D 1.0 PCS
14 51660AHL BATTERY COVER ASSY-C9800D 1.0 PCS
15 51660AHJ SIM CARD HOUSING ASSY-CN-C9800D 1.0 PCS
16 51634067 Submic Gasket Assy-C9800D 1.0 PCS
17 51634068 MOTOR Frame Assy-C9800D 1.0 PCS
18 51660AHM Sub Camera Frame Assy-C9800D 1.0 PCS
19 51634070 Sensor Rubber Assy-C9800D 1.0 PCS
20 51634242 DKBA80932335,A-COVER-TP-ADHENSIVE,C9800D 1.0 PCS
21 51634071 O-Ring-Earjack-C9800D 1.0 PCS
22 51634073 O-Ring-SPK-C9800D 1.0 PCS
23 51634075 Mainboard Conductive Copper-C9800D 1.0 PCS
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 18 of 187
No. Part Number Name Quantity
24 51634074 Main Fpczif-Mylar-C9800D 1.0 PCS
25 51624192 DKBA80359900,Volume-box-grounding-contact,C9800D 1.0 PCS
26 51634243 DKBA80933901,USB electric fabric,C9800D 1.0 PCS
27 51634244 DKBA80933187,MOTOR-zif-mylar,C9800D 1.0 PCS
28 51634245 DKBA80932887,Main-cam-electic-fabric,C9800D 1.0 PCS
29 51634246 DKBA80933311,SUB-mic-dustproof,C9800D 1.0 PCS
30 04050532 Out Sourcing Cable,RF Coaxing Cable,87mm,fit
14240433,0.087,Terminal Dedicated
1.0 PCS
31 51634117 DKBA80932409,C9800D-GRAPHITE-FILM-BOTTOM,C9800
D
1.0 PCS
32 51634118 GRAPHITE L-FILM_TOP_YD_T9800L 1.0 PCS
33 51622215 M 1.4*3*2.5*0.5(T5)-NY 6.0 PCS
34 51622228 M1.4*2.0*2.5*0.5 3.0 PCS
35 51623361 DKBA89000766,Screw-T5 3.0 PCS
36 51621198 DKBA8.900.0504,T5 pan head mechanical
screw,M1.4*4.0*D2.6*0.8,Plated with black
zinc,NY,Unitary(non-priority)
2.0 PCS
37 51650888 DKBA8.817.7194,warranty label,2.5mm,General 1.0 PCS
38 51623870 BOT-SHIELD-COVER-1-CN-C9800D 1.0 PCS
39 51623871 TOP-SHIELD-COVER-1-CN-C9800D 1.0 PCS
40 51623873 TOP-SHIELD-COVER-2-CN-C9800D 1.0 PCS
41 51623876 BOT-SHIELD-COVER-2-CN-C9800D 1.0 PCS
42 51634303 Thermal-Pad,T0.76mm,D2,Terminal Dedicated 1.0 PCS
43 05011FCF Terminal Software,D2-2010,HDD2-2010M01,D2-2010 Update
Software,Program,China(K3V2 +QSC6085 + MTK6252D)
1.0 PCS
44 27161240 Terminal
Antenna,1.565GHz-1.605GHz,2.4GHz-2.5GHz,5GHz-6GHz,880
MHz-960MHz,1710MHz-1880MHz,1880MHz-1990MHz,larger
than -3dBi,isotropic,smaller than 3,4W,D2-2010 antenna on C
cover,LDS antenna ,Skycross
1.0 PCS
45 27161241 Terminal
Antenna,824MHz-960MHz,1710MHz-2170MHz,2.3GHz-2.4GH
z,2.5GHz-2.7GHz,larger than -3dBi,isotropic,smaller than
3,4W,D2-2010 main antenna,FPC antenna,Skycross
1.0 PCS
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 19 of 187
The component list is for your reference only and subject to changes without notices. The latest
component list is available in Huawei's ITEM information system. If you have any questions, contact
your local technical support.
4 Components on the PCBA
4.1 Components on the PCBA
Figure 4-1 PCBA's front and back components (excluding the shielding cover and frame)
D2-5000/D2-0082:
U1800 flashlight control chipFault caused if damaged: flashlight fault
U3105 1.2V LDOFault caused if damaged: MHL fault
U3201 DC/DC buck-single output primary camera DVDD power supplyFault caused if damaged: camera fault
U3203 Load switchSecondary camera DVDD power supplyFault caused if damaged: camera fault
TCXO5601 26M2.4/5GHz WLAN/Bluetooth 4.0/FM/GPS four-in-one chip clockFault caused if damaged: wifi,BT,FM,GPS faults
J1801 secondary camera connectorFault caused if damaged: Secondary camera fault
U2005 COMPASS chipFault caused if damaged: Compass fault
U2203 operational amplifier-2.5 to 5.5 V-motor power supplyFault caused if damaged: motor fault
U1201 audio power amplifierFault caused if damaged: Speaker failure
U56032.4/5GHz WLAN/Bluetooth 4.0/FM/GPS four-in-one chipFault caused if damaged: Wi-Fi,BT,FM,GPS faults
U4102 GSM four-band PAFault caused if damaged: Calling fault
U4204 RF power moduleGSM four-band PAFault caused if damaged: TD-SCDMA Band 40 has no or low power to send signals.
U4402: RF power moduleFault caused if damaged: LTE Band 7 has no or low power to send signals.
U4203：RF power moduleFault caused if damaged: TDD-LTE Band 38 has no or low power to send signals.
U4001,U4201 RF power moduleFault caused if damaged: UMTS Band 1 has no or low power to send signals.U4401 RF gain module
Fault caused if damaged: calling failure
U900 power management chipFault caused if damaged: power on failure
U1301 battery fuel gauge
Fault caused if damaged: power
on failure and charging failure
U3000: double denoising chipsFault caused if damaged: No sound during calling
TCXO1001(26M) main crystal oscilliator
Fault caused if damaged: power on failure
X1000 crystal（32 K）Fault caused if damaged: power
on failure
U300 /U300_POP AP+DDR2
Fault caused if damaged: power
on failure
U3101MHL conversion chip
Fault caused if damaged: MHL fault
U3104 level-conversion chip
Fault caused if damaged:
MHL fault
U1102 EMMC
Fault caused if damaged:
power on failure
D2 Maintenance Manual INTERNAL
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U2004 Accelerometer chip
Fault caused if damaged:
Accelerometer fault
U2003 Gyroscope chip
Fault caused if damaged:
Gyroscope fault
J2202 Receiver FPC connector
Fault caused if damaged: No
sound from the receiver, tri-color
indicator，3-in-1 light, and
proximity and infrared sensor faults
J1802 Camera connector
Fault caused if damaged: Failure
of the main camera
U1901 charging chip
Fault casused if damaged:
Charging and Wi-Fi/BT faults
J1900 tail plug
Fault caused if damaged: USB/
MHL/charging malfucnction
J1601 LCD connector：Fault caused if damaged: LCD
display failure
U1905，MHL conversion chip
Fault caused if damaged: MHL
fault
U1600 LCD backlight chip
Fault caused if damaged: LCD
backlight failure
U800（under the shielding
cover）GPU Power
Fault caused if damaged: GPU fault
U2001 Temperature sensor IC
Fault caused if damaged:
Temperature sensor failure
U1601 LCD Voltage driverIC
Fault caused if damaged: LCD
display failure
J1301 battery
connector：Fault caused if
damaged: power on failureJ2201 Main FPC connector：Fault caused if damaged:
Power on failure, volume/
speaker/microphone key
malfunction, motor failure
U2900: PMU Hi6451
MODEM PMU
Fault caused if damaged:
2G and 3G faults
U1501 headphone PA
Fault caused if
damaged: No sound
from the headphone and
power on failure
U4302，U3903 RF switch
Fault caused if damaged:
Calling failure
U4101 RF switch
Fault caused if damaged:
Calling failure
U4003，U4005，U4006，U44
03，U4404 RF duplexer
Fault caused if damaged:
Calling failure
U4301 RF switch
Fault caused if damaged:
Calling failure
U3901：MODEM Hi6360 RF
receiving and sending chip
Fault caused if damaged: 2G
and 3G faults
U5504 RF switch
Fault caused if damaged:
Wi-Fi/BT failure
Z5505 SAW filter
Fault caused if damaged:
Wi-Fi failure
TCX100 19.2M
Fault caused if damaged:
Calling failure
U2501 MODEM Hi6920 BB IC
Fault caused if damaged: 2G
and 3G faults
D2-2010:
U1905：MHL conversion chip
Fault caused if damaged: MHL
fault
U1902：Analog switch
Fault caused if damaged:
MHL fault
U3101MHL conversion chip
Fault caused if damaged: MHL
fault
U3104 level
conversion chip
Fault caused if
damaged: MHL fault
U3000: Double denoising chips
Fault caused if damaged: No
sound during the call, Bluetooth/
Wi-Fi fault
U3105 1.2V LDO
Fault caused if damaged:
MHL fault
U1601 LCD voltage driver IC
Fault caused if damaged: LCD
display failure
J1801 secondary camera connector
Fault caused if damaged: Secondary
camera failure
U2005 Compass chip
Fault caused if damaged:
Compass failure
U2003 gyroscope chip
Fault caused if damaged:
Gyroscope fault
U2101，U2109 analog switch
and anti-burning card
Fault caused if damaged:
Calling failure
U4201MCP-1Gb(64M x 16)
NAND FLASH
Fault caused if damaged:
Calling failure
U2203 differential operational
amplifier -2.5 to 5.5 V- power
supply for the motor
Fault caused if damaged:
Motor failure
U6501LVCMOS-4BIT automatic
direction identification and level
conversion chip
Fault caused if damaged: MTK6252
modem fault and calling fault
X1000 crystal（32 K）Fault caused if damaged:
Power on failure
U1201 audio power amplifier
Fault caused if damaged: No
sound from the speaker
TCXO1001(26M) main
crystal oscilliator
Fault caused if damaged:
Power on failure
U1501 headphone PA
Fault caused if damaged: No
sound from the headphone and
power-on failure
U900 power management chip
Fault caused if damaged:
Power on failure
U300 /U300_POP
AP+DDR2
Fault caused if damaged:
Power on failure
U800 GPU Power
Fault caused if damaged:
GPU fault
U1101 EMMC
Fault caused if damaged:
Power on failure
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 21 of 187
U2004 Accelerometer chip
Fault caused if damaged:
Accelerometer fault
U3203 Load switch
Secondary camera DVDD
power supply
Fault caused if damaged:
Camera fault
U3204 DC/DC buck-single output
Primary camera DVDD power supply
Fault caused if damaged: Camera
fault
J2202 Receiver FPC connector
Fault caused if damaged: No sound from
the receiver, tri-color indicator，3-in-1 light,
and proximity and infrared sensor faults
J1901：tail plug
Fault caused if damaged: USB/MHL/
charging failure
J1802 Camera connector
Fault caused if damaged: Primary
camera failure
J1601 LCD connector
Fault caused if damaged: LCD display failure
U1901 charging chip
Fault caused if damaged: Charging/
WIFI/BT failure
U5000：GSM/GPRS baseband
processing chip MT6252D
Fault caused if damaged: 2G fault
U5301: RF multi-functional
component-
Fault caused if damaged: 2G fault
U1301 voltameter
Fault caused if damaged: Power on
and charging failure
J1301 battery
connector：Fault caused if
damaged: Power one failure
J2201 Main FPC connector：Fault caused if damaged:
Power on failure, volume/
speaker/microphone key
malfunction, motor failure
X5301:26M crystal (for
GSM/GPRS baseband
processing chip）Fault caused if damaged:
2G fault
U700: Baseband
Processor(QSC6085-1)
Fault caused if damaged:
2G and 3 G faults
Z4501：SAW filter
Fault caused if damaged:
Calling fault
U2001 Temperature
sensor IC
Fault caused if damaged:
Temperature sensor fault
U4302: Temperature
compensated oscillator-
19.2 MHz, for QSC6085
Fault caused if damaged:
2G and 3G faults
U5501 : RF switch
Fault caused if damaged:
Wi-Fi 5 GHz fault
U5504,U5502 : RF switch
Fault caused if damaged:
Wi-Fi 2.4 GHz fault
U5400 : WIFI,GPS duplexor
Fault caused if damaged:
Wi-Fi and GPS faults
Z5801 : GPS SAW filter
Fault caused if damaged:
GPS fault
U2005 COMPASS chip
Fault caused if damaged:
Compass failure
TCXO5601 26M
2.4/5 GHz WLAN/Bluetooth 4.0/FM/
GPS four-in-one chip clock
Fault caused if damaged: Wi-
Fi,BT,FM,GPS faults
4.2 PCBA Component List
Table 4-1 D2 Component List
D2-5000:
No. Part Number Name Quantity Position
-1 03021YFH Manufactured
Board,D2-5000,HL1D25000M,
D2-5000 Handset Main
Board(16G
ROM/GSM),Terminal
Dedicated,2*2
- -
10 03010TAB Manufactured
Board-D2-5000-HL1D25000M
-Ascend D2 Handset Main
Board -Terminal
Dedicated-2*2
1.0 PCS -
20 8071128 SMD Ceramic
Capacitor-6.3V-1000nF-+/-20
%-X5R-0201-Terminal
Dedicated
92.0 PCS C1004, C1005, C1026,
C1416, C2261, C2800,
C2802, C2803, C2833,
C3808, C500, C501, C502,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 22 of 187
No. Part Number Name Quantity Position
C503, C504, C505, C506,
C507, C508, C509, C510,
C511, C5620, C5621, C5622,
C5623, C5624, C5625,
C5626, C605, C606, C607,
C608, C609, C612, C614,
C615, C616, C617, C618,
C619, C620, C621, C622,
C623, C624, C625, C626,
C627, C628, C629, C630,
C633, C645, C650, C651,
C652, C653, C655, C656,
C657, C658, C659, C660,
C661, C662, C663, C665,
C666, C669, C670, C686,
C687, C707, C708, C709,
C710, C711, C712, C713,
C714, C715, C723, C724,
C725, C726, C727, C734,
C735, C738, C739, C740
30 8070667 SMD Ceramic
Capacitor-6.3V-2200nF-+/-20
%-X5R-0402-TS16949
70.0 PCS C1001, C1002, C1003,
C1132, C1505, C1526,
C1527, C1814, C1816,
C1818, C2000, C2001,
C2500, C2808, C2809,
C2810, C2811, C2812,
C2813, C2900, C2901,
C2902, C2903, C2905,
C2906, C3101, C3102,
C3116, C3197, C3915,
C3916, C4093, C4095,
C4235, C4236, C600, C602,
C603, C647, C648, C664,
C685, C688, C700, C701,
C733, C901, C902, C903,
C904, C905, C906, C907,
C908, C909, C911, C912,
C913, C914, C915, C916,
C917, C918, C919, C920,
C921, C922, C923, C924,
C925
40 8070783 SMD Ceramic
Capacitor-6.3V-22000nF-+/-20
%-X5R-0603-Terminal
Dedicated
31.0 PCS C1118, C1119, C1238,
C1908, C1910, C2908,
C2909, C2910, C2948,
C3121, C3202, C4106,
C4125, C601, C636, C642,
C643, C644, C649, C802,
C803, C939, C940, C941,
C942, C944, C946, C948,
C950, C952, C959
50 8070819 SMD Ceramic 26.0 PCS C1513, C1514, C1515,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 23 of 187
No. Part Number Name Quantity Position
Capacitor-6.3V-4700nF-+/-20
%-X5R-0402-Terminal
Dedicated-Terminal Dedicated
C1516, C1611, C1811,
C2012, C2260, C2924,
C2925, C2926, C2950,
C5639, C5640, C604, C610,
C611, C613, C667, C668,
C683, C684, C728, C736,
C737, C910
60 8070692 SMD Ceramic
Capacitor-10V-10nF-+/-10%-X
5R-0201-TS16949
16.0 PCS C2503, C2930, C2931,
C2932, C2944, C3003,
C3004, C3005, C3122,
C3802, C5646, C632, C635,
C638, C646, C947
70 8070704 SMD Ceramic
Capacitor-6.3V-100nF-+/-10%-
X5R-0201-TS16949
156.0 PCS C1021, C1023, C1105,
C1106, C1110, C1111,
C1112, C1113, C1133,
C1236, C1307, C1309,
C1310, C1311, C1312,
C1315, C1319, C1406,
C1407, C1418, C1501,
C1502, C1506, C1602,
C1603, C1633, C1635,
C1636, C1805, C1806,
C1808, C1809, C1815,
C1817, C1819, C1821,
C1822, C1824, C1827,
C1920, C2002, C2003,
C2004, C2005, C2006,
C2015, C2016, C2021,
C2143, C2144, C2145,
C2146, C2216, C2217,
C2241, C2242, C2243,
C2262, C2266, C2401,
C2402, C2419, C2420,
C2421, C2501, C2502,
C2510, C2605, C2814,
C2815, C2816, C2817,
C2818, C2819, C2820,
C2821, C2822, C2823,
C2824, C2825, C2826,
C2827, C2828, C2829,
C2830, C2831, C2832,
C2834, C2835, C2836,
C2838, C2839, C2840,
C2907, C2951, C3105,
C3106, C3107, C3108,
C3110, C3111, C3112,
C3113, C3114, C3115,
C3189, C3905, C4115,
C4123, C4327, C4436,
C5503, C5504, C5605,
C5606, C5607, C5610,
C5611, C5613, C5614,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 24 of 187
No. Part Number Name Quantity Position
C5615, C5616, C5632,
C5642, C5643, C634, C639,
C641, C654, C689, C690,
C691, C702, C703, C704,
C705, C706, C716, C717,
C718, C719, C720, C721,
C722, C729, C730, C731,
C732, C800, C801, C804,
C926, C927, C928, C929,
C933
80 8070449 SMD Ceramic
Capacitor-16V-10nF-+/-10%-X
7R-0402-BT,TS16949
1.0 PCS C637
90 8070676 SMD Ceramic
Capacitor-25V-0.01nF-+/-5%-
NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
12.0 PCS C1503, C5505, C5506,
C5507, C5515, C5516,
C5520, C5526, C5527,
C5528, C640, C934
100 8070564 SMD Ceramic
Capacitor-6.3V-4700nF-+/-20
%-X5R-0603-BT,TS16949
1.0 PCS C930
110 8070612 SMD Ceramic
Capacitor-10V-1000nF-+/-10%
-X5R-0402-BT,TS16949
11.0 PCS C1303, C1904, C1905,
C1909, C3000, C3001,
C3002, C935, C936, C937,
C938
120 8070649 SMD Ceramic
Capacitor-6.3V-10000nF-+/-20
%-X5R-0603-BT,TS16949
18.0 PCS C1124, C1125, C1632,
C1823, C1903, C2934,
C2936, C2945, C3103,
C3118, C3201, C5635,
C5636, C5637, C5648,
C5649, C949, C951
130 8070703 SMD Ceramic
Capacitor-25V-1nF-+/-10%-X7
R-0201-TS16949
17.0 PCS C1024, C1104, C1134,
C1301, C2801, C2804,
C2805, C2806, C2807,
C2911, C3804, C3805,
C3806, C3901, C4103,
C5502, C958
140 8070695 SMD Ceramic
Capacitor-25V-0.022nF-+/-5%-
NP0-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
12.0 PCS C1010, C1011, C3909,
C3910, C3912, C3913,
C3914, C3917, C3918,
C3919, C3920, L4010
150 8070720 SMD Ceramic
Capacitor-6.3V-1000nF-+/-10
%-X5R-0402-Terminal
Dedicated,TS16949-Terminal
Dedicated
21.0 PCS C1020, C1025, C1114,
C1528, C1529, C1616,
C1820, C1825, C1826,
C2913, C2914, C2915,
C2916, C2917, C2918,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 25 of 187
No. Part Number Name Quantity Position
C2920, C2922, C2923,
C2949, C3117, C5647
160 8070531 SMD Ceramic
Capacitor-50V-1nF-+/-10%-X7
R-0402-BT
1.0 PCS C1022
170 8070752 SMD Ceramic
Capacitor-6.3V-220nF-+/-20%-
X5R-0201-Terminal Dedicated
3.0 PCS C1103, C1601, C5601
180 8070625 SMD Ceramic
Capacitor-6.3V-470nF-+/-10%-
X5R-0402
3.0 PCS C1131, C1308, C2103
190 8070817 SMD Ceramic
Capacitor-6.3V-47nF-+/-10%-
X5R-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C1234, C1245
200 8071388 SMD Ceramic
Capacitor-10V-22000nF-+/-20
%-X5R-0805(2.0*1.25*0.95m
m)-Terminal Dedicated
1.0 PCS C1237
210 8070696 SMD Ceramic
Capacitor-25V-0.1nF-+/-5%-N
PO-0201-TS16949
21.0 PCS C1243, C1313, C1907,
C3911, C4001, C4003,
C4011, C4012, C4028,
C4029, C4204, C4205,
C4212, C4213, C4223,
C4225, C4406, C4407,
C4415, C4419, C5511
220 8070716 SMD Ceramic
Capacitor-6.3V-33nF-+/-10%-
X5R-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C1306, C3803
230 8070760 SMD Ceramic
Capacitor-25V-0.047nF-+/-5%-
NPO-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C1314, C1504
240 8020142 Solid SMD Tantalum
Capacitor-6.3V-47uF-+/-20%-0
805-2.0*1.25*1.0mm-200moh
m-Terminal Dedicated
1.0 PCS C1316
250 8070689 SMD Ceramic
Capacitor-25V-0.033nF-+/-5%-
NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
147.0 PCS C1412, C1413, C1414,
C1417, C1508, C1509,
C1531, C1604, C1605,
C1606, C1620, C1621,
C1623, C2022, C2023,
C2024, C2025, C2028,
C2029, C2106, C2122,
C2124, C2142, C2201,
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
C2202, C2203, C2205,
C2206, C2207, C2208,
C2209, C2210, C2211,
C2212, C2213, C2214,
C2244, C2245, C2246,
C2265, C2403, C2405,
C2406, C2407, C2408,
C2409, C2411, C2412,
C2413, C2414, C2415,
C2416, C2417, C2418,
C2927, C2943, C3807,
C3925, C3926, C3927,
C3931, C3932, C3951,
C4004, C4006, C4007,
C4008, C4025, C4026,
C4027, C4038, C4039,
C4072, C4089, C4094,
C4096, C4097, C4107,
C4108, C4110, C4111,
C4112, C4113, C4114,
C4116, C4117, C4118,
C4119, C4120, C4121,
C4127, C4128, C4129,
C4130, C4135, C4201,
C4202, C4203, C4210,
C4217, C4221, C4222,
C4224, C4226, C4227,
C4232, C4233, C4234,
C4292, C4293, C4294,
C4295, C4304, C4305,
C4306, C4307, C4309,
C4319, C4320, C4322,
C4328, C4329, C4330,
C4331, C4332, C4333,
C4334, C4335, C4336,
C4342, C4401, C4402,
C4403, C4404, C4410,
C4413, C4414, C4417,
C4425, C4426, C4433,
C4434, C4437, C4438,
C5523, L4225, L4226
260 8070450 SMD Ceramic
Capacitor-50V-0.1nF-+/-5%-N
PO-0402-BT
1.0 PCS C1525
270 8070713 SMD Ceramic
Capacitor-6.3V-22nF-+/-10%-
X5R-0201
1.0 PCS C1530
280 8070735 SMD Ceramic
Capacitor-50V-1000nF-+/-10%
-X5R-0805-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C1610
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 27 of 187
No. Part Number Name Quantity Position
290 8070780 SMD Ceramic
Capacitor-10V-10000nF-+/-10
%-X5R-0805-Terminal
Dedicated-Terminal Dedicated
3.0 PCS C1628, C1629, C1812
300 8070547 SMD Ceramic
Capacitor-50V-0.033nF-+/-5%-
NP0-0402-BT
1.0 PCS C1634
310 8070789 SMD Ceramic
Capacitor-25V-0.0056nF-+/-0.
1pF-NPO-0201-Terminal
Dedicated
22.0 PCS C1801, C1802, C1803,
C1804, C1807, C1810,
C1846, C1847, C1848,
C1849, C1850, C1851,
C1852, C1853, C1864,
C1865, C1866, C1867,
C1868, C1869, C1872,
C1873
320 8070583 SMD Ceramic
Capacitor-10V-47nF-+/-10%-X
7R-0402
1.0 PCS C1901
330 8070785 SMD Ceramic
Capacitor-10V-4700nF-+/-10%
-X5R-0603-Terminal
Dedicated-Terminal Dedicated
3.0 PCS C1906, C2837, C2933
340 8071463 SMD Ceramic
Capacitor-16V-2200nF-+/-20%
-X5R-0402(1.0*0.5*0.6mm)-H
max=0.6mm-Terminal
Dedicated
1.0 PCS C1911
350 8070970 SMD Ceramic
Capacitor-50V-10nF-10%-X7R
-0402-Terminal Dedicated
1.0 PCS C2011
360 8070711 SMD Ceramic
Capacitor-16V-2.2nF-+/-10%-
X7R-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C2504
370 8070746 SMD Ceramic
Capacitor-25V-0.003nF-+/-0.2
5pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated
4.0 PCS C3902, C3903, C3935,
C3936
380 8070966 SMD Ceramic
Capacitor-4V-470nF-+/-20%-X
5R-0201-Terminal Dedicated
5.0 PCS C3906, C3907, C3908,
C3921, C3922
390 10100118 Mobile Dedicated,Chip
Inductor-0.0056uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated
2.0 PCS C3928, C4104
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 28 of 187
No. Part Number Name Quantity Position
400 8070743 SMD Ceramic
Capacitor-25V-0.0015nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
3.0 PCS C3933, C3934, C4301
410 10100110 Mobile Dedicated,Chip
Inductor-0.0027uH-+/-0.3nH-0.
2A-0.25ohm-201
1.0 PCS C4030
420 10100105 Mobile Dedicated,Chip
Inductor-0.0015uH-+/-0.3nH-0.
23A-0.18ohm-201-Terminal
Dedicated
2.0 PCS C4079, L4132
430 10100103 Mobile Dedicated,Chip
Inductor-0.001uH-+/-0.3nH-0.2
5A-0.14ohm-201-TS16949-Ter
minal Dedicated
3.0 PCS C4098, C4105, C4215
440 8070740 SMD Ceramic
Capacitor-25V-0.0005nF-+/-0.
1pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
3.0 PCS C4102, L4296, L5401
450 8070707 SMD Ceramic
Capacitor-25V-0.68nF-+/-10%-
X7R-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C4109
460 10100124 Mobile Dedicated,Chip
Inductor-0.01uH-+/-5%-0.15A-
0.63ohm-201-TS16949-Termin
al Dedicated
6.0 PCS C4220, L3901, L4303,
L4304, L4404, L4405
470 8070712 SMD Ceramic
Capacitor-25V-0.015nF-+/-5%-
NP0-0201
4.0 PCS C4286, C4287, L4411,
L4412
480 8070950 SMD Ceramic
Capacitor-25V-0.018nF-+/-5%-
C0G-0.6mm*0.3mm*0.3mm-T
erminal Dedicated
8.0 PCS C4289, C4291, C5402,
C5403, C5404, C5512,
C5522, C5529
490 8070741 SMD Ceramic
Capacitor-25V-0.001nF-+/-0.2
5pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C4298, C5641
500 10100126 Mobile Dedicated,Chip
Inductor,
0.015uH,+/-5%,0.10A,0.70ohm
,0201,Chip Inductor,Mobile
Dedicated
2.0 PCS C4299, L4131
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 29 of 187
No. Part Number Name Quantity Position
510 8070753 SMD Ceramic
Capacitor-25V-0.0082nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated
3.0 PCS C4317, C4408, C4422
520 10100117 Mobile Dedicated,Chip
Inductor-0.0051uH-+/-0.3nH-0.
15A-0.4ohm-201
7.0 PCS C4325, L4023, L4222,
L4223, L4310, L4311, L4406
530 10100116 Mobile Dedicated,Chip
Inductor-0.0047uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated
3.0 PCS C4337, L4129, L5506
540 10100125 Mobile Dedicated,Chip
Inductor-0.012uH-+/-5%-0.1A-
0.7ohm-201-TS16949-Termina
l Dedicated
1.0 PCS C4412
550 10100115 Mobile Dedicated,Chip
Inductor-0.0043uH-+/-0.3nH-0.
15A-0.4ohm-201
3.0 PCS C4439, L4004, L4005
560 8070754 SMD Ceramic
Capacitor-25V-0.039nF-+/-5%-
NPO-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C5501
570 7090911 Chip Thick Film
Resistor-0.05W-0ohm-< 50m
ohm-0201-ELOM,TS16949
84.0 PCS C5530, R1007, R1013,
R1014, R1223, R1301,
R1313, R1314, R1402,
R1403, R1408, R1409,
R1502, R1622, R1811,
R1814, R1817, R1821,
R1823, R1825, R1828,
R1830, R1831, R1832,
R1932, R1934, R1937,
R2002, R2003, R2006,
R2014, R2015, R2016,
R2017, R2018, R2131,
R2409, R2516, R2518,
R2519, R2742, R2743,
R2744, R2745, R2804,
R2805, R2906, R2911,
R2912, R2913, R2914,
R2915, R2916, R2917,
R2918, R3003, R3009,
R3010, R3012, R3013,
R3018, R306, R3113, R3126,
R3130, R3131, R4301, R524,
R525, R5402, R5403, R5501,
R5507, R5508, R5514,
R5609, R5621, R5629,
R5642, R5650, R5651,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 30 of 187
No. Part Number Name Quantity Position
R5655, R5657, R911
580 8070700 SMD Ceramic
Capacitor-25V-0.068nF-+/-5%-
NP0-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C5603
590 8070751 SMD Ceramic
Capacitor-25V-0.027nF-+/-5%-
NPO-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C5619
600 15040311 Transient Suppression
Diode-6V-12V-50W-5A-SOD9
23-Terminal Dedicated
3.0 PCS D1301, D1302, D1903
610 15040339 Transient Suppression
Diode-6V-12V-30W-3A-0201-
Terminal Dedicated
11.0 PCS D1406, D1601, D1602,
D2101, D2102, D2104,
D2201, D2202, D2240,
D2241, D2242
620 15010262 Switching
Diode-75V-200mA-1V-SOD-5
23
1.0 PCS D1600
630 15010248 Schottky
diode-30V-0.2A-0.5V-SOD-52
3-1A
1.0 PCS D2901
640 15010365 Schottky
Diode,30V,0.3A,0.3V,SOD882
,Automotive Grade,Terminal
Dedicated
1.0 PCS D2902
650 19040169 Protection Tube,Fast Blowout
Fuse,24V,3A,IEC
Spec,0.03ohm,0.100
A*A*Sec,UL,Terminal
Dedicated
1.0 PCS F1900
660 51623884 BOT-SHIELD-COVER-3-YD-
T9800L
1.0 PCS F2401
670 51623897 BOT-SHIELD-COVER-1-YD-
T9800L
1.0 PCS F2402
680 51623898 BOT-SHIELD-COVER-2-YD-
T9800L
1.0 PCS F2403
690 51623900 Sim-rail2-T9800L 1.0 PCS F2405
700 51623877 BOT-SHIEDLING-FRAME-2-
YD-T9800L
1.0 PCS F2406
710 51623899 TOP-SHIELD
FRAME-1-YD-T9800L
1.0 PCS F2407
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 31 of 187
No. Part Number Name Quantity Position
720 51623879 B-Camera-nut-C9800D 1.0 PCS F2408
730 51623883 PCB-Steel-C9800D 1.0 PCS F2409
740 14240576 Card Block Connector,BTF
Connector,3*2,Female,1.3mm,
Terminal Dedicated
2.0 PCS J1301, J1900
750 14240375 BTB
Connector,female,40Pin,0.4m
m,0.8mm,SMT,Terminal
Dedicated
1.0 PCS J1601
760 14240496 BTB
Connector,Female,24Pin,0.4m
m,SMT,Mating Height
0.8mm,Terminal Dedicated
2.0 PCS J1801, J2201
770 14240579 BTB
Connector,BTBconnector,34PI
N,0.4mm,0.8mm,SMT,female,
Terminal Dedicated
1.0 PCS J1802
780 14240155 Card Socket Connector,SIM
Card
Socket,6pin,Horizontal,2.54m
m,Without Lock,Without Hold
Peg,Height 0.95mm,Terminal
Dedicated
1.0 PCS J2102
790 14240460 BTB
Connector,female,10Pin,0.4m
m,0.9mm,SMT,Terminal
Dedicated
1.0 PCS J2202
800 14240655 RF Connector,RF
Switch,Straight,female,SMT,S
plit from 14240432,Terminal
Dedicated
4.0 PCS J4101, J4301, J5501, J5502
810 14240433 RF Connector,Coaxial
Connector,50ohm,Straight,mal
e,SMT,W.FL2,PCN
Control,Terminal Dedicated
1.0 PCS J4102
820 51623882 Antenna-contact-C9800D 6.0 PCS J4302, J4304, J5401, J5503,
J5506, J5507
830 51621023 108-5785,Ground
Spring,U1250
2.0 PCS J5504, J5509
840 51621024 WN9149-N83-7F-W,Antenna
Spring,U1250
1.0 PCS J5508
850 10100051 Mobile Dedicated,EMI beads,
600ohm+/-25%,0.2A,0.65ohm,
12.0 PCS L1502, L1910, L2801,
L3101, L3102, L3105, L600,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 32 of 187
No. Part Number Name Quantity Position
0402,BT,Terminal Dedicated L601, L602, L603, L604,
L605
860 10100541 Terminal Power
Inductor,0.47uH,+/-30%,3.4A,
0.039ohm,2.5*2.0*1.2mm,100
8,3.8A,High Current
Inductor,Terminal Dedicated
1.0 PCS L800
870 10100175 Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-2A-0.1
15ohm-2.5*2.0*1.2mm
2.0 PCS L900, L901
880 10100473 Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-1.9A-0
.117ohm-2.5*2.0*1.2mm-Term
inal Dedicated
11.0 PCS L1210, L1601, L1803,
L2900, L2902, L2903,
L2904, L2905, L903, L904,
L905
890 10100147 SMT Power
Inductors,22uH,20%,0.42A,0.7
56ohm,3*3*1.2mm,Terminal
Dedicated
1.0 PCS L1600
900 7090800 Chip Thick Film
Resistor-0.0625W-0ohm-<
50mohm-0402-1A-BT
17.0 PCS L1804, L1805, L1806,
R1102, R1105, R1605,
R1634, R1919, R1943,
R2101, R2102, R2268,
R2269, R3112, R5632,
R5658, R702
910 10100539 Terminal Chip
Inductor,1uH,+/-30%,2.7A,0.0
59ohm,2.5*2.0*1.2mm,3A,PM
IC,Apart from
10100353,Inductor,Terminal
Dedicated
1.0 PCS L1901
920 10100168 Special Inductor and
Bead,Power
Inductor,4.7uH,-+/-20%,0.8A,0
.18ohm,2.5*2.0*1.2mm,25MH
z,Terminal Dedicated
1.0 PCS L2901
930 10100328 Terminal Chip
Inductor,1uH,+/-30%,1.58A,0.
102ohm,2.5*2.0*1.2mm(comp
atible with
2.4*2.4*1.2mm),Terminal
Dedicated
4.0 PCS L2906, L3103, L3201, L5608
940 10100119 Terminal Chip Inductor,
0.0062uH,+/-5%,0.15A,0.44oh
m,0201,EAR99.Chip Inductor
2.0 PCS L4011, L4012
950 10100128 Mobile Dedicated,Chip
Inductor-0.022uH-+/-5%-0.1A-
2.0 PCS L4013, L4014
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 33 of 187
No. Part Number Name Quantity Position
1.2ohm-201-TS16949-Termina
l Dedicated
960 8070744 SMD Ceramic
Capacitor-25V-0.0018nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated
1.0 PCS L4022
970 10100121 Mobile Dedicated,Chip
Inductor-0.0075uH-+/-5%-0.15
A-0.53ohm-201-TS16949-Ter
minal Dedicated
1.0 PCS L4024
980 10100122 Mobile Dedicated,Chip
Inductor-0.0082uH-+/-5%-0.15
A-0.55ohm-201-TS16949-Ter
minal Dedicated
13.0 PCS L4025, L4026, L4201,
L4228, L4230, L4287,
L4288, L4291, L4292,
L4299, L4402, L4408, L5607
990 10100113 Mobile Dedicated,Chip
Inductor,
0.0036uH,+/-0.3nH,0.17A,0.30
ohm,0201,Chip
Inductor,Mobile Dedicated
1.0 PCS L4102
1000 10100134 Mobile Dedicated,Chip
Inductor,
0.068uH,+/-5%,0.05A,3.00ohm
,0201,Chip Inductor,Mobile
Dedicated
2.0 PCS L4107, L4113
1010 10100107 Mobile Dedicated,Chip
Inductor-0.002uH-+/-0.3nH-0.2
A-0.2ohm-201-TS16949-Termi
nal Dedicated
2.0 PCS L4127, L4128
1020 10100120 Mobile Dedicated,Chip
Inductor-0.0068uH-+/-5%-0.15
A-0.48ohm-201-TS16949-Ter
minal Dedicated
2.0 PCS L4133, R4102
1030 10100106 Mobile Dedicated,Chip
Inductor-0.0018uH-+/-0.3nH-0.
2A-0.19ohm-201-TS16949-Ter
minal Dedicated
4.0 PCS L4204, L4224, L4231, L4413
1040 10100108 Mobile Dedicated,Chip
Inductor-0.0022uH-+/-0.3nH-0.
2A-0.22ohm-201
1.0 PCS L4295
1050 10100112 Mobile Dedicated,Chip
Inductor-0.0033uH-+/-0.3nH-0.
18A-0.3ohm-201-TS16949-Ter
minal Dedicated
3.0 PCS L4297, L4312, L4313
1060 10100111 Mobile Dedicated,Chip
Inductor,
2.0 PCS L4305, L4306
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 34 of 187
No. Part Number Name Quantity Position
0.003uH,+/-0.3nH,0.18A,0.28o
hm,0201,Chip Inductor,Mobile
Dedicat
1070 10100123 Mobile Dedicated,Chip
Inductor-0.0091uH-+/-5%-0.15
A-0.62ohm-201
1.0 PCS L4410
1080 10100127 Mobile Dedicated,Chip
Inductor-0.018uH-+/-5%-0.1A-
0.9ohm-201
1.0 PCS L4415
1090 10100153 Mobile Dedicated,Chip
Inductor-0.003uH-+/-0.3nH-0.3
A-0.17ohm-0402
1.0 PCS L5504
1100 10100280 Mobile Dedicated,Chip
Inductor-0.18uH-+/-5%-0.1A-3
.8ohm-1.0*0.5*0.55mm-0402-
500000000Hz-Terminal
Dedicated
1.0 PCS L5603
1110 10100185 Mobile Dedicated,Chip
Inductor-2.2uH-+/-20%-0.97A-
0.19ohm-2.5*2.0*1.0mm
1.0 PCS L5604
1120 10100350 Mobile Dedicated,Chip
Inductor-0.47uH-+/-30%-1.6A-
0.075ohm-2.0*1.6*1.0mm-Ter
minal Dedicated
1.0 PCS L5606
1130 10100150 ZD Dedicated Inductor and
Bead,EMI
Bead,330ohm@100MHZ,25%,
1.5A,0.08ohm,0603,Terminal
Dedicated
1.0 PCS LB1201
1140 10070019 EMI
beads,+/-25%,1000ohm,1.25oh
m,0.25A,0402
7.0 PCS LB1601, LB1602, LB1603,
LB1604, LB1605, LB2204,
LB2205
1150 10100507 Terminal EMI
beads,220ohm,25%,3A,0.04oh
m,0805,@30~500M
Impedance>120ohm,Terminal
Dedicated
1.0 PCS LB1900
1160 10100184 Terminal EMI
beads-1800ohm-25%-0.2A-2.2
ohm-0402-Terminal Dedicated
3.0 PCS LB2206, LB2207, LB2208
1170 10100100 Terminal EMI
beads-80ohm-25%-0.2A-0.4oh
m-0201-110ohm
tpy@1GHz,murata
70ohm@100MHz-Terminal
1.0 PCS LB2802
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 35 of 187
No. Part Number Name Quantity Position
Dedicated
1180 10100075 Mobile Dedicated,Chip
Inductor-0.0062uH-+/-0.2nH-0.
7A-0.09ohm-1.19*0.7*0.66
max
mm-4800000000Hz-Terminal
Dedicated
1.0 PCS LB5501
1190 15020235 LED,240cd,white,500mA,Ter
minal Dedicated,Flash LED
1.0 PCS LED1801
1200 22050075 Microphone,-42dB.,3.76*2.95*
1.1mm,silicon
1.0 PCS MIC1402
1210 15060238 MOSFET,N
Channel,20V,0.7A,530mohm,6
V,SC,75
1.0 PCS Q2901
1220 7092269 Chip Thick Film
Resistor-0.05W-1800ohm-+/-1
%-0201(0.6*0.3*0.23mm)-Ter
minal Dedicated
1.0 PCS R300
1230 7092050 Chip Thick Film
Resistor-0.05W-200ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated
2.0 PCS R2700, R301
1240 7091300 Chip Thick Film
Resistor-0.05W-6040ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
3.0 PCS R302, R303, R304
1250 7091298 Chip Thick Film
Resistor-0.05W-4700ohm-+/-1
%-0201-Terminal
Dedicated-Terminal Dedicated
9.0 PCS R1104, R2113, R2140,
R3011, R3014, R3198,
R3199, R400, R5661
1260 7091150 Chip Thick Film
Resistor-0.05W-22ohm-+/-5%-
0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS R405
1270 7091161 Chip Thick Film
Resistor-0.05W-2000ohm-+/-5
%-0201-Terminal
Dedicated-Terminal Dedicated
4.0 PCS R1812, R1813, R406, R407
1280 7091172 Chip Thick Film
Resistor-0.05W-22000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
14.0 PCS R2603, R2604, R500, R501,
R502, R503, R504, R505,
R506, R507, R508, R509,
R510, R511
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 36 of 187
No. Part Number Name Quantity Position
1290 7092051 Chip Thick Film
Resistor-0.05W-240ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated
5.0 PCS R2602, R512, R513, R514,
R515
1300 7091159 Chip Thick Film
Resistor-0.05W-1000ohm-+/-5
%-0201-ELOM,TS16949
26.0 PCS R1311, R2141, R2142,
R2143, R2401, R2510,
R2511, R2521, R2706,
R2707, R2708, R2710,
R2720, R2722, R2733,
R2734, R2909, R3802,
R4107, R4108, R4109,
R4110, R516, R517, R518,
R519
1310 7091408 Chip Thick Film
Resistor-0.05W-68000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS R1008, R900
1320 7090875 Chip Thick Film
Resistor-0.0625W-100000ohm-
+/-1%-0402
1.0 PCS R901
1330 7092053 Chip Thick Film
Resistor-0.05W-1000000ohm-
+/-1%-0.6mm*0.3mm*0.23mm
-Terminal Dedicated-Terminal
Dedicated
1.0 PCS R902
1340 7090823 Chip Thick Film
Resistor-0.0625W-180000ohm-
+/-1%-0402
1.0 PCS R903
1350 7091256 Chip Thick Film
Resistor-0.05W-33ohm-+/-5%-
0201-Terminal
Dedicated-Terminal Dedicated
3.0 PCS R5626, R907, R908
1360 7091246 Chip Thick Film
Resistor-0.05W-100000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated
12.0 PCS R1000, R1101, R1633,
R1637, R1929, R1933,
R1935, R2138, R2264,
R2933, R3201, R3230
1370 7091405 Chip Thick Film
Resistor-0.05W-56000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
3.0 PCS R1001, R1002, R3901
1380 7091016 Chip Thick Film
Resistor-0.05W-7320ohm-+/-1
%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R1004
1390 7091169 Chip Thick Film
Resistor-0.05W-10000ohm-+/-
18.0 PCS R1010, R1011, R1514,
R1639, R1640, R1808,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 37 of 187
No. Part Number Name Quantity Position
5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
R1809, R1910, R2012,
R2514, R2926, R3104,
R3121, R3132, R3195,
R3197, R3902, R5647
1400 7091301 Chip Thick Film
Resistor-0.05W-10000ohm-+/-
1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
11.0 PCS R1103, R1939, R1940,
R2112, R2605, R2732,
R2747, R2904, R2905,
R2910, R3008
1410 7091175 Chip Thick Film
Resistor-0.05W-100000ohm-+/
-5%-0201-Terminal
Dedicated-Terminal Dedicated
6.0 PCS R1226, R1231, R1505,
R1512, R1901, R1947
1420 7091380 Chip Thick Film
Resistor-0.0625W-39200ohm-
+/-1%-0402
1.0 PCS R1232
1430 7090858 Chip Thick Film
Resistor-0.0625W-2000000oh
m-+/-1%-0402
1.0 PCS R1302
1440 7091783 Chip Thick Film
Resistor-0.2W-0.01ohm-+/-1%
-0603
1.0 PCS R1303
1450 7091155 Chip Thick Film
Resistor-0.05W-100ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated
5.0 PCS R1309, R1310, R2418,
R2419, R2902
1460 7090796 Chip Thick Film
Resistor-0.0625W-18000ohm-
+/-5%-0402
1.0 PCS R1312
1470 7091162 Chip Thick Film
Resistor-0.05W-2200ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS R1501
1480 7091393 Chip Thick Film
Resistor-0.0625W-301000ohm-
+/-1%-0402
1.0 PCS R1603
1490 7091389 Chip Thick Film
Resistor-0.0625W-91000ohm-
+/-1%-0402
1.0 PCS R1604
1500 7091395 Chip Thick Film
Resistor-0.0625W-392000ohm-
+/-1%-0402
1.0 PCS R1611
1510 7091148 Chip Thick Film
Resistor-0.05W-10ohm-+/-5%-
2.0 PCS R1638, R3801
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 38 of 187
No. Part Number Name Quantity Position
0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1520 7092272 Chip Thick Film
Resistor-0.05W-180ohm-1%-0
201(0.6*0.3*0.23mm)-Termina
l Dedicated
1.0 PCS R1907
1530 7091174 Chip Thick Film
Resistor-0.05W-51000ohm-+/-
5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS R2005
1540 7090867 Chip Thick Film
Resistor-0.0625W-10000ohm-
+/-1%-0402-BT
1.0 PCS R2013
1550 7091153 Chip Thick Film
Resistor-0.05W-51ohm-+/-5%-
0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
5.0 PCS R2240, R2241, R2242,
R4007, R5401
1560 7091350 Chip Thick Film
Resistor-0.0625W-1500ohm-+/
-1%-0402-BT
1.0 PCS R2266
1570 7091378 Chip Thick Film
Resistor-0.0625W-27400ohm-
+/-1%-0402
1.0 PCS R2267
1580 7090798 Chip Thick Film
Resistor-0.0625W-22000ohm-
+/-1%-0402
2.0 PCS R2508, R3203
1590 7091409 Chip Thick Film
Resistor-0.05W-150000ohm-+/
-5%-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS R2520, R4105
1600 7090857 Chip Thick Film
Resistor-0.0625W-1000000oh
m-+/-1%-0402
2.0 PCS R2900, R3109
1610 7091250 Chip Thick Film
Resistor-0.05W-12000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R2903
1620 7091302 Chip Thick Film
Resistor-0.05W-51000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R2922
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 39 of 187
No. Part Number Name Quantity Position
1630 7091176 Chip Thick Film
Resistor-0.05W-121000ohm-+/
-1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS R2923
1640 7091177 Chip Thick Film
Resistor-0.05W-180000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R2934
1650 7091384 Chip Thick Film
Resistor-0.0625W-51000ohm-
+/-1%-0402
1.0 PCS R3128
1660 7090892 Chip Thick Film
Resistor-0.0625W-30000ohm-
+/-1%-0402
2.0 PCS R3129, R3202
1670 7091152 Chip Thick Film
Resistor-0.05W-47ohm-+/-5%-
0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R4004
1680 7091253 Chip Thick Film
Resistor-0.05W-120ohm-+/-5%
-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS R4005, R4006
1690 7091158 Chip Thick Film
Resistor-0.05W-390ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R4101
1700 8070749 SMD Ceramic
Capacitor-25V-0.0047nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R5513
1710 7050106 NTC-220000ohm-NTC-0402-1
.0*0.5*0.5mm-Terminal
Dedicated
1.0 PCS RT1801
1720 7050063 NTC-150000ohm-SMT-0402-
Terminal Dedicated
2.0 PCS RT2501, RT4101
1730 7040075 Varistor-18V-14V-10A-40V-S
MT-0402-Terminal Dedicated
1.0 PCS RV1900
1740 16100067 Tact
Switch,SPDT,DC,SMT,0.4mm,
5.65*3.5*0.9,5000,Terminal
Dedicated
1.0 PCS S2101
1750 10100527 Terminal Common Mode 8.0 PCS T1801, T1802, T1803,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 40 of 187
No. Part Number Name Quantity Position
Inductor,28ohm,+/-20%,5V,0.1
A,
2.5ohm,03025,0.85*0.65*0.45(
mm),TAIYO YUDEN
12ohm@100M;TDK
35ohm@100M,Terminal
Dedicated
T1804, T1805, T1806,
T1807, T1808
1760 10100331 Terminal Common Mode
Inductor,40ohm,+/-25%,5V,0.1
A,1.625ohm,1.25*1.0*0.5(mm)
,Terminal Dedicated
1.0 PCS T1901
1770 10100564 Terminal Com-mode
Inductor,45ohm,+/-25%,5V,0.1
A,2.5ohm,0504,1.25mm*1.0m
m*0.65mm,USB D+/D-
Application
1.0 PCS T1902
1780 12070055 Temperature Compensated
Oscillator,19.2MHz,+/-2.5ppm,
2.8V,+/-2.0ppm,-30degC,85de
gC,Terminal Dedicated
1.0 PCS TCXO100
1790 12070038 Temperature Compensated
Oscillator,26MHz,+/-1.5ppm(
max),+1.8V,+/-0.5ppm(max),-4
0degC,85degC,Terminal
Dedicated
2.0 PCS TCXO1001, TCXO5601
1800 35020171 Consumption
Chip,Hi3620GFCV111G15,FC
CSP
576,1.1/1.2/1.8/2.6/3.3V,Appli
cation processor
1.0 PCS U300
1810 40020168 DDR2 DRAM-16Gb
LPDDR2-533MHz-32bit-1.8V/
1.2V-216BALL
FBGA(POP)-Terminal
Dedicated
1.0 PCS U300_POP
1820 39110780 Switching Regulators-DC/DC
buck for
GPU-2.5V-5.5V-4000mA-2.5
MHz-CSP16-Terminal
Dedicated
1.0 PCS U800
1830 35020158 Consumer
Chips-Hi6421GFCV231-FCCS
P189-1.8/3.3/4.2V-K3 PMU
and Codec chip
1.0 PCS U900
1840 40060418 MCP-32GB(32Gbx8)
EMMC-52MHz-3.3/1.8V-FBG
A169-1Gb(32Mbx32)
1.0 PCS U1102
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 41 of 187
No. Part Number Name Quantity Position
LPDDR-Terminal Dedicated
1850 38020077 Analog Switch,one input one
output Load
switch,1.1V~3.6V-1.8Vinput,<
55mohm;1.2Vinput,<90mohm,
WLCSP4,Terminal Dedicated
2.0 PCS U1103, U3203
1860 39080180 Operation Amplifier,Audio
Power
Amplifier,2.5V~5.5V,Differenc
ial,Micro SMD
16pin(WLCSP),Terminal
Dedicated
1.0 PCS U1201
1870 39070073 -0.3~2.75V,Battery
Gauge,SON,Terminal
Dedicated
1.0 PCS U1301
1880 39080124 Operation
Amplifier,Headphone Audio
Power Amplifier,2.3 V to 5.5
V,differential AB
Amplifier,QFN,Terminal
Dedicated
1.0 PCS U1501
1890 39110626 Switching
Regulators-Vin~38V-0.02A-Q
FN-2*2-SMT-2*2-10 LED
Driver, Terminal Dedicated
1.0 PCS U1600
1900 39110636 Switching
Regulators-ThinQFN-LCD
Driver-Terminal Dedicated
1.0 PCS U1601
1910 39110620 Power Driver,1.5A LED flash
driver IC,CSP,Terminal
Dedicated
1.0 PCS U1800
1920 39070149 Battery Management IC-charge
IC-buck-3A input
ability-3.9V-6.5V-QFN-24-OT
G-Terminal Dedicated
1.0 PCS U1901
1930 38020071 Analog Switch,double-pole,
triple throw (DP3T)
multiplexer,2.5V-4.5V,<6.6oh
m,1470MHz,QFN12,Terminal
Dedicated
1.0 PCS U1905
1940 33030026 Temperature
Sensor,-40~+125degC,1.4V~2.
75V,Digital
Output,+/-1degC,DFN,60000us
,NA,12bit,IIC,Terminal
Dedicated
1.0 PCS U2001
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 42 of 187
No. Part Number Name Quantity Position
1950 38140103 Semiconductor Sensor,three
axis
gyroscope,LGA-16,Terminal
Dedicated
1.0 PCS U2003
1960 38140098 Semiconductor
Sensor,Accelerometer,LGA,3a
xis,Terminal Dedicated
1.0 PCS U2004
1970 38140069 Semiconductor
Sensor,E-Compass,WLCSP(Pb
-free),3axis,Terminal
Dedicated
1.0 PCS U2005
1980 38020072 Bi-directional,4PDT,
1.65-4.3V ,Rond(max)<12ohm
;Ronv<0.7ohm-160MHz-UML
P, Terminal Dedicated
1.0 PCS U2101
1990 36020419 CMOS,Dual
Reverse,QFN,33.6ns,20mA,C
MOS,CMOS, Terminal
Dedicated
1.0 PCS U2103
2000 39080185 Operation Amplifier, Linear
Motor
Driver,2.5~5.5V,Differential, 9
Ball 0.5mm Pitch
WCSP,Terminal Dedicated
1.0 PCS U2203
2010 35020149 Consumption
Chip,Hi6920GFCV100,FBGA
520,1.1/1.8/2.5,LTE,WCDMA/
GSM
1.0 PCS U2501
2020 35020150 Chip,Hi6451GBCV110,BGA1
04,5V,Power management unit
1.0 PCS U2900
2030 39110756 Switching Regulators,DC/DC
buck,2.5V~5.5V,Voadj,1.2A,D
FN/QFN
3.0 PCS U2901, U3105, U3201
2040 43110067 AUDIO Chip,2 digital
microphones/4 Digital Audio
Ports (PCM/I2S)/Voice
equalization,BGA32, Terminal
Dedicated
1.0 PCS U3000
2050 43090148 VIDEO Chip,49
VFBGA,1.2V/1.8V/3.3V,HDM
I&USB 2in1,1080p/60Hz,
Terminal Dedicated
1.0 PCS U3101
2060 39110548 LDO-3.3V-2%-0.15A-SC70-5-
Terminal Dedicated-Terminal
Dedicated
1.0 PCS U3104
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 43 of 187
No. Part Number Name Quantity Position
2070 35020147 Consumer-Hi6360RBCV210-V
FBGA-2.2V/1.8V/1.2V-2G/3G
/4G multi mode multi band RF
Transceiver
1.0 PCS U3901
2080 47140042 0.5~3GHz,SPDT,0.46,22,TSS
ON,Terminal Dedicated
2.0 PCS U3902, U3905
2090 47140068 RF
Switch,400~3000MHz,DPDT,0
.25~0.7dB,1.5:1,26dB,QFN,10
00V
2.0 PCS U3903, U4302
2100 47100500 RF Power Amplifying
Module,1920MHz~1980MHz,2
9.5dB
max.,28.25dBm,QFN,Terminal
Dedicated
2.0 PCS U4001, U4201
2110 47100375 RF Power Amplifying
Module,1850~1910,28,27.5dB
m,QFN,1000v
1.0 PCS U4002
2120 13080130 Duplexer,RX:1930-1990MHz/
TX:1850-1910MHz,2.7dB.,3.3
dB.,-45dB.,2520,Terminal
Dedicated
1.0 PCS U4003
2130 47100387 RF Power Amplifying
Module,880MHz~915MHz,28/
18/11,QFN,1000V
1.0 PCS U4004
2140 13080104 Duplexer,TX:880MHz~915M
Hz/RX:925MHz~960MHz,3dB
.,3dB.,55dB/50dB.,2520,Termi
nal Dedicated
1.0 PCS U4005
2150 13080038 Duplexer,RX:2110~2170MHz/
TX:1920~1980MHz,1.9dB(ma
x),2.6dB(max),55dB/46dB(min
),2.5*2.0*0.9mm, Terminal
Dedicated
1.0 PCS U4006
2160 47140112 RF
Switch,700M~2700MHz,SP14
T,0.5dB(900MHz)/0.8dB(2100
MHz)/1.0dB(2700MHz),25dB.,
LGA,Terminal Dedicated
1.0 PCS U4101
2170 47100348 RF Power Amplifying
Module,824MHz~849MHz/88
0MHz~915MHz/1710MHz~17
85MHz/1850MHz~1910MHz,3
3.5,35dBm,LGA
1.0 PCS U4102
2180 47100449 RF Power Amplifying 1.0 PCS U4203
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 44 of 187
No. Part Number Name Quantity Position
Module,2570MHz~2620MHz,2
8dB,28dBm,QFN,500V
2190 47100380 Power
Module,2300-2400MHz,28dB,
28dBm,QFN,1000V,Terminal
Dedicated
1.0 PCS U4204
2200 47140045 RF
Switch-0.5~2.5GHz-SP4T-0.95
-15dB.-QFN
1.0 PCS U4301
2210 47100305 Power Module,
824MHz~849MHz,27dB,28.5d
Bm,QFN,2000V,Terminal
Dedicated
1.0 PCS U4401
2220 47100353 RF Power Amplifying
Module,2500-2570MHz,28,31d
Bm,QFN,1000V
1.0 PCS U4402
2230 13080037 Duplexer,TX:824~849MHz;R
X:869~894MHz,1.7dB(typ),2.0
dB(typ),60dB/53dB(typ),2520,
Terminal Dedicated,TS16949
1.0 PCS U4403
2240 13080162 Duplexer,TX:2500-2570MHz/
RX:2620-2690MHz,2.5dB.,2.5
dB.,-50dB.,-2016.,Terminal
Dedicated-Unbalance-FBAR
1.0 PCS U4404
2250 47140111 RF
Switch-700~2700MHz-DP6T-0
.55dB max.-1.43
max.-19dB.-QFN-Terminal
Dedicated
1.0 PCS U4405
2260 47990023 Balun,50:100Balun,2300MHz~
2700MHz,50:100,1.2,0.5,1608
SMD,Terminal Dedicated
1.0 PCS U4406
2270 47140113 RF
Switch-100~3500MHz-SP3T-0
.65dB max. at
2400~2500MHz-1.29 at
2450MHz-32dB.-QFN-Termin
al Dedicated
2.0 PCS U5401, U5504
2280 47140114 RF
Switch-20~6000MHz-SPDT-0.
65dB
max.-1.43-22dB.-QFN-Termin
al Dedicated
1.0 PCS U5501
2290 47090053 RF LNA,1575MHz,14dB
min.,1.6dB
1.0 PCS U5503
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 45 of 187
No. Part Number Name Quantity Position
max.,SOT886,Terminal
Dedicated
2300 39210059 Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949
1.0 PCS U5603
2310 12020125 Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949
1.0 PCS X1000
2320 15040385 Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN16-Terminal Dedicated
1.0 PCS Z1601
2330 15040384 Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN10-Terminal Dedicated
1.0 PCS Z1602
2340 13010212 SAW
Filter,1842.5MHz,1.6dB(typ),5
0V,SFLT5-0101,Terminal
Dedicated
1.0 PCS Z4101
2350 13010329 SAW
Filter,2595MHz,2.3dB,1411,Te
rminal Dedicated
1.0 PCS Z4201
2360 13030037 Ceramics
Filter,1900MHz/2017.5MHz,0.
71dB,1608,Terminal Dedicated
1.0 PCS Z4202
2370 13010292 SAW
Filter-1900MHz/2017.5MHz-2.
3dB/2.6dB-1511-Terminal
Dedicated
1.0 PCS Z4203
2380 13010319 SAW
Filter,2340MHz,2.7dB,2016,Te
rminal Dedicated, FBAR
1.0 PCS Z4204
2390 13010315 SAW
Filter-2350MHz-3.8dB-1411
2.0 PCS Z4205, Z4302
2400 13010327 SAW
Filter-2595MHz-3.8dB-1411-T
erminal Dedicated
2.0 PCS Z4210, Z4304
2410 13010137 SAW
Filter-1900MHz-2.0dB(Max)-1
411-Terminal
Dedicated-Terminal Dedicated
1.0 PCS Z4301
2420 13010271 SAW
Filter-2655MHz-3.8dB-1411-T
1.0 PCS Z4303
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 46 of 187
No. Part Number Name Quantity Position
erminal Dedicated
2430 13010274 SAW
Filter-2437MHz-3.5-500V-201
6-
2.0 PCS Z5401, Z5505
2440 13080106 Duplexer,1565~1607MHz/240
0~2500MHz,0.8dB./0.9dB.,13d
B./18dB,1608,Terminal
Dedicated
1.0 PCS Z5501
2450 13010264 SAW
Filter-1590.16MHz-1.8dB-50V
-1411-Terminal Dedicated
2.0 PCS Z5502, Z5503
2460 13030061 Ceramic
Filter,5375MHz,1.7dB,SMD 1.0 PCS Z5504
2470 8071219 SMD Ceramic
Capacitor-10V-100nF-+/-10%-
X5R-0201-Terminal Dedicated
2.0 PCS C1246, C300
2480 05020XTY Board
Software,HWD2-5000M,HWD
2-5000M01A,D2-5000
Handset
Software,Program,CMCC(Chin
a,K3V2,BALONG V7R1)
1.0 PCS -
2490 10100017 Terminal EMI
beads-470ohm-+/-25%-0.5A-0.
21ohm-0603-BT,TS16949-Ter
minal Dedicated
2.0 PCS LB1202, LB1204
2500 8070698 SMD Ceramic
Capacitor-16V-3.3nF-+/-10%-
X7R-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS C1241, C1247
U9800D:
No. Part Number Name Quantity Position
-1 03021YXM Manufactured
Board,D2-5000,HL1D25000M,
Ascend D2 Handset Main
Board,Terminal used,2*2
- -
10 03010TAB Manufactured
Board,D2-5000,HL1D25000M,
Ascend D2 Handset Main
Board,Terminal used,2*2
1.0 PCS -
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 47 of 187
No. Part Number Name Quantity Position
20 8071128 SMD Ceramic
Capacitor-6.3V-1000nF-+/-20
%-X5R-0201-Terminal
Dedicated
92.0 PCS C1004, C1005, C1026,
C1416, C2261, C2800,
C2802, C2803, C2833,
C3808, C500, C501, C502,
C503, C504, C505, C506,
C507, C508, C509, C510,
C511, C5620, C5621, C5622,
C5623, C5624, C5625,
C5626, C605, C606, C607,
C608, C609, C612, C614,
C615, C616, C617, C618,
C619, C620, C621, C622,
C623, C624, C625, C626,
C627, C628, C629, C630,
C633, C645, C650, C651,
C652, C653, C655, C656,
C657, C658, C659, C660,
C661, C662, C663, C665,
C666, C669, C670, C686,
C687, C707, C708, C709,
C710, C711, C712, C713,
C714, C715, C723, C724,
C725, C726, C727, C734,
C735, C738, C739, C740
30 8070667 SMD Ceramic
Capacitor-6.3V-2200nF-+/-20
%-X5R-0402-TS16949
70.0 PCS C1001, C1002, C1003,
C1132, C1505, C1526,
C1527, C1814, C1816,
C1818, C2000, C2001,
C2500, C2808, C2809,
C2810, C2811, C2812,
C2813, C2900, C2901,
C2902, C2903, C2905,
C2906, C3101, C3102,
C3116, C3197, C3915,
C3916, C4093, C4095,
C4235, C4236, C600, C602,
C603, C647, C648, C664,
C685, C688, C700, C701,
C733, C901, C902, C903,
C904, C905, C906, C907,
C908, C909, C911, C912,
C913, C914, C915, C916,
C917, C918, C919, C920,
C921, C922, C923, C924,
C925
40 8070783 SMD Ceramic
Capacitor-6.3V-22000nF-+/-20
%-X5R-0603-Terminal
Dedicated
31.0 PCS C1118, C1119, C1238,
C1908, C1910, C2908,
C2909, C2910, C2948,
C3121, C3202, C4106,
C4125, C601, C636, C642,
C643, C644, C649, C802,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 48 of 187
No. Part Number Name Quantity Position
C803, C939, C940, C941,
C942, C944, C946, C948,
C950, C952, C959
50 8070819 SMD Ceramic
Capacitor-6.3V-4700nF-+/-20
%-X5R-0402-Terminal
Dedicated-Terminal Dedicated
26.0 PCS C1513, C1514, C1515,
C1516, C1611, C1811,
C2012, C2260, C2924,
C2925, C2926, C2950,
C5639, C5640, C604, C610,
C611, C613, C667, C668,
C683, C684, C728, C736,
C737, C910
60 8070692 SMD Ceramic
Capacitor-10V-10nF-+/-10%-X
5R-0201-TS16949
16.0 PCS C2503, C2930, C2931,
C2932, C2944, C3003,
C3004, C3005, C3122,
C3802, C5646, C632, C635,
C638, C646, C947
70 8070704 SMD Ceramic
Capacitor-6.3V-100nF-+/-10%-
X5R-0201-TS16949
156.0 PCS C1021, C1023, C1105,
C1106, C1110, C1111,
C1112, C1113, C1133,
C1236, C1307, C1309,
C1310, C1311, C1312,
C1315, C1319, C1406,
C1407, C1418, C1501,
C1502, C1506, C1602,
C1603, C1633, C1635,
C1636, C1805, C1806,
C1808, C1809, C1815,
C1817, C1819, C1821,
C1822, C1824, C1827,
C1920, C2002, C2003,
C2004, C2005, C2006,
C2015, C2016, C2021,
C2143, C2144, C2145,
C2146, C2216, C2217,
C2241, C2242, C2243,
C2262, C2266, C2401,
C2402, C2419, C2420,
C2421, C2501, C2502,
C2510, C2605, C2814,
C2815, C2816, C2817,
C2818, C2819, C2820,
C2821, C2822, C2823,
C2824, C2825, C2826,
C2827, C2828, C2829,
C2830, C2831, C2832,
C2834, C2835, C2836,
C2838, C2839, C2840,
C2907, C2951, C3105,
C3106, C3107, C3108,
C3110, C3111, C3112,
C3113, C3114, C3115,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 49 of 187
No. Part Number Name Quantity Position
C3189, C3905, C4115,
C4123, C4327, C4436,
C5503, C5504, C5605,
C5606, C5607, C5610,
C5611, C5613, C5614,
C5615, C5616, C5632,
C5642, C5643, C634, C639,
C641, C654, C689, C690,
C691, C702, C703, C704,
C705, C706, C716, C717,
C718, C719, C720, C721,
C722, C729, C730, C731,
C732, C800, C801, C804,
C926, C927, C928, C929,
C933
80 8070449 SMD Ceramic
Capacitor-16V-10nF-+/-10%-X
7R-0402-BT,TS16949
1.0 PCS C637
90 8070676 SMD Ceramic
Capacitor-25V-0.01nF-+/-5%-
NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
12.0 PCS C1503, C5505, C5506,
C5507, C5515, C5516,
C5520, C5526, C5527,
C5528, C640, C934
100 8070564 SMD Ceramic
Capacitor-6.3V-4700nF-+/-20
%-X5R-0603-BT,TS16949
1.0 PCS C930
110 8070612 SMD Ceramic
Capacitor-10V-1000nF-+/-10%
-X5R-0402-BT,TS16949
11.0 PCS C1303, C1904, C1905,
C1909, C3000, C3001,
C3002, C935, C936, C937,
C938
120 8070649 SMD Ceramic
Capacitor-6.3V-10000nF-+/-20
%-X5R-0603-BT,TS16949
18.0 PCS C1124, C1125, C1632,
C1823, C1903, C2934,
C2936, C2945, C3103,
C3118, C3201, C5635,
C5636, C5637, C5648,
C5649, C949, C951
130 8070703 SMD Ceramic
Capacitor-25V-1nF-+/-10%-X7
R-0201-TS16949
17.0 PCS C1024, C1104, C1134,
C1301, C2801, C2804,
C2805, C2806, C2807,
C2911, C3804, C3805,
C3806, C3901, C4103,
C5502, C958
140 8070695 SMD Ceramic
Capacitor-25V-0.022nF-+/-5%-
NP0-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
12.0 PCS C1010, C1011, C3909,
C3910, C3912, C3913,
C3914, C3917, C3918,
C3919, C3920, L4004
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 50 of 187
No. Part Number Name Quantity Position
150 8070720 SMD Ceramic
Capacitor-6.3V-1000nF-+/-10
%-X5R-0402-Terminal
Dedicated,TS16949-Terminal
Dedicated
21.0 PCS C1020, C1025, C1114,
C1528, C1529, C1616,
C1820, C1825, C1826,
C2913, C2914, C2915,
C2916, C2917, C2918,
C2920, C2922, C2923,
C2949, C3117, C5647
160 8070531 SMD Ceramic
Capacitor-50V-1nF-+/-10%-X7
R-0402-BT
1.0 PCS C1022
170 8070752 SMD Ceramic
Capacitor-6.3V-220nF-+/-20%-
X5R-0201-Terminal Dedicated
3.0 PCS C1103, C1601, C5601
180 8070625 SMD Ceramic
Capacitor-6.3V-470nF-+/-10%-
X5R-0402
3.0 PCS C1131, C1308, C2103
190 8070817 SMD Ceramic
Capacitor-6.3V-47nF-+/-10%-
X5R-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C1234, C1245
200 8071388 SMD Ceramic
Capacitor-10V-22000nF-+/-20
%-X5R-0805(2.0*1.25*0.95m
m)-Terminal Dedicated
1.0 PCS C1237
210 8070696 SMD Ceramic
Capacitor-25V-0.1nF-+/-5%-N
PO-0201-TS16949
19.0 PCS C1243, C1313, C1907,
C3911, C4001, C4003,
C4011, C4012, C4028,
C4029, C4204, C4205,
C4218, C4406, C4407,
C4415, C4419, C5511,
L4205
220 8070716 SMD Ceramic
Capacitor-6.3V-33nF-+/-10%-
X5R-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C1306, C3803
230 8070760 SMD Ceramic
Capacitor-25V-0.047nF-+/-5%-
NPO-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C1314, C1504
240 8020142 Solid SMD Tantalum
Capacitor-6.3V-47uF-+/-20%-0
805-2.0*1.25*1.0mm-200moh
m-Terminal Dedicated
1.0 PCS C1316
250 8070689 SMD Ceramic
Capacitor-25V-0.033nF-+/-5%-
NPO-0201-Terminal
123.0 PCS C1412, C1413, C1414,
C1417, C1508, C1509,
C1531, C1604, C1605,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 51 of 187
No. Part Number Name Quantity Position
Dedicated,TS16949-Terminal
Dedicated
C1606, C1620, C1621,
C1623, C2022, C2023,
C2024, C2025, C2028,
C2029, C2106, C2122,
C2124, C2142, C2201,
C2202, C2203, C2205,
C2206, C2207, C2208,
C2209, C2210, C2211,
C2212, C2213, C2214,
C2244, C2245, C2246,
C2265, C2403, C2405,
C2406, C2407, C2408,
C2409, C2411, C2412,
C2413, C2414, C2415,
C2416, C2417, C2418,
C2927, C2943, C3807,
C3925, C3926, C3927,
C3951, C4004, C4006,
C4007, C4008, C4025,
C4026, C4027, C4039,
C4072, C4089, C4094,
C4096, C4097, C4107,
C4108, C4110, C4111,
C4112, C4113, C4114,
C4116, C4117, C4118,
C4119, C4120, C4121,
C4127, C4128, C4129,
C4130, C4135, C4304,
C4305, C4306, C4307,
C4309, C4322, C4328,
C4331, C4332, C4333,
C4334, C4335, C4336,
C4342, C4401, C4402,
C4403, C4404, C4410,
C4413, C4414, C4417,
C4425, C4426, C4433,
C4434, C4437, C4438,
C5523, L4010, L4011
260 8070450 SMD Ceramic
Capacitor-50V-0.1nF-+/-5%-N
PO-0402-BT
1.0 PCS C1525
270 8070713 SMD Ceramic
Capacitor-6.3V-22nF-+/-10%-
X5R-0201
1.0 PCS C1530
280 8070735 SMD Ceramic
Capacitor-50V-1000nF-+/-10%
-X5R-0805-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C1610
290 8070780 SMD Ceramic
Capacitor-10V-10000nF-+/-10
3.0 PCS C1628, C1629, C1812
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 52 of 187
No. Part Number Name Quantity Position
%-X5R-0805-Terminal
Dedicated-Terminal Dedicated
300 8070547 SMD Ceramic
Capacitor-50V-0.033nF-+/-5%-
NP0-0402-BT
1.0 PCS C1634
310 8070789 SMD Ceramic
Capacitor-25V-0.0056nF-+/-0.
1pF-NPO-0201-Terminal
Dedicated
22.0 PCS C1801, C1802, C1803,
C1804, C1807, C1810,
C1846, C1847, C1848,
C1849, C1850, C1851,
C1852, C1853, C1864,
C1865, C1866, C1867,
C1868, C1869, C1872,
C1873
320 8070583 SMD Ceramic
Capacitor-10V-47nF-+/-10%-X
7R-0402
1.0 PCS C1901
330 8070785 SMD Ceramic
Capacitor-10V-4700nF-+/-10%
-X5R-0603-Terminal
Dedicated-Terminal Dedicated
3.0 PCS C1906, C2837, C2933
340 8071463 SMD Ceramic
Capacitor-16V-2200nF-+/-20%
-X5R-0402(1.0*0.5*0.6mm)-H
max=0.6mm-Terminal
Dedicated
1.0 PCS C1911
350 8070970 SMD Ceramic
Capacitor-50V-10nF-10%-X7R
-0402-Terminal Dedicated
1.0 PCS C2011
360 8070711 SMD Ceramic
Capacitor-16V-2.2nF-+/-10%-
X7R-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C2504
370 8070966 SMD Ceramic
Capacitor-4V-470nF-+/-20%-X
5R-0201-Terminal Dedicated
5.0 PCS C3906, C3907, C3908,
C3921, C3922
380 10100110 Mobile Dedicated,Chip
Inductor-0.0027uH-+/-0.3nH-0.
2A-0.25ohm-201
1.0 PCS C4030
390 10100104 Mobile Dedicated,Chip
Inductor,
0.0012uH,+/-0.3nH,0.25A,0.14
ohm,0201,Chip
Inductor,Mobile Dedicated
1.0 PCS C4038
400 10100124 Mobile Dedicated,Chip
Inductor-0.01uH-+/-5%-0.15A-
3.0 PCS C4070, L4404, L4405
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 53 of 187
No. Part Number Name Quantity Position
0.63ohm-201-TS16949-Termin
al Dedicated
410 8070747 SMD Ceramic
Capacitor-25V-0.0033nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated
1.0 PCS C4079
420 10100125 Mobile Dedicated,Chip
Inductor-0.012uH-+/-5%-0.1A-
0.7ohm-201-TS16949-Termina
l Dedicated
2.0 PCS C4092, C4412
430 10100103 Mobile Dedicated,Chip
Inductor-0.001uH-+/-0.3nH-0.2
5A-0.14ohm-201-TS16949-Ter
minal Dedicated
1.0 PCS C4105
440 8070740 SMD Ceramic
Capacitor-25V-0.0005nF-+/-0.
1pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS C4102, L4007
450 10100118 Mobile Dedicated,Chip
Inductor-0.0056uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated
1.0 PCS C4104
460 8070707 SMD Ceramic
Capacitor-25V-0.68nF-+/-10%-
X7R-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C4109
470 8070743 SMD Ceramic
Capacitor-25V-0.0015nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS C4301, L5401
480 10100117 Mobile Dedicated,Chip
Inductor-0.0051uH-+/-0.3nH-0.
15A-0.4ohm-201
4.0 PCS C4325, L4023, L4311,
L4406
490 10100116 Mobile Dedicated,Chip
Inductor-0.0047uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated
2.0 PCS C4337, L5506
500 8070753 SMD Ceramic
Capacitor-25V-0.0082nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated
2.0 PCS C4408, C4422
510 10100115 Mobile Dedicated,Chip
Inductor-0.0043uH-+/-0.3nH-0.
1.0 PCS C4439
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 54 of 187
No. Part Number Name Quantity Position
15A-0.4ohm-201
520 8070950 SMD Ceramic
Capacitor-25V-0.018nF-+/-5%-
C0G-0.6mm*0.3mm*0.3mm-T
erminal Dedicated
6.0 PCS C5402, C5403, C5404,
C5512, C5522, C5529
530 8070754 SMD Ceramic
Capacitor-25V-0.039nF-+/-5%-
NPO-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C5501
540 7090911 Chip Thick Film
Resistor-0.05W-0ohm-< 50m
ohm-0201-ELOM,TS16949
87.0 PCS C5530, R1007, R1013,
R1014, R1223, R1301,
R1313, R1314, R1402,
R1403, R1408, R1409,
R1502, R1622, R1811,
R1814, R1817, R1821,
R1823, R1825, R1828,
R1830, R1831, R1832,
R1932, R1934, R1937,
R2002, R2003, R2006,
R2014, R2015, R2016,
R2017, R2018, R2131,
R2409, R2516, R2518,
R2519, R2742, R2743,
R2744, R2745, R2804,
R2805, R2906, R2911,
R2912, R2913, R2914,
R2915, R2916, R2917,
R2918, R3003, R3009,
R3010, R3012, R3013,
R3018, R306, R3113, R3126,
R3130, R3131, R4202,
R4205, R4206, R4301, R524,
R525, R5402, R5403, R5501,
R5507, R5508, R5514,
R5609, R5621, R5629,
R5642, R5650, R5651,
R5655, R5657, R911
550 8070700 SMD Ceramic
Capacitor-25V-0.068nF-+/-5%-
NP0-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C5603
560 8070751 SMD Ceramic
Capacitor-25V-0.027nF-+/-5%-
NPO-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C5619
570 8070741 SMD Ceramic
Capacitor-25V-0.001nF-+/-0.2
5pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C5641, L4003
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 55 of 187
No. Part Number Name Quantity Position
580 15040311 Transient Suppression
Diode-6V-12V-50W-5A-SOD9
23-Terminal Dedicated
3.0 PCS D1301, D1302, D1903
590 15040339 Transient Suppression
Diode-6V-12V-30W-3A-0201-
Terminal Dedicated
11.0 PCS D1406, D1601, D1602,
D2101, D2102, D2104,
D2201, D2202, D2240,
D2241, D2242
600 15010262 Switching
Diode-75V-200mA-1V-SOD-5
23
1.0 PCS D1600
610 15010248 Schottky
diode-30V-0.2A-0.5V-SOD-52
3-1A
1.0 PCS D2901
620 15010365 Schottky
Diode,30V,0.3A,0.3V,SOD882
,Automotive Grade,Terminal
Dedicated
1.0 PCS D2902
630 19040169 Protection Tube,Fast Blowout
Fuse,24V,3A,IEC
Spec,0.03ohm,0.100
A*A*Sec,UL,Terminal
Dedicated
1.0 PCS F1900
640 51623884 BOT-SHIELD-COVER-3-YD-
T9800L
1.0 PCS F2401
650 51623897 BOT-SHIELD-COVER-1-YD-
T9800L
1.0 PCS F2402
660 51623898 BOT-SHIELD-COVER-2-YD-
T9800L
1.0 PCS F2403
670 51623900 Sim-rail2-T9800L 1.0 PCS F2405
680 51623877 BOT-SHIEDLING-FRAME-2-
YD-T9800L
1.0 PCS F2406
690 51623899 TOP-SHIELD
FRAME-1-YD-T9800L
1.0 PCS F2407
700 51623879 B-Camera-nut-C9800D 1.0 PCS F2408
710 51623883 PCB-Steel-C9800D 1.0 PCS F2409
720 14240576 Card Block Connector,BTF
Connector,3*2,Female,1.3mm,
Terminal Dedicated
2.0 PCS J1301, J1900
730 14240375 BTB
Connector,female,40Pin,0.4m
m,0.8mm,SMT,Terminal
Dedicated
1.0 PCS J1601
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 56 of 187
No. Part Number Name Quantity Position
740 14240496 BTB
Connector,Female,24Pin,0.4m
m,SMT,Mating Height
0.8mm,Terminal Dedicated
2.0 PCS J1801, J2201
750 14240579 BTB
Connector,BTBconnector,34PI
N,0.4mm,0.8mm,SMT,female,
Terminal Dedicated
1.0 PCS J1802
760 14240155 Card Socket Connector,SIM
Card
Socket,6pin,Horizontal,2.54m
m,Without Lock,Without Hold
Peg,Height 0.95mm,Terminal
Dedicated
1.0 PCS J2102
770 14240460 BTB
Connector,female,10Pin,0.4m
m,0.9mm,SMT,Terminal
Dedicated
1.0 PCS J2202
780 14240655 RF Connector,RF
Switch,Straight,female,SMT,S
plit from 14240432,Terminal
Dedicated
4.0 PCS J4101, J4301, J5501, J5502
790 14240433 RF Connector,Coaxial
Connector,50ohm,Straight,mal
e,SMT,W.FL2,PCN
Control,Terminal Dedicated
1.0 PCS J4102
800 51623882 Antenna-contact-C9800D 6.0 PCS J4302, J4304, J5401, J5503,
J5506, J5507
810 51621023 108-5785,Ground
Spring,U1250
2.0 PCS J5504, J5509
820 51621024 WN9149-N83-7F-W,Antenna
Spring,U1250
1.0 PCS J5508
830 10100051 Mobile Dedicated,EMI beads,
600ohm+/-25%,0.2A,0.65ohm,
0402,BT,Terminal Dedicated
12.0 PCS L1502, L1910, L2801,
L3101, L3102, L3105, L600,
L601, L602, L603, L604,
L605
840 10100541 Terminal Power
Inductor,0.47uH,+/-30%,3.4A,
0.039ohm,2.5*2.0*1.2mm,100
8,3.8A,High Current
Inductor,Terminal Dedicated
1.0 PCS L800
850 10100175 Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-2A-0.1
15ohm-2.5*2.0*1.2mm
2.0 PCS L900, L901
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 57 of 187
No. Part Number Name Quantity Position
860 10100473 Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-1.9A-0
.117ohm-2.5*2.0*1.2mm-Term
inal Dedicated
11.0 PCS L1210, L1601, L1803,
L2900, L2902, L2903,
L2904, L2905, L903, L904,
L905
870 10100147 SMT Power
Inductors,22uH,20%,0.42A,0.7
56ohm,3*3*1.2mm,Terminal
Dedicated
1.0 PCS L1600
880 7090800 Chip Thick Film
Resistor-0.0625W-0ohm-<
50mohm-0402-1A-BT
17.0 PCS L1804, L1805, L1806,
R1102, R1105, R1605,
R1634, R1919, R1943,
R2101, R2102, R2268,
R2269, R3112, R5632,
R5658, R702
890 10100539 Terminal Chip
Inductor,1uH,+/-30%,2.7A,0.0
59ohm,2.5*2.0*1.2mm,3A,PM
IC,Apart from
10100353,Inductor,Terminal
Dedicated
1.0 PCS L1901
900 10100168 Special Inductor and
Bead,Power
Inductor,4.7uH,-+/-20%,0.8A,0
.18ohm,2.5*2.0*1.2mm,25MH
z,Terminal Dedicated
1.0 PCS L2901
910 10100328 Terminal Chip
Inductor,1uH,+/-30%,1.58A,0.
102ohm,2.5*2.0*1.2mm(comp
atible with
2.4*2.4*1.2mm),Terminal
Dedicated
4.0 PCS L2906, L3103, L3201, L5608
920 10100113 Mobile Dedicated,Chip
Inductor,
0.0036uH,+/-0.3nH,0.17A,0.30
ohm,0201,Chip
Inductor,Mobile Dedicated
2.0 PCS L4102, L4129
930 10100121 Mobile Dedicated,Chip
Inductor-0.0075uH-+/-5%-0.15
A-0.53ohm-201-TS16949-Ter
minal Dedicated
2.0 PCS L4008, L4024
940 10100128 Mobile Dedicated,Chip
Inductor-0.022uH-+/-5%-0.1A-
1.2ohm-201-TS16949-Termina
l Dedicated
1.0 PCS L4014
950 8070744 SMD Ceramic
Capacitor-25V-0.0018nF-+/-0.
1.0 PCS L4022
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
25pF-NPO-0201-Terminal
Dedicated
960 10100122 Mobile Dedicated,Chip
Inductor-0.0082uH-+/-5%-0.15
A-0.55ohm-201-TS16949-Ter
minal Dedicated
7.0 PCS L4025, L4026, L4303,
L4304, L4402, L4408, L5607
970 10100134 Mobile Dedicated,Chip
Inductor,
0.068uH,+/-5%,0.05A,3.00ohm
,0201,Chip Inductor,Mobile
Dedicated
2.0 PCS L4107, L4113
980 10100106 Mobile Dedicated,Chip
Inductor-0.0018uH-+/-0.3nH-0.
2A-0.19ohm-201-TS16949-Ter
minal Dedicated
2.0 PCS L4127, L4413
990 10100109 Mobile Dedicated,Chip
Inductor-0.0024uH-+/-0.3nH-0.
2A-0.24ohm-201-Terminal
Dedicated
1.0 PCS L4128
1000 10100105 Mobile Dedicated,Chip
Inductor-0.0015uH-+/-0.3nH-0.
23A-0.18ohm-201-Terminal
Dedicated
1.0 PCS L4132
1010 10100120 Mobile Dedicated,Chip
Inductor-0.0068uH-+/-5%-0.15
A-0.48ohm-201-TS16949-Ter
minal Dedicated
2.0 PCS L4133, R4102
1020 10100111 Mobile Dedicated,Chip
Inductor,
0.003uH,+/-0.3nH,0.18A,0.28o
hm,0201,Chip Inductor,Mobile
Dedicat
3.0 PCS C4098, L4305, L4306
1030 10100112 Mobile Dedicated,Chip
Inductor-0.0033uH-+/-0.3nH-0.
18A-0.3ohm-201-TS16949-Ter
minal Dedicated
2.0 PCS L4312, L4313
1040 10100123 Mobile Dedicated,Chip
Inductor-0.0091uH-+/-5%-0.15
A-0.62ohm-201
1.0 PCS L4410
1050 8070712 SMD Ceramic
Capacitor-25V-0.015nF-+/-5%-
NP0-0201
2.0 PCS L4411, L4412
1060 10100127 Mobile Dedicated,Chip
Inductor-0.018uH-+/-5%-0.1A-
0.9ohm-201
1.0 PCS L4415
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 59 of 187
No. Part Number Name Quantity Position
1070 10100153 Mobile Dedicated,Chip
Inductor-0.003uH-+/-0.3nH-0.3
A-0.17ohm-0402
1.0 PCS L5504
1080 10100280 Mobile Dedicated,Chip
Inductor-0.18uH-+/-5%-0.1A-3
.8ohm-1.0*0.5*0.55mm-0402-
500000000Hz-Terminal
Dedicated
1.0 PCS L5603
1090 10100185 Mobile Dedicated,Chip
Inductor-2.2uH-+/-20%-0.97A-
0.19ohm-2.5*2.0*1.0mm
1.0 PCS L5604
1100 10100350 Mobile Dedicated,Chip
Inductor-0.47uH-+/-30%-1.6A-
0.075ohm-2.0*1.6*1.0mm-Ter
minal Dedicated
1.0 PCS L5606
1110 10100150 ZD Dedicated Inductor and
Bead,EMI
Bead,330ohm@100MHZ,25%,
1.5A,0.08ohm,0603,Terminal
Dedicated
1.0 PCS LB1201
1120 10070019 EMI
beads,+/-25%,1000ohm,1.25oh
m,0.25A,0402
7.0 PCS LB1601, LB1602, LB1603,
LB1604, LB1605, LB2204,
LB2205
1130 10100507 Terminal EMI
beads,220ohm,25%,3A,0.04oh
m,0805,@30~500M
Impedance>120ohm,Terminal
Dedicated
1.0 PCS LB1900
1140 10100184 Terminal EMI
beads-1800ohm-25%-0.2A-2.2
ohm-0402-Terminal Dedicated
3.0 PCS LB2206, LB2207, LB2208
1150 10100100 Terminal EMI
beads-80ohm-25%-0.2A-0.4oh
m-0201-110ohm
tpy@1GHz,murata
70ohm@100MHz-Terminal
Dedicated
1.0 PCS LB2802
1160 10100075 Mobile Dedicated,Chip
Inductor-0.0062uH-+/-0.2nH-0.
7A-0.09ohm-1.19*0.7*0.66
max
mm-4800000000Hz-Terminal
Dedicated
1.0 PCS LB5501
1170 15020235 LED,240cd,white,500mA,Ter
minal Dedicated,Flash LED
1.0 PCS LED1801
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
1180 22050075 Microphone,-42dB.,3.76*2.95*
1.1mm,silicon
1.0 PCS MIC1402
1190 15060238 MOSFET,N
Channel,20V,0.7A,530mohm,6
V,SC,75
1.0 PCS Q2901
1200 7092269 Chip Thick Film
Resistor-0.05W-1800ohm-+/-1
%-0201(0.6*0.3*0.23mm)-Ter
minal Dedicated
1.0 PCS R300
1210 7092050 Chip Thick Film
Resistor-0.05W-200ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated
2.0 PCS R2700, R301
1220 7091300 Chip Thick Film
Resistor-0.05W-6040ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
3.0 PCS R302, R303, R304
1230 7091298 Chip Thick Film
Resistor-0.05W-4700ohm-+/-1
%-0201-Terminal
Dedicated-Terminal Dedicated
9.0 PCS R1104, R2113, R2140,
R3011, R3014, R3198,
R3199, R400, R5661
1240 7091150 Chip Thick Film
Resistor-0.05W-22ohm-+/-5%-
0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS R405
1250 7091161 Chip Thick Film
Resistor-0.05W-2000ohm-+/-5
%-0201-Terminal
Dedicated-Terminal Dedicated
4.0 PCS R1812, R1813, R406, R407
1260 7091172 Chip Thick Film
Resistor-0.05W-22000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
14.0 PCS R2603, R2604, R500, R501,
R502, R503, R504, R505,
R506, R507, R508, R509,
R510, R511
1270 7092051 Chip Thick Film
Resistor-0.05W-240ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated
5.0 PCS R2602, R512, R513, R514,
R515
1280 7091159 Chip Thick Film
Resistor-0.05W-1000ohm-+/-5
%-0201-ELOM,TS16949
26.0 PCS R1311, R2141, R2142,
R2143, R2401, R2510,
R2511, R2521, R2706,
R2707, R2708, R2710,
R2720, R2722, R2733,
R2734, R2909, R3802,
R4107, R4108, R4109,
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
R4110, R516, R517, R518,
R519
1290 7091408 Chip Thick Film
Resistor-0.05W-68000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS R1008, R900
1300 7090875 Chip Thick Film
Resistor-0.0625W-100000ohm-
+/-1%-0402
1.0 PCS R901
1310 7092053 Chip Thick Film
Resistor-0.05W-1000000ohm-
+/-1%-0.6mm*0.3mm*0.23mm
-Terminal Dedicated-Terminal
Dedicated
1.0 PCS R902
1320 7090823 Chip Thick Film
Resistor-0.0625W-180000ohm-
+/-1%-0402
1.0 PCS R903
1330 7091256 Chip Thick Film
Resistor-0.05W-33ohm-+/-5%-
0201-Terminal
Dedicated-Terminal Dedicated
3.0 PCS R5626, R907, R908
1340 7091246 Chip Thick Film
Resistor-0.05W-100000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated
13.0 PCS R1000, R1002, R1101,
R1633, R1637, R1929,
R1933, R1935, R2138,
R2264, R2933, R3201,
R3230
1350 7091405 Chip Thick Film
Resistor-0.05W-56000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
3.0 PCS R1001, R1004, R3901
1360 7091169 Chip Thick Film
Resistor-0.05W-10000ohm-+/-
5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
18.0 PCS R1010, R1011, R1514,
R1639, R1640, R1808,
R1809, R1910, R2012,
R2514, R2926, R3104,
R3121, R3132, R3195,
R3197, R3902, R5647
1370 7091301 Chip Thick Film
Resistor-0.05W-10000ohm-+/-
1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
11.0 PCS R1103, R1939, R1940,
R2112, R2605, R2732,
R2747, R2904, R2905,
R2910, R3008
1380 7091175 Chip Thick Film
Resistor-0.05W-100000ohm-+/
-5%-0201-Terminal
Dedicated-Terminal Dedicated
6.0 PCS R1226, R1231, R1505,
R1512, R1901, R1947
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
1390 7091380 Chip Thick Film
Resistor-0.0625W-39200ohm-
+/-1%-0402
1.0 PCS R1232
1400 7090858 Chip Thick Film
Resistor-0.0625W-2000000oh
m-+/-1%-0402
1.0 PCS R1302
1410 7091783 Chip Thick Film
Resistor-0.2W-0.01ohm-+/-1%
-0603
1.0 PCS R1303
1420 7091155 Chip Thick Film
Resistor-0.05W-100ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated
5.0 PCS R1309, R1310, R2418,
R2419, R2902
1430 7090796 Chip Thick Film
Resistor-0.0625W-18000ohm-
+/-5%-0402
1.0 PCS R1312
1440 7091162 Chip Thick Film
Resistor-0.05W-2200ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS R1501
1450 7091393 Chip Thick Film
Resistor-0.0625W-301000ohm-
+/-1%-0402
1.0 PCS R1603
1460 7091389 Chip Thick Film
Resistor-0.0625W-91000ohm-
+/-1%-0402
1.0 PCS R1604
1470 7091395 Chip Thick Film
Resistor-0.0625W-392000ohm-
+/-1%-0402
1.0 PCS R1611
1480 7091148 Chip Thick Film
Resistor-0.05W-10ohm-+/-5%-
0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS R1638, R3801
1490 7092272 Chip Thick Film
Resistor-0.05W-180ohm-1%-0
201(0.6*0.3*0.23mm)-Termina
l Dedicated
1.0 PCS R1907
1500 7091174 Chip Thick Film
Resistor-0.05W-51000ohm-+/-
5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS R2005
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 63 of 187
No. Part Number Name Quantity Position
1510 7090867 Chip Thick Film
Resistor-0.0625W-10000ohm-
+/-1%-0402-BT
1.0 PCS R2013
1520 7091153 Chip Thick Film
Resistor-0.05W-51ohm-+/-5%-
0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
5.0 PCS R2240, R2241, R2242,
R4007, R5401
1530 7091350 Chip Thick Film
Resistor-0.0625W-1500ohm-+/
-1%-0402-BT
1.0 PCS R2266
1540 7091378 Chip Thick Film
Resistor-0.0625W-27400ohm-
+/-1%-0402
1.0 PCS R2267
1550 7090798 Chip Thick Film
Resistor-0.0625W-22000ohm-
+/-1%-0402
2.0 PCS R2508, R3203
1560 7091409 Chip Thick Film
Resistor-0.05W-150000ohm-+/
-5%-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS R2520, R4105
1570 7090857 Chip Thick Film
Resistor-0.0625W-1000000oh
m-+/-1%-0402
2.0 PCS R2900, R3109
1580 7091250 Chip Thick Film
Resistor-0.05W-12000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R2903
1590 7091302 Chip Thick Film
Resistor-0.05W-51000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R2922
1600 7091176 Chip Thick Film
Resistor-0.05W-121000ohm-+/
-1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS R2923
1610 7091177 Chip Thick Film
Resistor-0.05W-180000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R2934
1620 7091384 Chip Thick Film
Resistor-0.0625W-51000ohm-
+/-1%-0402
1.0 PCS R3128
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 64 of 187
No. Part Number Name Quantity Position
1630 7090892 Chip Thick Film
Resistor-0.0625W-30000ohm-
+/-1%-0402
2.0 PCS R3129, R3202
1640 7091152 Chip Thick Film
Resistor-0.05W-47ohm-+/-5%-
0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R4004
1650 7091253 Chip Thick Film
Resistor-0.05W-120ohm-+/-5%
-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS R4005, R4006
1660 7091158 Chip Thick Film
Resistor-0.05W-390ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R4101
1670 8070749 SMD Ceramic
Capacitor-25V-0.0047nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R5513
1680 7050106 NTC-220000ohm-NTC-0402-1
.0*0.5*0.5mm-Terminal
Dedicated
1.0 PCS RT1801
1690 7050063 NTC-150000ohm-SMT-0402-
Terminal Dedicated
2.0 PCS RT2501, RT4101
1700 7040075 Varistor-18V-14V-10A-40V-S
MT-0402-Terminal Dedicated
1.0 PCS RV1900
1710 16100067 Tact
Switch,SPDT,DC,SMT,0.4mm,
5.65*3.5*0.9,5000,Terminal
Dedicated
1.0 PCS S2101
1720 10100527 Terminal Common Mode
Inductor,28ohm,+/-20%,5V,0.1
A,
2.5ohm,03025,0.85*0.65*0.45(
mm),TAIYO YUDEN
12ohm@100M;TDK
35ohm@100M,Terminal
Dedicated
8.0 PCS T1801, T1802, T1803,
T1804, T1805, T1806,
T1807, T1808
1730 10100331 Terminal Common Mode
Inductor,40ohm,+/-25%,5V,0.1
A,1.625ohm,1.25*1.0*0.5(mm)
,Terminal Dedicated
1.0 PCS T1901
1740 10100564 Terminal Com-mode
Inductor,45ohm,+/-25%,5V,0.1
1.0 PCS T1902
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
A,2.5ohm,0504,1.25mm*1.0m
m*0.65mm,USB D+/D-
Application
1750 12070055 Temperature Compensated
Oscillator,19.2MHz,+/-2.5ppm,
2.8V,+/-2.0ppm,-30degC,85de
gC,Terminal Dedicated
1.0 PCS TCXO100
1760 12070038 Temperature Compensated
Oscillator,26MHz,+/-1.5ppm(
max),+1.8V,+/-0.5ppm(max),-4
0degC,85degC,Terminal
Dedicated
2.0 PCS TCXO1001, TCXO5601
1770 35020171 Consumption
Chip,Hi3620GFCV111G15,FC
CSP
576,1.1/1.2/1.8/2.6/3.3V,Appli
cation processor
1.0 PCS U300
1780 40020168 DDR2 DRAM-16Gb
LPDDR2-533MHz-32bit-1.8V/
1.2V-216BALL
FBGA(POP)-Terminal
Dedicated
1.0 PCS U300_POP
1790 39110780 Switching Regulators-DC/DC
buck for
GPU-2.5V-5.5V-4000mA-2.5
MHz-CSP16-Terminal
Dedicated
1.0 PCS U800
1800 35020158 Consumer
Chips-Hi6421GFCV231-FCCS
P189-1.8/3.3/4.2V-K3 PMU
and Codec chip
1.0 PCS U900
1810 40060418 MCP-32GB(32Gbx8)
EMMC-52MHz-3.3/1.8V-FBG
A169-1Gb(32Mbx32)
LPDDR-Terminal Dedicated
1.0 PCS U1102
1820 38020077 Analog Switch,one input one
output Load
switch,1.1V~3.6V-1.8Vinput,<
55mohm;1.2Vinput,<90mohm,
WLCSP4,Terminal Dedicated
2.0 PCS U1103, U3203
1830 39080180 Operation Amplifier,Audio
Power
Amplifier,2.5V~5.5V,Differenc
ial,Micro SMD
16pin(WLCSP),Terminal
Dedicated
1.0 PCS U1201
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 66 of 187
No. Part Number Name Quantity Position
1840 39070073 -0.3~2.75V,Battery
Gauge,SON,Terminal
Dedicated
1.0 PCS U1301
1850 39080124 Operation
Amplifier,Headphone Audio
Power Amplifier,2.3 V to 5.5
V,differential AB
Amplifier,QFN,Terminal
Dedicated
1.0 PCS U1501
1860 39110626 Switching
Regulators-Vin~38V-0.02A-Q
FN-2*2-SMT-2*2-10 LED
Driver, Terminal Dedicated
1.0 PCS U1600
1870 39110636 Switching
Regulators-ThinQFN-LCD
Driver-Terminal Dedicated
1.0 PCS U1601
1880 39110620 Power Driver,1.5A LED flash
driver IC,CSP,Terminal
Dedicated
1.0 PCS U1800
1890 39070149 Battery Management IC-charge
IC-buck-3A input
ability-3.9V-6.5V-QFN-24-OT
G-Terminal Dedicated
1.0 PCS U1901
1900 38020071 Analog Switch,double-pole,
triple throw (DP3T)
multiplexer,2.5V-4.5V,<6.6oh
m,1470MHz,QFN12,Terminal
Dedicated
1.0 PCS U1905
1910 33030026 Temperature
Sensor,-40~+125degC,1.4V~2.
75V,Digital
Output,+/-1degC,DFN,60000us
,NA,12bit,IIC,Terminal
Dedicated
1.0 PCS U2001
1920 38140103 Semiconductor Sensor,three
axis
gyroscope,LGA-16,Terminal
Dedicated
1.0 PCS U2003
1930 38140098 Semiconductor
Sensor,Accelerometer,LGA,3a
xis,Terminal Dedicated
1.0 PCS U2004
1940 38140069 Semiconductor
Sensor,E-Compass,WLCSP(Pb
-free),3axis,Terminal
Dedicated
1.0 PCS U2005
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
1950 38020072 Bi-directional,4PDT,
1.65-4.3V ,Rond(max)<12ohm
;Ronv<0.7ohm-160MHz-UML
P, Terminal Dedicated
1.0 PCS U2101
1960 36020419 CMOS,Dual
Reverse,QFN,33.6ns,20mA,C
MOS,CMOS, Terminal
Dedicated
1.0 PCS U2103
1970 39080185 Operation Amplifier, Linear
Motor
Driver,2.5~5.5V,Differential, 9
Ball 0.5mm Pitch
WCSP,Terminal Dedicated
1.0 PCS U2203
1980 35020149 Consumption
Chip,Hi6920GFCV100,FBGA
520,1.1/1.8/2.5,LTE,WCDMA/
GSM
1.0 PCS U2501
1990 35020150 Chip,Hi6451GBCV110,BGA1
04,5V,Power management unit
1.0 PCS U2900
2000 39110756 Switching Regulators,DC/DC
buck,2.5V~5.5V,Voadj,1.2A,D
FN/QFN
3.0 PCS U2901, U3105, U3201
2010 43110067 AUDIO Chip,2 digital
microphones/4 Digital Audio
Ports (PCM/I2S)/Voice
equalization,BGA32, Terminal
Dedicated
1.0 PCS U3000
2020 43090148 VIDEO Chip,49
VFBGA,1.2V/1.8V/3.3V,HDM
I&USB 2in1,1080p/60Hz,
Terminal Dedicated
1.0 PCS U3101
2030 39110548 LDO-3.3V-2%-0.15A-SC70-5-
Terminal Dedicated-Terminal
Dedicated
1.0 PCS U3104
2040 35020147 Consumer-Hi6360RBCV210-V
FBGA-2.2V/1.8V/1.2V-2G/3G
/4G multi mode multi band RF
Transceiver
1.0 PCS U3901
2050 47140042 0.5~3GHz,SPDT,0.46,22,TSS
ON,Terminal Dedicated
2.0 PCS U3902, U3905
2060 47100500 RF Power Amplifying
Module,1920MHz~1980MHz,2
9.5dB
max.,28.25dBm,QFN,Terminal
Dedicated
1.0 PCS U4001
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 68 of 187
No. Part Number Name Quantity Position
2070 47100360 RF Power Amplifying
Module,1710-1785MHz,26.5d
B/18dB/12dB,28.6dBm,QFN,C
LASS1
1.0 PCS U4002
2080 13080086 Duplexer-TX:1710~1785MHz/
RX:1805~1880MHz-3.5dB.-4d
B.-43dB./45dB.-2520-Terminal
Dedicated
1.0 PCS U4003
2090 47100387 RF Power Amplifying
Module,880MHz~915MHz,28/
18/11,QFN,1000V
1.0 PCS U4004
2100 13080104 Duplexer,TX:880MHz~915M
Hz/RX:925MHz~960MHz,3dB
.,3dB.,55dB/50dB.,2520,Termi
nal Dedicated
1.0 PCS U4005
2110 13080094 Duplexer-TX:1920~
1980MHz/RX:2110~2170MHz
-5dB.-2.2dB.-48dB./52dB.-252
0-Terminal Dedicated
1.0 PCS U4006
2120 47140112 RF
Switch,700M~2700MHz,SP14
T,0.5dB(900MHz)/0.8dB(2100
MHz)/1.0dB(2700MHz),25dB.,
LGA,Terminal Dedicated
1.0 PCS U4101
2130 47100348 RF Power Amplifying
Module,824MHz~849MHz/88
0MHz~915MHz/1710MHz~17
85MHz/1850MHz~1910MHz,3
3.5,35dBm,LGA
1.0 PCS U4102
2140 47140045 RF
Switch-0.5~2.5GHz-SP4T-0.95
-15dB.-QFN
1.0 PCS U4301
2150 47140068 RF
Switch,400~3000MHz,DPDT,0
.25~0.7dB,1.5:1,26dB,QFN,10
00V
1.0 PCS U4302
2160 47100305 Power Module,
824MHz~849MHz,27dB,28.5d
Bm,QFN,2000V,Terminal
Dedicated
1.0 PCS U4401
2170 47100353 RF Power Amplifying
Module,2500-2570MHz,28,31d
Bm,QFN,1000V
1.0 PCS U4402
2180 13080037 Duplexer,TX:824~849MHz;R
X:869~894MHz,1.7dB(typ),2.0
1.0 PCS U4403
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 69 of 187
No. Part Number Name Quantity Position
dB(typ),60dB/53dB(typ),2520,
Terminal Dedicated,TS16949
2190 13080162 Duplexer,TX:2500-2570MHz/
RX:2620-2690MHz,2.5dB.,2.5
dB.,-50dB.,-2016.,Terminal
Dedicated-Unbalance-FBAR
1.0 PCS U4404
2200 47140111 RF
Switch-700~2700MHz-DP6T-0
.55dB max.-1.43
max.-19dB.-QFN-Terminal
Dedicated
1.0 PCS U4405
2210 47990023 Balun,50:100Balun,2300MHz~
2700MHz,50:100,1.2,0.5,1608
SMD,Terminal Dedicated
1.0 PCS U4406
2220 47140113 RF
Switch-100~3500MHz-SP3T-0
.65dB max. at
2400~2500MHz-1.29 at
2450MHz-32dB.-QFN-Termin
al Dedicated
2.0 PCS U5401, U5504
2230 47140114 RF
Switch-20~6000MHz-SPDT-0.
65dB
max.-1.43-22dB.-QFN-Termin
al Dedicated
1.0 PCS U5501
2240 47090053 RF LNA,1575MHz,14dB
min.,1.6dB
max.,SOT886,Terminal
Dedicated
1.0 PCS U5503
2250 39210059 Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949
1.0 PCS U5603
2260 12020125 Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949
1.0 PCS X1000
2270 15040385 Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN16-Terminal Dedicated
1.0 PCS Z1601
2280 15040384 Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN10-Terminal Dedicated
1.0 PCS Z1602
2290 13010177 SAW
Filter-1960MHz-2.7dB-1.4*1.1
1.0 PCS Z4101
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 70 of 187
No. Part Number Name Quantity Position
mm-Terminal Dedicated
2300 13010212 SAW
Filter,1842.5MHz,1.6dB(typ),5
0V,SFLT5-0101,Terminal
Dedicated
1.0 PCS Z4301
2310 13010271 SAW
Filter-2655MHz-3.8dB-1411-T
erminal Dedicated
1.0 PCS Z4303
2320 13010262 SAW
Filter-2140MHz-3.0dB-50V-14
11-Terminal Dedicated
1.0 PCS Z4304
2330 13010274 SAW
Filter-2437MHz-3.5-500V-201
6-
2.0 PCS Z5401, Z5505
2340 13080106 Duplexer,1565~1607MHz/240
0~2500MHz,0.8dB./0.9dB.,13d
B./18dB,1608,Terminal
Dedicated
1.0 PCS Z5501
2350 13010264 SAW
Filter-1590.16MHz-1.8dB-50V
-1411-Terminal Dedicated
2.0 PCS Z5502, Z5503
2360 13030061 Ceramic
Filter,5375MHz,1.7dB,SMD
1.0 PCS Z5504
2370 8071219 SMD Ceramic
Capacitor-10V-100nF-+/-10%-
X5R-0201-Terminal Dedicated
2.0 PCS C1246, C300
2380 05021AXP Board
Software,HDD2-0082M,HDD2
-0082M00,D2-0082 Handset
Software,Program,Universal
1.0 PCS -
2390 10100119 Terminal Chip Inductor,
0.0062uH,+/-5%,0.15A,0.44oh
m,0201,EAR99.Chip Inductor
1.0 PCS C4071
2400 10100017 Terminal EMI
beads-470ohm-+/-25%-0.5A-0.
21ohm-0603-BT,TS16949-Ter
minal Dedicated
2.0 PCS LB1202, LB1204
2410 8070698 SMD Ceramic
Capacitor-16V-3.3nF-+/-10%-
X7R-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS C1241, C1247
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 71 of 187
D2-2010:
No. Part Number Name Quantity Position
-1 03021UPQ Manufactured Board-CDMA
D2-2010-HC1C9800DM-D2-2
010 Handset Main Board -2*2
- -
1 03010QMQ Manufactured
Board-D2-2010-HC1C9800D
M-D2-2010 Handset Main
Board -2*2
1.0 PCS -
2 8070704 SMD Ceramic
Capacitor-6.3V-100nF-+/-10%-
X5R-0201-TS16949
154.0 PCS C1013, C1021, C1023,
C1102, C1104, C1107,
C1111, C1236, C1307,
C1309, C1310, C1311,
C1312, C1315, C1327,
C1406, C1407, C1418,
C1501, C1502, C1506,
C1602, C1603, C1633,
C1635, C1643, C1806,
C1808, C1809, C1815,
C1817, C1819, C1821,
C1822, C1824, C1827,
C1831, C1920, C2002,
C2003, C2004, C2005,
C2006, C2015, C2016,
C2102, C2104, C2105,
C2107, C2108, C2109,
C2155, C2156, C2158,
C2159, C2162, C2216,
C2217, C2241, C2242,
C2243, C2262, C2422,
C2424, C3105, C3106,
C3107, C3108, C3110,
C3111, C3112, C3113,
C3114, C3115, C3119, C401,
C4014, C4017, C4018,
C4019, C4020, C4021,
C4022, C4101, C4102,
C4103, C4104, C4105,
C4106, C4107, C4108,
C4109, C4110, C4111,
C4112, C4113, C4114,
C4115, C4201, C4202,
C4303, C4304, C4315,
C4316, C4611, C5028,
C5102, C5504, C5605,
C5606, C5607, C5610,
C5611, C5613, C5614,
C5615, C5616, C5632,
C5642, C5643, C5644, C607,
C608, C609, C639, C641,
C660, C681, C682, C702,
C703, C704, C705, C706,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 72 of 187
No. Part Number Name Quantity Position
C716, C717, C718, C719,
C720, C721, C722, C729,
C730, C731, C732, C801,
C802, C803, C805, C926,
C927, C928, C929, C933
3 8070689 SMD Ceramic
Capacitor-25V-0.033nF-+/-5%-
NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
72.0 PCS C1412, C1413, C1414,
C1417, C1508, C1509,
C1531, C1604, C1605,
C1606, C1620, C1621,
C1623, C2007, C2008,
C2009, C2010, C2031,
C2032, C2101, C2106,
C2122, C2124, C2136,
C2139, C2140, C2201,
C2202, C2203, C2205,
C2206, C2207, C2208,
C2209, C2210, C2211,
C2212, C2213, C2214,
C2227, C2244, C2245,
C2246, C2263, C2264,
C2425, C2427, C2428,
C2429, C2430, C2431,
C2443, C2444, C2445,
C2446, C2447, C2448,
C2449, C2450, C410, C411,
C4314, C4714, C514, C515,
C5302, C5323, C5326,
C5336, C5501, C5505,
C5506
4 8071128 SMD Ceramic
Capacitor-6.3V-1000nF-+/-20
%-X5R-0201-Terminal
Dedicated
93.0 PCS C1004, C1005, C1020,
C1026, C1416, C1825,
C2261, C3006, C3007,
C4126, C500, C5000, C5005,
C5006, C5008, C501, C5018,
C502, C503, C504, C505,
C506, C507, C508, C509,
C510, C5108, C5109, C511,
C5620, C5621, C5622,
C5623, C5624, C5625,
C5626, C605, C606, C611,
C612, C614, C615, C616,
C617, C618, C619, C620,
C621, C622, C623, C624,
C625, C626, C627, C628,
C629, C630, C633, C6417,
C645, C650, C651, C652,
C653, C6549, C655, C656,
C661, C670, C671, C672,
C673, C674, C675, C679,
C707, C708, C710, C711,
C712, C713, C714, C715,
C723, C724, C725, C726,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 73 of 187
No. Part Number Name Quantity Position
C727, C728, C750, C753,
C754, C755
5 8070667 SMD Ceramic
Capacitor-6.3V-2200nF-+/-20
%-X5R-0402-TS16949
52.0 PCS C1001, C1002, C1003,
C1105, C1505, C1526,
C1527, C1814, C1818,
C2000, C2001, C3101,
C3102, C3116, C3197,
C4006, C4007, C4008,
C4009, C4010, C4011,
C5001, C600, C602, C603,
C676, C700, C733, C901,
C902, C903, C904, C905,
C906, C907, C908, C909,
C911, C912, C913, C914,
C915, C916, C917, C918,
C919, C920, C921, C922,
C923, C924, C925
6 8070783 SMD Ceramic
Capacitor-6.3V-22000nF-+/-20
%-X5R-0603-Terminal
Dedicated
22.0 PCS C1109, C1110, C1238,
C1317, C1908, C1910,
C3121, C3231, C601, C642,
C649, C804, C939, C941,
C942, C943, C944, C945,
C946, C948, C950, C952
7 8070819 SMD Ceramic
Capacitor-6.3V-4700nF-+/-20
%-X5R-0402-Terminal
Dedicated-Terminal Dedicated
26.0 PCS C1513, C1514, C1515,
C1516, C1611, C1811,
C2012, C2260, C4717,
C5015, C5016, C5118,
C5637, C5638, C5639, C604,
C610, C613, C677, C678,
C685, C686, C701, C751,
C752, C910
10 8070692 SMD Ceramic
Capacitor-10V-10nF-+/-10%-X
5R-0201-TS16949
19.0 PCS C3003, C3004, C3005,
C3008, C3009, C3122,
C4311, C4312, C4313,
C5112, C5113, C5114, C632,
C635, C637, C638, C646,
C6515, C947
11 8070676 SMD Ceramic
Capacitor-25V-0.01nF-+/-5%-
NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
12.0 PCS C1503, C2231, C4309,
C4310, C4402, C5515,
C5516, C5518, C5519,
C5520, C640, C934
12 8070649 SMD Ceramic
Capacitor-6.3V-10000nF-+/-20
%-X5R-0603-BT,TS16949
19.0 PCS C1103, C1632, C1823,
C1902, C1903, C3103,
C3118, C3230, C4030,
C4031, C5332, C5333,
C5633, C5634, C5635,
C5636, C643, C949, C951
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 74 of 187
No. Part Number Name Quantity Position
13 8071542 SMD Ceramic
Capacitor-50V-1000nF-+/-10%
-X5R-0805(2.0*1.25*0.95mm)
-Hmax=0.95mm-Terminal
Dedicated
2.0 PCS C1610, C699
17 8070564 SMD Ceramic
Capacitor-6.3V-4700nF-+/-20
%-X5R-0603-BT,TS16949
7.0 PCS C4005, C4032, C4033,
C4034, C4035, C4036, C930
18 8070612 SMD Ceramic
Capacitor-10V-1000nF-+/-10%
-X5R-0402-BT,TS16949
35.0 PCS C1303, C1904, C1905,
C1909, C3000, C3001,
C3002, C4024, C4025,
C4026, C4027, C4116,
C4117, C4118, C4119,
C4120, C4121, C4122,
C4123, C4124, C4125,
C4127, C4128, C4129,
C4130, C4131, C4132,
C4133, C4305, C5110,
C6511, C935, C936, C937,
C938
19 8070703 SMD Ceramic
Capacitor-25V-1nF-+/-10%-X7
R-0201-TS16949
14.0 PCS C1024, C1301, C4001,
C4002, C4003, C4004,
C4203, C4301, C4705,
C4706, C4713, C5100,
C65101, C958
20 8070695 SMD Ceramic
Capacitor-25V-0.022nF-+/-5%-
NP0-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
9.0 PCS C1010, C1011, C4204,
C4602, C5318, C5319,
C5320, C5321, C5334
21 8070531 SMD Ceramic
Capacitor-50V-1nF-+/-10%-X7
R-0402-BT
1.0 PCS C1022
22 8070720 SMD Ceramic
Capacitor-6.3V-1000nF-+/-10
%-X5R-0402-Terminal
Dedicated,TS16949-Terminal
Dedicated
14.0 PCS C1025, C1101, C1528,
C1529, C1616, C1820,
C1826, C1900, C3117,
C5007, C5009, C5027,
C5309, C5310
25 8070625 SMD Ceramic
Capacitor-6.3V-470nF-+/-10%-
X5R-0402
3.0 PCS C1108, C2103, C2141
26 8070817 SMD Ceramic
Capacitor-6.3V-47nF-+/-10%-
X5R-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C1234, C1245
27 8071388 SMD Ceramic 1.0 PCS C1237
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 75 of 187
No. Part Number Name Quantity Position
Capacitor-10V-22000nF-+/-20
%-X5R-0805(2.0*1.25*0.95m
m)-Terminal Dedicated
28 8070696 SMD Ceramic
Capacitor-25V-0.1nF-+/-5%-N
PO-0201-TS16949
10.0 PCS C1243, C1313, C1907,
C4508, C4612, C4613,
C4701, C4707, C5513,
C5812
30 8070716 SMD Ceramic
Capacitor-6.3V-33nF-+/-10%-
X5R-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C1306, C4308
31 8070966 SMD Ceramic
Capacitor-4V-470nF-+/-20%-X
5R-0201-Terminal Dedicated
1.0 PCS C1308
32 8070760 SMD Ceramic
Capacitor-25V-0.047nF-+/-5%-
NPO-0201-Terminal
Dedicated-Terminal Dedicated
3.0 PCS C1314, C1504, C2230
36 8070450 SMD Ceramic
Capacitor-50V-0.1nF-+/-5%-N
PO-0402-BT
1.0 PCS C1525
37 8070713 SMD Ceramic
Capacitor-6.3V-22nF-+/-10%-
X5R-0201
1.0 PCS C1530
38 8070752 SMD Ceramic
Capacitor-6.3V-220nF-+/-20%-
X5R-0201-Terminal Dedicated
3.0 PCS C1601, C4709, C5601
40 8070780 SMD Ceramic
Capacitor-10V-10000nF-+/-10
%-X5R-0805-Terminal
Dedicated-Terminal Dedicated
3.0 PCS C1628, C1629, C1812
41 8070547 SMD Ceramic
Capacitor-50V-0.033nF-+/-5%-
NP0-0402-BT
1.0 PCS C1634
42 8070753 SMD Ceramic
Capacitor-25V-0.0082nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated
3.0 PCS C1640, C1641, C1642
43 8070789 SMD Ceramic
Capacitor-25V-0.0056nF-+/-0.
1pF-NPO-0201-Terminal
Dedicated
21.0 PCS C1801, C1802, C1803,
C1804, C1807, C1810,
C1830, C1846, C1847,
C1849, C1850, C1851,
C1852, C1853, C1864,
C1866, C1868, C1869,
C1872, C1873, C5301
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 76 of 187
No. Part Number Name Quantity Position
47 8070573 SMD Ceramic
Capacitor-10V-2200nF-+/-10%
-X5R-0603
1.0 PCS C1816
50 8070583 SMD Ceramic
Capacitor-10V-47nF-+/-10%-X
7R-0402
1.0 PCS C1901
53 8070785 SMD Ceramic
Capacitor-10V-4700nF-+/-10%
-X5R-0603-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C1906
55 8071463 SMD Ceramic
Capacitor-16V-2200nF-+/-20%
-X5R-0402(1.0*0.5*0.6mm)-H
max=0.6mm-Terminal
Dedicated
1.0 PCS C1911
56 8070970 SMD Ceramic
Capacitor-50V-10nF-10%-X7R
-0402-Terminal Dedicated
1.0 PCS C2011
57 8070561 SMD Ceramic
Capacitor-10V-100nF-+/-10%-
X5R-0402
1.0 PCS C2021
67 8071109 SMD Ceramic
Capacitor-10V-10nF-+/-10%-X
5R-0201-Terminal Dedicated
1.0 PCS C4205
68 8070717 SMD Ceramic
Capacitor-25V-0.056nF-+/-5%-
NP0-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS C4307, C5311
70 8070701 SMD Ceramic
Capacitor-25V-0.082nF-+/-5%-
NP0-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS C4501, C4502
71 8070742 SMD Ceramic
Capacitor-25V-0.0012nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS C4503
72 8070810 SMD Ceramic
Capacitor-16V-0.22nF-+/-10%-
X7R-0201-Terminal Dedicated
1.0 PCS C4510
73 8070698 SMD Ceramic
Capacitor-16V-3.3nF-+/-10%-
X7R-0201-Terminal
Dedicated,TS16949-Terminal
3.0 PCS C1241, C1247, C4511
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 77 of 187
No. Part Number Name Quantity Position
Dedicated
76 8070809 SMD Ceramic
Capacitor-6.3V-4.7nF-+/-10%-
X7R-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C4616
77 8070683 SMD Ceramic
Capacitor-16V-82nF-+/-10%-X
7R-0402-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C4617
81 8070700 SMD Ceramic
Capacitor-25V-0.068nF-+/-5%-
NP0-0201-Terminal
Dedicated-Terminal Dedicated
3.0 PCS C4711, C5602, C5603
82 8070950 SMD Ceramic
Capacitor-25V-0.018nF-+/-5%-
C0G-0.6mm*0.3mm*0.3mm-T
erminal Dedicated
4.0 PCS C5013, C5014, C5322,
C5514
84 8070748 SMD Ceramic
Capacitor-25V-0.0039nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS C5304, C5305
85 8070614 SMD Ceramic
Capacitor-16V-100nF-+/-10%-
X7R-0402-BT
1.0 PCS C5306
86 8070750 SMD Ceramic
Capacitor-25V-0.0068nF-+/-0.
5pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
4.0 PCS C5307, C5308, C5312,
C5313
88 10100112 Mobile Dedicated,Chip
Inductor-0.0033uH-+/-0.3nH-0.
18A-0.3ohm-201-TS16949-Ter
minal Dedicated
2.0 PCS C5314, L5302
91 8070697 SMD Ceramic
Capacitor-25V-0.012nF-+/-5%-
NP0-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS C5325
92 7090911 Chip Thick Film
Resistor-0.05W-0ohm-< 50m
ohm-0201-ELOM,TS16949
97.0 PCS C5330, C5335, C5508,
C5509, C5510, L5319,
R1007, R1013, R1014,
R1223, R1301, R1313,
R1314, R1402, R1403,
R1408, R1409, R1605,
R1622, R1634, R1699,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 78 of 187
No. Part Number Name Quantity Position
R1811, R1814, R1816,
R1817, R1819, R1821,
R1823, R1825, R1827,
R1830, R1850, R1851,
R1912, R1922, R1937,
R2001, R2003, R2004,
R2107, R3001, R3003,
R3006, R3007, R3009,
R3010, R3016, R306, R3112,
R3113, R3126, R3130,
R3131, R4018, R4104,
R4105, R4201, R4202,
R4204, R4302, R4314,
R4704, R5017, R5020,
R5021, R5022, R5103,
R5104, R5106, R5107,
R5128, R5129, R5130,
R5132, R5133, R5148,
R5155, R5161, R522, R523,
R5304, R5305, R5307,
R5308, R5310, R5401,
R5402, R5405, R5501,
R5502, R5503, R5507,
R5521, R5609, R5621,
R5629, R5805
99 8070751 SMD Ceramic
Capacitor-25V-0.027nF-+/-5%-
NPO-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C5619
100 8070741 SMD Ceramic
Capacitor-25V-0.001nF-+/-0.2
5pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C5641
101 8070754 SMD Ceramic
Capacitor-25V-0.039nF-+/-5%-
NPO-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS C5810
102 15040311 Transient Suppression
Diode-6V-12V-50W-5A-SOD9
23-Terminal Dedicated
2.0 PCS D1301, D1302
103 15040339 Transient Suppression
Diode-6V-12V-30W-3A-0201-
Terminal Dedicated
15.0 PCS D1406, D1601, D1602,
D1903, D2101, D2102,
D2104, D2105, D2106,
D2108, D2201, D2202,
D2240, D2241, D2242
104 15010262 Switching
Diode-75V-200mA-1V-SOD-5
23
1.0 PCS D1600
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2013-04-09 Huawei confidential. No spreading without permission. Page 79 of 187
No. Part Number Name Quantity Position
105 15040264 Transient Suppression
Diode-7V-15V-1A-SOD882/04
02-Terminal Dedicated
2.0 PCS D1901, D1902
106 15010251 Schottky
diode-30V-0.2A-0.5V-SOD523
2.0 PCS D1905, D4301
108 15040278 Zener,5.1V,0.2W,SOD323 1.0 PCS D5001
109 19040169 Protection Tube,Fast Blowout
Fuse,24V,3A,IEC
Spec,0.03ohm,0.100
A*A*Sec,UL,Terminal
Dedicated
1.0 PCS F1900
110 51623866 TOP-HIELD-COVER-3-CN-C
9800D
1.0 PCS F2401
111 51623862 TOP-SHIELD-PRAME-2-CN-
C9800D
1.0 PCS F2402
112 51623861 TOP-SHIELD-PRAME-1-CN 1.0 PCS F2403
113 51623880 SIM-Rail-C9800D 1.0 PCS F2404
114 51623881 SIM-Rail2-C9800D 1.0 PCS F2405
115 51623878 BOT-SHIELD-FRAME-2-CN-
C9800D
1.0 PCS F2406
116 51623864 BOT-SHIELD-PRAME-1-CN-
C9800D
1.0 PCS F2407
117 51623879 B-Camera-nut-C9800D 1.0 PCS F2408
118 51623883 PCB-Steel-C9800D 1.0 PCS F2409
122 14240576 Card Block Connector,BTF
Connector,3*2,Female,1.3mm,
Terminal Dedicated
2.0 PCS J1301, J1901
123 14240375 BTB
Connector,female,40Pin,0.4m
m,0.8mm,SMT,Terminal
Dedicated
1.0 PCS J1601
124 14240496 BTB
Connector,Female,24Pin,0.4m
m,SMT,Mating Height
0.8mm,Terminal Dedicated
2.0 PCS J1801, J2201
125 14240579 BTB
Connector,BTBconnector,34PI
N,0.4mm,0.8mm,SMT,female,
Terminal Dedicated
1.0 PCS J1802
126 14240155 Card Socket Connector,SIM
Card
2.0 PCS J2101, J2102
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
Socket,6pin,Horizontal,2.54m
m,Without Lock,Without Hold
Peg,Height 0.95mm,Terminal
Dedicated
127 14240460 BTB
Connector,female,10Pin,0.4m
m,0.9mm,SMT,Terminal
Dedicated
1.0 PCS J2202
129 14240433 RF Connector,Coaxial
Connector,50ohm,Straight,mal
e,SMT,W.FL2,PCN
Control,Terminal Dedicated
1.0 PCS J4401
130 14240655 RF Connector,RF
Switch,Straight,female,SMT,S
plit from 14240432,Terminal
Dedicated
4.0 PCS J4402, J5301, J5402, J5503
131 51621023 108-5785,Ground
Spring,U1250
2.0 PCS J5400, J5403
132 51623882 Antenna-contact-C9800D 5.0 PCS J5401, J5501, J5505, U5302,
U5304
135 51621024 WN9149-N83-7F-W,Antenna
Spring,U1250
1.0 PCS J5502
136 10100541 Terminal Power
Inductor,0.47uH,+/-30%,3.4A,
0.039ohm,2.5*2.0*1.2mm,100
8,3.8A,High Current
Inductor,Terminal Dedicated
1.0 PCS L800
137 10100175 Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-2A-0.1
15ohm-2.5*2.0*1.2mm
2.0 PCS L900, L901
138 10100475 Terminal Chip
Inductor,2.2uH,+/-20%,1.75A,
0.096ohm,2.5*2.0*1.2mm,1.8
A,include self-temperature rise
40degC,Terminal Dedicated
3.0 PCS L903, L904, L905
139 10100185 Mobile Dedicated,Chip
Inductor-2.2uH-+/-20%-0.97A-
0.19ohm-2.5*2.0*1.0mm
2.0 PCS L1210, L5604
140 10100051 Mobile Dedicated,EMI beads,
600ohm+/-25%,0.2A,0.65ohm,
0402,BT,Terminal Dedicated
11.0 PCS L1502, L1910, L3101,
L3102, L3105, LB600,
LB601, LB602, LB603,
LB604, LB605
141 10100147 SMT Power
Inductors,22uH,20%,0.42A,0.7
56ohm,3*3*1.2mm,Terminal
1.0 PCS L1600
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 81 of 187
No. Part Number Name Quantity Position
Dedicated
142 10100473 Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-1.9A-0
.117ohm-2.5*2.0*1.2mm-Term
inal Dedicated
2.0 PCS L1601, L1803
144 10100038 Terminal Chip
Inductor,0.015uH,+/-5%,0.3A,
0.5ohm,0402,2300000000Hz,
Multilayer inductor,Terminal
Dedicated
3.0 PCS L1804, L1805, L1806
145 10100353 Terminal Chip
Inductor,1uH,+/-30%,3.0A,0.0
59ohm,2.5*2.0*1.2mm,Termin
al Dedicated
1.0 PCS L1901
146 10100328 Terminal Chip
Inductor,1uH,+/-30%,1.58A,0.
102ohm,2.5*2.0*1.2mm(comp
atible with
2.4*2.4*1.2mm),Terminal
Dedicated
3.0 PCS L3103, L3230, L5605
148 10100053 Terminal Power
Inductor,4.7uH,20%,0.49A,0.8
97ohm,0805,0.275A,Terminal
Dedicated
1.0 PCS L4001
149 10100168 Special Inductor and
Bead,Power
Inductor,4.7uH,-+/-20%,0.8A,0
.18ohm,2.5*2.0*1.2mm,25MH
z,Terminal Dedicated
1.0 PCS L4002
151 10100119 Terminal Chip Inductor,
0.0062uH,+/-5%,0.15A,0.44oh
m,0201,EAR99.Chip Inductor
1.0 PCS L4402
152 10100116 Mobile Dedicated,Chip
Inductor-0.0047uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated
2.0 PCS L4501, L4502
154 10100127 Mobile Dedicated,Chip
Inductor-0.018uH-+/-5%-0.1A-
0.9ohm-201
3.0 PCS L4603, L5313, L5801
155 10100079 Terminal Chip
Inductor,0.039uH,+/-5%,0.2A,
0.6ohm,1.19*0.64*0.66 max
mm-2100000000Hz,wire
wound inductor
1.0 PCS L4605
156 10100124 Mobile Dedicated,Chip 2.0 PCS L4606, L5306
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 82 of 187
No. Part Number Name Quantity Position
Inductor-0.01uH-+/-5%-0.15A-
0.63ohm-201-TS16949-Termin
al Dedicated
157 10100118 Mobile Dedicated,Chip
Inductor-0.0056uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated
3.0 PCS L5301, L5303, L5804
159 10100117 Mobile Dedicated,Chip
Inductor-0.0051uH-+/-0.3nH-0.
15A-0.4ohm-201
1.0 PCS L5304
160 10100128 Mobile Dedicated,Chip
Inductor-0.022uH-+/-5%-0.1A-
1.2ohm-201-TS16949-Termina
l Dedicated
2.0 PCS L5307, L5314
165 10100033 Mobile Dedicated,chip
Inductor,10nH+/-5%,0.45ohm,
0.2A,0402,Terminal Dedicated
1.0 PCS L5315
166 8070749 SMD Ceramic
Capacitor-25V-0.0047nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS L5317
169 10100280 Mobile Dedicated,Chip
Inductor-0.18uH-+/-5%-0.1A-3
.8ohm-1.0*0.5*0.55mm-0402-
500000000Hz-Terminal
Dedicated
1.0 PCS L5603
170 10100350 Mobile Dedicated,Chip
Inductor-0.47uH-+/-30%-1.6A-
0.075ohm-2.0*1.6*1.0mm-Ter
minal Dedicated
1.0 PCS L5606
171 10100122 Mobile Dedicated,Chip
Inductor-0.0082uH-+/-5%-0.15
A-0.55ohm-201-TS16949-Ter
minal Dedicated
1.0 PCS L5607
174 10100150 ZD Dedicated Inductor and
Bead,EMI
Bead,330ohm@100MHZ,25%,
1.5A,0.08ohm,0603,Terminal
Dedicated
1.0 PCS LB1201
175 10070019 EMI
beads,+/-25%,1000ohm,1.25oh
m,0.25A,0402
7.0 PCS LB1601, LB1602, LB1603,
LB1604, LB1605, LB2201,
LB2204
177 10100507 Terminal EMI
beads,220ohm,25%,3A,0.04oh
m,0805,@30~500M
1.0 PCS LB1900
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
Impedance>120ohm,Terminal
Dedicated
178 10100184 Terminal EMI
beads-1800ohm-25%-0.2A-2.2
ohm-0402-Terminal Dedicated
3.0 PCS LB2205, LB2206, LB2207
179 10100075 Mobile Dedicated,Chip
Inductor-0.0062uH-+/-0.2nH-0.
7A-0.09ohm-1.19*0.7*0.66
max
mm-4800000000Hz-Terminal
Dedicated
1.0 PCS LB5802
180 15020235 LED,240cd,white,500mA,Ter
minal Dedicated,Flash LED
1.0 PCS LED1801
182 15060238 MOSFET,N
Channel,20V,0.7A,530mohm,6
V,SC,75
6.0 PCS Q2101, Q4301, Q4302,
Q5100, Q5101, Q5102
184 7092269 Chip Thick Film
Resistor-0.05W-1800ohm-+/-1
%-0201(0.6*0.3*0.23mm)-Ter
minal Dedicated
1.0 PCS R300
185 7092050 Chip Thick Film
Resistor-0.05W-200ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated
1.0 PCS R301
186 7091300 Chip Thick Film
Resistor-0.05W-6040ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
3.0 PCS R302, R303, R304
188 7091298 Chip Thick Film
Resistor-0.05W-4700ohm-+/-1
%-0201-Terminal
Dedicated-Terminal Dedicated
9.0 PCS R1101, R2104, R2105,
R2113, R3011, R3014,
R3198, R3199, R400
190 7091150 Chip Thick Film
Resistor-0.05W-22ohm-+/-5%-
0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1.0 PCS R405
191 7091161 Chip Thick Film
Resistor-0.05W-2000ohm-+/-5
%-0201-Terminal
Dedicated-Terminal Dedicated
4.0 PCS R1812, R1813, R406, R407
192 7091172 Chip Thick Film
Resistor-0.05W-22000ohm-+/-
1%-0201-Terminal
14.0 PCS R1004, R500, R501, R502,
R503, R504, R505, R506,
R507, R508, R509, R510,
D2 Maintenance Manual INTERNAL
2013-04-09 Huawei confidential. No spreading without permission. Page 84 of 187
No. Part Number Name Quantity Position
Dedicated-Terminal Dedicated R511, R5306
193 7092051 Chip Thick Film
Resistor-0.05W-240ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated
4.0 PCS R512, R513, R514, R515
194 7091159 Chip Thick Film
Resistor-0.05W-1000ohm-+/-5
%-0201-ELOM,TS16949
15.0 PCS R1311, R2135, R2136,
R4301, R4310, R4311,
R4601, R5124, R516, R517,
R518, R519, R5309, R5311,
R5313
196 7090800 Chip Thick Film
Resistor-0.0625W-0ohm-<
50mohm-0402-1A-BT
18.0 PCS R1102, R1103, R1502,
R1943, R2101, R2102,
R2142, R2268, R2269,
R5000, R5001, R5010,
R5100, R5102, R5301,
R5302, R5650, R702
198 7091408 Chip Thick Film
Resistor-0.05W-68000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS R1008, R900
199 7090875 Chip Thick Film
Resistor-0.0625W-100000ohm-
+/-1%-0402
1.0 PCS R901
200 7092053 Chip Thick Film
Resistor-0.05W-1000000ohm-
+/-1%-0.6mm*0.3mm*0.23mm
-Terminal Dedicated-Terminal
Dedicated
2.0 PCS R3109, R902
201 7090823 Chip Thick Film
Resistor-0.0625W-180000ohm-
+/-1%-0402
1.0 PCS R903
202 7091256 Chip Thick Film
Resistor-0.05W-33ohm-+/-5%-
0201-Terminal
Dedicated-Terminal Dedicated
3.0 PCS R5626, R907, R908
203 7091246 Chip Thick Film
Resistor-0.05W-100000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated
17.0 PCS R1105, R1633, R1637,
R1929, R1933, R1935,
R2106, R2187, R2264,
R3230, R3299, R4315,
R5115, R5116, R5139,
R5140, R5153
204 7091405 Chip Thick Film
Resistor-0.05W-56000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R1002
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
205 7091169 Chip Thick Film
Resistor-0.05W-10000ohm-+/-
5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
20.0 PCS R1010, R1011, R1514,
R1639, R1640, R1808,
R1809, R1910, R1917,
R1921, R2012, R3104,
R3121, R3140, R3195,
R3197, R4014, R4101,
R4203, R5109
206 7091350 Chip Thick Film
Resistor-0.0625W-1500ohm-+/
-1%-0402-BT
1.0 PCS R1020
207 7091378 Chip Thick Film
Resistor-0.0625W-27400ohm-
+/-1%-0402
1.0 PCS R1021
208 7091301 Chip Thick Film
Resistor-0.05W-10000ohm-+/-
1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
5.0 PCS R1104, R1939, R1940,
R3008, R5312
210 7091175 Chip Thick Film
Resistor-0.05W-100000ohm-+/
-5%-0201-Terminal
Dedicated-Terminal Dedicated
6.0 PCS R1226, R1231, R1505,
R1512, R1901, R1947
211 7091380 Chip Thick Film
Resistor-0.0625W-39200ohm-
+/-1%-0402
1.0 PCS R1232
212 7090858 Chip Thick Film
Resistor-0.0625W-2000000oh
m-+/-1%-0402
1.0 PCS R1302
213 7091783 Chip Thick Film
Resistor-0.2W-0.01ohm-+/-1%
-0603
1.0 PCS R1303
216 7091155 Chip Thick Film
Resistor-0.05W-100ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated
7.0 PCS R1309, R1310, R4308,
R5118, R5119, R5122,
R5123
217 7090796 Chip Thick Film
Resistor-0.0625W-18000ohm-
+/-5%-0402
1.0 PCS R1312
218 7090810 Chip Thick Film
Resistor-0.0625W-2200ohm-+/
-1%-0402-ELOM
1.0 PCS R1501
219 7091393 Chip Thick Film
Resistor-0.0625W-301000ohm-
+/-1%-0402
1.0 PCS R1603
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
220 7091389 Chip Thick Film
Resistor-0.0625W-91000ohm-
+/-1%-0402
1.0 PCS R1604
221 7091395 Chip Thick Film
Resistor-0.0625W-392000ohm-
+/-1%-0402
1.0 PCS R1611
222 7091148 Chip Thick Film
Resistor-0.05W-10ohm-+/-5%-
0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS R1638, R4103
225 7092272 Chip Thick Film
Resistor-0.05W-180ohm-1%-0
201(0.6*0.3*0.23mm)-Termina
l Dedicated
1.0 PCS R1907
227 7091174 Chip Thick Film
Resistor-0.05W-51000ohm-+/-
5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
5.0 PCS R2005, R2402, R4001,
R4002, R4003
228 7090867 Chip Thick Film
Resistor-0.0625W-10000ohm-
+/-1%-0402-BT
1.0 PCS R2013
229 7091374 Chip Thick Film
Resistor-0.0625W-20000ohm-
+/-1%-0402-TS16949
1.0 PCS R2103
230 7091162 Chip Thick Film
Resistor-0.05W-2200ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
3.0 PCS R2120, R2121, R5026
231 7091404 Chip Thick Film
Resistor-0.05W-180ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated
2.0 PCS R2204, R4706
232 7091153 Chip Thick Film
Resistor-0.05W-51ohm-+/-5%-
0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
12.0 PCS R2240, R2241, R2242,
R4007, R4008, R4010,
R4020, R4309, R4312,
R4313, R4710, R5511
233 7091166 Chip Thick Film
Resistor-0.05W-5100ohm-+/-5
%-0201-/
2.0 PCS R2401, R4603
237 7091384 Chip Thick Film
Resistor-0.0625W-51000ohm-
1.0 PCS R3128
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
+/-1%-0402
238 7090892 Chip Thick Film
Resistor-0.0625W-30000ohm-
+/-1%-0402
2.0 PCS R3129, R3242
239 7090798 Chip Thick Film
Resistor-0.0625W-22000ohm-
+/-1%-0402
1.0 PCS R3241
240 7091151 Chip Thick Film
Resistor-0.05W-30ohm-+/-5%-
0201-Terminal
Dedicated-Terminal Dedicated
6.0 PCS R4005, R4011, R4012,
R4205, R4206, R4707
241 7091146 Chip Thick Film
Resistor-0.05W-4.7ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R4102
242 7091247 Chip Thick Film
Resistor-0.05W-2.2ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R4106
244 7091176 Chip Thick Film
Resistor-0.05W-121000ohm-+/
-1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
2.0 PCS R1000, R4307
245 7090850 Chip Thick Film
Resistor-0.0625W-12100ohm-
+/-1%-0402
1.0 PCS R4502
246 7091017 Chip Thick Film
Resistor-0.05W-560ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R4602
248 7091280 Chip Thick Film
Resistor-0.0625W-604000ohm-
+/-1%-0402
1.0 PCS R4703
249 7090829 Chip Thick Film
Resistor-0.0625W-47000ohm-
+/-1%-0402
1.0 PCS R4711
250 7091168 Chip Thick Film
Resistor-0.05W-6200ohm-+/-1
%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R5012
251 7091394 Chip Thick Film
Resistor-0.0625W-330000ohm-
+/-1%-0402
1.0 PCS R5013
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
252 7092168 Chip Thick Film
Resistor-0.0625W-39000ohm-
+/-1%-0402(1.0*0.5*0.35mm)-
Terminal Dedicated
1.0 PCS R5016
253 7091139 Chip Thick Film
Resistor-0.0625W-5.1ohm-+/-5
%-0402
2.0 PCS R5126, R5127
254 7091250 Chip Thick Film
Resistor-0.05W-12000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R5143
257 7091173 Chip Thick Film
Resistor-0.05W-47000ohm-+/-
5%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R5602
258 7091299 Chip Thick Film
Resistor-0.05W-30000ohm-+/-
1%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R5637
259 7050106 NTC-220000ohm-NTC-0402-1
.0*0.5*0.5mm-Terminal
Dedicated
1.0 PCS RT1801
260 7050063 NTC-150000ohm-SMT-0402-
Terminal Dedicated
1.0 PCS RT4701
261 7040075 Varistor-18V-14V-10A-40V-S
MT-0402-Terminal Dedicated
1.0 PCS RV1900
262 16100067 Tact
Switch,SPDT,DC,SMT,0.4mm,
5.65*3.5*0.9,5000,Terminal
Dedicated
1.0 PCS S2102
263 10100527 Terminal Common Mode
Inductor,28ohm,+/-20%,5V,0.1
A,
2.5ohm,03025,0.85*0.65*0.45(
mm),TAIYO YUDEN
12ohm@100M;TDK
35ohm@100M,Terminal
Dedicated
8.0 PCS T1801, T1802, T1803,
T1804, T1805, T1806,
T1807, T1808
264 10100331 Terminal Common Mode
Inductor,40ohm,+/-25%,5V,0.1
A,1.625ohm,1.25*1.0*0.5(mm)
,Terminal Dedicated
1.0 PCS T1901
265 10100564 Terminal Com-mode
Inductor,45ohm,+/-25%,5V,0.1
A,2.5ohm,0504,1.25mm*1.0m
1.0 PCS T1902
D2 Maintenance Manual INTERNAL
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No. Part Number Name Quantity Position
m*0.65mm,USB D+/D-
Application
266 12070038 Temperature Compensated
Oscillator,26MHz,+/-1.5ppm(
max),+1.8V,+/-0.5ppm(max),-4
0degC,85degC,Terminal
Dedicated
2.0 PCS TCXO1001, TCXO5601
270 35020171 Consumption
Chip,Hi3620GFCV111G15,FC
CSP
576,1.1/1.2/1.8/2.6/3.3V,Appli
cation processor
1.0 PCS U300
271 40020229 DDR2 DRAM,16Gb
LPDDR2,533MHz,32bit,1.8V/
1.2V,216BALL
FBGA(POP),D2
Dedicated,Terminal Dedicated
1.0 PCS U300_POP
272 39200279 Dedicated Terminal
IC,CDMA2000 1*Digital
Baseband
Processor(QSC6085-1),
Support EV-DO rev.A and
S-GPS,3.0/3.6V/4.2/5.0V,BGA
424(Pb-Free),Terminal
Dedicated
1.0 PCS U700
273 39110780 Switching Regulators-DC/DC
buck for
GPU-2.5V-5.5V-4000mA-2.5
MHz-CSP16-Terminal
Dedicated
1.0 PCS U800
274 35020158 Consumer
Chips-Hi6421GFCV231-FCCS
P189-1.8/3.3/4.2V-K3 PMU
and Codec chip
1.0 PCS U900
275 40060453 NAND FLASH,32GB EMMC
V4.41,52MHz,1024KB,3.3V,F
BGA169(Pb-Free),D2
Dedicated,Terminal Dedicated
1.0 PCS U1101
276 38020077 Analog Switch,one input one
output Load
switch,1.1V~3.6V-1.8Vinput,<
55mohm;1.2Vinput,<90mohm,
WLCSP4,Terminal Dedicated
2.0 PCS U1102, U3203
277 39080180 Operation Amplifier,Audio
Power
Amplifier,2.5V~5.5V,Differenc
ial,Micro SMD
1.0 PCS U1201
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No. Part Number Name Quantity Position
16pin(WLCSP),Terminal
Dedicated
278 39070073 -0.3~2.75V,Battery
Gauge,SON,Terminal
Dedicated
1.0 PCS U1301
280 39080124 Operation
Amplifier,Headphone Audio
Power Amplifier,2.3 V to 5.5
V,differential AB
Amplifier,QFN,Terminal
Dedicated
1.0 PCS U1501
281 39110626 Switching
Regulators-Vin~38V-0.02A-Q
FN-2*2-SMT-2*2-10 LED
Driver, Terminal Dedicated
1.0 PCS U1600
282 39110636 Switching
Regulators-ThinQFN-LCD
Driver-Terminal Dedicated
1.0 PCS U1601
283 39110620 Power Driver,1.5A LED flash
driver IC,CSP,Terminal
Dedicated
1.0 PCS U1800
284 39070149 Battery Management IC-charge
IC-buck-3A input
ability-3.9V-6.5V-QFN-24-OT
G-Terminal Dedicated
1.0 PCS U1901
285 38020043 Analog
Switch,DPDT,3.0~3.6V,6.5oh
m,550MHz,Terminal
Dedicated
1.0 PCS U1902
286 38020071 Analog Switch,double-pole,
triple throw (DP3T)
multiplexer,2.5V-4.5V,<6.6oh
m,1470MHz,QFN12,Terminal
Dedicated
1.0 PCS U1905
287 33030026 Temperature
Sensor,-40~+125degC,1.4V~2.
75V,Digital
Output,+/-1degC,DFN,60000us
,NA,12bit,IIC,Terminal
Dedicated
1.0 PCS U2001
288 38140103 Semiconductor Sensor,three
axis
gyroscope,LGA-16,Terminal
Dedicated
1.0 PCS U2003
289 38140098 Semiconductor 1.0 PCS U2004
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No. Part Number Name Quantity Position
Sensor,Accelerometer,LGA,3a
xis,Terminal Dedicated
290 38140069 Semiconductor
Sensor,E-Compass,WLCSP(Pb
-free),3axis,Terminal
Dedicated
1.0 PCS U2005
291 38020072 Bi-directional,4PDT,
1.65-4.3V ,Rond(max)<12ohm
;Ronv<0.7ohm-160MHz-UML
P, Terminal Dedicated
3.0 PCS U2101, U2102, U2109
292 36020419 CMOS,Dual
Reverse,QFN,33.6ns,20mA,C
MOS,CMOS, Terminal
Dedicated
1.0 PCS U2111
293 39080185 Operation Amplifier, Linear
Motor
Driver,2.5~5.5V,Differential, 9
Ball 0.5mm Pitch
WCSP,Terminal Dedicated
1.0 PCS U2203
294 43110067 AUDIO Chip,2 digital
microphones/4 Digital Audio
Ports (PCM/I2S)/Voice
equalization,BGA32, Terminal
Dedicated
1.0 PCS U3000
295 38020046 DUAL
SPDT,2.7-4.2V,0.6ohm,16MH
z,QFN10L,Terminal Dedicated
2.0 PCS U3001, U3002
296 43090148 VIDEO Chip,49
VFBGA,1.2V/1.8V/3.3V,HDM
I&USB 2in1,1080p/60Hz,
Terminal Dedicated
1.0 PCS U3101
297 39110548 LDO-3.3V-2%-0.15A-SC70-5-
Terminal Dedicated-Terminal
Dedicated
1.0 PCS U3104
298 39110756 Switching Regulators,DC/DC
buck,2.5V~5.5V,Voadj,1.2A,D
FN/QFN
2.0 PCS U3105, U3204
299 38020074 Analog Switch,one input one
output load
switch,1.4V~5.5V,60mohm,W
LCSP, Terminal Dedicated
2.0 PCS U4001, U5001
300 40060417 MCP,1Gb(64Mx16) NAND
FLASH,23MHz,128KB,1.8V,1
30ball
BGA(Pb-free),256Mb(16Mbx1
1.0 PCS U4201
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No. Part Number Name Quantity Position
6) DDR 200MHz,Terminal
Dedicated
301 12070055 Temperature Compensated
Oscillator,19.2MHz,+/-2.5ppm,
2.8V,+/-2.0ppm,-30degC,85de
gC,Terminal Dedicated
1.0 PCS U4302
302 47100136 Power Module,824~
849MHz,27dB(High
Gain)/17dB(Low Gain),M9
3*3mm
1.0 PCS U4700
303 47050047 RF coupler,823
MHz~925MHz,19.40 +/- 1.00
dB,32dB,0402,Terminal
Dedicated
1.0 PCS U4702
304 39200454 Terminal Baseband process
IC,GSM/GPRS BASEBAND
PROCESSOR
MT6252D,1.2V/1.8V/2.8V,TF
BGA-350,Terminal Dedicated
1.0 PCS U5000
305 36020366 CMOS,4BIT Level Shifter
With Automatic Direction
Sensing,WLCSP(Pb-free),7.4ns
,50mA,CMOS,CMOS,Termina
l Dedicated
1.0 PCS U5100
306 47150231 RF Multi-Functional
Device,QUAD-BAND
Tx/DUAL-BAND Rx
GSM/GPRS
TxM,824~849/880~915/1710~
1785/1850~1910MHz,QFN,Ter
minal Dedicated
1.0 PCS U5301
307 13080106 Duplexer,1565~1607MHz/240
0~2500MHz,0.8dB./0.9dB.,13d
B./18dB,1608,Terminal
Dedicated
1.0 PCS U5400
308 47140114 RF
Switch-20~6000MHz-SPDT-0.
65dB
max.-1.43-22dB.-QFN-Termin
al Dedicated
1.0 PCS U5501
309 47140113 RF
Switch-100~3500MHz-SP3T-0
.65dB max. at
2400~2500MHz-1.29 at
2450MHz-32dB.-QFN-Termin
al Dedicated
2.0 PCS U5502, U5504
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No. Part Number Name Quantity Position
310 39210059 Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949
1.0 PCS U5603
311 47090053 RF LNA,1575MHz,14dB
min.,1.6dB
max.,SOT886,Terminal
Dedicated
1.0 PCS U5801
312 36020404 LVCMOS,4 BIT bidirectional
voltage level translator with
automatic sensing,
QFN12,13.5ns,50mA,CMOS,C
MOS,0ns,0ns,0ns
1.0 PCS U6501
313 12020125 Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949
2.0 PCS X1000, X5000
314 12020202 Crystal
Oscillator,0.032768MHz,7pF,+
-20ppm,70000ohm,3.2*1.5,Ter
minal Dedicated
1.0 PCS X4301
315 12020268 Crystal
Oscillitor,26MHz,7.5pF,+/-10p
pm,30ohm,3225,Terminal
Dedicated
1.0 PCS X5301
316 15040385 Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN16-Terminal Dedicated
1.0 PCS Z1601
317 15040384 Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN10-Terminal Dedicated
1.0 PCS Z1602
318 13010147 SAW
Filter-881.5MHz-2.2dB-00241
564-Terminal Dedicated
1.0 PCS Z4501
319 13010174 SAW
Filter-836.5MHz-2.1dB-1.4*1.
1mm-Terminal
Dedicated-TS16949
1.0 PCS Z4700
320 13010188 SAW
Filter-942.5MHz-2.1-1.4mm*1
.1mm-Terminal Dedicated
1.0 PCS Z5301
321 8071219 SMD Ceramic
Capacitor-10V-100nF-+/-10%-
X5R-0201-Terminal Dedicated
12.0 PCS C1246, C300, C5019, C5020,
C5021, C5022, C5023,
C5024, C5025, C5026,
C5806, C5809
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No. Part Number Name Quantity Position
322 13010258 SAW
Filter-1842.5MHz/1960MHz-2.
8dB/3.0dB-50V-1814-Terminal
Dedicated
1.0 PCS Z5302
323 13010189 SAW
Filter-897.5MHz-2.7dB-SFLT5
-0101-Terminal Dedicated
1.0 PCS Z5303
324 13030067 Ceramic
Filter,2450MHz,1.8dB,20125,T
erminal Dedicated
2.0 PCS Z5401, Z5501
325 13030061 Ceramic
Filter,5375MHz,1.7dB,SMD
1.0 PCS Z5502
326 13010264 SAW
Filter-1590.16MHz-1.8dB-50V
-1411-Terminal Dedicated
2.0 PCS Z5801, Z5802
327 22050075 Microphone,-42dB.,3.76*2.95*
1.1mm,silicon
1.0 PCS MIC1402
328 7091177 Chip Thick Film
Resistor-0.05W-180000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated
1.0 PCS R1001
329 13080068 Duplexer-TX:824MHz~849M
Hz/RX:869MHz~894MHz-1.5
dB.-2dB.-48dB./56dB.-2.5*2.0
*0.95-Terminal Dedicated
1.0 PCS Z4401
330 05020YXR Board
Software,HDD2-2010M,HDD2
-2010M01B,D2-2010 Handset
Software,Program,China(QSC6
085)
1.0 PCS U4201
331 05020YXM Board
Software,HDD2-2010M,HDD2
-2010M01A,D2-2010 Handset
Software,Program,China(K3V2
+QSC6085 + MTK6252D)
1.0 PCS -
332 10100017 Terminal EMI
beads-470ohm-+/-25%-0.5A-0.
21ohm-0603-BT,TS16949-Ter
minal Dedicated
2.0 PCS LB1202, LB1203
The component list is for your reference only and subject to changes without notices. The latest
component list is available in Huawei's ITEM information system. If you have any questions, contact
your local technical support.
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5 Software Upgrade
5.1 Preparing for the Upgrade
Table 5-1 Upgrading the Software
Category Description Remarks
Upgrade
environment
Computer Operating system: Windows 2000/Windows
XP/Win7
Battery Remaining power > 20%
Upgrade file update.app This version is provided for reference only. Use the
latest version when upgrading the software.
Upgrade using the USB
port
Normal upgrade
Forcible upgrade
5.2 Installing the Driver
Before upgrade, install the driver: connect the phone to the PC and switch the working mode of the USB
port to Normal (#*#2846579#*#* -> Engineering menu -> Background setting -> USB port mode ->
Normal) to see if the adb port can be found.
If you can find the adb port, ignore the following step.
If you cannot find the adb port, install the following driver.
Handset WinDriver.exe
5.3 Installing the Driver
There are two upgrade portals:
After turning on the phone, make sure the working mode of the USB port has been switched to Normal
(#*#2846579#*#* -> Engineering menu -> Background setting -> USB port mode -> Normal), then use
upgrade tool to conduct upgrade.
Disconnect the phone from the power socket. Press the volume key and connect the phone to a USB cable,
and the phone will be forced into USB upgrade mode, then use the upgrade tool to implement USB
upgrade.
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5.4 Login Tool
Password: Huawei
5.5 Configuration Tools
Select Allow upgrade for the second time
Select Firmware and select UPDATE.APP
Select Please Choose The Configuration File
Select the following configuration files (Configuration files are provided by the device).
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The configuration interface is displayed as follows.
Then enter the upgrade interface.
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5.6 Start Upgrade
Click Scan & Download to implement upgrade.
This upgrade mode will erase user data.
5.7 Other Upgrade Modes
1. Automatic, easy, and fast online HOTA system firmware update. Restoring the phone to default
settings.
2. Local upgrade: Recover the update.app file in the local storage device. You can copy the upgrade file
to the phone through the MTP mode: Connect the phone to a computer, click the Media device (MTP), and then open the device on the computer.
3. USB update can be realized through software in a connected USB device. The update files are stored
in the dload folder in the root directory of the SD card.
NOTE
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See the following figure and click Icon setting > About the device.
6 Repair Tools
Name: constant-temperature heat gun
Usage: heats components
Name: soldering iron
Usage: solders components
Name: DC regulated power supply
Usage: supplies power
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Name: soldering table
Usage: secures the PCBA
Name: lead-free tin solder wire
Usage: solders components
Name: digital multimeter
Usage: measures parameters during maintenance
Name: toolkit
Usage: assembles and disassembles the U9508
Name: electric screwdriver
Usage: fastens and removes screws
7 Disassembly Procedure
7.1 Disassembly Preparation
Disassembly tools: ESD-preventive gloves and wrist strap, pry bars, pry boards (homemade), tweezers,
four-angle screwdrivers, hexagon screwdrivers, and the cutting knives.
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7.2 Disassembly Procedure (Read the Notes to Save Workload)
The disassembly of this phone is complex and hard to explain in traditional ways. The following figures are used to
illustrate the disassembly procedure. The numbers in the figures do not indicate the disassembly sequence. The left
procedure is prior to the right procedure. All the left procedures are necessary to their next procedure. The up procedure
is not necessarily prior to the bottom procedure. For example, if you want to remove the silicon pads of the
photoreceptor, implement only procedure 1, 3, 5, 10 + 11 + 12 + 13, 16, 19, 23 and ignore the others.
7.2.1 Removing the Battery Cover
1. Insert the cutting knife between the battery cover and A cover and separate them in the direction
shown in the figure.
NOTE
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2. Remove the battery cover slowly.
7.2.2 Removing the SIM Card Component
1. Use the tweezers to press the SIM card lever to release the SIM card component.
2. After the SIM card component is released, hold the component and pull it out.
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7.2.3 Removing Screws of Cover C
Four screws
7.2.4 Removing Motor Support Insulation Mylar.
7.2.5 Removing Cover C Components
1. Release the shielding cover from the latch of cover C with tweezers.
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2. Pry cover C from the front cover starting from the bottom right. There are seven latches as shown in
the figure.
3. Remove cover C slowly.
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7.2.6 Removing Motor Support Screws
1. Remove the screw at the top right of the support.
2. Remove the FPC from the connector.
Tweezer
3. Remove the FPC of the motor pad starting from top right. Remove the FPC of the motor pad from the
headset connector FPC.
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4. Remove the screw at the left bottom of the support.
7.2.7 Removing the Fixed Speaker Box Screw
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7.2.8 Removing the Primary Camera
Connector
Camera
7.2.9 Removing the Secondary Microphone Cover
Silicon case of the secondary microphone
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7.2.10 Removing Main Board Screws
7.2.11 Removing the Main Board Graphite Sheet
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7.2.12 Removing the conductive fabric of the LCD Connector
7.2.13 Removing the Side Button Connector Mylar
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7.2.14 Removing the Motor Support Component
7.2.15 Removing Speaker Box
1. Remove the speaker FPC connector from the main FPC.
2. Pry the speaker box off the phone starting from the battery side. Do not damage the battery.
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7.2.16 Removing the Main Board Component
1. Remove the power key, volume key, and FPC from the shielding cover. Then remove their male
connectors from the main FPC connector.
Stuck to the shielding
cover
ZIF connector
2. Remove the main FPC connector from the main board.
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Stuck to the shielding
cover
Main FPC connector
3. Remove the coaxial connector of the antenna and the male connectors of the USB-FPC, receiver-FPC,
LCD, and battery from the main board.
Receiver-FPC connector
USB-FPC connector
LCD connector
Coaxial cable connector of the antenna
Battery connector
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7.2.17 Removing Screws at the Left of the Earphone
7.2.18 Removing the Coaxial Connector at the Antenna PCB Side
7.2.19 Removing the TP-LCD Component
1. Remove the TP from the slot of the middle cover support.
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2. Heat the digital display heat gun to around 70ºC.
3. Use a sucker to remove the TP-LCD.
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7.2.20 Removing the Main FPC
1. Remove the main FPC from the battery slowly.
2. Insert a stick with a diameter equaling that of a headphone (≤ 3 mm) into the headphone jack and pry
the headphone component as shown in the figure.
3. Hold the headphone component and remove it from the front cover.
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7.2.21 Removing the Antenna PCB and Its Screws
Two screws
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7.2.22 Removing the Receiver Ornament
Speaker ornament
7.2.23 Removing the Silicon Pad of the Photoreceptor
Silicon pad of the photoreceptor
7.2.24 Remove the Magnesium Support of the Middle Cover
1. Remove the screws of the magnesium support of the middle cover.
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2. Try to make the front cover deform as shown by the red line. Then press the magnesium support at the
bottom against the TP-LCD to remove the support from the front cover.
7.2.25 Remove REC-FPC and Receiver
1. Pry the SMT-FPC photoreceptor of the receiver off the front cover.
2. Remove the receiver-FPC from the front cover.
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3. Remove the receiver from the front cover.
7.2.26 Remove the USB-FPC
1. Remove the USB-FPC screws.
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2. Remove the USB component and USB-FPC from the front cover.
7.2.27 Removing Side Key FPC and Side Keys
1. Remove the three screws of the side key FPC.
2. Remove the FPC, washers, inner side key assembly, and side keys.
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After the FPC is removed, the side keys and inner side key assembly can be taken out.
Pads
FPC
7.2.28 Remove the Battery.
1. Heat the front cover and then use the home-made pry board to pry the battery off the cover.
2. Insert the pry board ever deeper between the battery and the support until the battery is completely off
the front cover.
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7.2.29 Removing the Antenna Coaxial Cable
1. Use tweezers to release the coaxial cable from the latch.
Latch at the bottom of the battery compartment
2. Pull the coaxial cable out slowly from right to left.
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7.2.30 Removing the Main Microphone FPC
7.2.31 Removing the Motor
Pull the motor out of the motor support in the direction as indicated by the arrow.
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7.2.32 Removing the Earphone Sealing Ring
7.2.33 Removing the Speaker Sealing Ring
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7.3 Disassembly Panoroma
8 Assembly Procedure
8.1 Assembly Preparation
Assembly tools: ESD-preventive gloves and wrist straps, tweezers, four-angle screwdrivers, hexagon
screwdrivers, and cutting knives.
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8.2 Assembly Procedure (Read the Notes to Save Workload)
The assembly of this phone is complex and hard to explain in traditional ways. The following figures are used to
illustrate the assembly procedure. The numbers in the figures do not indicate the disassembly sequence. The left
procedure is prior to the right procedure. All the left procedures are necessary to their next procedure. The up procedure
is not necessarily prior to the bottom procedure. In addition, many components are one-off products in phone
maintenance. New components are needed in assembly.
8.2.1 Installing the Front Cover Components
1. Install the power and volume keys.
a. Install the power and volume keys b. Install the inner side key assemblies.
NOTE
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c. Install the dome pad. d. Install the side key FPC and
screw the assemblies.
2. Install the receiver.
a. Install the REC
component
b. Install the REC FPC.
c. Install the silicon pad
of the sensor
3. Install the water-proof USB assemblies.
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a. Install the water-proof USB coilb. Install the USB
assembly and
screw it.
4. Install the magnesium middle frame.
a. Install the middle cover
Start from
this side.
b. Snap the latch
c. Screw the middle cover
(seven screws in total)
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8.2.2 Installing the TP-LCD Assemblies
a. Stick the TP adhesive
Clean the front cover and the
TP with alcohol before sticking
b. Remove the
release paper.
c. Install the TP-LCD.
d. Install the TP and press it tight.
e. Stick the LCD FPC
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8.2.3 Installing the Shielding Cover of the Main Board
a. Shielding cover 1 and 2
Shielding cover 1 Shielding cover 2
b. Shielding cover 3 and 4
Shielding cover
3
Shielding cover
4
8.2.4 Installing the Camera
a. Install the primary camera b. Install the secondary camera
8.2.5 Installing the Secondary Microphone Sheath
a.Install the secondary microphone sheath.
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8.2.6 Installing the Main Board
a. Install the main board b. Install the TP, USB,
REC, and FPC assemblies
c. Screw the assemblies
8.2.7 Installing the Antenna Board
a. Connect the antenna mini-board
to the coaxial cableb. Install the coaxial cable
The coaxial cable here should be under the latch.
The coaxial cable here should be away from the right screw hole to avoid being damaged while installing cover C.
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8.2.8 Installing the Battery
a. Remove the release
paper of the battery
b. Install the battery and
snap it to the slot.
8.2.9 Installing the Main Microphone
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8.2.10 Installing the Motor, Main FPC, and the Speaker Box
a. Install the water-proof pad of the headphone
b. Install the headphone
Tilt the headphone assembly 30 degrees and install it slowly, then latch it.
c. Install the motor
d. Screw the headphone
holder (two screws)
e. Install the water-proof
pad for the speaker box
f. Install the speaker box.
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g. Screw the speaker box and the motor (two
screws for the speaker box, one for the motor)
h. Install the speaker box and the main
microphone ZIF connector.
8.2.11 Connecting the ZIF Connector of the Main FPC with the Side Key FPC
a. Stick the side key FPC to the shielding cover
Glued to the shielding cover.
ZIF connector
b. Connect the side key FPC ZIF to the
ZIF connector of the main FPC.
c. Install the side key connector mylar
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8.2.12 Sticking the Conductive Fabric and Graphite Sheet to the Main Board
a. Stick conductive fabric of the main board
Stick the fabric using this angle as the locating basis.
b. Stick the graphite sheet
8.2.13 Installing Cover C
a. Install latches of cover C
1. Install latch1 and latch2 first 2. Install latch3 and latch and avoid the latches from deforming
b. Screw cover C (four screws)
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8.2.14 Installing the Battery Cover
a. Remove the release paper of the battery backplane assembly.
b. Install the battery cover
Before install the battery cover, clean the front cover with alcohol for example.
Press the battery cover tight.
9 Troubleshooting Common Faults
Before repairing a phone, ensure that the failure of the phone is not caused by environmental factors or
incorrect functional settings,
and it is recommended that you restore the phone to its default settings.
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9.1 Working Principles of the Phone
Figure 9-1 Schematic Diagram of Circuits
Hi3620
KEYPAD
BT GPS
USB 2.0 Device
SPI0
SDIO1
UART4 UART3 UART0
KeyPad Controller
Audio Signal Processor
Mobile TV
USB 2.0 Host
MIPI DSI*2
HD TV
LPDDR2/DDR3
DDRC
eMMC 4.41 eMMC
Memory CardMMC/SD3.0
NAND FLASHNANDC
FM X-Sensor
DMA Controller
System Controller
CRG
SYSCtrl
Periph Ctrl
G2D/G3D GPU
MMU
Video Decoder
ARM Cotex A9 *4
ICache DCache
Video Encoder
IO CONF
1MB L2 Cache
HDMI
MIPI CSI*2
DVP
ISP
EDC
CSI/I2C
DVP/I2C
8*8
TMDS/DDC/CEC
I2S
PCM
BT Baseband
PMU_SPI
PMSPI
Hi6421
GPS Baseband
Hi6350
GPS/BT RF
BT/WiFi Switch
3G/4GModem
Baseband I/F
PCM
WiFi
RF TX RF RX
Charger IC
I2C0 I2C1
Trace
USB Disk
PC
PCI-E 1X South Bridge
LCD Panel 1
Camera2
Camera3
LCD Panel 2
Camera1
LPDDR2/DDR3
HSIC
SDIO0
SPI1
UART1
GPIO
Power
SIM JTAG
Debug
Audio
Headset
Speaker
MIC
Headset
Receiver
Vibrator
CapacitiveTP
Huawei D2-2010 is a bar-type smartphone with AP+MODEM structure and based on the K3 platform.
Powered by 1.5 GHz quad core ARM Cortex-A9 processor, D2 is equipped with two dual-channel
LPDDR2 ports, which improves the system performance.D2's hardware structure can be divided into three
parts: the AP subsystem, Modem subsystem and RF module.K3 (AP) processes input and output signals
(including image, video, and connectivity signals) and provides interfaces for the keyboard, LCD screen,
SD card, Bluetooth module, and cameras. HI6421, as the audio codec and power management unit, is
responsible for encoding and decoding audio. X-GOLD 626 is the modem and responsible for the RF
interfaces. RF engine is responsible for transmitting and receiving radiofrequency signals. BCM4330 is an
integrated chip that supports Bluetooth, Wi-Fi and FM. BCM 4751 is an integrated chip that receives and
processes GPS signals. The whole system is composed of the PCBA, external battery and mechanical parts.
The PCBA incorporates the main board, main FPC (HD1U9800DL), side key FPC (HD1U9800DK), REC
FPC(HD1U9800DR), and USB FPC (HD1U9800DU).Others include TP/LCD modules, 1.3/13 megapixel
HD camera modules, and motor/microphone/speaker/recording modules. Mechanical parts include B shell,
C shell, sound cavity, main antenna, GPS antenna, and Wi-Fi/Bluetooth antenna.
Figure 9-2 shows the hardware structure of D2.
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Figure 9-2 Hardware structure of D2
ISP & MMU_CFG
GPIO:RST/FSIN/CLK/FLASH_EN/PD
GPIO:Xsensor_INT
TPC_RST/INTPWM0/1
GPIO:ISP_I2C0/1
To MMU connector
Serial R array Serial R array Serial R array
PU
R
8*8Keybaordinterface
Serial R array
I2C0/1 MIPI_DSI0 MIPI_CSI0 MIPI_DSI1/CSI1
To MMU connector
1C
LK
lan
e
4C
LK
lan
e
1C
LK
lan
e
4C
LK
lan
e
1C
LK
lan
e
4C
LK
lan
e
Rbais=
6.04K_1%
Rbais=
6.04K_1%
Rbais=
6.04K_1%
D-PHY ESD D-PHY ESD D-PHY ESD
0R阻抗补偿 0R阻抗补偿 0R阻抗补偿
PCI-E 1XCLK±/TX±/RX±
PCI-E 1XConnector
100MHz_REF
TX&RX
TX/RX ESD
Rbais=
191ohm_1%
USB 2.0 HOST/Device
PICO_VBUS_DCT
PICO_ID
PICO_D+/D-
USB 2.0 HOST
NANO_VBUS_DCT
PICO_D+/D-
US
B
HO
ST
/D
EV
ICE
Co
nn
ecto
r
US
B H
OS
T
Co
nn
ecto
r
VBUSConfirmation
Circuit （charger DRV ）
ESDEMI
VBUSCharger ESD
ESD
ESDEMI
PICO_Rbais
NANO_Rbais
Rbais=200ohm_1%
Rbais=200ohm_1%
HD
MI
TM
DS
/D
DC
/C
EC
TM
DS
ES
D
DDC/CEC/HPDESD&LS
Rbais=5.5k_%
HD
MI
D C
on
nec
torE
MI
cho
ke
DDC_5VConfirmation
(charge pump)
From PMU
Mic
ro S
DC
on
nec
tor
MM
C/
SD
3.0
CL
K/
CM
D/
D0.
.3
SDR50DDR50 E
SD
PMU SPI
CLK & RST&AUDIO&SPI
SYS_CLK
RTC_CLK
RST
PWR_HOLD
BUCK0/1/3_EN
PMU_INT
GPIO_LREN
GPIO_CHARGER_EN
I2C1 for CHARGER
PMU I2S
BackupOssi
PowerAudio
Headset
SpeakerMIC
Headset
Receiver
Vibrator
Charger
Ser
ial
R a
rray
MODEM I/F
HSIC
SDIO0
SPI1
UART1
GPIO_72/73/74/78
HSICConnector
MO
DE
MC
on
nec
tor
Ser
ial
R a
rray
MODEM_EN
MODEM_RST
MODEM_PLED
MODEM_PD
UA
RT
4
BT_BB
BT_CFG/CLK/RST
BT_SPI
In_BT_PCM
In_BT_IOC
内/外置BT_BBPCM切换 R array
BW
GU
Co
nn
ecto
r
PMU codec
Ser
ial
R a
rray
GPS_BB
GPS_PD
GPS_SPI(UART3)
GPS_IOC
Ser
ial
R a
rray
WIFIWIFI_SDIO1
WIFI&BT 3线共存
BT_PRIO
BT_ACT
WIFI_ACTSer
ial
R a
rray
SPI0UART0 JTAG
Serial R array Serial R array Serial R array
I2C
Serial R array
外设扣板Connector
Bootmode
FAC/DFNBT/TEST modeSelector R
eMMC 4.41CLK/CMD/D0..7
eMMC
NAND FLASH
8b NANDCCE/ALE/CLE/RE/WE/
CS0..3/RB0..3/IO0..7
GP
IO:E
CC
_SE
L
Serial R on CLK
eMM
C_C
LK
eMM
C_dat
/cm
d
EC
C m
od
eS
elec
tor
R
NAND_D0~D7/ctrl
PU
R a
rray
ISP_8b Serial R
array
DMA Controller
System Controller
CRG
SYSCtrl
Periph Ctrl
G2D/G3D GPU
MMU
Video Decoder
ARM Cotex A9 *4
ICache DCache
Video Encoder
IO CONF
1MB L2 Cache
APU
By function, the PCBA can be divided into four subsystems: baseband (including the AP, modem, and BB),
RF, power, and user interfaces. Table describes the subsystems' modules, units, and their functions.
Table 9-1 Main Board System Structure
Subsystem Module Unit Function
Baseband
subsystem
K3 Application subsystem 45 nm fabrication, dual ARM9 processors,
supports the micro SD card and UART/SIM
card, incorporates functional modules, such
as the I2C, HIS, MIPI, GPIO, HDMI, Smart
reflex 2, and clocks.
User interface
processing unit
Provides camera, PCM, broadband codec,
RF, HKADC, LCD, micro SD card, USB,
UART, SIM card, HSI, MIPI, GPIO,
JTAG/ETM, and keypad interfaces.
Multimedia and game
engine
The multimedia and game engine runs MPEG
and JPEG hardware engines and game
engines, JAVA accelerator, and provides
MP3/MMS/MIDI functions.
QSC6085/
MT6252DA
Modem BB QSC6085(China Telecom): WCDMA
baseband module with low-consumption SIP
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Subsystem Module Unit Function
/ Balong technology. MT6252DA(China
Telecom):GSM baseband module. Balong BB
6920(China Mobile and China Unicom):
WCDMA/GSM 40nmbaseband module. The
subsystem include ARM processor, modem
DSP, interruption controller, and sleep
controller.
Modem PMU Supplies power to modem and BB, provides
reset function, two Switch-Mode Power
Supplies (SMPS) and eight LDO regulators.
Modem memory MCP (1G + 256M)
EMMC EMMC feature, power
consumption, file
system support
Stores programs and NV items, 4 GB
DDR RAM Power consumption RAM for program running, 2GB
RF subsystem Transmissio
n and
receiving of
WCDMA
and
GSM/DCS
Smartti-UE2 Performs the RF function of WCDMA signal
reception and transmission. Mainly includes
the RFMD RF chip, PMU, and the peripheral
circuit.
GPS GPS reception Receives and processes GPS signals, mainly
including Broadcom 4751 chip and its
peripheral circuit.
Bluetooth
interface
Bluetooth module Transmits and receives the Bluetooth
baseband function and RF signal. Mainly
includes the Bluetooth module of Broadcom
4330 and peripheral circuit.
Wi-Fi
interface
Wi-Fi Module Transmits and receives Wi-Fi baseband and
RF signals, mainly includes Wi-Fi module of
Broadcom 4330 and the peripheral circuit.
Crystal
oscillator
and
frequency
synthesizer
26 MHz TCVCXO
and control circuit
Generates the highly accurate, 26 MHz local
reference clock TCVCXO.
Antenna External antenna,
internal interface
component, antenna
protection
The phone uses internal antennas for wireless
communication, supporting WCDMA high
and low frequency bands. The VIVA phone
antennas include the main antenna,
Wi-Fi/Bluetooth antenna, and GPS antenna.
User interface
subsystem
UART
interface
The UART0 interface of the AP subsystem is
used for commissioning; the UART1 is used
for the modem module. UART2 is used for
audio denoising chip ES305. UART3 is used
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Subsystem Module Unit Function
for MediaTek (MTK). UART4 is used to
connect the four-in-one chip W1873.
USB port Driver, protection
circuit, output
interface component
Indicates the peripheral circuit of USB
interface in the AP, modem, and MHL
subsystems, and unit circuits such as
protection circuit and interface connectors. It
is the major data service channel for the
engineering sample, and can be used to debug
and test devices during product development.
SIM card
interfaces
Power supply,
protection circuit, SIM
card holder
Mainly includes the SIM card holder and
related connection circuits.
Color LCD
and
backlight
LCD driver, interface
mode, and backlight
control
Main display, 16.7 million colors
Speaker Driver mode,
connection mode,
speaker component
The power of the speaker that plays
polyphonic ringtones when there is an
incoming call can be 500 mW. Their
frequency response is good enough to
playback 20 Hz to 20 KHz ringtones
smoothly. They can also play mono-audio
MP3 files.
Receiver Driver mode,
connection mode,
receiver component
The power of the receiver for calls must be
less than 10 mW.
MIC Interface circuit,
connection mode,
microphone
component
Built-in microphone, with dual silicon
microphone noise reduction.
Earphone Earphone, headset
interface circuit,
microphone interface
circuit
The phone provides a headset jack to output
audio or MP3 audio. The microphone on the
headset cable picks up audio.
Vibration
motor
interface
Driver mode,
connection mode,
motor
When there is an incoming call, the motor
vibrates to notify the user of the call.
Acceleromet
er I2C interface control Senses acceleration to help realize game
functions.
Gyroscope I2C interface control Three-axial rate sensor
Compass I2C interface control Geomagnetic sensor
Proximity
sensor
I2C interface control Senses the ambient light and proximity light.
Power Internal
backup
Li-ion battery, Li-ion battery with standard output of 3.8
V/2900 mAh. It is required that the
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Subsystem Module Unit Function
subsystem battery interface component charge/discharge lifecycle is over 500 times.
The battery should pass the following
authentication: GB18287 safety requirements
(Li-ion battery)
External
power
supply
(travel
charger)
Adapter and interface
component
The charger can be used in China, Europe, the
USA, and Australia: 90–264 V, 47-63 Hz,
AC input. The model differs with different
markets. The output voltage of the charger is
5 ± 0.25 V. The charger passes certifications
such as the CE certification, China
Compulsive Certification, FCC, and A-tick
certification. The charger's output current
shall be adequate to charge the battery and
supply power to the phone for normal
operation at the same time.
Power
distribution
network and
power
management
Power distribution
network
Includes filtering networks and cabling for
the power supply.
Backup battery
management, charge
circuit, charge mode,
charge protection
It manages battery charging and discharging,
overcharging and over-discharging
protection, and also charges the capacitance
used for RTC current maintenance.
Board circuit power
management
(power-on/off
analysis)
Mainly indicates LDO, which manages power
supply flexibly. Based on the service status,
protocol requirements and power-saving
analysis, the board software manages power
supply to unit circuits on the board to reduce
power consumption. A 32 KHz sleep clock is
provided.
TWL1873
enhanced
functions
RTC The built-in RTC circuit uses a sleep clock of
32.768 KHz to provide precise time.
ADC Supports five 12 bit/10 bit/8 bit
programmable analog signal input.
Two I2C Interfaces Controls the camera.
UVLO Low-voltage power-off function. When the
input voltage is lower than the threshold for a
specific period, the phone powers off.
Overheat protection When the on-chip junction temperature
exceeds 150°C, the phone powers off.
Internal driver circuit Provides the LED driver, the LCD backlight
driver, one vibrator driver, and one speaker
driver.
UART High-speed UART1: 4 Mbit/s, low-speed
UART2: 115 Kbit/s
Interrupt management The built-in interrupt manager handles
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Subsystem Module Unit Function
interrupted signals.
USB driver D2 has a built-in OTG USB driver that
supports USB 2.0 HS and /B interface. Its
software supports the OTG function.
The following are maintenance schematics and reference drawings:
hc1c9800dm Front and Back board Drawings.rar
hc1T9800L & U9800D Front and Back Board Drawings.rar
hl1d25000m (Maintenance Schematic Diagram-China Mobile ).rar
hc1c9800dm（Maintenance Schematic Diagram-China Telecom）.rar
HL1D20082M（Maintenance Schematic Diagram-China Unicom）.rar
9.2 Startup Failure
Check the faulty phone and locate the fault. The possible faults are as follows:
1. No voltage output caused by battery damage, protection upon startup caused by low voltage, or
improper installation of battery connection components
2. Startup failure caused by PCBA faults
3. Seeming power-on failure caused by LCD damage
4. Seeming power-on failure caused by power key FPC fault (The power key is disabled.).
5. Identification methods:
− Check whether the motor vibrates or there is any start-up tone after the power key is pressed. If the
motor vibrates or there is start-up tone, the fault is LCD damage. Then replace the LCD to identify
the fault.
− Use a USB charger to charge the faulty phone to identify that whether the fault occurs in the power
key FPC, the battery or the main board. If it is the power key FPC fault or battery fault, the
charging interface will be displayed after the USB power is connected.
− If no charging interface is displayed and the battery is not faulty, the fault may occur in the PCBA.
In this case, disassemble the phone to detect the fault. After confirming that the battery and the
power key FPC are normal, you can determine that the main board is damaged.
For PCBA damage, you can charge the phone with external power supply, and then power on the
phone to detect the current to identify the possible cause.
Three situations may occur: excessive current, weak current, and no current.
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9.2.2 Excessive Current (DC Power Supply)
Excessive current is mainly caused by short circuits. When the phone is charged by the DC power supply,
the current is equal to or greater than 500 mA. (Generally, it can achieve the output protection value of the
external power supply.)The main reason is ground short circuits of VBAT and VPH_PWR.
Figure 9-3 Troubleshooting excessive current
When charging the phone by an external power supply or dummy, excessive current is detected after the power key
is pressed.
Check whether there is a VBAT short circuit.
Check whether the circuit of the battery connection components
are short-circuited.
Check whether there is short circuit in U1901, U1301, and U5301.
Check whether other circuits are short-circuited (especially
the circuits near the connection components).
Re-solder or replace the
components.
Re-solder or replace the
components.
Check whether the relevant circuits of the VPH_PWR are
short-circuited.
Is the problem solved after U1901 is removed.
Check whether other circuits are short-circuited (especially
the circuits near the connection components).
End
N
Y
Y
Y
N
N
N
Y
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9.2.3 Weak Current (DC Power Supply)
After the phone is powered on, if weak current is generated, partial short circuits may exist on the PM or
the system does not start normally and reserves certain current. It may be caused by main chip or memory
faults that result in the system startup failure. The current is between 20 mA and several hundreds mA.
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Figure 9-4 Troubleshooting weak current
When charging the phone by external power supply or
dummy battery, weak current is detected after the power key is pressed, but the phone cannot
be powered on.
N
N
Y
Y
Re-solder or replace TCX01001 and X1000
Re-solder or replace U900.
Re-solder or replace U900.
Check whether U900 power output
is normal.
Check whether the signals of XTAL26_IN
and RTC_OUT are normal.
Check whether the signal of
H_SYS_NRESPWR is normal.
Check whether other circuits are normal (especially
circuits of U300, U1102, and U300_POP)
N
Y
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The common power supplies are as follows:
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9.3 No Current (DC Power Supply)
This fault is caused when the power supply channel is not established or poorly soldered, or circuits related
to the power key are faulty.
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Figure 9-5 Procedure of troubleshooting no current
When charging the phone by external power supply or dummy battery, no current is
detected.
N
N
Y
Y
Check whether the side key FPC is
normal.
Check whether the battery connection components are
normal.
Check whether D1905 is normal.
Re-solder or replace U1901.
Press to fasten the side key or replace the
power key FPC.
Re-solder or replace battery connection
components.
Re-solder or replace D1905.
N
Y
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9.4 Charging Failure
D2-2010 employs dedicated charging chip BQ24192 for charging control. If the system is operating
normally but fails to be charged, check circuits in the charging management module, or replace U1901 to
check whether this fault is fixed. If not, replace U1301 and check it again.
Figure 9-6 Schematic diagram of the charging circuit
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Figure 9-7 Schematic diagram of battery fuel gauge
9.5 Display Failure
Figure 9-8 Troubleshooting display failure
Display failure
N
N
Y
Y
No display at all?
Check whether the screen is properly
connected to the man baoard.
Check whether it is a problem of the
screen.
Replace the FHD screen.
Replace the screen to deterrmine whether it is screen failure or main
board failure.
Snap the connectors of the screen to the
main board.
Check whetherL1600 and U1600 are normal.
N
Y
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9.6 Vibration Failure
Figure 9-9 Troubleshooting vibration failure
Vibration failure
N
N
Y
Y
No vibration at all?
Whether the motor vibrates when powered
on by an external power supply?
Check whether the signal DR2_LM_VDP and DR2_LM_VDN
are normal.
Re-solder or replace U2203.
Check whether the motor FPC and the main board FPC are well connected via the ZIF connector.
Replace the motor.
Check whether U300 and U2203
communicate with each other well.
N
Y
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9.7 SIM Card Identification Failure
Figure 9-10 Troubleshooting SIM card detection failure
Unable to detect the SIM card.
N
N
Y
Y
Check whether the SIM card holder work
properly.
Check whether the SIM card detection switch S2102 works
properly.
Check whether the circuits of
SIM1_VCC/SIM2_VCC and other circuits are
normal.
Re-solder or replace U2101/U2102
Re-solder or replace the holder J2102.
Re-solder or replace the holder S2102.
Re-solder or replace the components.
N
Y
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9.8 Touchscreen Failure
The touchscreen failure is reflected as touchscreen unlocking failure while the LCD display is normal.
Since the TP and LCD are provided by the same supplier and the two are full laminated. You can replace
the display modules to determine whether it is the display screen fault or the main board circuit fault.
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Figure 9-11 Troubleshooting touchscreen failure
Touchscreen failure
Re-solder or replace connectorJ1601.
N
N
Y
Y
Re-solder or replace U900.
Re-solder or replace TP circuit components.
Replace the touchscreen components.
Is the problem solved after the TP
is replaced.
Check whether the TP power supply is
normal.
Check whether the circuits between RST/INT and I2C of the TP
are normal.
Y
N
The screen film may reduce the sensitivity of the touchscreen, making the phone irresponsive to touch operation.
NOTE
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9.9 Proximity Sensor and Automatic Light Sensor Failure
Figure 9-12 Troubleshooting proximity sensor and automatic light sensor failure
Proximity sensor and automatic light sensor failure
Replace the senso r FPC
Y
N
Y
N
Remove the shielding object and ensure the silicon pad properly
installed?
Ensure J2202 is firmly connected.
Is there any shielding object on the panel? Is the
silicon pad properly installed?
Check whether J2202 is firmly connected.
9.10 Accelerometer Failure
If the accelerometer is faulty, the compass sensor does not work either, because the compass sensor
software operation depends on the accelerometer. This is an identification basis.
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Figure 9-13 Troubleshooting accelerometer failure
The accelerometer sensor is faulty.
Re-solder or replace U300.
N
Y
N
Y
Check the power supply circuit.
End
Check whether the power supply
SENSOR_2V6/1V8 works properly.
Is the problem solved after the accelerometer sensor chip is
replaced.
9.11 Compass Sensor Failure
Figure 9-14 Troubleshooting compass sensor failure
Compass sensor failure
Re-solder or replace U300.
N
N
Y
Y
Check the power supply circuit.
End
Check whether the power supply
is normal.
Check whether the compass sensor chip
U2005 is normal.
Y
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9.12 Gyroscope Failure
The gyroscope is also called the angular rate sensor and is mainly used to test the angular variation. If the
gyroscope is faulty, users will fail to take turns effectively when they are playing racing games. Therefore,
you can determine whether the gyroscope is faulty by playing racing games.
Figure 9-15 Troubleshooting gyroscope failure
Gyroscope failure
Re-solder or replace U300.
N
Y
N
Y
Check the power supply circuit.
End
Check whether the power supply
is normal?
Is the problem solved after gyroscope chip U2003 is replaced?
9.13 Camera Failure
1. First, use the software to identify whether it is a front camera fault or rear camera fault.
2. Currently, the camera components are connected in the BTB mode. If only one camera is abnormal, it
is considered as a single component fault, and you can detect the fault by replacing the camera.
3. If the camera does not work properly after being replaced, check whether the software is able to detect
the camera and whether power is supplied normally. If the camera is not detected or power is supplied
abnormally, check the relevant circuits of the PCBA.
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9.14 Audio Failure
9.14.1 Ringtone Failure
Figure 9-16 Troubleshooting ringtone failure
Ringtone failure
Re-solder or replace U1201.
Check whether the speaker is normal.
Check whether The Speaker signal circuit is
normal.
N
N
Y
Y
Replace the speaker.
Troubleshoot the FPC flat cable
and main board J2201 faults.
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9.14.2 Call Transmitting Failure
Figure 9-17 Troubleshooting call transmitting failure
Call transmitting failure
Replace microphone 1402
Check whether the Main microphone is normal
Check whether The relevant signal circuits are faulty.
N
N
Y
Y
Replace the main microphone.
Troubleshoot the relevant signal
circuit faults of the main PFC and the
main board.
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9.14.3 Call Receiving Failure
Figure 9-18 Troubleshooting call receiving failure
Call receiving failure
Re-solder or replace U900.
Check whether the earpiece FPC is normal.
N
N
Y
Y
Replace the earpiece FPC
Troubleshoot the relevant signal
circuit faults of the main board.
Check whether theEARN/EARP signals
are normal.
Check whether the earpiece is normal.
NReplace the
earpiece.
Y
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9.15 Headphone Audio Failure
9.15.1 Headphone Silence Failure
Figure 9-19 Troubleshooting headphone silence failure
Headphone silence failure
Replace U900.
N
N
Y
Y
Replace relevant components.
Troubleshoot the signal circuit fault.
Check the headphone channel
to see if ground short circuit exists.
NReplace the main
FPC.
Y
Check whether the headphone power amplifier U1501 and relevant components
are normal.
Check whether the main FPC and the
headphone jack are normal.
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9.15.2 Headphone Transmitting Failure
Figure 9-20 Troubleshooting headphone transmitting failure
Headphone transmitting failure
Replace U900
N
N
Y
Y
Find the reason and solve the
problem.
Troubleshoot the signal circuit fault.
Check the microphone channel to see if ground short
circuit exists.
NReplace the main
FPC.
Y
Check whether the HS_MICBIAS voltage
is normal.
Check whether the main FPC and the
headphone jack are normal.
9.16 Speaker Noise Failure
1. If the speaker is water penetrated or contains impurities, such as iron scraps, noise may occur on the
speaker.
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Figure 9-21 Troubleshooting speaker noise failure
Speaker noise failure
Repair or replace the backplane components.
Troubleshoot the fault according to
regulations.
EndIs the problem solved after the front cover is
replaced?
Y Troubleshoot the fault according to
regulations.
N
Whether the speaker contains iron dusts?
Whether the speaker is water
penetrated?
EndIs the problem solved after the speaker is
replaced?
Y
Y
Y
N
N
N
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9.17 Wi-Fi and Bluetooth Failure
9.17.1 2.4 GHz WIFI
Figure 9-22 Troubleshooting Wi-Fi and Bluetooth failure
Wi-Fi/Bluetooth failure
End
N
N
Y
Y
Ensure that they contact with each
other properly.
Troubleshoot the signal circuit fault.
Is the problem solved after U5400
and Z5401 are replaced?
N Re-solder or replace U5603.
Y
Check whether the spring U5302 contacts
with the antenna properly.
Check whetherthe software is
operating normally.
N Troubleshoot the signal circuit fault.
Check whether U5400 and Z5401 are
normal.
Y
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9.17.2 5 GHz Wi-Fi
Figure 9-23 Wi-Fi/Bluetooth signal input circuit diagram
Wi-Fi/Bluetooth failure
End
N
N
Y
Y
Ensure that they contact with each
other properly.
Troubleshoot the signal circuit fault.
Is the problem solved after
U5501is replaced.
NRe-solder or
replace U5603.
Y
Check whether the spring J5501 contacts
with the antenna properly.
Check whether the software is
operating normally.
N Troubleshoot the signal circuit fault.Check whether Z5502
is normal.
Y
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9.18 FM Failure (D2 Is Not Equipped with the FM Function.)
9.19 GPS Failure
Figure 9-24 Troubleshooting GPS failure
GPS failure
Check
whether the spring U5302
contacts with the antenna
properly.
Is the
problem solved after
U5400 and Z5801 are
replaced?
Is the
problem solved after U5603 is
replaced?
Is the
problem solved after U5603 is
replaced?
Replace U300.
Ensure that they
contact with each
other properly.
End
End
EndY
Y
Y
N
Y
N
N
N
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Figure 9-25 GPS circuit diagram
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9.20 Mobile High-Definition Link (MHL) Failure
Figure 9-26 Troubleshooting MHL failure
MHL failure
Check
whether J1901 contacts with
MHLconnector properly?
Check
whether the pull-up resistor of the
MHL_CBUS_ID channel is
Normal?
Check
whether power supplies for MHL are
normal?
Check
whether MHL output circuits are
normal?
Is
the problem solved after U3101 is
replaced?
Ensure that they
Re-solder or replace R3109.
Troubleshoot power supply
faults（Replace U3104, U3105,
and other power channel
components in order.）
Troubleshoot circuit
faults（Replace T1901, U1905,
U3101, and peripheral components
in order.）
End
Replace U300.
Y
N
Y
Y
Y
N
N
N
N
Y
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9.21 UIM1 Card Detection Failure
Figure 9-27 Troubleshooting card detection failure-GSM
GSM card detection
Check
Whether the SIM card is
properly inserted into the card
Holder?
Check Whether
there is any foreign matter
in the SIM card holder or
whetherthe holder
is damaged?
At
the dialing interface, check the
IMEI No. by keying
in *#06#?
Replace Z4700 and U4700?
Is the
problem solved after U4702
and Z4401 are replaced
in orede?
According to the faulty
frequency band, replace
corresponding circuits to see if
the problem is
solved?
Replace
the J2102 SIM card holder,
S2102, U2101, and U20109 to
see if the problem is
Solved?
Is
the problem solved after U700
is replaced?
Re-insert
the UIM card properly to see if
the problem is solved?
End
End
End
End
End
End
Check and replace U300.
Y
N
Y
Y
N
N
N
N
N
N
N
Y
Y
N
Y
Y
Y
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9.22 UIM2 Card Detection Failure
Figure 9-28 Troubleshooting the UIM2 card detection failure
UIM2 card detection
Check
whether the SIM card is properly
inserted into the card
holder?
Check whether
there is any foreign matter in the
SIM card holder or whether the
holder is damaged ?
At the
dialing interface, check the IMEI
No. by keying in *#06#?
Is the
problem solved after Z5301 and
Z5302 are replaced?
Is the
problem solved after U5301 is
replaced?
According to
the faulty frequency band,
replace corresponding circuits to
see if the problem
is solved?
Replace
the SIM card holder, S2102, and
U2102 to see if the problem is
solved?
Is the
problem solved after U5000 is
replaced?
Re-insert
the UIM card properly to see if the
problem is solved?
End
End
End
End
End
End
Replace U300.
Y
NY
N
Y
Y
N
N
Y
Y
N
N
N
N Y
Y
Y
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9.23 RF Reception Failure-CDMA (D2-2010)
Figure 9-29 Troubleshooting RF reception failure-CDMA
WCDMA RF reception failure
Check whether the hardware
components are normal?
Whether
the problem is solved after the
software is updated to the latest
version?
Check
whether the circuit for the RF signal is
normal?
Is the
problem solved after Z4501 is
replaced?
According to the
faulty frequency band, replace
corresponding circuits to see if the
problem is solved?
Is the
problem solved after C4616 and
C4617R4602L4605
are replaced?
Replace U700.
Check whether the RF
connector and the antenna
spring are properly installed
and well contacted?
End
Replace Z4401 to solve the
problem.
End
End
End
Y
N
Y
Y
Y
Y
N
N
N
N
N
Y
If all RF signals are abnormal, pay attention to inspecting the circuits for the power supply, antenna feed point, antenna
switch chip, antenna connector, and RF test base.
NOTE
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9.24 RF Sending Failure-CDMA (D2-2010)
Figure 9-30 Troubleshooting RF sending failure-CDMA
CDMA RF signal sending
Check
whether the hardware components are
normal?
Whether the
problem is solved after the software is
updated to the latest
version?
Check whether RF receiving is normal?
Is the
problem solved after Z4700 is
replaced?
Is the
problem solved after U4700 and U4702
are replaced?
According to the
faulty frequency band, replace
corresponding circuits to see if the
problem is solved?
Replace U700.
Check whether the RF
connector and the antenna
spring are properly installed
and well contacted?
End
Replace Z4401 to solve the
problem.
End
End
End
N
Y
Y
Y
Y
Y
Y
N
N
N
N
N
If all RF signals are abnormal, inspect the circuits for the power supply, antenna switch chip and antenna connector.
NOTE
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9.25 RF Signal Receiving Failure-GSM (D2-2010)
Figure 9-31 Troubleshooting RF signal receiving failure-GSM
GSM RF signal receiving failure
Check
whether the hardware components are
normal?
Whether the
problem is solved after the software is
updated to the latest
version?
Check
whether the RF sending components are
normal?
Is the
problem solved after Z5302 and Z5301
are replaced?
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?
Replace U5000
Check whether the RF
connector and the antenna
spring are properly installed
and well contacted?
End
Replace U5301 to solve the
problem.
End
End
Y
Y
Y
Y
Y
N
N
N
N
N
If all RF signals are abnormal, pay attention to inspecting the circuits for the power supply, antenna feed point, antenna
switch chip, antenna connector, and RF test base.
NOTE
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9.26 RF Signal Sending Failure-GSM (D2-2010)
Figure 9-32 Troubleshooting RF signal sending failure-GSM
GSM RF signal sending
Check whether the hardware
components are normal?
Whether
the problem is solved after the
software is updated?
Check
whether the radio receiving circuit is
normal?
Is
the problem sovled after Z5303 is
replaced?
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?
Replace U3801.
Check whether the RF
connector and the antenna
spring are properly
End
Replace U5301 to solve the
problem.
End
End
N
N
N
N
Y
Y
Y
Y
Y
Y
If all RF signals are abnormal, pay attention to inspecting the circuits for the power supply, antenna feed point, antenna
switch chip, antenna connector, and RF test base.
NOTE
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9.27 RF Reception Failure-WCDMA (D2-5000)
Figure 9-33 Troubleshooting the RF reception failure-WCDMA
WCDMA RF reception failure
Check
whether the hardware components are
normal?
Is the
problem solved after the software is
updated to the latest version?
Check
whether the radio sending circuit is
normal?
Is the
problem solved after Z4501 is
replaced?
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?
Replac e U700.
Check whether the RF connector and
the antenna spring are properly
installed and well contacted?
End
Replace Z4401 to solve the problem.
End
End
Is the
problem solved after C4616 and
C4617R4602L4605 are
replaced?
End
Y
Y
Y
Y
Y
N
Y
N
N
N
N
N
If all RF signals are abnormal, pay attention to inspecting the circuits for the power supply, antenna feed point, antenna
switch chip, antenna connector, and RF test base.
NOTE
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9.28 RF Sending Failure-CDMA (D2-5000)
Figure 9-34 Troubleshooting RF sending failure-CDMA
RF sending failure-CDMA
Check whether the hardware
components are normal?
Is the
problem solved after the software is
updated to the latest
version?
Check
whether radio receiving is
normal?
Is the
problem solved after Z4700 is
replaced?
Is the
problem solved after U4700 and U4702
are replaced?
Replace U700.
Check whether the RF connector and
the antenna spring are properly
installed and well contacted?
End
Replace Z4401 to solve the problem.
End
End
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?
End
N
N
N
N
N
N
Y
Y
Y
Y
Y
Y
If all RF signals are abnormal, inspect the circuits for the power supply, PA patch, coupler patch, antenna connector, and
the main chip.
NOTE
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9.29 RF Signal Receiving Failure-GSM (D2-5000)
Figure 9-35 Troubleshooting RF signal receiving failure-GSM
RF signal receiving
Check
whether the hardware components are
Normal?
Is the
problem solved after the software is
updated to the latest
version?
Check
whether the RF sending components
are normal?
Is the
problem solved after Z5302 and Z5301
are replaced?
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?
Replace U5000.
Check whether the RF connector and
the antenna spring are properly
installed and well contacted?
End
Replace U5301 to solve the problem.
End
End
N
N
N
N
Y
Y
Y
Y
Y
N
If all RF signals are abnormal, pay attention to inspecting the circuits for the power supply, antenna feed point, antenna
switch chip, antenna connector, and RF test base.
NOTE
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9.30 RF Signal Sending Failure-GSM (D2-5000)
Figure 9-36 Troubleshooting RF signal sending failure-GSM
RF signal sending
Check
whether the hardware components are
normal?
Is the
problem solved after the software is
updated to the latest
version?
Check
whether the radio receiving circuit is
normal?
Is the problem solved after Z5303 is
replaced?
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?
Replace U3801
Check whether the RF connector
and the antenna spring are properly
installed and well contacted?
End
Replace U5301 to solve the
problem.
End
EndY
Y
Y
Y
Y
N
N
N
N
N
If all RF signals are abnormal, inspect the circuits for the power supply, antenna feed point, antenna switch chip,
antenna connector, and RF test base.
NOTE
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10 Chapter Ten Function Tests
10.1 Keys
D2 has only three buttons. They are the power button, volume up button, and volume down button.
D2's built-in battery is not user removable; therefore, the forcible power-off function is designed. The
phone will be forcibly powered off after you press the power key for 10 seconds. The function applies to
cases such as software upgrade.
Figure 10-1 D2's keys
Power on key
Volume + key
Volume - key
10.2 MMI Tests
HUAWEI D2-2010 V100R001C00B118 MMI测试操作指导书.xls
10.3 Wi-Fi Test
To ensure a normal network, place the mobile phone within 15 meters from an AP, and there must be no obstacle
between the mobile phone and the AP.
1. Configure the AP properly. Power on the phone and place it within the AP's transmission range.
2. Tap Settings > Wireless & Settings > WLAN > Turn WLAN on, and enable network notifications.
3. After the phone automatically finds the AP's SSID, enter the password to establish a connection.
4. Change the distance between the phone and AP to check the change of the Wi-Fi signal strength.
NOTE
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5. In the normal network, launch a browser and access a website to test the network quality.
If no problems are found, finish the Wi-Fi test. If any problems are found, troubleshoot the phone or send it
to an advanced service center for repair.
10.4 Voice Call Test
1. Install a SIM card or UIM card on the fixed station.
2. Power on the phone.
3. Check whether the signal strength displayed on the LCD is normal (given that the network is normal).
4. Make a call to a fixed-line phone, and check the voice quality during the call.
5. If no problems are found, exit the voice call test. If any problem is found, troubleshoot the problem or
send the phone to an advanced service center for repair.
11 Solder Points on the PCB and the BGA Chip
Red (R: 255, G: 0, B: 0) : Solder point
Green (R: 0, G: 255, B: 0) : Vacant point
D2-2010:
Top solder point diagram
Bottom solder point diagram
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D2-5000/D2-0082:
Top solder point diagram
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Bottom solder point diagram
12 PCBA Layout
D2-2010:
Top slot layout:
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Bottom slot layout:
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D2-5000/D2-0082:
Top slot layout:
Bottom slot layout:
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Schematic diagrams: